Polishing equipment for semiconductor substrate production and processing

Abstract

The polishing equipment comprises a base, a mounting plate is fixedly connected to the upper end of the base, a polishing box is fixedly connected to the side wall of the mounting plate, two frame openings are symmetrically formed in the side wall of the polishing box, a conveying frame a is fixedly connected to the inner wall of the polishing box, and a detection mechanism is mounted in the conveying frame a; the detection mechanism comprises two detection plates and two cavities symmetrically formed in the conveying frame a, fixing plates are slidably connected to the inner walls of the two cavities, conductive blocks a are fixedly connected to the side walls of the fixing plates, conductive blocks b are slidably connected to the inner walls of the cavities, and fixing rods are fixedly connected to the side walls of the conductive blocks b; sliding grooves are formed in the side walls of the two detection plates, and one end of the fixing rod penetrates through the inner wall of the conveying frame a and is in sliding connection with the inner walls of the sliding grooves. The detection mechanism can automatically screen out the semiconductor substrates with unqualified sizes, so that later screening is avoided, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor substrate production and processing, and in particular to a polishing device for semiconductor substrate production and processing. Background Art

[0002] Semiconductor substrate is the basic material for manufacturing PCB. The required circuit pattern is obtained through selective hole processing, chemical copper plating, electroplating copper, etching and other processing. It has three functions of conductivity, insulation and support. Silicon wafer is the mother material for making semiconductor substrate. In the production and processing of silicon wafer, it needs to go through rough grinding, chemical etching and polishing to become a semiconductor substrate.

[0003] The existing patent "A substrate processing device for semiconductor production" with application number "CN202111436061.9" includes: a base, two transmission frames are provided on the left side of the top of the base, and the two transmission frames are distributed in parallel, and a silicon wafer is provided on the transmission frame; a polishing cylinder is provided on the right side of the transmission frame, and the polishing cylinder is fixedly connected to the base by embedding; a rotating seat is provided in the middle of the polishing cylinder, and a polishing turntable is provided on the rotating seat, and the polishing turntable is located in the polishing cylinder; a transmission roller group is provided on the right side of the top of the base; a driving mechanism is provided at the bottom of the base, and a collecting component is provided on the right side of the driving mechanism, which can simultaneously polish the upper and lower sides of the silicon wafer. Polishing is performed simultaneously, thereby saving the process of polishing the silicon wafer face, greatly improving the polishing efficiency, but there are still defects: there is a lack of a device for detecting the size of the semiconductor substrate, and the size of the semiconductor substrate cannot be detected before the semiconductor substrate is transported to the polishing device for polishing and polishing. Semiconductor substrates with unqualified sizes are screened out, and polishing all semiconductor substrates at the same time will reduce the polishing efficiency. Further screening will be required later, reducing the production and processing efficiency of the semiconductor substrate. There may be a device for detecting the size of the semiconductor substrate in the prior art, but basically infrared detection equipment is used, the equipment is expensive, and the subsequent maintenance is difficult and the maintenance cost is high.

[0004] Based on this, we propose a polishing device for semiconductor substrate production and processing. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a polishing device for the production and processing of semiconductor substrates.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A polishing device for producing and processing semiconductor substrates comprises a base, the upper end of the base is fixedly connected to a mounting plate, the side wall of the mounting plate is fixedly connected to a polishing box, the side wall of the polishing box is symmetrically provided with two frame openings, the inner wall of the polishing box is fixedly connected to a conveying frame a, a detection mechanism is installed in the conveying frame a, the detection mechanism comprises two detection plates and two cavities symmetrically provided in the conveying frame a, the inner walls of the two cavities are both slidably connected to a fixing plate, the side wall of the fixing plate is fixedly connected to a conductive block a, the inner wall of the cavity is slidably connected to a conductive block b, the side wall of the conductive block b is fixedly connected to a fixing rod, the side walls of the two detection plates are provided with sliding grooves, and the One end of the fixed rod passes through the inner wall of the conveying frame a and is slidably connected to the inner wall of the slide groove. A plurality of springs a are fixedly connected to the inner wall of the cavity. The other ends of the plurality of springs a are fixedly connected to the side wall of the conductive block b. A discharge port is provided at the lower end of the conveying frame a. A guide plate is rotatably connected to the inner wall of the discharge port. An electric push rod a is fixedly connected to the bottom of the grinding box. The movable end of the electric push rod a abuts against the lower end of the guide plate. The electric push rod a is electrically connected to the conductive block a through a wire. Two threaded rods are symmetrically threadedly connected to the side wall of the conveying frame a. The other ends of the two threaded rods pass through the side wall of the conveying frame a and are threadedly connected to the fixed plate. A conveying device a is installed on the side wall of the mounting plate.

[0008] Preferably, the detection mechanism also includes a conductive block c fixedly connected to the inner wall of one of the slide grooves, the side wall of the fixed rod located in the slide groove is fixedly connected to a conductive block d, the inner wall of the slide groove is fixedly connected to a spring b, the other end of the spring b is fixedly connected to the side wall of the fixed rod, the side wall of the polishing box is fixedly connected to a cross plate, the lower end of the cross plate is fixedly connected to an electric push rod b, the electric push rod b is electrically connected to the conductive block c through a wire, and the side wall of the mounting plate is installed with a conveying device b.

[0009] Preferably, the inner wall of the polishing box is symmetrically rotatably connected to two rotating shafts, and the ends of the two rotating shafts close to each other are fixedly connected to polishing discs. The upper and lower ends of the polishing box are fixedly connected to two motors, and the output ends of the two motors pass through the polishing box and are fixedly connected to the rotating shafts.

[0010] Preferably, a collecting box cooperating with the guide plate is fixedly connected to the lower end of the polishing box.

[0011] Preferably, a conveying rack b is fixedly connected to the inner wall of the polishing box, and the conveying rack a and the conveying rack b are respectively aligned with the two frame openings.

[0012] Preferably, the side walls of the two detection plates close to each other are coated with a smooth coating, and the upper end of the guide plate is coated with a smooth coating.

[0013] Preferably, the fixing rod and the side wall of the spring a are both covered with insulating sleeves.

[0014] The present invention has the following beneficial effects:

[0015] 1. By setting up a detection mechanism, semiconductor substrates with too small width can be automatically screened out without polishing, avoiding later screening and improving production efficiency;

[0016] 2. By setting up a detection mechanism, semiconductor substrates with excessive width can be automatically screened out, and then re-transmitted to the cutting equipment for cutting processing, so that semiconductor substrates that do not meet the size can be screened out, improving the efficiency of grinding and polishing;

[0017] 3. This device can detect the size of the semiconductor substrate by setting up a detection plate and a plurality of conductive blocks. Compared with the existing infrared detection equipment, the cost is lower and the subsequent maintenance cost is also very low;

[0018] 4. By setting up a grinding box, the flying chips generated during the grinding process can be shielded, which can prevent the chips from flying around and splashing onto the surrounding workers, causing injuries to the workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a polishing device for producing and processing semiconductor substrates proposed by the present invention;

[0020] Figure 2 A schematic diagram of the operating state of a polishing device for producing and processing semiconductor substrates proposed by the present invention;

[0021] Figure 3 for Figure 1 A schematic cross-sectional view of the middle conveyor frame a;

[0022] Figure 4 for Figure 3 A schematic diagram of the structure enlargement at point A;

[0023] Figure 5 for Figure 3 Schematic diagram of the enlarged structure at point B in FIG.

[0024] In the figure: 1 base, 101 mounting plate, 2 grinding box, 3 frame mouth, 4 conveying frame a, 5 conveying frame b, 6 detection plate, 7 cavity, 8 fixing plate, 9 conductive block a, 10 conductive block b, 11 fixing rod, 12 slide groove, 13 spring a, 14 discharge port, 15 guide plate, 16 electric push rod a, 17 threaded rod, 18 conveying device a, 19 conductive block c, 20 conductive block d, 21 spring b, 22 cross plate, 23 electric push rod b, 24 conveying device b, 25 rotating shaft, 26 grinding disc, 27 motor, 28 collection box. DETAILED DESCRIPTION

[0025] Reference Figure 1-5A polishing device for producing and processing semiconductor substrates comprises a base 1, the lower end of the base 1 is symmetrically fixedly connected with a support column, and the lower ends of the support columns are fixedly connected to the ground through expansion screws, the upper end of the base 1 is fixedly connected with a mounting plate 101, the side wall of the mounting plate 101 is fixedly connected with a polishing box 2, the side wall of the polishing box 2 is symmetrically provided with two frame openings 3, the inner wall of the polishing box 2 is fixedly connected with a conveying rack a4, the conveying rack a4 is hollow and both ends are open, a detection mechanism is installed in the conveying rack a4, the detection mechanism comprises two detection plates 6 and two cavities 7 symmetrically provided in the conveying rack a4, the side walls of the two detection plates 6 close to each other are coated with a smooth coating, which can greatly reduce the friction between the semiconductor substrate and the detection plate 6, the inner walls of the two cavities 7 are slidably connected with a fixing plate 8, the side wall of the fixing plate 8 is fixedly connected with a conductive block a9, an insulating pad is provided between the fixing plate 8 and the conductive block a9, which plays a good insulating role, the cavity 7 A conductive block b10 is slidably connected to the inner wall, and a fixed rod 11 is fixedly connected to the side wall of the conductive block b10. A slide groove 12 is provided on the side walls of the two detection plates 6. One end of the fixed rod 11 penetrates the inner wall of the conveying frame a4 and is slidably connected to the inner wall of the slide groove 12. A plurality of springs a13 are fixedly connected to the inner wall of the cavity 7, and the other ends of the plurality of springs a13 are fixedly connected to the side wall of the conductive block b10. A discharge port 14 is provided at the lower end of the conveying frame a4, and a guide plate 15 is rotatably connected to the inner wall of the discharge port 14, and the upper end of the guide plate 15 is coated with a smooth coating. An electric push rod a16 is fixedly connected to the bottom of the polishing box 2, and the movable end of the electric push rod a16 is abutted against the lower end of the guide plate 15. The electric push rod a16 is electrically connected to the conductive block a9 through a wire. Two threaded rods 17 are symmetrically threadedly connected to the side wall of the conveying frame a4, and the other ends of the two threaded rods 17 penetrate the side wall of the conveying frame a4 and are threadedly connected to the fixed plate 8. A conveying device a18 is installed on the side wall of the mounting plate 101.

[0026] It should be noted that the conveying device a18 includes conveying rollers and conveying belts. The conveying rollers are connected by the conveying belts, and also includes a servo motor for driving the conveying rollers to rotate. This is existing technology and will not be described in detail here.

[0027] It should be noted that the spring coefficient of the spring a13 is relatively small. Even if the spring a13 is stretched to the maximum extent, the two detection plates 6 are unable to clamp the semiconductor substrate.

[0028] The fixing rod 11 and the side wall of the spring a13 are both covered with insulating sleeves, which play a good insulating role.

[0029] Furthermore, when the width of the semiconductor substrate is too small, the semiconductor substrate cannot push the conductive block b10 to contact the conductive block a9 through the detection plate 6, and the electric push rod a16 cannot be energized and extended, and the guide plate 15 is in an inclined state. When the semiconductor substrate is transported in the conveying rack a4, it will fall onto the guide plate 15 through the discharge port 14, and then slide along the guide plate 15 to the collection box 28 for collection. The semiconductor substrates that do not meet the size can be screened out without the need for grinding and polishing, which can improve the efficiency of grinding and polishing.

[0030] It is worth mentioning that the position of the conductive block a9 can be adjusted by rotating the threaded rod 17, so that the detection board 6 can perform size detection on semiconductor substrates of different widths, which has a wider range of applications.

[0031] The detection mechanism also includes a conductive block c19 fixedly connected to the inner wall of one of the slide grooves 12, a conductive block d20 fixedly connected to the side wall of the fixed rod 11 located in the slide groove 12, a spring b21 fixedly connected to the inner wall of the slide groove 12, and the other end of the spring b21 fixedly connected to the side wall of the fixed rod 11, a cross plate 22 fixedly connected to the side wall of the grinding box 2, and an electric push rod b23 fixedly connected to the lower end of the cross plate 22, and the electric push rod b23 is electrically connected to the conductive block c19 through a wire, and a conveying device b24 is installed on the side wall of the mounting plate 101. It should be noted that the conveying device b24 includes conveying rollers and conveying belts, and the conveying rollers are connected by conveying belts, and also includes a servo motor for driving the conveying rollers to rotate. This is a prior art and will not be elaborated here, and the conveying directions of the conveying device a18 and the conveying device b24 are opposite. The conveying device a18 conveys the semiconductor substrate from left to right, and the conveying device b24 conveys the semiconductor substrate from right to left.

[0032] Furthermore, when the size of the semiconductor substrate is too large, the semiconductor substrate will abut against the end of the detection plate 6 located outside the polishing box 2 during the transportation process, and will be stuck and unable to be transported to the conveying rack a4. At this time, the semiconductor substrate will push the two detection plates 6 so that the conductive block c19 contacts the conductive block d20, and the electric push rod b23 will be energized and extended, pushing the semiconductor substrate to fall onto the conveying device b24. The conveying device b24 will transport the semiconductor substrate to the left to the cutting equipment for re-cutting, so that the semiconductor substrates that do not meet the size can be screened out, thereby improving the efficiency of grinding and polishing.

[0033] It is worth mentioning that the device can detect the size of the semiconductor substrate by setting up a detection plate 6 and a plurality of conductive blocks. Compared with the existing infrared detection equipment, the cost is lower and the subsequent maintenance cost is also very low.

[0034] The inner wall of the polishing box 2 is symmetrically rotatably connected to two rotating shafts 25, and the ends of the two rotating shafts 25 close to each other are fixedly connected to grinding discs 26. The upper and lower ends of the polishing box 2 are fixedly connected to two motors 27, and the output ends of the two motors 27 pass through the polishing box 2 and are fixedly connected to the rotating shafts 25.

[0035] It is worth mentioning that the grinding box 2 can shield the flying chips generated during the grinding process, thereby preventing the chips from flying around and splashing onto the surrounding workers, causing injuries to the workers.

[0036] A collecting box 28 that cooperates with the guide plate 15 is fixedly connected to the lower end of the polishing box 2 .

[0037] The inner wall of the polishing box 2 is fixedly connected with a conveying rack b5 , and the conveying rack a4 and the conveying rack b5 are respectively aligned with the two frame openings 3 .

[0038] It should be noted that the device is arranged at the rear end of the cutting equipment, and the semiconductor substrate is transported to the device for grinding and polishing after being cut.

[0039] In the present invention, firstly, by rotating the two threaded rods 17, the fixed plate 8 is driven to slide on the inner wall of the cavity 7, and then the two conductive blocks a9 are driven to move, and the distance between the two conductive blocks a9 is adjusted, so that semiconductor substrates of different widths can be detected. After the width is adjusted, the conveying device a18 and the motor 27 are started to convey the semiconductor substrate to the conveying rack a4 through the frame opening 3. Before entering the conveying rack a4, the semiconductor substrate will squeeze the detection plate 6 to both sides, and then the detection plate 6 will give pressure to the two fixed rods 11, driving the two conductive blocks b10 to slide close to the conductive block a9 in the cavity 7. When the width of the semiconductor substrate meets the standard, the conductive block b10 just moves to contact with the conductive block a9, and the electric push rod a16 is energized and extended, against one end of the guide plate 15, driving the guide plate 15 to rotate upward, so that the guide plate 15 completely blocks the discharge port 14, and then the semiconductor substrate that meets the standard will continue to be conveyed to the right in the conveying rack a4.

[0040] When the semiconductor substrate is transported between the two grinding discs 26, the motor 27 will drive the grinding discs 26 to rotate through the two rotating shafts 25, and then grind and polish the two surfaces of the semiconductor substrate. After grinding, it will continue to be transported to the right, and transported out of the grinding box 2 through the conveying rack b5 and the frame mouth 3, thereby completing the grinding and polishing. The flying chips generated during the grinding process will be blocked by the grinding box 2, which can prevent the chips from flying around and splashing onto the surrounding workers, causing injuries to the workers.

[0041] When the width of the semiconductor substrate is too small, the semiconductor substrate cannot push the conductive block b10 to contact the conductive block a9 through the detection plate 6, and the electric push rod a16 cannot be energized. At this time, the guide plate 15 is in a tilted state. When the semiconductor substrate is transported in the conveying rack a4, it will fall onto the guide plate 15 through the discharge port 14, and then slide along the guide plate 15 to the collection box 28 for collection, so there is no need to grind and polish it. Semiconductor substrates that do not meet the size can be screened out, thereby improving the efficiency of grinding and polishing, avoiding screening in the later stage, and improving production efficiency.

[0042] When the size of the semiconductor substrate is too large, the semiconductor substrate will abut against the end of the detection plate 6 outside the polishing box 2 during the transportation process, and will be stuck and unable to be transported to the conveying rack a4. At this time, the semiconductor substrate will push the two detection plates 6 to move to the right, and then the conductive block c19 will quickly approach the conductive block d20. When the conductive block c19 contacts the conductive block d20, the electric push rod b23 will be energized and extended, and the active end of the electric push rod b23 will abut against the upper end of the semiconductor substrate, pushing it to fall onto the conveying device b24. The conveying device b24 will transport the oversized semiconductor substrate to the left to the cutting equipment for re-cutting, so that the semiconductor substrates that do not meet the size can be screened out, thereby improving the efficiency of grinding and polishing.

Claims

1. A polishing device for producing and processing semiconductor substrates, comprising a base (1), characterized in that: A mounting plate (101) is fixed to the upper end of the base (1), a polishing box (2) is fixed to the side wall of the mounting plate (101), two frame openings (3) are symmetrically provided on the side wall of the polishing box (2), a conveying frame a (4) is fixed to the inner wall of the polishing box (2), and a detection mechanism is installed in the conveying frame a (4); The detection mechanism comprises two detection plates (6) and two cavities (7) symmetrically arranged in the conveying frame a (4), the inner walls of the two cavities (7) are slidably connected with a fixing plate (8), the side wall of the fixing plate (8) is fixed with a conductive block a (9), the inner wall of the cavity (7) is slidably connected with a conductive block b (10), the side wall of the conductive block b (10) is fixed with a fixing rod (11), the side walls of the two detection plates (6) are provided with a sliding groove (12), one end of the fixing rod (11) passes through the conveying frame The inner wall of the cavity (7) is fixed with a plurality of springs a (13), and the other ends of the plurality of springs a (13) are fixed with the side wall of the conductive block b (10). A discharge port (14) is provided at the lower end of the conveying frame a (4), and the inner wall of the discharge port (14) is rotatably connected with a guide plate (15). An electric push rod a (16) is fixed to the bottom of the grinding box (2), and the movable end of the electric push rod a (16) abuts against the lower end of the guide plate (15).

2. A polishing device for semiconductor substrate production and processing according to claim 1, characterized in that: The electric push rod a (16) is electrically connected to the conductive block a (9); the side wall of the conveying frame a (4) is symmetrically threaded with two threaded rods (17); the other ends of the two threaded rods (17) penetrate the side wall of the conveying frame a (4) and are threadedly connected to the fixing plate (8); and the side wall of the mounting plate (101) is installed with a conveying device a (18).

3. A polishing device for semiconductor substrate production and processing according to claim 2, characterized in that: The detection mechanism also includes a conductive block c (19) fixedly connected to the inner wall of one of the slide grooves (12); a conductive block d (20) is fixed to the side wall of the fixed rod (11) located in the slide groove (12); a spring b (21) is fixed to the inner wall of the slide groove (12); the other end of the spring b (21) is fixed to the side wall of the fixed rod (11); a transverse plate (22) is fixed to the side wall of the polishing box (2); an electric push rod b (23) is fixed to the lower end of the transverse plate (22); the electric push rod b (23) is electrically connected to the conductive block c (19) through a wire; and a conveying device b (24) is installed on the side wall of the mounting plate (101).

4. The polishing equipment for semiconductor substrate production and processing according to claim 3, characterized in that: The inner wall of the polishing box (2) is symmetrically rotatably connected to two rotating shafts (25), and a polishing disc (26) is fixed to one end of the two rotating shafts (25) close to each other. Two motors (27) are fixed to the upper and lower ends of the polishing box (2), and the output ends of the two motors (27) pass through the polishing box (2) and are connected to the rotating shafts (25).

5. The polishing equipment for semiconductor substrate production and processing according to claim 1, characterized in that: A collecting box (28) matched with the guide plate (15) is fixed at the lower end of the polishing box (2).

6. The polishing equipment for semiconductor substrate production and processing according to claim 1, characterized in that: A conveying frame b (5) is fixed to the inner wall of the polishing box (2), and the conveying frame a (4) and the conveying frame b (5) are respectively aligned with the two frame openings (3).

7. The polishing equipment for semiconductor substrate production and processing according to claim 1, characterized in that: The side walls of the two detection plates (6) close to each other are coated with a smooth coating, and the upper end of the guide plate (15) is coated with a smooth coating.

8. The polishing equipment for semiconductor substrate production and processing according to claim 7, characterized in that: The fixing rod (11) and the side wall of the spring a (13) are both sleeved with insulating sleeves.

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