Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)

Abstract

The invention discloses a packaging method of a PCBA board. The PCBA board comprises a printed circuit board and an electronic element arranged on the printed circuit board. The maximum height of the electronic component relative to the surface of the printed circuit board is less than 1cm. The packaging method comprises the following steps: controlling a glue spraying assembly to spray a UV glue solution to a target glue spraying area of the PCBA board on a horizontal plane in a manner of moving at least along a first direction and a second direction; the first direction and the second direction intersect and are both parallel to the horizontal plane. According to the packaging method of the PCBA board, the glue spraying assembly can move on the horizontal plane in at least two directions, and glue spraying protection of the large-area PCBA board is achieved.

Description

Technical Field

[0001] The present invention relates to the field of circuit board packaging technology, and in particular to a packaging method and packaging equipment for a PCBA board. Background Art

[0002] There are many ways to package PCBA (Printed Circuit Board + Assembly) boards, such as coating the surface of the circuit board with conformal coating, potting, and low-pressure injection molding. Each of the above methods has its own advantages and disadvantages: direct spraying of conformal coating, although simple, convenient, and easy to implement, cannot truly protect the circuit board, cannot achieve waterproofing and shockproofing, and the packaging may fail over time; potting is cumbersome, inefficient, costly, and has poor reliability; low-pressure injection molding uses low-pressure injection molding equipment, special molds, and adjusts the corresponding injection pressure and time to complete the packaging of the circuit board. This method has high mold design and production costs, and the characteristics of the glue itself have a greater impact on the packaging.

[0003] In the patent with application number CN2021 / 131465 and name "PCBA board packaging method and packaging equipment", the adopted scheme is suitable for the reliable packaging of low-height PCBA boards, but its spray glue assembly can only move back and forth in a straight line in a horizontal direction, resulting in a limited spraying range of the nozzle; although the relative movement of the PCBA board and the spray glue assembly can be achieved through a movable workbench, the structure connected to the workbench for placing the PCBA board is complex, which is not conducive to product simplification. Summary of the invention

[0004] In view of the deficiencies in the prior art, an object of this specification is to provide a packaging method and packaging equipment for a PCBA board, wherein a glue spraying assembly can move in at least two directions on a horizontal plane to achieve glue spraying protection for a large-area PCBA board.

[0005] To achieve the above-mentioned purpose, an embodiment of the present specification provides a packaging method for a PCBA board, wherein the PCBA board includes a printed circuit board and electronic components arranged on the printed circuit board; the maximum height of the electronic components relative to the surface of the printed circuit board is less than 1 cm, and the packaging method includes: controlling a spray glue assembly to move along at least a first direction and a second direction on a horizontal plane to spray UV glue toward a target spray glue area of ​​the PCBA board; the first direction and the second direction intersect and are both parallel to the horizontal plane.

[0006] As a preferred implementation, during the glue spraying process, the relative height between the glue spraying assembly and the PCBA board remains unchanged.

[0007] As a preferred implementation, the first direction and the second direction are perpendicular to each other.

[0008] As a preferred implementation, in the packaging method, the glue spraying assembly is controlled to move in a forward direction in the first direction, a forward direction in the second direction, a reverse direction in the first direction, and a reverse direction in the second direction in a cycle.

[0009] As a preferred implementation, in the packaging method, the glue spraying assembly is controlled to move in a cyclic manner in a first direction forward, a second direction forward, a first direction reverse, and a second direction forward.

[0010] As a preferred implementation, the distances that the glue spraying assembly moves in the forward direction and in the reverse direction along the first direction are equal, and the distances that the glue spraying assembly moves in the forward direction and in the reverse direction along the second direction are equal.

[0011] As a preferred implementation, the distance that the glue spraying assembly moves along the first direction is equal to the length of the PCBA board in the first direction.

[0012] As a preferred implementation, the distance that the glue spraying assembly moves along the second direction is less than or equal to the length of the glue spraying assembly in the second direction.

[0013] As a preferred embodiment, when the glue spraying component moves forward and reversely along the first direction, it sprays UV glue to the target glue spraying area of ​​the PCBA board; when the glue spraying component moves forward or reversely along the second direction, it stops spraying.

[0014] The embodiment of this specification also provides a PCBA board packaging device, including: A glue spraying assembly having a plurality of spray holes for independently controlling spraying; A moving assembly connected to the glue spraying assembly; the moving assembly is used to drive the glue spraying assembly to move at least along a first direction and a second direction on a horizontal plane; the first direction and the second direction intersect and are both parallel to the horizontal plane; A workbench located below the spray hole, the workbench having a placement surface for placing a PCBA board; A control device connected to the glue spraying assembly and the moving assembly can control the glue spraying assembly to move along at least a first direction and a second direction on a horizontal plane to spray UV glue to a target glue spraying area of ​​the PCBA board. Beneficial Effects

[0015] The packaging method of the PCBA board provided in this embodiment can control the glue spraying component to move in at least two directions on a horizontal plane to spray UV glue to the target glue spraying area of ​​the PCBA board, and can achieve glue spraying protection for large-area PCBA boards. In addition, there is no need to move the workbench for placing the PCBA board, which can simplify the relevant structure of the workbench.

[0016] With reference to the following description and the accompanying drawings, the specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0017] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0018] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A schematic diagram of the movement trajectory of a glue spraying component on a PCBA board provided in this embodiment; Figure 2 A schematic diagram of the movement trajectory of another glue spraying component provided in this embodiment on the PCBA board; Figure 3 A schematic diagram of a movement trajectory of a glue spraying component on a PCBA board in a possible embodiment; Figure 4 FIG. 4 is a schematic diagram of the movement trajectory of the glue spraying component on the PCBA board in another possible embodiment.

[0021] Description of reference numerals: 1. PCBA board; 2. Glue spraying assembly; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0023] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be another element centered thereon. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be another element centered thereon at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] See also Figure 1 and Figure 2 . The embodiment of the present application provides a packaging method for a PCBA board. The packaging method is applicable to, but not limited to, a low-height PCBA board 1 (which may also be directly referred to as PCBA). The PCBA board 1 includes a printed circuit board and electronic components arranged on the printed circuit board. The maximum height of the electronic component relative to the surface of the printed circuit board (PCB) is less than 1 cm. Furthermore, the maximum height of the electronic component relative to the surface of the printed circuit board is less than 0.5 mm.

[0026] refer to Figure 1 and Figure 2 As shown, the packaging method includes: controlling the glue spraying component 2 to move along at least a first direction X and a second direction Y on a horizontal plane to spray UV glue to a target glue spraying area of ​​the PCBA board 1. The first direction X and the second direction Y intersect and are both parallel to the horizontal plane. The height position of the glue spraying component 2 does not change during the movement. The glue spraying component 2 moves at least in two different directions at the same height position, which can realize glue spraying protection of a large area PCBA board 1. In addition, there is no need to move the workbench for placing the PCBA board 1, which can simplify the relevant structure of the workbench.

[0027] In the packaging method, the glue spraying assembly 2 is positioned higher than the highest electronic component, and the distance between the glue spraying assembly 2 and the highest electronic component is controlled to be less than 2 mm. Furthermore, the distance between the glue spraying assembly 2 and the highest electronic component is controlled to be less than 1 mm.

[0028] In order to avoid interference between the electronic components on the PCBA board 1 and the moving path of the glue spraying assembly 2, and the glue (glue droplets) drifting, the distance between the glue spraying assembly 2 and the PCBA board 1 should not be too large. The glue spraying assembly 2 uses an array nozzle such as a piezoelectric array nozzle, which has a small nozzle hole and a high initial velocity of the glue droplets ejected, but the speed is also damaged quickly, which is prone to drifting. To avoid this problem, the distance between the glue spraying assembly 2 and the highest electronic component is controlled to be less than 2mm, or even within 1mm.

[0029] During the glue spraying process, the relative height between the glue spraying component 2 and the PCBA board 1 remains unchanged. During the glue spraying process, the glue spraying component 2 is controlled to move along at least the first direction X and the second direction Y on a horizontal plane to spray UV glue to the target glue spraying area of ​​the PCBA board 1 until the glue spraying packaging is completed. The PCBA board 1 is placed horizontally on a workbench, and the glue spraying component 2 is controlled to spray glue to the PCBA board 1 on the workbench in a manner that the spray hole is vertically facing the workbench.

[0030] In this embodiment, the first direction X and the second direction Y are perpendicular to each other. In the packaging method, the glue spraying assembly 2 is controlled to move linearly along the first direction X and the second direction Y to spray UV glue to the target glue spraying area of ​​the PCBA board 1. The first direction X and the second direction Y can be the extension directions of each side of the rectangular PCBA board 1, respectively.

[0031] In one embodiment of a packaging method, Figure 1 As shown, the glue spraying assembly 2 is controlled to move in a circular motion in the first direction X, the second direction Y, the first direction X, and the second direction Y. In this embodiment, the length of the PCBA board 1 in the second direction Y is required to be greater than the length of the glue spraying assembly 2 in the second direction Y and less than or equal to twice the length of the glue spraying assembly 2 in the second direction Y. At this time, the movement trajectory of the glue spraying assembly 2 is approximately in the shape of a "mouth".

[0032] The glue spraying component 2 completes one movement along the first direction X positive direction, the second direction Y positive direction, the first direction X reverse direction, and the second direction Y reverse direction to form a glue spraying layer. The glue spraying component 2 moves along the first direction X positive direction, the second direction Y positive direction, the first direction X reverse direction, and the second direction Y reverse direction once in sequence as completing the first moving unit, and the glue spraying component 2 is controlled to repeatedly complete the first moving unit. The number of times the first moving unit is completed is equal to the number of glue spraying layers formed by the glue spraying component 2 on the PCBA board 1.

[0033] The packaging method also includes the steps of: obtaining a target number of glue spraying layers; controlling the glue spraying component 2 to move along at least a first direction X and a second direction Y on a horizontal plane to spray UV glue to a target glue spraying area of ​​the PCBA board 1 until the target glue spraying area reaches the target number of glue spraying layers.

[0034] In another embodiment of the packaging method, Figure 2 As shown, the glue spraying assembly 2 is controlled to move cyclically in the first direction X, the second direction Y, the first direction X, and the second direction Y. In this embodiment, the length of the PCBA board 1 in the second direction Y is required to be greater than twice the length of the glue spraying assembly 2 in the second direction Y.

[0035] Divide the length of the PCBA board 1 in the second direction Y by the length of the glue spraying component 2 in the second direction Y. If the quotient is evenly divisible, the value of the quotient is the number of movements along the first direction X (including forward and reverse directions) required to form a glue spraying layer; if the quotient is not evenly divisible, the value of the quotient plus one is the number of movements along the first direction X (including forward and reverse directions) required to form a glue spraying layer.

[0036] After the first glue spraying layer is formed, the nozzle assembly can be controlled to move in the reverse direction along the movement trajectory of the first glue spraying layer to form the second glue spraying layer, and then the nozzle assembly can be controlled to move forward along the movement trajectory of the first glue spraying layer to form the third glue spraying layer, etc., that is, the movement trajectories of forming two adjacent glue spraying layers are opposite. Alternatively, after the first glue spraying layer is formed, the nozzle assembly can be controlled to move to the initial position of the first glue spraying layer, and continue to form the second glue spraying layer, the third glue spraying layer, etc., that is, the movement trajectories of forming all glue spraying layers are the same.

[0037] In the above two embodiments, the distances that the glue spraying assembly 2 moves in the forward direction and in the reverse direction along the first direction X are equal, and the distances that the glue spraying assembly 2 moves in the forward direction and in the reverse direction along the second direction Y are equal. Specifically, the distance that the glue spraying assembly 2 moves in the first direction X is equal to the length of the PCBA board 1 in the first direction X. The distance that the glue spraying assembly 2 moves in the second direction Y is less than or equal to the length of the glue spraying assembly 2 in the second direction Y.

[0038] When the glue spraying component 2 moves forward and reversely along the first direction X, it sprays UV glue to the target glue spraying area of ​​the PCBA board 1. When the glue spraying component 2 moves forward or reversely along the second direction Y, it stops spraying.

[0039] In a possible embodiment, the glue spraying component 2 can be controlled to move in a positive direction of the first direction X, a positive direction of the second direction Y, a reverse direction of the first direction X, and a reverse direction of the second direction Y in a cycle. The distance moved by the glue spraying component 2 along the first direction X gradually decreases from the length of the PCBA board 1 in the first direction X to zero, and the distance moved along the second direction Y gradually decreases from the length of the PCBA board 1 in the second direction Y to zero; or, the distance moved by the glue spraying component 2 along the first direction X gradually increases from zero to the length of the PCBA board 1 in the first direction X, and the distance moved along the second direction Y gradually increases from zero to the length of the PCBA board 1 in the second direction Y. At this time, the movement trajectory of the glue spraying component 2 is roughly a straight spiral with a rectangular appearance, such as Figure 3 and Figure 4 shown.

[0040] It should be noted that the glue spraying assembly 2 in the embodiment of the present application has no rotational freedom and can only perform translational motion in a horizontal plane. Preferably, the glue spraying assembly 2 only performs translational motion in the first direction X and the second direction Y.

[0041] Based on the same concept, a PCBA board packaging device is also provided in an embodiment of the present invention. As described in the following embodiments, the packaging device can implement the packaging method in the above embodiments. Since the principle of solving the problem by the PCBA board packaging device and the technical effect that can be achieved are similar to those of the above PCBA board packaging method, the implementation of the PCBA board packaging device can refer to the implementation of the above PCBA board packaging method, and the repeated parts will not be repeated.

[0042] One embodiment of the present invention further provides a PCBA board packaging device. The PCBA board packaging device is suitable for protective packaging of electronic components on a PCBA board 1. The PCBA board 1 includes a printed circuit board and electronic components arranged on the printed circuit board. In particular, the PCBA board packaging device is suitable for electronic packaging of a low-height, thin or patch PCBA board 1. Specifically, the maximum height of the electronic component relative to the surface of the printed circuit board (PCB) is less than 1 cm. Furthermore, the maximum height of the electronic component relative to the surface of the printed circuit board 100 is less than 0.5 mm.

[0043] In this embodiment, the PCBA board packaging equipment includes: a glue spraying component 2, a moving component, and a workbench. The packaging equipment may also have an equipment housing, and the glue spraying component 2, the moving component, and the workbench are located in the equipment housing to prevent environmental impurities from entering the glue solution and affecting the packaging quality. An observation window is provided above the equipment housing to observe the packaging of the PCBA board 1. After the PCBA board 1 is packaged, the equipment door where the observation window is located can be opened by a handle, the PCBA board 1 is removed, and a new PCBA board 1 is sent in. A storage door is provided below the equipment housing, and a storage space is formed on the inner side of the storage door.

[0044] The glue spraying assembly 2 has a plurality of independently controlled spray holes. The moving assembly is connected to the glue spraying assembly 2. The moving assembly is used to drive the glue spraying assembly 2 to move at least along a first direction X and a second direction Y on a horizontal plane. The workbench is located below the spray holes. The workbench is lower than the spray holes in height. The workbench has a placement surface for placing the PCBA board 1.

[0045] The glue spraying assembly 2 is fixed with at least one array nozzle. The array nozzle has a glue input joint and a glue output joint to connect to a glue storage box. Each array nozzle is connected to a glue storage box through a glue input joint and a glue output joint. Each array nozzle is independently supplied with glue.

[0046] The glue spraying assembly 2 is also fixed with a curing light source. The curing light source is an LED lamp with a wavelength of 365-395nm. The UV energy is 8000mW / cm 3 . The curing depth of the curing light source is 100-3000μm. The curing light source is located on at least one side of the glue spraying assembly 2 in the first direction X and / or at least one side in the second direction Y. The light-emitting surface of the curing light source is oriented perpendicular to the workbench. The curing light source is also provided with a water-cooled heat dissipation structure. The light-emitting surface of the curing light source is arranged vertically downward. A water-cooled input connector and a water-cooled output connector are provided on the curing light source. A power connector (cable connector) is provided between the water-cooled input connector and the water-cooled output connector to input electrical energy.

[0047] Preferably, curing light sources are provided on both sides of the first direction X of the glue spraying assembly 2. A horizontal mounting plate is provided at the lower end of the glue spraying assembly 2. Two curing light sources (UV lamps) are respectively mounted on the mounting plate and are at the same level (at the same height) as the array nozzle. When moving along the first direction X, the curing light source on the rear side of the glue spraying assembly 2 in the moving direction can be turned on to achieve follow-up curing after glue spraying, so that glue spraying and curing can be performed simultaneously.

[0048] In order to achieve a better curing effect and avoid the curing light source affecting the spraying of the glue (mainly to prevent the droplets from being cured before contacting the PCBA), the horizontal distance between the curing light source and the array nozzle is greater than 5cm. The horizontal distance between the curing light source and the array nozzle is within 15cm.

[0049] In this embodiment, the moving component may include at least one screw module. The screw module has a servo motor and a screw driven to rotate by the servo motor. The screw module is provided with a slider sliding along the screw. The glue spraying assembly 2 includes a glue spraying bracket fixedly connected to the slider, and the glue spraying assembly 2 moves linearly with the slider. The glue spraying assembly 2 constitutes a glue spraying bracket of the glue spraying shell, and multiple array nozzles are fixed therein, or the array nozzles are fixedly configured so that the glue spraying bracket faces the bottom below, and the glue spraying panel of the array nozzle is a horizontal panel, and the spray hole is vertically downward, perpendicular to the workbench.

[0050] In other embodiments, the moving assembly may further include an electric cylinder and a linear guide rail. The glue spraying assembly 2 includes a glue spraying bracket slidably disposed on the linear guide rail and driven by the electric cylinder to reciprocate along the linear guide rail. The array nozzle is fixedly disposed on the glue spraying bracket.

[0051] In order to realize the automation of packaging and improve production efficiency, in one embodiment, the packaging equipment also includes a control device connected to the spray glue component 2 and the moving component, and the control device can control the spray glue component 2 to move along at least a first direction X and a second direction Y on a horizontal plane to spray UV glue to the target spray glue area of ​​the PCBA board 1.

[0052] In another embodiment, the packaging device further includes an acquisition module for acquiring information of the glue spraying area and a control device connected to the glue spraying component 2, the moving component, and the acquisition module. The control device can control the glue spraying component 2 to move along at least a first direction X and a second direction Y on a horizontal plane to spray UV glue to the target glue spraying area of ​​the PCBA board 1.

[0053] The acquisition module includes a network transmission module, or drawing software, or mapping software, or a data transmission interface such as a USB interface, a type-C interface, etc., to input or import the glue spraying information picture. The acquisition module may also include an information input device such as a touch screen or a keyboard to input the target number of glue spraying layers. The controller runs the host computer software.

[0054] It should be noted that, in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, and they cannot be understood as indicating or implying relative importance. In addition, in the description of this specification, unless otherwise specified, the meaning of "plurality" is two or more.

[0055] Any numerical value cited herein includes all values ​​of lower and upper values ​​that increase by one unit from the lower limit to the upper limit, and there is at least a two-unit interval between any lower value and any higher value. For example, if the value of the quantity of a component or a process variable (such as temperature, pressure, time, etc.) is set forth to be from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in the specification. For values ​​less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be clearly expressed, and it can be considered that all possible combinations of numerical values ​​listed between the lowest value and the highest value are clearly set forth in the specification in a similar manner.

[0056] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. "About" or "approximately" used with a range applies to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30", including at least the specified endpoints.

[0057] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." to describe a combination should include the identified elements, ingredients, parts or steps and other elements, ingredients, parts or steps that do not substantially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, parts or steps herein also contemplates embodiments that consist essentially of these elements, ingredients, parts or steps. By using the term "may", it is intended to indicate that any attribute described that "may" include is optional.

[0058] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure "one" or "an" used to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0059] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents possessed by such claims. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to be a waiver of the subject matter, nor should it be considered that the inventors did not consider the subject matter to be part of the disclosed inventive subject matter.

Claims

1. A packaging method for a PCBA board, wherein the PCBA board comprises a printed circuit board and an electronic component arranged on the printed circuit board; the maximum height of the electronic component relative to the surface of the printed circuit board is less than 1 cm, characterized in that: The packaging method comprises: controlling the glue spraying component to move along at least a first direction and a second direction on a horizontal plane to spray UV glue to a target glue spraying area of ​​the PCBA board; the first direction and the second direction intersect and are both parallel to the horizontal plane.

2. The packaging method of the PCBA board according to claim 1, characterized in that: During the glue spraying process, the relative height between the glue spraying assembly and the PCBA board remains unchanged.

3. The packaging method of PCBA board according to claim 1, characterized in that: The first direction and the second direction are perpendicular to each other.

4. The packaging method of the PCBA board according to claim 3, characterized in that: In the packaging method, the glue spraying assembly is controlled to move in a forward direction of the first direction, a forward direction of the second direction, a reverse direction of the first direction, and a reverse direction of the second direction in a cycle.

5. The packaging method of PCBA board according to claim 3, characterized in that: In the packaging method, the glue spraying assembly is controlled to move in a circular manner in a first direction forward, a second direction forward, a first direction reverse, and a second direction forward in sequence.

6. The packaging method of the PCBA board according to claim 4 or 5, characterized in that: The distances that the glue spraying assembly moves in the forward direction and in the reverse direction along the first direction are equal, and the distances that the glue spraying assembly moves in the forward direction and in the reverse direction along the second direction are equal.

7. The packaging method of the PCBA board according to claim 6, characterized in that: The distance that the glue spraying assembly moves along the first direction is equal to the length of the PCBA board in the first direction.

8. The packaging method of the PCBA board according to claim 7, characterized in that: The distance that the glue spraying assembly moves along the second direction is less than or equal to the length of the glue spraying assembly in the second direction.

9. The packaging method of the PCBA board according to claim 8, characterized in that: When the glue spraying component moves forward and reversely along the first direction, UV glue is sprayed to the target glue spraying area of ​​the PCBA board; when the glue spraying component moves forward or reversely along the second direction, the spraying is stopped.

10. A PCBA board packaging device, characterized in that: include: A glue spraying assembly having a plurality of spray holes for independently controlling spraying; A moving component connected to the glue spraying component; The moving assembly is used to drive the glue spraying assembly to move at least along a first direction and a second direction on a horizontal plane; the first direction and the second direction intersect and are both parallel to the horizontal plane; A workbench located below the spray hole, the workbench having a placement surface for placing a PCBA board; A control device connected to the glue spraying assembly and the moving assembly can control the glue spraying assembly to move along at least a first direction and a second direction on a horizontal plane to spray UV glue to a target glue spraying area of ​​the PCBA board.

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