Metal solid-state phase change temperature control structure and additive preparation method thereof

Abstract

The invention provides a metal solid-state phase change temperature control structure and an additive preparation method thereof.The preparation method of the metal solid-state phase change temperature control structure comprises the following steps that three-dimensional modeling is conducted on a target metal solid-state phase change temperature control structure, and different temperature control areas are divided according to heat dissipation temperature control requirements; designing corresponding metal solid-state phase change alloy components with phase change heat absorption capacity according to allowable temperature ranges of different temperature control areas; and a laser coaxial powder feeding additive manufacturing process is adopted for conducting partitioned printing to form a plurality of temperature control areas, and the metal solid-state phase change temperature control structure is manufactured. The problem that a single-component alloy structure cannot effectively control the temperature in a large temperature area range is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing thermal control structures for electronic components, and in particular to a metal solid-state phase change temperature control structure and an additive manufacturing method thereof. Background Art

[0002] With the development of electronic components in micro-intelligent equipment, the heat flux density per unit volume caused by the increase in power load continues to increase, which will put forward higher heat dissipation requirements for compact metal temperature control structures. Effectively removing additional heat flux and uneven heat dissipation are two major technical challenges in the thermal management of electronic components in current micro-intelligent equipment. Traditional active cooling technologies such as air cooling and liquid cooling have disadvantages such as large volume, high noise and complex structure, and cannot meet the cooling needs of highly integrated electronic components in today's micro-intelligent equipment. In contrast, phase change endothermic materials with high thermal conductivity, high phase change latent heat and small phase change volume have attracted great attention. Phase change endothermic materials absorb and release heat through reversible phase change within a small temperature range. When the surface temperature of electronic components rises to the phase change temperature of phase change endothermic materials, it absorbs heat through phase change and delays the rise of the surface temperature of the equipment. Phase change endothermic materials are mainly divided into solid-liquid phase change materials and solid-solid phase change materials. Solid-liquid phase change materials have low cost, phase change temperature suitable for cooling electronic components and high phase change latent heat per unit mass. However, the specially designed anti-leakage metal structure and low thermal conductivity limit its application in micro-intelligent devices. Metal solid-solid phase change materials with relatively high thermal conductivity and high unit volume phase change latent heat have the advantage of thermal management inside micro-intelligent devices.

[0003] Among various metal solid-solid phase change materials, phase change endothermic alloys with phase change heat absorption and good thermal conductivity have important application potential in micro-intelligent equipment. However, existing phase change endothermic alloys cannot effectively control related electronic components within the optimal operating temperature range in a short time.

[0004] To this end, the present invention is proposed. Summary of the invention

[0005] The main purpose of the present invention is to propose a metal solid-state phase change temperature control structure and an additive preparation method thereof. The present invention utilizes the customized manufacturing capability of regional component organization of laser coaxial powder feeding additive manufacturing technology to achieve the preparation of a metal solid-state phase change temperature control structure with differentiated temperature control performance in different regions, thereby solving the problem that existing component alloys cannot effectively control electronic components within the optimal operating temperature range in a short time.

[0006] In order to achieve the above objectives, the present invention provides the following technical solutions.

[0007] A first aspect of the present invention provides an additive manufacturing method for a metal solid-state phase change temperature control structure, which comprises the following steps:

[0008] Conduct three-dimensional modeling of the target metal solid phase change temperature control structure and divide it into multiple temperature control areas;

[0009] According to the temperature control targets required by different temperature control areas, design the alloy composition corresponding to different areas;

[0010] Under a protective atmosphere, a laser coaxial powder feeding additive manufacturing process is used to perform partition printing to form the multiple phase change temperature control areas, thereby obtaining the metal solid phase change temperature control structure.

[0011] Furthermore, the multiple temperature control areas include at least one high thermal conductivity alloy temperature control area and at least one high phase change endothermic alloy temperature control area; the high thermal conductivity alloy temperature control area is used to be close to electronic components, and the high phase change endothermic alloy temperature control areas are distributed around the electronic components.

[0012] Furthermore, the alloy composition corresponding to the high thermal conductivity alloy temperature control region is different from the alloy composition corresponding to the high phase change endothermic alloy temperature control region.

[0013] Furthermore, the thermal conductivity of the temperature control area of ​​the high thermal conductivity alloy is ≥120 W / (m·K).

[0014] Furthermore, the high phase change endothermic alloy includes one of a Cu-based, Fe-based and Ni-based alloy having a solid phase change endothermic effect.

[0015] Furthermore, the process of performing partition printing using the laser coaxial powder feeding additive manufacturing process includes:

[0016] Set the process parameters and the speed of the powder barrel corresponding to each metal powder;

[0017] The metal powder in each powder barrel is transported to the powder mixer, mixed evenly and then sent to the powder feeding pipe, and the corresponding number of layers are deposited according to the preset layer thickness, and printing of different phase change temperature control areas is performed in sequence.

[0018] Preferably, the metal powder is spherical powder, and the powder particle size is 53-150 μm.

[0019] Furthermore, the process parameters set for the laser coaxial powder feeding additive manufacturing process include:

[0020] The laser power is 3000-4000W, the scanning speed is 600-1000mm / min, the overlap rate is 35-50%, the powder feeding rate is 15-20g / min, and the layer thickness is 0.6-0.8mm.

[0021] Furthermore, the powder drum rotation speed corresponding to the relevant metal powder is obtained according to the alloy components required by the multiple temperature control zones.

[0022] Furthermore, the substrate used in the laser coaxial powder feeding additive manufacturing process has an alloy composition similar to that required by the temperature control area.

[0023] Preferably, the process of using the laser coaxial powder feeding additive manufacturing process for zoned printing also includes cleaning the forming device and the substrate.

[0024] Preferably, the protective atmosphere comprises a nitrogen atmosphere.

[0025] The second aspect of the present invention provides a metal solid-state phase change temperature control structure prepared by the preparation method provided by the first aspect of the present invention, which includes a plurality of integrally formed temperature control regions, and the plurality of temperature control regions have different functional parameters.

[0026] Compared with the prior art, the present invention achieves the following technical effects:

[0027] The present invention performs regional design on the metal solid phase change temperature control structure, utilizes the regional composition organization customized manufacturing capability of additive manufacturing to achieve regional precise control of high thermal conductivity and high phase change heat absorption capacity by regulating the alloy component type and atomic ratio, which is beneficial to realize the continuous and efficient temperature control capability of the metal temperature control structure within the allowable temperature rise range of micro-intelligent equipment, and improves the reliability of electronic components application.

[0028] The present invention is conducive to solving the demand for overclocking and cooling of high-power electronic components in micro-intelligent equipment, innovatively realizes the continuous and efficient temperature control capability of the intelligent metal temperature control structure within the allowable temperature rise range of the equipment, and improves the reliability of the application of electronic components.

[0029] The preparation method of the present invention is easy to implement, has good applicability and strong functionality.

[0030] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0032] Figure 1A schematic structural diagram of a metal solid-state phase change temperature control structure according to one or more embodiments;

[0033] Figure 2 It is a schematic diagram of preparing a metal solid-state phase change temperature control structure according to one embodiment or multiple embodiments. DETAILED DESCRIPTION

[0034] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concept of the present invention.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" in the specification and claims of the present invention and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] In the description of the embodiments of the present invention, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0038] In the description of the embodiments of the present invention, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0039] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0040] Traditional melting and casting methods can only produce alloys with a single composition, while laser coaxial powder feeding additive manufacturing technology is a rapid prototyping manufacturing technology that uses high-energy laser beams to achieve layer-by-layer melting and rapid solidification deposition of powders, and ultimately produces high-performance dense metal parts in near-net shape. Compared with traditional manufacturing technologies, laser coaxial powder feeding additive manufacturing technology has the advantages of high efficiency, fast response, and in-situ controllable composition. Therefore, the regional composition organization customized manufacturing capabilities of laser coaxial powder feeding additive manufacturing technology are used to promote the realization of differentiated temperature control performance in different regions.

[0041] On the one hand, the present invention provides a method for preparing a metal solid-state phase change temperature control structure. The key lies in realizing precise control of functional parameters (such as thermal conductivity and phase change latent heat, etc.) in different regions of the metal temperature control structure through alloy composition design, and utilizing the customized manufacturing capability of regional composition organization of additive manufacturing to promote the realization of differentiated temperature control performance in different regions.

[0042] Reference Figure 1 As shown, the metal solid phase change temperature control structure in the present invention is specifically carried out according to the following steps.

[0043] (1) Use 3D printing design software to perform three-dimensional modeling of the target metal solid-state phase change temperature control structure.

[0044] In an embodiment of the present invention, a three-dimensional model is performed on the target metal solid-state phase change temperature control structure to clarify the alloy phase change temperature requirements in different regions and divide it into multiple phase change temperature control regions, thereby obtaining the alloy phase change temperature distribution gradient.

[0045] Generally speaking, the area close to the electronic components is used as the temperature control area of ​​the high thermal conductivity alloy; the area around the electronic components is used as the temperature control area of ​​the high phase change heat absorption alloy.

[0046] High thermal conductivity alloys are used in the parts close to electronic components. During the heating process, the local heat is first conducted out through the excellent thermal conductivity function to suppress the temperature rise. Alloys with high phase change heat absorption capacity are used in the parts around the electronic components / high thermal conductivity alloys. When the alloys in the parts close to the electronic components cannot control the temperature rise through thermal conduction, their temperature control capacity is supplemented to control the temperature of the electronic components within the maximum operating temperature.

[0047] In an embodiment of the present invention, the multiple temperature control zones include at least one high thermal conductivity alloy temperature control zone and at least one high phase change heat absorption capacity alloy temperature control zone; in other words, the multiple phase change temperature control zones are mainly composed of at least one high thermal conductivity alloy temperature control zone and at least one high phase change heat absorption capacity alloy temperature control zone.

[0048] Among them, the temperature control area of ​​the high thermal conductivity alloy is close to the electronic components, and the temperature control area of ​​the high phase change heat absorption alloy with high phase change temperature and large latent heat is located around the electronic components / high thermal conductivity alloy.

[0049] In an embodiment of the present invention, the alloy compositions corresponding to the multiple high thermal conductivity alloy temperature control zones are the same, ensuring that the high thermal conductivity alloy compositions corresponding to the electronic components A, B, and C are the same, so that the thermal conductivity of the alloy can meet the initial heat dissipation requirements of the electronic components.

[0050] In an embodiment of the present invention, the alloy composition corresponding to the high thermal conductivity alloy temperature control area is different from the alloy composition corresponding to the high phase change heat absorption capacity alloy temperature control area, and the temperature control mechanism of the high thermal conductivity alloy temperature control area and the high phase change heat absorption capacity alloy is different.

[0051] In an embodiment of the present invention, the alloy compositions corresponding to multiple high phase change heat absorption capacity alloy temperature control areas are the same or different, ensuring that the high phase change heat absorption capacity alloy compositions corresponding to the areas around electronic components A, B, and C / around the high thermal conductivity alloy temperature control areas are the same or different, so as to change the phase change heat absorption capacity to meet the excess higher heat dissipation requirements of different electronic components.

[0052] As certain embodiments of the present invention, the austenite phase transformation start temperature (As) of the temperature control zone of the high phase transformation heat absorption alloy is 20 to 40°C lower than the derating temperature of the electronic components adjacent thereto, and has a relatively high phase transformation temperature and a relatively large phase transformation latent heat.

[0053] It should be noted that the thickness of different temperature control areas can be designed according to the actual application environment requirements without specific limitation.

[0054] (2) Ingredient design.

[0055] According to the temperature control requirements of different temperature control areas in the metal solid phase change temperature control structure, it is understood that different alloy compositions can be designed according to the allowable temperature range of different temperature control areas. The metal solid phase change temperature control structure includes a high thermal conductivity alloy temperature control area and a high phase change heat absorption capacity alloy temperature control area.

[0056] In the embodiment of the present invention, the high thermal conductivity alloy temperature control region is made of a high thermal conductivity alloy such as Al-based, Cu-based or Ag-based.

[0057] In an embodiment of the present invention, the high phase change heat absorption capacity alloy temperature control region is selected from one of the Cu-based, Cu-Al-based, Fe-based and Ni-based shape memory alloys having a solid phase change heat absorption effect.

[0058] In the embodiment of the present invention, the high thermal conductivity alloy and the high phase change heat absorption capacity alloy are selected to have good metallurgical bonding performance.

[0059] In the embodiment of the present invention, the metal powder corresponding to each element is spherical powder, and the powder particle size distribution is in the range of 53-150 μm.

[0060] In an embodiment of the present invention, the purity of each metal powder is greater than or equal to 99.95%.

[0061] It is worth mentioning that the rotation speed of the powder barrel corresponding to each metal powder is obtained according to the alloy composition. In other words, the conveying rate of various metal powders corresponding to different phase change temperature control areas can be calculated according to the alloy composition requirements, thereby realizing the alloy composition distribution gradient by adjusting the powder barrel rotation speed corresponding to each element to control the content ratio of different elements.

[0062] (3) Cleaning of forming equipment.

[0063] In an embodiment of the present invention, before additive manufacturing, the powder barrel and powder feeding tray of the powder feeder may be wiped with absorbent cotton soaked in alcohol to ensure that the residual powder deposited last time is cleaned up.

[0064] At the same time, an explosion-proof vacuum cleaner can be used to clean the residual powder and condensate in the laser head, powder outlet pipe and molding bin, and then the powder delivery pipe and the inner wall of the molding bin can be wiped with cotton wool soaked in alcohol to ensure that there is no contamination during the sample deposition process.

[0065] Grind the substrate surface until it is free of oxide and flat, then clean the oil and dirt on the surface with alcohol. Put the polished and cleaned substrate into the molding chamber.

[0066] In an embodiment of the present invention, the substrate used in the laser coaxial powder feeding additive manufacturing process may be a pure Ni substrate.

[0067] (4) Add metal powder and introduce protective gas.

[0068] After cleaning the equipment, the several types of pure metal powders required in step (2) are loaded into separate powder feeding barrels.

[0069] Finally, protective gas is introduced into the molding chamber to control the oxygen content in the molding chamber below 100 ppm to ensure that the sample is not oxidized during the preparation process and to reduce the impact of the external environment.

[0070] In an embodiment of the present invention, the protective gas may be high-purity argon gas.

[0071] In an embodiment of the present invention, the metal powder may be dried in a vacuum drying box before being loaded into the powder barrel to remove moisture from the powder and ensure printing quality.

[0072] It should be noted that the powder feeding barrel containing different types of metal powders is directly connected to a mixing powder feeding device, such as a powder mixer, which can achieve real-time mixing of multiple powders to ensure that the powder delivered during the printing process is a uniformly mixed metal powder.

[0073] (5) Process parameter setting.

[0074] The main process parameters that need to be controlled in laser coaxial powder feeding additive manufacturing are: laser power, scanning speed, overlap rate, powder feeding rate and layer thickness.

[0075] Based on the alloy of the present invention, the process parameters are designed as follows: laser power is 3000-4000W, scanning speed is 600-1000mm / min, overlap rate is 35-50%, powder feeding rate is 15-20g / min, and layer thickness is 0.6-0.8mm.

[0076] Illustratively, the laser power may be one of 3000 W, 3100 W, 3200 W, 3300 W, 3400 W, 3500 W, 3600 W, 3700 W, 3800 W, 3900 W, 4000 W or any value within the above range.

[0077] Illustratively, the scanning speed may be one of 600 mm / min, 700 mm / min, 800 mm / min, 900 mm / min, 1000 mm / min, or any value satisfying the above range.

[0078] Exemplarily, the overlap rate can be one of 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50% or any value that meets the above range.

[0079] Exemplarily, the powder feeding rate may be one of 15 g / min, 16 g / min, 17 g / min, 18 g / min, 19 g / min, 20 g / min or any value satisfying the above range.

[0080] Exemplarily, the layer thickness may be one of 0.6 mm, 0.7 mm, 0.8 mm, or any value satisfying the above range.

[0081] In an embodiment of the present invention, when depositing alloys in different temperature control zones, due to the different ratios of alloy components, in order to ensure the forming quality of each temperature control zone, it is necessary to adjust and set the corresponding process parameter values ​​for mixed powders with different element ratios. Therefore, the parameter values ​​can be set according to actual conditions without specific limitations.

[0082] For example, when the alloy composition difference in different temperature zones is small, the same forming process parameters are used for forming. If the alloy composition difference is large, the process parameters should be appropriately adjusted to ensure the forming quality.

[0083] In addition, the scanning strategy in the embodiment of the present invention is not limited to the "bow-step" reciprocating scanning, and can be adjusted according to actual conditions, such as: "67° interlayer rotation" scanning strategy, "orthogonal" scanning strategy, etc.

[0084] (6) Partition printing.

[0085] During the forming process, partition manufacturing is carried out.

[0086] When printing different phase change temperature control areas, it is necessary to set the corresponding powder barrel speed and process parameters. The metal powder in each powder barrel is transported to the powder mixer, and the metal powder is mixed evenly by the powder mixer and then sent to the powder feeding pipe. The corresponding number of layers is deposited according to the designed layer thickness, and finally a metal solid phase change temperature control structure is obtained.

[0087] In an embodiment of the present invention, after the target metal solid-state phase change temperature control structure is printed as a whole, argon gas is continuously introduced, and the sample is taken out after it is completely cooled to prevent oxidation of the high-temperature sample.

[0088] Another aspect of the present invention provides a Figure 1 The metal solid-state phase change temperature control structure based on laser coaxial powder feeding additive manufacturing technology shown includes multiple temperature control zones formed in one piece, and the multiple temperature control zones have different functional parameters.

[0089] Among them, the functional parameters include thermal conductivity, phase change temperature and phase change latent heat.

[0090] In an embodiment of the present invention, the metal solid phase change temperature control structure may be an integrated alloy plate having a plurality of alloy plates with different alloy component ratios. In other words, each alloy plate forms a temperature control area.

[0091] In the embodiment of the present invention, the alloy plate close to the electronic component has a relatively high thermal conductivity, and the alloy plate around the electronic component has a relatively high phase change temperature and a large phase change latent heat.

[0092] In other words, the high thermal conductivity alloy is close to the electronic components, and the alloy plate or phase change temperature control area with relatively high phase change temperature and relatively large phase change latent heat is located around the electronic components.

[0093] The metal solid phase change temperature control structure and the preparation method thereof in the present invention will be described in detail below through specific embodiments.

[0094] Example 1

[0095] See preparation instructions Figure 2 As shown, in Example 1, a method for preparing a metal solid phase change temperature control structure is provided, comprising the following steps:

[0096] The first step is to use 3D modeling software to build a model of the target metal solid phase change temperature control structure, clarify the division of temperature areas, and obtain two temperature control areas, namely, the high thermal conductivity alloy temperature control area and the high phase change endothermic alloy temperature control area (with large latent heat), such as Figure 1 shown.

[0097] In Example 1, the high thermal conductivity alloy temperature control area adopts an alloy composition of a high thermal conductivity Cu-based / Al-based alloy, and the high phase change endothermic alloy adopts a Cu-Al-based alloy.

[0098] The three-dimensional model is converted into a file format, recognized by a computer, and the different phase change temperature control areas are sliced ​​and printed in layers.

[0099] In the second step, use cotton wool soaked in alcohol to wipe the powder barrel and powder tray of the powder feeder to ensure that the residual powder from the last deposition is cleaned up. Use an explosion-proof vacuum cleaner to clean the residual powder and condensate in the laser head, powder outlet pipe and molding chamber, and then use cotton wool soaked in alcohol to wipe the powder feed pipe and the inner wall of the molding chamber to ensure that there is no contamination during the sample deposition process. Grind the surface until there is no oxide and it is flat, and then use alcohol to clean the oil and dirt on the surface. Put the polished and cleaned substrate into the molding chamber.

[0100] The third step is to put the dried high thermal conductivity alloy powder and high phase change endothermic alloy powder into powder barrels respectively. Then, the rotation speed of different powder barrels is calculated based on the total powder feeding amount of 15g / min.

[0101] The fourth step is to introduce high-purity argon gas into the forming chamber until the oxygen content in the forming chamber is less than 100 ppm.

[0102] Step 5: Set the process parameters: laser power is 3500W, scanning speed is 600mm / min, spot diameter is 6mm, overlap rate is 50%, layer thickness is 0.5mm, and powder feeding rate is 12g / min. The scanning strategy is "bow-shaped step" back and forth scanning. Since the alloy composition difference in different phase change temperature regions in Example 1 is small, the same forming process parameters are adopted for forming.

[0103] Step 6: Set the powder barrel speed, and the powder barrel will deliver powder to the top of the laser. Figure 2 shown.

[0104] According to the regional composition setting, adjust the rotation speed of the powder barrel corresponding to the relevant alloy composition, select different temperature control areas for printing, and stop after layer-by-layer deposition and printing to the specified height.

[0105] Step 7: Continue to introduce argon gas and take out the sample after it has completely cooled to room temperature.

[0106] The present invention performs regional design on the metal solid-state phase change temperature control structure, utilizes the regional composition organization customized manufacturing capability of additive manufacturing, and realizes precise control of metal thermal conductivity and solid-state phase change parameters (such as temperature and latent heat) by selecting alloy composition. This is beneficial to realizing the continuous and efficient temperature control capability of the intelligent metal temperature control structure within the allowable temperature rise range of the equipment, thereby improving the reliability of the application of electronic components.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A method for additively preparing a metal solid phase change temperature control structure, characterized in that: The following steps are involved: Conduct three-dimensional modeling of the target metal solid phase change temperature control structure and divide it into multiple temperature control areas; Design the alloy composition corresponding to different temperature control areas according to the temperature control targets required by different temperature control areas; Under a protective atmosphere, a laser coaxial powder feeding additive manufacturing process is used to perform zone printing to form the multiple temperature control areas, thereby obtaining the metal solid-state phase change temperature control structure.

2. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1, characterized in that: The multiple temperature control areas include at least one high thermal conductivity alloy temperature control area and at least one high phase change endothermic alloy temperature control area; the high thermal conductivity alloy temperature control area is used to be close to the heat dissipation device, and the high phase change endothermic alloy temperature control areas are distributed around the heat dissipation device.

3. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 2, characterized in that: The alloy composition corresponding to the high thermal conductivity alloy temperature control region is different from the alloy composition corresponding to the high phase change endothermic alloy temperature control region.

4. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 2, characterized in that: The thermal conductivity of the high thermal conductivity temperature control area is ≥120 W / (m·K).

5. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1, characterized in that: The high phase change endothermic alloy includes one of a Cu-based, Fe-based and Ni-based alloy having a solid phase change endothermic effect.

6. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1, characterized in that: The process of zone printing using laser coaxial powder feeding additive manufacturing process includes: Set the process parameters and the speed of the powder barrel corresponding to each metal powder; The metal powder in each of the powder barrels is transported to the powder mixer, mixed evenly and then sent to the powder feeding pipe, and the corresponding number of layers are deposited according to the preset layer thickness, and printing is performed in different phase change temperature control areas in sequence; Preferably, the metal powder is spherical powder, and the powder particle size is 53-150 μm.

7. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1 or 6, characterized in that: The process parameters set for the laser coaxial powder feeding additive manufacturing process include: The laser power is 3000-4000W, the scanning speed is 600-1000mm / min, the overlap rate is 35-50%, the powder feeding rate is 15-20g / min, and the layer thickness is 0.6-0.8mm.

8. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1 or 6, characterized in that: The powder drum rotation speed corresponding to the relevant metal powder is obtained according to the metal solid phase change alloy components required by the multiple temperature control zones.

9. The additive manufacturing method for a metal solid phase change temperature control structure according to claim 1, characterized in that: The substrate used in the laser coaxial powder feeding additive manufacturing process has an alloy composition similar to the alloy composition required in the temperature control area; Preferably, before the partition printing is performed using the laser coaxial powder feeding additive manufacturing process, the forming device and the substrate are cleaned; Preferably, the protective atmosphere comprises a nitrogen atmosphere.

10. A metal solid phase change temperature control structure prepared by the additive preparation method according to any one of claims 1 to 9, characterized in that: It comprises a plurality of integrally formed temperature control areas, and the plurality of temperature control areas have different functional parameters.

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