Shell assembly and electronic equipment

Abstract

The invention discloses a shell assembly and electronic equipment, and belongs to the technical field of electronic equipment. The housing assembly comprises a rear cover; the edge of the frame assembly is connected with the edge of the rear cover; the mounting part is connected with the frame assembly and is used for mounting a battery of the electronic equipment; and under the condition that the battery is mounted on the mounting part, at least one part of the mounting part is positioned between the battery and the rear cover.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and in particular relates to a housing assembly and an electronic equipment. Background Art

[0002] In the related art, the housing of electronic devices mostly adopts a sandwich structure, that is, the middle frame is arranged between the screen and the battery cover. Furthermore, a battery is generally arranged between the battery cover and the middle frame. In order to achieve the thinning of the whole device, the back cover usually adopts a special fiber material to improve the strength of the battery cover. However, when the battery cover is thinned to a certain thickness, the battery cover has basically no rigidity and extremely poor impact resistance, which cannot meet the safety performance of the battery. Summary of the invention

[0003] The present application aims to provide a housing assembly and an electronic device, which can solve the technical problem in the related art that the safety of the battery cannot be guaranteed after the battery cover of the electronic device is thinned.

[0004] In a first aspect, an embodiment of the present application provides a housing assembly for an electronic device, the housing assembly comprising:

[0005] Back cover;

[0006] A frame assembly, the edge of which is connected to the edge of the back cover;

[0007] An installation portion, connected to the frame assembly, for installing a battery of the electronic device;

[0008] Wherein, when the battery is mounted on the mounting portion, at least a portion of the mounting portion is located between the battery and the rear cover.

[0009] In a second aspect, an embodiment of the present application provides an electronic device, including: a housing assembly as in the first aspect.

[0010] The housing assembly of the embodiment of the present application includes a back cover and a frame assembly, the edge of the frame assembly is connected to the edge of the back cover, so that the back cover and the frame assembly enclose a receiving space, and further, the housing assembly also includes a mounting portion, the mounting portion is connected to the frame assembly, and the mounting portion is located in the receiving space enclosed by the back cover and the frame assembly, and the mounting portion is used to install the battery of the electronic device. Wherein, when the battery of the electronic device is installed in the mounting portion, at least a part of the mounting portion is located between the battery and the back cover. Thus, when the back cover is impacted by an external object, at least a part of the mounting portion can be used to support the deformation of the back cover. In this way, compared with the battery cover in the related art, when the same impact force is received and the disturbance of the back cover is the same as the disturbance of the battery cover in the related art, due to the supporting effect of a part of the mounting portion, the span of the deformed part of the back cover is reduced, so when the thickness of the back cover is reduced, it can also be ensured that the back cover is within the range of elastic deformation and will not be damaged due to excessive deformation, thereby ensuring the safety of the battery and being conducive to the miniaturization design of the electronic device.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 One of the structural schematic diagrams of the housing assembly of an embodiment of the present application is shown;

[0014] Figure 2 A second structural schematic diagram of a housing assembly according to an embodiment of the present application is shown;

[0015] Figure 3 Shows Figure 2 Sectional view in the AA direction;

[0016] Figure 4 Shows Figure 3 A partial enlarged view of point B in the middle;

[0017] Figure 5 A schematic diagram of force analysis of the rear cover in an embodiment of the present application is shown;

[0018] Figure 6 Shows Figure 1 A schematic diagram of the structure of the middle frame assembly and the mounting portion;

[0019] Figure 7 Shows Figure 1 A schematic diagram of the structure of the heat dissipation component;

[0020] Figure 8 A third structural schematic diagram of a housing assembly according to an embodiment of the present application is shown;

[0021] Fig. 9 A flowchart showing a heat transfer process of a housing assembly according to an embodiment of the present application is shown;

[0022] Fig.10 Shows Figure 1 Schematic diagram of the structure of the middle and rear cover;

[0023] Fig.11 A schematic structural diagram of an electronic device according to an embodiment of the present application is shown.

[0024] Reference numerals:

[0025] 100 shell assembly, 102 back cover, 104 frame assembly, 106 installation part, 108 first frame, 110 second frame, 112 connecting rod, 114 supporting rod, 116 device compartment, 118 heat dissipation assembly, 120 third frame, 122 partition, 124 first heat conducting plate, 126 placement groove, 128 first hollow part, 130 second hollow part, 132 second heat conducting plate, 134 first cover body, 136 second cover body, 138 mounting bracket, 200 electronic device, 202 battery, 204 electronic device, 206 screen. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0027] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, and internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] Combine the following Figures 1 to 11 A housing assembly and an electronic device according to embodiments of the present application are described.

[0030] In some embodiments of the present application, a housing assembly is provided. Figure 1 One of the structural schematic diagrams of the housing assembly of an embodiment of the present application is shown; Figure 2 The second structural schematic diagram of the housing assembly of the embodiment of the present application is shown; Figure 1 and Figure 2 As shown, the shell assembly 100 is used for an electronic device 200, and the shell assembly 100 includes: a back cover 102; a frame assembly 104, the edge of the frame assembly 104 is connected to the edge of the back cover 102; a mounting portion 106, connected to the frame assembly 104, and used to install a battery 202 of the electronic device 200; wherein, when the battery 202 is installed on the mounting portion 106, at least a portion of the mounting portion 106 is located between the battery 202 and the back cover 102.

[0031] In the embodiment of the present application, the housing assembly 100 includes a rear cover 102 and a frame assembly 104, wherein the edge of the frame assembly 104 is connected to the edge of the rear cover 102, so that the rear cover 102 and the frame assembly 104 enclose a storage space for accommodating multiple components of the electronic device 200, such as a motherboard, a battery 202, and related electrical components. Specifically, the housing assembly 100 also includes a mounting portion 106, which is connected to the frame assembly 104 and is located in the storage space enclosed by the rear cover 102 and the frame assembly 104, and the mounting portion 106 is used to install the battery 202 of the electronic device.

[0032] Further, when the battery 202 of the electronic device 200 is installed on the installation portion 106, at least a portion of the installation portion 106 is located between the battery 202 and the back cover 102. It can be understood that when the battery 202 is installed on the installation portion 106, the back cover 102 can be used to protect the battery 202, thereby preventing the electronic device 200 from being damaged by an external object when the battery 202 is impacted. At the same time, at least a portion of the installation portion 106 is located between the battery 202 and the back cover 102, so that when the back cover 102 is impacted by an external object, at least a portion of the installation portion 106 can be used to support the deformation of the back cover 102, so that the span of the deformed portion of the back cover 102 can be reduced, thereby effectively reducing the deformation of the back cover 102 when it is impacted by an external object, thereby preventing the back cover 102 from being damaged due to excessive deformation.

[0033] That is, compared with the battery cover in the related art, when subjected to the same impact force and the disturbance of the back cover 102 is the same as that of the battery cover in the related art, due to the supporting effect of a part of the mounting portion 106, the span of the deformed part of the back cover 102 is reduced. Therefore, when the thickness of the back cover 102 is reduced, it is also possible to ensure that the back cover 102 is within the range of elastic deformation and will not be damaged due to excessive deformation. This is beneficial to the miniaturized design of the electronic device 200 while ensuring the safety of the battery 202.

[0034] It should be noted that one side of the battery in the related art is fixed to the battery compartment structure of the middle frame by double-sided tape, and the other side is directly in contact with the battery cover. The battery compartment structure of the middle frame is made of metal and has high strength, but it cannot protect the battery and only has the function of fixing the battery. The protection of the battery is only achieved by the battery cover. In the embodiment of the present application, the mounting portion 106 is also the battery compartment in the related art. At least a part of the mounting portion 106 is set between the battery 202 and the back cover 102. That is, compared with the related art, the structure of the battery compartment is retained, and the setting position of the battery compartment is changed, so that the battery compartment can fix the battery 202 while protecting the battery 202 through at least a part of the structure of the battery compartment in combination with the back cover 102, so that the thickness of the back cover 102 can be reduced, thereby ensuring the safety of the battery 202 and facilitating the miniaturization design of the electronic device 200.

[0035] The housing assembly 100 of the embodiment of the present application includes a back cover 102 and a frame assembly 104. The edge of the frame assembly 104 is connected to the edge of the back cover 102, so that the back cover 102 and the frame assembly 104 enclose a receiving space. Further, the housing assembly 100 also includes a mounting portion 106. The mounting portion 106 is connected to the frame assembly 104, and the mounting portion 106 is located in the receiving space enclosed by the back cover 102 and the frame assembly 104. The mounting portion 106 is used to install the battery 202 of the electronic device. Wherein, when the battery 202 of the electronic device 200 is installed on the mounting portion 106, at least a portion of the mounting portion 106 is located between the battery 202 and the back cover 102. Therefore, when the back cover 102 is impacted by an external object, at least a portion of the mounting portion 106 can be used to support the deformation of the back cover 102. In this way, compared with the battery cover in the related art, when the same impact force is applied and the disturbance of the back cover 102 is the same as that of the battery cover in the related art, the span of the deformed portion of the back cover 102 is reduced due to the supporting effect of a portion of the mounting portion 106. Therefore, while reducing the thickness of the back cover 102, it is also possible to ensure that the back cover 102 is within the range of elastic deformation and will not be damaged due to excessive deformation. This is beneficial to the miniaturization design of the electronic device 200 while ensuring the safety of the battery 202.

[0036] In some embodiments of the present application, the mounting portion 106 includes a mounting bracket 138 connected to the frame assembly 104 , the mounting bracket 138 includes a support rod 114 , and when the battery 202 is installed on the mounting bracket 138 , the support rod 114 is located between the battery 202 and the back cover 102 .

[0037] In the embodiments of the present application, Figure 6 As shown, the mounting portion 106 may include a mounting bracket 138, through which the battery 202 may be fixed to achieve installation of the battery 202. Specifically, the mounting bracket 138 may be connected to the frame assembly 104, so as to achieve fixation of the mounting bracket 138.

[0038] Further, the mounting bracket includes a support rod, and when the battery 202 is mounted on the mounting bracket 138, the support rod 114 is located between the battery 202 and the back cover 102. That is, when the battery 202 is mounted on the mounting bracket 138, the deformation of the back cover 102 can be supported by the support rod 114 during the process of the back cover 102 being impacted by an external object. In this way, when the back cover 102 is deformed, the span of both ends of the deformed part of the back cover 102 can be reduced by the support of the support rod 114, and then when the disturbance of the back cover 102 is the same as the disturbance of the battery cover in the related art, the deformation amount of the back cover 102 when it is impacted by an external object can be effectively reduced. In this way, when the thickness of the back cover 102 is reduced, it can also be ensured that the deformation of the back cover 102 will not be damaged due to excessive deformation, which is conducive to the miniaturization design of the electronic device 200 on the basis of ensuring the safety of the battery 202.

[0039] For example, Figure 3 Shows Figure 2 Sectional view in the AA direction; Figure 4 Shows Figure 3 A partial enlarged view of point B in the middle; Figure 6 Shows Figure 1 The structural diagram of the middle frame assembly and the mounting part; Figure 3 , Figure 4 and Figure 6 As shown, along the first direction, the frame assembly 104 includes a first frame 108 and a second frame 110, wherein the first direction is the width direction of the housing assembly 100, and the mounting portion 106 includes: two connecting rods 112, both ends of the connecting rod 112 are respectively connected to the first frame 108 and the second frame 110, and the two connecting rods 112 are arranged along the second direction, wherein the second direction is perpendicular to the first direction; wherein both ends of the support rod 114 are respectively connected to the two connecting rods 112;

[0040] Specifically, along the first direction, the frame assembly 104 includes a first frame 108 and a second frame 110 . Specifically, the first direction may be the width direction of the shell assembly 100 , that is, the first frame 108 and the second frame 110 are two frames in the width direction of the shell assembly 100 .

[0041] Furthermore, the mounting bracket 138 also includes two connecting rods 112, wherein two ends of the two connecting rods 112 are respectively connected to the first frame 108 and the second frame 110, and the two connecting rods 112 are arranged along the second direction. Specifically, the second direction is perpendicular to the first direction, that is, the first direction is the width direction of the shell assembly 100, and the second direction is the length direction of the shell assembly 100, and the two connecting rods 112 are arranged along the length direction of the electronic device 200.

[0042] Furthermore, both ends of the support rod 114 are connected to the two connecting rods 112, that is, the battery 202 of the electronic device 200 is fixed by the two connecting rods 112 and the support rod 114, thereby ensuring the stability of the installation of the battery 202. Meanwhile, when the battery 202 is installed on the mounting bracket 138, the support rod 114 is located between the battery 202 and the rear cover 102. That is, when the battery 202 is installed on the mounting bracket 138, the deformation of the back cover 102 can be supported by the support rod 114 when the back cover 102 is impacted by an external object. In this way, when the back cover 102 is deformed, the span of the two ends of the deformed part of the back cover 102 can be reduced through the support of the support rod 114. Furthermore, when the disturbance of the back cover 102 is the same as the disturbance of the battery cover in the related art, the deformation of the back cover 102 when impacted by an external object can be effectively reduced. In this way, when the thickness of the back cover 102 is reduced, it can also be ensured that the deformation of the back cover 102 will not be damaged due to excessive deformation. On the basis of ensuring the safety of the battery 202, it is beneficial to the miniaturized design of the electronic device 200.

[0043] For example, Figure 5 FIG. 2 shows a schematic diagram of force analysis of the rear cover in an embodiment of the present application; Figure 5 and Figure 6 As shown, along the first direction, that is, the width direction of the electronic device 200, the two ends of the support rod 114 can be connected to the middle positions of the two connecting rods 112 respectively, so that when the back cover 102 is impacted by an external object, the span of the deformed portion of the back cover 102 is half of the width (L) of the back cover 102. Compared with the battery cover in the related art, when subjected to the same impact force (F), the thickness of the back cover 102 can be reduced to half of the thickness of the battery cover in the related art. Similarly, it can be ensured that the back cover 102 is within the range of elastic deformation, and the battery cover is not damaged due to excessive deformation. On the basis of ensuring the safety of the battery 202, the thickness of the back cover 102 is reduced, which is beneficial to the miniaturization design of the electronic device 200.

[0044] In addition, the support rod 114 can be made of the same material as the frame assembly 104, such as aluminum alloy. The support rod 114 can also be made of titanium alloy or special fiber composite material to improve the support strength of the support rod 114 and further improve the impact resistance of the back cover 102. The support rod 114 and the frame assembly can be connected by bolts or other connection methods.

[0045] In some embodiments of the present application, a device compartment 116 is enclosed between the mounting bracket 138 and the frame assembly 104. The device compartment 116 is located on one side of the mounting bracket 138, and the device compartment 116 is used to place electronic devices 204 of the electronic device 200; the shell assembly 100 also includes a heat dissipation assembly 118, both ends of the heat dissipation assembly 118 are connected to the frame assembly 104, and the heat dissipation assembly 118 and the device compartment 116 are arranged opposite to each other, and are used to transfer the heat generated by the electronic device 204 to the frame assembly.

[0046] In the embodiments of the present application, Figure 1 As shown, a device compartment 116 is enclosed between the mounting bracket 138 and the frame assembly 104. Specifically, the edge of the frame assembly 104 is connected to the edge of the back cover 102, so that the back cover 102 and the frame assembly 104 enclose a receiving space, wherein the mounting bracket 138 is located in the receiving space. At the same time, along the second direction, that is, the length direction of the electronic device 200, a device compartment 116 is enclosed between the mounting bracket 138 and the frame assembly 104. The device compartment 116 is located on one side of the mounting bracket 138. The electronic device 204 of the electronic device 200 can be placed through the device compartment 116.

[0047] Furthermore, the housing assembly 100 further includes a heat dissipation assembly 118, which is disposed opposite to the device compartment 116, so as to dissipate heat for the electronic device 200 in the device compartment 116. It is understandable that the electronic device 204 in the device compartment 116 may include chip devices such as a processor and an arithmetic unit. During the operation of the electronic device 200, the electronic device 204 will generate heat, and the heat dissipation assembly 118 dissipates heat for the electronic device 204, so as to avoid damage to the electronic device 204 caused by excessive temperature of the electronic device 204.

[0048] Specifically, the two ends of the heat dissipation component 118 are respectively connected to the first frame 108 and the second frame 110, so that after the heat dissipation component 118 absorbs the heat generated by the electronic device 204, the heat can be transferred to the first frame 108 and the second frame 110, thereby achieving heat dissipation through heat exchange between the first frame 108 and the second frame 110 and the air around the electronic device 200, and finally achieving heat dissipation of the electronic device 204.

[0049] In some embodiments of the present application, the shell assembly 100 also includes a partition 122, the edges of the partition 122 are respectively connected to the frame assembly 104 and the mounting bracket 138, and the partition 122 is located in the device compartment; the heat dissipation assembly 118 includes: a first heat conductive plate 124, the first heat conductive plate 124 is attached to the side of the partition 122 away from the electronic device 204, and both ends of the heat conductive plate are connected to the frame assembly 104.

[0050] In the embodiments of the present application, Figure 6 Shows Figure 1 A schematic diagram of the structure of the middle frame assembly and the mounting portion; Figure 7 Shows Figure 1 The structural diagram of the heat dissipation component; Figure 6 and Figure 7 As shown, the housing assembly 100 may further include a partition 122 , through which the electronic device 204 in the device compartment 116 may be isolated from the heat dissipation assembly 118 .

[0051] Specifically, the frame assembly 104 further includes a third frame 120, and the two ends of the third frame 120 are respectively connected to one end of the first frame 108 and one end of the second frame 110, that is, the third frame 120 is located on one side of the second direction, that is, the third frame 120 is a frame on one side of the length direction of the electronic device 200. Further, the edges of the partition 122 are respectively connected to the first frame 108, the second frame 110, the third frame 120 and a connecting rod 112 of the mounting portion 106, so that the partition 122, the first frame 108, the second frame 110, the third frame 120 and a connecting rod 112 of the mounting portion 106 enclose the device compartment 116. At the same time, through the partition 122, the electronic device 204 in the device compartment 116 can be isolated from the heat dissipation assembly 118.

[0052] Further, the heat dissipation assembly 118 may include a first heat conducting plate 124, and the first heat conducting plate 124 is attached to the side of the partition 122 away from the electronic device 204, that is, the electronic device 204 is isolated from the first heat conducting plate 124 by the partition 122, thereby preventing the first heat conducting plate 124 from affecting the operation of the electronic device 204. It can be understood that, in order to ensure the heat dissipation effect of the heat dissipation assembly 118, the first heat conducting plate 124 is usually made of a metal material with high thermal conductivity, such as aluminum alloy, copper and other metals, and because metal materials have conductive properties, the electronic device 204 is isolated from the first heat conducting plate 124 by the partition 122, thereby preventing the first heat conducting plate 124 from conducting electricity and generating unnecessary electrical signals, thereby affecting the normal operation of the electronic device 204.

[0053] By setting up the first heat conducting plate 124, it is possible to absorb the heat generated by the electronic device 204. At the same time, the first heat conducting plate 124 is connected to the frame assembly 104, that is, the two ends of the first heat conducting plate 124 are respectively connected to the first frame 108 and the second frame 110, so that after the first heat conducting plate 124 absorbs the heat generated by the electronic device 204, the heat can be transferred to the first frame 108 and the second frame 110, so that heat dissipation is achieved through heat exchange between the first frame 108 and the second frame 110 and the air around the electronic device 200, and finally the heat dissipation of the electronic device 204 is achieved.

[0054] In some embodiments of the present application, a placement groove 126 is formed on a side of the partition 122 facing away from the electronic device 204 , and the first heat conducting plate 124 is disposed in the placement groove 126 .

[0055] In the embodiments of the present application, Figure 6 As shown, a placement groove 126 is provided on the side of the partition 122 facing away from the electronic device 204, that is, a placement groove 126 is provided on the side of the partition 122 that is in contact with the first heat conducting plate 124. The placement groove 126 can be used to place the first heat conducting plate 124. Specifically, the first heat conducting plate 124 can be in contact with the bottom wall of the placement groove 126.

[0056] By providing the placement groove 126 , the thickness of the partition 122 can be utilized to provide a receiving space for the first heat conducting plate 124 , thereby being more conducive to the miniaturized design of the electronic device 200 .

[0057] In some embodiments of the present application, a first hollow portion 128 is enclosed between the support rod 114 and one side of the frame assembly 104, and / or a second hollow portion 130 is enclosed between the support rod 114 and the other side of the frame assembly 104, and the heat dissipation assembly 118 also includes: a second heat conducting plate 132, one end of the second heat conducting plate 132 is connected to the first heat conducting plate 124; wherein the second heat conducting plate 132 passes through the first hollow portion 128 to fit with the back cover 102, and / or the second heat conducting plate 132 passes through the second hollow portion 130 to fit with the back cover 102.

[0058] In the embodiments of the present application, Figure 6As shown, the two ends of the support rod 114 of the mounting portion 106 are respectively connected to the two connecting rods 112 of the mounting portion 106, and the two ends of the two support rods 114 are respectively connected to the first frame 108 and the second frame 110. In this way, according to the width of the support rod 114 along the first direction and the setting position, it is possible to enclose a first hollow portion 128 or a second hollow portion 130 between the support rod 114 and the two sides of the frame assembly 104, that is, the first hollow portion 128 is enclosed between the first frame 108, or the second hollow portion 130 is enclosed between the support rod 114 and the second frame 110, or the first hollow portion 128 can be enclosed between the support rod 114 and the first frame 108, and the second hollow portion 130 can be enclosed between the support rod 114 and the second frame 110 at the same time.

[0059] Furthermore, the heat dissipation assembly 118 further includes a second heat conducting plate 132, one end of which is connected to the first heat conducting plate 124, and the second heat conducting plate 132 passes through the first hollow portion 128 and / or the second hollow portion 130 and fits with the back cover 102. It can be understood that the first heat conducting plate 124 is fitted to the side of the partition 122 away from the electronic device 204, and the electronic device 204 is arranged in the device compartment 116. Therefore, along the thickness direction of the electronic device 200, the first heat conducting plate 124 and the back cover 102 are not in the same plane, and the second heat conducting plate 132 can be bent along the thickness direction of the electronic device 200, so that the second heat conducting plate 132 can extend to the first hollow portion 128 and / or the second hollow portion 130 and fit with the back cover 102.

[0060] Figure 8 The second structural schematic diagram of the housing assembly of the embodiment of the present application is shown; Figure 8 As shown, by providing a second heat conducting plate 132 and connecting one end of the second heat conducting plate 132 to the first heat conducting plate 124, the first heat conducting plate 124 can transfer the heat emitted by the electronic device 204 absorbed by the first heat conducting plate 124 to the second heat conducting plate 132. At the same time, the second heat conducting plate 132 is attached to the back cover 102, so that the heat transferred to the second heat conducting plate 132 can be transferred to the back cover 102, and then heat exchange is performed with the air around the electronic device 200 through the back cover 102 to achieve the heat dissipation function.

[0061] That is, Fig. 9 FIG. 1 is a flow chart showing the heat transfer process of the housing assembly of the embodiment of the present application; Fig. 9As shown, the heat generated by the electronic device 204, on the one hand, is absorbed by the first heat conducting plate 124, and then heat is exchanged with the air around the electronic device 200 through the first frame 108 and the second frame 110, that is, heat is exchanged with the air through the frame assembly 104 to achieve heat dissipation. On the other hand, the heat is transferred to the back cover 102 of the housing assembly 100 through the first heat conducting plate 124 and the second heat conducting plate 132, and then the back cover 102 exchanges heat with the air around the electronic device 200 to achieve heat dissipation of the heat generated by the electronic device 204. That is, the heat generated by the electronic device 204 can be dissipated not only through the first frame 108 and the second frame 110, but also through the back cover 102, so that the heat dissipation effect of the housing assembly 100 on the electronic device 204 can be further improved.

[0062] In some embodiments of the present application, thermal grease is disposed between the first heat conducting plate 124 and the frame assembly 104 , and between the second heat conducting plate 132 and the back cover 102 .

[0063] In the embodiment of the present application, thermal conductive silicone grease may be provided between the first heat conductive plate 124 and the frame assembly 104, so as to improve the heat conduction efficiency between the first heat conductive plate 124 and the frame assembly 104, thereby improving the heat dissipation effect of the first heat conductive plate 124. That is, thermal conductive silicone may be provided between the first heat conductive plate 124 and the first frame 108, and between the first heat conductive plate 124 and the second frame 110.

[0064] Accordingly, by disposing thermally conductive silicone between the second heat conducting plate 132 and the back cover 102 , the heat conduction efficiency between the second heat conducting plate 132 and the back cover 102 can be improved, thereby improving the heat dissipation effect of the second heat conducting plate 132 .

[0065] In some embodiments of the present application, the back cover 102 includes a first cover body 134 and a second cover body 136 , the first cover body 134 is connected to the second cover body 136 , and the second heat conductive plate 132 is attached to the first cover body 134 ; wherein the thermal conductivity of the first cover body 134 is greater than the thermal conductivity of the second cover body 136 .

[0066] In the embodiments of the present application, Fig.10 Shows Figure 1 The structural diagram of the middle and rear cover; Fig.10As shown, the back cover 102 includes a first cover body 134 and a second cover body 136, that is, the first cover body 134 and the second cover body 136 are connected to form the back cover 102. Further, the second heat conducting plate 132 is attached to the first cover body 134, and the thermal conductivity of the first cover body 134 is greater than the thermal conductivity of the second cover body 136. That is, the thermal conductivity of the material of the portion where the back cover 102 and the second heat conducting plate 132 are attached is set to be greater than the thermal conductivity of the material of the other portions of the back cover 102, so that the heat dissipation effect of the back cover 102 can be further improved.

[0067] Specifically, the first cover body 134 and the second cover body 136 of the back cover 102 are made of different materials respectively, wherein the material of the first cover body 134 can be a material with high thermal conductivity, such as ceramic, high thermal conductivity metal, etc., so that when the second heat conduction plate 132 transfers the heat generated by the electronic device 204 to the first cover body 134, the first cover body 134 can timely exchange heat with the air around the back cover 102 through the material with high thermal conductivity, thereby improving the heat dissipation effect of the back cover 102.

[0068] On the contrary, the portion of the rear cover 102 that is not in contact with the second heat conducting plate 132 , that is, the second cover body 136 , can be made of a material with relatively low thermal conductivity.

[0069] In some embodiments of the present application, along the length direction of the housing assembly 100 , both sides of the first cover body 134 include a second cover body 136 .

[0070] In the embodiments of the present application, Fig.10 As shown, along the length direction of the electronic device 200 , both sides of the first cover body 134 include a second cover body 136 , that is, the first cover body 134 is located between the two second cover bodies 136 .

[0071] At the same time, since the thermal conductivity of the first cover body 134 is greater than the thermal conductivity of the second cover body 136, during the use of the electronic device 200, the temperature of the first cover body 134 will be higher than the temperature of the second cover body 136 on both sides. In this way, when the two ends of the electronic device 200 are held with both hands, the hands will not feel a higher temperature, thereby ensuring the user's usage experience. At the same time, the heat dissipation effect of the electronic device 200 is ensured by the first cover plate.

[0072] The present application embodiment further provides an electronic device 200, Fig.11 The structure block diagram of the electronic device according to the embodiment of the present application is shown as follows: Fig.11 As shown, the electronic device 200 includes a housing assembly 100 as in any one of the above embodiments; a battery 202 , and the battery 202 is installed in the installation portion 106 .

[0073] The electronic device 200 provided in this embodiment includes a battery 202 and the housing assembly 100 of any one of the above embodiments, wherein the battery 202 is installed in the installation portion 106 of the housing assembly 100 .

[0074] Furthermore, the electronic device 200 provided in this embodiment has the housing assembly 100 as in any of the above embodiments, and thus has the beneficial effects of any of the above embodiments, which are not described in detail here.

[0075] Specifically, the electronic device 200 may include a mobile phone, a tablet computer, a laptop computer, etc.

[0076] In some embodiments of the present application, Fig.11 As shown, the electronic device 200 further includes: a screen 206 , an edge of the screen 206 is connected to an edge of the frame assembly 104 , and the screen 206 is located on a side of the frame assembly 104 away from the back cover 102 .

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A housing assembly for an electronic device, characterized in that: The housing assembly comprises: Back cover; A frame assembly, the edge of which is connected to the edge of the back cover; An installation portion, connected to the frame assembly, and used to install a battery of the electronic device; Wherein, when the battery is installed on the installation portion, at least a portion of the installation portion is located between the battery and the back cover.

2. The housing assembly according to claim 1, characterized in that: The mounting portion comprises: The mounting bracket is connected to the frame assembly, and the mounting bracket includes a support rod. When the battery is mounted on the mounting bracket, the support rod is located between the battery and the back cover.

3. The housing assembly according to claim 2, characterized in that: A device compartment is enclosed between the mounting bracket and the frame assembly, the device compartment is located on one side of the mounting bracket, and the device compartment is used to place electronic devices of the electronic device; The shell assembly also includes a heat dissipation assembly, both ends of which are connected to the frame assembly. The heat dissipation assembly is arranged opposite to the device compartment and is used to transfer the heat generated by the electronic device to the frame assembly.

4. The housing assembly according to claim 3, characterized in that: Also includes: A partition, the edges of which are respectively connected to the frame assembly and the mounting bracket, and the partition is located in the device compartment; The heat dissipation component comprises: A first heat conducting plate is attached to a side of the partition away from the electronic device, and two ends of the first heat conducting plate are connected to the frame assembly.

5. The housing assembly according to claim 4, characterized in that: A placement groove is provided on a side of the partition away from the electronic device, and the first heat conducting plate is arranged in the placement groove.

6. The housing assembly according to claim 4, characterized in that: A first hollow portion is enclosed between the support rod and one side of the frame assembly, and / or a second hollow portion is enclosed between the support rod and the other side of the frame assembly, and the heat dissipation assembly further includes: A second heat conducting plate, one end of the second heat conducting plate being connected to the first heat conducting plate; The second heat conducting plate passes through the first hollow portion and is fitted with the back cover, and / or the second heat conducting plate passes through the second hollow portion and is fitted with the back cover.

7. The housing assembly according to claim 6, characterized in that: Thermal grease is provided between the first heat conducting plate and the frame assembly, and between the second heat conducting plate and the back cover.

8. The housing assembly according to claim 6, characterized in that: The back cover comprises a first cover body and a second cover body, the first cover body is connected to the second cover body, and the second heat conducting plate is attached to the first cover body; Wherein, the thermal conductivity of the first cover body is greater than the thermal conductivity of the second cover body.

9. The housing assembly according to claim 8, characterized in that: Along the length direction of the housing assembly, both sides of the first cover body include the second cover body.

10. An electronic device, characterized in that: include: The housing assembly according to any one of claims 1 to 9; A battery is mounted on the mounting portion.

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