Production process and production equipment of semiconductor material processing cutter

Abstract

The invention relates to a production process of a semiconductor material processing cutter, which comprises the following steps of: firstly, in a material mixing procedure, gradually adding resin liquid into a grinding material for stirring, adding resin powder for stirring, realizing primary bonding by using the resin liquid, uniformly mixing the resin powder, and avoiding the situation that the resin powder is dissolved in the resin liquid; the materials can be conveniently and uniformly mixed when being dry in the early stage, a wetting agent is subsequently added to adjust the dryness and wetness degree, and finally, a uniform and loose mixture with moderate dryness and wetness is obtained after vibration screening; and meanwhile, when the formed blank is cured, air circulation is arranged in the curing reaction furnace, so that the temperature in the curing reaction furnace is balanced, the balance and completeness of the reaction atmosphere are guaranteed, and the structural strength of the cured semiconductor cutter is improved. The invention further relates to production equipment of the semiconductor material processing cutter.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor tool production, and in particular to a production process and production equipment for a semiconductor material processing tool. Background Art

[0002] Semiconductor tools (also called semiconductor material special processing tools) are suitable for dry grinding and wet grinding, especially under the conditions of using water-based and oil-based grinding fluids.

[0003] The production process of semiconductor tools includes mixing, pressing and curing. In the mixing process, abrasives, resins, fillers, colorants, etc. are stirred and mixed to obtain a uniform, loose, and moderately dry and wet mixture. In the pressing process, the mixture is transported to a forming mold and pressed to obtain a formed body. In the curing process, the formed body is transported to a curing reaction furnace for consolidation and hardening treatment to obtain a semiconductor tool.

[0004] However, during the curing process, the reaction atmosphere of the molded body in the curing reactor is difficult to be balanced and complete, which makes it difficult to balance the internal structure of the semiconductor tool and reduces the structural strength of the semiconductor tool. Summary of the invention

[0005] The purpose of the present invention is to provide a production process for semiconductor material processing tools, by arranging air circulation in a curing reaction furnace, thereby ensuring the balance and completeness of the reaction atmosphere and improving the structural strength of the cured semiconductor tool.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: A production process for semiconductor material processing tools, including a mixing process, a pressing process and a curing process, wherein the mixing process includes the following: (S1) mixing abrasives: adding abrasives into the upper stirring pot of a double-pot countercurrent mixer in proportion; (S2) adding resin liquid: adding resin liquid into the upper stirring pot in proportion and stirring for 2 to 3 minutes; (S3) adding fillers: adding fillers and colorants into the upper stirring pot in proportion; (S4) stirring once: stirring the materials in the upper stirring pot for 6 minutes. ~ 8 minutes, stir evenly and then add it to the lower stirring pot of the double pot countercurrent mixer; (S5) adding resin powder: adding resin powder to the lower stirring pot according to proportion; (S6) secondary stirring: stirring the material in the lower stirring pot for 4 to 6 minutes, adding a wetting agent according to proportion and stirring for another 2 to 3 minutes; (S7) screening: adding the stirred material to a vibrating screen, and putting the screened mixture into a sand box for standby use; the pressing process includes the following: adding the mixture into the mold cavity of the cold pressing molding machine, scraping it flat and pressing it, and the pressure range of the cold pressing is 15 to 30N / mm 2, the pressing time is 5 to 50 seconds to obtain a molded embryo; the curing process includes the following: placing the molded embryo on a ceramic disc, placing it in a curing reaction furnace for curing, setting air circulation in the curing reaction furnace so that all parts of the molded embryo are heated evenly, starting the temperature rise program of the curing reaction furnace for curing, and obtaining a semiconductor tool.

[0007] By adopting the above technical scheme, firstly, in the mixing process, resin liquid and resin powder are gradually added to the abrasive for stirring, so as to achieve preliminary bonding by using the resin liquid, and the resin powder can be evenly mixed to avoid the resin powder dissolving in the resin liquid. In addition, it is convenient to mix evenly when the material is relatively dry in the early stage, and then a wetting agent is added to adjust the degree of dryness and wetness, and finally a uniform, loose, and moderately dry and wet mixture is obtained after vibration screening. At the same time, when the molded embryo is cured, air circulation is set in the curing reactor to make the temperature in the curing reactor balanced, thereby ensuring the balance and completeness of the reaction atmosphere and improving the structural strength of the cured semiconductor tool.

[0008] The present invention is further configured as follows: starting the temperature rise program of the curing reaction furnace for curing includes the following stages: the first stage: the curing temperature is 75 to 85 degrees Celsius, the resin (resin liquid, resin powder) in the molded embryo begins to melt, water begins to evaporate, and the curing reaction begins; the second stage: the curing temperature is 110 degrees Celsius, the molten resin is cross-linked, and ammonia and water vapor are released; the third stage: the curing temperature is 110 to 180 degrees Celsius, the resin is cross-linked until it is completely cured, and ammonia is released.

[0009] The present invention is further configured as follows: when the curing temperature in the third stage is 110 to 180 degrees Celsius, the final curing temperature is one of the following two options: a) the final temperature is 165 to 170 degrees Celsius, and the semiconductor tool is hard and has good toughness; b) the final temperature is 175 to 180 degrees Celsius, and the semiconductor tool is hard.

[0010] By adopting the above technical scheme, too high a curing temperature will lead to over-curing of the resin, which will increase the hardness of the semiconductor tool and reduce its strength; when the final curing temperature is 165-170 degrees Celsius, the semiconductor tool is hard and has good toughness; when the final curing temperature is 175-180 degrees Celsius, the semiconductor tool is hard; after the final curing temperature exceeds 180 degrees Celsius, the tool is hard and brittle.

[0011] The purpose of the present invention is to provide a production equipment for semiconductor material processing tools, by arranging an air circulation device in the curing reaction furnace and coordinating the rotation of the shelf mechanism, so as to ensure the balance and completeness of the reaction atmosphere and improve the structural strength of the cured semiconductor tool.

[0012] The above technical objectives of the present invention are achieved through the following technical solutions: a production equipment for semiconductor material processing tools, including a double-pot countercurrent mixer, a vibrating screen, a cold press molding machine, and a curing reaction furnace, the curing reaction furnace including a curing furnace body, a transmission network chain arranged in the curing furnace body and with the inlet and outlet ends extending outside the curing area, a closed door arranged at both ends of the curing furnace body located in the heating area, an electric heating device arranged in the curing furnace body, an air circulation device arranged in the curing furnace body, a plurality of ceramic discs, and a plurality of placement mechanisms placed on the transmission network chain and for the ceramic discs to rest; the air circulation device is arranged in a plurality along the length direction of the curing furnace body, the air circulation device includes an exhaust fan arranged in the curing furnace body, an air inlet pipe arranged between the inlet end of the exhaust fan and the top of the curing furnace body, a three-way pipe arranged at the outlet end of the exhaust fan, a first air outlet pipe arranged on the joint of the three-way pipe and connected to one side of the curing furnace body, and a second air outlet pipe arranged on the joint of the three-way pipe and connected to the other side of the curing furnace body, the first air outlet pipe and the curing furnace body The connection point, the connection point of the second air outlet duct and the curing furnace body are staggered; the shelf mechanism includes a base, an anti-slip component arranged in the base and embedded in the transmission network chain through the base after being subjected to the downward force of the ceramic disc and the formed blank, a turntable rotatably connected to the upper surface of the anti-slip component and for the ceramic disc to be embedded, and a wind driving member arranged on the circumference of the turntable and driving the turntable to rotate when being blown by wind; the following operations are performed in the three stages of curing: (1) when the temperature rise program of the curing reaction furnace is in the first stage, the plurality of shelf mechanisms are divided into The first and second air outlet ducts are respectively located in front of the corresponding air circulation device, and the circulating air blown out by the first and second air outlet ducts does not affect the shelf mechanism; (2) when the temperature rise program of the curing reaction furnace is in the second stage and the third stage, the plurality of shelf mechanisms move to the first and second air outlet ducts of the corresponding air circulation device along with the operation of the transmission network chain, and part of the circulating air blown out by the first and second air outlet ducts simultaneously acts on the wind driving part of the turntable, driving the turntable to rotate, so that the molded embryo is evenly heated during the hot air circulation and self-rotation process.

[0013] By adopting the above technical solution, when the shelf mechanism is placed on the transmission network chain, the anti-slip component is first subjected to the downward force of the ceramic disc and the formed blank and then passes through the bottom bracket and is embedded in the transmission network chain, so that the shelf mechanism is combined with the transmission network chain to prevent the shelf mechanism from shaking under the wind. Then, the following operations are performed in the three stages of curing: (1) When the temperature rise program of the curing reaction furnace is in the first stage, the multiple shelf mechanisms are respectively located in front of the corresponding air circulation device, and the circulating air blown out by the first air outlet pipe and the second air outlet pipe does not affect the shelf mechanism, so as to avoid the wind driving the turntable to rotate, resulting in The molded embryo is dispersed; (2) when the temperature rise program of the curing reaction furnace is in the second stage and the third stage, the molded embryo is initially improved in structural strength. At this time, the molding makes multiple shelving mechanisms move to the first air outlet duct and the second air outlet duct of the corresponding air circulation device along with the operation of the transmission network chain. Part of the circulating air blown out by the first air outlet duct and the second air outlet duct acts on the wind driving part of the turntable at the same time, driving the turntable to rotate, so that the molded embryo is evenly heated during the hot air circulation and self-rotation process; finally, the reaction atmosphere is balanced and complete, and the structural strength of the cured semiconductor tool is improved.

[0014] The present invention is further configured as follows: a plurality of through holes are provided at the bottom of the base, the anti-slip assembly comprises a lifting plate arranged in the base, a plurality of elastic members arranged in the base and driving the plate to move upward, a plurality of fixed pointed piles arranged on the lower surface of the plate and penetrating into the transmission network chain after passing through the through holes during the downward movement of the plate, and the turntable is rotatably connected to the plate; the elastic member comprises a first limiting column arranged on the base, a second limiting column arranged on the lower surface of the plate, and a first compression spring sleeved between the first limiting column and the second limiting column, a movable groove corresponding to the first limiting column is provided on the lower surface of the base, a threaded adjustment hole is provided on the second limiting column, and an adjustment screw is provided in the movable groove after passing through the first limiting column upward and being threadedly connected in the threaded adjustment hole.

[0015] By adopting the above technical solution, when the ceramic disc with the molded embryo is placed on the turntable, multiple first compression springs are compressed, the support plate moves downward, and the fixed spikes on the lower surface of the support plate pass through the through holes of the base and pierce into the transmission network chain; at the same time, for different models or different numbers of molded embryos, the length of the fixed spikes passing through the base after the anti-detachment component is subjected to force can be adjusted by adjusting the screw to achieve adjustment and adaptation.

[0016] The present invention is further configured as follows: a circular cavity rotatably connected to a support plate is provided on the lower surface of the turntable, the wind-driven component comprises a plurality of wind tubes arranged in a circular array on the circumferential side of the circular cavity, a connecting hole is provided between the wind tube and the circular cavity, a mesh portion communicating with the circular cavity is provided on the lower surface of the turntable, the circulating air blown out by the first air outlet pipe and the second air outlet pipe simultaneously acts on the wind tube to drive the turntable to rotate, and the circulating air is used to heat the ceramic disc during the process of being blown out from the connecting hole and the mesh portion.

[0017] By adopting the above technical solution, the circulating air blown out from the first air outlet duct and the second air outlet duct acts on the air duct at the same time to drive the turntable to rotate, and the circulating air is used to heat the ceramic disc during the process of being blown out from the connecting hole and the mesh part, so that the ceramic disc is heated evenly, ensuring the balance and completeness of the reaction atmosphere, and improving the structural strength of the solidified semiconductor tool.

[0018] The present invention is further configured as follows: a first three-way valve is provided at the inlet end of the exhaust fan, a second three-way valve is provided at the outlet end of the exhaust fan, the air inlet pipe is connected to the first three-way valve, the three-way pipe is connected to the second three-way valve, and the remaining outlet of the first three-way valve and the remaining outlet of the second three-way valve are both arranged upward; after the curing procedure is completed, the following heat dissipation operations are performed: (1) firstly, the second three-way valve is adjusted so that the outlet of the second three-way valve arranged upward is connected to the exhaust fan, and the hot air in the curing furnace body is extracted by the exhaust fan; (2) when the temperature in the curing furnace body drops to 50-60°C, the second three-way valve is reset, and the first three-way valve is adjusted so that the outlet of the first three-way valve arranged upward is connected to the exhaust fan, and the normal temperature air outside the equipment of the exhaust fan is transported into the curing furnace body, and the semiconductor tool is cooled.

[0019] By adopting the above technical solution, after the curing process is completed, the following heat dissipation operations can be performed using the improved setting of the air circulation device: (1) first adjust the second three-way valve so that the upward outlet of the second three-way valve is connected to the exhaust fan, and the hot air in the curing furnace body is extracted by the exhaust fan; (2) when the temperature in the curing furnace body drops to 50-60°C, the second three-way valve is reset, and the first three-way valve is adjusted so that the upward outlet of the first three-way valve is connected to the exhaust fan, and the normal temperature air outside the equipment is transported by the exhaust fan into the curing furnace body, thereby cooling the semiconductor tool.

[0020] The present invention is further configured as follows: a lifting and separation mechanism for driving the ceramic disc on the turntable to lift upward is arranged between the outlet end of the curing furnace body, the shelf mechanism and the ceramic disc; an air cooling mechanism located above the lifting and separation mechanism is arranged at the outlet end of the curing furnace body; a countersunk hole for a fixed pointed pile to be embedded from top to bottom is arranged on the support plate, a second compression spring is embedded on the countersunk hole, and an end cover is arranged on the countersunk hole; an annular groove protruding from the turntable is arranged on the circumference of the ceramic disc; the lifting and separation mechanism includes brackets arranged on both sides of the outlet end of the curing furnace body, two brackets respectively arranged on the brackets and used for horizontal insertion into the ceramic The horizontal guide pieces in the annular groove of the disc and the inclined guide pieces which are arranged on two brackets and press down the air-cooling drive parts on the peripheral side of the turntable during the movement of the shelf mechanism to separate the ceramic disc; after the heat dissipation operation is completed, the following cooling operation is performed: first, the shelf mechanism is driven by the transmission network chain to output, the horizontal guide pieces are embedded in the annular groove of the ceramic disc to achieve the upper limit in the vertical direction, the inclined guide pieces press down the air-cooling drive parts on the peripheral side of the turntable to separate the turntable and the ceramic disc, and finally the ceramic disc is placed on multiple horizontal guide pieces and arranged in an arranged manner, and is air-cooled by the air-cooling mechanism, and the separated shelf mechanism is recycled for use in the next round of curing operation.

[0021] By adopting the above technical solution, after the heat dissipation operation, the temperature of the shelf mechanism, ceramic disc and forming tool is still high. At this time, the following cooling operation is performed through the cooperation of the lifting and separation mechanism and the air cooling mechanism. First, the shelf mechanism is output under the drive of the transmission network chain, and the horizontal guide plate is embedded in the annular groove of the ceramic disc to achieve the upper limit in the vertical direction. The inclined guide plate presses down the air-cooled drive part on the peripheral side of the turntable to separate the turntable and the ceramic disc (at this time, the second compression spring can provide a downward movement stroke when it is compressed). Finally, the ceramic disc is placed on multiple horizontal guide plates and arranged in an array. At this time, the multiple ceramic discs are in a suspended state and are air-cooled by the air cooling mechanism. The cooling efficiency of the semiconductor tool can be improved. In addition, the separated shelf mechanism is used for the next round of curing operation after recovery.

[0022] The present invention is further configured as follows: the air cooling mechanism includes a plurality of cold air ducts arranged at the outlet end of the curing furnace body, an air supply duct, a plurality of hoses connected between the air supply duct and the cold air duct, and an air compressor connected to the air supply duct; a plurality of air outlets arranged and distributed are provided at the bottom of the cold air duct, and the two horizontal guide plates are located below the plurality of cold air ducts.

[0023] By adopting the above technical solution, the air compressor transmits compressed air to the air supply pipe, hose, cold air pipe, and outputs it through multiple air outlets, thereby achieving efficient cooling of semiconductor tools. The present invention is further configured as follows: a filtering mechanism is provided on the top of the curing furnace body to cover the connection between multiple air inlet pipes and the curing furnace body, a slide rail is provided on the top of the curing furnace body to extend along the length direction of the curing furnace body, and the filtering mechanism includes multiple activated carbon filter plates inserted in the slide rail to cover the connection between the air inlet pipe and the curing furnace body, a cable assembly is provided between the transmission network chain and the activated carbon filter plate at one end and drives the activated carbon filter plate to move during the movement of the transmission network chain; the cable assembly includes a first hanging ring provided on both sides of one end of the activated carbon filter plate close to the entrance end of the curing furnace body, two second hanging rings provided on both sides of the transmission network chain, and a cable with a lock that is detachably provided between the first hanging ring and the second hanging ring of the activated carbon filter plate at one end, and when the closed door moves upward to the limit state, it does not affect the horizontal movement of the activated carbon filter plate, and when the closed door moves downward to the limit state, it contacts the sides of the activated carbon filter plates at both ends.

[0024] By adopting the above technical scheme, water vapor, ammonia and other gases will be generated during the curing process. First, by setting an activated carbon filter plate, ammonia can be adsorbed to achieve the treatment of ammonia generated during the curing process; in addition, humidity has the following effects on the adsorption of ammonia by activated carbon: when the humidity is low, the water film on the surface of the activated carbon is insufficient to form, and the adsorption effect is poor. When the humidity is high, the pore structure of the activated carbon is easily blocked, and at the same time, water molecules preferentially form hydrogen bonds on the surface of the activated carbon, competing with ammonia molecules, affecting the adsorption of ammonia; however, in the second stage of this curing process, ammonia and water vapor are released at the same time, so that when activated carbon is used to adsorb ammonia, due to the presence of water vapor, the adsorption performance of the activated carbon filter plate is maintained in a relatively suitable state; in addition, the activated carbon filter plate needs to be replaced after long-term use. By setting a pull cable assembly, the activated carbon filter plate at the end can be pulled during the operation of the transmission network chain, so that multiple activated carbon filter plates can be moved out of the slide rail. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of the curing reaction furnace in Example 2; Figure 2 yes Figure 1 A local enlarged view at A in the figure; Figure 3 is a schematic structural diagram of a shelf mechanism of a curing reaction furnace in Example 2; Figure 4 yes Figure 3 Structural cross-sectional view of Figure 5 yes Figure 4 A partial enlarged view at B in the figure; Figure 6It is a structural schematic diagram of the shelving mechanism and the lifting and separation mechanism in Example 2; Figure 7 yes Figure 6 Schematic diagram of the local structure; Figure 8 yes Figure 1 A partial enlarged view of point C in the figure.

[0026] Figure numerals: 1, curing furnace body; 11, slide rail; 2, transmission network chain; 3, closed door; 4, electric heating device; 5, air circulation device; 51, exhaust fan; 52, air inlet pipe; 53, three-way pipe; 54, first air outlet pipe; 55, second air outlet pipe; 56, first three-way valve; 57, second three-way valve; 6, ceramic disc; 61, annular groove; 7, shelving mechanism; 71, bottom support; 711, through hole; 712, movable groove; 72, anti-slip assembly; 721, support plate; 7211, countersunk hole; 722, elastic member; 7221, first limiting column; 7222, second limiting column; 72221, threaded adjustment hole; 722 3. first compression spring; 7224. adjusting screw; 723. fixing spike; 724. second compression spring; 725. end cover; 73. turntable; 731. circular cavity; 732. connecting hole; 733. mesh portion; 74. wind-driven component; 741. air cylinder; 8. lifting and separation mechanism; 81. bracket; 82. horizontal guide plate; 83. inclined guide plate; 9. air cooling mechanism; 91. cold air duct; 92. air supply duct; 93. hose; 94. air compressor; 10. filtering mechanism; 101. activated carbon filter plate; 102. cable assembly; 1021. first lifting ring; 1022. second lifting ring; 1023. cable. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0028] Embodiment 1: A production process for semiconductor material processing tools, including a mixing process, a pressing process and a curing process.

[0029] The mixing process includes the following: (S1) mixing abrasives: adding abrasives into the upper stirring pot of a double-pot countercurrent mixer in proportion; (S2) adding resin liquid: adding resin liquid into the upper stirring pot in proportion and stirring for 2 to 3 minutes; (S3) adding fillers: adding fillers and colorants into the upper stirring pot in proportion; (S4) primary stirring: stirring the materials in the upper stirring pot for 6 to 8 minutes, stirring evenly and then adding them into the lower stirring pot of the double-pot countercurrent mixer; (S5) adding resin powder: adding resin powder into the lower stirring pot in proportion; (S6) secondary stirring: stirring the materials in the lower stirring pot for 4 to 6 minutes, adding a wetting agent in proportion and stirring for another 2 to 3 minutes; (S7) screening: adding the stirred materials into a vibrating screen, and putting the screened mixture into a sand box for standby use.

[0030] The pressing process includes the following: adding the mixed material into the mold cavity of the cold pressing machine, scraping it flat and pressing it. The cold pressing pressure range is 15~30N / mm 2 , the pressing time is 5 to 50 seconds to obtain a formed embryo; The curing process includes the following: placing the molded embryo on a ceramic disc, placing it in a curing reactor for curing, setting air circulation in the curing reactor so that all parts of the molded embryo are heated evenly, starting the temperature rise program of the curing reactor for curing, and obtaining a semiconductor tool. Starting the temperature rise program of the curing reactor for curing includes the following stages: the first stage: the curing temperature is 75 to 85 degrees Celsius, the resin (resin liquid, resin powder) in the molded embryo begins to melt, the water begins to evaporate, and the curing reaction begins; the second stage: the curing temperature is 110 degrees Celsius, the molten resin undergoes cross-linking, and ammonia and water vapor are released; the third stage: the curing temperature is 110 to 180 degrees Celsius, the resin undergoes cross-linking until it is completely cured, and ammonia is released. The curing temperature of the third stage is 110 to 180 degrees Celsius, and the final curing temperature is one of the following two options: a) the final temperature is 165 to 170 degrees Celsius, and the semiconductor tool is hard and tough; b) the final temperature is 175 to 180 degrees Celsius, and the semiconductor tool is hard.

[0031] Implementation effect: First, in the mixing process, gradually add resin liquid and resin powder to the abrasive for stirring, so as to achieve preliminary bonding with the resin liquid, and make the resin powder evenly mixed to avoid the resin powder dissolving in the resin liquid. It is convenient to mix evenly when the material is relatively dry in the early stage, and then add a wetting agent to adjust the degree of dryness and wetness, and finally obtain a uniform, loose, and moderately dry and wet mixture after vibration screening; at the same time, when the molded embryo is cured, air circulation is set in the curing reactor to make the temperature in the curing reactor balanced, so as to ensure the balance and completeness of the reaction atmosphere and improve the structural strength of the cured semiconductor tool. Too high a curing temperature will lead to over-curing of the resin, which will increase the hardness of the semiconductor tool and reduce its strength; when the final curing temperature is 165-170 degrees Celsius, the semiconductor tool is hard and has good toughness; when the final curing temperature is 175-180 degrees Celsius, the semiconductor tool is hard; after the final curing temperature exceeds 180 degrees Celsius, the tool is hard and brittle.

[0032] Embodiment 2: A production device for semiconductor material processing tools, such as Figure 1As shown, it includes a double-pot countercurrent mixer, a vibrating screen, a cold press molding machine, and a curing reaction furnace. The curing reaction furnace includes a curing furnace body 1, a transmission network chain 2 arranged in the curing furnace body 1 and with the inlet and outlet ends extending outside the curing area, a closed door 3 arranged at both ends of the curing furnace body 1 located in the heating area, an electric heating device 4 arranged in the curing furnace body 1, an air circulation device 5 arranged in the curing furnace body 1, a plurality of ceramic discs 6, and a plurality of placing mechanisms 7 placed on the transmission network chain 2 and for the ceramic discs 6 to place.

[0033] like Figure 1 and Figure 2 As shown, a plurality of air circulation devices 5 are arranged along the length direction of the curing furnace body 1, and the air circulation devices 5 include an exhaust fan 51 arranged on the curing furnace body 1, an air inlet pipe 52 arranged between the inlet end of the exhaust fan 51 and the top of the curing furnace body 1, a three-way pipe 53 arranged at the outlet end of the exhaust fan 51, a first air outlet pipe 54 arranged on the joint of the three-way pipe 53 and connected to one side of the curing furnace body 1, and a second air outlet pipe 55 arranged on the joint of the three-way pipe 53 and connected to the other side of the curing furnace body 1. The connection between the first air outlet pipe 54 and the curing furnace body 1 and the connection between the second air outlet pipe 55 and the curing furnace body 1 are staggered.

[0034] like Figure 3 and Figure 4 As shown, the shelf mechanism 7 includes a base 71, an anti-slip component 72 arranged in the base 71 and passing through the base 71 to be embedded in the transmission network chain 2 after being subjected to the downward force of the ceramic disc 6 and the formed blank, a turntable 73 rotatably connected to the upper surface of the anti-slip component 72 and for the ceramic disc 6 to be embedded, and a wind driving component 74 arranged on the circumferential side of the turntable 73 and driving the turntable 73 to rotate when being blown by wind. The following operations are performed in the three stages of curing: (1) When the temperature rise program of the curing reaction furnace is in the first stage, the multiple shelf mechanisms 7 are respectively located in front of the corresponding air circulation device 5, and the circulating air blown out by the first air outlet 54 and the second air outlet 55 does not affect the shelf mechanisms 7; (2) When the temperature rise program of the curing reaction furnace is in the second stage and the third stage, the multiple shelf mechanisms 7 move to the first air outlet 54 and the second air outlet 55 of the corresponding air circulation device 5 as the transmission network chain 2 runs. Part of the circulating air blown out by the first air outlet 54 and the second air outlet 55 acts on the wind driving part 74 of the turntable 73 at the same time, driving the turntable 73 to rotate, so that the molded embryo is evenly heated during the hot air circulation and self-rotation process.

[0035] like Figure 2 , Figure 4 and Figure 5As shown, a plurality of through holes 711 are provided at the bottom of the bottom bracket 71, and the anti-slip assembly 72 includes a support plate 721 which is lifted and lowered in the bottom bracket 71, a plurality of elastic members 722 which are provided in the bottom bracket 71 and drive the support plate 721 to move upward, and a plurality of fixed pointed stakes 723 which are provided on the lower surface of the support plate 721 and penetrate through the through holes 711 and penetrate into the transmission network chain 2 during the downward movement of the support plate 721, and the turntable 73 is rotatably connected to the support plate 721; the elastic member 722 includes a first limiting column 722 provided on the bottom bracket 71 1. A second limiting column 7222 is arranged on the lower surface of the support plate 721, and a first compression spring 7223 is sleeved between the first limiting column 7221 and the second limiting column 7222. A movable groove 712 corresponding to the first limiting column 7221 is arranged on the lower surface of the base 71, and a threaded adjustment hole 72221 (the thread is not shown) is arranged on the second limiting column 7222. An adjustment screw 7224 is arranged in the movable groove 712, which passes upward through the first limiting column 7221 and is threadedly connected to the threaded adjustment hole 72221.

[0036] like Figure 1 , Figure 3 and Figure 4 As shown, a circular cavity 731 rotatably connected to the support plate 721 is provided on the lower surface of the turntable 73, and the wind driving member 74 includes a plurality of wind tubes 741 arranged in a circular array on the circumferential side of the circular cavity 731, and a connecting hole 732 is provided between the wind tube 741 and the circular cavity 731. A mesh portion 733 communicating with the circular cavity 731 is provided on the lower surface of the turntable 73, and the circulating air blown out by the first air outlet pipe 54 and the second air outlet pipe 55 acts on the wind tube 741 at the same time to drive the turntable 73 to rotate, and the circulating air is used to heat the ceramic disc 6 during the process of being blown out from the connecting hole and the mesh portion 733.

[0037] like Figure 1 and Figure 2 As shown, a first three-way valve 56 is provided at the inlet end of the exhaust fan 51, and a second three-way valve 57 is provided at the outlet end of the exhaust fan 51. The air inlet pipe 52 is connected to the first three-way valve 56, and the three-way pipe 53 is connected to the second three-way valve 57. The remaining outlet of the first three-way valve 56 and the remaining outlet of the second three-way valve 57 are both arranged upward; the first three-way valve 56 and the second three-way valve 57 are solenoid valves. After the curing process is completed, the following heat dissipation operations are performed: (1) First, the second three-way valve 57 is adjusted so that the upward outlet of the second three-way valve 57 is connected to the exhaust fan 51, and the hot air in the curing furnace body 1 is extracted through the exhaust fan 51; (2) When the temperature in the curing furnace body 1 drops to 50-60°C, the second three-way valve 57 is reset, and the first three-way valve 56 is adjusted so that the upward outlet of the first three-way valve 56 is connected to the exhaust fan 51, and the normal temperature air outside the equipment is transported by the exhaust fan 51 into the curing furnace body 1, thereby cooling the semiconductor tool.

[0038] like Figure 1 , Figures 5 to 8 As shown, a lifting and separating mechanism 8 for driving the ceramic disc 6 on the turntable 73 to lift upward is arranged between the outlet end of the curing furnace body 1, the placing mechanism 7 and the ceramic disc 6, and an air cooling mechanism 9 located above the lifting and separating mechanism 8 is arranged at the outlet end of the curing furnace body 1. A countersunk hole 7211 for the fixing stake 723 to be embedded from top to bottom is arranged on the support plate 721, a second compression spring 724 is embedded in the countersunk hole 7211, and an end cover 725 (the thread is not shown) is threadedly arranged on the countersunk hole 7211. The ceramic disc 6 is provided with an annular groove 61 protruding from the turntable 73 on the circumference thereof. The lifting and separating mechanism 8 comprises a bracket 81 arranged on both sides of the outlet end of the curing furnace body 1, two horizontal guide pieces 82 respectively arranged on the bracket 81 and used for being laterally inserted into the annular groove 61 of the ceramic disc 6, and an inclined guide piece 83 arranged on the two brackets 81 and pressing down the air-cooling driving member 74 on the circumference of the turntable 73 during the movement of the shelf mechanism 7 to separate the ceramic disc 6; after the heat dissipation operation is completed, the following cooling operation is performed: first, the shelf mechanism 7 is output under the drive of the transmission network chain 2, the horizontal guide piece 82 is embedded in the annular groove 61 of the ceramic disc 6 to realize the upper limit in the vertical direction, the inclined guide piece 83 presses down the air-cooling driving member 74 on the circumference of the turntable 73 to separate the turntable 73 and the ceramic disc 6, and finally the ceramic disc 6 is placed on a plurality of horizontal guide pieces 82 and arranged in an array, and is air-cooled by the air-cooling mechanism 9, and the separated shelf mechanism 7 is recycled for use in the next round of curing operation. The air cooling mechanism 9 includes a plurality of cold air ducts 91 arranged at the outlet end of the curing furnace body 1, an air supply duct 92, a plurality of hoses 93 connected between the air supply duct 92 and the cold air duct 91, and an air compressor 94 connected to the air supply duct 92. A plurality of air outlets arranged in an arranged manner are arranged at the bottom of the cold air duct 91, and two horizontal guide plates 82 are located below the plurality of cold air ducts 91.

[0039] like Figure 1 and Figure 2As shown, a filter mechanism 10 is provided on the top of the curing furnace body 1 to cover the connection between the plurality of air inlet pipes 52 and the curing furnace body 1, and a slide rail 11 is provided on the top of the curing furnace body 1 to extend along the length direction of the curing furnace body 1. The filter mechanism 10 includes a plurality of activated carbon filter plates 101 inserted in the slide rail 11 and covering the connection between the air inlet pipe 52 and the curing furnace body 1, and a cable 1023 assembly 102 which is provided between the transmission network chain 2 and the activated carbon filter plate 101 at one end and drives the activated carbon filter plate 101 to move during the movement of the transmission network chain 2; The rope 1023 assembly 102 includes a first hanging ring 1021 arranged on both sides of one end of the activated carbon filter plate 101 close to the entrance end of the curing furnace body 1, two second hanging rings 1022 arranged on both sides of the transmission network chain 2, and a pull rope 1023 with a lock that is detachably arranged between the first hanging ring 1021 and the second hanging ring 1022 of the activated carbon filter plate 101 located at one end. When the closed door 3 moves upward to the limit state, it does not affect the horizontal movement of the activated carbon filter plate 101. When the closed door 3 moves downward to the limit state, it contacts the sides of the activated carbon filter plates 101 located at both ends.

[0040] Implementation effect: When the shelf mechanism 7 is placed on the transmission network chain 2, the anti-slip component 72 is first subjected to the downward force of the ceramic disc 6 and the formed blank, and then passes through the bottom bracket 71 and is embedded in the transmission network chain 2, so that the shelf mechanism 7 is combined with the transmission network chain 2 to prevent the shelf mechanism 7 from shaking under the wind. Then, the following operations are performed in the three stages of curing: (1) When the temperature rise program of the curing reaction furnace is in the first stage, the plurality of shelf mechanisms 7 are respectively located in front of the corresponding air circulation device 5, and the circulating air blown out by the first air outlet duct 54 and the second air outlet duct 55 does not affect the shelf mechanism 7, so as to prevent the wind from driving the turntable 73 to rotate, causing the forming blank to shake. The embryo is scattered; (2) when the temperature rise program of the curing reaction furnace is in the second stage and the third stage, the molded embryo is initially improved in structural strength. At this time, the molding makes multiple shelf mechanisms 7 move to the first air outlet 54 and the second air outlet 55 of the corresponding air circulation device 5 along with the operation of the transmission network chain 2. Part of the circulating air blown out by the first air outlet 54 and the second air outlet 55 acts on the wind driving part 74 of the turntable 73 at the same time, driving the turntable 73 to rotate, so that the molded embryo is evenly heated during the hot air circulation and self-rotation process; finally, the reaction atmosphere is balanced and complete, and the structural strength of the cured semiconductor tool is improved.

[0041] When the ceramic disc 6 with the shaped embryo is placed on the turntable 73, multiple first compression springs 7223 are compressed, the support plate 721 moves downward, and the fixed spikes 723 on the lower surface of the support plate 721 pass through the through holes 711 of the base 71 and then penetrate into the transmission network chain 2; at the same time, for different models or different numbers of shaped embryos, the length of the fixed spikes 723 passing through the base 71 after the anti-slip component 72 is subjected to force can be adjusted by adjusting the screws 7224 to achieve adjustment and adaptation.

[0042] The circulating air blown out from the first air outlet 54 and the second air outlet 55 acts on the air cylinder 741 at the same time to drive the turntable 73 to rotate, and the circulating air is used to heat the ceramic disc 6 during the process of being blown out from the connecting hole and the mesh part 733, so that the ceramic disc 6 is heated evenly, ensuring the balance and completeness of the reaction atmosphere and improving the structural strength of the solidified semiconductor tool.

[0043] After the curing process is completed, the improved setting of the air circulation device 5 can be used to perform the following heat dissipation operations: (1) First, the second three-way valve 57 is adjusted so that the upward outlet of the second three-way valve 57 is connected to the exhaust fan 51, and the hot air in the curing furnace body 1 is extracted through the exhaust fan 51; (2) When the temperature in the curing furnace body 1 drops to 50-60°C, the second three-way valve 57 is reset, and the first three-way valve 56 is adjusted so that the upward outlet of the first three-way valve 56 is connected to the exhaust fan 51, and the normal temperature air outside the equipment is transported by the exhaust fan 51 into the curing furnace body 1, thereby cooling the semiconductor tool.

[0044] After the heat dissipation operation, the temperature of the shelf mechanism 7, the ceramic disc 6, and the forming tool is still high. At this time, the following cooling operation is performed through the cooperation of the lifting separation mechanism 8 and the air cooling mechanism 9. First, the shelf mechanism 7 is output under the drive of the transmission network chain 2. The horizontal guide plate 82 is embedded in the annular groove 61 of the ceramic disc 6 to achieve the upper limit in the vertical direction. The inclined guide plate 83 presses down the air cooling drive member 74 on the side of the turntable 73 to separate the turntable 73 and the ceramic disc 6 (at this time, the second compression spring 724 can provide a downward movement when it is compressed). Finally, the ceramic disc 6 is placed on multiple horizontal guide plates 82 and arranged in an array. At this time, multiple ceramic discs 6 are in a suspended state. Air cooling is performed by the air cooling mechanism 9, which can improve the cooling efficiency of the semiconductor tool. In addition, the separated shelf mechanism 7 is used for the next round of curing operation after recovery. The compressed air is output to the air supply pipe 92, the hose 93, and the cold air pipe 91 through the air compressor 94, and is output through multiple air outlets, thereby achieving efficient cooling of the semiconductor tool. During the curing process, water vapor, ammonia and other gases are generated. First, by setting up an activated carbon filter plate 101, ammonia can be adsorbed to achieve the treatment of ammonia generated during the curing process; in addition, humidity has the following effects on the adsorption of ammonia by activated carbon: when the humidity is low, the water film on the surface of the activated carbon is insufficient to form, and the adsorption effect is poor. When the humidity is high, the pore structure of the activated carbon is easily blocked, and at the same time, water molecules preferentially form hydrogen bonds on the surface of the activated carbon, competing with ammonia molecules, affecting the adsorption of ammonia; however, in the second stage of this curing process, ammonia and water vapor are released at the same time, so that when activated carbon is used to adsorb ammonia, due to the presence of water vapor, the adsorption performance of the activated carbon filter plate 101 is maintained in a relatively suitable state; in addition, the activated carbon filter plate 101 needs to be replaced after long-term use. By setting up the cable 1023 component 102, the activated carbon filter plate 101 at the end can be pulled during the operation of the transmission network chain 2, so that multiple activated carbon filter plates 101 are removed from the slide rail 11.

[0045] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A production process for semiconductor material processing tools, comprising a mixing process, a pressing process and a curing process, characterized in that: The mixing process includes the following: (S1) mixing abrasives: adding abrasives into the upper stirring pot of a double pot countercurrent mixer according to proportion; (S2) Adding resin liquid: Add the resin liquid into the upper stirring pot according to the proportion and stir for 2 to 3 minutes; (S3) Adding fillers: Add fillers and colorants into the upper stirring pot according to proportion; (S4) primary stirring: stirring the material in the upper stirring pot for 6 to 8 minutes, and then adding the material into the lower stirring pot of the double-pot countercurrent mixer after stirring evenly; (S5) Adding resin powder: adding the resin powder into the lower stirring pot according to the proportion; (S6) Secondary stirring: Stir the material in the lower stirring pot for 4 to 6 minutes, add a wetting agent in proportion, and stir for another 2 to 3 minutes; (S7) Screening: Add the stirred material to the vibrating screen, and put the screened mixture into the sand box for later use; The pressing process includes the following steps: adding the mixed material into the mold cavity of the cold pressing machine, flattening it and pressing it. The cold pressing pressure range is 15 to 30 N / mm 2 , the pressing time is 5 to 50 seconds to obtain a formed embryo; The curing process includes the following steps: placing the molded embryo on a ceramic disc, placing it in a curing reaction furnace for curing, setting air circulation in the curing reaction furnace so that all parts of the molded embryo are heated evenly, starting the temperature rise program of the curing reaction furnace for curing, and obtaining a semiconductor tool.

2. The production process of a semiconductor material processing tool according to claim 1, characterized in that: The temperature rise program of starting the curing reaction furnace for curing includes the following stages: The first stage: The curing temperature is 75-85 degrees Celsius, the resin (resin liquid, resin powder) in the molded body begins to melt, the water begins to evaporate, and the curing reaction begins; The second stage: the curing temperature is 110 degrees Celsius, the molten resin is cross-linked, and ammonia and water vapor are released; The third stage: The curing temperature is 110-180 degrees Celsius, the resin is cross-linked until it is completely cured, and ammonia is released.

3. The production process of a semiconductor material processing tool according to claim 2, characterized in that: The third stage curing temperature is between 110 and 180 degrees Celsius, and the final curing temperature is one of the following two options: a) The final temperature is 165-170 degrees Celsius, and the semiconductor tool is hard and tough; b) The final temperature is 175-180 degrees Celsius, and the semiconductor tool is hard.

4. A production equipment for semiconductor material processing tools according to claim 3, comprising a double-pot countercurrent mixer, a vibrating screen, a cold press molding machine, and a curing reaction furnace, characterized in that: The curing reaction furnace comprises a curing furnace body (1), a transmission network chain (2) arranged in the curing furnace body (1) and having an inlet and outlet end extending outside the curing area, closed doors (3) arranged at both ends of the curing furnace body (1) located in the heating area, an electric heating device (4) arranged in the curing furnace body (1), an air circulation device (5) arranged in the curing furnace body (1), a plurality of ceramic discs (6), and a plurality of placing mechanisms (7) placed on the transmission network chain (2) and for placing the ceramic discs (6); The air circulation device (5) is arranged in a plurality along the length direction of the curing furnace body (1), and the air circulation device (5) comprises an exhaust fan (51) arranged on the curing furnace body (1), an air inlet pipe (52) arranged between the inlet end of the exhaust fan (51) and the top of the curing furnace body (1), a three-way pipe (53) arranged at the outlet end of the exhaust fan (51), a first air outlet pipe (54) arranged on the joint of the three-way pipe (53) and connected to one side of the curing furnace body (1), and a second air outlet pipe (55) arranged on the joint of the three-way pipe (53) and connected to the other side of the curing furnace body (1), wherein the connection between the first air outlet pipe (54) and the curing furnace body (1) and the connection between the second air outlet pipe (55) and the curing furnace body (1) are staggered; The shelf mechanism (7) comprises a base (71), an anti-slip component (72) arranged in the base (71) and inserted into the transmission network chain (2) after being subjected to the downward force of the ceramic disc (6) and the formed blank, a turntable (73) rotatably connected to the upper surface of the anti-slip component (72) and for the ceramic disc (6) to be inserted, and a wind driving member (74) arranged on the peripheral side of the turntable (73) and driving the turntable (73) to rotate when being blown by wind. The following operations are performed in the three stages of curing: (1) when the temperature rise program of the curing reaction furnace is in the first stage, the plurality of the shelf mechanisms (7) are respectively located in front of the corresponding air circulation device (5), and the circulating air blown out by the first air outlet pipe (54) and the second air outlet pipe (55) does not affect the shelf mechanisms (7); (2) when the temperature rise program of the curing reaction furnace is in the second stage and the third stage, the plurality of the shelf mechanisms (7) move to the first air outlet pipe (54) and the second air outlet pipe (55) of the corresponding air circulation device (5) along with the operation of the transmission network chain (2), and part of the circulating air blown out by the first air outlet pipe (54) and the second air outlet pipe (55) simultaneously acts on the wind driving member (74) of the turntable (73), driving the turntable (73) to rotate, so that the molded embryo is evenly heated during the hot air circulation and self-rotation process.

5. The production equipment of a semiconductor material processing tool according to claim 4, characterized in that: The bottom of the base (71) is provided with a plurality of through holes (711); the anti-slip assembly (72) comprises a support plate (721) which is lifted and lowered in the base (71); a plurality of elastic members (722) which are arranged in the base (71) and drive the support plate (721) to move upward; and a plurality of fixed pointed stakes (723) which are arranged on the lower surface of the support plate (721) and penetrate through the through holes (711) and penetrate into the transmission network chain (2) when the support plate (721) moves downward. The rotating disk (73) is rotatably connected to the support plate (721); the elastic member (722) comprises a first limiting member arranged on the base (71); The bottom support (71) comprises a first limiting column (7221), a second limiting column (7222) arranged on the lower surface of the support plate (721), and a first compression spring (7223) sleeved between the first limiting column (7221) and the second limiting column (7222); the lower surface of the bottom support (71) is provided with a movable groove (712) corresponding to the first limiting column (7221); the second limiting column (7222) is provided with a threaded adjustment hole (72221); and the movable groove (712) is provided with an adjustment screw (7224) which passes upward through the first limiting column (7221) and is then threadedly connected to the threaded adjustment hole (72221).

6. The production equipment for semiconductor material processing tools according to claim 4, characterized in that: The lower surface of the rotating disk (73) is provided with a circular cavity (731) rotatably connected to the supporting plate (721); the wind driving member (74) comprises a plurality of wind tubes (741) arranged in a circumferential array on the circumferential side of the circular cavity (731); a connecting hole (732) is provided between the wind tube (741) and the circular cavity (731); the lower surface of the rotating disk (73) is provided with a mesh portion (733) communicating with the circular cavity (731); the circulating air blown out by the first air outlet pipe (54) and the second air outlet pipe (55) simultaneously acts on the wind tube (741) to drive the rotating disk (73) to rotate; and the circulating air is used to heat the ceramic disc (6) during the process of being blown out from the connecting hole and the mesh portion (733).

7. The production equipment of a semiconductor material processing tool according to claim 6, characterized in that: The inlet end of the exhaust fan (51) is provided with a first three-way valve (56), and the outlet end of the exhaust fan (51) is provided with a second three-way valve (57); the air inlet pipe (52) is connected to the first three-way valve (56), and the three-way pipeline (53) is connected to the second three-way valve (57); the remaining outlet of the first three-way valve (56) and the remaining outlet of the second three-way valve (57) are both arranged upward; After the curing process is completed, the following heat dissipation operation is performed: (1) firstly, the second three-way valve (57) is adjusted so that the outlet of the second three-way valve (57) facing upward is connected to the exhaust fan (51), and the hot air in the curing furnace body (1) is extracted through the exhaust fan (51); (2) when the temperature in the curing furnace body (1) drops to 50-60°C, the second three-way valve (57) is reset, and the first three-way valve (56) is adjusted so that the outlet of the first three-way valve (56) facing upward is connected to the exhaust fan (51), and the normal temperature air outside the equipment of the exhaust fan (51) is transported into the curing furnace body (1), thereby cooling the semiconductor tool.

8. The production equipment of a semiconductor material processing tool according to claim 7, characterized in that: A lifting and separating mechanism (8) for driving the ceramic disc (6) on the rotating disk (73) to lift upward is arranged between the outlet end of the curing furnace body (1), the shelf mechanism (7) and the ceramic disc (6); and an air cooling mechanism (9) located above the lifting and separating mechanism (8) is arranged at the outlet end of the curing furnace body (1); The support plate (721) is provided with a countersunk hole (7211) for the fixing stake (723) to be embedded from top to bottom, a second compression spring (724) is embedded in the countersunk hole (7211), and an end cover (725) is provided on the countersunk hole (7211); an annular groove (61) protruding from the rotating disk (73) is provided on the circumference of the ceramic disc (6); the lifting and separation mechanism (8) comprises a bracket (81) arranged on both sides of the outlet end of the curing furnace body (1), two horizontal guide pieces (82) respectively arranged on the brackets (81) and used to be laterally inserted into the annular groove (61) of the ceramic disc (6), and an inclined guide piece (83) arranged on the two brackets (81) and a wind driving member (74) pressing down the circumference of the rotating disk (73) during the movement of the shelf mechanism (7) to separate the ceramic disc (6); After the heat dissipation operation is completed, the following cooling operation is performed: first, the shelf mechanism (7) is driven by the transmission network chain (2) to be output, the horizontal guide plate (82) is embedded in the annular groove (61) of the ceramic disc (6) to achieve upper limit in the vertical direction, the inclined guide plate (83) presses down the wind driving member (74) on the peripheral side of the turntable (73) to separate the turntable (73) and the ceramic disc (6), and finally the ceramic disc (6) is placed on a plurality of horizontal guide plates (82) and arranged in an array, and air-cooled by the air-cooling mechanism (9), and the separated shelf mechanism (7) is recycled for use in the next round of curing operation.

9. The production equipment of a semiconductor material processing tool according to claim 8, characterized in that: The air cooling mechanism (9) comprises a plurality of cold air ducts (91) arranged at the outlet end of the curing furnace body (1), an air supply duct (92), a plurality of hoses (93) connected between the air supply duct (92) and the cold air duct (91), and an air compressor (94) connected to the air supply duct (92); a plurality of air outlets arranged in an arranged manner are arranged at the bottom of the cold air duct (91); and the two horizontal guide plates (82) are located below the plurality of cold air ducts (91).

10. The production equipment of a semiconductor material processing tool according to claim 4, characterized in that: A filter mechanism (10) is arranged at the top of the curing furnace body (1) to cover the connection between the plurality of air inlet pipes (52) and the curing furnace body (1); a slide rail (11) extending along the length direction of the curing furnace body (1) is arranged at the top of the curing furnace body (1); the filter mechanism (10) comprises a plurality of activated carbon filter plates (101) inserted in the slide rail (11) and covering the connection between the air inlet pipes (52) and the curing furnace body (1); and a cable (1023) assembly (102) arranged between the transmission network chain (2) and the activated carbon filter plate (101) at one end and driving the activated carbon filter plate (101) to move during the movement of the transmission network chain (2). The pull rope (1023) assembly (102) comprises a first hanging ring (1021) arranged on both sides of one end of the activated carbon filter plate (101) close to the entrance end of the curing furnace body (1), two second hanging rings (1022) arranged on both sides of the transmission network chain (2), and a pull rope (1023) with a lock that is detachably arranged between the first hanging ring (1021) and the second hanging ring (1022) of the activated carbon filter plate (101) at one end; when the closed door (3) moves upward to the limit state, it does not affect the horizontal movement of the activated carbon filter plate (101); when the closed door (3) moves downward to the limit state, it contacts the side surfaces of the activated carbon filter plates (101) at both ends.

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