Small-size anti-warping AMB ceramic copper-clad plate and preparation method and packaging method thereof

Abstract

The invention relates to a small-size anti-warping AMB ceramic copper-clad plate as well as a preparation method and a packaging method thereof. Comprising the following steps: setting the reduction size of the length of the AMB ceramic copper-clad plate according to the size and design length requirements of the existing AMB ceramic copper-clad plate, and preparing a small-size AMB ceramic copper-clad plate according to the reduction size; preparing the DBC ceramic copper-clad plate according to the design that the width of the DBC ceramic copper-clad plate is equal to 1 / 2 of the reduced size of the AMB ceramic copper-clad plate plus the total width of a copper layer isolation circuit groove on the DBC ceramic copper-clad plate and the length of the DBC ceramic copper-clad plate is smaller than or equal to the width of the AMB ceramic copper-clad plate; the obtained DBC ceramic copper-clad plates are attached to the left side and the right side of a small-size AMB ceramic copper-clad plate, and the small-size anti-warping AMB ceramic copper-clad plate is obtained; the preparation method of the small-size anti-warping AMB ceramic copper-clad plate is used for solving the technical problem that a large-size AMB ceramic copper-clad plate is used as a substrate, so that the use of the large-size AMB ceramic copper-clad plate in a small device is limited.

Description

Technical Field

[0001] The invention relates to the technical field of packaging, and in particular to a small-size anti-warping AMB ceramic copper-clad plate, a preparation method thereof and a packaging method thereof. Background Art

[0002] At present, the market demand for SiC chip power modules is increasing rapidly. In the traditional packaging process, the tin alloy welding process can no longer meet the advantages of SiC chips. In order to give full play to the advantages of SiC chips, the use of silver sintering process effectively alleviates this shortcoming.

[0003] During the sintering process of SiC chips, the different thermal expansion coefficients of the copper layer, ceramic layer, chip, sintering material, etc. of the AMB ceramic copper clad laminate generate thermal stress, causing the AMB ceramic copper clad laminate to bend and become uneven, which has a great impact on the subsequent packaging. Therefore, it is necessary to use a larger AMB ceramic copper clad laminate as a substrate to ensure the strength while meeting the requirements of multi-electronic insulation and bonding wire layout. The larger the size of the ceramic substrate, the greater the substrate curvature after sintering and packaging. If the AMB ceramic copper clad laminate is simply reduced, it will not be able to meet the requirements of insulation and bonding wire layout for multi-electronic components.

[0004] Therefore, in view of the above problems, the present invention urgently needs to provide a preparation method and packaging method of a small-sized anti-warping AMB ceramic copper-clad laminate. Summary of the invention

[0005] The purpose of the present invention is to provide a small-sized AMB ceramic copper-clad laminate structure design method and a packaging method with enhanced anti-warping properties, and to solve the technical problem in the prior art that large-sized AMB ceramic copper-clad laminates are used as substrates, which limits their use in small devices.

[0006] The present invention provides a method for preparing a small-sized anti-warping AMB ceramic copper-clad laminate, comprising the following steps: According to the existing AMB ceramic copper clad laminate size and design length requirements, the reduced size of the AMB ceramic copper clad laminate length is set, and based on the reduced size, a small-sized AMB ceramic copper clad laminate is prepared; According to the design that the width of DBC ceramic copper clad laminate = 1 / 2 the reduced size of AMB ceramic copper clad laminate + the total width of the copper layer isolation circuit groove on the DBC ceramic copper clad laminate, the length of DBC ceramic copper clad laminate ≤ the width of AMB ceramic copper clad laminate, the DBC ceramic copper clad laminate is prepared; The obtained DBC ceramic copper clad laminate is mounted on the left and right sides of a small-sized AMB ceramic copper clad laminate to obtain a small-sized warping-resistant AMB ceramic copper clad laminate.

[0007] Preferably, on the small-sized anti-warping AMB ceramic copper-clad laminate, the distance between the outer edge of each DBC ceramic copper-clad laminate and the outer edge of the adjacent small-sized AMB ceramic copper-clad laminate is 0.2 mm-1.0 mm.

[0008] Preferably, the DBC ceramic copper-clad laminate is bonded to the small-sized AMB ceramic copper-clad laminate by using an adhesive.

[0009] Preferably, the thickness of the adhesive layer is 0.5±0.2 mm; and the adhesive coating area is ≥ the surface area of ​​the DBC ceramic copper clad laminate.

[0010] Preferably, the adhesive is UV glue; Use 365nm ultraviolet light to evenly irradiate the adhesive surface, the light intensity is 400mW / cm 2 , irradiate at room temperature for no less than 3 seconds and then remove the near-ultraviolet light to activate the adhesive.

[0011] Preferably, the small-sized AMB ceramic copper-clad laminate is divided into three layers: upper, middle and lower layers, which are respectively composed of an AMB upper copper layer, a SiN ceramic layer and an AMB lower copper layer. A circuit isolation groove is etched on the AMB upper copper layer; the DBC ceramic copper-clad laminate is bonded to the upper copper layer of the small-sized AMB ceramic copper-clad laminate.

[0012] Preferably, the DBC ceramic copper-clad laminate is divided into three layers: upper, middle and lower layers, which are DBC upper copper layer, Al 2 O 3 It is composed of a ceramic layer and a DBC1 lower copper layer, and an isolation circuit groove is etched on the DBC upper copper layer.

[0013] Preferably, a suction nozzle is used to press down and mount the DBC ceramic copper-clad board, the pressure applied by the suction nozzle is 20±5N, and the suction nozzle stays for 1-10s.

[0014] The present invention also provides a small-sized anti-warping AMB ceramic copper-clad laminate obtained based on the preparation method of the small-sized anti-warping AMB ceramic copper-clad laminate as described in any one of the above.

[0015] The present invention also provides a packaging method, comprising the following steps: The chips are mounted on the small-sized anti-warping AMB ceramic copper-clad board as described above; each chip is connected to the copper layer of the corresponding DBC ceramic copper-clad board or the copper layer on the small-sized anti-warping AMB ceramic copper-clad board through a wire.

[0016] The small-sized anti-warping AMB ceramic copper-clad laminate, the preparation method and the packaging method thereof provided by the present invention have the following improvements compared with the prior art: The present invention proposes a method for preparing a small-sized anti-warping AMB ceramic copper-clad laminate, and with the assistance of a DBC ceramic copper-clad laminate, the problem of deformation of the AMB ceramic copper-clad laminate under heat and force can be avoided, and the short side of the AMB ceramic copper-clad laminate can be reinforced to prevent the AMB ceramic copper-clad laminate from bending. At the same time, the DBC ceramic copper-clad laminate can provide bonding points to meet the layout of multi-electronic insulation and bonding wires, without etching the short side of the AMB side, increasing the copper layer area of ​​the AMB under the same area, and improving the flow capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a structural schematic diagram of the DBC ceramic copper-clad plate in the present invention being adhered to the AMB ceramic copper-clad plate; Figure 2 This is a diagram of the packaging structure of the DBC ceramic copper-clad laminate bonded to the AMB ceramic copper-clad laminate described in the present invention; Figure 3 An exploded view of the DBC ceramic copper clad laminate described in the present invention; Figure 4 It is a schematic diagram of the structure in which the DBC ceramic copper-clad laminate in the present invention is adhered to the AMB ceramic copper-clad laminate.

[0019] Description of reference numerals: 1. AMB ceramic copper clad laminate; 2. DBC ceramic copper clad laminate; 21. Upper copper layer; 22. Al 2 O 3 Ceramic layer; 23, lower copper layer; 3, lead. DETAILED DESCRIPTION

[0020] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] like Figure 1 As shown, the present embodiment provides a method for preparing a small-sized anti-warping AMB ceramic copper-clad laminate, comprising the following steps: 101) According to the existing AMB ceramic copper clad laminate size and design length requirements, the reduced size of the AMB ceramic copper clad laminate length is set, and based on the reduced size, a small-sized AMB ceramic copper clad laminate 1 is prepared; 102) According to the design that the width of the DBC ceramic copper clad board = 1 / 2 the reduced size of the AMB ceramic copper clad board + the total width of the copper layer isolation circuit groove on the DBC ceramic copper clad board, the length of the DBC ceramic copper clad board ≤ the width of the AMB ceramic copper clad board, prepare the DBC ceramic copper clad board 2; 103) The obtained DBC ceramic copper clad laminate 2 is mounted on the left and right sides of the small-sized AMB ceramic copper clad laminate 1 to obtain a small-sized anti-warping AMB ceramic copper clad laminate.

[0024] like Figure 3 , Figure 4 As shown, specifically, the DBC ceramic copper-clad plate 2 is divided into three layers: upper, middle and lower, which are DBC upper copper layer 21, Al 2 O 3 The ceramic layer 22 and the DBC1 lower copper layer 23 are composed, and an isolation circuit groove is etched on the DBC upper copper layer 21, and the isolation circuit groove includes a first upper copper layer isolation circuit groove 25 arranged in a circumferential direction along the outer edge of the DBC upper copper layer 21 and a second upper copper layer isolation circuit groove 26 arranged in a circumferential direction inside the DBC upper copper layer 21; the total width of the copper layer isolation circuit groove on the DBC ceramic copper clad board = (the width of the first upper copper layer isolation circuit groove + the width of the second upper copper layer isolation circuit groove) × 2.

[0025] For example, the existing AMB ceramic copper-clad laminate has a length of 61.7 mm and a width of 38.94. By designing the auxiliary DBC ceramic copper-clad laminate, the size of the AMB is reduced. The length of the small-sized AMB ceramic copper-clad laminate 1 is 52.3 and the width is 38.94. The total width of the copper layer isolation circuit groove on each DBC ceramic copper-clad laminate is designed to be 1.4 mm; According to the formula, width of DBC ceramic copper clad laminate = 1 / 2 reduced size of AMB ceramic copper clad laminate + total width of copper layer isolation circuit groove on DBC ceramic copper clad laminate, width of DBC ceramic copper clad laminate is 6.1mm, length is 26mm (width and length of DBC ceramic copper clad laminate can be designed according to actual requirements, not greater than total width of AMB ceramic copper clad laminate, not less than 1 / 2 total width of AMB ceramic copper clad laminate), prepare DBC ceramic copper clad laminate according to size, mount DBC ceramic copper clad laminate on left and right sides of small-sized AMB ceramic copper clad laminate 1, and obtain small-sized anti-warping AMB ceramic copper clad laminate.

[0026] The present invention proposes a method for preparing a small-sized anti-warping AMB ceramic copper-clad laminate, and with the assistance of a DBC ceramic copper-clad laminate, the problem of deformation of the AMB ceramic copper-clad laminate under heat and force can be avoided, and the short side of the AMB ceramic copper-clad laminate can be reinforced to prevent the AMB ceramic copper-clad laminate from bending. At the same time, the DBC ceramic copper-clad laminate can provide bonding points to meet the layout of multi-electronic insulation and bonding wires, without etching the short side of the AMB side, increasing the copper layer area of ​​the AMB under the same area, and improving the flow capacity.

[0027] The present invention follows the principle that the width of the DBC ceramic copper-clad board = 1 / 2 the reduced size of the AMB ceramic copper-clad board + the total width of the copper layer isolation circuit groove on the DBC ceramic copper-clad board. The copper layer isolation circuit groove is used for bonding and electrical connection of different circuits. The width of the isolation circuit groove depends on the voltage and current level. Therefore, the width design of the DBC ceramic copper-clad board needs to retain the width of the copper layer isolation circuit groove on the DBC ceramic copper-clad board, thereby ensuring the conductive effect and electrical insulation.

[0028] In some embodiments, on the small-sized anti-warping AMB ceramic copper clad laminate, the distance between the outer edge of each DBC ceramic copper clad laminate 2 and the outer edge of the adjacent small-sized AMB ceramic copper clad laminate 1 is 0.2mm-1.0mm, and the above design facilitates packaging.

[0029] In some embodiments, the DBC ceramic copper clad laminate 2 is bonded to the small-sized AMB ceramic copper clad laminate 1 with an adhesive; the thickness of the adhesive layer is 0.5±0.2 mm; and the adhesive coating area is ≥ the surface area of ​​the DBC ceramic copper clad laminate 2 .

[0030] In some embodiments, the adhesive is UV glue; 365nm ultraviolet light is evenly irradiated on the adhesive surface, and the light intensity is 400mW / cm 2 , remove the near-ultraviolet light after irradiation at room temperature for no less than 3s to activate the adhesive; the curing conditions of UV glue do not require heating so that DBC will not be deformed by heat.

[0031] Specifically, the small-sized AMB ceramic copper-clad laminate 1 is divided into three layers: upper, middle and lower, which are respectively composed of an AMB upper copper layer, a SiN ceramic layer and an AMB lower copper layer. A circuit isolation groove is etched on the AMB upper copper layer; the DBC ceramic copper-clad laminate 2 is bonded to the upper copper layer of the small-sized AMB ceramic copper-clad laminate 1.

[0032] Specifically, the DBC ceramic copper-clad board 2 is mounted by pressing down with a suction nozzle, the pressure applied by the suction nozzle is 20±5N, and the suction nozzle stays for 1-10s.

[0033] The present invention also provides a small-sized anti-warping AMB ceramic copper-clad laminate obtained based on the preparation method of the small-sized anti-warping AMB ceramic copper-clad laminate as described in any one of the above.

[0034] like Figure 2 As shown, the present invention also provides a packaging method, comprising the following steps: 201) mounting the chip onto the small-sized anti-warping AMB ceramic copper-clad board as described above; 202) Connect each chip to the copper layer of the corresponding DBC ceramic copper clad board 2 or the copper layer on the small-sized anti-warping AMB ceramic copper clad board through wires.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a small-size anti-warping AMB ceramic copper-clad laminate, characterized in that: The steps include: According to the existing AMB ceramic copper clad laminate size and design length requirements, a reduced size of the AMB ceramic copper clad laminate length is set, and based on the reduced size, a small-sized AMB ceramic copper clad laminate (1) is prepared; According to the design that the width of the DBC ceramic copper clad laminate is equal to 1 / 2 the reduced size of the AMB ceramic copper clad laminate + the total width of the copper layer isolation circuit groove on the DBC ceramic copper clad laminate, and the length of the DBC ceramic copper clad laminate is less than or equal to the width of the AMB ceramic copper clad laminate, a DBC ceramic copper clad laminate (2) is prepared; The obtained DBC ceramic copper-clad laminate (2) is mounted on the left and right sides of a small-sized AMB ceramic copper-clad laminate (1) to obtain a small-sized anti-warping AMB ceramic copper-clad laminate.

2. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 1, characterized in that: In the small-sized anti-warping AMB ceramic copper-clad laminate, the distance between the outer edge of each DBC ceramic copper-clad laminate (2) and the outer edge of the adjacent small-sized AMB ceramic copper-clad laminate (1) is 0.2 mm to 1.0 mm.

3. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 1, characterized in that: A DBC ceramic copper-clad laminate (2) is bonded to a small-sized AMB ceramic copper-clad laminate (1) using an adhesive.

4. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 3, characterized in that: The thickness of the adhesive layer is 0.5±0.2 mm; the adhesive coating area is ≥ the surface area of ​​the DBC ceramic copper clad laminate (2).

5. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 3, characterized in that: The adhesive is UV glue; Use 365nm ultraviolet light to evenly irradiate the adhesive surface, the light intensity is 400mW / cm 2 , irradiate at room temperature for no less than 3 seconds and then remove the near-ultraviolet light to activate the adhesive.

6. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 1, characterized in that: The small-sized AMB ceramic copper-clad laminate (1) is divided into three layers: an upper layer, a middle layer and a lower layer, which are respectively composed of an AMB upper copper layer, a SiN ceramic layer and an AMB lower copper layer. A circuit isolation groove is etched on the AMB upper copper layer. The DBC ceramic copper-clad laminate (2) is bonded to the upper copper layer of the small-sized AMB ceramic copper-clad laminate (1).

7. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 1, characterized in that: The DBC ceramic copper-clad plate (2) is divided into three layers: an upper layer, a middle layer and a lower layer, which are respectively composed of a DBC upper copper layer (21), an Al2O3 ceramic layer (22) and a DBC1 lower copper layer (23). An isolation circuit groove is etched on the DBC upper copper layer (21).

8. The method for preparing a small-size anti-warping AMB ceramic copper-clad laminate according to claim 1, characterized in that: The DBC ceramic copper-clad board (2) is mounted by pressing down with a suction nozzle, the pressure applied by the suction nozzle is 20±5N, and the suction nozzle stays for 1-10s.

9. A small-sized anti-warping AMB ceramic copper-clad laminate obtained based on the preparation method of the small-sized anti-warping AMB ceramic copper-clad laminate according to any one of claims 1 to 8.

10. A packaging method, characterized in that: The steps include: The chip is mounted on the small-sized anti-warping AMB ceramic copper-clad board as claimed in claim 9; each chip is connected to the copper layer of the corresponding DBC ceramic copper-clad board (2) or the copper layer on the small-sized anti-warping AMB ceramic copper-clad board through a wire.

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