Apparatus and method for cleaning a substrate
By setting the comb and driving unit in the cleaning tank to rotate the substrate to set the angle, the uniform emission of ultrasonic waves under the simple structure inside the cleaning tank is achieved, the dead zone problem is solved and the cleaning performance is improved.
Patent Information
- Application Number
- CN202280096088.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-05-13
- Filing Date
- 2022-12-06
- Publication Date
- 2024-12-27
AI Technical Summary
With a simple structure inside the cleaning tank, how to uniformly emit ultrasonic waves on the entire substrate to avoid dead zones and improve substrate cleaning performance.
An apparatus including a cleaning tank, a megasic wave generator, a comb and a driving unit is designed, and a driving unit is utilized by a comb provided on a first side arm, a second side arm and a central arm within the cleaning tank. Move the center arm up/down or swing relative to the center of the substrate to ensure that ultrasound is emitted evenly across the substrate.
Under the simple structure inside the cleaning tank, uniform rotation of the substrate is achieved, so that ultrasonic waves are emitted uniformly across the entire substrate, eliminating dead zones, improving cleaning performance, and simplifying equipment control and minimizing pollution sources.
Smart Images
Figure CN119213540A_ABST
Abstract
Description
Technical Field
[0001] Embodiments relate to an apparatus and method for cleaning a substrate, which can improve substrate cleaning performance by uniformly emitting ultrasonic waves throughout the substrate without a dead zone. Background Art
[0002] Generally, a substrate used to manufacture a semiconductor device is produced through a series of processes including a slicing process, a grinding process, a lapping process, an etching process, and a polishing process.
[0003] During the substrate manufacturing process, the surface of the substrate may be contaminated by fine particles, metal contaminants, organic contaminants, etc. These contaminants reduce the quality of the substrate and also cause physical defects and characteristic deterioration of the semiconductor device, ultimately reducing the production yield of the semiconductor device. Therefore, a wet cleaning process using deionized water or an etching solution (such as an acid or alkaline solution) is performed to remove the contaminants attached to the surface of the substrate.
[0004] The wet cleaning process is divided into a single wafer cleaning process that cleans substrates one by one and a batch cleaning process that cleans all substrates at once.
[0005] The batch type substrate cleaning apparatus may clean the surfaces of the substrates by immersing a plurality of substrates in a cleaning tank filled with a cleaning solution for a certain period of time and generating ultrasonic waves in the cleaning solution.
[0006] Contaminants such as particles, organic matter, and metal contaminants present on the surface of the substrate may be removed by chemical reaction using a suitable cleaning solution such as Standard Clean-1 (SC1), Standard Clean-2 (SC2), or phosphoric acid.
[0007] Furthermore, contaminants on the surface of the substrate can also be removed more effectively by ultrasonic vibration propagating through the cleaning solution, and wet etching can be performed to remove an oxide film or a nitride film formed on the surface of the substrate.
[0008] According to the wafer cleaning equipment disclosed in Korean Patent Publication No. 2012-0127783 (filed on May 16, 2011), the wafer cleaning equipment includes: a gas spraying part, which sprays a cleaning gas onto the wafer; a gas recovery part, which faces the gas spraying part, and the wafer is between the gas spraying part and the gas recovery part; and a rotary drive, which rotates the wafer.
[0009] The rotary drive is in direct contact with the edge of the wafer, and the rotary drive includes a groove into which the edge of the wafer is inserted. Summary of the invention
[0010] Technical issues
[0011] The embodiments are intended to provide an apparatus and method for cleaning a substrate, which can rotate a substrate supported on a comb member by a set angle during ultrasonic cleaning, so that even when a simple structure is set inside a cleaning tank, ultrasonic waves can be uniformly emitted over the entire substrate without dead zones.
[0012] Technical Solution
[0013] According to one aspect of the embodiment, there is provided an apparatus for cleaning a substrate, the apparatus comprising: a cleaning tank containing a plurality of substrates and a cleaning solution; a megasonic generator disposed below the cleaning tank and emitting ultrasonic waves toward the substrates during a cleaning time (t); a first side arm and a second side arm, the first side arm and the second side arm being disposed on both sides of the interior of the cleaning tank; a plurality of first side comb members and a plurality of second side comb members, the plurality of first side comb members and the plurality of second side comb members being disposed below the first side arm and the second side arm, and the plurality of first side comb members and the plurality of second side comb members supporting both sides of the lower portion of the substrate; a central arm disposed at the center of the interior of the cleaning tank; a plurality of central comb members, the plurality of central comb members being disposed below the central arm, and the plurality of central comb members supporting the center of the lower portion of the substrate; and a driving unit configured to move or swing the central arm upward / downward relative to the center of the substrate during the cleaning time (t).
[0014] According to one aspect of the embodiment, the first side arm and the second side arm may include: a pair of vertical portions, which are vertically arranged at positions corresponding to the edges of both sides of the substrate; and a pair of inclined portions, which are arranged at lower ends of the vertical portions at an inward and downward angle, wherein the first side comb member and the second side comb member may be arranged on the inclined portions with regular gaps.
[0015] According to one aspect of the embodiment, the central arm may be arranged to vertically span the center of the substrate, and the central arm may be movable or swung upward / downward relative to a driving point coinciding with the center of the substrate.
[0016] According to an aspect of the embodiment, the central comb-like member may be provided with at least three or more central comb-like members, and each of the first side comb-like member and the second side comb-like member may be provided with at least two side comb-like members.
[0017] According to an aspect of the embodiment, the driving unit may be configured to swing the central arm within 45° relative to the center of the substrate.
[0018] According to an aspect of the embodiment, the driving unit may be configured to move the central arm upward / downward relative to the center of the substrate by at least the diameter of the central comb piece or the diameters of the first and second side comb pieces.
[0019] According to an aspect of the embodiment, the driving unit may be configured to repeat a process of moving the central arm upward and rotating in a forward direction and moving the central arm downward and rotating in a reverse direction to rotate the substrate by a set angle.
[0020] According to an aspect of the embodiment, when the driving unit moves the central arm upward by a predetermined gap, the central comb-shaped member may contact the substrate, and the first side comb-shaped member and the second side comb-shaped member may not contact the substrate.
[0021] According to an aspect of the embodiment, when the driving unit moves the central arm downward by a predetermined gap, the central comb member does not contact the substrate, and the first side comb member and the second side comb member contact the substrate.
[0022] According to another aspect of the embodiment, a method for cleaning substrates is provided, the method comprising: a first operation, in which a plurality of substrates are loaded into a cleaning tank containing a cleaning solution, and both sides of the lower portion of the substrates are supported by a plurality of first side comb members and a second side comb member disposed below a first side arm and a second side arm; a second operation, after the first operation, emitting ultrasonic waves toward the substrates loaded into the cleaning tank for a cleaning time (t); a third operation, when a central arm arranged between the first side arm and the second side arm moves upward / downward or swings relative to the center of the substrate during the second operation, causing a plurality of central comb members disposed below the central arm to rotate the substrate by a set angle; and a fourth operation, after the second operation, unloading the substrate from the cleaning tank.
[0023] According to another aspect of the embodiment, in a first operation, the center arm may be arranged vertically across the center of the substrate, the center comb may be maintained in a state of not contacting the lower portion of the substrate, and the first side comb and the second side comb may be maintained in a state of contacting both sides of the lower portion of the substrate.
[0024] According to another aspect of the embodiment, the third operation may include a process of moving or swinging the center arm upward / downward relative to a driving point coincident with the center of the substrate.
[0025] According to another aspect of the embodiment, the third operation may include a process in which an edge of the substrate is supported by at least three center comb members or at least two first side comb members and a second side comb member.
[0026] According to another aspect of the embodiment, the third operation may include a process of swinging the central arm within 45° relative to the center of the substrate.
[0027] According to another aspect of the embodiment, the third operation may include a process of moving the center arm upward / downward relative to the center of the substrate by at least the diameter of the center comb or the diameters of the first and second side combs.
[0028] According to another aspect of the embodiment, the third operation may include: a first process of rotating the central arm in a reverse direction by half of a set angle, a second process of moving the central arm upward after the first process, a third process of rotating the central arm in a forward direction by a set angle after the second process, a fourth process of moving the central arm downward after the third process, and a fifth process of rotating the central arm in a reverse direction by a set angle after the fourth process.
[0029] According to another aspect of the embodiment, the third operation may include repeating the second process, the third process, the fourth process, and the fifth process until the cleaning time (t) is completed.
[0030] According to another aspect of the embodiment, in the first process, the fourth process, and the fifth process, in a state where the center arm is lowered, the center comb member does not contact the substrate, and the first side comb member and the second side comb member contact the substrate.
[0031] According to another aspect of the embodiment, when the second process and the third process are performed, in a state where the central arm is raised, the central comb-shaped member may contact the substrate, and the first side comb-shaped member and the second side comb-shaped member may not contact the substrate.
[0032] According to another aspect of the embodiment, the fourth operation may include a process of rotating the center arm in a reverse direction by half of a set angle after the fourth process, and when the process is performed, when the center arm is lowered, the center comb member will not contact the substrate, and the first side comb member and the second side comb member will contact the substrate.
[0033] Beneficial Effects
[0034] According to an embodiment, the substrate is supported by a first side comb and a second side comb arranged on a first side arm and a second side arm, and a driving axis of a central arm coincident with the center of the substrate moves upward / downward or swings, so that the central comb arranged on the central arm rotates the substrate by a set angle.
[0035] Therefore, even when a simple structure is set inside the cleaning tank, the substrate supported on the comb-shaped member can be rotated by a set angle during ultrasonic cleaning. Therefore, ultrasonic waves can be uniformly emitted over the entire substrate without dead zones, thereby enabling uniform cleaning of the substrate. In addition, since upward / downward movement and swinging can be performed at a single driving point, the equipment and control can be simplified, and the cleaning performance can be improved by minimizing the contamination source inside the cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] Figure 1 is a diagram schematically showing an apparatus for cleaning a substrate according to an embodiment.
[0037] 2A to 2F are diagrams illustrating operating states of an apparatus for cleaning a substrate according to an embodiment.
[0038] Figure 3 is a flow chart illustrating a method for cleaning a substrate according to an embodiment.
[0039] Figure 4 is shown in more detail Figure 3 Flow chart of operation S3. DETAILED DESCRIPTION
[0040] Hereinafter, the present embodiment will be described in detail with reference to the accompanying drawings.
[0041] Figure 1 is a diagram schematically showing an apparatus for cleaning a substrate according to an embodiment.
[0042] In an embodiment, an apparatus for cleaning a substrate includes a cleaning tank (B), a megasonic generator (M) disposed below the cleaning tank (B), a first side arm (110) and a second side arm (120) disposed inside the cleaning tank (B), a plurality of first side comb members (130) and a second side comb member (140) disposed below the first side arm (110) and the second side arm (120), a central arm (150) disposed between the first side arm (110) and the second side arm (120), a central comb member (160) disposed below the central arm (150), and a driving unit (not shown) that moves or swings the central arm (150) upward / downward relative to the center of the substrate (W).
[0043] The cleaning tank (B) may have a tank shape with an open top surface, and the cleaning tank may contain a cleaning solution for cleaning the substrate. The cleaning solution contained in the cleaning tank (B) may overflow to the upper side of the cleaning tank (B), and contaminants including particles (particles contained in the cleaning solution overflowing from the cleaning tank (B)) may be removed from the cleaning solution, and then the cleaning solution may be supplied back to the cleaning tank (B).
[0044] The substrate (W) may include a Si substrate, a SiC substrate, a GaN substrate, or a sapphire substrate, all of which have a disc shape, but the present disclosure is not limited thereto. The cleaning solution may vary depending on the type of substrate. The cleaning solution may be an etching solution, such as an acid or alkaline solution, deionized water (DIW) or SC1 (DIW+H2O2+NH4OH) from which various impurities have been removed, but the present disclosure is not limited thereto. The cleaning tank (B) may be made of a material such as quartz or sapphire, which is resistant to corrosion by the cleaning solution and also transmits ultrasonic waves generated by the megasonic generator (M) described below.
[0045] The megasonic generator (M) may be arranged at the outside below the cleaning tank (B), and the megasonic generator may generate ultrasonic waves toward the substrate (W) arranged inside the cleaning tank. The ultrasonic waves generated from the megasonic generator (M) may generate vibrations of the cleaning solution passing through the inside of the cleaning tank (B), and the vibrations of the cleaning solution may remove contamination sources (such as particles) attached to the surface of the substrate (W).
[0046] Of course, the vibration of the ultrasonic wave generated from the megasonic wave generator (M) does not propagate to some surfaces of the substrate (W) through the first side comb member (130), the second side comb member (140) and the center comb member (160). However, since the center arm (150) to be described below is moved or swung upward / downward relative to the center of the substrate by a driving unit (not shown), thereby rotating the substrate (W) by a predetermined angle, the entire surface of the substrate (W) can be cleaned uniformly, which will be described in detail below.
[0047] The substrate (W) is arranged in an upright state with a predetermined gap in the front-rear direction. Both sides of the lower portion of the substrate (W) can be supported by the first side arm (110) and the second side arm (120) and the first side comb member (130) and the second side comb member (140).
[0048] The first side arm (110) and the second side arm (120) may be arranged on both sides inside the cleaning tank (B), and the first side arm and the second side arm may be respectively disposed at the front and rear of the substrate (W). The first side arm (110) and the second side arm (120) may respectively include vertical portions (111) and (121) and inclined portions (112) and (122), the vertical portions being vertically arranged at positions corresponding to the edges of both sides of the substrate (W), and the inclined portions being arranged at the lower ends of the vertical portions (111) and (121) to be inclined downward in an inward direction. When the lower portions of the first side arm (110) and the second side arm (120) are configured to be inclined, the area can be minimized, thereby reducing the pollution source.
[0049] The first side comb piece (130) and the second side comb piece (140) may be respectively arranged on the inclined portions (112) and (122) of the first side arm and the second side arm at a predetermined gap along the circumferential direction of the substrate (W), and the first side comb piece and the second side comb piece may be arranged to intersect with the front-to-back direction of the substrate (W). The first side comb piece (130) and the second side comb piece (140) may be provided with a plurality of slits spaced apart at a predetermined gap along the front-to-back direction so that both sides of the lower portion of the substrate (W) may be located on the top surface of the substrate. In order to stably support the substrate (W), it is preferred that at least two first side comb pieces (130) and second side comb pieces (140) are arranged on each of the first side arm (110) and the second side arm (120). Considering the movement range of the center comb member (160) to be described below, it is preferred that the first side comb member (130) and the second side comb member (140) are disposed to maintain a gap of at least 100° or more relative to the center of the substrate (W).
[0050] During the ultrasonic cleaning process, the substrate (W) is rotated by a set angle. The substrate (W) can be rotated by the central arm (150) and the central comb (160).
[0051] The central arm (150) may be arranged at the center inside the cleaning tank (B), that is, between the first side arm (110) and the second side arm (120), and the central arm may be set at the front and rear of the substrate (W). The central arm (150) may be arranged vertically across the center of the substrate (W), and the central arm may have a driving shaft (151) that coincides with the center of the substrate (W). The driving shaft (151) of the central arm is a driving point connected to a driving unit (not shown), and the driving shaft of the central arm may enable the central arm (150) to move up / down or swing relative to the driving shaft (151) of the central arm.
[0052] The central comb-shaped member (160) may be disposed below the central arm (150) with a predetermined gap in the circumferential direction of the substrate (W), and the central comb-shaped member may be disposed to intersect the front-to-back direction of the substrate (W). Similar to the first side comb-shaped member (130) and the second side comb-shaped member (140), the central comb-shaped member (160) may also be disposed so that a plurality of slits where the center of the lower portion of the substrate (W) is located are disposed on the top surface of the substrate with a predetermined gap in the front-to-back direction. In order to stably support the substrate (W), it is preferred that at least three central comb-shaped members (160) are disposed on the central arm (150).
[0053] The driving unit (not shown) may be configured to move or swing the central arm (150) upward / downward relative to the driving shaft (151) of the central arm. Since the driving unit (not shown) may be variously configured, a detailed description thereof is omitted.
[0054] However, the driving unit (not shown) can rotate the central comb member (160) in a forward direction and a reverse direction within 45° relative to the center of the substrate (W) by swinging the central arm (150) within 45° relative to the driving axis (151) of the central arm.
[0055] In addition, a driving unit (not shown) moves the center arm (150) upward / downward relative to the driving shaft (151) of the center arm by at least the diameter of the first side comb member (130) and the second side comb member (140) or the diameter of the center comb member (160) (i.e., 10 mm or more), so that the substrate (W) can selectively contact or not contact the first side comb member (130), the second side comb member (140) and the center comb member (160).
[0056] 2A to 2F are diagrams illustrating operating states of an apparatus for cleaning a substrate according to an embodiment.
[0057] As shown in FIG. 2A , when a substrate (W) is loaded into a cleaning tank (B) containing a cleaning solution, both sides of the lower portion of the substrate (W) are supported by the first side comb member (130) and the second side comb member (140), but the center of the lower portion of the substrate (W) is maintained in a state of being spaced apart from the center comb member (160).
[0058] When the megasonic generator (M) operates and emits ultrasonic waves toward the substrate (W), foreign matter attached to the surface of the substrate (W) is removed by ultrasonic vibration, and the process of rotating the substrate (W) by a set angle (a) is repeated during ultrasonic cleaning.
[0059] As shown in FIG. 2B , when the driving shaft (151) of the center arm rotates 15° in the reverse direction and then moves upward by 10 mm or more as shown in FIG. 2C , the substrate (W) is not supported by the first side comb member (130) and the second side comb member (140), but is supported by the center comb member (160).
[0060] Next, as shown in FIG. 2D , when the driving shaft ( 151 ) of the center arm rotates 30° in the forward direction and then moves downward by 10 mm or more as shown in FIG. 2E , the substrate (W) is supported by the first side comb member ( 130 ) and the second side comb member ( 140 ) instead of the center comb member ( 160 ).
[0061] Next, as shown in FIG. 2F , when the driving shaft ( 151 ) of the center arm rotates 30° in the reverse direction and then moves upward by 10 mm or more as shown in FIG. 2C , the substrate (W) is not supported by the first side comb member ( 130 ) and the second side comb member ( 140 ), but is supported by the center comb member ( 160 ).
[0062] By repeating the process shown in FIG. 2C to FIG. 2F during ultrasonic cleaning, the substrate (W) supported by the first side comb member (130) and the second side comb member (140) can be rotated 30° each time. Therefore, a dead zone where ultrasonic waves are not emitted can be eliminated, and the surface of the substrate (W) can be uniformly cleaned.
[0063] When the ultrasonic cleaning is completed, the process proceeds to FIG. 2, and then, as shown in FIG. 2G, the driving shaft (151) of the central arm rotates 15° in the reverse direction to restore to the initial position, and the substrate (W) is unloaded from the cleaning tank (B).
[0064] Figure 3 is a flow chart showing a method for cleaning a substrate according to an embodiment, Figure 4 is shown in more detail Figure 3 Flow chart of operation S3.
[0065] First, the substrate is loaded into a cleaning tank containing a cleaning solution. (See S1)
[0066] Both sides of the lower portion of the substrate are supported by the first and second side comb members, but the center of the lower portion of the substrate is maintained in a state of being spaced apart from the center comb member.Since the cleaning solution is contained in the cleaning tank, the cleaning solution may etch the surface of the substrate.
[0067] Next, the megasonic generator emits ultrasonic waves into the cleaning tank. (See S2)
[0068] The ultrasonic wave passes through the cleaning tank, vibrates the cleaning solution, and removes foreign matter attached to the surface of the substrate. Of course, the ultrasonic wave will not propagate to the part supported by the first side comb-shaped member and the second side comb-shaped member, thereby forming a dead zone.
[0069] Next, during the cleaning time (t), the substrate is rotated by a set angle (a). (See S3 and S4)
[0070] Specifically, the driving axis of the central arm coincident with the center of the substrate rotates in the reverse direction by half of the set angle (a). (See S31) The substrate (W) is supported by the first side comb and the second side comb, but not by the central comb. Before rotating the substrate, the central comb can be positioned at one side of the lower part of the substrate.
[0071] Next, the driving shaft of the central arm is moved upward by a set height (h) or more. (See S32) The substrate (W) is not supported by the first side comb and the second side comb, but by the central comb. In order to rotate the substrate, the central comb can be supported on one side of the lower part of the substrate.
[0072] Next, the driving shaft of the central arm rotates in the forward direction by a set angle (a). (See S33) The central comb member can move one side of the lower portion of the substrate to the other side and rotate the substrate by a set angle (a).
[0073] Next, the driving shaft of the central arm is moved downward by a set height (h) or more, and then the driving shaft of the central arm is rotated in the reverse direction by a set angle (a). (See S34 and S35) The substrate (W) is supported by the first side comb and the second side comb, but not by the central comb. Before the substrate is rotated, the central comb may be positioned at one side of the lower portion of the substrate.
[0074] While ultrasonic cleaning is being performed, by repeating processes S32 to S35, the substrate (W) supported by the first side comb member and the second side comb member can be rotated a set angle (a) each time, thereby eliminating a dead zone where ultrasonic waves are not emitted and uniformly cleaning the surface of the substrate (W).
[0075] Next, after the cleaning time (t) has passed, the substrate is unloaded from the cleaning tank. (See S5)
[0076] The above description is merely an example of the technical idea of the present disclosure, and those skilled in the art will appreciate that various modifications and changes may be made without departing from the basic features of the present disclosure.
[0077] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical idea of the present disclosure but are intended to explain the present disclosure, and the scope of the technical idea of the present disclosure is not limited by the embodiments.
[0078] The protection scope of the present disclosure should be interpreted by the appended claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the right scope of the present disclosure.
[0079] Industrial Applicability
[0080] This embodiment is suitable for cleaning contaminants attached to the surface during the process of manufacturing a semiconductor substrate.
Claims
1. A device for cleaning a substrate, the device comprising: a cleaning tank comprising a plurality of substrates and a cleaning solution; a megasonic generator disposed below the cleaning tank and emitting ultrasonic waves toward the substrate during a cleaning time (t); a first side arm and a second side arm, wherein the first side arm and the second side arm are arranged on both sides of the interior of the cleaning tank; a plurality of first side comb members and a plurality of second side comb members, the plurality of first side comb members and the plurality of second side comb members being disposed below the first side arm and the second side arm, and the plurality of first side comb members and the plurality of second side comb members supporting both sides of the lower portion of the substrate; a central arm disposed at the center of the interior of the cleaning tank; a plurality of center combs disposed below the center arm and supporting the center of the lower portion of the substrate; A driving unit configured to move or swing the central arm upward / downward relative to the center of the substrate during the cleaning time (t).
2. The device according to claim 1, wherein: The first side arm and the second side arm include: a pair of vertical portions, the pair of vertical portions being vertically arranged at positions corresponding to edges of both sides of the substrate; and a pair of inclined portions, the pair of inclined portions being arranged at lower ends of the vertical portion at an inward and downward angle, Wherein, the first side comb-shaped members and the second side comb-shaped members are arranged on the inclined portion with regular gaps.
3. The device according to claim 1, wherein: The central arm is arranged to vertically span the center of the substrate, and the central arm moves or swings upward / downward relative to a driving point coinciding with the center of the substrate.
4. The device according to claim 1, wherein: The central comb-shaped member is provided with at least three or more central comb-shaped members, and each of the first side comb-shaped member and the second side comb-shaped member is provided with at least two side comb-shaped members.
5. The device according to claim 1, wherein: The driving unit is configured to swing the central arm within 45° relative to the center of the substrate.
6. The device according to claim 1, wherein: The driving unit is configured to move the central arm upward / downward relative to the center of the substrate by at least a diameter of the central comb member or diameters of the first and second side comb members.
7. The device according to claim 1, wherein: The driving unit is configured to repeat a process of moving the central arm upward and rotating in a forward direction and moving the central arm downward and rotating in a reverse direction to rotate the substrate by a set angle.
8. The device according to claim 6, wherein: When the driving unit moves the center arm upward by a predetermined gap, the center comb-shaped member contacts the substrate, and the first side comb-shaped member and the second side comb-shaped member do not contact the substrate.
9. The device according to claim 6, wherein: When the driving unit moves the central arm downward by a predetermined gap, the central comb-shaped member is not in contact with the substrate, and the first side comb-shaped member and the second side comb-shaped member are in contact with the substrate.
10. A method for cleaning a substrate, the method comprising: a first operation in which a plurality of substrates are loaded into a cleaning tank containing a cleaning solution, and both sides of lower portions of the substrates are supported by a plurality of first and second side comb members disposed below a first side arm and a second side arm; a second operation of emitting ultrasonic waves toward the substrate loaded into the cleaning tank for a cleaning time (t) after the first operation; a third operation, when the central arm disposed between the first side arm and the second side arm moves or swings upward / downward relative to the center of the substrate during the second operation, causing a plurality of central comb members disposed below the central arm to rotate the substrate by a set angle; as well as A fourth operation, after the second operation, is to unload the substrate from the cleaning tank.
11. The method according to claim 10, wherein: In the first operation, the center arm is arranged vertically across the center of the substrate, the center comb is maintained in a state of not contacting the lower portion of the substrate, and the first side comb and the second side comb are maintained in a state of contacting both sides of the lower portion of the substrate.
12. The method according to claim 10, wherein: The third operation includes a process of moving or swinging the central arm upward / downward relative to a driving point coincident with the center of the substrate.
13. The method according to claim 12, wherein: The third operation includes a process in which the edge of the substrate is supported by at least three central comb members or at least two first side comb members and a second side comb member.
14. The method according to claim 12, wherein: The third operation includes a process of swinging the central arm within 45° relative to the center of the substrate.
15. The method according to claim 12, wherein: The third operation includes a process of moving the center arm upward / downward relative to the center of the substrate by at least the diameter of the center comb member or the diameters of the first and second side comb members.
16. The method according to claim 12, wherein: The third operation includes: A first process of rotating the central arm in a reverse direction by half of a set angle; a second process of moving the central arm upward after the first process; a third process of rotating the central arm in a forward direction by a set angle after the second process; a fourth process of moving the central arm downward after the third process; and A fifth process is performed to rotate the central arm in a reverse direction by a set angle after the fourth process.
17. The method according to claim 16, wherein: The third operation includes repeating the second process, the third process, the fourth process, and the fifth process until the cleaning time (t) is completed.
18. The method according to claim 16, wherein: In the first process, the fourth process, and the fifth process, in a state in which the center arm is lowered, the center comb member is not in contact with the substrate, and the first side comb member and the second side comb member are in contact with the substrate.
19. The method according to claim 16, wherein: When the second process and the third process are performed, in a state in which the center arm is raised, the center comb-shaped member is in contact with the substrate, and the first side comb-shaped member and the second side comb-shaped member are not in contact with the substrate.
20. The method according to claim 16, wherein: The fourth operation includes a process of rotating the central arm in a reverse direction by half of a set angle after the fourth process, and When the process is performed, in a state where the central arm is lowered, the central comb member is not in contact with the substrate, and the first side comb member and the second side comb member are in contact with the substrate.