Computing node and computing device

Abstract

The embodiment of the invention discloses a computing node and computing equipment. The computing node comprises a shell, a first connector, a connecting circuit board, a communication component and a sealing element; the shell comprises a mounting wall and a containing cavity; the mounting wall is connected with the wall forming the accommodating cavity; the communication component is positioned in the accommodating cavity; a first insertion hole is formed in the mounting wall; a second insertion hole is formed in the wall of the accommodating cavity, and the first insertion hole is opposite to the second insertion hole; the first connector is arranged in the first jack; the connecting circuit board comprises a first part, a second part and a third part; the first part is a flexible circuit board, is positioned between the first jack and the second jack, and is electrically connected with the first connector; the second part is hermetically connected with the second jack; and the third part is positioned in the accommodating cavity and is electrically connected with the communication component. According to the scheme, the communication component extends out of the containing cavity through the connecting circuit board, signal loss is small, sealing performance is easy to guarantee, the first part is the flexible circuit board, and floating connection of the first connector is facilitated.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of server technology, and in particular to a computing node and a computing device. Background Art

[0002] With the rapid development of communication technology, the integration and heat density of computing devices are getting higher and higher, and the demand for heat dissipation is increasing. The traditional air cooling + air conditioning heat dissipation mode is increasingly difficult to meet the requirements. For this reason, the immersion liquid cooling process came into being.

[0003] In the related art, a computing device includes a shell, electronic components are arranged inside the shell, and the shell is filled with a cooling medium. The cooling medium can immerse the electronic components. The heat generated by the electronic components can be taken away through the circulation and / or phase change of the cooling medium, thereby achieving efficient heat dissipation of the electronic components. In a scenario where an electronic component needs to be connected to an external device, the electronic component can be provided with a connection port, and then a cable is used to connect the connection port and the external device. However, in an environment immersed in the cooling medium, the signal integrity (SI) of the connection port is seriously degraded, which seriously affects the normal use of the computing device.

[0004] Therefore, how to provide a solution to better overcome or alleviate the above-mentioned defects is still a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] An embodiment of the present application provides a computing node and a computing device, wherein a communication component of the computing node is connected to a connector via a connecting circuit board, which can effectively reduce signal loss.

[0006] In the first aspect, an embodiment of the present application provides a computing node, comprising a shell, a first connector, a connecting circuit board, a communication component and a seal; wherein the shell comprises a mounting wall and a accommodating cavity; the mounting wall is connected to the wall forming the accommodating cavity; the communication component and the seal are located in the accommodating cavity; the mounting wall is provided with a first jack; the wall forming the accommodating cavity is provided with a second jack; wherein the first jack is arranged opposite to the second jack; the first connector is arranged in the first jack; wherein the connecting circuit board comprises a first part, a second part and a third part; wherein the first part is a flexible circuit board; the first part is located between the first jack and the second jack, and is electrically connected to the first connector; the second part is passed through the second jack, and is sealed and connected to the second jack through a seal; the third part is located in the accommodating cavity, and is electrically connected to the communication component.

[0007] The computing node may be a server node, and the communication component may be a network card, a switch card, etc. The shell of the computing node includes a housing cavity and a mounting wall. The communication component is located in the housing cavity. The mounting wall is provided with a first jack, and the wall used to form the housing cavity is provided with a second jack. The communication component is electrically connected to the connecting circuit board. The connecting circuit board can extend out of the housing cavity from the first jack. A seal is provided between the connecting circuit board and the first jack to ensure sealing performance. The connecting circuit board is connected to the first connector, and the first connector is provided at the first jack, that is, at the mounting wall, to achieve fixation of the first connector, which can facilitate the connection between the computing node and the backplane in the computing device cabinet.

[0008] In the above solution, the communication component is electrically connected to the connection circuit board and extends out of the accommodating cavity through the connection circuit board. In this way, the cables and connection ports in the related art can be omitted, which can effectively reduce the cost and avoid the problem of SI performance degradation caused by the connection port being immersed in the cooling medium, thereby reducing the loss of the high-speed link and ensuring the integrity of the high-speed signal.

[0009] In addition, the first part of the connecting circuit board is a flexible circuit board with good flexible deformation ability. During the assembly process of the computing node, the deformation of the first part can create conditions for the floating connection between the connecting circuit board and the backplane in the computing equipment cabinet, which can alleviate the force when connecting the connecting circuit board and the cabinet.

[0010] In addition, the connecting circuit board is a solid component, and there is no gap between the outer sheath and the core of the cable, which can solve the sealing problem caused by the cable. During the specific assembly, it is only necessary to ensure the sealing assembly between the outer wall of the connecting circuit board and the inner wall of the jack, and the connection circuit board and the inner wall of the second jack can be sealed by setting a seal, so the sealing is relatively easy to ensure. In this way, the possibility of leakage of the cooling medium is greatly reduced, the effectiveness of cooling and heat dissipation can be guaranteed, and the environment around the computing device can be guaranteed, which is conducive to the promotion and application of the immersion liquid cooling process in the field of computing equipment.

[0011] Based on the first aspect, the embodiment of the present application also provides a first implementation of the first aspect: the second part is a flexible circuit board or a rigid circuit board; the third part is a flexible circuit board or a rigid circuit board.

[0012] When the second part and the third part are both rigid circuit boards, the connecting circuit board can be a soft-hard combination wall, the overall structural strength can be high, and the sealing assembly between the second part and the jack can be easily achieved. When the second part and the third part are both flexible circuit boards, the connecting circuit board can be a flexible circuit board as a whole, which has better flexible deformation ability, not only creating conditions for the floating connection between the connecting circuit board and the computing equipment cabinet, but also relieving the force between the communication component and the jack.

[0013] Based on the first aspect, or based on the first implementation of the first aspect, the embodiment of the present application also provides a second implementation of the first aspect: the communication part includes a carrier circuit board; the third part is electrically connected to the communication component, including: the third part is electrically connected to the carrier circuit board.

[0014] Based on the second implementation of the first aspect, the embodiment of the present application also provides a third implementation of the first aspect: a circuit board in which the connecting circuit board and the bearing circuit board are integrated. In this way, the loss between the communication component and the connecting circuit board is smaller, which is more conducive to ensuring the integrity of the signal.

[0015] In practical applications, the connection circuit board and the carrier circuit board may also be connected by gold fingers, that is, both the connection circuit board and the carrier circuit board may be provided with gold fingers, and then the gold fingers of the two may be connected by soldering.

[0016] Based on the first aspect, or based on any one of the first to third embodiments of the first aspect, the embodiment of the present application further provides a fourth embodiment of the first aspect: the sealing member includes a sealing seat and a sealing element; a third plug hole is provided on the sealing seat; wherein the third plug hole is arranged opposite to the second plug hole; the second part is passed through the third plug hole and is sealed and connected to the third plug hole through the sealing element; the second part is sealed and connected to the second plug hole through the sealing seat. In this scheme, the second part can be indirectly sealed and connected to the second plug hole through the sealing seat. The sealing element can specifically be a sealing element in various forms such as a sealing ring, a sealant, and a sealing filler.

[0017] Based on the first aspect, or based on any one of the first to fourth implementations of the first aspect, the embodiment of the present application further provides a fifth implementation of the first aspect: the first connector is an OSFP connector or a QSFP connector.

[0018] Based on the first aspect, or based on any one of the first to fourth embodiments of the first aspect, the embodiment of the present application also provides a sixth embodiment of the first aspect: the first connector is a gold finger connector; the gold finger connector includes a connector circuit board, and the connector circuit board and the connecting circuit board can be an integrated circuit board, so that the loss can be smaller, the structure can be simpler, and the processing can be more convenient.

[0019] Based on the first aspect, or based on any one of the first to sixth embodiments of the first aspect, the embodiment of the present application also provides a seventh embodiment of the first aspect: the communication component also includes a network card chip; the network card chip is arranged on the carrier circuit board of the communication component and is electrically connected to the carrier circuit board of the communication component.

[0020] In the second aspect, an embodiment of the present application further provides a computing device, a computing device computing node, a cabinet and a backplane; wherein the computing node is the computing node involved in the first aspect or any one of the embodiments of the first aspect, and is arranged in the cabinet; the backplane is arranged relative to the mounting wall of the computing node; a second connector is arranged on the backplane; the first connector is plugged into the second connector; and the communication component communicates by connecting the circuit board, the first connector and the second connector.

[0021] The computing device may specifically be a server. After the first connector and the second connector are plugged in, the communication component may be connected via the connecting circuit board, the first connector and the second connector to achieve communication connection between the connecting circuit board and the backplane side.

[0022] Based on the second aspect, the embodiment of the present application also provides a first implementation of the second aspect: the above-mentioned computing node is a server node, and the computing device is a whole cabinet server. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a data center provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of a computing device provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the relative positions of the computing nodes and the backplane in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of a portion of the structure of a computing node in an embodiment of the present application;

[0027] Figure 5 This is a partial enlarged schematic diagram of the connection between the circuit board and the middle wall in the embodiment of the present application;

[0028] Figure 6 This is a schematic diagram of the structure of the first connector according to an embodiment of the present application;

[0029] Figure 7 This is a schematic diagram of the sealed connection structure between the first connector and the communication component in the embodiment of the present application;

[0030] Figure 8 This is a schematic diagram of the connection structure between the first connector and the connection circuit board in an embodiment of the present application.

[0031] Fig. 9 This is a schematic diagram of the structure of the first floating component in an embodiment of the present application.

[0032] Fig.10 This is a schematic diagram of the connection structure between the second connector and the external cable according to an embodiment of the present application.

[0033] The following are the descriptions of the reference numerals:

[0034] 100 data center, 110 computer room;

[0035] 200 computing device, 210 cabinet, 211 installation slot, 212 backplane, 213 external cable, 220 computing node, 221 shell, 221a upper cover, 221b lower wall, 221c side wall, 221d front wall, 221e middle wall, 221e-1 jack, 221f rear wall, 221g partition, 221h accommodating cavity, 221i power supply room, 221j signal room, 221k sealing seat, 221l sealing ring, 222 working medium inlet pipe, 223 working medium outlet pipe, 224 network card, 224a network card chip, 224b carrier circuit board, 225 connecting circuit board, 225a first part part, 225b the second part, 225c the third part, 226 the first connector, 226a the base, 226a-1 the mounting seat body, 226a-2 the floating seat body, 226a-2a the bottom wall, 226b the plug-in part, 226b-1 the plug-in interface, 226b-2 the alignment recess, 226c the first floating component, 226c-1 the primary elastic component, 226c-2 the secondary elastic component, 226c-3 the middle floating seat, 226d the second floating component, 227 the second connector, 227a the docking seat, 227a-1 the alignment protrusion, 227b the docking circuit board, 227b-1 the docking gold finger. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0037] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0038] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] In the description of the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0040] With the rapid development of communication technology, Internet service providers, enterprises, research institutions, etc. have generally begun to build data centers (also known as computing clusters) that carry storage, computing, and transmission functions to meet the demand for data usage. The structure of data centers can be diverse.

[0041] Please refer to Figure 1 and Figure 2 , Figure 1 is a structural diagram of a specific implementation method of a data center, Figure 2 A schematic diagram of a specific implementation of a computing device provided in an embodiment of the present application.

[0042] like Figure 1 As shown, in an exemplary solution, the data center 100 may include a computer room 110 and at least one computing device 200 .

[0043] In some embodiments, an air cooling circulation system (not shown) may be provided in the data center 100 , which ventilates and cools the interior of the computer room 110 by providing air conditioning equipment or fan equipment to ensure the internal environment of the computer room 110 .

[0044] Combination Figure 2 The computing device 200 may include but is not limited to a server. For example, the computing device 200 may be a whole cabinet server. The computing device 200 includes a cabinet 210 and a computing node 220. The number of the computing node 220 may be one or more.

[0045] It should be noted that the computing node 220 may also be referred to as a server node.

[0046] In one implementation, the computing device 200 may further include a switching node, and exemplary switching nodes include a management switch and a communication switch.

[0047] The cabinet 210 is provided with a mounting slot 211, and the number of the mounting slots 211 can be multiple, and each mounting slot 211 is used to install a computing node 220, so as to realize the integrated assembly of multiple computing nodes 220. Here, the embodiment of the present application does not limit the number and arrangement of the mounting slots 211. In actual applications, those skilled in the art can design according to specific needs as long as it can meet the requirements of use. For example, Figure 2 As shown, a plurality of mounting grooves 211 may be arranged vertically to form a row.

[0048] Please refer to Figure 3-Figure 6 , Figure 3 is the relative position diagram of the computing node and the backplane. Figure 4 This is a schematic diagram of the structure of the computing node after the upper cover is opened. Figure 5 This is a partial enlarged view of the connection between the circuit board and the middle wall. Figure 6 This is a connection structure diagram of the network card, the sealing seat and the first connector.

[0049] like Figure 3 and Figure 4 As shown, in the embodiment of the present application, the computing node 220 includes a housing 221, and the housing 221 is provided with electronic components. The computing device 200 also includes a backplane 212, and the computing node 220 can be connected to the backplane 212 after being inserted into the mounting slot 211; it should be understood that Figure 3 The component labeled 212 is actually only a portion of the back plate. In the embodiment of the present application, the back plate 212 is characterized by this portion.

[0050] The shell 221 is the outer frame of the computing node 220, which is used to integrate and assemble the electronic components arranged inside the shell 221, so as to facilitate the overall transportation and assembly of the computing node 220. In addition, the shell 221 can also protect the electronic components, etc., and can reduce the damage of the electronic components caused by factors such as collision during installation and use. In addition, the shell 221 also forms the outer contour of the computing node 220 and basically determines the overall shape of the computing node 220. In some embodiments, the computing node 220 can be roughly presented in the form of a rectangular parallelepiped; of course, the shell 221 can also adopt other spatial shapes, such as a cylinder, etc. For ease of description, the following embodiments of the present application are all described by taking the shell 221 as a rectangular parallelepiped as an example.

[0051] For ease of description, you can Figure 3The directions such as “front”, “rear”, “up”, “down”, “left” and “right” are defined based on the directions and positional relationships in the diagram. Specifically, the front-to-back direction is the installation direction of the computing node 220 relative to the cabinet 210, wherein the side of the computing node 220 away from the backplane 212 is the “front”, and the side of the computing node 220 facing the backplane 212 is the “rear”. In some embodiments, the front-to-back direction may also be referred to as the length direction or longitudinal direction of the computing node 220; the up-down direction is the direction perpendicular to the installation surface (the ground or the wall of the building, etc.) of the cabinet 210, wherein the direction relatively close to the installation surface is the “down”, and the direction relatively far from the installation surface is the “up”. In some embodiments, the up-down direction may also be referred to as the height direction or vertical direction of the computing node 220; the direction perpendicular to the up-down direction and the front-to-back direction is the left-to-right direction. In some embodiments, the left-to-right direction may also be referred to as the width direction or lateral direction of the computing node 220.

[0052] Combination Figure 3 and Figure 4 The shell 221 may include an upper cover 221a and a lower wall 221b arranged opposite to each other in the up-down direction, two side walls 221c arranged opposite to each other in the left-right direction, and a front wall 221d, a middle wall 221e and a rear wall 221f arranged in sequence in the front-back direction.

[0053] The lower wall 221b, the two side walls 221c, the front wall 221d and the middle wall 221e can be an integrally formed one-piece structure to form the base of the housing 221. In the base, the front wall 221d and the middle wall 221e can be connected to the two side walls 221c, and the front wall 221d, the middle wall 221e and the two side walls 221c can be connected to the bottom wall 221b, and the upper cover 221a can be installed on the base, and the specific installation method can be screw connection. After the installation is completed, the upper cover 221a, the lower wall 221b, the two side walls 221c, the front wall 221d and the middle wall 221e can be enclosed to form a receiving cavity 221h, so that the upper cover 221a, the lower wall 221b, the two side walls 221c, the front wall 221d and the middle wall 221e are all walls forming the receiving cavity 221h; the receiving cavity 221h is used to install electronic components. In addition, a sealing member in the form of a sealing ring or the like may be provided between the upper cover 221a and the base, so as to ensure the sealing performance of the accommodating cavity 221h at the connection between the upper cover 221a and the base.

[0054] The rear wall 221f may be a sheet metal part, which may be connected to a side wall 221c, that is, connected to the wall forming the accommodating chamber 221h, and a partition wall 221g may be provided between the rear wall 221f and the middle wall 221e to isolate and form chambers such as a power supply chamber 221i and a signal chamber 221j between the rear wall 221f and the middle wall 221e. The power supply chamber 221i may lead out a power connector, which may be connected to a battery or the like in the accommodating chamber 221h, and the power connector may also be connected to a power interface on the backplane 212. The signal chamber 221j may lead out a signal connector, such as a high-speed signal connector, which may be connected to a signal interface on the backplane 212 to establish a signal connection relationship between the computing node 220 and the chassis 210.

[0055] In practical applications, the rear wall 221f may also be connected to both side walls 221c; or, there may be no partition wall 221g between the rear wall 221f and the middle wall 221e, that is, the power chamber 221i and the signal chamber 221j may be connected.

[0056] The middle wall 221e may also be provided with a working fluid inlet and a working fluid outlet. The working fluid inlet may be installed with a working fluid inlet pipe 222, and the working fluid outlet may be installed with a working fluid outlet pipe 223. Both the working fluid inlet pipe 222 and the working fluid outlet pipe 223 may be connected to the accommodating chamber 221h, and are used to circulate the cooling working fluid in the accommodating chamber 221h, so as to dissipate heat for each electronic component through an immersion liquid cooling process, thereby effectively ensuring the operating temperature and working performance of each electronic component. The above-mentioned cooling working fluid may specifically be a fluorinated liquid, deionized water, etc. During the circulation operation, the above-mentioned cooling working fluid may be a liquid phase working fluid or a two-phase working fluid, which is specifically related to the liquid cooling process used.

[0057] The accommodating cavity 221h may accommodate electronic components, and an exemplary electronic component may be a communication component. For example, when the computing node is a server, the communication component may be a network card 224; when the computing node is a switch, the communication component may be a switch board. In practical applications, communication components in the form of a network card 224, a switch board, etc. need to be connected to an external device so as to transmit signals with the external device.

[0058] For ease of description, in the following embodiments, the network card 224 is taken as an example to describe the relevant solutions.

[0059] In the related art, the network card is provided with a connection port, which can be an Octal Small Form-factor pluggable (OSFP) port, a Quad Small Form-factor Pluggable (Quad Small Form-factor Pluggable) port, etc., and then the connection port and the external device can be connected by a cable. However, the above connection method is only suitable for air environment. When the immersion liquid cooling process is adopted, due to the different dielectric constant (DK) of the cooling medium and air, the SI performance of the connection port will be seriously degraded, resulting in the high-speed link loss between the network card and the backplane exceeding the 112G LR standard, and the loss is serious. In addition, the cable includes a core and a sheath, and there is a gap between the core and the sheath. When the immersion liquid cooling process is adopted, the cooling medium may leak from the gap; and the sheath itself is also prone to rupture due to factors such as bending, and the rupture position of the sheath is also prone to leakage; this will affect the heat dissipation efficiency of the cooling medium and will affect the promotion and application of the immersion liquid cooling process in the field of computing equipment.

[0060] In view of this, in the embodiments of the present application, Figure 4 As shown, the computing node 220 further includes a connecting circuit board 225, and the network card 224 and the connecting circuit board 225 can be electrically connected. Specifically, the network card 224 can be connected to an external device through the connecting circuit board 225. In this way, the connection port and the cable in the related art can be omitted, which can effectively reduce the cost, and can avoid the problem of SI performance degradation caused by the connection port being immersed in the cooling medium, thereby reducing the loss of the high-speed link, which is conducive to ensuring the integrity of the high-speed signal.

[0061] In one possible implementation, combining Figure 6 The network card 224 may include a network card chip 224a and a carrier circuit board 224b. The network card chip 224a may be mounted on the carrier circuit board 224b and may be electrically connected to the carrier circuit board 224b. The carrier circuit board 224b and the connection circuit board 225 may be integrally formed circuit boards. In this way, the loss between the network card 224 and the connection circuit board 225 may be smaller, and the structure may be simpler. In addition, the connection circuit board 225 and the carrier circuit board 224b may also be welded using a gold finger, that is, both the connection circuit board 225 and the carrier circuit board 224b may be configured with a gold finger, and then the gold fingers of the two may be welded.

[0062] Combination Figure 5The middle wall 221e is provided with a second plug hole 221e-1, and the connecting circuit board 225 can be inserted into the second plug hole 221e-1 to extend out of the accommodating cavity 221h from the middle wall 221e. For ease of description, the connecting circuit board 225 can be divided into three parts, namely, a first part 225a, a second part 225b and a third part 225c, wherein the first part 225a is located outside the accommodating cavity 221h, the second part 225b is used for sealing connection with the second plug hole 221e-1, and the third part 225c is located inside the accommodating cavity 221h.

[0063] The first part 225a may be a flexible circuit board, so that the floating connection between the circuit board 225 and the back plate 212 can be well achieved, and the force when the two are connected can be alleviated.

[0064] The second part 225b and the second jack 221e-1 can be sealed and connected. The specific sealing method can be to set a seal in the form of a sealing ring, a sealing strip, an adhesive, etc., which can seal the gap between the inner wall surface of the connecting circuit board 225 and the second jack 221e-1. By setting the seal, the sealing performance of the accommodating chamber 221h can be improved, and the possibility of leakage of the cooling medium can be reduced. In other words, the accommodating chamber 221h in the embodiment of the present application is actually a sealed accommodating chamber, which has a relatively high sealing performance.

[0065] In one possible implementation, combining Figure 6 The sealing member may include a sealing seat 221k and a sealing element (not shown in the figure). The sealing seat 221k may be sealed and connected to the middle wall 221e through a sealing ring 2211 to achieve sealing of the second plug hole 221e-1. The sealing seat 221k is provided with a third plug hole (not shown in the figure). The second part 225b may be inserted into the third plug hole, and the sealing between the second part and the third plug hole may be achieved through a sealing element; the sealing element may specifically be a sealing member in various forms such as a sealing ring, an adhesive, a sealing strip, etc. In the above scheme, the sealing assembly between the second part 225b and the second plug hole 221e-1 may be indirectly achieved through the provision of the sealing seat 221k.

[0066] It should be understood that one or both of the second part 225b and the third part 225c may also have the ability of flexible deformation, that is, one or both of the second part 225b and the third part 225c may also be a flexible circuit board, so that the connection circuit board 225 may have better flexibility adjustment performance; exemplarily, when the third part 225c is a flexible circuit board, the force between the network card 224 and the second jack 221e-1 can be well relieved through the flexible deformation of the third part 225c. Of course, one or both of the second part 225b and the third part 225c may also be a rigid part, where the rigid part refers to a part that is not prone to flexible deformation; exemplarily, when the second part 225b is a rigid part, the second part 225b may have a higher strength, which can improve the overall strength of the connection circuit board 225 and facilitate the sealing setting between the second part 225b and the second jack 221e-1.

[0067] In the embodiment of the present application, the connection circuit board 225 is a solid component. The connection circuit board 225 of the solid structure does not have a gap like the gap between the outer sheath and the core of the cable, which can solve the sealing problem caused by the cable. During the specific assembly, it is only necessary to ensure the sealing assembly between the outer wall of the connection circuit board 225 and the inner wall of the jack, and the connection circuit board 225 and the inner wall of the jack can be sealed by setting a sealing component, and the sealing is relatively easy to ensure. In this way, the possibility of leakage of the cooling medium is greatly reduced, the effectiveness of cooling and heat dissipation can be guaranteed, and the environment around the computing device 200 can be guaranteed, so as to facilitate the promotion and application of the immersion liquid cooling process in the field of computing devices 200.

[0068] The connection circuit board 225 includes a substrate and a signal transmission part arranged on the substrate. The substrate is used to realize the insulation assembly of the connection circuit board 225 and to carry the signal transmission part. The signal transmission part can be made of metal material, such as copper foil, etc. It can be laid on the surface of the substrate or buried inside the substrate to realize signal transmission between the network card 224 and the external device; the number and arrangement of the signal transmission parts are not limited here. In practical applications, those skilled in the art can make a selection according to specific needs.

[0069] The connecting circuit board 225 can be a flexible printed circuit (FPC) as a whole. The substrate of the flexible circuit board can be made of polyester film, polyimide film and fluorinated Z-propylene film, etc. The flexible circuit board has good flexible deformation ability, which can better alleviate the force between the network card 224 and the second jack 221e-1, as well as the floating connection between the connecting circuit board 225 and the backplane 212, thereby alleviating the force between the two. At the same time, it can also adapt to and absorb assembly tolerances, which can greatly improve the convenience of connection, and then improve the reliability of connection and the stability of signal transmission. In addition, the flexible circuit board can also absorb the vibration and installation pull of the computing node 220 during actual use through its own flexible deformation, which can weaken the impact of vibration or installation pull on the sealing assembly and service life of the connecting circuit board 225.

[0070] Alternatively, the connection circuit board 225 may also be a soft-hard combination wall. The soft-hard combination wall may be formed by assembling a hard printed circuit board (PCB) and an FPC through a lamination process, wherein the substrate of the PCB may be a phenolic paper laminated wall, an epoxy paper laminated wall, a polyester glass felt laminated wall, an epoxy glass cloth laminated wall, etc. The hard printed circuit board has a high structural rigidity.

[0071] In specific applications, those skilled in the art can design the shape and setting position of the PCB and FPC as needed. For example, the second part 225b can be set as a PCB, and the first part 225a and the third part 225c can be set as FPC; in this way, the second part 225b can make full use of the high hardness and high strength of the PCB, can improve the structural strength of the entire connecting circuit board 225, and is conducive to achieving the sealed assembly between the connecting circuit board 225 and the second jack 221e-1. The first part 225a and the third part 225c can make full use of the flexible deformation ability of the FPC to alleviate the force between the network card 224 and the second jack 221e-1 and the force between the connecting circuit board 225 and the backplane 212. At the same time, it can also absorb assembly tolerances, vibrations, installation pulls, etc., and can easily achieve flexible assembly.

[0072] There can be a one-to-one matching relationship between the connection circuit board 225 and the network card 224, that is, one network card 224 can be provided with one connection circuit board 225. Figure 4 At this time, the possibility of signals from different network cards 224 interfering with each other is relatively low.

[0073] In addition, there may be a one-to-many matching relationship between the connecting circuit board 225 and the network card 224, that is, one network card 224 may be provided with multiple connecting circuit boards 225, so that the network card 224 may exchange signals with external devices through different connecting circuit boards 225; or, there may be a many-to-one matching relationship between the connecting circuit board 225 and the network card 224, that is, multiple network cards 224 may share one connecting circuit board 225, so that the number of connecting circuit boards 225 is relatively small, the number of second jacks 221e-1 provided on the shell 221 may be relatively small, the potential leakage points may be reduced, and the possibility of leakage of the cooling medium is relatively low.

[0074] The connection circuit board 225 can be connected to a first connector 226. Specifically, the first connector 226 can be installed on the rear wall 221f of the aforementioned housing 221. In the embodiment of the present application, the wall (such as the rear wall 221f) used to install the first connector 226 is also referred to as a mounting wall. The mounting wall is provided with a first jack, and the first connector 226 can be installed on the first jack. The backplane 212 is provided with a second connector 227. When the computing node 220 is inserted into the cabinet 210, the first connector 226 can be plugged into the second connector 227 to realize the connection between the connection circuit board 225 and the backplane 212, and can realize signal transmission between the network card 224 and the backplane 212 side.

[0075] Please refer to Figure 7-Figure 10 , Figure 7 is a connection structure diagram of the first connector and the connection circuit board, Figure 8 for Figure 7 A schematic diagram of the structure from another perspective. Fig. 9 is a schematic structural diagram of the first connector and the second connector when the first floating component is a two-stage floating component, Fig.10 This is a connection structure diagram of the second connector and the external cable.

[0076] like Figure 7 and Figure 8 As shown, the first connector 226 may include a base 226a and a plug-in portion 226b. The plug-in portion 226b may be provided with a plug-in interface 226b-1. The plug-in portion 226b-1 may specifically be an OSFP port, a QSFP port, etc. The plug-in interface 226b-1 has a plug-in direction, and the plug-in direction may specifically be the aforementioned front-to-back direction. The number and arrangement of the plug-in interfaces 226b-1 are not limited herein. In actual applications, those skilled in the art may set them according to specific needs as long as they can meet the requirements of use. For example, as Figure 7 As shown, the plug-in portion 226b may be provided with two plug-in interfaces 226b-1.

[0077] A first floating component 226c may be provided between the plug-in portion 226b and the base 226a, and the first floating component 226c is used for floating connection between the plug-in portion 226b and the base 226a in the plug-in and pull-out direction.

[0078] With such a configuration, when the second connector 227 is docked with the first connector 226, the plug-in portion 226b can float relative to the base 226a in the front-to-back direction, thereby absorbing the docking force well and reducing the possibility of damage to the first connector 226 and the second connector 227 during the docking assembly process. After the assembly is completed, the plug-in portion 226b can be reset relative to the base 226a under the action of the first floating component 226c.

[0079] Specifically, Figure 8 As shown, the first floating component 226c can be a single-stage floating component, which can include two elastic members (only one elastic member is shown in the figure), the base 226a can have a bottom wall 226a-2a, and the two elastic members can be arranged between the bottom wall 226a-2a and the plug-in portion 226b. During the docking and assembly process of the second connector 227 and the first connector 226, the two elastic members can be displaced synchronously.

[0080] In addition, the first floating component 226c can also be a multi-stage floating component, which can include multiple groups of elastic members, and an intermediate floating seat can be provided between two adjacent groups of elastic members. In this embodiment, during the docking and assembly process of the second connector 227 and the first connector 226, each group of elastic members can be displaced successively, so that the docking force can be absorbed to a greater extent.

[0081] like Fig. 9 As shown, taking the scheme with two groups of elastic members as an example, the two groups of elastic members can be arranged in the front-to-back direction. For the convenience of description, one of the two groups of elastic members that is relatively close to the second connector 227 can be called the primary elastic member 226c-1, and one of the two groups of elastic members that is relatively far from the second connector 227 can be called the secondary elastic member 226c-2. The elastic modulus of the primary elastic member 226c-1 can be smaller than that of the secondary elastic member 226c-2. An intermediate floating seat 226c-3 is provided between the primary elastic member 226c-1 and the secondary elastic member 226c-2. During the docking and assembly process between the second connector 227 and the first connector 226, the primary elastic member 226c-1 can first undergo elastic deformation, and then the secondary elastic member 226c-2 can undergo elastic deformation again.

[0082] In some optional embodiments, the base 226a can be a split structure, including a mounting seat body 226a-1 and a floating seat body 226a-2. The mounting seat body 226a-1 is used to realize the installation and fixation of the base 226a. For example, it can be fixed to the rear wall 221f by a connector in the form of screws, and the floating seat body 226a-2 and the mounting seat body 226a-1 can be displaced in the front-to-back direction. The aforementioned bottom wall 226a-2a can be set on the floating seat body 226a-2. The floating seat body 226a-2 can also be provided with a second floating component 226d, and the second floating component 226d is used to realize the floating assembly of the floating seat body 226a-2 in the plug-in and pull-out direction. When the second connector 227 is docked with the first connector 226, the floating seat 226a-2 of the base 226a can also float in the front-to-back direction. Such a configuration can, on the one hand, better absorb the docking force to reduce the possibility of damage to the first connector 226 and the second connector 227 during the docking and assembly process. On the other hand, it can also alleviate the adverse effects of factors such as equipment vibration on signal integrity.

[0083] Similar to the aforementioned first floating component 226c, the second floating component 226d may also be a single-stage floating component or a multi-stage floating component; Figure 7 and Figure 8 In the embodiment, the second floating component 226d is a single-stage floating component, and the single-stage floating component may include four elastic members.

[0084] The elastic modulus of the second floating component 226d may be greater than that of the first floating component 226c, that is, the difficulty of the second floating component 226d to float is greater than that of the first floating component 226c. In this way, during the docking and assembly process of the second connector 227 and the first connector 226, the first floating component 226c may float first, and then the second floating component 226d may float.

[0085] The elastic member can be a spring, which has good elastic deformation and recovery ability, and is available in many models and easy to obtain, and can better meet the use requirements of the floating assembly. In addition, the elastic member can also be an elastic element in the form of a tension rope and an elastic block, as long as it can meet the use requirements; the elastic block specifically refers to a component made of rubber, latex and other materials with a certain elastic deformation ability.

[0086] like Figure 8 As shown, the second connector 227 may include a docking station 227a.

[0087] One of the docking seat 227a and the plug-in portion 226b may be provided with a positioning protrusion 227a-1, and the other may be provided with a positioning recess 226b-2. The positioning protrusion 227a-1 may be plugged into the positioning recess 226b-2. Figure 5 and Figure 8 In the implementation manner, the alignment recess 226b-2 can be set on the plug-in portion 226b, specifically as an alignment hole, and the alignment protrusion 227a-1 can be set on the docking seat 227a, specifically as a guide column; in addition, the alignment recess 226b-2 can also be set on the base 226a, which is also feasible.

[0088] By plugging and fitting between the alignment protrusion 227a-1 and the alignment recess 226b-2, the docking of the first connector 226 and the second connector 227 can be guided, which can improve the accuracy of the docking of the first connector 226 and the second connector 227 and is also beneficial for protecting the first connector 226 and the second connector 227.

[0089] exist Figure 7-Figure 10 In the embodiment, the end of the connecting circuit board 225 away from the network card 224 can be installed on the plug-in portion 226b; the docking seat 227a of the second connector 227 can be installed on the backplane 212, and the second connector 227 can also include a docking circuit board 227b, the docking circuit board 227b has a docking end, and the docking end is provided with a docking gold finger 227b-1, and the docking end can be plugged into the plug interface 226b-1 to achieve the connection between the connecting circuit board 225 and the backplane 212. With this solution, the connecting circuit board 225 and the backplane 212 can be connected with the help of the docking gold finger 227b-1 for signal transmission, which can save the dedicated backplane connector, effectively reduce the use cost, and reduce the loss of high-speed links.

[0090] The end of the docking circuit board 227b away from the docking end can be connected to an external connection cable 213, and the external connection cable 213 can be used to connect with other devices. The connection method between the external connection cable 213 and the docking circuit board 227b can be welding or the like.

[0091] In fact, the structures of the first connector 226 and the second connector 227 can also be interchangeable, that is, the first connector 226 can include a docking seat 227a and a docking circuit board 227b, and the second connector 227 can include a base 226a and a plug-in portion 226b. In this embodiment, the docking circuit board 227b of the first connector 226 and the connecting circuit board 225 can be an integrated circuit board, which can further simplify the structure and can be easily processed.

[0092] The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A computing node, characterized in that: It comprises a housing, a first connector, a connecting circuit board, a communication component and a sealing member; wherein the housing comprises a mounting wall and a receiving cavity; the mounting wall is connected to a wall forming the receiving cavity; the receiving cavity is used to set a liquid-cooling working fluid; The communication component and the sealing component are located in the accommodating cavity; The mounting wall is provided with a first plug hole; A second plug hole is provided on the wall forming the accommodating cavity; Wherein, the first jack and the second jack are arranged opposite to each other; The first connector is disposed at the first jack; Wherein, the connecting circuit board comprises a first part, a second part and a third part; wherein, the first part is a flexible circuit board; The first portion is located between the first jack and the second jack and is electrically connected to the first connector; The second part is inserted into the second plug hole and is sealed and connected to the second plug hole through the sealing member; The third part is located in the accommodating cavity and is electrically connected to the communication component.

2. The computing node according to claim 1, characterized in that: The second part is a flexible circuit board or a rigid circuit board; The third part is a flexible circuit board or a rigid circuit board.

3. The computing node according to claim 1 or 2, characterized in that: The communication component includes a carrier circuit board; The third part is electrically connected to the communication component, including: the third part is electrically connected to the carrier circuit board.

4. The computing node according to claim 3, characterized in that: The connecting circuit board and the bearing circuit board are an integrated circuit board.

5. The computing node according to any one of claims 1 to 4, characterized in that: The sealing member comprises a sealing seat and a sealing element; The sealing seat is provided with a third plug hole; wherein the third plug hole is arranged opposite to the second plug hole; The second part is inserted into the third insertion hole and is sealed and connected to the third insertion hole through the sealing element; the second part is sealed and connected to the second insertion hole through the sealing seat.

6. The computing node according to any one of claims 1 to 5, characterized in that: The first connector is an OSFP connector or a QSFP connector.

7. The computing node according to any one of claims 1 to 5, characterized in that: The first connector is a gold finger connector; the gold finger connector includes a connector circuit board; the connector circuit board and the connection circuit board are integrated into one circuit board.

8. The computing node according to any one of claims 1 to 7, characterized in that: The communication component also includes a network card chip; The network card chip is arranged on the carrier circuit board of the communication component and is electrically connected to the carrier circuit board of the communication component.

9. A computing device, characterized in that The computing device comprises a computing node, a cabinet and a backplane as described in any one of claims 1 to 8; Wherein, the computing node is arranged in the cabinet; The backplane is arranged opposite to the installation wall of the computing node; The back panel is provided with a second connector; The first connector is plugged into the second connector; The communication component communicates through the connection circuit board, the first connector, and the second connector.

10. The computing device according to claim 9, characterized in that: The computing node is a server node, and the computing device is a whole cabinet server.

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