Fluid routing for a vacuum pumping system

Abstract

A fluid routing module (104) for a vacuum pumping system (100), comprising: a first fluid inlet (110a); a first fluid outlet (114a); a first fluid line (200) coupled between the first fluid inlet (110a) and the first fluid outlet (114a); and a restrictor module (212) disposed along a first fluid line (200) between the first fluid inlet (110a) and the first fluid outlet (114a), wherein the restrictor module (212) is configured to variably restrict fluid flow between the first fluid inlet (110a) and the first fluid outlet (114a).

Description

Technical Field

[0001] The present invention relates to fluid routing for use with vacuum pumping systems, including but not limited to vacuum systems for pumping fluids from semiconductor processing tools. Background Art

[0002] Semiconductor manufacturing plants manufacture integrated circuit chips. In the manufacture of such devices, wafers are processed through a number of different process stations, including stations where the wafers undergo processes such as chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography. Many of these processes involve the use of gaseous environments and often require the use of high vacuum and reduced gas pressures.

[0003] A vacuum pump is used to provide reduced gas pressure in the process chamber, to provide chamber evacuation, and to maintain the flow of process gases. Summary of the invention

[0004] When the pressure inside the chamber of a semiconductor processing tool is not at a working vacuum, for example after the process chamber has been vented to atmospheric pressure to enable service or maintenance, a so-called "pump down event" is performed to establish the desired reduced gas pressure in the chamber. The pump down event involves pumping gas from the chamber in order to reduce the pressure inside the chamber to the desired level.

[0005] Similarly, when the pressure inside the pumping chamber of a vacuum pump (e.g., a turbo pump) is at atmospheric pressure, such as after the vacuum pump has been deactivated to enable service or maintenance, the pump-down event is performed to establish a reduced gas pressure in the pumping chamber of the vacuum pump.

[0006] A vacuum and abatement system may be used to simultaneously pump gases from multiple process chambers of a semiconductor processing tool using a common pump via a common manifold. The inventors have recognized that in such a system, since multiple chambers and / or multiple turbo pumps may be fluidly connected to a common manifold, performing a pumpdown event on one of those chambers and / or turbo pumps may affect conditions within other of those chambers. For example, a pumpdown event performed on one chamber may cause highly undesirable fluctuations in other chambers connected to the same manifold.

[0007] Aspects of the present invention provide valve modules for controlling fluids from multiple chambers of a semiconductor processing tool in a manner that reduces or eliminates these deficiencies.

[0008] In a first aspect, a fluid routing module for a vacuum pumping system is provided. The fluid routing module includes: a first fluid inlet; a first fluid outlet; a first fluid line coupled between the first fluid inlet and the first fluid outlet; and a restrictor module disposed along the first fluid line between the first fluid inlet and the first fluid outlet, the restrictor module being configured to variably restrict a fluid flow between the first fluid inlet and the first fluid outlet.

[0009] The restrictor module may include a plurality of restrictors arranged along a first fluid line between a first fluid inlet and a fluid outlet, the plurality of restrictors being arranged in parallel with each other, each of the plurality of restrictors being configured to restrict the fluid flow passing therethrough. The fluid routing module may further include a device configured to selectively direct the fluid flow through one or more selected restrictors of the plurality of restrictors while preventing the fluid flow from passing through other restrictors of the plurality of restrictors. The device configured to selectively direct the fluid flow through the selected one or more restrictors may include a plurality of valves, each of the plurality of valves being arranged in series with a corresponding restrictor of the plurality of restrictors. The fluid routing module may further include: a bypass line arranged in parallel with the restrictor module to allow the fluid flow to bypass the plurality of restrictors; and one or more additional valves configured to selectively direct the fluid flow through the bypass line or the plurality of restrictors. The fluid routing module may further include a valve controller configured to control the operation of the valve. Each of the plurality of restrictors may be configured to restrict the fluid flow passing therethrough to varying degrees. Each restrictor of the plurality of restrictors may include a flow restricting orifice having a different respective diameter.

[0010] The fluid routing module may further include a vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module. The vacuum pump may be a turbo pump.

[0011] The fluid routing module may further include: a second fluid inlet; a second fluid outlet; a second fluid line coupled between the second fluid inlet and the fluid outlet; and one or more valves disposed along the second fluid line.

[0012] In a further aspect, a system is provided, comprising: a semiconductor processing tool including a process chamber; the fluid routing module of any preceding aspect, wherein a first fluid inlet is fluidly coupled to the process chamber; and a vacuum pump operably coupled to the first fluid outlet.

[0013] The semiconductor processing tool may further include one or more additional process chambers. The system may further include one or more additional fluid routing modules, each additional fluid routing module being a fluid routing module according to any of the foregoing aspects, wherein the first fluid inlet of each additional fluid routing module is fluidically coupled to the corresponding additional process chamber. The system may further include a fluid line manifold, wherein the first fluid outlet of the fluid routing module and each additional fluid routing module is fluidically coupled to the fluid line manifold. The vacuum pump may be operably coupled to the fluid line manifold.

[0014] The second fluid inlet may be fluidly coupled to the process chamber.The system may further include an additional vacuum pump operably coupled to the second fluid outlet.

[0015] In a further aspect, a method for routing a fluid through a fluid routing module is provided. The fluid routing module may be according to any of the preceding aspects. The method comprises: receiving a fluid flow at a first fluid inlet; variably restricting the fluid through the restrictor module by a restrictor module; and then, causing the fluid to flow out of a first fluid outlet.

[0016] The fluid routing module may further include: a vacuum pump disposed along a first fluid line between a first fluid inlet and a restrictor module; a bypass line arranged to allow fluid to flow to a flow-restricting portion of the restrictor module; and a device configured to selectively direct fluid flow through the bypass line. The method may further include: in response to one or more conditions being met, controlling another device to cause fluid flow through the bypass line to bypass the flow-restricting portion of the restrictor module. The one or more conditions may include a condition that a pressure in a pumping chamber of the vacuum pump is below a critical pressure.

[0017] In any of the above aspects, there may be multiple fluid routing modules, that is, there may be multiple first fluid inlets, multiple first fluid lines, and multiple first fluid outlets. In addition, there may be a fluid line manifold. Multiple first fluid outlets of multiple fluid routing modules may be fluidly coupled to the fluid line manifold. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a semiconductor manufacturing facility (not drawn to scale);

[0019] Figure 2 is a schematic diagram (not to scale) showing further details of a pumping module of a semiconductor manufacturing facility;

[0020] Figure 3 is a schematic diagram (not to scale) showing further details of a limiter module of a semiconductor manufacturing facility;

[0021] Figure 4 is a process flow diagram illustrating certain steps of a process for pumping gases in a semiconductor manufacturing facility;

[0022] Figure 5 is a process flow diagram showing certain steps of a process for operating a restrictor valve; and

[0023] Figure 6 is a schematic diagram (not to scale) illustrating the operation of the restrictor valve. DETAILED DESCRIPTION

[0024] Figure 1 is a schematic diagram (not drawn to scale) of a semiconductor manufacturing facility 100 according to an embodiment.

[0025] The semiconductor manufacturing facility 100 includes a semiconductor processing tool 102 , a fluid routing module 104 , a first vacuum pump 106 , and a second vacuum pump 107 .

[0026] The semiconductor processing tool 102 includes a plurality of process chambers 108 where semiconductor wafers undergo respective processes. Examples of these processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography processes.

[0027] The first vacuum pump 106 is configured to pump fluid (ie, process gas) out of the process chamber 108 of the semiconductor processing tool 102 via the fluid routing module 104 .

[0028] The second vacuum pump 107 is configured to pump fluid (ie, process gas) out of the process chamber 108 of the semiconductor processing tool 102 via the fluid routing module 104 .

[0029] The fluid routing module 104 includes: multiple fluid inlets (particularly, multiple first fluid inlets 110a and multiple second fluid inlets 110b), multiple pumping modules 112, multiple fluid outlets (particularly, multiple first fluid outlets 114a and multiple second fluid outlets 114b), a first fluid pipeline manifold 116, and a second fluid pipeline manifold 122.

[0030] A pair of respective first and second fluid inlets 110a, 110b are fluidly connected between the respective process chamber 108 and the respective pumping module 112 such that fluid may flow from the process chamber 108 to the pumping module 112 via one or both of the first and second fluid inlets 110a, 110b.

[0031] Reference later below Figure 2 The pumping module 112 will be described in more detail.

[0032] Each pumping module 112 is fluidly connected to the first fluid line manifold 116 by a corresponding first fluid outlet 114a so that fluid may flow from the pumping module 112 to the first fluid line manifold 116. Each pumping module 112 is fluidly connected to the second fluid line manifold 122 by a corresponding second fluid outlet 114b so that fluid may flow from the pumping module 112 to the second fluid line manifold 122.

[0033] The first fluid line manifold 116 is fluidly connected between the plurality of first fluid outlets 114 a and the first vacuum pump 106 .

[0034] The second fluid line manifold 122 is fluidly connected between the plurality of second fluid outlets 114 b and the second vacuum pump 107 .

[0035] The fluid routing module 104 further includes a valve controller 118 .

[0036] The valve controller 118 is operably coupled to each of the plurality of valves included in the pumping module 112 via corresponding pneumatic lines and / or electrical connections (not shown). Figure 2 These valves are described in more detail. Figure 4 As described in greater detail, the valve controller 118 is configured to control the operation of the valves of the pumping module 112 , such as by delivering pneumatic fluid thereto via pneumatic lines.

[0037] Figure 2 is a schematic diagram (not drawn to scale) showing further details of the pumping modules 112. In the present embodiment, the pumping modules 112 of the fluid routing module 104 are substantially identical to one another.

[0038] In the present embodiment, the first fluid inlet 110a and the second fluid inlet 110b are fluid inlets of the pumping module 112. Likewise, the first fluid outlet 114a and the second fluid outlet 114b are fluid outlets of the pumping module 112.

[0039] The pumping module 112 includes a first fluid line 200 coupled between the first fluid inlet 110a and the first fluid outlet 114a , and a second fluid line 202 coupled between the second fluid inlet 110b and the second fluid outlet 114b .

[0040] The pumping module 112 includes an automatic pressure control (APC) module 208 , a turbo pump 210 , a restrictor module 212 , a pressure sensor 214 , and a valve 216 .

[0041] The APC module 208, the turbo pump 210, the restrictor module 212, and the pressure sensor 214 are arranged along the first fluid pipeline 200. The APC module 208 is arranged between the first fluid inlet 110a and the turbo pump 210. The turbo pump 210 is arranged between the APC module 208 and the restrictor module 212. The restrictor module 212 is arranged between the turbo pump 210 and the pressure sensor 214. The pressure sensor 214 is arranged between the restrictor module 212 and the first fluid outlet 114a.

[0042] A valve 216 , which may be considered a chamber coarse adjustment valve, is disposed along the second fluid line 202 and between the second fluid inlet 110 b and the second fluid outlet 114 b .

[0043] The APC module 208 is configured to control the flow of fluid therethrough. The APC module 208 may include a movable valve with a controller. The movable valve of the APC module 208 may include a movable pendulum that can be controlled by the controller of the APC module 208 to increase or decrease the size of an orifice in the chamber exhaust path. The APC module 208 may receive a pressure set point and an actual pressure reading for the pressure inside the process chamber 108. The controller of the APC module 208 may then control the pendulum according to a control algorithm until the actual pressure measurement matches the set point. In some embodiments, the valve of the APC module 208 may be controlled by the valve controller 118.

[0044] The turbo pump 210 is coupled to the corresponding process chamber 108 via the first fluid inlet 110a. The turbo pump 210 is configured to pump exhaust gas from the process chamber 108, through the first fluid line 200, and out of the first fluid outlet 114a.

[0045] Reference later below Figure 3 The limiter module 212 is described in further detail.

[0046] The pressure sensor 214 is configured to measure the pressure of the fluid in the first fluid line 200 flowing from the restrictor module 212. The pressure sensor 214 may be operably coupled to the valve controller 118 such that the pressure measurement obtained by the pressure sensor 214 may be received by the valve controller 118.

[0047] The valve 216 is configured to control the flow of fluid therethrough. In particular, in the present embodiment, the valve 216 is configured to be controlled by the valve controller 118 to selectively allow or prevent the flow of fluid therethrough.

[0048] Figure 3is a schematic diagram (not drawn to scale) showing further details of the restrictor module 212. In this embodiment, the restrictor modules 212 of the pumping modules 112 are substantially identical to each other.

[0049] The restrictor module 212 includes a plurality of restrictors. Specifically, the restrictor module 212 includes: a first restrictor 301, a second restrictor 302, a third restrictor 303, a fourth restrictor 304, and a fifth restrictor 305. The restrictors 301-305 are arranged along the first fluid pipeline 200. The restrictors 301-305 are arranged in parallel with each other.

[0050] Each restrictor 301-305 is configured to restrict the flow of fluid therethrough. In particular, in this embodiment, each restrictor 301-305 includes a flow-restricting orifice.

[0051] In the present embodiment, each restrictor 301-305 is configured to limit the fluid flow passing therethrough to varying degrees. Each restrictor 301-305 includes a flow restriction orifice with different corresponding diameters. In other words, the diameters of the flow restriction orifices of restrictors 301-305 are different in size from each other. The diameter of the flow restriction orifice of the restrictor 301-305 may be any suitable size, for example, the size selected from a group of values ​​consisting of 0.5mm, 0.6mm, 0.75mm, 1mm, and 2mm. In the present embodiment, the first restrictor 301 has a diameter of 0.5mm, the second restrictor 302 has a diameter of 0.6mm, the third restrictor 303 has a diameter of 0.75mm, the fourth restrictor 304 has a diameter of 1mm, and the fifth restrictor 305 has a diameter of 2mm.

[0052] The restrictor module 212 further includes a device configured to selectively direct fluid flow through one or more selected ones of the restrictors 301-305 while preventing fluid flow through other restrictors of the restrictors 301-305. In the present embodiment, the device for selectively directing fluid flow through one or more selected ones of the restrictors 301-305 includes a plurality of valves, hereinafter referred to as "restrictor valves". In particular, the restrictor module 212 includes a first restrictor valve 311, a second restrictor valve 312, a third restrictor valve 313, a fourth restrictor valve 314, and a fifth restrictor valve 315. Each restrictor valve 311-315 is fluidly coupled in series with a corresponding restrictor 301-305. In particular, the first restrictor valve 311 is connected in series with the first restrictor 301, the second restrictor valve 312 is connected in series with the second restrictor 302, the third restrictor valve 313 is connected in series with the third restrictor 303, the fourth restrictor valve 314 is connected in series with the fourth restrictor 304, and the fifth restrictor valve 315 is connected in series with the fifth restrictor 305. Each pair of serially connected restrictors and restrictor valves is connected in parallel with each other.

[0053] Each restrictor valve 311-315 is configured to control fluid flow therethrough. In particular, in the present embodiment, each restrictor valve 311-315 is configured to be controlled by the valve controller 118 to selectively allow or prevent fluid flow therethrough. Thus, each restrictor valve 311-315 can selectively allow or prevent fluid flow through a corresponding restrictor 301-305 coupled in series with the valve.

[0054] In the present embodiment, the restrictor module 212 further includes a bypass line 320. The bypass line 320 is arranged in parallel with the plurality of restrictors 301-305 (and the restrictor valves 311-315). The bypass line 320 is arranged to allow the fluid flow to bypass the plurality of restrictors 301-305. The bypass line 320 allows the fluid flow to bypass the plurality of restrictors 301-305 and flow relatively unrestricted between the turbo pump 210 and the first fluid outlet 114a.

[0055] In the present embodiment, the restrictor module 212 further includes a valve, hereinafter referred to as a "bypass valve 322". The bypass valve 322 is disposed along the bypass line 320. The bypass valve 322 is configured to control the flow of fluid therethrough. In particular, in the present embodiment, the bypass valve 322 is configured to be controlled by the valve controller 118 to selectively allow or prevent the flow of fluid therethrough. Therefore, the bypass valve 322 can selectively allow or prevent the flow of fluid through the bypass line 320.

[0056] The restrictor modules 212 may be oriented vertically, ie, so that the process fluid flows through the restrictor in a vertically downward direction. This orientation and arrangement of the restrictor modules 212 tends to prevent the restrictors 301-305 from becoming blocked by, for example, liquids that may flow out of the restrictors 301-305 under gravity.

[0057] The apparatus including the valve controller 118 for implementing the above arrangement and performing the method steps to be described below may be provided by configuring or adapting any suitable apparatus (e.g., one or more computers or other processing devices or processors) and / or providing additional modules. The apparatus may include a computer, a network of computers or one or more processors for implementing instructions and using data, including instructions and data in the form of a computer program or multiple computer programs stored in or on a machine-readable storage medium such as a computer memory, a computer disk, a ROM, a PROM, etc., or any combination of these or other storage media.

[0058] The system described above may undergo a pumpdown event to extract gas from one or more process chambers 108, which may be at atmospheric pressure, to reduce the pressure therein to a level suitable for semiconductor manufacturing processes. The pumpdown event may be performed to extract gas from a pumping chamber of a turbo pump of one or more pumping modules.

[0059] Now refer to Figures 4 to 6 Described is a process for pumping gases in a semiconductor fabrication facility 100 , including pump-down events.

[0060] It should be noted that in Figure 4 and Figure 5 Certain process steps depicted in the flowchart and described below may be omitted, or these process steps may be performed differently than those presented and described below. Figure 4 and Figure 5 In addition, for the purpose of convenience and easy understanding, although all process steps have been depicted as discrete time-sequential steps, some process steps may actually be performed simultaneously or at least overlap to a certain extent in time.

[0061] Figure 4 is a process flow diagram illustrating certain steps of a process 400 for pumping gases in a semiconductor fabrication facility 100 , including a pump-down event.

[0062] At step s402, semiconductor manufacturing processes are performed in the process chamber 108. These semiconductor manufacturing processes generate process gases.

[0063] In the present embodiment, at this stage, valve 216 is closed, restrictor valves 311-315 are closed, and bypass valve 322 is open for each pumping module 112. Thus, at step s402, the first vacuum pump 106 pumps process gas from the process chamber 108 through the relatively unrestricted first fluid line 200 of the pumping module 112 and into the first fluid line manifold 116.

[0064] At step s404, one of the process chambers 108 (hereinafter referred to as "first process chamber 108" for convenience) is closed for inspection, maintenance, repair or maintenance. In the present embodiment, the closing of the first process chamber 108 includes: stopping the pumping of gas from the first process chamber 108. In the present embodiment, this can be achieved by closing the bypass valve 322 of the pumping module 112 associated with the first process chamber 108. The turbo pump 210 of the pumping module 112 associated with the first process chamber 108 is also closed. In the present embodiment, closing the first process chamber 108 further includes: increasing the pressure in the first process chamber 108 to approximately atmospheric pressure. This can be achieved by opening a valve coupled to the first process chamber 108, thereby allowing air to enter the first process chamber 108. In addition, in the present embodiment, the pressure in the pumping chamber of the turbo pump 210 of the pumping module 112 associated with the first process chamber 108 is also increased to approximately atmospheric pressure.

[0065] At step s406 , the operator performs an inspection, service, repair or maintenance operation on the first process chamber 108 . Alternatively or in addition, inspection, service, repair or maintenance may be performed on one or more components of the pumping module 112 associated with the first process chamber 108 .

[0066] After the inspection, maintenance, repair or service operation, the low gas pressure environment will be re-established in the first process chamber 108 so that the semiconductor manufacturing process can be performed therein.

[0067] Therefore, at step s408 , the valve 216 of the pumping module 112 associated with the first process chamber 108 is opened by the valve controller 118 .

[0068] At step s410 , with the valve 216 opened, the second vacuum pump 107 pumps gas from the first process chamber 108 along the second fluid line 202 into the second fluid line manifold 122 .

[0069] Thus, the first process chamber 108 is “evacuated.” This gas flow from the first process chamber 108 is independent of the gas flow through the first fluid line manifold 116. Advantageously, this separation of flows tends to reduce or eliminate evacuation of the first process chamber 108 that adversely affects conditions within the parallel process chambers 108.

[0070] At step s412 , in response to the evacuation of the first process chamber 108 being completed, the valve controller 118 closes the valve 216 of the pumping module 112 associated with the first process chamber 108 .

[0071] The completion of the evacuation of the first process chamber 108 may be detected by any suitable means. For example, the valve controller 118 may determine that the evacuation of the first process chamber 108 is complete in response to a measurement of the pressure within the first process chamber 108 reaching or falling below a first threshold value, and / or a calculated rate of decrease of the measured pressure associated with the first process chamber 108 reaching or falling below a second threshold value. The first threshold value may be any suitable threshold value. The second threshold value may be any suitable threshold value.

[0072] At step s414, in response to the evacuation of the first process chamber 108 being completed, the valve controller 118 controls the restrictor valves 311-315 to open in a predetermined sequence. Therefore, at step s414, the restrictor valves 311-315 are opened and closed in a predetermined pattern.

[0073] In some embodiments, at step s414, the valve controller 118 may also control the APC module 208 to prevent or block fluid flow therethrough.

[0074] Figure 5 is a process flow diagram illustrating certain steps of a process 500 for operating restrictor valves 311 - 315 , which may be performed at step s414 . Figure 6 is a schematic diagram (not drawn to scale) illustrating the operation of the restrictor valves 311-315. Figure 5 and Figure 6 Later, we will describe in more detail below. Figure 4 The remaining steps.

[0075] At step s502, the first restrictor valve 311 is opened. At step s502, the remaining restrictor valves 312-315 and bypass valve 322 are closed. With the first restrictor valve 311 opened, the fluid flow is directed through the first restrictor 301, which has a minimum diameter in this embodiment, which is 0.5 mm. The fluid does not flow through the other restrictors 302-305 or the bypass line 320. Therefore, at step s502, the first vacuum pump 106 pumps gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the first restrictor 301.

[0076] At step s504, the first restrictor valve 311 is closed and the second restrictor valve 312 is opened. At step s504, the first and third to fifth restrictor valves 311, 313-315 and the bypass valve 322 are closed. With the second restrictor valve 312 opened, the fluid flow is directed through the second restrictor 302, which has a larger diameter than the first restrictor 301 in this embodiment, which is 0.6 mm. The fluid does not flow through the other restrictors 301, 303-305 or the bypass line 320. Therefore, at step s504, the first vacuum pump 106 pumps the gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the second restrictor 302.

[0077] At step s506, the second restrictor valve 312 is closed and the third restrictor valve 313 is opened. At step s506, the first, second, fourth and fifth restrictor valves 311, 312, 314, 315 and the bypass valve 322 are closed. With the third restrictor valve 313 opened, the fluid flow is directed through the third restrictor 303, which has a larger diameter than the second restrictor 302 in this embodiment, which is 0.75 mm. The fluid does not flow through the other restrictors 301, 303, 304, 305 or the bypass line 320. Therefore, at step s506, the first vacuum pump 106 pumps gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the third restrictor 303.

[0078] At step s508, the third restrictor valve 313 is closed and the fourth restrictor valve 314 is opened. At step s508, the first to third and fifth restrictor valves 311-313, 315 and the bypass valve 322 are closed. With the fourth restrictor valve 314 opened, the fluid flow is directed through the fourth restrictor 304, which has a larger diameter than the third restrictor 303 in this embodiment, which is 1 mm. The fluid will not flow through the other restrictors 301-303, 305 or the bypass line 320. Therefore, at step s508, the first vacuum pump 106 pumps the gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the fourth restrictor 304.

[0079] At step s510, the fourth restrictor valve 314 is closed and the fifth restrictor valve 315 is opened. At step s510, the first to fourth restrictor valves 311-314 and the bypass valve 322 are closed. With the fifth restrictor valve 315 opened, the fluid flow is directed through the fifth restrictor 305, which has a larger diameter than the fourth restrictor 304 in this embodiment, which is 2 mm. The fluid does not flow through the other restrictors 301-304 or the bypass line 320. Therefore, at step s510, the first vacuum pump 106 pumps gas from the pumping chamber of the turbo pump 210 along the first fluid line 200 into the first fluid line manifold 116 via the fifth restrictor 305.

[0080] Figure 6 It shows the Figure 5 A schematic diagram (not drawn to scale) of a diagram 600 of a process.

[0081] An x-axis 602 of the graph 600 represents time in seconds (s).

[0082] The primary y-axis 604 of the graph 600 represents pressure (ie, the pressure in the turbo pump) in millibars.

[0083] A secondary y-axis 605 of the graph 600 represents gas flow in standard liters per minute (slm).

[0084] Graph 600 includes two plotted lines, namely, a first line 606 and a second line 608. First line 606 is a solid line. Second line 608 is a dashed line. First line 606 shows the chamber pressure within the pumping chamber of turbo pump 210. Second line 608 shows the pressure within the foreline of the pumping system, i.e., the pressure within the first fluid inlet 110a.

[0085] The x-axis 602 of the graph 600 is divided or separated into five time intervals, namely, a first time interval 611 , a second time interval 612 , a third time interval 613 , a fourth time interval 614 , and a fifth time interval 615 .

[0086] In this embodiment, the duration of each time interval is approximately 190 seconds. However, in other embodiments, one or more time intervals may be of a corresponding different duration different from 190 seconds.

[0087] The first time interval 611 corresponds to step s502. Therefore, during the first time interval 611, the first restrictor valve 311 is open, and the other restrictor valves 312-315 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the first restrictor 301.

[0088] At the end of the first time interval 611, the second time interval 612 begins. In addition, at the end of the first time interval 611 / the beginning of the second time interval 612, the first restrictor valve 311 is closed, and the second restrictor valve 312 is opened.

[0089] The second time interval 612 corresponds to step s504. Therefore, during the second time interval 612, the second restrictor valve 312 is open, and the other restrictor valves 311, 313-315 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the second restrictor 302.

[0090] At the end of the second time interval 612, the third time interval 613 begins. In addition, at the end of the second time interval 612 / the beginning of the third time interval 613, the second restrictor valve 312 is closed, and the third restrictor valve 313 is opened.

[0091] The third time interval 613 corresponds to step s506. Therefore, during the third time interval 613, the third restrictor valve 313 is opened, and the other restrictor valves 311, 312, 314, 315 and the bypass valve 322 are closed. Therefore, the fluid flows from the pumping chamber of the turbo pump 210 through the third restrictor 303.

[0092] At the end of the third time interval 613, the fourth time interval 614 begins. In addition, at the end of the third time interval 613 / the beginning of the fourth time interval 614, the third restrictor valve 313 is closed, and the fourth restrictor valve 314 is opened.

[0093] The fourth time interval 614 corresponds to step s508. Therefore, during the fourth time interval 614, the fourth restrictor valve 314 is open, and the other restrictor valves 311-313, 315 and the bypass valve 322 are closed. Therefore, fluid flows from the pumping chamber of the turbo pump 210 through the fourth restrictor 304.

[0094] At the end of the fourth time interval 614, the fifth time interval 615 begins. In addition, at the end of the fourth time interval 614 / the beginning of the fifth time interval 615, the fourth restrictor valve 314 is closed, and the fifth restrictor valve 315 is opened.

[0095] The fifth time interval 615 corresponds to step s510. Therefore, during the fifth time interval 615, the fifth restrictor valve 315 is open, and the other restrictor valves 311-314 and the bypass valve 322 are closed. Therefore, fluid flows from the pumping chamber of the turbo pump 210 through the fifth restrictor 305.

[0096] At the end of the fifth time interval 615 , the fifth restrictor valve 315 is closed.

[0097] At the end of the fifth time interval 615 , the pressure in the pumping chamber of the turbo pump 210 tends to be less than or equal to a critical value, such as 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar, or 10 mbar.

[0098] Thus, the pumping chamber of the turbopump 210 is "evacuated." This gas flow from the pumping chamber of the turbopump 210 is sequentially restricted by the first through fifth restrictors 301-305. Advantageously, such flow restriction by the restrictors 301-305 tends to reduce or eliminate the evacuation of the pumping chamber of the turbopump 210 that adversely affects conditions within the parallel process chamber 108. In addition, evacuating the pumping chamber of the turbopump 210 sequentially through restrictors of increasing size advantageously tends to provide faster evacuation of the pumping chamber, for example, as compared to if a single restrictor of a fixed size were used.

[0099] In the present embodiment, as shown in chart 600, the process flow through each chamber 108 is limited to 2slm (maximum). This tends to prevent a single vacuum pump from being overloaded and unable to provide necessary vacuum conditions to maintain the correct function of all turbo pumps 210. The restrictor is sized to ensure that the turbine evacuated from the atmosphere will never exceed the chamber flow restriction of 2slm. The restrictor is preferably sized to reduce pressure as quickly as possible. In other embodiments, different process flow maxima that are different from 2slm may be implemented.

[0100] At the end of the fifth time interval 615, i.e., at Figure 5 After step s510 in the process of , step s414 ends, and Figure 4 The process proceeds to step s416.

[0101] Return to Figure 4 In the description, at step s416, in response to the completion of the evacuation of the pumping chamber of the turbo pump 210, the valve controller 118 controls the fifth restrictor valve 315 to be closed and the bypass valve 322 to be opened. Therefore, the fluid flow is directed through the bypass line 320 without passing through the flow restriction portion 301-305 of the restrictor module 212.

[0102] In some embodiments, at step s416 , the valve controller 118 may also control the APC module 208 to allow fluid flow therethrough.

[0103] The completion of the evacuation of the pumping chamber of the turbopump 210 may be detected by any appropriate means. For example, the valve controller 118 may determine that the evacuation of the pumping chamber of the turbopump 210 is completed in response to the measurement result of the pressure in the pumping chamber of the turbopump 210 reaching or falling below the critical pressure value, and / or the calculated rate of decline of the measured pressure associated with the pumping chamber of the turbopump 210 reaching or falling below the critical rate value. The critical pressure value may be any appropriate critical value, such as 2 mbar, 3 mbar, 4 mbar, 5 mbar, 6 mbar, 7 mbar, 8 mbar, 9 mbar or 10 mbar. The critical rate value may be any appropriate critical value. The valve controller 118 may determine that the evacuation of the pumping chamber of the turbopump 210 is completed based on the measurement result obtained by the pressure sensor 214 and / or any other pressure sensor (e.g., a pressure sensor arranged to measure the pressure in the pumping chamber of the turbopump 210).

[0104] At step s418, after the bypass valve 322 is controlled to direct fluid flow through the bypass line 320, a semiconductor manufacturing process may be performed in the first process chamber 108. These semiconductor manufacturing processes generate process gases.

[0105] At step s420 , the first vacuum pump 106 pumps gas from the first process chamber 108 , through the relatively unrestricted first fluid line 200 of the pumping module 112 associated with the first process chamber, and into the first fluid line manifold 116 .

[0106] Thus, a process 400 for pumping gas in a semiconductor fabrication facility 100 is provided.

[0107] The above-described systems and methods advantageously tend to reduce or eliminate evacuation events that adversely affect conditions within parallel process chambers. This tends to be achieved by pumping the evacuated gas through a restrictor (ie, a restricted conduit or orifice of reduced diameter).

[0108] Advantageously, by pumping the evacuated gas sequentially through restrictors of increasing diameter, evacuation may be performed relatively quickly.

[0109] Advantageously, pump-down events and the end of said pump-down events tend to be automatically detected and mitigated.

[0110] Advantageously, the above-described fluid routing module may be integrated in-line with a horizontal manifold connecting the semiconductor processing tool to a vacuum pump.

[0111] Advantageously, the fluid routing module described above tends to be robust. The vacuum module may be fully assembled, leak-checked and pre-tested off-site or on-site upon delivery, for example, to a semiconductor manufacturing facility. This tends to simplify the installation process and reduce installation time.

[0112] Advantageously, the fluid routing modules described above tend to be modular and expandable.

[0113] Advantageously, components in the gas flow of the fluid routing module tend to be easy to maintain, repair or replace.

[0114] Advantageously, the status and operating condition of the system tends to be easily monitorable, for example via a human machine interface of the valve module or remotely.

[0115] Advantageously, each fluid routing module in the system is intended to be easily controlled by a system controller, for example using a communication protocol such as EtherCAT or Ethernet.

[0116] Advantageously, the fluid routing module described above allows for a variety of mounting options. For example, the fluid routing module may be suspended from the ceiling of a semiconductor manufacturing facility, which provides the benefit of not consuming floor space. Alternatively, the fluid routing module may be mounted in a floor-standing rack or on top of other equipment.

[0117] In the above-described embodiments, the fluid routing module is implemented in a semiconductor manufacturing facility for routing pumped process gases. However, in other embodiments, the fluid routing module may be implemented in different systems and used to route different types of fluids.

[0118] In the above embodiment, there is a single semiconductor processing tool including six process chambers. However, in other embodiments, there is more than one semiconductor processing tool. One or more semiconductor processing tools may include a different number of process chambers than six.

[0119] In the above embodiment, there is a single fluid routing module that includes six pumping modules. However, in other embodiments, there may be a different number of fluid routing modules, that is, a plurality of fluid routing modules. In some embodiments, one or more fluid routing modules may include a different number of pumping modules than six.

[0120] In the above embodiment, the pumping module includes two inlets connected to two outlets. However, in other embodiments, one or more pumping modules include a different number of inlets than two and a different number of outlets than two. For example, a pumping module may include two inlets connected to a single common outlet.

[0121] In the above-described embodiments, each pumping module includes a restrictor module having a plurality of restrictors arranged along a first fluid line between a first fluid inlet and a fluid outlet. The restrictors are arranged in parallel with each other. Therefore, the above-described functions are provided. However, in other embodiments, the restrictor module is configured to variably restrict the fluid flow between the first fluid inlet and the first fluid outlet in different ways. For example, in some embodiments, the restrictor module includes one or more variable restrictors, that is, one or more restrictors, each of which can be controlled to change the degree to which it restricts the fluid flow passing therethrough.

[0122] In the above-described embodiments, each of the plurality of restrictors is connected in series to its corresponding restrictor valve. In addition, a bypass valve is arranged in parallel with the restrictor valve. However, in other embodiments, one or more restrictors and / or bypass valves may be replaced by different arrangements or configurations of valves that provide the above-described functions. For example, in some embodiments, a plurality of valves (i.e., restrictor valves and / or bypass valves) may be replaced by a multi-way valve disposed at the intersection of the corresponding fluid lines. The multi-way valve may be configured to guide fluid along one or more selected ones of the corresponding fluid lines.

[0123] In the above described embodiments, the pumping chamber of the turbo pump is evacuated via the restrictor module. However, in other embodiments, instead of or in addition to the pumping chamber of the turbo pump, a different entity (eg, a process chamber) is evacuated via the restrictor module.

[0124] In the above described embodiments, a monotonically increasing size restricting orifice is used to evacuate the pumping chamber of the turbo pump. However, in other embodiments, the size of the restricting orifice does not increase monotonically, for example, the size of the restricting orifice may be reduced in response to meeting some criteria, such as the impact on parallel process chambers.

[0125] In the above described embodiments, fluid flow switches between passing through different restrictors in response to an elapsed time interval (e.g., 190 seconds). However, in other embodiments, fluid flow switches between passing through different restrictors in response to meeting different criteria, such as in response to the pressure measured within the pumping chamber or the rate of change (e.g., decrease) of the measured pressure reaching a predetermined threshold. Switching to a larger restrictor size may be controlled by time and / or vacuum diagnostics of the turbo pump. An optimization process may be performed to manage the relationship between maximum throughput and the minimum time required for evacuation.

[0126] In some embodiments, the APC module may be omitted or replaced by one or more valves.

[0127] Reference numerals

[0128] 100 – Semiconductor manufacturing facility

[0129] 102 – Semiconductor processing tools

[0130] 104– Fluid Routing Module

[0131] 106– First Vacuum Pump

[0132] 107– Second vacuum pump

[0133] 108– Process chamber

[0134] 110a – First fluid inlet

[0135] 110b – Second fluid inlet

[0136] 112 – Pumping module

[0137] 114a – First fluid outlet

[0138] 114b – Second fluid outlet

[0139] 116 – First fluid line manifold

[0140] 118– Valve Controller

[0141] 122 – Second fluid line manifold

[0142] 200 – First fluid line

[0143] 202 – Second fluid line

[0144] 208– APC module

[0145] 210– Turbine pump

[0146] 212 – Limiter module

[0147] 214– Pressure sensor

[0148] 216– Valve

[0149] 301 – First Limiter

[0150] 302– Second limiter

[0151] 303 – Third Limiter

[0152] 304 – Fourth Limiter

[0153] 305 – Fifth Limiter

[0154] 311 – First restrictor valve

[0155] 312 – Second restrictor valve

[0156] 313 – Third restrictor valve

[0157] 314 – Fourth restrictor valve

[0158] 315 – Fifth restrictor valve

[0159] 320 – Bypass line

[0160] 322 – Bypass valve

[0161] 400 – Craftsmanship

[0162] s402-420 Steps

[0163] 500 Crafts

[0164] s502-s510 steps

[0165] 600– Chart

[0166] 602– x-axis

[0167] 604 – y-axis

[0168] 606 – First Pipeline

[0169] 608– Second pipeline

[0170] 611 – First time interval

[0171] 612 – Second time interval

[0172] 613 – Third time interval

[0173] 614 – Fourth Time Interval

[0174] 615 – Fifth Time Interval

Claims

1. A fluid routing module for a vacuum pumping system, the fluid routing module comprising: a first fluid inlet; a first fluid outlet; a first fluid line coupled between the first fluid inlet and the fluid outlet; as well as A restrictor module is disposed along the first fluid line between the first fluid inlet and the first fluid outlet, the restrictor module being configured to variably restrict fluid flow between the first fluid inlet and the first fluid outlet.

2. The fluid routing module of claim 1, wherein: The restrictor module includes a plurality of restrictors disposed along a first fluid line between a first fluid inlet and a fluid outlet, the plurality of restrictors being arranged in parallel with each other, each of the plurality of restrictors being configured to restrict fluid flow therethrough; and The fluid routing module further includes a device configured to selectively direct fluid flow through selected one or more of the plurality of restrictors while preventing fluid flow through other of the plurality of restrictors.

3. The fluid routing module of claim 2, wherein the device configured to selectively direct fluid flow through a selected one or more restrictors comprises a plurality of valves, each valve of the plurality of valves being arranged in series with a corresponding restrictor of the plurality of restrictors.

4. The fluid routing module according to any one of claims 2 to 3, further comprising: a bypass line arranged in parallel with the restrictor module to allow fluid flow to bypass the plurality of restrictors; as well as One or more additional valves configured to selectively direct fluid flow through the bypass line or the plurality of restrictors.

5. The fluid routing module of claim 3 or 4, further comprising a valve controller configured to control the operation of the valve.

6. A fluid routing module according to any one of claims 2 to 5, wherein each restrictor of the plurality of restrictors is configured to restrict fluid flow therethrough to a different degree.

7. The fluid routing module of claim 6, wherein each restrictor of the plurality of restrictors comprises a flow restricting orifice having a different respective diameter.

8. The fluid routing module according to any one of claims 1 to 7, further comprising a vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module.

9. The fluid routing module of claim 8, wherein the vacuum pump is a turbo pump.

10. The fluid routing module according to any one of claims 1 to 9, further comprising: a second fluid inlet; a second fluid outlet; a second fluid line coupled between the second fluid inlet and the fluid outlet; as well as One or more valves are disposed along the second fluid line.

11. A system, comprising: A semiconductor processing tool including a process chamber; The fluid routing module of any one of claims 1 to 10, wherein the first fluid inlet is fluidly coupled to the process chamber; and A vacuum pump is operably coupled to the first fluid outlet.

12. The system of claim 11, wherein: The semiconductor processing tool further includes one or more additional process chambers; The system further comprises one or more additional fluid routing modules, each of the additional fluid routing modules being a fluid routing module according to any one of claims 1 to 10, wherein the first fluid inlet of each additional fluid routing module is fluidly coupled to a respective additional process chamber; The system further includes a fluid line manifold, wherein the first fluid outlet of the fluid routing module and each additional fluid routing module are fluidly coupled to the fluid line manifold; as well as A vacuum pump is operably coupled to the fluid line manifold.

13. A system according to claim 11 or 12, wherein: The fluid routing module is the fluid routing module according to claim 10; and The second fluid inlet is fluidly connected to the process chamber; and The system further includes an additional vacuum pump operably coupled to the second fluid outlet.

14. A method for routing a fluid through a fluid routing module, the fluid routing module according to any one of claims 1 to 10, the method comprising: receiving a fluid flow at a first fluid inlet; variably restricting, by the restrictor module, the passage of fluid through the restrictor module; as well as Subsequently, the fluid is caused to flow out of the first fluid outlet.

15. The method according to claim 14, wherein: The fluid routing module further comprises: a vacuum pump disposed along the first fluid line between the first fluid inlet and the restrictor module; a bypass line arranged to allow fluid to flow to the flow-restricting portion of the restrictor module; and a device configured to selectively direct fluid flow through the bypass line; The method further includes: in response to one or more conditions being met, controlling the further device to cause the fluid to flow through the bypass line, thereby bypassing the flow-restricting portion of the restrictor module; and The one or more conditions include a condition in which the pressure in a pumping chamber of the vacuum pump is lower than a critical pressure.

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