Immersion tank cooling apparatus with electronic hardware for different on-board heat generating electronic components

Abstract

A liquid cooling apparatus and system for immersion cooling of electronic devices, particularly including a server and other IT hardware nodes with an array of heat generating devices including microprocessors, RAMs, mainboards, etc. with different operating temperatures. The apparatus and system are adapted for at least series-connected cooling liquid streams in direct contact with different heat generating devices, providing multi-stage heat transfer stages, improving energy efficiency and operational control and performance of electronic devices.

Description

Technical Field

[0001] The present concept relates to a liquid cooling system for effectively and efficiently cooling heat-generating electronic components, and particularly, but not exclusively, to a liquid cooling system for cooling IT components, servers, computing electronic devices, etc. by directly immersing these components and equipment in a dielectric cooling liquid coolant. Background Art

[0002] Due to the continuous development of smaller, faster, higher density and higher power capacity electronic devices, cooling of electronic devices, especially IT components, servers, data storage devices and computing electronics with graphics and central processing units (GPUs and CPUs) has become a major technical challenge.

[0003] Computing devices generate heat during operation. With tens of thousands of these devices in a data center, the heat generated can be very high. As the demand for greater processing and data storage continues to expand, the density of server systems continues to increase, and the resulting heat dissipation becomes a significant practical obstacle.

[0004] Conventional fan-based cooling systems require large amounts of electricity. As a result, the power requirements to drive such systems increase significantly as server density increases. Immersion cooling of IT components is a relatively recent development. Operating hot electronic devices are directly immersed in a dielectric (electrically insulating) cooling liquid that is circulated and cooled through the use of a heat exchanger, for example. Cooling of electronic devices improves their performance efficiency, enabling higher processing speeds (e.g., overclocking of CPUs). Heat generated by the circuits is quickly and efficiently removed directly at the heat source by the dielectric liquid. However, there is an overall need to continue to improve the operating efficiency of existing liquid immersion cooling systems, both to improve the cooling efficiency of electronic components and to improve the thermal management and circulation of the cooling liquid to achieve efficient energy reuse. Summary of the invention

[0005] One object of the present disclosure is to provide an apparatus and method for accurate and efficient liquid cooling of electronic equipment. A specific object is to provide an electronic component liquid cooling system to enable IT components and the like to operate at high temperatures. Another specific object is to provide a refrigeration system to maximize the operating temperature of the dielectric liquid, which is due to heat transfer with the electronic components for subsequent energy reuse. Another specific object is to provide a system that allows the dielectric liquid to flow out at a uniform / constant temperature (after heat transfer with the electronic components). This configuration maximizes the efficiency and effectiveness of thermal energy transfer using a suitable heat exchanger or similar device to achieve thermal energy reuse.

[0006] The present system provides a liquid immersion / submersion arrangement in which IT electronic components are spatially separated / isolated based on their operating temperature and effective power consumption. Specifically, the present system is configured to cool the electronic components via direct contact and circulation with a refrigerant liquid to provide a single liquid refrigeration system for cooling each electronic component individually and / or independently of each other as needed based on the operating performance, type, operating temperature, size and / or configuration of the electronic component.

[0007] "Electronic components", "electronic devices", or similar components mentioned in this specification include heat-generating electronic components, such as those installed on larger IT components / equipment, such as servers, motherboards, data storage devices, programmable logic controller boards, etc. Such heat-generating electronic components include, for example, circuits and / or electronic devices located on motherboards or other printed circuit board devices, random access memory (RAM); graphics processing units (GPUs); central processing units (CPUs); chips, sockets; peripheral component interconnect standard (PCI) slots; read-only memory (ROM) components, chips and slots; graphics processing components, ports, slots, chips; bridges; battery components, ports and slots; power plugs, slots and ports, electronic connectors; electronic heat sinks; switches; jumpers; capacitors; transistors; diodes; components related to operating power; current and / or voltage regulators and modules; power converters, etc.

[0008] The present system is configured to deliver coolant liquid to heat generating electronic devices based on typical, normal, average, or maximum operating temperatures of the heat generating electronic devices according to a variety of different possible liquid flow circuit configurations. For example, the present system is compatible with series, parallel, and / or a combination of series and parallel liquid flow configurations based on the spatial positioning of the electronic components according to the typical, normal, average, and / or maximum operating temperatures of the electronic components. Thus, the present system provides an outflow liquid flow at a maximum outflow temperature and a constant / uniform temperature over time. The heated dielectric liquid can then be efficiently and effectively processed for thermal reuse via a heat exchanger or the like, wherein thermal energy is transferred from the dielectric liquid to an auxiliary application or device requiring a temporary or continuous supply of thermal energy.

[0009] The outflow of dielectric liquid heated to a maximum and uniform operating temperature (over time) provides an efficient and effective heat source for heat reuse technology. This is achieved by spatially separating / isolating the heat generating devices based on their respective operating temperatures. Specifically, at least one, and in particular a group of, first heat generating electronic components can be separated and located in a first area or chamber of the device for initial contact with the dielectric liquid. At least one second element or a group of additional heat generating electronic components (having a higher operating temperature than the first electronic device) can be located in an isolated or separated area (or enclosure) of the system / device for separation and / or subsequent contact with the dielectric liquid. This arrangement allows the dielectric liquid to be retained to directly contact the first heat generating electronic component and then directly contact the second heat generating electronic component, so that the temperature of the dielectric liquid output in the outflow area of ​​the device is the sum of the temperature increases of the liquid that has been in contact with the electronic devices in all spatially isolated areas.

[0010] In one aspect, the system includes a package (or lid) positionable to (at least partially) surround an electronic device (e.g., CPU / GPU). The package can be mounted above the chip (with or without a heat sink) or on top of the chip (e.g., cold plate technology). A coolant is then configured to flow through each package area to capture all heat generated by the electronic device. This arrangement enables the electronic device (CPU / GPU) to operate at its optimal or typical operating temperature independent of overclocking mode, while also allowing the temperature of the outflow flow of cooling liquid to be high and remain uniform over time to improve energy reuse.

[0011] On the one hand, the system provides for isolating submerged heat generating devices according to their operating temperature ranges so that all submerged heat generating devices are in contact with different portions of a cooling fluid within a fluid container at a given time. The fluid within the container is driven to a cooling device where it is cooled in preparation for being driven into the container again, thereby effectively cooling the submerged heat generating devices in series. The fluid can be driven through the system in such a way that it first contacts the isolated heat generating devices having the lowest operating temperature. The partially heated fluid is then driven into contact with the next group of isolated heat generating devices having the second lowest operating temperature, where its temperature can be further increased. This process is repeated until a group of isolated heat generating devices having the highest operating temperature is in contact with the dielectric liquid, which is then driven to a cooling device (i.e., a heat exchanger).

[0012] According to a first aspect of the present concept, there is provided a liquid cooling device for an electronic device, comprising: a main housing defining a chamber to accommodate at least one electronic device having at least one heat-generating electronic component; at least one liquid flow inlet and at least one liquid flow outlet, disposed at the housing to allow a dielectric cooling liquid flow to enter and leave the chamber in direct contact with the electronic device; a second housing, located within the chamber, defining an enclosure to at least partially accommodate the at least one heat-generating electronic component of the device; at least one liquid flow inlet and at least one liquid flow outlet, disposed at the second housing to allow the liquid flow to enter and leave the enclosure in direct contact with the heat-generating electronic component; and a cooling unit, fluidically connected to at least one of the inlets and at least one of the outlets, forming part of a fluid flow network to transfer thermal energy from the liquid.

[0013] Preferably, the at least one outlet of the main housing is connected in fluid communication with the at least one inlet of the second housing such that the liquid is arranged to flow through the chamber and then through the enclosure.

[0014] Preferably, the electronic device comprises: at least one first heat generating electronic component, which is at least partially contained in the chamber and is used to be immersed in the liquid in the chamber; and at least one second heat generating electronic component, which is at least partially contained in the enclosure and is used to be immersed in the liquid in the enclosure. Optionally, the second heat generating electronic component can have a higher operating temperature than the first heat generating electronic component.

[0015] The first heat generating electronic components mentioned in this specification include relatively low heat generating devices / components (LHGA), such as RAM, motherboard, etc. Similarly, the second heat generating electronic components mentioned in this article include relatively high heat generating components (HHGD), such as microprocessors, CPUs, GPUs, etc. The first and second heat generating electronic components are distinguished in this article by their relative normal, typical, standard and / or maximum operating temperatures. This is the heat energy generated by such a device during use and / or the heat energy as described in detail in the electronic component data sheet, database, etc. Therefore, the low heat generating component / device generally includes a normal, typical, standard and / or maximum operating temperature lower than the high heat generating component / device. In certain specific implementations, the low heat generating component / device can be configured to generate less than 200W of heat under normal or typical operation. In addition, in certain specific implementations, the high heat generating component / device can be configured to generate more than 200W of heat under normal or typical operation. However, these values ​​are for reference only, and those skilled in the art will understand that the 200W value applied to LGHD and HHGD herein may vary depending on the type of electronic component.

[0016] Preferably, at least one outlet of the second housing is connected in fluid communication with an inlet of a cooling unit, and the outlet of the cooling unit is connected in fluid communication with at least one inlet of the main housing. Optionally, the chamber is connected in series fluid communication with the enclosure.

[0017] Preferably, the device comprises at least one electronically controllable valve arranged to be fluidically connected to the inlet and / or the outlet of the main housing and / or the second housing; and a control unit to control the valve and the liquid flow to enter and leave the main housing and / or the second housing via the respective inlet and outlet.

[0018] Optionally, the control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic element, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic element, the second heat energy exchange being a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increase of the liquid that has passed through the chamber and the enclosure. The control unit may include one or more electronic control units, modules or devices, which may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, a server, a printed circuit board, a motherboard or other similar devices. The control unit may include a sensor, the sensor including at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or a magnet sensor. The control unit may include at least one control valve, which may include a solenoid valve, a diaphragm valve, a multi-way valve controlled by a pilot valve, and combinations thereof. The control unit may be located locally or remotely in the system and device for local and / or remote control of the device. The control unit may be operated via a cloud network, wireless or wired communication paths and associated elements.

[0019] Preferably, the main housing comprises a liquid immersion tank. Preferably, the at least one second housing is smaller in size than the main housing and is located within the chamber. Optionally, the device comprises a plurality of second housings (referred to herein alternatively as enclosures) which may be positioned not in series and / or in parallel with each other. Thus, the liquid may be configured to flow through the chamber according to a first path, then through at least one enclosure via a second path in series, and then through another enclosure in series with the first enclosure. Each enclosure may comprise the same or different heat generating electronic components having the same or different operating temperatures. When the enclosures are connected in parallel, the liquid supply may be divided / divided into separate streams flowing into each of the respective enclosures in parallel. The isolated parallel flow streams may then be merged into a single flow stream after flowing through the enclosures (in the direction of fluid flow).

[0020] Optionally, the system may include a plurality of enclosures defined by respective second shells, each of which encloses a respective heat generating electronic component disposed at the electronic device; the plurality of enclosures being arranged in parallel and / or in series along the direction of fluid flow. Optionally, the respective heat generating electronic components comprise substantially the same operating temperature or comprise different operating temperatures arranged in the respective second shells in an order of increasing operating temperatures. Optionally, the liquid is capable of flowing through the respective second shells in parallel or in series contact with the respective heat generating electronic components. Preferably, the main shell comprises an immersion tank or tank, and the second shell comprises at least one second shell, cover, container, pocket or sub-chamber to respectively accommodate different heat generating electronic components, which are spatially separated relative to the larger main shell, thereby allowing separated / isolated liquid flows to contact different (groups of) electronic devices. Optionally, the second shell may be exclusively and / or completely contained within the main shell.

[0021] The apparatus typically includes a dielectric cooling liquid contained within the chamber of the main housing, and wherein the second housing is at least partially immersed or completely immersed in the liquid within the chamber of the main housing. The dielectric cooling liquid may be a type of liquid suitable for immersion cooling of IT components, having suitable electrical insulating properties, providing safe direct contact with live electronic components, and importantly, having no liquid electrical conductivity.

[0022] Optionally, at least a portion of the second heat generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing, and / or at least a portion of the first heat generating electronic component is positioned in direct contact with the liquid within the chamber.

[0023] Optionally, the electronic device may include any one or a combination of the following: a computer entity; a server; a mainboard; a printed circuit board including a plurality of electronic components. Optionally, the first heat generating electronic component and / or the second heat generating electronic component include any one or a combination of the following: a mainboard; a random access memory (RAM); a graphics processing unit (GPU); a central processing unit (CPU).

[0024] Optionally, the inlet of the second shell is defined at least by the periphery of an opening through which the second shell can be positioned to receive and wrap the heat-generating electronic component at the enclosure. Optionally, the inlet and outlet of the second shell are separated from each other and / or located in different areas of the second shell. Optionally, the second shell includes an opening to enable the second shell to receive and wrap the heat-generating electronic component at the enclosure, and a top located opposite the opening. Optionally, the inlet of the second shell is located at the top of the second shell. Optionally, the outlet of the second shell is partially defined by the opening. Optionally, the inlet and / or outlet of the second shell are partially defined by the periphery of the opening of the second shell. Optionally, the inlet and / or outlet of the second shell are partially defined by the gap or area between the outer periphery of the electronic component and the area within the periphery of the enclosure in close proximity. Such a gap area can be annular so that liquid flows into and / or out of the enclosure via the space / gap between the electronic component and the wall or body of the second shell.

[0025] Optionally, the second shell is adjustably mounted on the device via an actuator, and the actuator is configured to change the internal volume of the enclosure by actuation. Optionally, the device includes an actuator connected to the second shell to actuate the movement of the second shell, and the actuator is configured to change any of the following or a combination thereof: the internal volume of the enclosure; the position of the enclosure relative to the shell and / or the heat-generating electronic component; the spacing distance between the second shell and the heat-generating electronic component; the extent to which the second shell encapsulates or contains the heat-generating electronic component within the enclosure. The actuator may include an electronic actuator, a magnetic actuator, a pneumatic or hydraulic actuator, a combination of these actuators, and optionally an electromagnetic or electromechanical actuator controlled locally or remotely via a control unit.

[0026] Optionally, the apparatus comprises a pump connected in fluid communication with the inlet and / or the outlet of the second housing to drive the liquid through the enclosure.

[0027] Optionally, the device comprises a first electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the chamber and a second electronically controllable valve connected in fluid communication with the inlet and / or the outlet of the enclosure. Optionally, the device further comprises at least one electronically controllable valve arranged in fluid communication with the inlet and the outlet of the second housing.

[0028] Optionally, the device further comprises at least one temperature sensor to determine the temperature or relative temperature difference of the liquid and / or the heat generating electronic component, the temperature sensor being arranged to communicate electronically with the control unit. Optionally, the electronic device or the first and / or second heat generating electronic component comprises a temperature sensor to determine the temperature or temperature difference of the liquid and the first and / or second heat generating electronic component. Optionally, the device comprises at least one sensor. Optionally, the at least one sensor may comprise at least one of a flow rate, temperature, proximity, motion, current, voltage, pH and / or magnet sensor.

[0029] Optionally, the device comprises a liquid return conduit in fluid communication with the outlet of the chamber and the inlet of the enclosure to circulate the liquid leaving the chamber into the enclosure. Optionally, the device comprises a temporary storage container connected in fluid communication between the outlet of the chamber and the inlet of the enclosure to temporarily store a volume of the liquid for circulation from the chamber to the enclosure. Optionally, the inlet of the chamber comprises a plenum to distribute the flow of the liquid into the chamber.

[0030] Optionally, the cooling unit comprises a heat exchanger to transfer heat energy from the liquid to a heat transfer fluid. Optionally, the heat exchanger comprises a refrigerant fluid configured to circulate within a fluid circuit or network, the fluid circuit or network being isolated from the dielectric liquid, and the dielectric liquid network being configured to flow through the chamber and the enclosure. These exchangers allow transfer of heat energy between the dielectric liquid and the refrigerant fluid, in particular allowing heat energy to be transferred from the dielectric liquid to the refrigerant working fluid.

[0031] Preferably, the outlet of the main housing is connected in fluid communication with an inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the inlet of the second housing.

[0032] Optionally, the device comprises a plurality of second housings, each second housing having a respective inlet and outlet connected in fluid communication with the cooling unit. Optionally, at least some of the second housings are connected in series with each other as part of a liquid flow network including the cooling unit. Optionally, at least some of the second housings are connected in parallel with each other as part of a liquid flow network including the cooling unit.

[0033] Optionally, a dielectric cooling liquid is contained within the chamber and is capable of flowing through the enclosure. Optionally, at least a portion of the electronic device and / or at least a portion of the first heat generating electronic component is located within the chamber and immersed in direct contact with the liquid within the chamber, and at least a portion of the at least one second heat generating electronic component is located within the enclosure and immersed in direct contact with the liquid within the enclosure.

[0034] Optionally, the device includes at least one weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the main housing and / or the second housing. Optionally, the device includes a first weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the second housing. Optionally, the device may include a second weir arrangement, which is arranged to be in fluid communication with the inlet and / or outlet of the main housing. The "weir arrangement" mentioned in the specification includes at least one hole, a partition wall, a flow restriction body, etc., which is configured to at least partially isolate the first volume of liquid from the second volume of liquid, so that the liquid is configured to flow from the first volume to the second volume via a restricted flow path at the weir arrangement. This arrangement includes an overflow or throughflow arrangement. Optionally, the weir arrangement can provide overflow or throughflow under the action of gravity.

[0035] Optionally, the device includes at least one storage container in fluid communication with the chamber to supply and / or receive liquid in the chamber and maintain a predetermined volume of liquid in the chamber. Optionally, the device may include at least one main storage container, which is in fluid communication with at least one of the inlet and outlet of the enclosure / second shell to store liquid as part of the fluid flow network. Optionally, the main storage container includes a pressurizing mechanism to change the pressure of the liquid in the fluid flow network. Optionally, the pressurizing mechanism includes at least one electronically controllable valve to control the volume of liquid in the main storage container and / or the fluid flow network.

[0036] According to another aspect of the present concept, a method of cooling at least a portion of an electronic device is provided, comprising: immersing an electronic device having at least one heat-generating electronic component in a dielectric cooling liquid contained in a chamber defined by a main housing; immersing the heat-generating electronic component in the liquid within an enclosure defined by a second housing located within the chamber; providing a first flow of the liquid flowing through the chamber via at least one inlet and at least one outlet disposed at the main housing; providing a second flow of the liquid flowing through the enclosure via at least one inlet and at least one outlet disposed at the second housing; using a cooling device to cool the liquid heated by the electronic device and / or the heat-generating electronic component, the cooling device forming part of a fluid flow network, the fluid flow network being fluidically connected to at least one of the inlets and at least one of the outlets.

[0037] Optionally, the electronic device includes at least one first heat-generating electronic component and at least one second heat-generating electronic component, the second heat-generating electronic component being capable of reaching or including a higher operating temperature than the first heat-generating electronic component, wherein at least a portion of the second heat-generating electronic component is positioned to be in direct contact with the liquid within the enclosed area defined by the second shell, and / or at least a portion of the first heat-generating electronic component is positioned to be in direct contact with the liquid within the chamber.

[0038] Optionally, the chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

[0039] Optionally, the method includes a plurality of enclosed areas defined by respective second shells, each of the enclosed areas enclosing a respective heat-generating electronic component disposed at the electronic device; wherein the plurality of enclosed areas are connected in series with each other by a liquid flow; and wherein the respective heat-generating electronic components include substantially the same operating temperature or include different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second shells, so that the liquid is configured to flow through the respective enclosed areas and contact the respective heat-generating electronic components in series from relatively low to high operating temperatures.

[0040] Optionally, the liquid is configured to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the liquid is configured to flow from the at least one outlet of the enclosure to a fluid flow network including the cooling unit.

[0041] Optionally, the method includes controlling the liquid flow along a first path through the chamber in direct contact with at least a portion of the first heat-generating electronic component, and then along a second path through the enclosure in direct contact with at least a portion of the second heat-generating electronic component, so that the thermal energy transferred to the liquid is the sum of the thermal energy transferred from the first heat-generating electronic component and from the second heat-generating electronic component.

[0042] Preferably, the method comprises driving the liquid through the chamber and / or the enclosure using a pump. Preferably, the method comprises directing a return flow of the liquid from the outlet of the chamber at the end of the first flow path to the inlet of the enclosure at the start of the second flow path. Preferably, the method comprises directing the flow of the liquid from the outlet of the enclosure to the cooling unit to reduce the temperature of the liquid; and providing a return flow of the liquid cooled by the cooling unit to the inlet of the enclosure.

[0043] Optionally, the method includes temporarily storing the liquid received from the outlet of the chamber at the end of the first flow path in a temperature storage container before the step of directing the return flow of the liquid to the inlet of the enclosure. Optionally, the electronic device includes a plurality of first heat-generating electronic components, each of which is immersed in liquid, and a plurality of second shells, which define respective enclosures to accommodate the heat-generating electronic components. Optionally, the liquid flows through the enclosures in direct contact with the heat-generating electronic components, and some of the enclosures flowed through are in series and / or some of the enclosures flowed through are in parallel.

[0044] According to another aspect of the present concept, there is provided a liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising an apparatus as described and claimed herein; and an electronic device having at least one heat generating electronic component, the device and the heat generating electronic component being respectively immersed in the liquid contained in the chamber defined by the main housing and / or the enclosure defined by the second housing.

[0045] Optionally, the liquid immersion cooling tank comprises: at least one main shell, defining the chamber to accommodate the at least one electronic device having at least one heat-generating electronic component; a plurality of second shells, the plurality of second shells being located within the chamber and defining respective enclosed areas to at least partially accommodate respective heat-generating electronic components of the devices; a plurality of electronic devices, each having at least one heat-generating electronic component, the devices being immersed in the liquid contained within the chamber, and the at least one heat-generating electronic component being immersed in the liquid contained within the respective enclosed areas.

[0046] Optionally, the liquid immersion cooling tank includes a plurality of electronic devices, each of which has a first and a second heat-generating electronic component, the devices and the first heat-generating electronic component are at least partially immersed or completely immersed in the liquid contained in the main shell, and the second heat-generating electronic component is at least partially immersed or completely immersed in the liquid contained in the enclosed area.

[0047] BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Specific implementations of the present invention will now be described by way of example only and with reference to the accompanying drawings, in which:

[0049] Figure 1 is a perspective view of an immersion cooling tank for accommodating a plurality of IT hardware nodes, each of which has a microprocessor array, according to a specific implementation of the present concept;

[0050] Figure 2 Another implementation of the present concept is to install in a vertical arrangement Figure 1 A perspective view of the rack of multiple IT hardware nodes in the system;

[0051] Figure 3 is a schematic diagram of a precision isolated cooling device for cooling respective first and second heat generating electronic components mounted on an IT hardware node;

[0052] Figure 4 is a schematic diagram of selected elements of a precision isolation cooling system having a circulating fluid network for circulating a cooling liquid in direct contact with a plurality of heat generating electronic components;

[0053] Figure 5 is a schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid to a low heat generating device and a plurality of high heat generating devices mounted on an IT hardware node;

[0054] Figure 6 is another schematic diagram of selected elements of a precision isolation cooling system configured to deliver cooling liquid in series to Figure 5 IT hardware nodes and heat-generating equipment;

[0055] Figure 7 is a schematic diagram of a plurality of adjustably mounted second housings configured to receive cooling liquid to cool a plurality of heat generating devices of an IT hardware node;

[0056] Figure 8 is a schematic diagram of an enclosure enclosing a high heat generating device, the enclosure having a control valve at an entrance to the enclosure to regulate the flow of cooling liquid;

[0057] Fig. 9 yes Figure 8 A schematic diagram of an enclosure and a heat generating device, wherein the enclosure is moved to a lowered position to reduce the internal volume within the enclosure;

[0058] Fig.10 yes Figure 8 Another schematic diagram of an arrangement in which the enclosure is elevated to increase the interior volume of the enclosure;

[0059] Fig.11 is a perspective view of a tray housing an IT hardware node having a plurality of microprocessors, the tray being provided with an internal dividing weir wall for controlled circulation of a cooling liquid;

[0060] Fig.12a is a cross-sectional side view of a first arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0061] Figure 12bis a cross-sectional side view of a second arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0062] Fig.12c is a cross-sectional side view of a third arrangement of weirs for controlled circulation of cooling liquid at an IT hardware node;

[0063] Fig.13 is a schematic diagram of an immersion cooling system according to a specific implementation of the present concepts, the system having IT hardware nodes immersed in cooling liquid contained in an immersion cooling tank and connected to a circulating cooling liquid network and manifold;

[0064] Fig.14 is a schematic diagram of a cooling liquid circulation system according to a specific implementation of the present concept, the system being used to separate and circulate cooling liquid at each heat generating device installed at an IT hardware node;

[0065] Fig.15 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0066] Fig.16 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0067] Fig.17 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0068] Fig.18 is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, the system being used to separate and transport and circulate cooling liquid at each heat generating device at an IT hardware node;

[0069] Fig.19 It is a schematic diagram of a cooling liquid circulation system according to another specific implementation of the present concept, which is used to separately transport and circulate cooling liquid at respective heat generating devices installed at IT hardware nodes. DETAILED DESCRIPTION

[0070] The present compartmentalized cooling fluid system attempts to maximize energy efficiency within a circulating cooling fluid network by isolating / compartmentalizing the delivery of working fluid to a series of onboard heat generating devices (typically microprocessors) having different typical operating temperatures. Specifically, the present system provides a multi-stage series cooling liquid circulation network, in which a dielectric cooling liquid can be delivered via an initial flow path in direct contact with at least one heat generating device having a relatively low operating temperature, and then flows via a second flow path in direct contact with at least one or more heat generating devices (roughly located at the same location as the low heat generating device), so that thermal energy is transferred from the low heat generating device to the high heat generating device, occurring in series as a multi-stage heat transfer process. This construction maximizes the temperature change of the circulating cooling liquid. The present system can be implemented in an immersion cooling tank or a more conventional IT hardware node rack.

[0071] Reference Figure 1 The immersion cooling tank 10 includes an inner cavity 12 for accommodating a plurality of IT hardware nodes 11 (such as servers, etc.), each of which has an array of different heat generating devices (HGDs) in the form of onboard electronic components, which may generally include relatively low heat generating components (e.g., RAM, motherboard, etc.) and relatively high heat generating devices (e.g., microprocessors), which themselves may have different maximum operating temperatures. Figure 2 An alternative arrangement for mounting IT hardware nodes 11 is shown in the form of a support rack 13, wherein the IT hardware nodes 11 are mounted within a generally upright frame 70. A plurality of horizontal rails 71 allow for mounting of respective trays 14, each tray being configured to accommodate at least one IT hardware node 11, so as to provide an array of nodes 11 mounted on the rack 13 vertically relative to each other.

[0072] Reference Figure 3 The system includes a main housing 15 defining an interior cavity 28 containing a dielectric cooling liquid 18. The main housing 15 is sized to accommodate an IT hardware node, and in particular, electronic equipment such as a motherboard 16, which in turn has a plurality of electronic components mounted thereon, specifically, a plurality of low heat generating devices 17 (LHGD) and a plurality of high heat generating devices 19 (HHGD). For ease of illustration, Figure 3A single LHGD 17 and HHGD 19 are shown, as well as a respective single second housing 20. However, it should be understood that the present device includes a plurality of such elements. A plurality of second housings (or covers) 20 are located above and around each respective HHGD 19. A conduit 21 provides fluid communication between the outlet port 23 of the main housing 15 and the respective enclosure 27 defined by each second housing 20. Each second housing 20 includes an opening 37, the cross-sectional area of ​​which is greater than the size / cross-sectional area of ​​each HHGD 19. Thus, at least a portion of each HHGD 19 can be accommodated or disposed within each enclosure 27, each enclosure 27 being defined by each second housing 20 located above and around each HHGD 19. Each opening 37 is correspondingly located in an area surrounding each HHGD 19, in contact or near contact with the motherboard 16. The main housing 15 also includes an inlet 22 located at a respective opposite end relative to the outlet 23. Inlet manifold 24 is connected in fluid communication between inlet 22 and heat exchanger 26, which has respective outlet 26a and inlet 26b. Respective return manifolds 25 provide fluid communication between housing outlet 23 and heat exchanger inlet 26b. Thus, the dielectric cooling liquid is configured to circulate through chamber 28 and directly contact LHGD 17 and HHGD 19 (via inlet 22 and outlet 23), heat exchanger 26, and manifolds 25 and 24. Heat exchanger 26 includes an internal heating coil with a respective working fluid or other similar arrangement configured to transfer energy from the dielectric cooling liquid received at inlet 26b so that the temperature of the liquid output at outlet 26a is lower than the temperature of the incoming liquid (through inlet 26b).

[0073] According to the series split immersion cooling of the respective LHGD 17 and HHGD 19, the temperature difference of the liquid at the outlet 23 and the inlet 22 is maximized, thereby maximizing the energy efficiency of the present arrangement. Figure 3 In the arrangement of FIG. 2 , cooling liquid enters chamber 28 via inlet 22, and the liquid then contacts LHGD 17 for a first energy exchange, thereby slightly increasing the temperature of the dielectric liquid. Due to the suction force, the partially warmed liquid is sucked into enclosure 27 via each opening 37. The liquid contained in each second shell 20 undergoes a second level of energy exchange with HHGD 19, which operates at a much higher temperature relative to LHGD 17. Therefore, the already warmed liquid is further heated to its maximum operating temperature. The fluid is then output from enclosure 27 (and chamber 28) and delivered to heat exchanger 26 via outlet 23 and return manifold 25. Once cooled in heat exchanger 26, the dielectric liquid is recirculated to inlet 22 via inlet manifold 24, and the cycle is repeated.

[0074] According to various embodiments described herein, the device and system include a control unit, sensors, and electronically controllable fluid flow valves to control and regulate the flow rate of the dielectric liquid flowing through each area of ​​the device and maximize energy efficiency, in particular, maximize the required heat energy exchange with the LHGD 17 and HHGD 19. The control unit may include a programmable logic controller (PLC), a remote telemetry unit (RTU), a microprocessor, and / or a motherboard, etc. The sensor may include a flow rate, temperature, proximity, motion, current, voltage, pH, and / or magnetic sensor. The control valve may include a solenoid valve, a diaphragm valve, or other solenoid valve, for example, including direct actuation, pilot valve control, two-way, three-way, four-way valves, and combinations thereof. The system and device may be locally and / or remotely controlled via a cloud network, and may be configured to monitor various operating characteristics of the system and device locally or remotely, including the operating performance of electronic components and / or dielectric cooling fluids.

[0075] Reference Figure 4 , the present device is configured to achieve maximum temperature variation of the dielectric cooling liquid (delivered in direct contact with the plurality of LHGDs 17 and HHGDs 19) in addition to supplying a constant temperature cooling liquid to the heat exchanger. This configuration maximizes the operating performance of the heat exchanger and the present system. Figure 4 In the embodiment of the present invention, the inlet manifold 24 provides fluid communication between the plurality of LHGDs 17 and the plurality of spaced-apart HHGDs 19 (all mounted on the IT hardware node). Each HHGD 19 is at least partially encapsulated by a respective second housing 20 ( Figure 3 ). Specifically, the incoming cooling liquid is divided via the inlet conduit 24a so as to provide parallel liquid flow streams to each enclosure 27 housing each HHGD 19. The heated fluid is then output from each respective enclosure 27 via the conduit 21. The flow control valve 29 is electronically communicated with a control unit 33, which is also provided with appropriate sensors (not shown) to monitor at least one operating characteristic at each HHGD 19 and / or region of the enclosure 27, particularly including the flow rate, temperature and / or temperature change of the cooling liquid at each HHGD 19. The flow streams from the conduit 21 are then configured to converge via the outlet conduit 25a to provide a single flow stream to the return manifold 25. A temperature sensor 30 (electronically connected to the control unit 33) is provided at the manifold 25. The pump 31 drives the liquid through the circuit, particularly in direct contact with the LHGD 17 and HHGD 19, and flows forward to the heat exchanger 26. Inlet manifold 24 provides return flow from heat exchanger 26 to LHGD 17 for a first stage of thermal energy exchange before flowing to HHGD 19 .

[0076] Reference Figure 5, describes a specific implementation of the flow path at the LHGD 17 and HHGD 19. The cooling liquid 18 within the main shell 15 is conveyed in direct contact with the LHGD 17 for the first stage of heat transfer. The partially heated liquid is then output via the outlet 61 at the main shell 15. The partially heated fluid can then be returned to the inlet 22 via the return manifold. The liquid is then separated for further thermal energy exchange with the LHGD 17, while also being transferred to the second shell 20 located above and around the respective HHGD 19 via the conduit 38. The partially warmed liquid enters the enclosure 27 via the respective inlet 34, flows in direct contact with the respective HHGD 19, and then leaves the enclosure 27 via the respective outlet 35. The dielectric liquid is thereby heated to its maximum operating temperature. The outlet conduit 39 provides fluid communication between each enclosure 27 (defined by the second shell 20) and a single combined outlet conduit 21, which is in turn arranged to be in fluid communication with the heat exchanger 26. By Figure 5 In an implementation manner, the dielectric liquid is exclusively delivered to the enclosure 27 via respective conduits 38 .

[0077] Figure 6 Shows Figure 5 In this arrangement, the dielectric liquid 18 within the main housing 15 undergoes a first stage of heat transfer with the LHGD 17. The partially warmed liquid is then drawn into each respective enclosure 27 via a respective inlet port 34, which is at least partially immersed in the liquid 18 (within chamber 28) in which the electronic device 16 is immersed. The liquid then undergoes a second stage of thermal energy exchange with the HHGD 19 before being output to the heat exchanger 26. Figure 6 The arrangement is configured to operate in series with respect to a first stage heat energy transfer with an initial LHGD 17 and a subsequent second stage heat energy transfer with the HHGD 19, the second stage heat energy transfer being carried out via isolation / separation of the LHGD 17 from the HHGD 19 via the second housing 20 and various cooling liquid flow paths.

[0078] Reference Figure 7 According to one implementation, each second housing 20 includes an opening 37 to allow the HHGD 19 to be surrounded and at least partially contained within the inner enclosure 27. The dielectric cooling liquid 18 is pumped via a suction pump 31 ( Figure 4) flows into the enclosure 27 under suction to pass through and circulate in direct contact with the HHGD 19 within the partially separated enclosure 27 for heat energy transfer between the HHGD 19 and the liquid 18. In normal use, each HHGD 19 mounted on the main board 16 has different operating characteristics, particularly including processing requirements and heat energy output. The present system is adapted to adjust the supply of cooling liquid as required and through automatic or semi-automatic response operations, with the aim of delivering the working liquid heated to the maximum operating temperature and at a constant temperature to the heat exchanger. This flow control (as well as temperature regulation of the dielectric liquid 18) is achieved via a control unit 33 and an adjustably mounted second shell 20. Specifically, each second shell 20 can be mounted relative to the main board 16 so as to be able to move forward and backward (toward and away from) each respective HHGD 19, thereby changing the internal volume of each respective enclosure 27, as shown in reference Figures 8 to 10 Described in detail. Figure 8 , each enclosure 27, and in particular each second housing 20, may include a control valve 40, which is electronically controlled via the control unit 33 to regulate the flow of liquid 18 to each enclosure 27 (and each HHGD 19). Typically, when installed on the electronic device 16, each device 19 includes a main processor, a thermal interface material, a heat sink, a second thermal interface material and a heat sink. It is advantageous to minimize such thermal connections, so according to the present device and system, each HHGD 19 may include a microprocessor, a thermal interface material and a series of heat sinks 41 extending upward from the microprocessor / thermal interface material into the enclosure 27. When the microprocessor is operating at its maximum processing rate, and therefore at its maximum operating temperature, the valve 40 can be controlled to a fully open position to maximize the flow of liquid between the inlet conduit 38 and the outlet conduit 35.

[0079] Fig. 9 and 10 The arrangement can represent Figure 8 The invention can be an alternative configuration of the valve control arrangement of the embodiment, or can be a combination of these embodiments, and also includes a corresponding control valve 40 (optionally installed at the inlet conduit 38 and / or the outlet conduit 35) Fig. 9 and 10 ). Fig. 9 and 10 , an electronically controllable actuator 42 is connected to the second housing 20, which in turn can be adjustably mounted on the device via another support or exclusively via the actuator 42. Thus, each second housing 20 is capable of reciprocating to and from each HHGD 19. Fig. 9The second housing 20 is located at its closest position relative to the HHGD 19. In this position, the dielectric liquid 18 is delivered and forced into between the fins 41 to exchange maximum heat energy with the HHGD 19. Fig.10 The second housing 20 is raised by the actuator 42 in the position of the second housing 20. In this position, the liquid 18 is allowed to flow around the fins 41, but not necessarily between the fins 41, so as to reduce the heat exchange with the HHGD 19 (which may be running at a lower process rate and thus generating less heat). Each actuator 42 is connected to the control unit 33 (such as Figure 4 17 and HHGD 19) to provide local or remote control of the flow rate through the system and to be in direct contact with the HHGD 19 to directly respond to the operating status of each HHGD 19 (microprocessor), in particular their respective operating temperatures. This arrangement is advantageous for maximizing the thermal energy transferred from the LHGD 17 and HHGD 19 to the liquid 18 and also for regulating the liquid delivered to the heat exchanger 26 to a constant temperature.

[0080] This device can be realized as Figure 1 Immersion cooling tank or Figure 2 The support frame may include one or more liquid flow weir arrangements. The weir arrangement may be arranged at or toward the inlet of the chamber 28 and / or each enclosure 27, and / or at the respective outlets of the chamber 28 and / or each enclosure 27. Fig.11 The tray construction may be particularly suitable for Figure 2 An embodiment of a rack in which an electronic device 16 can be at least partially accommodated and located within the inner groove 14b, relative to the annular portion surrounding the outer groove 14a. The grooves 14a, 14b are separated by a plurality of dividing weir walls 46c extending upward from the base 43a. The outer groove 14a is also defined by a plurality of outer tray walls 43b extending upward from the base 43a. The height of the wall 43c is preferably slightly smaller than the outer wall 43b, so that when the liquid 18 is delivered to the outer groove 14a via the inlet 22, the liquid is configured to overflow from the outer groove 14a into the inner groove 14b via the weir arrangement (above the dividing wall 43c). The liquid 18 is then allowed to flow out of the tray 14 via the outlet 23.

[0081] Fig.12a , b and c show different configurations of the weir arrangement for controlling the flow of liquid into the inner tank 14b. Fig.12a Shows Fig.11 An arrangement in which liquid 18a in outer tank 14a is transferred to liquid 18b in inner tank 14b via weir arrangement 44. Figure 12bIn the embodiment, each partition wall 45 separating the outer tank 14a from the inner tank 14b includes at least one port 45a to allow the liquid 18a to flow directly from the outer tank 14a to the inner tank 14b (liquid 18b), and also allows the liquid 18a to flow through the partition wall 45. Fig.12c 4. A siphon effect weir arrangement is shown in FIG. 4. In this embodiment, a siphon flange 46 extends around the upper end of the partition wall 46c so as to define a weir flow path between the respective outer and inner grooves 14a, 14b, thereby providing a flow path based on suction siphoning. Each tray 14 (each tray containing an electronic device 16 with respective devices 17 and 19) can then be detachably stored on the rack 13 via a track 71 that engages with a corresponding slide (not shown) disposed transversely on each respective tray 14.

[0082] Fig.13 Another embodiment of the present cooling device implemented as part of a liquid immersion cooling tank arrangement is shown. Chamber 28 corresponds to tank 10 ( Figure 1 ) of the main chamber 12, which supports a plurality of electronic devices arranged side by side and suspended / immersed in a cooling liquid 18. As shown, the electronic device 16 may have a plurality of groups of HHGDs 19, which may be arranged and distinguished by their respective operating temperatures, particularly their respective maximum operating temperatures. Specifically, the first group 19a is located toward the inlet 48, and the second group 19b is located downstream in the flow direction of the first group 19a, away from the inlet 48. The first group 19a is configured to be in fluid communication with the second group 19b via respective ports 36, and the first group 19a is configured to be in fluid communication with the inlet 48 via ports 34. Each HHGD 19 in the first 19a and the second group 19b is separated from the main chamber 28 via respective second housings 20, and each second housing may be optionally connected via a second housing 20. Figures 8 to 10 The main housing 15 is configured for inflow of cooling liquid via inlet 22, according to Fig.13The arrangement of the inlet 22 is provided with a plenum 47 to evenly distribute / distribute the incoming liquid flow within the chamber 28. The main housing 15 is provided with at least one respective weir arrangement 44 located at the upper end of the tank 10. Therefore, the cooling liquid is configured to overflow into at least one temporary storage container 49 as a liquid holding volume 50. The gravity return manifold 25 provides fluid communication with the holding volume 50 and the inlet 48. The device also includes an outlet flow conduit network 52, which provides fluid communication from the HHGD group 19a, 19b to the heat exchanger 26 via an intermediate control valve 51. The heat exchanger 26 may include the pump 31 as an integral element, or the device may include other pumps at different locations within the liquid flow network. The heat exchanger 26 includes an internal heat transfer coil 54 connected to a working fluid network 72, which is configured to receive thermal energy from the dielectric cooling liquid 18. The heated working fluid (within the network 72) can then be delivered (as a heat source) to supplementary or auxiliary elements 53 within a data center or the like, in which the present system can be implemented. In operation, the dielectric liquid is initially introduced into the chamber 28 via the inlet 22 and the plenum 47 so as to flow upward against gravity toward the weir 44 (within the chamber 28). In this path, the liquid 18 flows in direct contact with the LHGD 17, so that the liquid overflowing into the holding volume 50 is at least partially heated / warmed. The warmed liquid is then returned to the inlet 48 via the manifold 25, where it is delivered directly to the first group 19a of HHGDs 19 for a second stage of heat transfer. The flow to each HHGD 19 within the first group 19a occurs in parallel. The flow then continues and flows in series from the first group 19a to the second group 19b. Likewise, the flow at each HHGD 19 within the second group 19b occurs in parallel. Thus, the present system is configured to provide serial delivery of dielectric liquid 18 according to a three-stage heat transfer process, including a first stage of delivery using LHGD 17, a second stage of delivery using a first set of HHGDs 19a, and a third stage of delivery using a second set of HHGDs 19b. The liquid is then supplied to heat exchanger 26 via pump 31 and (via control valve 51) and then recirculated to chamber 28 via return manifold 24.

[0083] The packaging of each HHGD 19 and the corresponding separation relative to the other HHGDs 19 and LHGDs 17 increases the temperature difference of the dielectric liquid initially delivered to the tank 10 (at the inlet 22) relative to the heating liquid delivered to the heat exchanger device 26. In addition, via the control unit 33 ( Figure 4), various sensors 30, control valves 40 and / or actuators 42, the system is adapted to maximize energy efficiency via automatic or semi-automatic dynamic response to the operating state of each HHGD 19, i.e., operating between minimum and maximum operating temperatures based on process rate. Single or various operating characteristics / states (i.e., temperature, power generation, process rate, etc.) of each LHGD and HHGD can be monitored and / or supplied and utilized by the system in real time to control the cooling liquid 18 (e.g., to adjust the liquid flow rate) in various different areas of the loop.

[0084] Figures 14 to 19 A further specific implementation of a circulating cooling liquid network forming part of the present apparatus and system is shown, the circulating cooling liquid network being implemented as an immersion cooling tank 10 ( Figure 1 ) or storage rack 13( Figure 2 ). Figures 14 to 19 The arrangement is configured for further operational control of fluid flow via other storage containers and / or pressurized tanks at different areas of the system in which the dielectric cooling liquid can be temporarily stored and its temperature and / or pressure regulated as part of its circulation within the network.

[0085] Reference Fig.14 , the cooling liquid network includes an inlet manifold 24, a heat exchanger 26, a second return manifold 58, a gravity return manifold 25, a storage container 56 (containing a stored liquid volume 57), a pump 31, and an immersion tank or rack and tray arrangement (providing fluid communication between the manifolds 24 and 25). According to the specific implementation, a weir arrangement 44 is provided at the inlet end of the chamber 28 to regulate the flow of cooling liquid to the electronic equipment 16. The LHGD 17 is at least partially immersed in the cooling liquid for the first thermal energy transfer. The cooling liquid is then output to the second weir arrangement 44 via the outlet valve 61, which provides fluid communication with the gravity return manifold 25. The liquid is then transferred to the storage container 56 (buffer storage) and then returned to the heat exchanger 26 via the manifold 58, continuing to flow forward to the inlet manifold 24 in the form of cooling liquid. The liquid flowing into the inlet 22 is diverted via the connecting valve 74 and also flows into the respective enclosure 27 and directly contacts the HHGD 19. The combined flow from enclosure 27 then passes through conduit 21 between outlet flow valves 60 which in turn are in fluid communication with gravity return manifold 25 for combined flow with the liquid from valve 61 . Fig.14 The liquid in the circuit can be pressurized or can be realized at atmospheric pressure. The system includes a control unit 33 (not shown) and related sensors (not shown) as described herein to provide a real-time dynamic response liquid cooling system, thereby achieving the advantages described herein.

[0086] Fig.15 yes Fig.14 A simplified embodiment of the arrangement of generally includes substantially the same elements and functions, including manifolds 24, 55, 58; storage container 56; pump 31 and heat exchanger 26. Fig.15 In the embodiment of the present invention, the electronic device 16 is contained in a chamber 28 having an inlet 22 and an outlet 23, which are in direct fluid communication with respective manifolds 24, 55. The series flow on the LHGD 17 and HHGD 19 is as described in reference Figure 3 As described in the implementation method. Fig.16 Shown as Fig.15 Another embodiment is a variation of the embodiment of . A pressurized container 59 is used instead of the storage container 56 , and an inlet weir arrangement 44 is provided at the inlet 22 of the main housing 15 . Fig.17 5, wherein a storage vessel 56 is also connected downstream of a return manifold 55, which in turn is connected to an outlet valve 61 of chamber 28 via an outlet weir arrangement 44. Outlet valve 61 is configured to receive warmed liquid partially heated by LHGD 17. Outlet valve 60 is configured to receive fully heated liquid from HHGD 19 for subsequent delivery to manifold 58 and transfer to heat exchanger 26. As shown, partially warmed liquid (from outlet valve 61) is transferred to each closed HHGD 19 via manifold 55, storage vessel 56 and pump 31 according to multiple stages of serial heat energy exchange (relative to primary heating by LHGD 17).

[0087] Fig.18 Shown with Fig.17 Another embodiment of a cooling liquid network with a similar arrangement is shown in FIG. 6 . A first stage heating outlet valve 61 is connected to a first return manifold 55a, which in turn is connected to a feed storage container 56. A second return manifold 55b is connected to a second stage outlet valve 60, the output of which is connected to a pump 31 for transfer to a manifold 58 and subsequently to a heat exchanger 26 for delivery to an inlet manifold 24. The storage container 56 is also connected upstream to the pump 31 so that the outlet cooling liquid flows from the valves 61, 60 are combined to flow into the return manifold 58 for heat transfer at the heat exchanger 26. Fig.19 Shows Fig.16 A further embodiment and variation of the arrangement has a weir arrangement 44 at the inlet 22 and further comprises a second weir arrangement 44 at the outlet 23 for forward delivery to a return manifold 25 which is arranged in fluid communication with a storage container 56. Fig.19 The embodiment also includes a pump 31, a manifold 58, a heat exchanger 26 and an inlet manifold 24, as shown in FIG. Fig.16 and are connected in fluid flow communication.

Claims

1. A liquid cooling device for electronic equipment, comprising: a main housing defining a chamber to house at least one electronic device having at least one heat generating electronic component; at least one liquid flow inlet and at least one liquid flow outlet disposed at the housing to allow a flow of dielectric cooling liquid into and out of the chamber in direct contact with the electronic device; a second housing, located within the chamber, defining an enclosure to at least partially house the at least one heat-generating electronic component of the device; at least one liquid flow inlet and at least one liquid flow outlet, disposed at the second housing to allow the liquid to flow into and out of the enclosure in direct contact with the heat generating electronic component; and A cooling unit is connected in fluid communication with at least one of the inlets and at least one of the outlets to form a part of the fluid flow network to transfer thermal energy from the liquid.

2. The device according to claim 1, wherein: The at least one outlet of the main housing is connected in fluid communication with the at least one inlet of the second housing such that the liquid is configured to flow through the chamber and then through the enclosure.

3. The apparatus according to claim 1, comprising an electronic device having: at least one first heat generating electronic component at least partially contained within the chamber for immersion in the liquid within the chamber; and At least one second heat generating electronic component is at least partially contained within the enclosure for immersion in the liquid within the enclosure.

4. The device according to claim 3, wherein: The second heat generating electronic component can include a higher operating temperature than the first heat generating electronic component.

5. The device according to claim 4, wherein: The at least one outlet of the second housing is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the at least one inlet of the main housing.

6. The device according to claim 5, wherein: The chamber is connected in series in fluid communication with the enclosure.

7. The apparatus according to claim 6, further comprising: at least one electronically controllable valve arranged in fluid communication with the inlet and / or the outlet of the main housing and / or the second housing; and A control unit is provided to control the valves and the flow of liquid to enter and leave the main housing and / or the second housing via the respective inlet and outlet.

8. The device according to claim 7, wherein: The control unit is configured to control the liquid to flow through the chamber for a first heat energy exchange with the first heat generating electronic component, and then control the liquid to flow through the enclosure for a second heat energy exchange with the second heat generating electronic component, wherein the second heat energy exchange is a supplement and addition to the first heat energy exchange, so that the increase in temperature of the liquid at the outlet of the enclosure is the sum of the temperature increases of the liquid that has passed through the chamber and the enclosure.

9. The device according to any one of the preceding claims, wherein: The main housing includes a liquid immersion tank, and the second housing is smaller in size than the main housing and is located within the chamber.

10. Apparatus according to any preceding claim, comprising a dielectric cooling liquid contained within the chamber of the main housing, and wherein the second housing is at least partially immersed or fully immersed in the liquid within the chamber of the main housing.

11. The device according to claim 10, wherein: At least a portion of the second heat generating electronic component is positioned in direct contact with the liquid within the enclosure defined by the second housing, and / or at least a portion of the first heat generating electronic component is positioned in direct contact with the liquid within the chamber.

12. An apparatus according to any preceding claim, when dependent on claim 3, wherein the electronic device comprises any one or a combination of the following: Computer entity; ·server; Motherboard; A printed circuit board including a plurality of electronic components.

13. A device according to any preceding claim, when dependent on claim 3, wherein the first heat generating electronic component and / or the second heat generating electronic component comprises any one or a combination of the following: Motherboard; Random access memory (RAM); Graphics processing unit (GPU); Central Processing Unit (CPU).

14. The device according to claim 1, wherein: The inlet of the second housing is defined by at least a perimeter of an opening through which the second housing is positionable to receive and enclose the heat generating electronic component at the enclosure.

15. A device according to any one of the preceding claims, wherein: The inlet and the outlet of the second housing are separated from each other and / or are located in different areas of the second housing.

16. A device according to any one of the preceding claims, wherein: The second shell includes an opening to enable the second shell to receive and enclose the heat-generating electronic component at the enclosure, and a top located opposite the opening.

17. The device according to claim 16, wherein: The inlet of the second shell is located at the top of the second shell.

18. The device according to claim 16 or 17, wherein: The outlet of the second housing is defined in part by the opening.

19. The device of any one of the preceding claims, further comprising an actuator connected to the second housing to actuate movement of the second housing, the actuator being configured to change any one or a combination of: the internal volume of the enclosed area; the position of the enclosure relative to the housing and / or the heat generating electronic component; The spacing distance between the second housing and the heat generating electronic component; The extent to which the second housing encapsulates or contains the heat-generating electronic component within the enclosure.

20. The device according to any one of claims 1 to 18, wherein: The second housing is adjustably mounted on the device via an actuator, the actuator being configured to change an interior volume of the enclosure upon actuation.

21. The device of any one of the preceding claims, further comprising a pump connected in fluid communication with the inlet and / or the outlet of the second housing to drive the liquid through the enclosure.

22. A device according to any of the preceding claims, comprising a first electronically controllable valve connected to the inlet and / or the outlet fluid of the chamber and a second electronically controllable valve connected to the inlet and / or the outlet fluid of the enclosure.

23. Apparatus according to any one of claims 1 to 21, comprising at least one electronically controllable valve arranged in fluid communication with the inlet and the outlet of the second housing.

24. A device according to any one of the preceding claims, comprising at least one temperature sensor to determine the temperature or relative temperature difference of the liquid and / or the heat generating electronic component, the temperature sensor being arranged in electronic communication with the control unit.

25. Apparatus according to any preceding claim, and when dependent on claim 3, wherein: The electronic device or the first and / or second heat generating electronic component comprises a temperature sensor to determine the temperature or the temperature difference between the liquid and the first and / or second heat generating electronic component.

26. The device according to any of the preceding claims, further comprising a liquid return conduit in fluid communication with the outlet of the chamber and the inlet of the enclosure to circulate the liquid leaving the chamber into the enclosure.

27. The apparatus of claim 26 further comprising a temporary storage container fluidly connected between the outlet of the chamber and the inlet of the enclosure to temporarily store a volume of the liquid for circulation from the chamber to the enclosure.

28. The device according to claim 26 or 27, wherein The inlet of the chamber includes a plenum to distribute the flow of liquid into the chamber.

29. The device according to any one of the preceding claims, wherein: The cooling unit comprises a heat exchanger to transfer thermal energy from the liquid to a heat transfer fluid.

30. The device according to any one of claims 26 to 28, wherein The outlet of the main housing is connected in fluid communication with the inlet of the cooling unit, and the outlet of the cooling unit is connected in fluid communication with the inlet of the second housing.

31. Apparatus according to any preceding claim, comprising a plurality of second housings, each second housing having a respective inlet and outlet connected in fluid communication with the cooling unit.

32. The device according to claim 31, wherein At least some of the second housings are connected in series with each other as part of a liquid flow network comprising the cooling unit.

33. The device according to claim 31 or 32, wherein: At least some of the second housings are connected in parallel with each other as part of a liquid flow network comprising the cooling unit.

34. Apparatus according to any preceding claim, comprising a dielectric cooling liquid contained within the chamber and capable of flowing through the enclosure.

35. Apparatus according to claim 34, when dependent on claim 3, wherein: At least a portion of the electronic device and / or at least a portion of the first heat-generating electronic component is located in the chamber and immersed in the liquid in the chamber and in direct contact therewith, and at least a portion of the at least one second heat-generating electronic component is located in the enclosure and immersed in the liquid in the enclosure and in direct contact therewith.

36. A method of cooling at least a portion of an electronic device, comprising: immersing an electronic device having at least one heat generating electronic component in a dielectric cooling liquid contained within a chamber defined by the main housing; immersing the heat generating electronic component in the liquid within an enclosure defined by a second housing located within the chamber; providing a first flow of the liquid through the chamber via at least one inlet and at least one outlet provided at the main housing; providing a second flow of the liquid through the enclosure via at least one inlet and at least one outlet disposed at the second housing; The liquid heated by the electronic device and / or the heat generating electronic component is cooled using a cooling device, the cooling device forming part of a fluid flow network connected in fluid communication with at least one of the inlets and at least one of the outlets.

37. The method of claim 36, wherein: The electronic device includes at least one first heat-generating electronic component and at least one second heat-generating electronic component, wherein the second heat-generating electronic component can reach or include a higher operating temperature than the first heat-generating electronic component, wherein at least a portion of the second heat-generating electronic component is positioned to be in direct contact with the liquid within the enclosed area defined by the second shell, and / or at least a portion of the first heat-generating electronic component is positioned to be in direct contact with the liquid within the chamber.

38. The method according to claim 35 or 36, wherein: The chamber is connected in series in fluid communication with the enclosure such that the liquid is configured to flow through the chamber and then through the enclosure.

39. A method according to any one of claims 36 to 38, comprising: a plurality of enclosures defined by respective second shells, each of the enclosures enclosing a respective heat-generating electronic component disposed at the electronic device; wherein the plurality of enclosed areas are connected in series with each other by a liquid flow; and Wherein, the respective heat-generating electronic components include substantially the same operating temperature or include different operating temperatures arranged in a sequence of increasing operating temperatures within the respective second shells, so that the liquid is configured to flow through the respective enclosed areas and contact the respective heat-generating electronic components in series from relatively low to high operating temperatures.

40. The method according to any one of claims 36 to 39, wherein: The liquid is configured to flow from the outlet of the chamber to the inlet of the enclosure via a return flow conduit, and then the liquid is configured to flow from the at least one outlet of the enclosure to a fluid flow network including the cooling unit.

41. The method of claim 37, comprising controlling the flow of the liquid along a first path through the chamber in direct contact with at least a portion of the first heat generating electronic component, and then along a second path through the enclosure in direct contact with at least a portion of the second heat generating electronic component, so that the thermal energy transferred to the liquid is the sum of the thermal energy transferred from the first heat generating electronic component and from the second heat generating electronic component.

42. The method of any one of claims 36 to 41 further comprising driving the liquid through the chamber and / or the enclosure using a pump.

43. The method of claim 41, comprising directing a return flow of the liquid from the outlet of the chamber at the end of the first flow path to the inlet of the enclosure at the beginning of the second flow path.

44. The method of claim 43, comprising: directing the flow of liquid from the outlet of the enclosure to the cooling unit to reduce the temperature of the liquid; and The inlet of the enclosure is provided with a return flow of the liquid cooled by the cooling unit.

45. The method of claim 44, comprising temporarily storing the liquid received from the outlet of the chamber at the end of the first flow path in a temperature storage container prior to the step of directing the return flow of the liquid to the inlet of the enclosure.

46. ​​A method according to any one of claims 36 to 45, when dependent on claim 36, wherein: The electronic device includes a plurality of first heat-generating electronic components, each of which is immersed in the liquid, and a plurality of second housings, which define respective enclosures to accommodate the heat-generating electronic components.

47. The method of claim 46, wherein: The liquid flows through the enclosures that are in direct contact with the heat generating electronic components, and some of the enclosures flowed through are in series and / or some of the enclosures flowed through are in parallel.

48. A liquid immersion cooling tank for cooling an electronic device having at least one heat generating electronic component, the tank comprising an apparatus as claimed in any one of claims 1 to 34; and An electronic device having at least one heat-generating electronic component, the device and the heat-generating electronic component are respectively immersed in the liquid contained in the chamber defined by the main housing and / or the enclosure defined by the second housing.

49. The liquid immersion cooling tank of claim 48, comprising: at least one main housing defining said chamber to house said at least one electronic device having at least one heat generating electronic component; a plurality of second housings located within the chamber and defining respective enclosures to at least partially house respective heat generating electronic components of the device; and A plurality of electronic devices, each having at least one heat generating electronic component, are immersed in the liquid contained within the chamber, and the at least one heat generating electronic component is immersed in the liquid contained within the respective enclosure.

50. The liquid immersion cooling tank of claim 49, wherein: Each of the plurality of electronic devices has a first and a second heat generating electronic component, the device and the first heat generating electronic component being at least partially immersed or completely immersed in the liquid contained within the main housing, and the second heat generating electronic component being at least partially immersed or completely immersed in the liquid contained within the enclosure.

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