Frequency converter system

Abstract

The invention relates to a frequency converter system which comprises at least two heating pieces and at least two heat dissipation plates which are correspondingly attached to the at least two heating pieces one by one. A heat dissipation flow channel is arranged in the heat dissipation plate, and the heat dissipation flow channel is configured to convey a refrigerant; and the centralized heat dissipation assembly is connected with the at least two heat dissipation plates, and the centralized heat dissipation assembly is configured to control the amount of refrigerants conveyed to the at least two heat dissipation plates according to the heat productivity of the at least two heating pieces. The heat dissipation plate adopts a split type layout mode, adaptive heat dissipation ways can be provided for different heating pieces, and the adaptability and efficiency of the heat dissipation device are greatly improved; the radiating plate is attached to the heating element, so that the occupied space is small, and the volume of the frequency converter is not excessively enlarged; a heat dissipation runner is arranged in the heat dissipation plate, so that the cooling uniformity of the heating element can be improved; the centralized heat dissipation assembly can control the amount of the refrigerant conveyed to the corresponding heat dissipation plate according to the heating value of each heating piece, and the cooling uniformity, the cooling efficiency and the cooling accuracy are improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of frequency converters, and in particular to a frequency converter system. Background Art

[0002] With the rapid development of the renewable energy industry, inverters, as key equipment connecting energy production and consumption, play a vital role in energy storage and conversion. In some related technologies, the heat dissipation device of the inverter has problems such as large size, complex structure, and poor heat dissipation effect, resulting in the entire inverter system occupying a large space and low heat dissipation efficiency. Summary of the invention

[0003] Some embodiments of the present disclosure provide an inverter system for alleviating the problems of large occupied space and low heat dissipation efficiency.

[0004] In one aspect of the present disclosure, there is provided a frequency converter system, comprising:

[0005] At least two heating elements;

[0006] At least two heat dissipation plates are respectively arranged corresponding to the at least two heat generating elements; a heat dissipation channel is provided in the heat dissipation plate, and the heat dissipation channel is configured to transport a refrigerant; and

[0007] The centralized heat dissipation component is connected to the at least two heat dissipation plates, and the centralized heat dissipation component is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates according to the heat generated by the at least two heat generating elements.

[0008] In some embodiments, the centralized heat dissipation assembly includes a centralized heat dissipation element, a collecting channel is provided in the centralized heat dissipation element, and the collecting channel is configured to collect the refrigerant in the heat dissipation channel and transport the refrigerant to the heat dissipation channel.

[0009] In some embodiments, the centralized heat dissipation assembly includes a main circuit and at least two branches, the main circuit is connected in parallel to the at least two branches, and each of the at least two branches is connected to at least one heat dissipation plate of the at least two heat dissipation plates.

[0010] In some embodiments, the centralized heat dissipation assembly further includes a liquid separation pump, and the liquid separation pump is disposed at the connection between at least one of the at least two branches and the main line.

[0011] In some embodiments, the centralized heat dissipation component also includes a radiator and a fan. The radiator is arranged in close contact with the centralized heat dissipation component. The radiator is provided with fins. The fan is arranged at the air inlet of the radiator. The air outlet direction of the fan is consistent with the direction from the air inlet to the air outlet of the radiator.

[0012] In some embodiments, the at least two heat generating elements include a first heat generating element and a second heat generating element; the centralized heat dissipation assembly includes a centralized heat dissipation element, and the second heat generating element, the first heat generating element and the centralized heat dissipation element are spaced apart along a first direction.

[0013] In some embodiments, the number of the first heating elements is at least two, at least two first heating elements are spaced apart along the second direction, the at least two heat dissipation plates include a first heat dissipation plate, the first heat dissipation plate is arranged in contact with the at least two first heating elements, and the first direction intersects with the second direction.

[0014] In some embodiments, the number of the second heating elements is at least two, at least two second heating elements are spaced apart along the second direction, the at least two heat dissipation plates include at least two second heat dissipation plates, each second heat dissipation plate is arranged in contact with a second heating element, and the first direction intersects with the second direction.

[0015] In some embodiments, the centralized heat dissipation assembly further includes a radiator, the radiator is arranged in close contact with the centralized heat dissipation element, and the radiator and the centralized heat dissipation element are arranged along a third direction, and the first direction intersects with the third direction.

[0016] In some embodiments, the centralized heat dissipation component also includes a fan, which is arranged at the air inlet of the radiator. The air outlet direction of the fan is consistent with the direction from the air inlet to the air outlet of the radiator, and the direction from the air inlet to the air outlet is parallel to the first direction.

[0017] In some embodiments, the at least two heat generating components include a power semiconductor device and a reactor.

[0018] In some embodiments, the number of the power semiconductor devices is three, and the at least two heat dissipation plates include a first heat dissipation plate, and the first heat dissipation plate is arranged to fit the three power semiconductor devices.

[0019] In some embodiments, the number of the reactors is at least two, the at least two heat sinks include at least two second heat sinks, and each reactor is provided with a corresponding second heat sink.

[0020] Based on the above technical solution, the present disclosure has at least the following beneficial effects:

[0021] In some embodiments, at least two heat sinks are respectively arranged to correspond to at least two heat generating components, and the heat sinks are arranged in a split manner, which can provide suitable heat dissipation paths for different heat generating components, greatly improving the adaptability and efficiency of the heat dissipation device; the heat sinks are arranged to fit the heat generating components, occupying a small space and not expanding the volume of the inverter too much; a heat dissipation channel is provided in the heat sink, and a refrigerant is transported in the heat dissipation channel. The refrigerant flows in the heat sink and exchanges heat with the heat generating components, thereby improving the cooling uniformity of the heat generating components; the centralized heat dissipation assembly can control the amount of refrigerant transported to the corresponding heat sink according to the heat generation of each heat generating component, ensuring that each heat generating component can obtain sufficient cooling, thereby improving the cooling uniformity, cooling efficiency and cooling accuracy, and reducing the overall energy consumption of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0023] Figure 1 A schematic diagram of a three-dimensional structure of a frequency converter system provided according to some embodiments of the present disclosure from a first perspective;

[0024] Figure 2 A schematic diagram of a three-dimensional structure of a frequency converter system provided according to some embodiments of the present disclosure from a second perspective;

[0025] Figure 3 A schematic diagram of the decomposed structure of a frequency converter system provided according to some embodiments of the present disclosure;

[0026] Figure 4 It is a schematic plan view of a frequency converter system provided according to some embodiments of the present disclosure.

[0027] The reference numerals in the accompanying drawings are described as follows:

[0028] 1-heating element; 11-first heating element; 111-power semiconductor device; 12-second heating element; 121-reactor; 13-capacitor;

[0029] 2- heat sink; 21- first heat sink; 22- second heat sink;

[0030] 3-centralized heat dissipation assembly; 31-centralized heat dissipation element; 32-main line; 33-branch line; 34-liquid separation pump; 35-radiator; 351-fin; 36-fan; 37-driving pump;

[0031] 4- Temperature detection element;

[0032] 5- Shell.

[0033] It should be understood that the size of each part shown in the accompanying drawings is not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0035] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0037] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0039] Among some related technologies, air cooling is widely used due to its simple structure and low cost, but its heat dissipation efficiency is limited by the heat capacity and heat transfer capacity of air, and it is difficult to meet the heat dissipation requirements of high-power density equipment. Direct liquid cooling achieves efficient heat dissipation through the high thermal conductivity of the liquid medium, but traditional liquid cooling systems are often bulky and not conducive to the miniaturization of equipment. Although phase change cooling has significant heat dissipation effects, it is costly and the system is complex, making it difficult to popularize and apply.

[0040] For the heat dissipation problem of miniaturized three-level inverters, it is difficult to take into account the heat dissipation efficiency, system integration and economic cost at the same time. Especially in miniaturized equipment, space limitations pose higher challenges to the design of the heat dissipation system. In addition, the differences in thermal characteristics of different heat-generating components in the inverter also require the heat dissipation system to provide customized heat dissipation solutions. For example, IGBT (Insulated Gate Bipolar Transistor) devices usually operate in high current and high voltage environments, and their heat generation is large and concentrated, requiring efficient local heat dissipation measures; while the heat distribution and generation mechanism of reactors and capacitors are different from IGBTs, which requires the heat dissipation system to be optimized for different heat characteristics.

[0041] Based on this, the embodiments of the present disclosure provide a frequency converter system, which can not only meet the miniaturization design requirements of the frequency converter, but also effectively manage the heat dissipation requirements of different heat generating components in a targeted manner.

[0042] refer to Figure 1 and Figure 2 In some embodiments, a frequency converter system includes a frequency converter and a heat sink.

[0043] The frequency converter includes at least two heating elements 1. The heat dissipation device includes at least two heat dissipation plates 2 and a centralized heat dissipation component 3.

[0044] At least two heat sinks 2 are respectively arranged corresponding to at least two heating elements 1 one by one; a heat sink channel is provided in the heat sink 2, and the heat sink channel is configured to transport a refrigerant.

[0045] The centralized heat dissipation component 3 is connected to at least two heat dissipation plates 2 , and the centralized heat dissipation component 3 is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates 2 according to the heat generation of the at least two heating elements 1 .

[0046] In the above embodiment, at least two heat sinks 2 are respectively arranged corresponding to at least two heating elements 1, and the heat sink 2 adopts a split layout, which can provide a suitable heat dissipation path for different heating elements 1, greatly improving the adaptability and efficiency of the heat dissipation device. The heat sink 2 is arranged in a manner that fits the heating element 1, and occupies a small space. Compared with the method of cooling the heating element 1 by setting an air duct in the related art, it is not necessary to reserve a space for setting the air duct, and the volume of the inverter will not be expanded too much. A heat dissipation flow channel is provided in the heat sink 2, and a refrigerant is transported in the heat dissipation flow channel. The refrigerant flows in the heat sink 2, exchanges heat with the heating element 1, and absorbs the heat generated by the heating element 1, which can improve the cooling uniformity of the heating element 1. The centralized heat dissipation component 3 can control the amount of refrigerant transported to the corresponding heat sink 2 according to the heat generation of each heating element 1, and realize the purpose of dynamically adjusting the refrigerant flow according to the actual heat generation of each heating element 1, so that each heating element 1 can obtain sufficient cooling, which can prevent equipment damage caused by local overheating, and can prevent unnecessary energy waste, improve cooling uniformity, cooling efficiency and cooling accuracy, and reduce the overall energy consumption of the system.

[0047] The heat dissipation device provided in the embodiment of the present disclosure has a highly efficient heat dissipation capability, which can greatly improve the working environment of the main heat generating parts (electronic components) inside the inverter, effectively prolong the service life of the inverter, reduce the number of maintenance times, and improve the overall stability and reliability. The experimental data and simulation results show that the inverter system provided in the embodiment of the present disclosure can achieve precise control of the device temperature under various working conditions, and can still maintain excellent heat dissipation performance under high power density working conditions.

[0048] In some embodiments, the heat sink 2 is in the shape of a flat plate. The size of the heat sink 2 is set according to the size of the heating element 1. The heat sink 2 is arranged on a relatively flat surface of the heating element 1.

[0049] In some embodiments, the heat dissipation channel in the heat dissipation plate 2 may be a channel dug in the heat dissipation plate 2, into which a refrigerant is passed to form a heat dissipation channel. The heat dissipation channel in the heat dissipation plate 2 may also be a space reserved in the heat dissipation plate 2 for arranging a pipeline, the pipeline is arranged in the heat dissipation plate 2, and a refrigerant is passed into the pipeline to form a heat dissipation channel.

[0050] The heat sink 2 is generally arranged on a component with a large amount of heat generated in the frequency converter. The component with a large amount of heat generated in the frequency converter is the heat generating element 1.

[0051] In some embodiments, the heating element 1 includes electronic components in a frequency converter. In some specific embodiments, the heating element 1 includes a power semiconductor device 111, a reactor 121, a capacitor 13, and the like.

[0052] In some embodiments, at least two heat sinks 2 and a concentrated heat sink assembly 3 constitute a heat sink for the frequency converter. A liquid cooling circulation system is formed in the heat sink.

[0053] In some embodiments, the power semiconductor device 111 includes an IGBT.

[0054] For the inverter, its main internal power components include IGBT, reactors and capacitors, etc. These power components will generate a lot of heat energy when working. If this heat energy is not dissipated in time and effectively, it will cause the temperature of the components to rise, affecting the conversion efficiency, stability and service life of the inverter. Therefore, the heat dissipation device provided by the embodiment of the present disclosure can improve the heat dissipation effect and heat dissipation efficiency of the inverter without increasing the volume of the inverter too much, and the space occupied by the entire frequency conversion system is small.

[0055] In some embodiments, the inverter includes a two-level inverter and a three-level inverter. The three-level inverter generates an output waveform by using three different levels, thereby achieving a smoother output voltage and lower harmonic distortion. Compared with the two-level inverter, the three-level inverter has a higher voltage level and better performance.

[0056] In some embodiments, the centralized heat dissipation assembly 3 includes a centralized heat dissipation element 31 , in which a collecting channel is provided. The collecting channel is configured to collect the refrigerant in the heat dissipation channel and transport the refrigerant to the heat dissipation channel.

[0057] In the above embodiment, the collecting channel in the centralized heat sink 31 can collect the refrigerant in the heat sink of each heat sink 2, and can also transport the refrigerant to the heat sink of each heat sink 2. Therefore, the refrigerant can form a circulation flow, providing a circulating cooling flow path for each heat sink 1, and can continuously provide refrigerant to the heat sink 1 so that the refrigerant evenly covers each heat sink 1, ensuring that each heat sink 1 is always within a suitable temperature range, avoiding local overheating, and improving cooling efficiency and cooling uniformity.

[0058] In some embodiments, the collecting channel in the centralized heat sink 31 may be a channel dug in the centralized heat sink 31, into which refrigerant is passed to form a collecting channel. The collecting channel in the centralized heat sink 31 may also be a space reserved in the centralized heat sink 31 for arranging pipes, into which pipes are arranged in the centralized heat sink 31, and into which refrigerant is passed to form a collecting channel.

[0059] refer to Figures 1 to 4 In some embodiments, the centralized heat dissipation assembly 3 includes a main circuit 32 and at least two branches 33, the main circuit 32 is connected in parallel with the at least two branches 33, and each of the at least two branches 33 is connected to at least one heat dissipation plate 2 of the at least two heat dissipation plates 2.

[0060] In the above embodiment, the main circuit 32 of the centralized heat dissipation component 3 is connected in parallel with at least two branch circuits 33, so that the centralized heat dissipation component 3 can be connected in parallel with at least two heat dissipation plates 2, which can be beneficial for controlling the amount of refrigerant delivered to the corresponding heat dissipation plates 2 according to the heat generation of each heat generating component 1, thereby achieving the purpose of dynamically adjusting the amount of refrigerant delivered to each heat dissipation plate 2, so that each heat generating component 1 can obtain sufficient cooling, thereby improving cooling uniformity, cooling efficiency and cooling accuracy.

[0061] In some embodiments, the outlet of the collecting flow channel in the centralized heat sink 31 is connected to the main line 32, the main line 32 is connected to each branch line 33, each branch line 33 is respectively connected to the inlet of the heat dissipation flow channel in at least one heat sink 2, the outlet of the heat dissipation flow channel of each heat sink 2 is connected to another branch line, another main line is connected to another main line, and another main line is connected to the inlet of the collecting flow channel in the centralized heat sink 31, so that the refrigerant forms a circulation.

[0062] In one embodiment, the collecting flow channel in the centralized heat sink 31 and the heat dissipation flow channel of each heat sink 2 can be formed by pipes passing through the plate-like structure. The pipes in the centralized heat sink 31 can be connected to the main pipe, or formed integrally with the main pipe. The pipes in each heat sink 2 can be connected to the branch pipe, or formed integrally with the branch pipe.

[0063] In some embodiments, the concentrated heat dissipating member 31 is configured as a flat plate.

[0064] In some embodiments, the centralized heat dissipation assembly 3 further includes a liquid separation pump 34 , and a liquid separation pump 34 is disposed at the connection between at least one branch 33 of the at least two branches 33 and the main line 32 .

[0065] In some embodiments, the centralized heat dissipation element 31 includes a main line 32 and two or more branches 33. The number of liquid separation pumps 34 can be one less than the number of branches 33. The liquid separation pumps 34 are connected in series on the main line 32 in sequence. Each liquid separation pump 34 is respectively connected to a branch 33, and the liquid separation pump 34 located at the most downstream is connected to two branches 33.

[0066] For example: the concentrated heat dissipation element 31 includes a main line 32 and two branches 33, the number of the liquid separation pump 34 is one, and the liquid separation pump 34 includes three interfaces, the first interface is connected to the main line 32, the second interface is connected to one of the two branches 33, and the third interface is connected to the other of the two branches 33.

[0067] In the above embodiment, by setting a liquid separation pump 34 at the connection between the branch 33 and the main line 32, the amount of refrigerant entering each branch 33 can be adjusted by adjusting the opening of each interface of the liquid separation pump 34, thereby adjusting the amount of refrigerant entering the heat sink 2.

[0068] In some embodiments, the centralized heat dissipation component 3 also includes a radiator 35 and a fan 36. The radiator 35 is arranged in close contact with the centralized heat dissipation element 31. The radiator 35 is provided with fins 351. The fan 36 is arranged at the air inlet of the radiator 35. The air outlet direction of the fan 36 is consistent with the direction from the air inlet to the air outlet of the radiator 35.

[0069] In some related technologies, air cooling is widely used due to its simple structure and low cost. However, when the power density of power electronic equipment is high, air cooling is difficult to meet the demand due to its limited heat dissipation capacity. Although direct liquid cooling has high heat dissipation efficiency, it often has problems such as complex system, large volume, high cost and difficult maintenance.

[0070] Based on this, in the above embodiment, a circulating heat dissipation system is formed by setting up a centralized heat sink 31 to optimize the heat flow path, and combined with a fin-type heat sink 35 and a fan 36, the heat dissipation area is significantly increased with the assistance of the fin structure and the fan 36, thereby improving the heat dissipation efficiency.

[0071] In some embodiments, the inverter system further includes a controller and a temperature detection element 4, the temperature detection element 4 is provided on the heating element 1, and the temperature detection element 4 is electrically connected to the controller. An intelligent control strategy is preset in the controller, which monitors the temperature of the heating element 1 by receiving the information sent by the temperature detection element 4 in real time, and dynamically adjusts the working state of the liquid separation pump 34 and the fan 36 according to the temperature data, thereby achieving the purpose of accurately controlling the heat dissipation effect. This intelligent adjustment mechanism can not only facilitate the stable operation of the equipment within the optimal operating temperature range, but also achieve energy saving and consumption reduction in partial load or low power consumption scenarios.

[0072] In some embodiments, the controller includes a microprocessor, a driving circuit, and a preset software algorithm to achieve precise temperature control.

[0073] refer to Figure 4 In some embodiments, at least two heat generating elements 1 include a first heat generating element 11 and a second heat generating element 12; the centralized heat dissipation assembly 3 includes a centralized heat dissipation element 31, and the second heat generating element 12, the first heat generating element 11 and the centralized heat dissipation element 31 are spaced apart along the first direction X.

[0074] In the above embodiment, the second heating element 12 and the first heating element 11 are components in the inverter and can maintain their setting positions in the inverter unchanged. The second heating element 12, the first heating element 11 and the concentrated heat sink 31 are arranged at intervals along the first direction X. The concentrated heat sink 31 has a certain distance from the first heating element 11 in the first direction X. The concentrated heat sink 31 can be independent of the inverter and arranged outside the inverter, and will not occupy the space in the inverter. The volume of the inverter will not increase due to the arrangement of the concentrated heat sink 31, and the heat sink 2 can be arranged in contact with the second heating element 12 and the first heating element 11. The heat sink 2 is plate-shaped and will not increase the volume of the inverter too much. It is suitable for inverters with smaller and smaller volumes and will not increase the occupied space of the entire inverter system too much.

[0075] In some embodiments, the inverter system includes multiple inverters, which are connected in series or in parallel. Heat sinks 2 are provided on the heating elements 1 in the multiple inverters, and each heat sink 2 is connected to the same centralized heat sink 31 .

[0076] In the above embodiment, the centralized heat sink 31 is independently provided to each inverter, that is, the centralized liquid cooling part is independently separated, thereby further compressing the internal space of the inverter cabinet, realizing the string design of the inverter, and using a centralized liquid cooling system to supply heat to multiple inverters, thereby improving the overall space utilization of the inverter system.

[0077] In some embodiments, the number of first heating elements 11 is at least two, at least two first heating elements 11 are arranged at intervals along the second direction Y, at least two heat dissipation plates 2 include a first heat dissipation plate 21, the first heat dissipation plate 21 is arranged in contact with at least two first heating elements 11, and the first direction X intersects with the second direction Y.

[0078] In the above embodiment, for multiple first heating elements 11 with the same structural model and the same working conditions, since the heat generation is the same, the multiple first heating elements 11 can be arranged in contact with each other through the first heat sink 21 to better utilize the surface area of ​​the entire heat sink, provide a larger heat dissipation area, help to distribute heat more evenly, reduce local hot spots, simplify the structure, reduce the complexity of assembly and maintenance, and reduce costs.

[0079] In some embodiments, the number of second heating elements 12 is at least two, at least two second heating elements 12 are arranged at intervals along the second direction Y, at least two heat dissipation plates 2 include at least two second heat dissipation plates 22, each second heat dissipation plate 22 is arranged in contact with a second heating element 12, and the first direction X intersects with the second direction Y.

[0080] In the above embodiment, for multiple second heating elements 12 with different structural models and different working conditions, since the heat generation of each second heating element 12 is different, a second heat sink 22 can be respectively arranged to fit a second heating element 12. According to the different heat generation and heat dissipation requirements of each second heating element 12, a refrigerant is provided to each second heating element 12 in a more targeted manner, so that each second heating element 12 can be cooled most effectively, and each second heating element 12 can be independently temperature controlled to avoid local overheating, so that each second heating element 12 can be within the optimal operating temperature range.

[0081] In some embodiments, one of the branches 33 is connected in parallel to at least two second heat sinks 22 through a pipeline. A flow control valve may be provided on the pipeline connecting the branch 33 and each second heat sink 22.

[0082] In some embodiments, the first direction X is perpendicular to the second direction Y.

[0083] In some embodiments, the first heat dissipation plate 21 and the first heat generating element 11 are arranged along the third direction Z.

[0084] In some embodiments, the second heating element 12 and the second heat dissipation plate 22 are arranged along the third direction Z.

[0085] In some embodiments, the first direction X intersects the third direction Z. Optionally, the first direction X is perpendicular to the third direction Z, and the first direction X is perpendicular to the second direction Y, and the third direction Z is perpendicular to the second direction Y.

[0086] In some embodiments, the centralized heat dissipation assembly 3 further includes a radiator 35 , which is arranged in close contact with the centralized heat dissipation element 31 , and the radiator 35 and the heat dissipation plate 2 are arranged along a third direction Z, and the first direction X intersects with the third direction Z.

[0087] In the above embodiment, the second heating element 12, the first heating element 11 and the concentrated heat dissipation element 31 are arranged at intervals along the first direction X. In the case of multiple second heating elements 12 and multiple first heating elements 11, the multiple second heating elements 12 are arranged in sequence along the second direction Y, and the multiple first heating elements 11 are arranged in sequence along the second direction Y. In order to arrange the heat dissipation plate 2 more reasonably, the first heat dissipation plate 21 and the first heating element 11 are arranged along the third direction Z, and the second heat dissipation element 12 and the second heat dissipation plate 22 are arranged along the third direction Z; accordingly, the radiator 35 and the concentrated heat dissipation element 31 are arranged along the third direction Z, which can make the structure of the entire inverter system neatly arranged, compact, optimize space utilization, and reduce the occupied space of the inverter system.

[0088] In some embodiments, the centralized heat dissipation component 3 also includes a fan 36, which is arranged at the air inlet of the radiator 35. The air outlet direction of the fan 36 is consistent with the direction from the air inlet to the air outlet of the radiator 35, and the direction from the air inlet to the air outlet is parallel to the first direction X.

[0089] In the above embodiment, by providing airflow to the radiator 35 through the fan 36, the convective heat dissipation effect of the radiator 35 can be enhanced, the heat dissipation efficiency can be greatly improved, and the thermal resistance between the radiator 35 and the surrounding air can be reduced, so that the heat can be taken away more quickly. In addition, the fan 36 can provide uniform airflow to ensure that all parts of the radiator 35 can be effectively cooled to avoid local overheating. Furthermore, the wind speed of the fan 36 can be adjusted, and the heat dissipation effect can be adjusted according to actual needs. For example, under low load conditions, the wind speed can be reduced to reduce noise and energy consumption; under high load conditions, the wind speed can be increased to prevent local overheating of the system and achieve the best heat dissipation effect. Therefore, by combining the fan 36 and the radiator 35 to dissipate heat from the centralized heat dissipation element 31, the heat dissipation efficiency and heat dissipation effect can be improved, and the structure is compact, the space is optimized, and the volume is reduced.

[0090] In the above embodiment, the direction from the air inlet to the air outlet of the fan 36 is parallel to the first direction X, and the second heating element 12, the first heating element 11 and the concentrated heat dissipation element 31 are arranged at intervals along the first direction X. The air outlet of the fan 36 enters the radiator 35, and after dissipating the heat for the concentrated heat dissipation element 31, it can also flow from the air outlet to the inverter to dissipate the heat for the heating element 1, thereby making full use of energy and reducing energy consumption.

[0091] In some embodiments, the number of fans 36 is at least two, and at least two fans 36 are sequentially arranged at the air inlet of the radiator 35 along the second direction Y to improve the heat dissipation effect.

[0092] In some embodiments, the frequency converter further comprises a housing 5, and the heating element 1 is disposed in the housing 5. The heat sink 2 is disposed in the housing 5. The concentrated heat dissipation element 31, the radiator 35 and the fan 36 are disposed outside the housing 5.

[0093] Since the heat sink 2 is in the shape of a flat plate, the heat sink 2 is arranged in close contact with the heating element 1, and occupies a small space in the housing 5. Compared with the method of cooling the heating element 1 by setting an air duct in the related art, it is not necessary to reserve space for setting the air duct, and the volume of the housing 5 will not be excessively expanded. In addition, the concentrated heat sink 31, the heat sink 35 and the fan 36 are arranged outside the housing 5, and will not occupy the space in the housing 5, which is suitable for the miniaturization of the inverter. The concentrated heat sink 31, the heat sink 35 and the fan 36 are integrated, with a compact structure, which reduces the space required for the heat sink, and is very suitable for the heat dissipation needs of high-density electronic equipment such as miniaturized inverters.

[0094] In some embodiments, the at least two heat generating elements 1 include a power semiconductor device 111 and a reactor 121 .

[0095] In the above embodiment, the power semiconductor device 111 and the reactor 121 are components with relatively large heat generation in the inverter. The heat sink 2 is arranged in close contact with the power semiconductor device 111 and the reactor 121, which can effectively reduce the temperature of the power semiconductor device 111 and the reactor 121 and prevent equipment damage caused by local overheating of the inverter.

[0096] In some embodiments, the number of the power semiconductor devices 111 is three, and at least two heat dissipation plates 2 include a first heat dissipation plate 21 . The first heat dissipation plate 21 is disposed in contact with the three power semiconductor devices 111 .

[0097] In the above embodiment, the number of power semiconductor devices 111 is three, the inverter is a three-level inverter, the three power semiconductor devices 111 are of the same model, are started and shut down at the same time, and therefore have the same heat generation. The first heat sink 21 is arranged to fit the three power semiconductor devices 111, which can better utilize the surface area of ​​the entire first heat sink 21, provide a larger heat dissipation surface, help to distribute heat more evenly, reduce local hot spots, simplify the structure, reduce the complexity of assembly and maintenance, and reduce costs.

[0098] The embodiments of the present disclosure can provide an integrated, intelligent and energy-efficient liquid cooling device for a miniaturized three-level inverter, thereby significantly improving the performance and reliability of the device.

[0099] In some embodiments, the number of the power semiconductor devices 111 may be an integer multiple of three, for example, the number of the power semiconductor devices 111 is six, nine, or twelve.

[0100] In some embodiments, the power semiconductor device 111 includes an IGBT.

[0101] In some embodiments, the number of the reactors 121 is at least two, the at least two heat sinks 2 include at least two second heat sinks 22 , and each reactor 121 is correspondingly provided with a second heat sink 22 .

[0102] In the above embodiment, since the models of the reactors 121 may be different and the heat generation may be different, a second heat sink 22 is provided corresponding to each reactor 121. According to the heat generation and heat dissipation requirements of each reactor 121, a refrigerant can be provided to each reactor 121 in a more targeted manner, so that each reactor 121 can be cooled most effectively, and each reactor 121 can be independently temperature controlled to avoid local overheating, so that each reactor 121 is within the optimal operating temperature range.

[0103] In some embodiments, at least two heating elements 1 further include a capacitor 13 , and the capacitor 13 and the power semiconductor device 111 are respectively disposed on two sides of the first heat sink 21 .

[0104] In the above embodiment, the first heat sink 21 not only dissipates heat for the power semiconductor device 111, but also dissipates heat for the capacitor 13. Moreover, the branch 33 connected to the first heat sink 21 passes through the capacitor 13. The refrigerant in the branch 33 can also dissipate heat for the capacitor 13, thereby improving the heat dissipation effect of various components in the inverter.

[0105] In the above embodiment, the first heat sink 21 and the second heat sink 22 can meet the personalized heat dissipation requirements of the power semiconductor device 111 and the reactor 121, and the branches arranged around the power semiconductor device 111 and the reactor 121 can also cool other heat-generating components, thereby achieving more uniform and effective temperature control at the entire system level.

[0106] In some embodiments, the centralized heat dissipation component 3 also includes a driving pump 37, which is arranged on a pipeline connecting the centralized heat dissipation element 31 and each heat dissipation plate 2. The driving pump 37 is used to provide power, so that the refrigerant can flow from each heat dissipation plate 2 to the centralized heat dissipation element 31, and can flow the refrigerant to each heat dissipation plate 2 through the centralized heat dissipation element 31.

[0107] In the above embodiment, the driving pump 37 provides the power for the circulation flow of the refrigerant in the whole system, and the heat of the heating element 1 is concentrated in the concentrated heat dissipation element 31 for unified heat dissipation.

[0108] The corresponding heating elements 1 in the entire system are all equipped with temperature detection elements 4. The temperature of each heating element 1 is monitored in real time through the controller, and the opening of each interface of the liquid separation pump 34 is automatically adjusted according to the temperature of different heating elements 1 to achieve optimal heat dissipation of the heating element 1.

[0109] refer to Figures 1 to 4In some specific embodiments, the inverter system includes an inverter and a heat dissipation device. The inverter includes a housing 5, in which a plurality of power semiconductor devices 111, a plurality of reactors 121 and a plurality of capacitors 13 are arranged. The plurality of power semiconductor devices 111 are arranged in a row along the second direction Y, and the plurality of reactors 121 are arranged in a row along the second direction Y. The row formed by the plurality of reactors 121 and the row formed by the plurality of power semiconductor devices 111 are arranged at intervals along the first direction X. The heat dissipation device includes a concentrated heat dissipation member 31, a first heat dissipation plate 21, a second heat dissipation plate 22, a heat sink 35 and a fan 36. The first heat dissipation plate 21 is arranged in the housing 5, and is arranged in contact with the plurality of power semiconductor devices 111, and the first heat dissipation plate 21 and the power semiconductor devices 111 are arranged in a third direction Z. The second heat dissipation plate 22 is arranged in the housing 5. Each of the plurality of reactors 121 is arranged in contact with a second heat dissipation plate 22, and the reactor 121 and the second heat dissipation plate 22 are arranged in the third direction Z. The concentrated heat sink 31 is arranged outside the housing 5, and the row formed by the multiple power semiconductor devices 111 is arranged at intervals with the concentrated heat sink 31 along the first direction X. The outlet of the concentrated heat sink 31 is connected to the main line 32, the main line 32 extends into the housing 5, and is successively connected to two branches 33. The first branch 33 connected is connected to the inlet of the first heat sink 21, and a liquid separation pump 34 is arranged at the position where the branch 33 is connected to the main line 32, and the branch 33 connected later is connected to the inlet of the multiple second heat sinks 22. The outlet of the first heat sink 21 and the outlet of the multiple second heat sinks 22 are respectively connected to another main line through another branch, and the other main line extends out of the housing 5, and a driving pump 37 is arranged on the other main line. The other main line is finally connected to the inlet of the concentrated heat sink 31, so that the refrigerant forms a cycle. The fan 36 and the radiator 35 are arranged outside the housing 5. The radiator 35 is arranged in contact with the concentrated heat sink 31, and the radiator 35 and the concentrated heat sink 31 are arranged along the third direction Z. The fan 36 is disposed at an air inlet of the radiator 35 located in the first direction X.

[0110] The inverter system also includes a temperature detection element 4 and a controller. The controller is electrically connected to the temperature detection element 4, the liquid separation pump 34, the drive pump 37 and the fan 36. The temperature detection element 4 is arranged in the housing 5, and each heating element 1 is provided with a temperature detection element 4. An intelligent control strategy is preset in the controller, which monitors the temperature of each heating element 1 by receiving the information sent by the temperature detection element 4 in real time, and dynamically adjusts the working state of the drive pump 37, the liquid separation pump 34 and the fan 36 according to the temperature data, so as to achieve the purpose of accurately controlling the heat dissipation effect.

[0111] In some specific embodiments, customized heat sinks and cooling pipes are provided according to the size and heat output characteristics of the main heating components 1 such as IGBT, reactors and capacitors inside the frequency converter. The corresponding heat sinks and pipes are installed on each heating component to ensure good thermal contact performance. At the same time, a centralized heat sink with fins is designed and connected to a liquid cooling circulation system. A temperature detection element is placed at a suitable position to monitor the operating temperature of the IGBT and the remaining heating components 1. In scenarios where higher power is required, when multiple frequency converters are used in series or in parallel, the main body of the frequency converter is separated from the centralized liquid cooling device, which can reduce the overall volume of the equipment, increase the energy density, and provide more convenient maintenance. At the same time, the operating state of the heat dissipation system is dynamically adjusted according to the actual working conditions to reduce the system energy consumption, and the fan can be prevented from being in a long-term high-load operation, which can effectively increase the service life of the fan and improve the stability of the heat dissipation system.

[0112] Based on the description of the above embodiments, the embodiments of the present disclosure have at least the following features and beneficial effects:

[0113] 1. Split layout: Different heating elements 1 (power semiconductor device 111 and reactor 121) are respectively installed on independent heat sinks 2, and branches are set around the heating elements 1. This layout fully considers the thermal characteristics and spatial distribution of different heating elements 1, realizes targeted heat dissipation, avoids thermal crosstalk, and optimizes the heat flow path.

[0114] 2. Circulation heat dissipation: Establish a liquid cooling circulation system that connects at least two heat sinks 2 and cooling pipes. At least two heat sinks 2 are connected in parallel, and by setting a liquid separation pump 34, each heat sink 2 can be in an independent cooling circuit. Use a drive pump 37 to drive a non-corrosive, high-heat-capacity refrigerant (such as a water-ethylene glycol mixture) to circulate. The same liquid cooling system is used to provide heat dissipation for all heating elements 1, including at least two heat sinks 2 and cooling pipes. The refrigerant is driven by the drive pump 37 to circulate between these components, effectively transferring heat to the outside of the inverter for heat exchange, and then adjusting the opening of the liquid separation pump 34 according to the temperature control information of each device, ensuring the heat dissipation uniformity and efficiency of the entire system.

[0115] The total flow of the liquid cooling circulation system is adjusted according to the sum of the load conditions of each heating element 1. At the parallel node, the opening of the liquid separation pump 34 is adjusted according to the different load conditions of each heating element 1 to control the heat dissipation power ratio of each heating element 1 to meet the heat dissipation requirements under different system load conditions, thereby improving the overall heat dissipation efficiency, improving the system stability and improving the system energy efficiency ratio.

[0116] 3. Centralized heat dissipation: A centralized heat sink 31 with fins is introduced into the liquid cooling circulation system. The centralized heat sink 31 is in close contact with the refrigerant, and can quickly collect heat from each heat sink 2 and the cooling pipeline. The fin structure enhances the heat exchange capacity on the air side, and cooperates with the fan 36 to strengthen the forced convection heat dissipation of the centralized heat sink 31, which greatly improves the heat dissipation efficiency of the system.

[0117] 4. Intelligent temperature control: By setting a temperature detection element 4 on each heating element 1, the working temperature of each heating element 1 is monitored in real time, and the operating speed of the driving pump 37 and the fan 36 is automatically adjusted according to a preset temperature range.

[0118] First of all, each heat sink 2 is designed according to its maximum operating condition when it serves as a separate heat dissipation system. The structure and size of each heat sink 2 are set according to the working condition of the heating element 1 that needs to dissipate heat. Because the heat dissipation structure and heat dissipation requirements of each heating element 1 are different, the heat dissipation demand conversion coefficient X in the total heat dissipation circuit is inconsistent, and needs to be calculated and matched according to actual conditions and built into the control system.

[0119] If there are two heating elements 1, namely heating element A and heating element B, the required total heat dissipation is: Q(total)=X1*Q(A)+X2*Q(B), and the operating speeds of the driving pump 37 and the fan 36 can be adjusted according to the total heat dissipation Q(total).

[0120] In the total system heat dissipation loop, the operation speed of the driving pump 37 and the fan 36 is adjusted according to the sum of the heat dissipation required by multiple systems (temperature data of the temperature detection element 4). This intelligent control strategy is not only conducive to the effective heat dissipation of the equipment under different load conditions, but also can adjust the heat dissipation intensity according to actual needs, thereby achieving energy saving and consumption reduction.

[0121] Secondly, the liquid separation pump 34 can adjust the refrigerant flow rate entering the heat sink corresponding to the heating element A and the heating element B according to different working conditions. The controller adjusts the opening of each interface of the liquid separation pump 34 by receiving the working temperature and working state (on or off) of the heating element A and the heating element B. For example, when the heating element A is in full power working state, the heating element B is not working, and the temperature of the heating element B is in the normal temperature range, the interface corresponding to the heating element B of the liquid separation pump 34 is controlled to be in a completely closed state, so that the heating element A becomes an independent heat dissipation system.

[0122] The disclosed embodiment can adjust the total heat dissipation power according to the total heat generation of the heating components of each system, and can also adjust the interface opening of different links of the parallel node liquid separation pump according to the different heating conditions of the heating components, so as to meet the heat dissipation requirements of various device systems under different states. It can not only realize the total heat dissipation power adjustment of the overall system, but also adjust the heat dissipation power of each heating component under different load conditions.

[0123] In some embodiments, when the system is initially tested for operation, the operating status and temperature changes of each component are monitored, and the pump speed, fan speed and temperature control parameters are fine-tuned according to actual conditions to ensure that ideal heat dissipation effects can be achieved under different working conditions.

[0124] In some embodiments, to ensure long-term stable operation of the system, a regular maintenance plan is formulated, including cleaning the heat sink and fins, checking the sealing of the pipelines, replacing the refrigerant, etc. At the same time, the software of the intelligent control system is regularly updated to adapt to possible changes and upgrade requirements.

[0125] The disclosed embodiment integrates multiple technologies such as split layout, circulating liquid cooling, centralized cooling design and intelligent temperature control to achieve efficient and accurate temperature management and control, aiming to improve the heat dissipation performance of the inverter, reduce the volume of the cooling system, reduce energy consumption, and improve the reliability and stability of the overall equipment. By introducing intelligent elements, real-time monitoring and automatic adjustment of the operating status of the cooling system are achieved, which is particularly suitable for thermal management of high-density power electronic devices.

[0126] In summary, the embodiments of the present disclosure provide a highly integrated, intelligent, energy-saving and efficient multi-component liquid cooling solution, which has important practical value in promoting the development of miniaturized inverters and related power electronic equipment.

[0127] Based on the above-mentioned embodiments of the present disclosure, in the absence of explicit negation or conflict, the technical features of one embodiment may be beneficially combined with one or more other embodiments.

[0128] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A frequency converter system, characterized in that: include: At least two heating elements (1); At least two heat dissipation plates (2) are respectively arranged in close contact with the at least two heat generating elements (1); a heat dissipation channel is provided in the heat dissipation plate (2), and the heat dissipation channel is configured to transport a refrigerant; as well as A concentrated heat dissipation component (3) is connected to the at least two heat dissipation plates (2), and the concentrated heat dissipation component (3) is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates (2) according to the heat generation of the at least two heat generating elements (1).

2. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) comprises a centralized heat dissipation element (31), wherein a collecting flow channel is provided in the centralized heat dissipation element (31), and the collecting flow channel is configured to collect the refrigerant in the heat dissipation flow channel and transport the refrigerant to the heat dissipation flow channel.

3. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) comprises a main circuit (32) and at least two branch circuits (33), the main circuit (32) and the at least two branch circuits (33) being connected in parallel, and each branch circuit (33) of the at least two branch circuits (33) being connected to at least one heat dissipation plate (2) of the at least two heat dissipation plates (2).

4. The frequency converter system according to claim 3, characterized in that: The centralized heat dissipation component (3) further comprises a liquid separation pump (34), and a liquid separation pump (34) is provided at the connection between at least one branch (33) of the at least two branches (33) and the main line (32).

5. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) further comprises a radiator (35) and a fan (36); the radiator (35) is arranged in close contact with the centralized heat dissipation element (31); fins (351) are arranged in the radiator (35); the fan (36) is arranged at the air inlet of the radiator (35); and the air outlet direction of the fan (36) is consistent with the direction from the air inlet to the air outlet of the radiator (35).

6. The frequency converter system according to claim 1, characterized in that: The at least two heat-generating elements (1) include a first heat-generating element (11) and a second heat-generating element (12); the centralized heat-dissipating assembly (3) includes a centralized heat-dissipating element (31); the second heat-generating element (12), the first heat-generating element (11), and the centralized heat-dissipating element (31) are arranged at intervals along a first direction (X).

7. The frequency converter system according to claim 6, characterized in that: The number of the first heating elements (11) is at least two, the at least two first heating elements (11) are arranged at intervals along the second direction (Y), the at least two heat dissipation plates (2) include a first heat dissipation plate (21), the first heat dissipation plate (21) is arranged in contact with the at least two first heating elements (11), and the first direction (X) intersects with the second direction (Y).

8. The frequency converter system according to claim 6, characterized in that: The number of the second heating elements (12) is at least two, the at least two second heating elements (12) are arranged at intervals along the second direction (Y), the at least two heat dissipation plates (2) include at least two second heat dissipation plates (22), each second heat dissipation plate (22) is arranged in contact with a second heating element (12), and the first direction (X) intersects with the second direction (Y).

9. The frequency converter system according to claim 6, characterized in that: The centralized heat dissipation component (3) further comprises a radiator (35), the radiator (35) being arranged in contact with the centralized heat dissipation element (31), and the radiator (35) and the centralized heat dissipation element (31) being arranged along a third direction (Z), and the first direction (X) intersects the third direction (Z).

10. The frequency converter system according to claim 9, characterized in that: The centralized heat dissipation component (3) further comprises a fan (36), the fan (36) being arranged at the air inlet of the radiator (35), the air outlet direction of the fan (36) being consistent with the direction from the air inlet to the air outlet of the radiator (35), and the direction from the air inlet to the air outlet being parallel to the first direction (X).

11. The frequency converter system according to claim 1, characterized in that: The at least two heating elements (1) include a power semiconductor device (111) and a reactor (121).

12. The frequency converter system according to claim 11, characterized in that: The number of the power semiconductor devices (111) is three, and the at least two heat dissipation plates (2) include a first heat dissipation plate (21), wherein the first heat dissipation plate (21) is arranged to fit the three power semiconductor devices (111).

13. The frequency converter system according to claim 11, characterized in that: The number of the reactors (121) is at least two, the at least two heat sinks (2) include at least two second heat sinks (22), and each reactor (121) is provided with a corresponding second heat sink (22).

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