Thermal simulation method and device of surface acoustic wave resonator and storage medium

Abstract

The invention discloses a thermal simulation method and device of a surface acoustic wave resonator, and a storage medium. The method comprises the following steps: constructing a thermal simulation heat transfer model; obtaining a first structure layer and a second structure layer which are adjacent to each other in the thermal simulation heat transfer model; calculating the ratio of the modeling thickness to the actual thickness; determining a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; according to the heat flow difference coefficient and the second heat conductivity of the second structural layer, determining a horizontal axis heat conductivity formula of the second structural layer along the horizontal coordinate direction and a longitudinal axis heat conductivity formula of the second structural layer along the longitudinal coordinate direction; and determining a steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal-axis thermal conductivity formula and the longitudinal-axis thermal conductivity formula. The simulation result obtained by the method can converge along with the modeling thickness of different supporting substrates, so that the accuracy of the thermal simulation result is improved.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a thermal simulation method, device and storage medium for a surface acoustic wave resonator. Background Art

[0002] Surface acoustic wave resonators (SAW for short) are usually composed of surface electrodes, piezoelectric films, and supporting substrates (sometimes including several intermediate layers depending on the materials). The surface electrodes can be divided into two-side reflection gratings and interdigital transducers according to their geometric structure and function.

[0003] When a surface acoustic wave resonator is working, the high-frequency vibration of the elastic field will generate a lot of heat through acoustic field damping, which will cause the device to heat up. The self-heating effect in the resonator is crucial for power tolerance, device miniaturization, and preventing frequency drift caused by temperature rise.

[0004] Thermal simulation is an important method to simulate and study the self-heating effect in resonators. The heat source in the model mainly comes from the damping loss in the resonator, which can be calculated from the finite element simulation results of the piezoelectric module applied to the same model, or roughly estimated from the actual measured loss of the device in the experiment. Usually, the model scale of the surface acoustic wave device is based on the device wavelength. In order to simplify the number of degrees of freedom of the model and speed up the calculation, the thickness of the supporting substrate in the model is only a few wavelengths (tens of microns), rather than its actual thickness (hundreds of microns). However, when the boundary conditions at the bottom of the supporting substrate in the thermal simulation model are not set properly, the results of the thermal simulation will diverge with the modeling thickness of the supporting substrate, resulting in distorted simulation results. Summary of the invention

[0005] The present application provides a thermal simulation method, device and storage medium for a surface acoustic wave resonator. The simulation results of the method can converge with the modeling thickness of different supporting substrates, thereby improving the accuracy of the thermal simulation results.

[0006] In one aspect, the present application provides a thermal simulation method for a surface acoustic wave resonator, the method comprising:

[0007] A thermal simulation heat transfer model is constructed by taking the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate;

[0008] Acquire two adjacent first structural layers and a second structural layer in the thermal simulation heat transfer model;

[0009] If the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model, calculating the ratio between the modeled thickness and the actual thickness;

[0010] determining a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio;

[0011] Determine, according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer, a formula for the thermal conductivity of the second structural layer along the horizontal axis and a formula for the thermal conductivity of the second structural layer along the vertical axis;

[0012] According to the transverse axis thermal conductivity formula and the longitudinal axis thermal conductivity formula, a steady-state temperature simulation result of the surface acoustic wave resonator is determined.

[0013] In an exemplary embodiment, determining the thermal conductivity formula of the second structural layer along the horizontal axis and the thermal conductivity formula of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer includes:

[0014] Adjusting the horizontal coordinate of the second structural layer in the surface acoustic wave device model according to the heat flow difference coefficient to obtain an adjusted horizontal coordinate;

[0015] Obtaining a second heat transfer equation corresponding to the second structural layer and a heat flow conservation boundary condition equation between the second structural layer and the first structural layer;

[0016] updating the second heat transfer equation according to the adjusted horizontal coordinate to obtain a second updated heat transfer equation;

[0017] updating the heat flow conservation boundary condition equation according to the adjusted horizontal coordinate to obtain an updated boundary condition equation;

[0018] According to the heat flux difference coefficient, the second updated heat transfer equation and the updated boundary condition equation, a formula for the horizontal axis thermal conductivity of the second structural layer along the horizontal axis direction and a formula for the vertical axis thermal conductivity of the second structural layer along the vertical axis direction are determined.

[0019] In an exemplary embodiment, determining the thermal conductivity formula of the second structural layer along the horizontal axis direction and the thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the second updated heat transfer equation and the updated boundary condition equation includes:

[0020] Performing equivalent transformation on the second updated heat transfer equation and the updated boundary condition equation according to the heat flow difference coefficient to obtain a transformed second updated heat transfer equation and a transformed updated boundary condition equation;

[0021] According to the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

[0022] In an exemplary embodiment, the method further comprises:

[0023] Acquire a first thermal conductivity corresponding to the first structural layer and a second thermal conductivity corresponding to the second structural layer;

[0024] Constructing a first heat transfer equation corresponding to the first structural layer according to the first thermal conductivity, and constructing a second heat transfer equation corresponding to the second structural layer according to the second thermal conductivity;

[0025] The step of determining the thermal conductivity formula of the second structural layer along the horizontal axis direction and the thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the transformed second updated heat transfer equation, and the transformed updated boundary condition equation comprises:

[0026] According to the first heat transfer equation, the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

[0027] In an exemplary embodiment, when the thermal simulation heat transfer model is a two-dimensional model, the second heat transfer equation is:

[0028]

[0029] The heat flow conservation boundary condition equation is:

[0030]

[0031] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0032] In an exemplary embodiment, the transformed second updated heat transfer equation is:

[0033]

[0034] The updated boundary condition equation after the transformation is:

[0035]

[0036] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0037] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the two-dimensional model is: κ x = rκ2;

[0038] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the two-dimensional model is: κ y =r -1 κ2;

[0039] The conduction heat flow formula of the second structural layer in steady state is as follows:

[0040]

[0041] Among them, q is the heat source.

[0042] In an exemplary embodiment, when the thermal simulation heat transfer model is a three-dimensional model, the second heat transfer equation is:

[0043]

[0044] The heat flow conservation boundary condition equation is:

[0045]

[0046] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0047] In an exemplary embodiment, the transformed second updated heat transfer equation is:

[0048]

[0049] The updated boundary condition equation after the transformation is:

[0050]

[0051] Wherein, κ1 is the first thermal conductivity, k2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0052] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the three-dimensional model is: x= rκ2;

[0053] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the three-dimensional model is: κ y =r -1 κ2;

[0054] The vertical axis thermal conductivity formula of the second structural layer along the vertical coordinate direction of the three-dimensional model is: κ z =r -1 κ2.

[0055] The conduction heat flow formula of the second structural layer in steady state is as follows:

[0056]

[0057] Among them, q is the heat source.

[0058] On the other hand, a thermal simulation device for a surface acoustic wave resonator is provided, the device comprising:

[0059] A model building module, used to build a thermal simulation heat transfer model using the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate;

[0060] A structure layer acquisition module, used to acquire two adjacent first structure layers and a second structure layer in the thermal simulation heat transfer model;

[0061] a ratio calculation module, configured to calculate a ratio between the modeled thickness and the actual thickness if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model;

[0062] a coefficient determination module, configured to determine a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio;

[0063] a thermal conductivity formula determination module, configured to determine a thermal conductivity formula of the second structural layer along the horizontal axis and a thermal conductivity formula of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer;

[0064] The simulation result determination module is used to determine the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula.

[0065] On the other hand, an electronic device is provided, comprising a processor and a memory, wherein the memory stores at least one instruction or at least one program, and the at least one instruction or the at least one program is loaded and executed by the processor to implement the thermal simulation method of the surface acoustic wave resonator as described above.

[0066] On the other hand, a computer storage medium is provided, wherein the computer storage medium stores at least one instruction or at least one program, and the at least one instruction or at least one program is loaded and executed by a processor to implement the thermal simulation method of the surface acoustic wave resonator as described above.

[0067] On the other hand, a computer program product or a computer program is provided, the computer program product or the computer program includes computer instructions, the computer instructions are stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes to implement the thermal simulation method of the surface acoustic wave resonator as described above.

[0068] The thermal simulation method, device and storage medium of the surface acoustic wave resonator provided by the present application have the following technical effects:

[0069] The present application uses the thickness of the structural layer in the surface acoustic wave resonator as the horizontal coordinate and the length of the structural layer in the surface acoustic wave resonator as the vertical coordinate to construct a thermal simulation heat transfer model; obtains two adjacent first structural layers and a second structural layer in the thermal simulation heat transfer model; if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeling thickness of the second structural layer in the thermal simulation heat transfer model, calculates the ratio between the modeling thickness and the actual thickness; determines the heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; determines the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer; determines the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula. The simulation results obtained by this method can converge with the modeling thickness of different supporting substrates, thereby improving the accuracy of the thermal simulation results. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] In order to more clearly illustrate the technical solutions and advantages of the embodiments of this specification or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0071] Figure 1 is a schematic structural diagram of a surface acoustic wave resonator provided in an embodiment of this specification;

[0072] Figure 2 It is a flow chart of a thermal simulation method of a surface acoustic wave resonator provided in an embodiment of this specification;

[0073] Figure 3 It is a graph showing the relationship between steady-state temperature and model depth in a two-dimensional thermal simulation heat transfer model in the related art;

[0074] Figure 4 is a schematic structural diagram of a heat transfer model including a two-layer structure provided in an embodiment of this specification;

[0075] Figure 5 is a schematic structural diagram of a two-layer surface acoustic wave resonator provided in an embodiment of this specification;

[0076] Figure 6 This is a comparison diagram of steady-state temperature distribution obtained by using different thermal conductivity conversion methods provided in the embodiments of this specification;

[0077] Figure 7 This is a comparison diagram of simulation results obtained by using different thermal conductivity conversion methods provided in the embodiments of this specification;

[0078] Figure 8 This is a conductive heat flux distribution diagram in a steady state under a correct thermal conductivity change provided by an embodiment of this specification;

[0079] Fig. 9 It is a schematic structural diagram of a thermal simulation device for a surface acoustic wave resonator provided in an embodiment of this specification;

[0080] Fig.10 It is a structural diagram of a server provided in an embodiment of this specification;

[0081] The reference numerals in the figures are as follows:

[0082] 1-support substrate, 2-intermediate layer, 3-piezoelectric film, 4-reflection grating, 41-first reflection grating, 42-second reflection grating, 5-interdigital transducer, 6-electrode array, 7-bus bar. DETAILED DESCRIPTION

[0083] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0084] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0085] In the embodiments of the present application, the term "module" or "unit" refers to a computer program or a part of a computer program with a predetermined function, and works together with other related parts to achieve a predetermined goal, and can be implemented in whole or in part by using software, hardware (such as processing circuits or memories) or a combination thereof. Similarly, a processor (or multiple processors or memories) can be used to implement one or more modules or units. In addition, each module or unit can be part of an overall module or unit that includes the function of the module or unit.

[0086] like Figure 1 As shown, Figure 1 is a schematic structural diagram of a surface acoustic wave resonator provided in an embodiment of this specification; Figure 1 Figure (a) is a top view of a surface acoustic wave resonator. Figure 1 Figure (b) is a cross-sectional view of a surface acoustic wave resonator; a surface acoustic wave resonator (hereinafter referred to as SAW) is usually composed of a surface electrode, a piezoelectric film 3, and a supporting substrate 1 (sometimes including several intermediate layers 2 depending on the material). The surface electrode can be divided into two side reflection gratings 4 (including a first reflection grating 41 and a second reflection grating 42) and an interdigital transducer 5 according to the geometric structure and function, wherein the interdigital transducer 5 (IDT) is composed of two groups of mutually intersecting electrode arrays 6 (marked as the first terminal and the second terminal respectively) with the working wavelength of the SAW device as a period, and a bus bar 7 providing electrical connection; wherein the patterned electrode can also be a deformation and expansion of the pattern.

[0087] The following describes a thermal simulation method for a surface acoustic wave resonator of the present application. Figure 2 It is a flow chart of a thermal simulation method for a surface acoustic wave resonator provided in an embodiment of this specification. This specification provides method operation steps as described in the embodiment or flow chart, but may include more or fewer operation steps based on conventional or non-creative labor. The order of steps listed in the embodiment is only one way of executing the steps among many orders, and does not represent the only order of execution. When the actual system or server product is executed, it can be executed in sequence or in parallel according to the method shown in the embodiment or the accompanying drawings (for example, in a parallel processor or multi-threaded processing environment). Specifically, Figure 2 As shown, the method may include:

[0088] S201: constructing a heat transfer simulation model by taking the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate.

[0089] In the embodiments of this specification, the surface acoustic wave resonator may include at least two structural layers, for example, the surface acoustic wave resonator may include a heat source layer (piezoelectric film layer) and a heat conductive layer (support substrate). The thickness of the structural layer may be used as the abscissa, and the length of the structural layer in the surface acoustic wave resonator may be used as the ordinate to construct a thermal simulation heat transfer model.

[0090] S203: Acquire two adjacent first structural layers and a second structural layer in the thermal simulation heat transfer model.

[0091] In the embodiment of the present specification, the first structural layer is located above the second structural layer, and the actual thickness of the first structural layer in the surface acoustic wave resonator can be the same as the modeling thickness of the first structural layer in the thermal simulation heat transfer model. Optionally, the first structural layer is a heat source layer, and the second structural layer is a heat conduction layer; the actual thickness of the heat source layer in the surface acoustic wave resonator is the same as the modeling thickness of the first structural layer in the thermal simulation heat transfer model.

[0092] Exemplarily, the first structural layer may be a piezoelectric film layer, and the second structural layer may be a supporting substrate. If there is an intermediate layer between the supporting substrate and the piezoelectric film layer, the first structural layer may be the intermediate layer, and the second structural layer may be the supporting substrate. If there are two intermediate layers, the first structural layer may be the intermediate layer close to the piezoelectric film layer, and the second structural layer may be the intermediate layer close to the supporting substrate.

[0093] S205: If the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model, calculate a ratio between the modeled thickness and the actual thickness.

[0094] In the embodiment of the present specification, the second structure layer may be a supporting substrate, and the modeling thickness of the second structure layer may be smaller than the actual thickness; and the ratio between the modeling thickness and the actual thickness may be calculated.

[0095] S207: Determine a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio.

[0096] In the embodiment of the present specification, the ratio between the modeled thickness and the actual thickness can be determined as the heat flow difference coefficient between the first structural layer and the second structural layer.

[0097] S209: Determine a formula for the thermal conductivity of the second structural layer along the horizontal axis and a formula for the thermal conductivity of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer.

[0098] In the embodiments of the present specification, a formula for the thermal conductivity of the second structural layer along the horizontal axis can be constructed based on the product of the second thermal conductivity of the second structural layer and the heat flow difference coefficient; a formula for the thermal conductivity of the second structural layer along the vertical axis can be constructed based on the ratio of the second thermal conductivity of the second structural layer to the heat flow difference coefficient.

[0099] S2011: Determine a steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula.

[0100] In the embodiments of the present specification, after determining the formula for the thermal conductivity of the horizontal axis and the formula for the thermal conductivity of the vertical axis, the steady-state temperature simulation results of the surface acoustic wave resonator can be further determined, and the obtained simulation results can converge with the modeling thickness of different supporting substrates, thereby improving the accuracy of the thermal simulation results.

[0101] It can be seen from the technical solution provided by the above embodiment of this specification that the embodiment of this specification uses the thickness of the structural layer in the surface acoustic wave resonator as the horizontal coordinate and the length of the structural layer in the surface acoustic wave resonator as the vertical coordinate to construct a thermal simulation heat transfer model; obtain two adjacent first structural layers and second structural layers in the thermal simulation heat transfer model; if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeling thickness of the second structural layer in the thermal simulation heat transfer model, calculate the ratio between the modeling thickness and the actual thickness; determine the heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; determine the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer; determine the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula. The simulation results obtained by this method can converge with the modeling thickness of different supporting substrates, thereby improving the accuracy of the thermal simulation results.

[0102] In the embodiment of the present specification, the formula for the thermal conductivity of the second structural layer along the horizontal axis and the formula for the thermal conductivity of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer include:

[0103] Adjusting the horizontal coordinate of the second structural layer in the surface acoustic wave device model according to the heat flow difference coefficient to obtain an adjusted horizontal coordinate;

[0104] Obtaining a second heat transfer equation corresponding to the second structural layer and a heat flow conservation boundary condition equation between the second structural layer and the first structural layer;

[0105] updating the second heat transfer equation according to the adjusted horizontal coordinate to obtain a second updated heat transfer equation;

[0106] updating the heat flow conservation boundary condition equation according to the adjusted horizontal coordinate to obtain an updated boundary condition equation;

[0107] According to the heat flux difference coefficient, the second updated heat transfer equation and the updated boundary condition equation, a formula for the horizontal axis thermal conductivity of the second structural layer along the horizontal axis direction and a formula for the vertical axis thermal conductivity of the second structural layer along the vertical axis direction are determined.

[0108] In the embodiment of this specification, the heat flow difference coefficient can be:

[0109] The horizontal axis after adjustment is as follows:

[0110] x′=rx

[0111] Then, the second heat transfer equation is updated according to the adjusted horizontal coordinate to obtain the second updated heat transfer equation; and the heat flux conservation boundary condition equation is updated according to the adjusted horizontal coordinate to obtain the updated boundary condition equation; finally, according to the heat flux difference coefficient, the second updated heat transfer equation and the updated boundary condition equation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal coordinate direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical coordinate direction can be quickly and accurately determined.

[0112] In the embodiment of the present specification, the formula for the thermal conductivity of the second structural layer along the horizontal axis and the formula for the thermal conductivity of the second structural layer along the vertical axis according to the heat flow difference coefficient, the second updated heat transfer equation and the updated boundary condition equation include:

[0113] Performing equivalent transformation on the second updated heat transfer equation and the updated boundary condition equation according to the heat flow difference coefficient to obtain a transformed second updated heat transfer equation and a transformed updated boundary condition equation;

[0114] According to the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

[0115] In the embodiment of this specification, the method further includes:

[0116] Acquire a first thermal conductivity corresponding to the first structural layer and a second thermal conductivity corresponding to the second structural layer;

[0117] Constructing a first heat transfer equation corresponding to the first structural layer according to the first thermal conductivity, and constructing a second heat transfer equation corresponding to the second structural layer according to the second thermal conductivity;

[0118] The step of determining the thermal conductivity formula of the second structural layer along the horizontal axis direction and the thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the transformed second updated heat transfer equation, and the transformed updated boundary condition equation comprises:

[0119] According to the first heat transfer equation, the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

[0120] In the embodiment of the present specification, the first thermal conductivity is determined based on the material properties of the first structural layer, and the second thermal conductivity is determined based on the material properties of the second structural layer.

[0121] In the two-dimensional thermal simulation heat transfer model, the model includes a piezoelectric film layer (heat source layer) and a supporting substrate layer (heat conduction layer). First, the general finite element model setting method is adopted, that is, an infinite element domain (IE) is set under the supporting substrate. Figure 3 As shown, Figure 3 The relationship between the steady-state temperature and the depth of the model in the two-dimensional thermal simulation heat transfer model is shown in Figure 2. Figure 3 The thickness of the supporting substrate increases from bottom to top along the curve. It can be seen that the thickness of the supporting substrate is different, and the final steady-state temperature is also different.

[0122] To solve this problem, the present invention converts the thermal conductivity of the supporting substrate based on the mathematical principle of the heat transfer equation.

[0123] In the embodiments of this specification, when the thermal simulation heat transfer model is a two-dimensional model, Figure 4 As shown, Figure 4 is a heat transfer model including a piezoelectric (heat source) layer and a supporting substrate (heat conducting) layer. Assume that their thermal conductivities are k1 and κ2, respectively, and the steady-state temperature distribution in each layer satisfies the following first heat transfer equation and second heat transfer equation respectively:

[0124]

[0125] And the boundary condition equation for heat flow conservation between the two layers is:

[0126]

[0127] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0128] The thickness of the supporting substrate layer is H real Change to modeling thickness H sim , which is equivalent to the following coordinate transformation of the heat transfer equation of the supporting substrate:

[0129] x′=rx

[0130] The heat flow difference coefficient is:

[0131] The transformed second heat transfer equation is:

[0132]

[0133] The transformed heat flow conservation boundary condition equation is:

[0134]

[0135] At this time, the boundary conditions in the finite element model do not satisfy the conservation of heat flow, but the interlayer heat flow differs by a coefficient r, which is difficult to achieve. Therefore, the above equation is equivalently transformed; accordingly, the second updated heat transfer equation after the transformation is:

[0136]

[0137] The updated boundary condition equation after the transformation is:

[0138]

[0139] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0140] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the two-dimensional model is: κ x = rκ2;

[0141] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the two-dimensional model is: κ y =r -1 κ2;

[0142] The conduction heat flow formula of the second structural layer in steady state is as follows:

[0143]

[0144] Among them, q is the heat source.

[0145] In some embodiments, when the thermal simulation heat transfer model is a three-dimensional model, the second heat transfer equation is:

[0146]

[0147] The heat flow conservation boundary condition equation is:

[0148]

[0149] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0150] Correspondingly, the second updated heat transfer equation after the transformation is:

[0151]

[0152] The updated boundary condition equation after the transformation is:

[0153]

[0154] Wherein, κ1 is the first thermal conductivity, k2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0155] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the three-dimensional model is: κ x = rκ2;

[0156] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the three-dimensional model is: κ y =r -1 κ2;

[0157] The vertical axis thermal conductivity formula of the second structural layer along the vertical coordinate direction of the three-dimensional model is: κ z =r -1 k2.

[0158] Correspondingly, the conduction heat flow formula of the second structural layer in steady state is as follows:

[0159]

[0160] Among them, q is the heat source.

[0161] In the embodiments of this specification, Figure 5 As shown, Figure 5 The schematic diagram of the structure of a two-layer surface acoustic wave resonator is shown in FIG. 1 . The piezoelectric film layer is 510nm thick lithium tantalate, the device wavelength is 1.8um, the supporting substrate is 4H-SiC, and the actual thickness of the substrate is 504um. The steady-state temperature distribution of the correct thermal conductivity transformation using this embodiment is shown in FIG. Figure 6 (b) and Figure 7 As shown in (a), it can be seen that no matter how thick the supporting substrate is, the temperature in the piezoelectric film layer at steady state will remain consistent.

[0162] As a comparative example, a steady-state temperature distribution using incorrect thermal conductivity transformation is shown in FIG. Figure 6 As shown in (a), the temperature simulation results in the steady state in the piezoelectric layer will diverge with the modeling thickness of the supporting substrate. Figure 7(b) is a comparison chart of simulation results under different lengths of the free surface area of ​​the model. It can be seen that the infinite element domain settings on both sides of the model play a good role in simulating the infinite length free surface area. The steady-state temperature simulation results of the device area remain consistent, which conforms to the general laws of model physics.

[0163] like Figure 8 As shown, Figure 8 The heat flux distribution diagram of the conduction in the steady state under the correct thermal conductivity change of the present embodiment is shown, wherein the temperature T increases from bottom to top. The heat flux formula of the second structural layer in the surface acoustic wave resonator in the steady state is as follows:

[0164]

[0165] Among them, q is the heat source.

[0166] The thermal simulation method of the surface acoustic wave resonator of this embodiment converts the thermal conductivity parameters of the supporting substrate based on the mathematical principle of the heat transfer equation. The converted simulation results will converge with different supporting substrate modeling thicknesses, thereby ensuring the accuracy and reliability of the thermal simulation results.

[0167] The embodiment of this specification also provides a thermal simulation device for a surface acoustic wave resonator, such as Fig. 9 As shown, the device comprises:

[0168] A model building module 910 is used to build a thermal simulation heat transfer model using the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate;

[0169] A structure layer acquisition module 920 is used to acquire two adjacent first structure layers and a second structure layer in the thermal simulation heat transfer model;

[0170] a ratio calculation module 930, configured to calculate a ratio between the modeled thickness and the actual thickness if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model;

[0171] A coefficient determination module 940, configured to determine a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio;

[0172] A thermal conductivity formula determination module 950 is used to determine a thermal conductivity formula of the second structural layer along the horizontal axis direction and a thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer;

[0173] The simulation result determination module 960 is used to determine the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula.

[0174] In some embodiments, the thermal conductivity formula determination module includes:

[0175] A coordinate adjustment unit, configured to adjust the horizontal coordinate of the second structural layer in the surface acoustic wave device model according to the heat flow difference coefficient to obtain an adjusted horizontal coordinate;

[0176] an equation acquisition unit, used to acquire a second heat transfer equation corresponding to the second structural layer and a heat flow conservation boundary condition equation between the second structural layer and the first structural layer;

[0177] a heat transfer equation updating unit, configured to update the second heat transfer equation according to the adjusted horizontal coordinate to obtain a second updated heat transfer equation;

[0178] A boundary equation updating unit, used for updating the heat flow conservation boundary condition equation according to the adjusted horizontal coordinate to obtain an updated boundary condition equation;

[0179] A formula determination unit is used to determine the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flux difference coefficient, the second updated heat transfer equation and the updated boundary condition equation.

[0180] In some embodiments, the formula determination unit includes:

[0181] A transformation subunit, configured to perform an equivalent transformation on the second updated heat transfer equation and the updated boundary condition equation according to the heat flow difference coefficient to obtain a transformed second updated heat transfer equation and a transformed updated boundary condition equation;

[0182] The formula determination subunit is used to determine the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the second updated heat transfer equation after the transformation and the updated boundary condition equation after the transformation.

[0183] In some embodiments, the apparatus further comprises:

[0184] A second thermal conductivity acquisition module, used to acquire a first thermal conductivity corresponding to the first structural layer and a second thermal conductivity corresponding to the second structural layer;

[0185] A second heat transfer equation construction module, used to construct a first heat transfer equation corresponding to the first structural layer according to the first thermal conductivity, and to construct a second heat transfer equation corresponding to the second structural layer according to the second thermal conductivity;

[0186] The formula determination subunit is also used to determine the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the first heat transfer equation, the heat flow difference coefficient, the second updated heat transfer equation after the transformation and the updated boundary condition equation after the transformation.

[0187] In some embodiments, when the thermal simulation heat transfer model is a two-dimensional model, the second heat transfer equation is:

[0188]

[0189] The heat flow conservation boundary condition equation is:

[0190]

[0191] Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0192] In some embodiments, the transformed second updated heat transfer equation is:

[0193]

[0194] The updated boundary condition equation after the transformation is:

[0195]

[0196] Wherein, κ1 is the first thermal conductivity, k2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0197] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the two-dimensional model is: κ x = rκ2;

[0198] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the two-dimensional model is: κ y =r -1 k2;

[0199] The conduction heat flow formula of the second structural layer of the surface acoustic wave resonator in a steady state is as follows:

[0200]

[0201] Among them, q is the heat source.

[0202] In some embodiments, when the thermal simulation heat transfer model is a three-dimensional model, the second heat transfer equation is:

[0203]

[0204] The heat flow conservation boundary condition equation is:

[0205]

[0206] Wherein, κ1 is the first thermal conductivity, k2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, and T is the temperature.

[0207] In some embodiments, the transformed second updated heat transfer equation is:

[0208]

[0209] The updated boundary condition equation after the transformation is:

[0210]

[0211] Wherein, k1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient;

[0212] The thermal conductivity formula of the second structural layer along the horizontal axis direction of the three-dimensional model is: κ x = rκ2;

[0213] The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the three-dimensional model is: κ y =r -1 k2;

[0214] The vertical axis thermal conductivity formula of the second structural layer along the vertical coordinate direction of the three-dimensional model is: κ z =r -1 k2.

[0215] The conduction heat flow formula of the second structural layer in steady state is as follows:

[0216]

[0217] Among them, q is the heat source.

[0218] The device and method embodiments in the described device embodiments are based on the same inventive concept.

[0219] An embodiment of the present specification provides an electronic device, which includes a processor and a memory, wherein the memory stores at least one instruction or at least one program, and the at least one instruction or at least one program is loaded and executed by the processor to implement a thermal simulation method for a surface acoustic wave resonator as provided in the above method embodiment.

[0220] An embodiment of the present application also provides a computer storage medium, which can be set in a terminal to store at least one instruction or at least one program related to a thermal simulation method for a surface acoustic wave resonator in a method embodiment. The at least one instruction or at least one program is loaded and executed by the processor to implement the thermal simulation method for a surface acoustic wave resonator provided in the above method embodiment.

[0221] The embodiment of the present application also provides a computer program product or a computer program, which includes computer instructions stored in a computer-readable storage medium. The processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes to implement the thermal simulation method of the surface acoustic wave resonator provided by the above method embodiment.

[0222] Optionally, in the embodiments of this specification, the storage medium may be located in at least one of the multiple network servers of the computer network. Optionally, in this embodiment, the storage medium may include, but is not limited to: a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and other media that can store program codes.

[0223] The memory described in the embodiments of this specification can be used to store software programs and modules, and the processor executes various functional applications and data processing by running the software programs and modules stored in the memory. The memory may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, application programs required for functions, etc.; the data storage area may store data created according to the use of the device, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage device. Accordingly, the memory may also include a memory controller to provide the processor with access to the memory.

[0224] The thermal simulation method of the surface acoustic wave resonator provided in the embodiments of this specification can be executed in a mobile terminal, a computer terminal, a server or a similar computing device. Taking running on a server as an example, Fig.10 1 is a hardware structure block diagram of a server for a thermal simulation method of a surface acoustic wave resonator provided in an embodiment of this specification. Fig.10 As shown, the server 1000 may have relatively large differences due to different configurations or performances, and may include one or more central processing units (CPU) 1010 (the central processing unit 1010 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA), a memory 1030 for storing data, and one or more storage media 1020 (such as one or more mass storage devices) for storing application programs 1023 or data 1022. Among them, the memory 1030 and the storage medium 1020 can be short-term storage or permanent storage. The program stored in the storage medium 1020 may include one or more modules, each of which may include a series of instruction operations on the server. Furthermore, the central processing unit 1010 can be configured to communicate with the storage medium 1020 and execute a series of instruction operations in the storage medium 1020 on the server 1000. The server 1000 may also include one or more power supplies 1060, one or more wired or wireless network interfaces 1050, one or more input and output interfaces 1040, and / or one or more operating systems 1021, such as Windows ServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, etc.

[0225] The input / output interface 1040 may be used to receive or send data via a network. The specific example of the network may include a wireless network provided by a communication provider of the server 1000. In one example, the input / output interface 1040 includes a network adapter (Network Interface Controller, NIC), which may be connected to other network devices through a base station so as to communicate with the Internet. In one example, the input / output interface 1040 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0226] It can be understood by those skilled in the art that Fig.10 The structure shown is only for illustration and does not limit the structure of the above electronic device. Fig.10 More or fewer components as shown, or with Fig.10 Different configurations shown.

[0227] It can be seen from the embodiments of the thermal simulation method, device, equipment or storage medium of the surface acoustic wave resonator provided by the present application that the present application uses the thickness of the structural layer in the surface acoustic wave resonator as the horizontal coordinate and the length of the structural layer in the surface acoustic wave resonator as the vertical coordinate to construct a thermal simulation heat transfer model; obtain two adjacent first structural layers and second structural layers in the thermal simulation heat transfer model; if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeling thickness of the second structural layer in the thermal simulation heat transfer model, calculate the ratio between the modeling thickness and the actual thickness; determine the heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; determine the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer; determine the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula. The simulation results obtained by this method can converge with the modeling thickness of different supporting substrates, thereby improving the accuracy of the thermal simulation results.

[0228] It should be noted that the above sequence of the embodiments of this specification is for description only and does not represent the advantages and disadvantages of the embodiments. The above describes specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0229] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the device, equipment, and storage medium embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0230] A person skilled in the art will appreciate that all or part of the steps to implement the above embodiments may be accomplished by hardware or by instructing related hardware through a program, and the program may be stored in a computer storage medium, and the above-mentioned storage medium may be a read-only memory, a disk or an optical disk, etc.

[0231] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A thermal simulation method for a surface acoustic wave resonator, characterized in that: The method comprises: A thermal simulation heat transfer model is constructed by taking the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate; Acquire two adjacent first structural layers and a second structural layer in the thermal simulation heat transfer model; If the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model, calculating the ratio between the modeled thickness and the actual thickness; determining a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; Determine, according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer, a formula for the thermal conductivity of the second structural layer along the horizontal axis and a formula for the thermal conductivity of the second structural layer along the vertical axis; According to the transverse axis thermal conductivity formula and the longitudinal axis thermal conductivity formula, a steady-state temperature simulation result of the surface acoustic wave resonator is determined.

2. The method according to claim 1, characterized in that The step of determining the thermal conductivity formula of the second structural layer along the horizontal axis and the thermal conductivity formula of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer comprises: Adjusting the horizontal coordinate of the second structural layer in the surface acoustic wave device model according to the heat flow difference coefficient to obtain an adjusted horizontal coordinate; Obtaining a second heat transfer equation corresponding to the second structural layer and a heat flow conservation boundary condition equation between the second structural layer and the first structural layer; updating the second heat transfer equation according to the adjusted horizontal coordinate to obtain a second updated heat transfer equation; updating the heat flow conservation boundary condition equation according to the adjusted horizontal coordinate to obtain an updated boundary condition equation; According to the heat flux difference coefficient, the second updated heat transfer equation and the updated boundary condition equation, a formula for the horizontal axis thermal conductivity of the second structural layer along the horizontal axis direction and a formula for the vertical axis thermal conductivity of the second structural layer along the vertical axis direction are determined.

3. The method according to claim 2, characterized in that The step of determining the thermal conductivity formula of the second structural layer along the horizontal axis direction and the thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the second updated heat transfer equation and the updated boundary condition equation includes: Performing equivalent transformation on the second updated heat transfer equation and the updated boundary condition equation according to the heat flow difference coefficient to obtain a transformed second updated heat transfer equation and a transformed updated boundary condition equation; According to the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

4. The method according to claim 3, characterized in that The method further comprises: Acquire a first thermal conductivity corresponding to the first structural layer and a second thermal conductivity corresponding to the second structural layer; Constructing a first heat transfer equation corresponding to the first structural layer according to the first thermal conductivity, and constructing a second heat transfer equation corresponding to the second structural layer according to the second thermal conductivity; The step of determining the thermal conductivity formula of the second structural layer along the horizontal axis direction and the thermal conductivity formula of the second structural layer along the vertical axis direction according to the heat flow difference coefficient, the transformed second updated heat transfer equation, and the transformed updated boundary condition equation comprises: According to the first heat transfer equation, the heat flow difference coefficient, the second updated heat transfer equation after transformation and the updated boundary condition equation after transformation, the horizontal axis thermal conductivity formula of the second structural layer along the horizontal axis direction and the vertical axis thermal conductivity formula of the second structural layer along the vertical axis direction are determined.

5. The method according to claim 4, characterized in that When the thermal simulation heat transfer model is a two-dimensional model, the second heat transfer equation is: The heat flow conservation boundary condition equation is: Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, and T is the temperature.

6. The method according to claim 5, characterized in that The second updated heat transfer equation after the transformation is: The updated boundary condition equation after the transformation is: Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient; The thermal conductivity formula of the second structural layer along the horizontal axis direction of the two-dimensional model is: κ x = rκ2; The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the two-dimensional model is: κ y =r -1 κ2; The conduction heat flow formula of the second structural layer in steady state is as follows: Among them, q is the heat source.

7. The method according to claim 2, characterized in that When the thermal simulation heat transfer model is a three-dimensional model, the second heat transfer equation is: The heat flow conservation boundary condition equation is: Wherein, κ1 is the first thermal conductivity, κ2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, and T is the temperature.

8. The method according to claim 7, characterized in that The second updated heat transfer equation after the transformation is: The updated boundary condition equation after the transformation is: Wherein, κ1 is the first thermal conductivity, k2 is the second thermal conductivity; x is the thickness of the structural layer in the surface acoustic wave resonator, y is the length of the structural layer in the surface acoustic wave resonator, z is the width of the structural layer in the surface acoustic wave resonator, T is the temperature, and r is the heat flow difference coefficient; The thermal conductivity formula of the second structural layer along the horizontal axis direction of the three-dimensional model is: κ x = rκ2; The thermal conductivity formula of the second structural layer along the longitudinal axis direction of the three-dimensional model is: κ y =r -1 κ2; The vertical axis thermal conductivity formula of the second structural layer along the vertical coordinate direction of the three-dimensional model is: κ z =r -1 κ2 The conduction heat flow formula of the second structural layer in steady state is as follows: Among them, q is the heat source.

9. A thermal simulation device for a surface acoustic wave resonator, characterized in that: The device comprises: A model building module, used to build a thermal simulation heat transfer model using the thickness of the structural layer in the surface acoustic wave resonator as the abscissa and the length of the structural layer in the surface acoustic wave resonator as the ordinate; A structure layer acquisition module, used to acquire two adjacent first structure layers and a second structure layer in the thermal simulation heat transfer model; a ratio calculation module, configured to calculate a ratio between the modeled thickness and the actual thickness if the actual thickness of the second structural layer in the surface acoustic wave resonator is different from the modeled thickness of the second structural layer in the thermal simulation heat transfer model; a coefficient determination module, configured to determine a heat flow difference coefficient between the first structural layer and the second structural layer according to the ratio; a thermal conductivity formula determination module, configured to determine a thermal conductivity formula of the second structural layer along the horizontal axis and a thermal conductivity formula of the second structural layer along the vertical axis according to the heat flow difference coefficient and the second thermal conductivity of the second structural layer; The simulation result determination module is used to determine the steady-state temperature simulation result of the surface acoustic wave resonator according to the horizontal axis thermal conductivity formula and the vertical axis thermal conductivity formula.

10. A computer storage medium, characterized in that: The computer storage medium stores at least one instruction or at least one program, and the at least one instruction or at least one program is loaded and executed by the processor to implement the thermal simulation method of the surface acoustic wave resonator according to any one of claims 1-8.

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