Manufacturing method of temperature sensor

Abstract

The invention discloses a manufacturing method of a temperature sensor, which comprises the following steps: respectively printing solder paste on a base and a PCB (Printed Circuit Board) to obtain the base printed with the solder paste and the PCB printed with the solder paste; a sensor chip, an inductor and a spring coil are placed at the first preset position, the second preset position and the third preset position of the PCB printed with the solder paste respectively, and the PCB provided with the elements is obtained; the PCB provided with the elements is placed at a fourth preset position of the base printed with the solder paste, and an assembled assembly is obtained; the assembled assembly is put into a reflow soldering furnace for reflow soldering, and a welded assembly is obtained; performing a first performance test on the welded assembly; and under the condition that the first performance test of the welded assembly is passed, marking, injection molding and second performance test are carried out on the welded assembly, and the temperature sensor is obtained. The temperature sensor can be directly installed on a heating point of which the temperature needs to be monitored, is large in temperature measurement range, and is not liable to be interfered by the environment.

Description

Technical Field

[0001] The present application relates to the technical field of temperature sensors, and in particular to a method for manufacturing a temperature sensor. Background Art

[0002] With the development of industrial automation and intelligence, sensor technology has been widely used in many fields. Especially in power, metallurgy, petrochemical and other systems, the reliability and safety of equipment have become crucial indicators. In these application scenarios, the temperature monitoring of equipment is directly related to the normal operation of the system, especially for cables and key equipment that work under high load for a long time. Real-time monitoring of temperature changes can effectively avoid safety hazards and ensure the stability and long-term operation of equipment.

[0003] Existing temperature monitoring technologies mostly use handheld infrared temperature measuring devices for regular inspections. Infrared temperature measurement technology is based on a non-contact method, which obtains temperature information by detecting infrared radiation on the surface of an object. It has the advantages of easy operation and low cost. However, this technology also has significant limitations, especially when measuring bright, humid, water or polished metal surfaces, which are greatly affected by environmental reflections and have low measurement accuracy. In addition, infrared temperature measuring equipment cannot effectively monitor obstructed or enclosed areas, such as internal hot spots of high-voltage cables, and is therefore not suitable for all-weather, continuous temperature monitoring needs.

[0004] In view of the shortcomings of existing technologies, current temperature monitoring methods still need to be improved to solve the problems of insufficient detection coverage, serious environmental interference, and a large amount of manpower required during use. Summary of the invention

[0005] To this end, the present application provides a method for manufacturing a temperature sensor to solve the problems in the prior art that the temperature sensor has insufficient detection coverage, is severely affected by environmental interference, and requires a lot of manpower during use.

[0006] In order to achieve the above objectives, this application provides the following technical solutions:

[0007] A method for manufacturing a temperature sensor, comprising: printing solder paste on a base and a PCB board respectively to obtain a base after printing the solder paste and a PCB board after printing the solder paste;

[0008] The sensor chip, the inductor and the spring coil are respectively placed at the first preset position, the second preset position and the third preset position of the PCB board after the solder paste is printed, to obtain the PCB board after the components are installed; wherein the first preset position is the desired position of the sensor chip on the PCB board after the solder paste is printed, the second preset position is the desired position of the inductor on the PCB board after the solder paste is printed, and the third preset position is the desired position of the spring coil on the PCB board after the solder paste is printed;

[0009] Placing the PCB board after the component is installed on the fourth preset position of the base after the solder paste is printed to obtain an assembled component; wherein the fourth preset position is the desired position of the PCB board after the component is installed on the base after the solder paste is printed;

[0010] Putting the assembled components into a reflow soldering furnace for reflow soldering to obtain a soldered component;

[0011] Performing a first performance test on the welded assembly;

[0012] When the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor.

[0013] Optionally, before printing solder paste on the base and the PCB board respectively, the method further comprises:

[0014] The base and the PCB board are cleaned and dried respectively.

[0015] Optionally, when the assembled component is subjected to reflow soldering in the reflow soldering furnace, the reflow soldering furnace is maintained at a first preset temperature for a first time period.

[0016] Optionally, the first performance test of the welded component includes:

[0017] The signal strength of the soldered assembly was first tested.

[0018] Optionally, when the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor, including:

[0019] When the first performance test of the welded component passes, marking the welded component to obtain a marked component;

[0020] Performing potting and injection molding on the marked component using epoxy resin to obtain an injection-molded component;

[0021] Performing a second performance test on the injection-molded component;

[0022] When the second performance test of the injection-molded component passes, a temperature sensor is obtained.

[0023] Optionally, the second performance test of the injection-molded component includes:

[0024] Performing a second test on the signal strength of the injection-molded component;

[0025] When the injection-molded component passes the second signal strength test, performing a high and low temperature impact test and an aging test on the injection-molded component;

[0026] When the second performance test of the injection-molded component passes, a temperature sensor is obtained, comprising:

[0027] When the injection-molded component passes both the high and low temperature impact test and the aging test, a temperature sensor is obtained.

[0028] Optionally, the sensor chip is a surface acoustic wave resonator.

[0029] Optionally, a welding plane is provided at the bottom of the spring coil, and the area of ​​the welding plane is greater than or equal to a preset area;

[0030] The preset area is three quarters of the coil area of ​​the spring coil.

[0031] Optionally, the base is made of brass.

[0032] Optionally, the PCB board is a FR-4 double-layer substrate.

[0033] Compared with the prior art, this application has at least the following beneficial effects:

[0034] The present application provides a method for manufacturing a temperature sensor. First, solder paste is printed on a base and a PCB board respectively to obtain a base after printing solder paste and a PCB board after printing solder paste; secondly, a sensor chip, an inductor and a spring coil are respectively placed at a first preset position, a second preset position and a third preset position of the PCB board after printing solder paste to obtain a PCB board after installing components; and the PCB board after installing components is placed at a fourth preset position of the base after printing solder paste to obtain an assembled component; finally, the assembled component is placed in a reflow soldering furnace for reflow soldering to obtain a welded component; a first performance test is performed on the welded component; if the first performance test of the welded component passes, the welded component is marked, injection molded and subjected to a second performance test to obtain a temperature sensor. The present application significantly improves the performance of the temperature sensor through precise component layout, reflow soldering process and passive wireless design. First, the precise installation of the sensor chip, inductor and spring coil ensures high accuracy of temperature measurement, while the optimized layout of the inductor and spring coil improves the stability of signal transmission; second, the passive design without external power supply not only reduces energy consumption, but also realizes long-term maintenance-free operation of the equipment, which is suitable for inaccessible equipment such as high-voltage cables in power systems; in addition, the reflow soldering process enhances the stability of the sensor structure and ensures its long-term reliable operation in harsh environments. This process reduces faults such as cold soldering and short circuits, and improves product reliability. Finally, multiple performance tests and epoxy resin injection molding processes give the temperature sensor the ability to be waterproof, moisture-proof and corrosion-resistant, so that the temperature sensor can adapt to outdoor or underwater environments, making up for the shortcomings of traditional infrared temperature measurement technology in humid and special environments, and ensuring all-weather temperature monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more intuitively illustrate the prior art and the present application, exemplary drawings are given below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing the present application; for example, those skilled in the art are capable of easily making conventional adjustments or further optimizations to the addition / reduction / attribution division, specific shapes, positional relationships, connection methods, dimensional ratios, etc. of certain units (components) based on the technical concepts and exemplary drawings disclosed in the present application.

[0036] Figure 1 A schematic flow chart of a method for manufacturing a temperature sensor provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The present application is further described below in detail through specific embodiments in conjunction with the accompanying drawings.

[0038] In the description of this application: unless otherwise specified, the meaning of "plurality" is two or more. The terms "first", "second", "third", etc. in this application are intended to distinguish the objects referred to, and do not have special meanings in terms of technical connotations (for example, they should not be understood as emphasizing the importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0039] The terms such as "upper", "lower", "left", "right", "middle", etc. cited in this application are usually used to indicate the general relative position relationship for the purpose of intuitive understanding by referring to the drawings, and are not absolute limitations on the position relationship in the actual product.

[0040] like Figure 1 As shown, a method for manufacturing a temperature sensor provided in the present application can be implemented through S101 to S106, and S101 to S106 are described in detail below.

[0041] S101, printing solder paste on the base and the PCB board respectively to obtain a base printed with solder paste and a PCB board printed with solder paste.

[0042] In this embodiment, S101 is used to print high temperature solder paste on the base and the PCB board. S101 can be implemented through step a1 and step a2.

[0043] Step a1: Place the cleaned base and PCB board on the positioning workbench respectively, adjust the corresponding positions of the positioning holes of the printing stencil and fix the printing stencil.

[0044] Step a2, use a scraper to evenly spread the solder on the printing screen, use the scraper to scrape the solder paste from top to bottom on the printing screen and print tin on the base and PCB board, visually check whether there is poor tin printing after printing, pick out the defective tin-printed products, wipe them with tin, and then print tin, and send the tin-printed products to the next process shown in S102 for assembly.

[0045] S102, placing the sensor chip, the inductor and the spring coil respectively at a first preset position, a second preset position and a third preset position of the PCB board after the solder paste is printed, to obtain a PCB board after the components are installed.

[0046] Among them, the first preset position is the expected position of the sensor chip on the PCB board after printing the solder paste, the second preset position is the expected position of the inductor on the PCB board after printing the solder paste, and the third preset position is the expected position of the spring coil on the PCB board after printing the solder paste.

[0047] It should be noted that the inductor uses a domestically produced 270nh winding inductor.

[0048] In this embodiment, S102 can be implemented through steps b1 to b3.

[0049] Step b1: Use tweezers to clamp the sensor chip in the right direction and place it vertically on the corresponding position of the PCB board after the solder paste is printed (i.e., the first preset position).

[0050] Step b2: Use tweezers to clamp the inductor in the right direction and place it vertically on the corresponding position of the PCB board after the solder paste is printed (i.e., the second preset position).

[0051] Step b3: After adjusting the vertical position of the spring coil to balance, place it vertically on the corresponding position of the PCB board after the solder paste is printed (ie, the third preset position).

[0052] S103, placing the PCB board after the components are installed on the fourth preset position of the base after the solder paste is printed, to obtain an assembled component.

[0053] The fourth preset position is the desired position of the PCB board after the components are installed on the base after the solder paste is printed.

[0054] In this embodiment, the PCB board assembled with the sensor chip, inductor, and spring coil is placed in the corresponding position (i.e., the fourth preset position) of the base after printing the solder paste, and the assembled components are checked for misalignment. The good products are sorted and placed on a tray and sent to the next process shown in S104 for assembly.

[0055] S104, placing the assembled components into a reflow soldering furnace for reflow soldering to obtain soldered components.

[0056] It should be noted that 230°C high-temperature solder paste is used for reflow soldering between the PCB board and the spring antenna, chip, inductor, and base.

[0057] In this embodiment, S104 can be implemented through steps c1 to c5.

[0058] Step c1, turn on the power of the reflow soldering furnace, set the temperature of each section to 250°C and maintain it for 3 minutes.

[0059] Step c2: After the temperature of each section of the reflow soldering furnace reaches the set value, the assembled products are placed on a tray and placed on a chain for heating and soldering.

[0060] Step c3: After coming out of the reflow soldering furnace, observe that the solder paste on the PCB board, chip, inductor, and spring coil is completely melted, and take out the product to cool naturally.

[0061] Step c4: After the product has cooled, use a magnifying glass (or microscope) to check for defects such as cold soldering, short circuit, displacement, etc. The defective products are collected together and repaired on a heating table.

[0062] Step c5: The qualified products are sorted and placed on a tray and sent to the next process shown in S105 for assembly.

[0063] S105. Perform the first performance test on the welded components.

[0064] S106. When the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor.

[0065] It should be noted that the present invention is a waterproof and sealed passive wireless temperature sensor. As an emerging intelligent device, it provides users with a convenient and fast temperature monitoring solution. The sensor can be directly installed on the hot spot where the temperature needs to be monitored. It has a large temperature measurement range and high accuracy. The temperature data is transmitted in real time, which is convenient for monitoring. It is a passive device that does not require battery replacement and is safe to use.

[0066] The waterproof and sealed wireless passive temperature sensor of the present invention comprises at least one passive temperature measurement chip, a spring antenna, a winding inductor, a PCB board, a brass base, and an epoxy resin sealed protective shell. It does not require power supply and can realize the wireless passive temperature measurement function in outdoor, humid, underwater and other environments. The present invention can perform all-weather real-time temperature monitoring on important electromechanical equipment or other important facilities that need to operate uninterruptedly for a long time and are prone to potential safety hazards, and ensure the operation safety of important equipment.

[0067] The present application provides a method for manufacturing a temperature sensor. First, solder paste is printed on a base and a PCB board respectively to obtain a base after printing solder paste and a PCB board after printing solder paste; secondly, a sensor chip, an inductor and a spring coil are respectively placed at a first preset position, a second preset position and a third preset position of the PCB board after printing solder paste to obtain a PCB board after installing components; and the PCB board after installing components is placed at a fourth preset position of the base after printing solder paste to obtain an assembled component; finally, the assembled component is placed in a reflow soldering furnace for reflow soldering to obtain a welded component; a first performance test is performed on the welded component; if the first performance test of the welded component passes, the welded component is marked, injection molded and subjected to a second performance test to obtain a temperature sensor. The present application significantly improves the performance of the temperature sensor through precise component layout, reflow soldering process and passive wireless design. First, the precise installation of the sensor chip, inductor and spring coil ensures high accuracy of temperature measurement, while the optimized layout of the inductor and spring coil improves the stability of signal transmission; second, the passive design without external power supply not only reduces energy consumption, but also realizes long-term maintenance-free operation of the equipment, which is suitable for inaccessible equipment such as high-voltage cables in power systems; in addition, the reflow soldering process enhances the stability of the sensor structure and ensures its long-term reliable operation in harsh environments. This process reduces faults such as cold soldering and short circuits, and improves product reliability. Finally, multiple performance tests and epoxy resin injection molding processes give the temperature sensor the ability to be waterproof, moisture-proof and corrosion-resistant, so that the temperature sensor can adapt to outdoor or underwater environments, making up for the shortcomings of traditional infrared temperature measurement technology in humid and special environments, and ensuring all-weather temperature monitoring.

[0068] In a possible embodiment, before S101, respectively printing solder paste on the base and the PCB board to obtain the base after printing the solder paste and the PCB board after printing the solder paste, the method for manufacturing the temperature sensor further includes step a.

[0069] Step a: clean and dry the base and the PCB board respectively.

[0070] In a possible embodiment, when the assembled components are subjected to reflow soldering in a reflow soldering furnace, the reflow soldering furnace is maintained at a first preset temperature for a first period of time.

[0071] In a possible embodiment, S105, performing a first performance test on the welded component includes: performing a first test on the signal strength of the welded component.

[0072] In this embodiment, S105 can be implemented through steps d1 to d7.

[0073] Step d1: First connect the collector and antenna, the collector and computer (connected through the UT890 conversion cable), and power the collector through the DC12V adapter.

[0074] Step d2: Open the test software on the computer.

[0075] Step d3: Attach the antenna vertically to the steel plate wall, and place the antenna vertically and perpendicular to the desktop.

[0076] Step d4: Place the sensors on the test table. The sensors are placed at approximately equal intervals and the distance from the antenna in the horizontal plane is about 8 to 10 cm.

[0077] Step d5: Click the "on" button of the test software, and then click the "start measurement" button, and the computer test system will start automatic measurement.

[0078] Step d6: Wait for about 1 to 2 minutes for the test software to search for a stable signal, confirm the signal strength and temperature displayed in each window, and continue to observe for 1 to 2 hours to confirm whether the signal is stable.

[0079] Step d7: The tested qualified products are sorted, placed on trays and sent to the next process for testing.

[0080] In a possible embodiment, S106, when the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor, which can be achieved through S1061 to S1064.

[0081] S1061. When the first performance test of the welded component passes, mark the welded component to obtain a marked component.

[0082] In this embodiment, S1061 can be implemented through steps e1 to e7.

[0083] Step e1: Turn on the main power switches of the water chiller, computer and laser machine.

[0084] Step e2, enter the marking software "***.ight", open the document, select the sensor document, and select the required file.

[0085] Step e3, adjust the laser focal height, click to display the print font, modify the required number in the text box and click "Apply" to confirm the change.

[0086] Step e4, put in the debugging copper plate for trial marking to confirm the effect.

[0087] Step e5: Place the product into the designated fixture position and start marking.

[0088] Step e6: After marking, check whether there are any defects such as missing characters, uneven font depth, etc.

[0089] Step e7: The qualified products are sorted, placed on a tray and sent to the next process shown in S1062 for assembly.

[0090] S1062, performing potting and injection molding on the marked component using epoxy resin to obtain an injection-molded component.

[0091] It should be noted that the marked components are potted and injection molded with epoxy resin to form an epoxy resin sealed protective shell for the sensor.

[0092] The sensor epoxy resin sealed protective shell is integrally encapsulated with a specific epoxy resin material. Epoxy resin is a high molecular polymer, a thermosetting resin. It has excellent physical and mechanical properties, heat resistance and electrical insulation, and is non-toxic, high relative density, low water absorption, moisture resistance, water resistance, water vapor resistance, acid and alkali resistance, and mildew resistance. It has good temperature stability and high dimensional stability, can maintain good electrical properties in a wide range of temperature and frequency changes, and is flame retardant and self-extinguishing.

[0093] In this embodiment, S1062 can be implemented through steps f1 to f5.

[0094] Step f1, prepare the injection molding glue in a ratio of (10:4): add the resin glue into the container according to the amount to be used and read the weight, add the curing agent into the container according to the proportion to be used and read the weight. Stir clockwise with a stirring rod for 2 to 5 minutes to fully blend the resin glue and curing agent. Set the stirred injection molding glue aside for later use.

[0095] Step f2, vacuum degassing: Place the container with injection molding glue in the vacuum cabinet, close the cabinet door, and lock the door buckle. Turn on the vacuum suction port switch and close the exhaust port switch. Turn on the vacuum pump power switch and start vacuuming. When the pressure gauge value reaches 55-65cmHg, turn off the vacuum suction port switch and keep it for more than 30 seconds. Turn on the exhaust port switch and when the pressure gauge value reaches 0, open the cabinet door and take out the container.

[0096] Step f3, PCB injection molding: Clean the injection mold and use a scraper to clean the residual resin glue on the mold. Press the sensor copper block upward and the PCB surface downward into the mold in sequence, and pour the resin glue into the mold groove in sequence according to the amount to be used, and observe whether a small amount of glue flows out of the overflow groove.

[0097] Step f4, resin glue heating and curing (curing conditions are 100℃ / 1.5 hours): Turn on the thermostat power switch, set the heating temperature value, press the run key to heat to the set temperature, put the injection mold into the thermostat to heat, and cure according to the curing conditions. After the set time is reached, put on gloves to take out the mold, and take out the sensor while the mold is at high temperature.

[0098] Step f5: Visually inspect the appearance of the finished injection molded product, sort the good products, place them on a tray and send them to the next process for assembly.

[0099] S1063. Perform a second performance test on the injection molded components.

[0100] S1064. When the second performance test of the injection-molded component passes, a temperature sensor is obtained.

[0101] In a possible embodiment, S1063, a second performance test is performed on the injection molded component, including S10631 and S10632.

[0102] S10631. Perform a second test on the signal strength of the injection molded component.

[0103] In this embodiment, S10631 can be implemented through steps g1 to g7.

[0104] Step g1: First connect the collector and antenna, the collector and computer (connected through the UT890 conversion cable), and power the collector through the DC12V adapter.

[0105] Step g2: Open the test software on the computer.

[0106] Step g3: Attach the antenna vertically to the steel wall, and place the antenna vertically and perpendicular to the desktop.

[0107] Step g4: Place the sensors on the test table. The sensors are placed at approximately equal intervals and the distance from the antenna in the horizontal plane is about 8 to 10 cm.

[0108] Step g5. Click the "on" button of the test software, then click the "start measurement" button, and the computer test system will start automatic measurement.

[0109] Step g6, wait for about 1 to 2 minutes for the test software to search for stable signals, confirm the signal strength and temperature displayed in each window, and continue to observe for 1 to 2 hours to confirm whether the signal is stable.

[0110] Step g7: The tested qualified products are sorted, placed on a tray and sent to the next process shown in S10632 for testing.

[0111] S10632. When the second signal strength test of the injection molded component passes, the injection molded component is subjected to a high and low temperature impact test and an aging test.

[0112] In this embodiment, S10631 can be implemented through steps h1 to h9.

[0113] Step h1, place the required sensors in the incubator; set the incubator to implement fixed value conditions for aging, conditions: heat to 80°C / maintain for 48 hours.

[0114] Step h2, set the temperature box to implement fixed value conditions for aging, conditions: heat to 80°C / maintain for 48 hours.

[0115] Step h3: After aging is completed, take out and cool naturally for 4 hours.

[0116] Step h4, set the temperature box to implement the high and low temperature cycle program, the cycle conditions: heat up to 120°C / maintain for 0.5 hour → cool down to -20°C / maintain for 0.5 hour, number of cycles: cycle for 24 hours.

[0117] Step h5: Place the required sensors in the temperature chamber.

[0118] Step h6, set to run according to the program, select execute, the temperature box automatically rises and falls according to the set conditions to perform high and low temperature cycles.

[0119] Step h7: After completing the high and low temperature cycle, take out the sensor and place it at room temperature for more than 4 hours.

[0120] Step h8: Connect to the performance test environment to perform performance testing and check whether the various functional indicators of the sensor are normal.

[0121] Step h9: The tested qualified products are sorted, placed on pallets and sent to the next process for packaging and storage.

[0122] S1064. When the second performance test of the injection-molded component passes, a temperature sensor is obtained, including: when the high and low temperature impact test and the aging test of the injection-molded component pass, a temperature sensor is obtained.

[0123] In a possible embodiment, the sensor chip is a surface acoustic wave resonator.

[0124] It should be noted that the chip of the wireless passive temperature sensor uses a surface acoustic wave resonator. When the chip of the surface acoustic wave resonator is excited by a signal of a specific frequency, the frequency of the output signal of the chip of the surface acoustic wave resonator will change with the change of the contact point temperature. By using this characteristic, the corresponding contact point temperature value can be obtained by collecting the output frequency of the temperature sensor and performing algorithm calculation.

[0125] In a possible embodiment, a welding plane is provided at the bottom of the spring coil, and the area of ​​the welding plane is greater than or equal to a preset area;

[0126] The preset area is three quarters of the coil area of ​​the spring coil.

[0127] It should be noted that the bottom surface of the spring antenna is processed into a welding plane, and the area of ​​the plane is required to be greater than or equal to 3 / 4 of the circle of the spring antenna, and the antenna head does not need to be ground flat.

[0128] In a possible embodiment, the base is made of brass.

[0129] It should be noted that the base is made of brass with excellent thermal conductivity; and the base has good flatness and surface finish, which can ensure better transmission of the temperature of the power cable to the temperature sensor.

[0130] The base has a fixed part connected to the temperature measuring point. The fixed part of the base is designed as a split structure, which is compatible with the structural installation of φ10 / φ12 / φ14 / φ16 similar bolts.

[0131] The contact part between the waterproof sealed sensor and the temperature measuring point is designed to be flat, with a large contact area, and the measured temperature is more accurate.

[0132] In a possible embodiment, the PCB board is a FR-4 double-layer substrate.

[0133] The technical features of the above embodiments may be arbitrarily combined (as long as there is no contradiction in the combination of these technical features). To make the description concise, not all possible combinations of the technical features in the above embodiments are described; these embodiments that are not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A method for manufacturing a temperature sensor, characterized in that: The method comprises: Print solder paste on the base and the PCB board respectively to obtain a base after printing solder paste and a PCB board after printing solder paste; The sensor chip, the inductor and the spring coil are respectively placed at the first preset position, the second preset position and the third preset position of the PCB board after the solder paste is printed, to obtain the PCB board after the components are installed; wherein the first preset position is the desired position of the sensor chip on the PCB board after the solder paste is printed, the second preset position is the desired position of the inductor on the PCB board after the solder paste is printed, and the third preset position is the desired position of the spring coil on the PCB board after the solder paste is printed; Placing the PCB board after the component is installed on the fourth preset position of the base after the solder paste is printed to obtain an assembled component; wherein the fourth preset position is the desired position of the PCB board after the component is installed on the base after the solder paste is printed; Putting the assembled components into a reflow soldering furnace for reflow soldering to obtain a soldered component; Performing a first performance test on the welded assembly; When the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor.

2. The method for manufacturing a temperature sensor according to claim 1, characterized in that: Before printing solder paste on the base and the PCB board respectively, the method further includes: The base and the PCB board are cleaned and dried respectively.

3. The method for manufacturing a temperature sensor according to claim 1, characterized in that: When the assembled component is subjected to reflow soldering in the reflow soldering furnace, the reflow soldering furnace is maintained at a first preset temperature for a first time period.

4. The method for manufacturing a temperature sensor according to claim 1, characterized in that: The first performance test of the welded component includes: The signal strength of the soldered assembly was first tested.

5. The method for manufacturing a temperature sensor according to claim 1, characterized in that: When the first performance test of the welded component passes, marking, injection molding and a second performance test are performed on the welded component to obtain a temperature sensor, including: When the first performance test of the welded component passes, marking the welded component to obtain a marked component; Performing potting and injection molding on the marked component using epoxy resin to obtain an injection-molded component; Performing a second performance test on the injection-molded component; When the second performance test of the injection-molded component passes, a temperature sensor is obtained.

6. The method for manufacturing a temperature sensor according to claim 1, characterized in that: The second performance test of the injection molded component includes: Performing a second test on the signal strength of the injection-molded component; When the injection-molded component passes the second signal strength test, performing a high and low temperature impact test and an aging test on the injection-molded component; When the second performance test of the injection-molded component passes, a temperature sensor is obtained, comprising: When the injection-molded component passes both the high and low temperature impact test and the aging test, a temperature sensor is obtained.

7. The method for manufacturing a temperature sensor according to claim 1, characterized in that: The sensor chip is a surface acoustic wave resonator.

8. The method for manufacturing a temperature sensor according to claim 1, characterized in that: A welding plane is provided at the bottom of the spring coil, and the area of ​​the welding plane is greater than or equal to a preset area; The preset area is three quarters of the coil area of ​​the spring coil.

9. The method for manufacturing a temperature sensor according to claim 1, characterized in that: The base is made of brass.

10. The method for manufacturing a temperature sensor according to claim 1, characterized in that: The PCB board is a FR-4 double-layer substrate.

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