PCB anomaly detection method and device, detection equipment and readable storage medium

Abstract

The embodiment of the invention relates to a PCB anomaly detection method and device, detection equipment and a readable storage medium, and the method comprises the steps: setting an identification code on a current PCB, and generating a PCB information group of the current PCB; scanning the identification code of the current PCB for the first time, carrying out electrical testing operation, generating an electrical testing result, and uploading the result to a PCB information group; and scanning the identification code of the current PCB for the second time to obtain an electrical testing result, if the electrical testing result is that electrical testing is passed, carrying out AVI appearance detection operation on the current PCB, and otherwise, carrying out exception handling operation on the current PCB. According to the invention, multiple times of scanning and repeated inspection are carried out in the detection process, so that abnormality detection is ensured, and the abnormality detection rate is greatly improved; and meanwhile, data association of electric detection operation and AVI appearance detection operation is realized, and PCB scrapping and cost loss caused by warehouse lifting and reworking inspection are avoided.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a PCB abnormality detection method, device, detection equipment and a readable storage medium. Background Art

[0002] At present, in the circuit board electronics industry, with the rapid development of modern electronic technology, customers' pursuit of quality will be taken to a higher level for various types of PCBs and various types of circuit board products. The continuous changes and development of the national economy and the transformation of various electronic product industries to high-tech and refined production development have greatly promoted the quality reform of PCB circuit boards. Among them, the principle of PCB electrical testing is to evaluate the performance and quality of PCB circuit boards by testing electromechanical signals, detecting and analyzing the difference between actual signals and expected signals. PCB electrical testing is widely used in the electronics manufacturing industry to improve product quality and production efficiency.

[0003] In the existing technology, due to the frequent exchange of material numbers during the production process, there is a risk of operators mixing up the boards; moreover, if there is leakage and the FQC / AVI appearance inspection machine cannot intercept it, it will flow directly to the client, causing major quality risks. Summary of the invention

[0004] In view of the above problems, the embodiments of the present invention provide a PCB abnormality detection method, an apparatus, a detection device and a readable storage medium, which are used to solve the problem that due to the frequent exchange of material numbers in the existing production process, operators are at risk of mixing up boards; PCB boards that are lost to the FQC / AVI appearance inspection machine cannot be intercepted and will directly flow to the client, causing major quality risks.

[0005] According to one aspect of an embodiment of the present invention, a PCB abnormality detection method is provided, the method comprising: Set an identification code on the current PCB board and generate a PCB information group of the current PCB board; Scanning the identification code of the current PCB board for the first time, performing an electrical test operation, generating an electrical test result and uploading the result to the PCB information group; The identification code of the current PCB board is scanned for the second time to obtain the electrical test result. If the electrical test result is a qualified product, the AVI appearance inspection operation is performed on the current PCB board, otherwise, the abnormal processing operation is performed on the current PCB board.

[0006] In some optional embodiments, the step of setting an identification code on the current PCB board specifically includes: A two-dimensional code is laser-printed on the current PCB board, and the two-dimensional code is an identification code.

[0007] In some optional embodiments, the electrical measurement operation specifically includes: Circuit function detection operation, by inputting a test signal into the module to be tested, and detecting whether the output signal of the module to be tested is consistent with a preset result to determine whether the module to be tested is normal, wherein the module to be tested includes at least one or more of a power module, a communication module, and a control module; The circuit connectivity detection operation applies an electrical signal to each node of the current PCB board and detects whether the voltage or current of the associated node connected to the detection node is normal to determine whether the connectivity is normal.

[0008] In some optional embodiments, uploading the result to the PCB information group specifically includes: The PCB information group of the current PCB board is stored in the MES database. After the electrical measurement operation is performed and the electrical measurement result is obtained, the electrical measurement result is uploaded to the PCB information group by communicating with the MES database.

[0009] In some optional embodiments, when the electrical test operation detects that the current PCB board has any one or more of missed test, mixed board, open circuit, and short circuit, the electrical test result is an abnormal product.

[0010] In some optional embodiments, the performing an exception handling operation on the current PCB board specifically includes: When the battery result of the current PCB board is found to be unsatisfactory, the AVI appearance inspection machine will issue a lock alarm; Conduct electrical retest on the current PCB board and upload the retest results to the PCB information group; If the re-inspection result is that the re-inspection is passed, the identification code of the current PCB board is scanned for the third time, and the AVI appearance inspection operation is performed on the current PCB board; If the re-inspection result is failure, the current PCB board will be scrapped through the MRB process.

[0011] According to another aspect of an embodiment of the present invention, a PCB abnormality detection device is provided, the device comprising: The code writing module is used to set the identification code on the current PCB board and generate the PCB information group of the current PCB board; An electrical testing module, used for scanning the identification code of the current PCB board for the first time, performing electrical testing operations, generating electrical testing results and uploading the results to the PCB information group; And an AVI appearance inspection module is used to scan the identification code of the current PCB board for the second time to obtain an electrical test result. If the electrical test result is a qualified product, an AVI appearance inspection operation is performed on the current PCB board; otherwise, an exception handling operation is performed on the current PCB board.

[0012] According to another aspect of an embodiment of the present invention, there is provided a detection device, comprising: a processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform operations such as the above-mentioned PCB abnormality detection method.

[0013] In some optional embodiments, the communication interface is communicatively connected to a laser device, an electrical measuring device, or an AVI appearance inspection device.

[0014] According to another aspect of an embodiment of the present invention, a readable storage medium is provided, in which at least one executable instruction is stored. When the executable instruction is executed on the detection device as described above, the endoscopic device performs the operation of the PCB abnormality detection method as described above.

[0015] The PCB abnormality detection method, device, detection equipment and readable storage medium of the present invention have the following beneficial effects: the present invention sets an identification code on the current PCB board and generates a PCB information group of the current PCB board; scans the identification code of the current PCB board for the first time, performs an electrical test operation, generates an electrical test result and uploads the result to the PCB information group; scans the identification code of the current PCB board for the second time, obtains the electrical test result, and if the electrical test result is a qualified product, performs an AVI appearance test operation on the current PCB board, otherwise performs an abnormal processing operation on the current PCB board. The present invention performs multiple scans and repeated inspections during the detection process to ensure abnormal detection and greatly improve the abnormal detection rate; at the same time, the data association between the electrical test operation and the AVI appearance test operation is realized, avoiding the cost loss of PCB scrapping and warehouse rework inspection.

[0016] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation mode of the present invention is specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 A schematic flow chart of a PCB abnormality detection method according to Embodiment 1 of the present invention is shown; Figure 2 A schematic diagram of the current PCB board circulation of the PCB abnormality detection method according to Embodiment 1 of the present invention is shown; Figure 3A schematic structural diagram of a PCB anomaly detection device according to Embodiment 2 of the present invention is shown.

[0018] Figure 4 A schematic structural diagram of a detection device according to Embodiment 3 of the present invention is shown. DETAILED DESCRIPTION

[0019] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0020] Embodiment 1: See also Figure 1-2 According to one aspect of an embodiment of the present invention, a PCB abnormality detection method is provided. The PCB abnormality detection method is applied to the back end of the PCB manufacturing process, and performs abnormality detection on the PCB board to ensure that the PCB functions normally and meets the design requirements. Among them, abnormality detection includes electrical detection and AVI appearance detection. The principle of PCB electrical testing is to evaluate the performance and quality of the PCB circuit board by testing the electromechanical signal, detecting and analyzing the difference between the actual signal and the expected signal. PCB electrical testing is widely used in the electronics manufacturing industry to improve product quality and production efficiency. Its basic principles include circuit connectivity testing, circuit function testing, circuit parameter testing and fault diagnosis. AVI appearance detection is to detect the shape, circuit and solder joints of the PCB board. This method specifically includes: 110, setting an identification code on the current PCB board and generating a PCB information group of the current PCB board; In step 110, setting an identification code on the current PCB board specifically includes: lasering a QR code on the current PCB board by laser, wherein the QR code is the identification code.

[0021] 120, first scan the identification code of the current PCB board, perform electrical testing, generate electrical testing results and upload the results to the PCB information group; in step 120, the electrical testing operation specifically includes: circuit function detection operation, by inputting a test signal to the module to be tested, and detecting whether the output signal of the module to be tested is consistent with the preset result to determine whether the module to be tested is normal, wherein the module to be tested includes at least one or more of a power module, a communication module, and a control module; circuit connectivity detection operation, by applying an electrical signal to each node of the current PCB board, and detecting whether the voltage or current of the associated node connected to the detection node is normal to determine whether the connectivity is normal. Uploading the results to the PCB information group specifically includes: the PCB information group of the current PCB board is stored in the MES database, and after performing the electrical testing operation and obtaining the electrical testing results, the electrical testing results are uploaded to the PCB information group by communicating with the MES database.

[0022] 130, scan the identification code of the current PCB board for the second time to obtain the electrical test result. If the electrical test result is a qualified product, perform the AVI appearance inspection operation on the current PCB board, otherwise perform an exception handling operation on the current PCB board. In step 130, when the electrical test operation detects that the current PCB board has any one or more of missed test, mixed board, open circuit, and short circuit, the electrical test result is an abnormal product. Perform an exception handling operation on the current PCB board, specifically including: when the battery result of the current PCB board is scanned as not passed, the AVI appearance inspection machine performs a lock alarm; the current PCB board is re-tested, and the re-test result is uploaded to the PCB information group; if the re-test result is passed, scan the identification code of the current PCB board for the third time, and perform the AVI appearance inspection operation on the current PCB board; if the re-test result is not passed, the current PCB board is scrapped through the MRB process. The AVI appearance inspection operation on the current PCB board is performed by moving or grabbing the current PCB board to the image acquisition area of ​​the AVI appearance inspection machine, collecting images of the current PCB board from various angles, and comparing the image features with the features of the standard PCB board to confirm whether the shape, circuits and solder joints of the current PCB board meet the requirements.

[0023] The present invention sets an identification code on the current PCB board and generates a PCB information group of the current PCB board; scans the identification code of the current PCB board for the first time, performs an electrical test operation, generates an electrical test result and uploads the result to the PCB information group; scans the identification code of the current PCB board for the second time to obtain the electrical test result, and if the electrical test result is a qualified product, performs an AVI appearance test operation on the current PCB board, otherwise performs an abnormal processing operation on the current PCB board. The present invention performs multiple scans and repeated inspections during the detection process to ensure abnormal detection and greatly improve the abnormal detection rate; at the same time, the data association between the electrical test operation and the AVI appearance test operation is realized, avoiding the cost loss of PCB scrapping and warehouse rework inspection.

[0024] In some optional embodiments, the identification code is set on the current PCB board, specifically including: lasering a two-dimensional code on the current PCB board by laser, and the two-dimensional code is the identification code. In this embodiment, a two-dimensional code is added to the current PCB board for quality traceability, and the information content of the two-dimensional code ensures uniqueness. Specifically, the PCB board is added with a laser engraved two-dimensional code traceability, and each set of boards is laser engraved with a two-dimensional code, which is convenient for production quality traceability.

[0025] In some optional embodiments, the electrical testing operation specifically includes: a circuit function detection operation, which determines whether the module to be tested is normal by inputting a test signal into the module to be tested and detecting whether the output signal of the module to be tested is consistent with a preset result, wherein the module to be tested includes at least one or more of a power module, a communication module, and a control module; a circuit connectivity detection operation, which determines whether the connectivity is normal by applying an electrical signal to each node of the current PCB board and detecting whether the voltage or current of the associated node connected to the detection node is normal.

[0026] In this embodiment, the principle of PCB electrical testing is to evaluate the performance and quality of the PCB circuit board by testing electromechanical signals, detecting and analyzing the difference between the actual signal and the expected signal. PCB electrical testing is widely used in the electronics manufacturing industry to improve product quality and production efficiency. Its basic principles include circuit connectivity testing, circuit function testing, circuit parameter testing, and fault diagnosis. Circuit function testing: Detect whether the functional modules on the PCB, such as power modules, communication modules, control modules, etc., are working properly. By inputting the corresponding functional signal into the module to be tested, and then checking whether the output signal is consistent with the expected result, it is judged whether the function is normal. Circuit connectivity test: By applying an electrical signal at each node, and then checking whether the voltage or current of the corresponding node is normal, it is judged whether the connection is good.

[0027] In summary, PCB electrical testing ensures the quality and performance of PCB circuit boards through the above steps and principles, so that they can work normally and meet design requirements. The test result PASS indicates qualified products, and the test result FAIL indicates abnormal products.

[0028] In some optional embodiments, uploading the result to the PCB information group specifically includes: the PCB information group of the current PCB board is stored in the MES database, and after performing the electrical measurement operation and obtaining the electrical measurement result, the electrical measurement result is uploaded to the PCB information group by communicating with the MES database. In this embodiment, the present invention is implemented based on laser equipment, electrical measurement equipment, and AVI appearance detection equipment. The laser equipment, electrical measurement equipment, and AVI appearance detection equipment are interconnected by wired or wireless means. The MES database can be stored in any of the laser equipment, electrical measurement equipment, and AVI appearance detection equipment, or the MES database is stored in the memory of the background server, and the background server is respectively connected to the laser equipment, electrical measurement equipment, and AVI appearance detection equipment. The PCB information group is a storage array for storing all traceable information of the current PCB board.

[0029] In some optional embodiments, when the current PCB board is detected by electrical testing operation to have any one or more of missed test, mixed board, open circuit, and short circuit, the electrical testing result is an abnormal product. The current PCB board is subjected to abnormal processing operation, specifically including: when the battery result of the current PCB board is scanned and failed, the AVI appearance inspection machine performs a lock alarm; the current PCB board is subjected to electrical testing and re-inspection, and the re-inspection result is uploaded to the PCB information group; if the re-inspection result is passed, the identification code of the current PCB board is scanned for the third time, and the current PCB board is subjected to AVI appearance inspection operation; if the re-inspection result is failed, the current PCB board is scrapped through the MRB process. In this embodiment, the AVI appearance inspection machine synchronously scans the QR code, and the scanned QR code information is matched with the MES database. Only the PASS board information can be inspected normally. The FAIL result device software automatically intercepts the lock screen and performs electrical testing and re-inspection. The probability of defective products being lost to the client is 0, which effectively intercepts the outflow of defective products of electrical testing, improves the quality in the factory, and meets the quality requirements of customers.

[0030] Embodiment 2: According to another aspect of the present invention, a PCB abnormality detection device is provided. Figure 3 , the device comprises: The code writing module 310 is used to execute step 110 in Example 1. The code writing module 310 is specifically used to: laser a two-dimensional code in the current PCB board by laser, and the two-dimensional code is an identification code.

[0031] The electrical measurement module 320 is used to execute step 120 in Example 1. The electrical measurement module 320 is specifically used for: circuit function detection operation, by inputting a test signal into the module to be tested, and detecting whether the output signal of the module to be tested is consistent with the preset result to determine whether the module to be tested is normal, wherein the module to be tested includes at least one or more of a power module, a communication module, and a control module; circuit connectivity detection operation, by applying an electrical signal to each node of the current PCB board, and detecting whether the voltage or current of the associated node connected to the detection node is normal to determine whether the connectivity is normal. Uploading the results to the PCB information group specifically includes: the PCB information group of the current PCB board is stored in the MES database, and after performing the electrical measurement operation and obtaining the electrical measurement result, the electrical measurement result is uploaded to the PCB information group by communicating with the MES database.

[0032] And an AVI appearance detection module 330, which is used to execute step 110 in Example 1, and the AVI appearance detection module 330 is specifically used to: when the current PCB board is detected by electrical testing operation to have any one or more of missed test, mixed board, open circuit, and short circuit, the electrical test result is an abnormal product. The abnormal processing operation is performed on the current PCB board, specifically including: when the battery result of the current PCB board is scanned and failed, the AVI appearance detection machine performs a lock alarm; the current PCB board is re-tested by electrical testing, and the re-test result is uploaded to the PCB information group; if the re-test result is passed, the identification code of the current PCB board is scanned for the third time, and the current PCB board is subjected to AVI appearance detection operation; if the re-test result is failed, the current PCB board is scrapped through the MRB process. The AVI appearance detection operation is performed on the current PCB board by moving or grabbing the current PCB board to the image acquisition area of ​​the AVI appearance detection machine, collecting images of each viewing angle of the current PCB board, and comparing the image features with the features of the standard PCB board to confirm whether the shape, circuit and solder joints of the current PCB board meet the requirements.

[0033] Embodiment 3: Figure 4 The schematic diagram of the structure of the embodiment of the detection device of the present invention is shown, and the specific embodiment of the present invention does not limit the specific implementation of the detection device.

[0034] like Figure 4 As shown, the detection device may include: a processor (processor) 410 , a communication interface (Communications Interface) 440 , a memory (memory) 420 , and a communication bus 430 .

[0035] The processor 410, the communication interface 440, and the memory 420 communicate with each other through the communication bus 430. The communication interface is used to communicate with other devices such as a client or other server network elements. The processor 410 is used to execute the program 450, which can specifically execute the relevant steps in the above-mentioned embodiment of the PCB abnormality detection method.

[0036] Specifically, program 450 may include program code including computer executable instructions.

[0037] The processor 410 may be a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiment of the present invention. The one or more processors included in the detection device may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0038] The memory 420 is used to store the program 450. The memory may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0039] Program 450 can be specifically called by a processor to enable the detection device to execute the steps of the PCB abnormality detection method of Example 1.

[0040] In this embodiment, the communication interface is communicatively connected with the laser equipment, the electrical measuring equipment, and the AVI appearance inspection equipment. The laser equipment, the electrical measuring equipment, and the AVI appearance inspection equipment are interconnected with the processor to realize multiple scans and repeated inspections during the inspection process to ensure abnormality detection and greatly improve the abnormality detection rate; at the same time, the data association between the electrical measuring operation and the AVI appearance inspection operation is realized to avoid the cost loss of PCB scrapping and rework inspection.

[0041] Embodiment 4: According to another aspect of an embodiment of the present invention, a readable storage medium is provided, in which at least one executable instruction is stored. When the executable instruction is run on the detection device as described above, the endoscope device performs the operation of the PCB abnormality detection method as described above. In this embodiment, an identification code is set on the current PCB board, and a PCB information group of the current PCB board is generated; the identification code of the current PCB board is scanned for the first time, an electrical measurement operation is performed, an electrical measurement result is generated and the result is uploaded to the PCB information group; the identification code of the current PCB board is scanned for the second time, and the electrical measurement result is obtained. If the electrical measurement result is that the electrical measurement passes, an AVI appearance detection operation is performed on the current PCB board, otherwise an abnormality handling operation is performed on the current PCB board. Through the present invention, multiple scans and repeated inspections are performed during the detection process to ensure abnormal detection and greatly improve the abnormality detection rate; at the same time, the data association between the electrical measurement operation and the AVI appearance detection operation is realized to avoid the cost loss of PCB scrapping and warehouse rework inspection.

[0042] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0043] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0044] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A PCB abnormality detection method, characterized in that: The method comprises: Set an identification code on the current PCB board and generate a PCB information group of the current PCB board; Scanning the identification code of the current PCB board for the first time, performing an electrical test operation, generating an electrical test result and uploading the result to the PCB information group; The identification code of the current PCB board is scanned for the second time to obtain the electrical test result. If the electrical test result is a qualified product, the AVI appearance inspection operation is performed on the current PCB board, otherwise, the abnormal processing operation is performed on the current PCB board.

2. The PCB abnormality detection method according to claim 1, characterized in that: The step of setting the identification code on the current PCB board specifically includes: A two-dimensional code is laser-printed on the current PCB board, and the two-dimensional code is an identification code.

3. The PCB abnormality detection method according to claim 1, characterized in that: The electrical measurement operation specifically includes: Circuit function detection operation, by inputting a test signal into the module to be tested, and detecting whether the output signal of the module to be tested is consistent with a preset result to determine whether the module to be tested is normal, wherein the module to be tested includes at least one or more of a power module, a communication module, and a control module; The circuit connectivity detection operation applies an electrical signal to each node of the current PCB board and detects whether the voltage or current of the associated node connected to the detection node is normal to determine whether the connectivity is normal.

4. The PCB abnormality detection method according to claim 1, characterized in that: The uploading of the results to the PCB information group specifically includes: The PCB information group of the current PCB board is stored in the MES database. After the electrical measurement operation is performed and the electrical measurement result is obtained, the electrical measurement result is uploaded to the PCB information group by communicating with the MES database.

5. The PCB anomaly detection method according to claim 1, characterized in that: When the current PCB board is detected by electrical testing operation to have any one or more of missed test, mixed board, open circuit, short circuit, the electrical testing result is abnormal.

6. The PCB anomaly detection method according to claim 5, characterized in that: The abnormal processing operation on the current PCB board specifically includes: When the battery of the current PCB board is found to be abnormal, the AVI appearance inspection machine will lock the machine and alarm; Conduct electrical retest on the current PCB board and upload the retest results to the PCB information group; If the re-inspection result is that the re-inspection is passed, the identification code of the current PCB board is scanned for the third time, and the AVI appearance inspection operation is performed on the current PCB board; If the re-inspection result is failure, the current PCB board will be scrapped through the MRB process.

7. A PCB abnormality detection device, characterized in that: The device comprises: The code writing module is used to set the identification code on the current PCB board and generate the PCB information group of the current PCB board; An electrical testing module, used for scanning the identification code of the current PCB board for the first time, performing electrical testing operations, generating electrical testing results and uploading the results to the PCB information group; And an AVI appearance inspection module is used to scan the identification code of the current PCB board for the second time to obtain an electrical test result. If the electrical test result is a qualified product, an AVI appearance inspection operation is performed on the current PCB board; otherwise, an exception handling operation is performed on the current PCB board.

8. A detection device, characterized in that: include: A processor, a memory, a communication interface and a communication bus, wherein the processor, the memory and the communication interface communicate with each other via the communication bus; The memory is used to store at least one executable instruction, and the executable instruction enables the processor to perform the operation of the PCB abnormality detection method as described in any one of claims 1-6.

9. The detection device according to claim 8, characterized in that: The communication interface is connected to the laser equipment, the electrical measuring equipment and the AVI appearance testing equipment for communication.

10. A readable storage medium, characterized in that: The readable storage medium stores at least one executable instruction. When the executable instruction is executed on the detection device as described in claims 8-9, the endoscopic device executes the operation of the PCB abnormality detection method as described in any one of claims 1-6.

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