Wafer cleaning liquid feeding device and feeding method thereof

Abstract

The present invention belongs to the field of conveying technology, and in particular to a wafer cleaning liquid feeding device and a feeding method thereof; the present invention provides a wafer cleaning liquid feeding device, comprising: a positioning plate, on which a plurality of discharge holes are opened at equal intervals; a conveying ring, and each discharge hole is evenly distributed between an inner and outer ring; a plurality of scraper blade assemblies are circumferentially arranged around the conveying ring, and each scraper blade assembly corresponds to a corresponding discharge hole, and comprises a scraper and sweeper suitable for sliding in the conveying ring; wherein the bottom of the scraper and sweeper comprises a material receiving groove, and the material receiving groove is connected with a discharge air pipe in the scraper and sweeper; the sliding of the scraper and sweeper causes particles deposited on the bottom wall of the conveying ring to enter the material receiving groove and gather toward the discharge hole, and when the scraper and sweeper moves above the discharge hole, the particles in the material receiving groove are pushed into the discharge hole; through the arrangement of the scraper blade assembly, particles in the grinding liquid are prevented from being deposited in the conveying ring, thereby improving the grinding efficiency and the utilization rate of the diamond liquid.

Description

Technical Field

[0001] The invention belongs to the field of conveying technology, and specifically relates to liquid distribution, and in particular to a wafer cleaning liquid feeding device and a feeding method thereof. Background Art

[0002] In the semiconductor silicon carbide substrate industry, the traditional wafer grinding method is rough grinding to remove the surface knife marks and surface damage layer of the silicon carbide wafer caused by the cutting process and repair the deformation caused by cutting. Due to the high hardness of SiC (silicon carbide), high-hardness abrasives must be used to grind the crystal surface of SiC slices during the grinding process. Using micron-sized diamond particles in diamond liquid to grind the surface of silicon carbide wafers can achieve rapid thinning.

[0003] In the related technology, holes are evenly drilled inside the conveying ring and connected to the positioning plate through pipelines. Diamond liquid drips onto the positioning plate along the evenly distributed pipelines in the conveying ring. The diamond liquid is evenly distributed on the positioning plate by the rotation of the planetary wheel. Then, the silicon carbide wafer is fixed in the middle of the planetary wheel, and a certain pressure and rotation speed are applied to the silicon carbide wafer, so that there is a relative speed difference and pressure between the silicon carbide wafer and the positioning plate, and the silicon carbide wafer is ground to achieve rapid thinning of the silicon carbide wafer.

[0004] However, the traditional conveying ring only relies on the inertia of rotation to flow the diamond liquid through the pipeline to the positioning plate. The diamond particles in the diamond liquid are easy to deposit, resulting in uneven distribution, which reduces the efficiency of diamond abrasive use, increases the loss of diamond liquid, and causes unstable chip removal.

[0005] Therefore, how to avoid the problem of reduced efficiency of the use of the polishing liquid and unstable chip removal caused by high usage of the polishing liquid is a technical problem that urgently needs to be solved in this field.

[0006] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0007] The disclosed embodiments at least provide a wafer cleaning liquid supply device and a working method thereof.

[0008] In a first aspect, an embodiment of the present disclosure provides a wafer cleaning liquid supply device, comprising:

[0009] A positioning plate, on which a number of feeding holes are provided at equal intervals;

[0010] The conveying ring includes an inner and outer ring, and is arranged on the positioning plate, and each material discharge hole is evenly distributed between the inner and outer rings;

[0011] A plurality of scraper blade assemblies are arranged circumferentially around the conveying ring, and each scraper blade assembly corresponds to a corresponding material discharge hole, and includes a scraper and sweeper member suitable for sliding in the conveying ring;

[0012] Wherein, the bottom of the scraping and sweeping member includes a material receiving groove, and the material receiving groove is connected with the material discharge air pipe in the scraping and sweeping member;

[0013] The scraper and sweeper slides to make the particles deposited on the bottom wall of the conveying ring enter the material receiving groove and gather toward the lower material hole. When the scraper and sweeper moves above the lower material hole, the particles in the material receiving groove are pushed into the lower material hole.

[0014] In an optional embodiment, the scraper assembly includes: a limit block, which is hollow inside and is arranged on the outer wall of the conveying ring;

[0015] A connecting air pipe is arranged on the outer wall of one end of the limit block and is connected to the air pump;

[0016] One end of the scraper is slidably fitted with the conveying ring, and the other end is slidably fitted with the inner wall of the limit block;

[0017] The connecting air pipe delivers compressed air into the limit block to push the scraper to slide toward the lower material hole;

[0018] When the trachea negative pressure suction limit block is connected, the negative pressure suction scraper is reset and slid.

[0019] In an optional embodiment, the scraping member is "L"-shaped and has an air hole therein, with one end of the air hole facing the bottom wall of the conveying ring and the other end facing the connecting air pipe.

[0020] In an optional embodiment, a sealing plate is hingedly connected to the inner wall of one end of the air hole close to the air pipe, and the sealing plate is suitable for opening and closing the air hole;

[0021] Wherein, when the tracheal negative pressure suction limit block is connected, the sealing plate is suitable for closing the air hole.

[0022] In an optional embodiment, the opening of the material receiving trough gradually increases from the end close to the air hole toward the outside;

[0023] When the scraping and sweeping member moves toward the lower material hole, the material receiving groove is suitable for guiding the particles to gather toward the air hole.

[0024] In an optional embodiment, a plurality of liquid inlet pipes are arranged above the conveying ring, one liquid inlet pipe corresponds to one discharge hole, and the liquid inlet pipe is suitable for conveying grinding liquid into the conveying ring.

[0025] In an optional embodiment, the positioning plate has a plurality of feeding holes formed at equal intervals thereon;

[0026] A conveying ring is arranged on the positioning plate, and a feeding hole is arranged between an inner ring and an outer ring of the conveying ring;

[0027] A scraper assembly, wherein a plurality of scraper assemblies are arranged circumferentially around the conveying ring, and one scraper assembly corresponds to one feeding hole;

[0028] The scraper assembly comprises: a limit block, which is hollow inside and is arranged on the outer wall of the conveying ring;

[0029] A connecting air pipe is arranged on the outer wall of one end of the limit block and is connected to the air pump;

[0030] A scraping member, one end of which is slidably fitted with the conveying ring, and the other end of which is slidably fitted with the inner wall of the limit block;

[0031] Wherein, compressed air is delivered into the scraper assembly to push the scraper to slide toward the lower material hole;

[0032] The scraper and sweeper is suitable for gathering the particles deposited on the bottom wall of the conveying ring during the movement;

[0033] Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

[0034] In an optional embodiment, an air hole is provided in the scraping member, one end of the air hole faces the bottom wall of the conveying ring, and the other end faces the connecting air pipe.

[0035] In an optional embodiment, a sealing plate is hingedly connected to the inner wall of one end of the air hole close to the air pipe, and the sealing plate is suitable for opening and closing the air hole;

[0036] Wherein, when the tracheal negative pressure suction limit block is connected, the sealing plate is suitable for closing the air hole.

[0037] In an optional embodiment, the scraping member is provided with a material receiving groove near the bottom wall of the conveying ring, the material receiving groove is communicated with the air hole, and the opening of the material receiving groove faces the material discharge hole;

[0038] The opening of the material receiving trough gradually increases from one end close to the air hole toward the outside.

[0039] In a second aspect, the present disclosure also provides a feeding method, the feeding method comprising:

[0040] The grinding liquid is conveyed into the conveying ring, and the grinding liquid is suitable for flowing along the discharge hole to the positioning plate;

[0041] Compressed air is delivered into the scraper assembly to push the scraper to slide toward the lower material hole;

[0042] The scraper and sweeper is suitable for gathering the particles deposited on the bottom wall of the conveying ring during the movement;

[0043] Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

[0044] The beneficial effect of the present invention is that the wafer cleaning liquid feeding device and feeding method of the present invention, through the cooperation of the scraper assembly and the conveying ring, connect the air pipe to convey compressed air to the limit block, and the compressed air can push the scraper to slide in the conveying ring to gather the particles deposited on the bottom wall of the conveying ring and spray them toward the grinding liquid again, thereby improving the mixing effect of the particles and the grinding liquid, avoiding the waste caused by the deposition of particles in the grinding liquid, and improving the utilization rate of the abrasive.

[0045] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0046] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 A three-dimensional diagram of a wafer cleaning liquid supply device provided in an embodiment of the present disclosure;

[0049] Figure 2 A longitudinal sectional perspective view of a conveying ring and a scraper assembly provided for an embodiment of the present disclosure;

[0050] Figure 3 A transverse cross-sectional perspective view of a scraper assembly provided in an embodiment of the present disclosure;

[0051] Figure 4 A schematic diagram of a state in which a scraping member provided in an embodiment of the present disclosure slides in a limiting block;

[0052] Figure 5 A three-dimensional diagram of a scraping member provided in an embodiment of the present disclosure;

[0053] Figure 6 A sectional perspective view of a scraping member provided in an embodiment of the present disclosure.

[0054] In the figure:

[0055] 1. Positioning plate; 10. Feeding hole; 2. Conveying ring; 20. Liquid inlet pipe; 3. Scraper assembly; 30. Scraping and sweeping member; 31. Limiting block; 32. Connecting air pipe; 33. Air hole; 34. Sealing plate; 35. Material receiving trough. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0058] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0059] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "include", "comprise" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0060] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0061] After research, it was found that the shortcomings of the existing technology are: in the related technology, the conveying ring is evenly drilled with holes and connected to the positioning plate through pipelines. The diamond liquid drips onto the positioning plate along the evenly distributed pipelines in the conveying ring. The diamond liquid is evenly distributed on the positioning plate through the rotation of the planetary wheel. Then the silicon carbide wafer is fixed in the middle of the planetary wheel, and a certain pressure and rotation speed are applied to the silicon carbide wafer, so that there is a relative speed difference and pressure between the silicon carbide wafer and the positioning plate, and the silicon carbide wafer is ground to achieve rapid thinning of the silicon carbide wafer.

[0062] However, the traditional conveying ring only relies on the inertia of rotation to flow the diamond liquid through the pipeline to the positioning plate. The diamond particles in the diamond liquid are easy to deposit, resulting in uneven distribution, which reduces the efficiency of diamond abrasive use, increases the loss of diamond liquid, and causes unstable chip removal.

[0063] Therefore, how to avoid the deposition of diamond particles in diamond liquid is a technical problem that needs to be solved urgently in this field.

[0064] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0065] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0066] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0067] like Figures 1 to 6 As shown, some embodiments provide a wafer cleaning liquid supply device, comprising:

[0068] The positioning disc 1 has a plurality of feeding holes 10 formed at equal intervals thereon; a grinding disc is disposed at the lower end of the positioning disc 1, and the grinding liquid flowing downward through the feeding holes 10 is suitable for flowing to the grinding surface of the grinding disc.

[0069] In order to further improve the grinding efficiency, the grinding liquid is a diamond liquid, that is, a liquid mixed with diamond particles in the grinding liquid, so as to achieve rapid wafer thinning. The conveying ring 2 includes an inner and outer ring, and is arranged on the positioning plate 1, and each feed hole 10 is evenly distributed between the inner and outer rings; the bottom wall of the conveying ring 2 is provided with a circular hole corresponding to the feed hole 10, and after the grinding liquid in the conveying ring 2 flows to the feed hole 10, the grinding liquid is suitable for flowing between the grinding surface of the grinding plate and the wafer. A scraper assembly 3 is circumferentially arranged around the conveying ring 2, and each scraper assembly 3 corresponds to a corresponding discharge hole 10, and includes a scraper 30 suitable for sliding in the conveying ring 2; a plurality of scraper assemblies 3 are circumferentially arranged around the conveying ring 2, and one scraper assembly 3 corresponds to one discharge hole 10; the scraper 30 of the scraper assembly 3 is suitable for reciprocating sliding in the conveying ring 2; wherein, the grinding liquid flows to the grinding surface of the grinding disk below the positioning disk 1 through the discharge hole 10, and the positioning disk 1 rotates to grind the wafer; compressed air is delivered into the scraper assembly 3 to push the scraper 30 to slide toward the discharge hole 10; during the movement, the scraper 30 is suitable for gathering the particles deposited on the bottom wall of the conveying ring 2; the compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid. The bottom of the scraper 30 includes a material receiving groove 35, and the material receiving groove 35 is connected to the material discharge air pipe in the scraper 30; the scraper 30 slides to make the particles deposited on the bottom wall of the conveying ring 2 enter the material receiving groove 35 and gather toward the discharge hole 10, and the scraper 30 moves above the discharge hole 10 to push the particles in the material receiving groove 35 into the discharge hole 10. Through the cooperation of the scraper assembly 3 and the conveying ring 2, the connecting air pipe 32 delivers compressed air to the limit block 31, and the compressed air can push the scraper 30 to slide in the conveying ring 2, so as to gather the particles deposited on the bottom wall of the conveying ring 2 and spray them toward the grinding liquid again, thereby improving the mixing effect of the particles and the grinding liquid, avoiding the waste caused by the deposition of particles in the grinding liquid, and improving the utilization rate of the grinding material.

[0070] Reference Figure 2The scraper assembly 3 includes: a limit block 31, which is hollow inside and is arranged on the outer wall of the conveying ring 2; one limit block 31 corresponds to one feeding hole 10, the limit block 31 is arc-shaped, and the two ends of a plurality of limit blocks 31 are respectively in contact with adjacent limit blocks 31. A connecting air pipe 32 is arranged on the outer wall of one end of the limit block 31 and is connected to the air pump; the connecting air pipe is arranged at the end of the limit block 31 away from the feeding hole 10, and the connecting air pipe 32 conveys compressed air into the limit block 31, and the compressed air is suitable for pushing the scraper 30 to move toward the feeding hole 10, and the scraper 30 slides in the conveying ring 2, and is suitable for gathering and scraping off the particles deposited on the inner bottom wall of the conveying ring 2, and the particles are the diamond particles in the grinding liquid. At the same time, part of the compressed air flows into the conveying ring 2 through the air hole 33; the particles collected and gathered by the receiving groove 35 toward the position of the lower material hole 10 meet the compressed air, which is suitable for spraying water particles, so that they move to the outside of the scraper 30, thereby improving the mixing effect of the particles and the grinding liquid and avoiding the particles from being deposited on the inner bottom wall of the conveying ring 2. When the scraper 30 is reset and moved, the air pump negative pressure sucks the limit block 31, and the negative pressure inside the limit block 31 is suitable for sucking the scraper 30 to make it move in the direction of the connecting air pipe 32. One end of the scraper 30 is slidably adapted to the conveying ring 2, and the other end is slidably adapted to the inner wall of the limit block 31; wherein, the connecting air pipe 32 transports compressed air into the limit block 31 to push the scraper 30 to slide in the direction of the lower material hole 10; when the connecting air pipe 32 negatively sucks the limit block 31, the scraper 30 is reset and slid by negative pressure suction. A stopper is disposed on one side of the material discharge hole 10 away from the corresponding scraping member 30 . When the scraping member 30 moves toward the material discharge hole 10 , the stopper is adapted to block particles from falling into the material discharge hole 10 .

[0071] Reference Figure 6 The scraper 30 is L-shaped and has an air hole 33 therein. One end of the air hole 33 faces the bottom wall of the conveying ring 2, and the other end faces the connecting air pipe 32. When the connecting air pipe 32 delivers compressed air to the scraper 30, the compressed air is suitable for pushing the scraper 30 to move away from the connecting air pipe 32, and part of the compressed air flows toward the conveying ring 2 along the air hole 33. In order to enable the scraper 30 to reset and move in the limit block 31, a sealing plate 34 is hingedly connected to the inner wall of one end of the air hole 33 near the connecting air pipe 32, and the sealing plate 34 is suitable for opening and closing the air hole 33; wherein, when the compressed air is delivered to the limit block 31, the compressed air is suitable for pushing the sealing plate 34 to open the air hole 33, and the compressed air flows toward the conveying ring 2 through the air hole 33. When the connecting air pipe 32 sucks the limit block 31 with negative pressure, the sealing plate 34 is suitable for closing the air hole 33. At this time, the negative pressure of the connecting air pipe 32 sucks the limiting block 31 , and after the negative pressure is formed in the limiting block 31 , the scraping member 30 can slide in the limiting block 31 toward the connecting air pipe 32 .

[0072] In order to improve the air tightness between the scraping member 30 and the limit block 31, a slide groove is provided on the side wall of the limit block 31 close to the conveying ring 2, and the scraping member 30 is slidably arranged in the slide groove; the upper and lower walls of the slide groove are respectively provided with a sealing strip, the two sealing strips are staggered with each other and the side walls are abutted, and the scraping member 30 slides between the two sealing strips. The setting of the sealing strip prevents the air in the limit block 31 from leaking out.

[0073] Reference Figure 5 In order to improve the gathering effect of the particulate material on the bottom wall of the conveying ring 2, the scraping member 30 is provided with a material receiving groove 35 near the bottom wall of the conveying ring 2, the material receiving groove 35 is connected with the air hole 33, and the opening of the material receiving groove 35 faces the feeding hole 10. The opening of the material receiving groove 35 gradually increases from the end close to the air hole 33 to the outside; wherein, when the scraping member 30 moves toward the feeding hole 10, the material receiving groove 35 is suitable for guiding the particulate material to gather toward the air hole 33. When the connecting air pipe 32 delivers compressed air to the limit block 31, the compressed air is suitable for pushing the scraper 30 to move away from the connecting air pipe 32. At this time, the collecting trough 35 is suitable for gathering the particles deposited on the inner bottom wall of the conveying ring 2, and the collecting trough guides the particles to move toward the air hole 33. Further, part of the compressed air flows toward the conveying ring 2 through the air hole 33, and the gathered particles are blown by the compressed air to move away from the scraper 30, thereby improving the mixing effect of the particles and the polishing liquid; the scraper 30 gradually moves toward the lower material hole 10, and the scraper 30 is suitable for pushing the particles to pass through the lower material hole 10 and flow to between the grinding surface of the grinding disk below the positioning disk 1 and the wafer. Refer to the attached Figure 4 When the scraper 30 moves to the top of the material discharge hole 10, the air hole 33 overlaps with the material discharge hole 10, and the compressed air in the material discharge hole 10 is suitable for spraying to the material discharge hole 10 to prevent particles from blocking the material discharge hole 10; when resetting, the air pump negative pressure sucks the limit block 31, and the sealing plate 34 seals the air hole 33 under the action of negative pressure, and the scraper 30 is sucked by the negative pressure and moves in the direction of the connecting air pipe 32.

[0074] Reference Figure 1 A plurality of liquid inlet pipes 20 are arranged above the conveying ring 2. The liquid inlet pipes 20 are suspended, that is, there is a distance between the lower end of the liquid inlet pipe 20 and the conveying ring 2. One liquid inlet pipe 20 corresponds to one discharge hole 10, and the liquid inlet pipe 20 is suitable for conveying grinding liquid into the conveying ring 2.

[0075] Some embodiments provide a wafer cleaning liquid supply device, comprising:

[0076] A positioning plate 1 is provided with a plurality of feeding holes 10 at equal intervals;

[0077] The conveying ring 2 is arranged on the positioning plate 1, and the feeding hole 10 is arranged between the inner and outer rings of the conveying ring 2;

[0078] A scraper assembly 3, wherein a plurality of scraper assemblies 3 are circumferentially arranged around the conveying ring 2, and one scraper assembly 3 corresponds to one discharge hole 10;

[0079] The scraper assembly 3 includes: a limit block 31, which is hollow inside and is arranged on the outer wall of the conveying ring 2;

[0080] A connecting air pipe 32 is arranged on the outer wall of one end of the limiting block 31 and is connected to the air pump;

[0081] A scraper 30, one end of which is slidably fitted with the conveying ring 2, and the other end of which is slidably fitted with the inner wall of the limit block 31;

[0082] The compressed air is delivered into the scraper assembly 3 to push the scraper 30 to slide toward the lower material hole 10;

[0083] The scraper 30 is suitable for gathering the particles deposited on the bottom wall of the conveying ring 2 during the movement;

[0084] Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

[0085] Furthermore, an air hole 33 is defined in the scraping member 30 , one end of the air hole 33 faces the bottom wall of the conveying ring 2 , and the other end faces the connecting air pipe 32 .

[0086] Furthermore, a sealing plate 34 is hingedly connected to the inner wall of one end of the air hole 33 close to the air pipe 32, and the sealing plate 34 is suitable for opening and closing the air hole 33;

[0087] When the air pipe 32 is connected to the negative pressure suction limit block 31 , the sealing plate 34 is suitable for closing the air hole 33 .

[0088] Furthermore, the scraping member 30 is provided with a material receiving groove 35 near the bottom wall of the conveying ring 2, the material receiving groove 35 is communicated with the air hole 33, and the opening of the material receiving groove 35 faces the material discharge hole 10;

[0089] The opening of the receiving groove 35 gradually increases from the end close to the air hole 33 to the outside.

[0090] Some embodiments provide a feeding method, the feeding method comprising:

[0091] The grinding liquid is conveyed into the conveying ring 2, and the grinding liquid is suitable for flowing along the discharge hole 10 to the positioning plate 1;

[0092] Compressed air is delivered into the scraper assembly 3 to push the scraper 30 to slide toward the lower material hole 10;

[0093] The scraper 30 is suitable for gathering the particles deposited on the bottom wall of the conveying ring 2 during the movement;

[0094] Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

[0095] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0096] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0097] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer cleaning liquid feeding device, characterized in that: include: A positioning plate (1) having a plurality of feeding holes (10) formed thereon at equal intervals; The conveying ring (2) comprises an inner and outer ring, and is arranged on the positioning plate (1), and the material discharge holes (10) are evenly distributed between the inner and outer rings; A plurality of scraper blade assemblies (3) are circumferentially arranged around the conveying ring (2), and each scraper blade assembly (3) corresponds to a corresponding material discharge hole (10) and comprises a scraping member (30) suitable for sliding in the conveying ring (2); The bottom of the scraping member (30) comprises a material receiving groove (35), and the material receiving groove (35) is connected to a material discharge air pipe in the scraping member (30); The scraper (30) slides to allow the particles deposited on the bottom wall of the conveying ring (2) to enter the receiving groove (35) and gather toward the lower material hole (10); when the scraper (30) moves above the lower material hole (10), the particles in the receiving groove (35) are pushed into the lower material hole (10); The scraper assembly (3) comprises: a limit block (31) which is hollow inside and is arranged on the outer wall of the conveying ring (2); A connecting air pipe (32) is arranged on an outer wall of one end of the limiting block (31) and is connected to the air pump; One end of the scraping member (30) is slidably fitted with the conveying ring (2), and the other end is slidably fitted with the inner wall of the limiting block (31); The connecting air pipe (32) delivers compressed air into the limiting block (31) to push the scraping member (30) to slide in the direction of the lower material hole (10); When the air pipe (32) is connected to the negative pressure suction limit block (31), the scraping member (30) is reset and slid by the negative pressure suction.

2. The wafer cleaning liquid feeding device according to claim 1, characterized in that: The scraping member (30) is L-shaped and has an air hole (33) therein, wherein one end of the air hole (33) faces the bottom wall of the conveying ring (2) and the other end faces the connecting air pipe (32).

3. The wafer cleaning liquid feeding device according to claim 2, characterized in that: A sealing plate (34) is hingedly connected to the inner wall of one end of the air hole (33) close to the air pipe (32), and the sealing plate (34) is suitable for opening and closing the air hole (33); Wherein, when the air pipe (32) is connected to the negative pressure suction limit block (31), the sealing plate (34) is suitable for closing the air hole (33).

4. The wafer cleaning liquid feeding device according to claim 2, characterized in that: The opening of the material receiving groove (35) gradually increases from the end close to the air hole (33) toward the outside; When the scraping member (30) moves in the direction of the lower material hole (10), the material receiving groove (35) is suitable for guiding the particles to gather toward the air hole (33).

5. The wafer cleaning liquid feeding device according to claim 1, characterized in that: A plurality of liquid inlet pipes (20) are arranged above the conveying ring (2), one liquid inlet pipe (20) corresponds to one material discharge hole (10), and the liquid inlet pipe (20) is suitable for conveying grinding liquid into the conveying ring (2).

6. A wafer cleaning liquid feeding device, characterized in that: include: A positioning plate (1) having a plurality of feeding holes (10) formed thereon at equal intervals; A conveying ring (2) is arranged on the positioning plate (1), and the discharge hole (10) is arranged between the inner and outer rings of the conveying ring (2); A scraper assembly (3), wherein a plurality of the scraper assemblies (3) are arranged circumferentially around the conveying ring (2), and one scraper assembly (3) corresponds to one material discharge hole (10); The scraper assembly (3) comprises: a limit block (31) which is hollow inside and is arranged on the outer wall of the conveying ring (2); A connecting air pipe (32) is arranged on an outer wall of one end of the limiting block (31) and is connected to the air pump; A scraping member (30), one end of which is slidably fitted with the conveying ring (2), and the other end of which is slidably fitted with the inner wall of the limiting block (31); Compressed air is delivered into the scraper assembly (3) to push the scraper (30) to slide in the direction of the lower material hole (10); The scraper (30) is suitable for gathering particles deposited on the bottom wall of the conveying ring (2) during the movement; Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

7. The wafer cleaning liquid supply device according to claim 6, characterized in that: An air hole (33) is formed in the scraping member (30), with one end of the air hole (33) facing the bottom wall of the conveying ring (2) and the other end facing the connecting air pipe (32).

8. The wafer cleaning liquid supply device according to claim 7, characterized in that: A sealing plate (34) is hingedly connected to the inner wall of one end of the air hole (33) close to the air pipe (32), and the sealing plate (34) is suitable for opening and closing the air hole (33); Wherein, when the air pipe (32) is connected to the negative pressure suction limit block (31), the sealing plate (34) is suitable for closing the air hole (33).

9. The wafer cleaning liquid supply device according to claim 8, characterized in that: The scraping member (30) is provided with a material receiving groove (35) near the bottom wall of the conveying ring (2), the material receiving groove (35) is communicated with the air hole (33), and the opening of the material receiving groove (35) faces the material discharge hole (10); The opening of the material receiving groove (35) gradually increases from the end close to the air hole (33) toward the outside.

10. A feeding method, characterized in that: Using the wafer cleaning liquid feeding device according to any one of claims 1 to 9, the feeding method comprises: The grinding liquid is conveyed into the conveying ring (2), and the grinding liquid is suitable for flowing along the discharge hole (10) to the positioning plate (1); Compressed air is delivered into the scraper assembly (3) to push the scraper member (30) to slide in the direction of the lower material hole (10); The scraper (30) is suitable for gathering particles deposited on the bottom wall of the conveying ring (2) during the movement; Compressed air is suitable for pushing the particles so that the particles are evenly mixed in the grinding liquid.

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