Optical module
Through the MCU monitoring and adjusting the supply voltage of the DSP chip, the problem of the supply voltage of the optical module exceeding the range under temperature changes is solved, and the high performance and low power consumption of the optical module are achieved, ensuring that the received parameters are within the target range.
Patent Information
- Application Number
- CN202310792138.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-29
- Publication Date
- 2024-12-31
AI Technical Summary
In optical communication, the power supply voltage of the DSP chip exceeds the optimal operating range due to changes in external temperature, resulting in deterioration of the optical module performance and difficulty in controlling power consumption.
The MCU monitors the supply voltage and reception parameters of the DSP chip in real time, such as the receiving side bit error rate and signal-to-noise ratio, and adjusts the supply voltage output from the power chip to ensure that the reception parameters are within the target range, reduce power consumption and improve performance.
When temperature changes, by adjusting the power supply voltage of the DSP chip, the high performance and low power consumption of the optical module are maintained, ensuring that the received parameters are within the target range, and avoiding performance degradation and increased power consumption.
Smart Images
Figure CN119224940A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art
[0002] Optical communication technology is used in new services and application modes such as cloud computing, mobile Internet, and video. In optical communication, the optical module is a device that realizes the conversion of optical and electrical signals and is one of the key components in optical communication equipment.
[0003] The optical module generally includes a circuit board, a digital signal processing (DSP) chip, an optical emitting component and an optical receiving component. The DSP chip is electrically connected to the circuit board. The DSP chip transmits an electrical signal to the optical emitting component so that the electrical signal transmits an optical signal. The external optical signal is converted into an electrical signal by the optical receiving component, and the electrical signal is transmitted to the DSP chip for signal processing.
[0004] During the normal operation of the optical module, the power supply voltage of the DSP chip may exceed the optimal operating range of the DSP chip due to changes in the external temperature, thereby causing the performance of the optical module to deteriorate. Summary of the invention
[0005] The embodiment of the present disclosure provides an optical module to optimize the performance of the optical module and reduce the power consumption according to the feedback of the power supply voltage of the DSP chip.
[0006] The present disclosure provides an optical module, comprising:
[0007] A circuit board, with a gold finger at one end;
[0008] A power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger;
[0009] A DSP chip is mounted on the circuit board, the DSP chip is electrically connected to the power chip, and the power chip supplies power to the DSP chip;
[0010] A light receiving component is electrically connected to the circuit board, the light receiving component is electrically connected to the DSP chip, and the electrical signal output by the light receiving component is transmitted to the DSP chip;
[0011] MCU, mounted on the circuit board, the MCU is connected to the power chip and the DSP chip respectively;
[0012] Wherein, the MCU is configured as:
[0013] Controlling the power chip to output a supply voltage;
[0014] Acquire the power supply voltage and receiving parameters in the DSP chip, wherein the receiving parameters include a receiving side bit error rate and a signal-to-noise ratio;
[0015] When the temperature changes, determining whether the received parameter exceeds a target range;
[0016] When the received parameter does not exceed the target range, controlling the power chip to reduce the output power supply voltage value;
[0017] When the receiving parameter exceeds the target range, the power chip is controlled to increase or decrease the output supply voltage value to improve the receiving parameter.
[0018] It can be seen from the above embodiments that the optical module provided by the embodiments of the present disclosure includes a circuit board, a power chip, a DSP chip, a light receiving component and an MCU. A gold finger is provided at one end of the circuit board. The power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger so as to supply power to the power chip through the gold finger; the DSP chip is mounted on the circuit board, and the DSP chip is electrically connected to the power chip so as to supply power to the DSP chip through the power chip; the light receiving component is electrically connected to the circuit board, and the light receiving component is electrically connected to the DSP chip. The light receiving component transmits the output electrical signal to the DSP chip, and the electrical signal is processed by the DSP chip. The processed electrical signal is transmitted to the host computer through the gold finger to realize light reception; the MCU is mounted on the circuit board, and the MCU is respectively connected to the power chip and the DSP chip. The MCU controls the power chip to output the power supply voltage. The MCU obtains the power supply voltage output by the power chip and the receiving parameters in the DSP chip in real time. The receiving parameters include the bit error rate and signal-to-noise ratio on the receiving side. When the temperature changes, the MCU detects whether the receiving parameters exceed the target range. When the receiving parameters do not exceed the target range, it means that the receiving parameters of the optical module are normal after the temperature changes. At this time, the MCU controls the power supply chip to reduce the output power supply voltage value, so as to minimize the output power supply voltage value of the power supply chip when the receiving parameters of the optical module are normal, which can reduce the power consumption of the optical module; when the receiving parameters exceed the target range, it means that the receiving parameters of the optical module are abnormal after the temperature changes. At this time, the MCU controls the power supply chip to increase or decrease the output power supply voltage value, so that the receiving parameters under the adjusted power supply voltage are within the target range, so as to optimize the receiving parameters of the optical module when the temperature changes. The optical module provided by the present disclosure obtains the relationship between the power supply voltage of the DSP chip and the receiving parameters of the optical module when the temperature changes, and changes the receiving parameters of the optical module by adjusting the power supply voltage of the DSP chip, so that the receiving parameters of the optical module are within the target range, so as to ensure the high performance and low power consumption of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.
[0020] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;
[0021] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;
[0022] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;
[0023] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;
[0024] Figure 5 A partial structural diagram of an optical module provided according to some embodiments of the present disclosure;
[0025] Figure 6 A partial structural diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure;
[0026] Figure 7 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 1 ;
[0027] Figure 8 A block diagram of bit error rate detection in an optical module provided according to some embodiments of the present disclosure;
[0028] Fig. 9 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 2 ;
[0029] Fig.10 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 3 . DETAILED DESCRIPTION
[0030] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.
[0031] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.
[0032] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.
[0033] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
[0034] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.
[0035] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.
[0036] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.
[0037] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.
[0038] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.
[0039] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.
[0040] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.
[0041] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.
[0042] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.
[0043] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.
[0044] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.
[0045] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.
[0046] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above-mentioned shell, and the above-mentioned components can be encapsulated and protected by the upper shell 201 and the lower shell 202. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., the assembly method of the upper shell 201 and the lower shell 202 facilitates the deployment of the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.
[0047] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.
[0048] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
[0049] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.
[0050] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier, LA), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.
[0051] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.
[0052] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.
[0053] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .
[0054] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.
[0055] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.
[0056] The optical emitting component 400 and the optical receiving component 500 are respectively used to realize the emission of optical signals and the reception of optical signals. The optical emitting component 400 is electrically connected to the DSP chip. The circuit board 300 transmits electrical signals to the optical emitting component 400 through the DSP chip. The optical emitting component 400 generates an optical signal based on the electrical signal. The optical signal is emitted through the optical fiber, thereby realizing the emission of light.
[0057] The optical receiving component 500 is electrically connected to the DSP chip. The optical receiving component 500 receives an external optical signal transmitted by an optical fiber. The optical receiving component 500 converts the external optical signal into an electrical signal. The electrical signal is processed by the DSP chip and transmitted to the circuit board 300. The processed electrical signal is transmitted to the host computer 100 via the gold finger 301 on the circuit board 300, thereby realizing light reception.
[0058] During the normal operation of the optical module, the supply voltage of the DSP chip may exceed the optimal operating range of the DSP chip due to changes in the external temperature, thereby causing the performance of the optical module to deteriorate.
[0059] In order to solve the above problems, some embodiments of the present disclosure provide an optical module, which obtains the relationship between the power supply voltage of the DSP chip and the receiving parameters of the optical module when the temperature changes, and changes the receiving parameters of the optical module by adjusting the power supply voltage of the DSP chip to achieve stability of the power supply voltage of the DSP chip at different temperatures, thereby ensuring high performance and low power consumption of the optical module.
[0060] Figure 5 is a partial structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 6 FIG. 1 is a partial structural diagram of a circuit board in an optical module provided according to some embodiments of the present disclosure. Figure 5 and Figure 6 As shown, the circuit board 300 is provided with an MCU 302, a power chip 303 and a DSP chip 304. One end of the power chip 303 is electrically connected to the gold finger 301 so as to supply power to the power chip 303 through the gold finger 301; the other end of the power chip 303 is electrically connected to the DSP chip 304 so as to supply power to the DSP chip 304 through the power chip 303; the power chip 303 is electrically connected to the MCU 302 so as to control the power supply voltage value output by the power chip 303 to the DSP chip 304 through the MCU 302.
[0061] Since the DSP chip 304 transmits electrical signals to the optical transmitting component 400 and the optical receiving component 500 transmits electrical signals to the DSP chip 304 , the working parameters of the DSP chip 304 are related to the transmitting parameters of the optical module and the receiving parameters of the optical module.
[0062] In some embodiments, the transmission parameters and receiving parameters of the optical module are not only related to the working parameters of the DSP chip 304, but also related to other working parameters in the optical module. When the optical module is at room temperature, the working parameters of the DSP chip 304 are fixed. When the receiving parameters of the optical module are abnormal, the receiving parameters of the optical module are changed by adjusting other working parameters in the optical module.
[0063] In some embodiments, when the ambient temperature of the optical module changes, such as when the temperature rises, the current required by optoelectronic devices such as lasers in the optical emitting component 400 and detectors in the optical receiving component 500 increases, and the power consumption of the optical module increases. If the operating parameters of the DSP chip 304 (such as the power supply voltage) remain unchanged at this time, the DSP chip 304 may be unable to meet the large current requirements of the optical emitting component 400 and the optical receiving component 500, causing the performance of the optical module to deteriorate.
[0064] When the temperature drops, the current required by optoelectronic devices such as lasers in the light emitting component 400 and detectors in the light receiving component 500 decreases, and the power consumption of the optical module decreases. If the power supply voltage of the DSP chip 304 remains unchanged at this time, the DSP chip 304 may exceed the requirements of the light emitting component 400 and the light receiving component 500, resulting in higher power consumption of the optical module.
[0065] To ensure high performance and low power consumption of the optical module, when the ambient temperature of the optical module changes, the relationship between the power supply voltage of the DSP chip 304 and the receiving parameters of the optical module is obtained, and the MCU302 controls the power supply voltage output from the power supply chip 303 to the DSP chip 304 to adjust the power supply voltage of the DSP chip 304 at different temperatures to change the receiving parameters of the optical module so that the receiving parameters of the optical module are within the target range.
[0066] Figure 7 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 1 .like Figure 7 As shown, MCU302 has an I2C interface, and the power chip 303 has an I2C pin. The I2C interface of MCU302 is connected to the I2C pin of the power chip 303 via an I2C signal line. MCU302 sends a control signal to the power chip 303 via the I2C signal line, and the power chip 303 outputs a corresponding voltage value according to the control signal to supply power to the DSP chip 304.
[0067] In some embodiments, the DSP chip 304 has a specified supply voltage range, such as a preset voltage range of 0.6±3% V=0.582-0.618 V, and the MCU 302 controls the power chip 303 to output a supply voltage within the preset voltage range to ensure the working performance of the DSP chip 302 .
[0068] The Vout pin of the power chip 303 is connected to the DSP chip 304 via a cable to output a power supply voltage to the DSP chip 304. Since the cable connecting the power chip 303 and the DSP chip 304 has impedance, this will cause a voltage drop at both ends of the cable, which may cause the power supply voltage value received by the DSP chip 304 to exceed the preset voltage range of the DSP chip 304.
[0069] In order to ensure the stability of the power supply voltage of the DSP chip 304, the sense terminal of the power chip 303 is connected to the DSP chip 304, and the power chip 303 sends a compensation voltage through the sense terminal to compensate for the voltage drop caused by the cable.
[0070] The MCU 302 also has an MDIO interface, and the DSP chip 304 has an MDIO pin. The MDIO interface of the MCU 302 is connected to the MDIO pin of the DSP chip 304 through a signal line, and the MCU 302 obtains the working parameters of the DSP chip 304 through the signal line.
[0071] After MCU302 obtains the working parameters of DSP chip 304, MCU302 adjusts the supply voltage output by power chip 303 according to the working parameters of DSP chip 304 to change the supply voltage value of DSP chip 304, thereby changing the receiving parameters of the optical module to ensure high performance or low power consumption of the optical module.
[0072] In some embodiments, the receiving parameter of the optical module may be a receiving side bit error rate, which is stored in the DSP chip 304. The MCU302 obtains the receiving side bit error rate in the DSP chip 304. When the temperature changes, the MCU302 detects whether the receiving side bit error rate exceeds the bit error threshold, that is, whether the receiving side bit error rate is deteriorated. If the receiving side bit error rate is less than the bit error threshold, it means that the receiving side bit error rate has not deteriorated. At this time, the MCU302 controls the power supply chip 303 to reduce the output supply voltage value to reduce the power consumption of the optical module.
[0073] If the bit error rate on the receiving side is greater than or equal to the bit error threshold, it indicates that the bit error rate on the receiving side is deteriorated. At this time, MCU302 controls the power chip 303 to increase or decrease the output power supply voltage value to improve the bit error rate on the receiving side and ensure the high performance of the optical module.
[0074] In some embodiments, the receiving parameter of the optical module may also be a signal-to-noise ratio, which is stored in the DSP chip 304. The MCU302 obtains the signal-to-noise ratio in the DSP chip 304. When the temperature changes, the MCU302 detects whether the signal-to-noise ratio exceeds the target signal-to-noise ratio. If the signal-to-noise ratio is greater than the target signal-to-noise ratio, it means that there is less noise in the received signal. At this time, the MCU302 controls the power supply chip 303 to reduce the output supply voltage value to reduce the power consumption of the optical module.
[0075] If the SNR is less than or equal to the target SNR, it means that there is more noise in the received signal. At this time, MCU302 controls the power chip 303 to increase or decrease the output power supply voltage value to improve the SNR and ensure the high performance of the optical module.
[0076] The optical module provided in the embodiment of the present disclosure is described by taking the receiving parameter as the receiving side bit error rate as an example.
[0077] Figure 8 FIG. 1 is a block diagram of detecting a bit error rate at the receiving side in an optical module according to some embodiments of the present disclosure. Figure 8 As shown, after the optical receiving component 500 converts the optical signal into an electrical signal, the electrical signal is amplified by a trans-impedance amplifier (TIA) and then transmitted to the DSP chip 304. The DSP chip 304 processes the amplified electrical signal. The DSP chip 304 can calculate the receiving side bit error rate based on the received electrical signal and other parameters.
[0078] In some embodiments, an error detection module is provided in the DSP chip 304, which can obtain the receiving side bit error rate based on parameters such as the electrical signal received by the DSP chip 304 from the optical receiving component 500, and the MCU302 can obtain the receiving side bit error rate from the DSP chip 304.
[0079] MCU302 can characterize the working state of DSP chip 304 through the receiving side bit error rate in DSP chip 304. For example, when the receiving side bit error rate is less than the bit error threshold value, it indicates that the bit error rate has not deteriorated, and the working state of DSP chip 304 is good; when the receiving side bit error rate is greater than the bit error threshold value, it indicates that the bit error rate has deteriorated, and the working state of DSP chip 304 is poor. In some embodiments, the bit error threshold value can be 1e-10.
[0080] In some embodiments, a register may be provided in the DSP chip 304, and the error detection module stores the calculated receiving side bit error rate in the register, and the MCU 302 directly reads the receiving side bit error rate in the register, so that the MCU 302 obtains the receiving parameters of the optical module.
[0081] When the temperature changes, the bit error rate on the receiving side may be related to the power supply voltage of the DSP chip 304. After MCU302 obtains the bit error rate on the receiving side of the optical module, MCU302 controls the adjustment of the power supply voltage output by the power chip 303 to change the power supply voltage of the DSP chip 304. MCU302 obtains the bit error rate on the receiving side under the new power supply voltage of the DSP chip 304, and checks whether the bit error rate on the receiving side changes after the power supply voltage of the DSP chip 304 changes.
[0082] If the receiving side bit error rate changes with the change of the power supply voltage of the DSP chip 304, the MCU302 controls and adjusts the power supply voltage output by the power chip 303 according to the change of the receiving side bit error rate to change the receiving side bit error rate, and optimizes the receiving side bit error rate of the optical module, thereby ensuring the high performance of the optical module.
[0083] If the receiving side bit error rate does not change with the change of the power supply voltage of the DSP chip 304, the MCU 302 does not need to control and adjust the power supply voltage output by the power chip 303, and needs to adjust other parameters to change the receiving side bit error rate of the optical module.
[0084] Fig. 9 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 2 , Fig.10 A power supply frame for a DSP chip in an optical module provided according to some embodiments of the present disclosure Figure 3 .like Fig. 9 and Fig.10 As shown, a temperature sensor can be set in MCU302, and a temperature sensor can also be set on the circuit board 300. The temperature sensor is connected to MCU302, and the ambient temperature of the optical module is collected through the temperature sensor in MCU302 or the temperature sensor on the circuit board 300; a first register is set in the power chip 303, and the first register stores the supply voltage value output by the power chip 303; an error detection module and a second register are set in the DSP chip 304, and the error detection module calculates the receiving side bit error rate according to the parameters of the signal received by the optical receiving component 500, and the error detection module stores the obtained receiving side bit error rate in the second register.
[0085] When the optical module is at room temperature, MCU302 reads the first voltage value in the first register and the first bit error rate in the second register. When the temperature changes, MCU302 reads the second voltage value in the first register and the second bit error rate in the second register. MCU302 compares the first bit error rate with the second bit error rate to detect whether the bit error rate on the receiving side of the optical module changes after the temperature changes.
[0086] In some embodiments, when the difference between the first bit error rate and the second bit error rate is less than half an order of magnitude of the bit error rate, it indicates that the bit error rate on the receiving side of the optical module has not changed; when the difference between the first bit error rate and the second bit error rate is greater than half an order of magnitude of the bit error rate, it indicates that the bit error rate on the receiving side of the optical module has changed.
[0087] For example, the first bit error rate is 1e-6, and the second bit error rate is 1e-5. At this time, the difference between the first bit error rate and the second bit error rate is greater than half an order of magnitude, indicating that the bit error rate on the receiving side of the optical module has changed; the first bit error rate is 1e-6, and the second bit error rate is 5e-5. At this time, the difference between the first bit error rate and the second bit error rate is less than half an order of magnitude, indicating that the bit error rate on the receiving side of the optical module has not changed.
[0088] When the temperature changes and the bit error rate on the receiving side of the optical module changes, the second bit error rate is compared with the bit error threshold to detect whether the second bit error rate is degraded. If the second bit error rate is less than the bit error threshold, it means that the bit error rate on the receiving side of the optical module has not degraded after the temperature changes; if the second bit error rate is greater than the bit error threshold, it means that the bit error rate on the receiving side of the optical module has degraded after the temperature changes.
[0089] When the temperature changes, the bit error rate of the optical module on the receiving side does not deteriorate. At this time, in order to reduce the power consumption of the optical module, the MCU 302 can control the power chip 303 to reduce the output voltage to reduce the power supply voltage of the DSP chip 304. The reduced power supply voltage is within the preset voltage range of the DSP chip 304, and the bit error rate on the receiving side under the reduced power supply voltage does not deteriorate. That is, when the temperature changes, the power supply voltage of the DSP chip 304 is reduced as much as possible to reduce the power consumption of the optical module while ensuring that the bit error rate on the receiving side of the optical module does not deteriorate.
[0090] In some embodiments, when the temperature changes and the bit error rate on the receiving side of the optical module does not deteriorate, the MCU302 controls the voltage output by the power chip 303 to gradually decrease from the second voltage value. When the voltage output by the power chip 303 gradually decreases to the minimum supply voltage value in the preset voltage range, the bit error rate on the receiving side still does not deteriorate, then the MCU302 controls the power chip 303 to output the minimum supply voltage value to the DSP chip 304 to minimize the power consumption of the optical module.
[0091] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power chip 303 to gradually decrease from 0.6V. MCU302 obtains the bit error rate of the DSP chip 304 after the power supply voltage is reduced in real time. When the voltage output by the power chip 303 is 0.582V, the receiving side bit error rate obtained by MCU302 has not deteriorated. Then, MCU302 controls the power chip 303 to output a power supply voltage of 0.582V to the DSP chip 304.
[0092] In some embodiments, when the temperature changes and the receiving side bit error rate of the optical module has not deteriorated, the MCU302 controls the voltage output by the power chip 303 to gradually decrease from the second voltage value. When the voltage output by the power chip 303 is the first supply voltage value, the receiving side bit error rate at the first supply voltage value is equal to or greater than the error threshold value, indicating that the receiving side bit error rate at the first supply voltage value begins to deteriorate, then the MCU302 controls the power chip 303 to output a second supply voltage value to the DSP chip 304, and the second supply voltage value is greater than the first supply voltage value, and the second supply voltage value is the first supply voltage value + 1%.
[0093] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power chip 303 to gradually decrease from 0.6V. MCU302 obtains the bit error rate of the DSP chip 304 after the power supply voltage is reduced in real time. When the voltage output by the power chip 303 is 0.58V, the receiving side bit error rate obtained by MCU302 begins to deteriorate, and MCU302 controls the voltage output by the power chip 303 to be 0.58+1%=0.5858V.
[0094] In some embodiments, when the temperature changes, the receiving side bit error rate of the optical module deteriorates. At this time, in order to ensure the performance of the optical module, the MCU302 adjusts the voltage value output by the power chip 303 to change the power supply voltage of the DSP chip 304, thereby changing the receiving side bit error rate of the optical module, so that the adjusted power supply voltage is within the preset voltage range of the DSP chip 304, and the receiving side bit error rate under the adjusted power supply voltage does not deteriorate, so as to optimize the receiving side bit error rate of the optical module.
[0095] When the optical module is in a high temperature environment, due to the high heat dissipation efficiency, the current transmitted to the optical emitting component 400 and the optical receiving component 500 is large, and the power consumption of the optical module is large, resulting in a small supply voltage of the DSP chip 304 at room temperature. At this time, in order to ensure the performance of the optical module, the supply voltage of the DSP chip 304 needs to be increased.
[0096] In some embodiments, when the temperature rises and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power chip 303 to increase the output supply voltage value. When the power supply voltage output by the power chip 303 gradually increases and the receiving side bit error rate under the gradually increasing supply voltage gradually decreases, the MCU302 controls the power chip 303 to output the maximum supply voltage value within a preset voltage range to the DSP chip 304.
[0097] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature rises, MCU302 controls the voltage output by the power chip 303 to gradually increase from 0.6V. MCU302 obtains the receiving side bit error rate of the DSP chip 304 in real time after the power supply voltage is increased. When the voltage output by the power chip 303 gradually increases, the receiving side bit error rate gradually decreases. When the voltage output by the power chip 303 increases to 0.618V, the receiving side bit error rate is the best and does not deteriorate. Then MCU302 controls the power chip 303 to output a power supply voltage of 0.618V to the DSP chip 304.
[0098] In some embodiments, when the temperature rises and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power chip 303 to increase the output power supply voltage value, and the receiving side bit error rate gradually decreases as the power supply voltage of the DSP chip 304 increases. When the voltage output by the power chip 303 is a third power supply voltage value, the receiving side bit error rate at the third power supply voltage value is less than the bit error threshold value, and as the power supply voltage continues to increase, the receiving side bit error rate stabilizes, then the MCU302 controls the power chip 303 to output the third power supply voltage value to the DSP chip 304, and the third power supply voltage value is within the preset voltage range of the DSP chip 304.
[0099] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature changes, MCU302 controls the voltage output by the power chip 303 to gradually increase from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is increased in real time. When the power supply voltage output by the power chip 303 gradually increases, the receiving side bit error rate gradually decreases. When the voltage output by the power chip 303 increases to 0.61V, the receiving side bit error rate is stable and does not deteriorate. Then, MCU302 controls the voltage output by the power chip 303 to be 0.61V.
[0100] When the optical module is in a low temperature environment, the power consumption of the optical module is low, resulting in a larger supply voltage of the DSP chip 304 at room temperature. In order to ensure the performance of the optical module, the supply voltage of the DSP chip 304 needs to be reduced.
[0101] In some embodiments, when the temperature decreases and the bit error rate on the receiving side of the optical module deteriorates, the MCU302 controls the power chip 303 to reduce the output supply voltage. When the power supply voltage output by the power chip 303 gradually decreases and the bit error rate on the receiving side gradually becomes smaller, the MCU302 controls the power chip 303 to output the minimum supply voltage value within a preset voltage range to the DSP chip 304.
[0102] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature drops, MCU302 controls the voltage output by the power chip 303 to gradually decrease from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is reduced in real time. When the power supply voltage output by the power chip 303 gradually decreases, the receiving side bit error rate gradually decreases. When the voltage output by the power chip 303 is reduced to 0.582V, the receiving side bit error rate is the smallest and does not deteriorate. Then, MCU302 controls the power supply voltage output by the power chip 303 to the DSP chip 304 to be 0.582V.
[0103] In some embodiments, when the temperature decreases and the receiving side bit error rate of the optical module deteriorates, the MCU302 controls the power chip 303 to reduce the output power supply voltage, and the receiving side bit error rate gradually decreases as the power supply voltage of the DSP chip 304 decreases. When the voltage output by the power chip 303 is a fourth power supply voltage value, the receiving side bit error rate at the fourth power supply voltage value is less than the bit error threshold value, and as the power supply voltage continues to decrease, the receiving side bit error rate stabilizes, then the MCU302 controls the power chip 303 to output a fourth power supply voltage value to the DSP chip 304, and the fourth power supply voltage value is within a preset voltage range of the DSP chip 304.
[0104] For example, when the optical module is at room temperature, the power supply voltage in the first register is 0.6V. When the temperature drops, MCU302 controls the voltage output by the power chip 303 to gradually decrease from 0.6V. MCU302 obtains the receiving side bit error rate after the power supply voltage of the DSP chip 304 is reduced in real time. When the voltage output by the power chip 303 gradually decreases, the receiving side bit error rate gradually decreases. When the voltage output by the power chip 303 is reduced to 0.59V, the receiving side bit error rate is stable and does not deteriorate. Then MCU302 controls the voltage output by the power chip 303 to be 0.59V.
[0105] In some embodiments, a LUT table can be generated in MCU302 according to the relationship between the DSP power supply voltage value and the receiving side bit error rate at different temperatures. When the ambient temperature of the optical module changes, MCU302 obtains the current temperature value, and MCU302 searches the DSP power supply voltage value and the receiving side bit error rate value corresponding to the current temperature value in the LUT table. MCU302 directly controls the power supply chip 303 to output the corresponding power supply voltage value, so that the receiving side bit error rate of the DSP chip 304 at the power supply voltage value reaches the corresponding receiving side bit error rate value, so as to realize the adjustment of the DSP power supply voltage and the receiving side bit error rate at different temperatures.
[0106] The optical module provided by the embodiment of the present disclosure reads the value of the first register in the power chip and the value of the second register in the DSP chip through the MCU when the ambient temperature of the optical module changes, obtains the supply voltage value output by the power chip and the receiving side bit error rate of the optical module, and according to the degradation of the receiving side bit error rate of the optical module, the MCU controls the power chip to increase or decrease the output supply voltage, obtains the relationship between the supply voltage of the DSP chip and the receiving parameters of the optical module, and changes the receiving parameters of the optical module by adjusting the supply voltage of the DSP chip, so that the receiving parameters of the optical module are within the target range, thereby realizing the adjustment of the DSP supply voltage and the receiving side bit error rate at different temperatures, and ensuring the high performance and low power consumption of the optical module.
[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. An optical module, characterized in that: include: A circuit board, with a gold finger at one end; A power chip is mounted on the circuit board, and the power chip is electrically connected to the gold finger; A DSP chip is mounted on the circuit board, the DSP chip is electrically connected to the power chip, and the power chip supplies power to the DSP chip; A light receiving component is electrically connected to the circuit board, the light receiving component is electrically connected to the DSP chip, and the electrical signal output by the light receiving component is transmitted to the DSP chip; MCU, mounted on the circuit board, the MCU is connected to the power chip and the DSP chip respectively; Wherein, the MCU is configured as: Controlling the power chip to output a supply voltage; Acquire the power supply voltage and receiving parameters in the DSP chip, wherein the receiving parameters include a receiving side bit error rate and a signal-to-noise ratio; When the temperature changes, determining whether the received parameter exceeds a target range; When the received parameter does not exceed the target range, controlling the power chip to reduce the output power supply voltage value; When the receiving parameter exceeds the target range, the power chip is controlled to increase or decrease the output supply voltage value to improve the receiving parameter.
2. The optical module according to claim 1, characterized in that: The MCU is further configured such that, when the receiving parameter is a receiving side bit error rate, when the receiving side bit error rate is less than a bit error threshold value, the power supply chip is controlled to reduce the output power supply voltage value; When the bit error rate of the receiving side is greater than or equal to the bit error threshold, the power supply chip is controlled to increase or decrease the output power supply voltage value.
3. The optical module according to claim 1, characterized in that: The MCU is further configured to, when the received parameter is a signal-to-noise ratio, control the power chip to reduce the output supply voltage value when the signal-to-noise ratio is greater than a target signal-to-noise ratio when the temperature changes; When the signal-to-noise ratio is less than or equal to the target signal-to-noise ratio, the power chip is controlled to increase or decrease the output supply voltage value.
4. The optical module according to claim 2, characterized in that: The power chip is provided with a first register, and the first register stores the supply voltage value output by the power chip; The DSP chip is provided with a second register, and the second register stores a receiving side bit error rate; The MCU reads the first register and the second register respectively to obtain the supply voltage value and the receiving side bit error rate.
5. The optical module according to claim 4, characterized in that: The DSP chip is provided with a bit error detection module, which obtains a receiving side bit error rate according to the parameters of the signal received by the optical receiving component, and stores the receiving side bit error rate in the second register.
6. The optical module according to claim 2, characterized in that: The MCU is also configured to, when the temperature changes and the receiving side bit error rate is less than the bit error threshold value, control the power supply voltage output by the power chip to be reduced to a first power supply voltage value, and when the receiving side bit error rate at the first power supply voltage value is equal to or greater than the bit error threshold value, control the power supply chip to output a second power supply voltage value, and the second power supply voltage value is the first power supply voltage value+1%.
7. The optical module according to claim 2, characterized in that: The MCU is also configured to, when the temperature rises and the receiving side bit error rate is greater than the bit error threshold value, control the power chip to increase the output power supply voltage value, and when the receiving side bit error rate gradually decreases under the gradually increased power supply voltage, control the power chip to output the maximum power supply voltage value within the power supply range.
8. The optical module according to claim 2, characterized in that: The MCU is also configured to, when the temperature decreases and the receiving side bit error rate is greater than the bit error threshold value, control the power chip to reduce the output power supply voltage value, and when the receiving side bit error rate gradually decreases under the gradually reduced power supply voltage, control the power chip to output the minimum power supply voltage value within the power supply range.
9. The optical module according to claim 2, characterized in that: The MCU is also configured to, when the temperature changes and the receiving side bit error rate is greater than the bit error threshold value, control the power supply voltage output by the power chip to increase or decrease to a third power supply voltage value, and when the receiving side bit error rate at the third power supply voltage value is less than or equal to the bit error threshold value and the receiving side bit error rate is stable, control the power supply chip to output the third supply voltage value.
10. The optical module according to claim 1, characterized in that: The power supply voltage range output by the power chip is 0.6±3%V.