Die for processing semiconductor lead frame through cold stamping

Abstract

The invention discloses a die for processing a semiconductor lead frame through cold stamping. The die comprises a cabinet body, a lower die holder, a lifting seat and an upper stamping die holder assembled on the lifting seat through a quick release mechanism, the quick release mechanism comprises a supporting plate, a positioning frame and a positioning locking piece; two supporting plates are vertically and fixedly arranged at the lower end of the lifting base at intervals, a row of first clamping tooth sets are evenly, horizontally and fixedly arranged at the upper ends of the two supporting plates correspondingly, and two extending parts capable of being lapped on the two supporting plates correspondingly extend out of the two sides of the top of the upper stamping die base correspondingly. The bottom ends of the two extending parts are evenly provided with two rows of second clamping tooth sets connected with the two rows of first clamping tooth sets in a meshed mode respectively, and the lifting base is vertically provided with at least two positioning frames capable of abutting against the upper stamping die base in a spaced and liftable mode. The problems that in the replacement process, thread bushings need to be screwed off one by one, time is wasted, and the disassembly and assembly efficiency is reduced are solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing, and in particular to a cold stamping processing semiconductor lead frame die. Background Art

[0002] As the chip carrier of integrated circuits, semiconductor lead frames are key structural parts that use bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. They serve as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are important basic materials in the electronic information industry. At present, lead frames are generally composed of multiple identical copper-based units arranged in an array. Stamping is a method of manufacturing lead frames, and the punching die is an important component.

[0003] After searching the Chinese patent application number "CN202410683839.3", a cold stamping mold for semiconductor lead frames is disclosed, including: a frame, specifically, the frame includes a base, support columns and a top plate, the top plate is fixed to the top of four support columns; an upper stamping die base, which is arranged on the frame through a driving mechanism to achieve lifting; a lower stamping die base, which is arranged on the frame through a limiting mechanism, and the lower stamping die base and the upper stamping die base cooperate with each other to achieve cold stamping processing of semiconductor lead frames. The present invention solves the problem that the die base model for processing semiconductor lead frames is relatively fixed and single, and it is impossible to replace the processing die base according to different models of semiconductor lead frames.

[0004] The inventors found the following problems in the prior art during the implementation of the present invention:

[0005] The existing stamping die adopts a threaded fixing method to assemble the upper stamping die seat, which results in the need to unscrew the threaded sleeves one by one during replacement, which is time-consuming and reduces the disassembly and assembly efficiency.

[0006] Therefore, it is an urgent problem to be solved by the present invention to provide a cold stamping semiconductor lead frame mold which can quickly assemble the upper stamping mold through a quick release mechanism during use, saving time and effort and improving the disassembly efficiency. Summary of the invention

[0007] In view of the above technical problems, the purpose of the present invention is to overcome the problem that the upper stamping die base is assembled by a threaded fixing method in the prior art, which results in the need to unscrew the threaded sleeves one by one during replacement, which is time-consuming and reduces the disassembly and assembly efficiency. Thus, a cold stamping semiconductor lead frame mold is provided, which can quickly assemble the upper stamping die through a quick release mechanism during use, saves time and effort, and improves the disassembly efficiency.

[0008] In order to achieve the above-mentioned object, the present invention provides a cold stamping mold for processing semiconductor lead frames, the mold comprising: a cabinet, a lower die base horizontally fixed in the cabinet, a lifting seat horizontally and liftably arranged in the cabinet and capable of abutting against the lower die base, and an upper stamping die base detachably assembled on the lifting seat through a quick release mechanism and used in conjunction with the lower die base;

[0009] The quick release mechanism comprises: a support plate, a positioning frame and a positioning locking member; wherein,

[0010] The lower end of the lifting seat is provided with two inverted L-shaped support plates spaced apart and vertically fixed, and a row of No. 1 tooth groups are evenly and horizontally fixed on the upper ends of the two support plates, and the two sides of the top of the upper stamping die seat partially extend horizontally and outward to form two extension parts that can be respectively placed on the two support plates, and the bottom ends of the two extension parts are evenly provided with two rows of No. 2 tooth groups meshingly connected with the two rows of No. 1 tooth groups, and the lifting seat is provided with at least two positioning frames that can abut against the upper stamping die seat at intervals, vertically and liftably, and the lifting seat is also provided with positioning locking members that can lock the two positioning frames abutting against the upper stamping die seat.

[0011] Preferably, the positioning locking member comprises: a locking housing, a moving block, a locking rod and a spring; wherein,

[0012] A locking shell is fixedly arranged horizontally at the bottom end of the lifting seat located between the two positioning frames, each of the positioning frames is a gantry structure, and its two vertical parts are respectively penetrated horizontally with No. 1 through holes compatible with the locking rods, and two moving blocks are respectively arranged horizontally and movably at the upper and lower ends inside the locking shell, and two locking rods that can pass through the two sides of the locking shell and horizontally pass through the two No. 1 through holes on the corresponding positioning frames are respectively spaced and fixed horizontally on the two moving blocks, and a spring is sleeved on each of the locking rods located inside the locking shell, and the two ends of each of the springs are respectively fixed on the locking shell and the moving block.

[0013] Preferably, each of the side walls of the positioning frame is provided with No. 2 through holes which are spaced apart and horizontally penetrated for the two locking rods on each corresponding moving block to pass through, and each locking rod can pass through the No. 2 through hole of the moving block and extend to its outside.

[0014] Preferably, the side walls of the locking housing are respectively provided with two guide holes which are connected with the interior thereof and correspond one-to-one with the two moving blocks, and an operating rod which can pass through the corresponding guide hole is horizontally fixed on each moving block.

[0015] Preferably, a cooling mechanism for cooling the lower mold base is fixedly arranged inside the cabinet below the lower mold base, and the cooling mechanism includes: a first cooling barrel, a second cooling barrel, a liquid inlet pump and a semiconductor refrigerator; wherein,

[0016] A cooling barrel No. 1 and a cooling barrel No. 2 which are internally connected are fixedly arranged inside the cabinet, and a plurality of semiconductor refrigerators with cooling surfaces resting on the side walls are fixedly arranged at intervals on the outer walls of the two cooling barrels, and a liquid inlet pipe and a liquid outlet pipe which extend into the bottom of the cooling barrel No. 1 and the cooling barrel No. 2 are fixedly arranged vertically at intervals on the bottom end of the lower mold base which is an internal hollow structure, and a liquid inlet pump is fixedly arranged at the bottom end of the cooling barrel No. 1, and its output end is connected to the liquid inlet pipe.

[0017] Preferably, a refill pump capable of conveying the coolant inside the No. 2 cooling barrel to the No. 1 cooling barrel is fixedly provided inside the No. 2 cooling barrel.

[0018] Preferably, at least one cylinder is vertically penetrated and fixedly provided on the top of the cabinet, and the free end of the piston rod of the cylinder is fixed on the lifting seat.

[0019] Preferably, a pressing plate capable of abutting against the upper stamping die seat is horizontally fixedly disposed at the bottom end of each positioning frame.

[0020] According to the above technical solution, the cold stamping semiconductor lead frame mold provided by the present invention has the following beneficial effects when used:

[0021] (1) During assembly, all the positioning frames are pulled upward to rise to a suitable position, and the upper stamping die seat is lifted upward for a distance to prevent the No. 2 latch tooth group of the upper stamping die seat from contacting the No. 1 latch tooth group on the support plate. Subsequently, the upper stamping die seat is extended into the interior from between the two support plates and moved downward so that the two extensions on the top of the upper stamping die seat are respectively placed on the two support plates. All the positioning frames are then pulled upward to descend to abut against the upper stamping die seat, and the meshing relationship between the No. 1 latch tooth group and the No. 2 latch tooth group is used to prevent the upper stamping die seat from moving in the horizontal direction. Then, all the positioning frames are locked by the locking member, thereby fixing the upper stamping die seat in the longitudinal direction to prevent it from moving in the longitudinal direction.

[0022] (2) During disassembly, the positioning frame is moved upward to separate it from the upper stamping die base, and the upper stamping die base is lifted upward to disengage the No. 2 latch tooth group on it from the No. 1 latch tooth group on the support plate, and then the upper stamping die base is horizontally pulled out from between the two support plates, thereby quickly disassembling the upper stamping die base.

[0023] In summary, the present invention can quickly assemble the upper stamping die through the quick-release mechanism, which saves time and effort and improves the disassembly efficiency.

[0024] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation mode; and the parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 It is a structural schematic diagram of a cold stamping semiconductor lead frame die provided in a preferred embodiment of the present invention;

[0027] Figure 2 It is a schematic diagram of the internal structure of a cold stamping semiconductor lead frame mold provided in a preferred embodiment of the present invention;

[0028] Figure 3 It is a schematic assembly diagram of an upper stamping die seat of a cold stamping semiconductor lead frame die provided in a preferred embodiment of the present invention;

[0029] Figure 4 yes Figure 3 Structural cross-sectional view of

[0030] Figure 5 It is a structural schematic diagram of a lifting seat of a cold stamping semiconductor lead frame die provided in a preferred embodiment of the present invention;

[0031] Figure 6 It is a structural schematic diagram of an upper stamping die seat of a semiconductor lead frame die for cold stamping provided in a preferred embodiment of the present invention;

[0032] Figure 7 It is a structural schematic diagram of a positioning locking member of a cold stamping semiconductor lead frame die provided in a preferred embodiment of the present invention;

[0033] Figure 8 It is a schematic structural diagram of a positioning frame for cold stamping semiconductor lead frame mold provided in a preferred embodiment of the present invention.

[0034] Description of Reference Numerals

[0035] 1. Cabinet; 2. Lower die base; 3. Upper stamping die base; 4. Lifting seat; 5. Quick release mechanism; 501. Support plate; 502. Positioning frame; 503. Positioning locking piece; 5031. Locking shell; 5032. Moving block; 5033. Locking rod; 5034. Spring; 6. Cylinder; 7. Cooling mechanism; 701. No. 1 cooling barrel; 702. No. 2 cooling barrel; 703. Liquid inlet pump; 704. Semiconductor refrigerator; 8. Press plate; 9. Liquid inlet pipe; 10. Liquid outlet pipe; 11. Liquid replenishing pump; 12. Operating lever; 13. Guide hole; 14. No. 1 gear group; 15. No. 2 gear group. DETAILED DESCRIPTION

[0036] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0037] like Figure 1-8 As shown, the present invention provides a cold stamping mold for processing semiconductor lead frames, the mold comprising: a cabinet 1, a lower die base 2 horizontally fixed in the cabinet 1, a lifting base 4 horizontally and liftably arranged in the cabinet 1 and capable of abutting against the lower die base 2, and an upper stamping die base 3 detachably assembled on the lifting base 4 through a quick release mechanism 5 and used in conjunction with the lower die base 2;

[0038] The quick release mechanism 5 comprises: a support plate 501, a positioning frame 502 and a positioning locking member 503; wherein,

[0039] Two inverted L-shaped support plates 501 are vertically fixedly arranged at the lower end of the lifting seat 4, and a row of No. 1 tooth groups 14 are evenly and horizontally fixedly arranged on the upper ends of the two support plates 501. The two sides of the top of the upper stamping die seat 3 partially extend horizontally and outward to form two extension parts that can be respectively placed on the two support plates 501, and the bottom ends of the two extension parts are evenly provided with two rows of No. 2 tooth groups 15 meshingly connected with the two rows of No. 1 tooth groups 14. The lifting seat 4 is vertically and spaced apart and can be lifted and lowered with at least two positioning frames 502 that can abut against the upper stamping die seat 3. The lifting seat 4 is also provided with a positioning locking member 503 that can lock the two positioning frames 502 abutting against the upper stamping die seat 3.

[0040] In the above solution, the two extension parts of the upper stamping die base 3 can abut against the side walls of the two support plates 502, and the lifting base 4 is provided with avoidance holes for the two vertical parts of the positioning frame 502 to pass through.

[0041] During assembly, all the positioning frames 502 are pulled upward to rise to the appropriate position, and the upper stamping die base 3 is lifted upward for a distance to prevent the No. 2 latch tooth group 15 of the upper stamping die base 3 from contacting the No. 1 latch tooth group 14 on the support plate 501. Subsequently, the upper stamping die base 3 is extended into the interior from between the two support plates 501 and the upper stamping die base 3 is moved downward so that the two extensions at the top are respectively placed on the two support plates 501. Then, all the positioning frames 502 are pulled upward to make them drop to rest against the upper stamping die base 3, and the meshing relationship between the No. 1 latch tooth group 14 and the No. 2 latch tooth group 15 is used to prevent the upper stamping die base 3 from moving in the horizontal direction. Then, all the positioning frames 502 are locked by the locking member 503, so that the upper stamping die base 3 is fixed in the longitudinal direction to prevent it from moving in the longitudinal direction.

[0042] During disassembly, the positioning frame 502 is moved upward to separate it from the upper stamping die base 3, and the upper stamping die base 3 is lifted upward to disengage the No. 2 latch tooth group 15 thereon from the No. 1 latch tooth group 14 on the support plate 501, and then the upper stamping die base 3 is horizontally pulled out from between the two support plates 501, thereby quickly disassembling the upper stamping die base 3.

[0043] In summary, the present invention can quickly assemble the upper stamping die 3 through the quick-release mechanism 5, thereby improving the disassembly efficiency.

[0044] In a preferred embodiment of the present invention, the positioning locking member 503 comprises: a locking housing 5031, a moving block 5032, a locking rod 5033 and a spring 5034; wherein,

[0045] A locking shell 5031 is horizontally fixedly set at the bottom end of the lifting seat 4 located between the two positioning frames 502. Each of the positioning frames 502 is a gantry structure, and its two vertical parts are horizontally penetrated by a No. 1 through hole compatible with the locking rod 5033. Two moving blocks 5032 are horizontally and movably set at the upper and lower ends inside the locking shell 5031, and two locking rods 5033 that can pass through the two sides of the locking shell 5031 and horizontally pass through the two No. 1 through holes on the corresponding positioning frames 502 are respectively spaced and horizontally fixed on the two moving blocks 5032. A spring 5034 is sleeved on each of the locking rods 5033 located inside the locking shell 5031, and the two ends of each of the springs 5034 are respectively fixed on the locking shell 5031 and the moving block 5032.

[0046] In the above scheme, during disassembly, the two moving blocks 5032 are moved and each of the springs 5034 is stretched to put them in a stretched state, so that all the locking rods 5033 on the two can be separated from the positioning frame 502 through the No. 1 through hole of the positioning frame 502, and then the positioning frame 502 is moved upward to separate it from the upper stamping die base 3, and the upper stamping die base 3 is lifted upward to disengage the No. 2 tooth group 15 thereon from the No. 1 tooth group 14 on the support plate 501, and then the upper stamping die base 3 is horizontally pulled out from between the two support plates 501, so that the upper stamping die base 3 can be quickly disassembled.

[0047] When assembly is required, the two moving blocks 5032 are moved and each spring 5034 is stretched to be in a stretched state, so that all the locking rods 5033 on the two can be separated from the positioning frame 502 through the No. 1 through hole of the positioning frame 502, and then the upper stamping die base 3 is lifted up for a distance to prevent the No. 2 latching tooth group 15 of the upper stamping die base 3 from contacting the No. 1 latching tooth group 14 on the support plate 501, and then the upper stamping die base 3 is extended into the interior of the two support plates 501 and the upper stamping die base 3 is moved downward to allow the two top portions of the upper stamping die base 3 to be moved downward. The extension part is respectively placed on the two support plates 501, and the meshing relationship between the No. 1 latch tooth group 14 and the No. 2 latch tooth group 15 prevents the upper stamping die base 3 from moving in the horizontal direction. Then, the two moving blocks 5032 are loosened, and all the positioning frames 502 are moved downward to make them rest against the upper stamping die base 3. The two moving blocks 5032 move in the opposite direction under the action of the multiple springs 5034 and drive all the locking rods 5033 on each of them to move toward the corresponding positioning frames 502 and pass through the No. 1 through holes thereon, thereby locking the positioning frames 502.

[0048] In a preferred embodiment of the present invention, each of the positioning frames 502 has a side wall with two through holes spaced apart and horizontally penetrated therethrough for the two locking rods 5033 on each corresponding moving block 5032 to pass through, and each locking rod 5033 can pass through the No. 2 through hole of the moving block 5032 and extend to its outside.

[0049] In the above scheme, if Figure 2 and 4As shown, since each of the locking rods 503 can pass through the No. 1 through hole on the positioning frame 502 and the No. 2 through hole on the support plate 501 in sequence, when the upper stamping die base 3 is in operation, the spring 5034 undergoes a small deformation in the horizontal direction, and each of the locking rods 503 will not be separated from the positioning frame 502 through the No. 1 through hole on the positioning frame 502, thereby improving the stability and reliability of the locking function of the positioning frame 502.

[0050] In a preferred embodiment of the present invention, the side walls of the locking shell 5031 are respectively provided with two guide holes 13 which are connected to the interior thereof and correspond one to one with the two moving blocks 5032, and each of the moving blocks 5032 is horizontally fixed with an operating rod 12 which can pass through the corresponding guide hole 13.

[0051] In the above scheme, if Figure 2 and 7 As shown, during disassembly, the operating rod 12 can be held by hand to drive the moving block 5032 along the guide hole 13 to drive all the locking rods 5033 thereon to separate from the positioning frame 502 through the No. 1 through hole of the positioning frame 502, and then the positioning frame 502 is moved upward to separate it from the upper stamping die base 3, and the upper stamping die base 3 is lifted upward to disengage the No. 2 tooth group 15 thereon from the No. 1 tooth group 14 on the support plate 501, and then the upper stamping die base 3 is pulled out horizontally from between the two support plates 501, thereby completing quick disassembly and improving disassembly efficiency.

[0052] In a preferred embodiment of the present invention, a cooling mechanism 7 for cooling the lower mold base 2 is fixedly arranged inside the cabinet 1 located below the lower mold base 2, and the cooling mechanism 7 includes: a first cooling barrel 701, a second cooling barrel 702, a liquid inlet pump 703 and a semiconductor refrigerator 704; wherein,

[0053] The interior of the cabinet 1 is fixedly provided with a cooling barrel No. 1 701 and a cooling barrel No. 2 702 which are internally connected, and the outer walls of the two are spaced and fixedly provided with a plurality of semiconductor refrigerators 704 with cooling surfaces against the side walls thereof, and the bottom end of the lower mold base 2 which is an internal hollow structure is vertically fixedly provided with a liquid inlet pipe 9 and a liquid outlet pipe 10 which extend into the bottom of the cooling barrel No. 1 701 and the cooling barrel No. 2 702 respectively, and the bottom end of the cooling barrel No. 1 701 is fixedly provided with a liquid inlet pump 703, and its output end is connected to the liquid inlet pipe 9.

[0054] In the above scheme, when in use, the coolant in the No. 1 cooling barrel 701 is transported to the lower mold base 2 by starting the liquid inlet pump 703, and the lower mold base 2 and the finished product thereon are cooled and cooled down. The coolant entering the lower mold base 2 exchanges heat with the lower mold base 2 and then flows into the No. 2 cooling barrel 702 through the liquid outlet pipe 10 and cools down the coolant inside through the several semiconductor refrigerators 704 on the outer wall of the No. 2 cooling barrel 702. The cooled coolant in the No. 2 cooling barrel 702 enters the No. 1 cooling barrel 702 and is cooled down for the second time, so that the coolant transported to the lower mold base 2 by the liquid inlet pump 703 is fully cooled.

[0055] In a preferred embodiment of the present invention, a refilling pump 11 is fixedly disposed inside the second cooling barrel 702 and is capable of transporting the coolant inside the second cooling barrel 702 to the first cooling barrel 701 .

[0056] In the above scheme, the coolant flowing out from the lower mold base 2 through the liquid outlet pipe 10 is transported to the No. 2 cooling barrel 702 for cooling by the liquid replenishing pump 11, and then transported to the No. 1 cooling barrel 701 for further cooling, and then transported to the lower mold base 2 by the liquid inlet pump 703 to realize the recycling of the coolant.

[0057] In addition, the input end of the liquid replenishment pump 11 is located above the No. 2 cooling barrel 702. The purpose of this is to allow the coolant to flow from the lower mold base 2 into the No. 2 cooling barrel 702 through the liquid outlet pipe 10. As the liquid level rises, the coolant flowing out of the liquid outlet pipe 10 can have enough time to cool down, so that the coolant from above the No. 2 cooling barrel 702 pumped by the liquid replenishment pump 11 is fully cooled.

[0058] In a preferred embodiment of the present invention, at least one cylinder 6 is vertically and fixedly provided through the top of the cabinet 1 , and the free end of the piston rod of the cylinder 6 is fixed on the lifting seat 4 .

[0059] In the above scheme, the lifting seat 4 can be driven to lift the upper stamping die seat 3 in the vertical direction when the piston rod of the cylinder 6 extends from or retracts into the cylinder portion, so as to realize the stamping operation and the resetting function after stamping.

[0060] In addition, the cylinder 6 is an existing disclosed technical means, so its specific structure and use principle will not be repeated here.

[0061] In a preferred embodiment of the present invention, a pressing plate 8 capable of abutting against the upper stamping die seat 3 is horizontally fixedly disposed at the bottom end of each positioning frame 502 .

[0062] In the above scheme, when in use, relative to the two vertical parts of the positioning frame 502 abutting against the upper stamping die base 3 to limit the upper stamping die base 3 in the vertical direction and prevent it from moving in the longitudinal direction, by driving the positioning frame 502 to drive the pressure plate 8 fixed at its bottom to descend and abut against the upper stamping die base 3, the fixing (contact) area between the positioning frame 502 and the upper stamping die base 3 can be increased to improve the stability and reliability of the fixation.

[0063] In summary, the cold stamping semiconductor lead frame mold provided by the present invention overcomes the problem that the threaded fixing method used in the prior art is used to assemble the upper stamping die base, which results in the need to unscrew the threaded sleeves one by one during replacement, which is time-consuming and reduces the disassembly and assembly efficiency.

[0064] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0065] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0066] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A cold stamping die for semiconductor lead frame, characterized in that: The mold comprises: a cabinet (1), a lower mold base (2) fixed horizontally in the cabinet (1), a lifting base (4) arranged horizontally and liftably in the cabinet (1) and capable of abutting against the lower mold base (2), and an upper stamping mold base (3) detachably mounted on the lifting base (4) through a quick release mechanism (5) and used in conjunction with the lower mold base (2); The quick-release mechanism (5) comprises: a support plate (501), a positioning frame (502) and a positioning locking member (503); wherein: The lower end of the lifting seat (4) is provided with two inverted L-shaped support plates (501) at intervals and vertically fixed thereon, and a row of first-number latching tooth groups (14) are evenly and horizontally fixedly provided on the upper ends of the two support plates (501), and the two sides of the top of the upper stamping die seat (3) respectively partially extend horizontally outward to form two extension parts that can be respectively placed on the two support plates (501), and the bottom ends of the two extension parts are evenly provided with two rows of second-number latching tooth groups (15) meshingly connected with the two rows of first-number latching tooth groups (14), and the lifting seat (4) is provided with at least two positioning frames (502) that can abut against the upper stamping die seat (3) at intervals and vertically and can be lifted and lowered, and the lifting seat (4) is also provided with a positioning locking member (503) that can lock the two positioning frames (502) abutting against the upper stamping die seat (3).

2. The cold stamping semiconductor lead frame mold according to claim 1, characterized in that: The positioning locking member (503) comprises: a locking housing (5031), a moving block (5032), a locking rod (5033) and a spring (5034); wherein, A locking shell (5031) is fixedly arranged horizontally at the bottom end of the lifting seat (4) located between the two positioning frames (502), each of the positioning frames (502) is a gantry structure, and two vertical parts thereof are respectively penetrated horizontally with a No. 1 through hole adapted to the locking rod (5033), and two moving blocks (5032) are respectively arranged horizontally and movably at the upper and lower ends inside the locking shell (5031), and the two moving blocks (5032) are respectively arranged on the upper and lower ends thereof. Two locking rods (5033) are separately spaced and horizontally fixedly arranged, which can pass through the two sides of the locking shell (5031) and horizontally pass through the two No. 1 through holes on the positioning frame (502) corresponding to each other, and each locking rod (5033) located inside the locking shell (5031) is sleeved with a spring (5034), and the two ends of each spring (5034) are respectively fixed to the locking shell (5031) and the moving block (5032).

3. The cold stamping semiconductor lead frame mold according to claim 2, characterized in that: Each of the positioning frames (502) has a side wall provided with two through holes spaced apart and horizontally extending therethrough for two locking rods (5033) on each of the corresponding moving blocks (5032) to pass through, and each locking rod (5033) can pass through the second through hole of the moving block (5032) and extend to the outside thereof.

4. The cold stamping semiconductor lead frame mold according to claim 2, characterized in that: The side walls of the locking housing (5031) are respectively provided with two guide holes (13) which are connected to the interior thereof and correspond one to one with the two moving blocks (5032), and an operating rod (12) which can pass through the corresponding guide hole (13) is horizontally fixedly arranged on each of the moving blocks (5032).

5. The cold stamping semiconductor lead frame mold according to claim 1, characterized in that: A cooling mechanism (7) for cooling the lower mold base (2) is also fixedly arranged inside the cabinet (1) below the lower mold base (2), and the cooling mechanism (7) comprises: a first cooling barrel (701), a second cooling barrel (702), a liquid inlet pump (703) and a semiconductor refrigerator (704); wherein: The cabinet (1) is fixedly provided with a first cooling barrel (701) and a second cooling barrel (702) which are connected to each other, and the outer walls of the two cooling barrels are fixedly provided with a plurality of semiconductor refrigerators (704) with cooling surfaces pressed against the side walls thereof at intervals. The bottom end of the lower mold base (2) which is a hollow structure is vertically fixedly provided with a liquid inlet pipe (9) and a liquid outlet pipe (10) which extend into the bottom of the first cooling barrel (701) and the second cooling barrel (702) respectively at intervals. The bottom end of the first cooling barrel (701) is fixedly provided with a liquid inlet pump (703), the output end of which is connected to the liquid inlet pipe (9).

6. The cold stamping semiconductor lead frame mold according to claim 5, characterized in that: A liquid replenishing pump (11) is fixedly arranged inside the second cooling barrel (702) and is capable of transporting the coolant inside the second cooling barrel (702) to the first cooling barrel (701).

7. The cold stamping semiconductor lead frame mold according to claim 1, characterized in that: At least one cylinder (6) is vertically and fixedly provided through the top of the cabinet (1), and the free end of the piston rod of the cylinder (6) is fixed on the lifting seat (4).

8. The cold stamping semiconductor lead frame mold according to claim 1, characterized in that: A pressing plate (8) capable of abutting against the upper stamping die seat (3) is fixedly disposed horizontally at the bottom end of each positioning frame (502).

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