Cable processing equipment state prediction system and method based on data feedback

Abstract

The invention discloses a cable processing equipment state prediction system and method based on data feedback, and belongs to the field of state prediction. Processing equipment power state abnormity analysis is carried out through a skin cutting abnormity analysis result and a cable core damage abnormity analysis result obtained through analysis; the skin cutting anomaly analysis result and the wire core damage anomaly analysis result of the processing equipment with the abnormal power state are imported into a power analysis strategy for optimal cutting power prediction, and skin cutting data in the cutting process and cut wire core damage data are comprehensively analyzed; the cutting quality in the cutting process is accurately evaluated, and then the optimal cutting power is accurately predicted according to the cutting quality obtained through comprehensive evaluation, so that the safety in the cable processing process is improved.

Description

Technical Field

[0001] The present application belongs to the field of state prediction, and more specifically, is a system and method for predicting the state of cable processing equipment based on data feedback. Background Art

[0002] In the process of cable processing, it is often necessary to separate the cable skin and the internal wire core. Most of the existing technologies use lasers or cutters to cut the cable skin. In the process of cutting the cable skin, it often happens that the cable cutting quality is poor or the cutting is excessive due to improper power adjustment (such as Figure 5 and Figure 6 As shown, the surface cutting position and wire core damage are caused during the cutting process). The prior art cannot comprehensively analyze the surface cutting data during the cutting process and the wire core damage data after cutting, and thus cannot accurately evaluate the cutting quality during the cutting process, which leads to the inability to accurately predict the optimal cutting power based on the cutting quality obtained by comprehensive evaluation. Most of the prior art have the above problems. In order to solve the problems raised by the background technology, the present application designs a cable processing equipment state prediction system and method based on data feedback. Summary of the invention

[0003] In response to the deficiencies in the prior art, the present application proposes a cable processing equipment state prediction system and method based on data feedback. The present application performs power state abnormality analysis on the processing equipment by analyzing the abnormal analysis results of surface cutting and the abnormal analysis results of wire core damage. The abnormal analysis results of surface cutting and the abnormal analysis results of wire core damage of the processing equipment with abnormal power state are imported into the power analysis strategy to predict the optimal cutting power. A comprehensive analysis is performed on the surface cutting data during the cutting process and the wire core damage data after cutting, and the cutting quality during the cutting process is accurately evaluated. Then, the cutting quality obtained by the comprehensive evaluation is used to accurately predict the optimal cutting power, thereby improving the safety of the cable processing process.

[0004] To achieve the above objectives, the present application provides the following technical solutions: In the first aspect, the present application provides a method for predicting the state of a cable processing equipment based on data feedback, which includes the following specific steps: S1. Obtaining the cable skin cutting data during the cable skin laser cutting process and the wire core damage data after cutting; S2, importing the obtained cable skin cutting data during the laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis; S3, importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model to perform wire core damage abnormality analysis; S4. Perform power status abnormality analysis of the processing equipment by analyzing the obtained skin cutting abnormality analysis results and the wire core damage abnormality analysis results; S5. Import the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status into the power analysis strategy to predict the optimal cutting power.

[0005] As a preferred technical solution of the cable processing equipment state prediction method based on data feedback, the specific content of obtaining the cable skin cutting data during the cable skin laser cutting process and the wire core damage data after cutting is: S11, placing the cable at the output end of the laser cutter to cut the cable skin, the laser cutter outputs a laser of set power to cut the cable skin, obtains the skin cutting depth and cutting surface image data after the laser cutter cuts, and stores them in the first storage component, where the cutting depth can be obtained by a three-dimensional imaging module, and the cutting surface image is obtained by an image acquisition terminal; S12. At the same time, the image data of the wire core damage after cutting is collected through the image collection terminal and stored in the second storage component.

[0006] As a preferred technical solution of the cable processing equipment state prediction method based on data feedback, the method of importing the acquired cable skin cutting data during the cable skin laser cutting process into the skin cutting abnormality analysis model for skin cutting abnormality analysis includes the following specific steps: S21, obtaining image data of the corresponding cutting surface during the cutting process, taking the cutting surface as a reference plane, obtaining the position and area data of abnormal surfaces such as pits and ridges on the cutting surface, and simultaneously obtaining the pixel value data of each pixel point on the cutting surface, and dividing the cutting surface into a plurality of thickness regions along the direction of the epidermis thickness; S22, obtaining the position and area data of the abnormal surface of the surface corresponding to each thickness region, and simultaneously obtaining the pixel value data of each pixel point on the surface of each thickness region, and importing them into the cutting surface abnormal value calculation formula to calculate the cutting surface abnormal value, wherein the cutting surface abnormal value calculation formula of the i-th thickness region is: , where Hi is the cutting surface abnormal value of the i-th thickness area, a is the surface flatness ratio, mi is the number of abnormal surfaces on the surface of the i-th thickness area, s is the cutting surface area, pj is the cutting surface thickness, and sj is the j-th abnormal surface area data. is the average distance between abnormal surfaces in the ith thickness region, ni is the number of pixels in the ith thickness region, xic is the pixel value of the cth pixel in the ith thickness region, and xim is the average pixel value of the epidermis. In this formula Where mi is the number of abnormal surfaces on the surface of the i-th thickness area, s is the cutting surface area, pj is the cutting surface thickness, sj is the j-th abnormal surface area data, is the average distance between the abnormal surfaces in the ith thickness region, which calculates the smoothness of the cut surface. At the same time, in order to reflect the aggregation of abnormal surfaces, the average distance between the abnormal surfaces in the ith thickness region is introduced to indicate that the more aggregated, the more serious the abnormality. The pixel anomaly of the cutting surface is the best. The pixel anomaly of the cutting surface and the smoothness of the cutting surface are combined to accurately analyze the quality of the cutting surface. S23, obtaining the calculated cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area, and substituting the cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area into the epidermis abnormal cutting value calculation formula to calculate the epidermis abnormal cutting value, wherein the epidermis abnormal cutting value calculation formula is: , where N is the number of thickness regions, ki is the average depth of the ith thickness region, and K is the epidermal thickness; S24, obtaining average depth data of the epidermal cut surface, and dividing the average cutting depth by the epidermal thickness to obtain a complete cutting value.

[0007] As a preferred technical solution of the cable processing equipment state prediction method based on data feedback, the method of importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model for wire core damage abnormality analysis includes the following specific steps: S31, obtaining wire core damage image data corresponding to the cutting position, and obtaining damage depth data of each point corresponding to the cutting position of the wire core; S32, importing the acquired damage depth data of each point corresponding to the cutting position of the wire core into the wire core damage abnormal value calculation formula to calculate the wire core damage abnormal value, wherein the wire core damage abnormal value calculation formula is: , where Xm is the core damage width, tz is the shortest distance from the z-th damage point on the core to the cutting position on the straight line, Lz is the depth of the z-th damage point on the core, Lm is the damage depth safety value, dz is the integral of the original contour of the damage position, and Mz is the cross-sectional area of ​​the fiber core; S33. Obtain the calculated abnormal value of the wire core damage.

[0008] As a preferred technical solution of the cable processing equipment state prediction method based on data feedback, the acquisition of the skin cutting abnormality analysis results and the wire core damage abnormality analysis results obtained through analysis to perform abnormal power state analysis of the processing equipment includes the following specific contents: The calculated skin cutting abnormality value is compared with the set skin cutting abnormality threshold, and the calculated wire core damage abnormality value is compared with the set wire core damage abnormality threshold, and the cutting complete value is compared with the set cutting complete threshold. If the calculated skin cutting abnormality value is less than or equal to the set skin cutting abnormality threshold, and the wire core damage abnormality value is less than or equal to the set wire core damage abnormality threshold, and the cutting complete value is greater than or equal to the set cutting complete threshold, then it is judged that the power state of the processing equipment is normal, and S5 is not performed; if the obtained skin cutting abnormality value is greater than the set skin cutting abnormality threshold and / or the wire core damage abnormality value is greater than the set wire core damage abnormality threshold and / or the cutting complete value is less than the set cutting complete threshold, then it is judged that the power state of the processing equipment is abnormal, and S5 is performed.

[0009] As a preferred technical solution for the method of predicting the state of cable processing equipment based on data feedback, the method of importing the abnormal analysis results of skin cutting and abnormal analysis results of wire core damage of processing equipment with abnormal power state into the power analysis strategy for optimal cutting power prediction includes the following specific contents: The calculated abnormal skin cutting value, complete cutting value and abnormal core damage value are imported into the optimal power calculation formula to calculate the optimal power, where the optimal power calculation formula is: , where Pm is the set power, w is the complete cutting value, b is the abnormal proportion coefficient, and c is the epidermal abnormal cutting value proportion coefficient.

[0010] In the second aspect, the present application provides a cable processing equipment state prediction system based on data feedback, which is implemented based on the above-mentioned cable processing equipment state prediction method based on data feedback, and specifically includes a data acquisition module, a skin cutting abnormality analysis module, a wire core damage abnormality analysis module, a state abnormality analysis module and an optimal power prediction module; The data acquisition module is used to acquire the cable skin cutting data and the wire core damage data after cutting during the cable skin laser cutting process; The skin cutting abnormality analysis module is used to import the skin cutting data obtained during the cable skin laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis; The wire core damage anomaly analysis module is used to import the obtained wire core damage data after cutting into the wire core damage anomaly judgment model to perform wire core damage anomaly analysis; The state abnormality analysis module is used to perform power state abnormality analysis of the processing equipment by analyzing the obtained surface cutting abnormality analysis results and the wire core damage abnormality analysis results; The optimal power prediction module is used to import the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status into the power analysis strategy to predict the optimal cutting power; It may also include a control module, which is used to control the operation of the data acquisition module, the skin cutting abnormality analysis module, the core damage abnormality analysis module, the state abnormality analysis module and the optimal power prediction module.

[0011] In a third aspect, the present application provides an electronic device, comprising: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the above-mentioned method for predicting the state of the cable processing equipment based on data feedback by calling the computer program stored in the memory.

[0012] In a fourth aspect, the present application provides a computer-readable storage medium storing instructions, which, when executed on a computer, enable the computer to execute the above-mentioned method for predicting the state of a cable processing equipment based on data feedback.

[0013] Compared with the prior art, the beneficial effects of the present application are as follows: the present application obtains the surface cutting data of the cable surface during the laser cutting process of the cable surface and the wire core damage data after cutting, imports the surface cutting data obtained during the laser cutting process of the cable surface into the surface cutting abnormality analysis model for surface cutting abnormality analysis, imports the wire core damage data obtained after cutting into the wire core damage abnormality judgment model for wire core damage abnormality analysis, performs power state abnormality analysis of the processing equipment by analyzing the surface cutting abnormality analysis results and the wire core damage abnormality analysis results, imports the surface cutting abnormality analysis results and the wire core damage abnormality analysis results of the processing equipment with abnormal power state into the power analysis strategy for optimal cutting power prediction, comprehensively analyzes the surface cutting data during the cutting process and the wire core damage data after cutting, accurately evaluates the cutting quality during the cutting process, and then accurately predicts the optimal cutting power prediction based on the cutting quality obtained by the comprehensive evaluation, thereby improving the safety of the cable processing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings.

[0015] Figure 1 This is a schematic diagram of the overall process of the cable processing equipment state prediction method based on data feedback in this application; Figure 2 This is a schematic diagram of step S2 of the cable processing equipment state prediction method based on data feedback of this application; Figure 3 This is a schematic diagram of step S3 of the cable processing equipment state prediction method based on data feedback of this application; Figure 4This is a schematic diagram of the overall framework of the cable processing equipment state prediction system based on data feedback in this application; Figure 5 A schematic diagram of the cables applicable to this application; Figure 6 This is a schematic diagram of a cable scene after cutting in the background technology of this application. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use.

[0017] Embodiment 1. To solve the technical problems raised in the background technology, the present application provides a preferred embodiment: Figure 1 - Figure 3 As shown, the cable processing equipment state prediction method based on data feedback includes the following specific steps: S1. Obtaining the cable skin cutting data during the cable skin laser cutting process and the wire core damage data after cutting; In a specific embodiment, the specific contents of obtaining the cable skin cutting data and the wire core damage data after cutting during the cable skin laser cutting process are as follows: S11, such as Figure 5 As shown, the cable is placed at the output end of the laser cutter to cut the cable skin. The laser cutter outputs a laser of set power to cut the cable skin. The skin cutting depth and cutting surface image data after cutting by the laser cutter are obtained and stored in the first storage component. The cutting depth here can be obtained by a three-dimensional imaging module, and the cutting surface image is obtained by an image acquisition terminal. S12, simultaneously collecting the wire core damage image data after cutting through the image acquisition terminal, and storing it in the second storage component; S2, importing the obtained cable skin cutting data during the laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis; In a specific embodiment, the obtained cable skin cutting data during the cable skin laser cutting process is imported into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis, which includes the following specific steps: S21, obtaining image data of the corresponding cutting surface during the cutting process, taking the cutting surface as a reference plane, obtaining the position and area data of abnormal surfaces such as pits and ridges on the cutting surface, and simultaneously obtaining the pixel value data of each pixel point on the cutting surface, and dividing the cutting surface into a plurality of thickness regions along the direction of the epidermis thickness; S22, obtaining the position and area data of the abnormal surface of the surface corresponding to each thickness region, and simultaneously obtaining the pixel value data of each pixel point on the surface of each thickness region, and importing them into the cutting surface abnormal value calculation formula to calculate the cutting surface abnormal value, wherein the cutting surface abnormal value calculation formula of the i-th thickness region is: , where Hi is the cutting surface abnormal value of the i-th thickness area, a is the surface flatness ratio, mi is the number of abnormal surfaces on the surface of the i-th thickness area, s is the cutting surface area, pj is the cutting surface thickness, and sj is the j-th abnormal surface area data. is the average distance between abnormal surfaces in the ith thickness region, ni is the number of pixels in the ith thickness region, xic is the pixel value of the cth pixel in the ith thickness region, and xim is the average pixel value of the epidermis. In this formula Where mi is the number of abnormal surfaces on the surface of the i-th thickness area, s is the cutting surface area, pj is the cutting surface thickness, sj is the j-th abnormal surface area data, is the average distance between the abnormal surfaces in the ith thickness region, which calculates the smoothness of the cut surface. At the same time, in order to reflect the aggregation of abnormal surfaces, the average distance between the abnormal surfaces in the ith thickness region is introduced to indicate that the more aggregated, the more serious the abnormality. The pixel anomaly of the cutting surface is the best. The pixel anomaly of the cutting surface and the smoothness of the cutting surface are combined to accurately analyze the quality of the cutting surface. S23, obtaining the calculated cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area, and substituting the cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area into the epidermis abnormal cutting value calculation formula to calculate the epidermis abnormal cutting value, wherein the epidermis abnormal cutting value calculation formula is: , where N is the number of thickness regions, ki is the average depth of the ith thickness region, and K is the epidermal thickness; S24, obtaining average depth data of the epidermal cut surface, and dividing the average cutting depth by the epidermal thickness to obtain a complete cutting value; S3, importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model to perform wire core damage abnormality analysis; In a specific embodiment, importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model to perform wire core damage abnormality analysis includes the following specific steps: S31, such as Figure 6 As shown, the wire core damage image data corresponding to the cutting position is obtained, and the damage depth data of each point corresponding to the cutting position of the wire core is obtained; S32, importing the acquired damage depth data of each point corresponding to the cutting position of the wire core into the wire core damage abnormal value calculation formula to calculate the wire core damage abnormal value, wherein the wire core damage abnormal value calculation formula is: , where Xm is the core damage width, tz is the shortest distance from the z-th damage point on the core to the cutting position on the straight line, Lz is the depth of the z-th damage point on the core, Lm is the damage depth safety value, dz is the integral of the original contour of the damage position, and Mz is the cross-sectional area of ​​the fiber core; S33, obtaining the calculated abnormal value of the wire core damage; S4. Perform power status abnormality analysis of the processing equipment by analyzing the obtained skin cutting abnormality analysis results and the wire core damage abnormality analysis results; In a specific embodiment, obtaining the skin cutting abnormality analysis results and the wire core damage abnormality analysis results obtained through analysis to perform abnormality analysis on the power state of the processing equipment includes the following specific contents: The calculated skin cutting abnormality value is compared with the set skin cutting abnormality threshold, and the calculated wire core damage abnormality value is compared with the set wire core damage abnormality threshold, and the cutting complete value is compared with the set cutting complete threshold. If the calculated skin cutting abnormality value is less than or equal to the set skin cutting abnormality threshold, and the wire core damage abnormality value is less than or equal to the set wire core damage abnormality threshold, and the cutting complete value is greater than or equal to the set cutting complete threshold, then it is judged that the power state of the processing equipment is normal, and S5 is not performed; if the obtained skin cutting abnormality value is greater than the set skin cutting abnormality threshold and / or the wire core damage abnormality value is greater than the set wire core damage abnormality threshold and / or the cutting complete value is less than the set cutting complete threshold, then it is judged that the power state of the processing equipment is abnormal, and S5 is performed. It should be noted that the and / or here means that as long as one of the three judgment factors is satisfied, the power state of the processing equipment is judged to be abnormal; S5, importing the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status into the power analysis strategy to predict the optimal cutting power; In a specific embodiment, the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status are introduced into the power analysis strategy to predict the optimal cutting power, which includes the following specific contents: The calculated abnormal skin cutting value, complete cutting value and abnormal core damage value are imported into the optimal power calculation formula to calculate the optimal power, where the optimal power calculation formula is: , where Pm is the set power, w is the complete cutting value, b is the abnormality ratio coefficient, and c is the skin abnormal cutting value ratio coefficient. It should be noted that the surface flatness ratio coefficient, abnormality ratio coefficient, skin cutting abnormality threshold, core damage abnormality threshold and complete cutting threshold are obtained as follows: 500 sets of skin cutting data during the skin laser cutting process of the cable and the core damage data after cutting are obtained, and qualified cutting processes and unqualified cutting processes are classified. The skin cutting data during the skin laser cutting process of the cable and the core damage data after cutting are imported into the optimal power calculation formula to calculate the optimal power, the qualified rate of the cutting process under the optimal power is analyzed, and the values ​​of the surface flatness ratio coefficient, skin cutting abnormality threshold, core damage abnormality threshold and complete cutting threshold corresponding to the maximum cutting process qualified rate are obtained.

[0018] The advantages of this embodiment over the prior art are as follows: obtaining the skin cutting data during the cable skin laser cutting process and the wire core damage data after cutting, importing the obtained skin cutting data during the cable skin laser cutting process into the skin cutting abnormality analysis model for skin cutting abnormality analysis, importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model for wire core damage abnormality analysis, performing power state abnormality analysis of the processing equipment by analyzing the obtained skin cutting abnormality analysis results and the wire core damage abnormality analysis results, importing the skin cutting abnormality analysis results and the wire core damage abnormality analysis results of the processing equipment with abnormal power state into the power analysis strategy for optimal cutting power prediction, comprehensively analyzing the skin cutting data during the cutting process and the wire core damage data after cutting, accurately evaluating the cutting quality during the cutting process, and then accurately predicting the optimal cutting power prediction based on the cutting quality obtained by the comprehensive evaluation, thereby improving the safety of the cable processing process.

[0019] Example 2. Figure 4As shown, a cable processing equipment state prediction system based on data feedback is implemented based on the above-mentioned cable processing equipment state prediction method based on data feedback, and specifically includes a data acquisition module, a skin cutting abnormality analysis module, a core damage abnormality analysis module, a state abnormality analysis module and an optimal power prediction module; wherein the data acquisition module is used to obtain the skin cutting data during the cable skin laser cutting process and the core damage data after cutting; the skin cutting abnormality analysis module is used to import the skin cutting data obtained during the cable skin laser cutting process into the skin cutting abnormality analysis model for skin cutting abnormality analysis; the core damage abnormality analysis module is used to import the obtained core damage data after cutting into the core damage abnormality judgment model for core damage abnormality analysis; the state abnormality analysis module is used to perform power state abnormality analysis of the processing equipment through the skin cutting abnormality analysis results and the core damage abnormality analysis results obtained by analysis; the optimal power prediction module is used to import the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power state into the power analysis strategy for optimal power prediction for cutting; A control module may also be included, and the control module is used to control the operation of the data acquisition module, the skin cutting abnormality analysis module, the wire core damage abnormality analysis module, the state abnormality analysis module and the optimal power prediction module.

[0020] The system can execute the method in any of the aforementioned embodiments and can obtain the same or similar technical effects, which will not be described in detail here.

[0021] Embodiment 3. This embodiment provides an electronic device, which, at the hardware level, includes a processor, and optionally also includes an internal bus, a network interface, and a memory. The memory may include a memory, such as a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage, etc. Of course, the electronic device may also include hardware required for other services.

[0022] The processor, network interface and memory can be interconnected through an internal bus, which can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc.

[0023] The electronic device may have relatively large differences due to different configurations or performances, and may include one or more processors and one or more memories, wherein the memory stores at least one computer program, and the computer program is loaded and executed by the processor to implement the cable processing equipment state prediction method based on data feedback provided by the above method embodiment. The electronic device may also include other components for realizing the functions of the device, for example, the electronic device may also have components such as a wired or wireless network interface and an input and output interface to input and output data. This embodiment will not be described in detail here.

[0024] Embodiment 4. This embodiment provides a computer-readable storage medium having a rewritable computer program stored thereon; When the computer program runs on a computer device, the computer device executes the above-mentioned method for predicting the state of a cable processing device based on data feedback.

[0025] For example, the computer readable storage medium can be a read-only memory, a random access memory, a read-only CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0026] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented by software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When a computer instruction or computer program is loaded or executed on a computer, a process or function according to an embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network or other programmable device. Computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, computer instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center through a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.

[0027] The terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus.

[0028] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of application involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned application concept. For example, the above features are replaced with (but not limited to) technical features with similar functions applied in the present application.

Claims

1. A method for predicting the state of cable processing equipment based on data feedback, characterized in that: It includes the following specific steps: S1. Obtaining the cable skin cutting data during the cable skin laser cutting process and the wire core damage data after cutting; S2, importing the obtained cable skin cutting data during the laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis; S3, importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model to perform wire core damage abnormality analysis; S4. Perform power status abnormality analysis of the processing equipment by analyzing the obtained skin cutting abnormality analysis results and the wire core damage abnormality analysis results; S5. Import the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status into the power analysis strategy to predict the optimal cutting power.

2. The method for predicting the state of a cable processing equipment based on data feedback according to claim 1, characterized in that: The specific contents of obtaining the skin cutting data and the wire core damage data after cutting during the cable skin laser cutting process are as follows: S11, placing the cable at the output end of the laser cutter to cut the cable skin, the laser cutter outputs a laser with a set power to cut the cable skin, and obtains the skin cutting depth and cutting surface image data after the laser cutter cuts, and stores them in the first storage component; S12. At the same time, the image data of the wire core damage after cutting is collected through the image collection terminal and stored in the second storage component.

3. The method for predicting the state of cable processing equipment based on data feedback according to claim 1, characterized in that: The step of importing the obtained cable skin cutting data during the laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis includes the following specific steps: S21, obtaining image data of the corresponding cutting surface during the cutting process, taking the cutting surface as a reference plane, obtaining the position and area data of the pits and abnormal raised surfaces on the cutting surface, and simultaneously obtaining the pixel value data of each pixel point on the cutting surface, and dividing the cutting surface into a plurality of thickness regions along the direction of the epidermis thickness; S22, obtaining the position and area data of the abnormal surface of the surface corresponding to each thickness region, and simultaneously obtaining the pixel value data of each pixel point on the surface of each thickness region, and importing them into the cutting surface abnormal value calculation formula to calculate the cutting surface abnormal value, wherein the cutting surface abnormal value calculation formula of the i-th thickness region is: , where Hi is the cutting surface abnormal value of the i-th thickness area, a is the surface flatness ratio, mi is the number of abnormal surfaces on the surface of the i-th thickness area, s is the cutting surface area, pj is the cutting surface thickness, and sj is the j-th abnormal surface area data. is the average distance between abnormal surfaces in the ith thickness region, ni is the number of pixels in the ith thickness region, xic is the pixel value of the cth pixel in the ith thickness region, and xim is the average pixel value of the epidermis; S23, obtaining the calculated cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area, and substituting the cutting surface abnormality values ​​of each thickness area and the average depth of each thickness area into the epidermis abnormal cutting value calculation formula to calculate the epidermis abnormal cutting value, wherein the epidermis abnormal cutting value calculation formula is: , where N is the number of thickness regions, ki is the average depth of the ith thickness region, and K is the epidermal thickness; S24, obtaining average depth data of the epidermal cut surface, and dividing the average cutting depth by the epidermal thickness to obtain a complete cutting value.

4. The method for predicting the state of a cable processing equipment based on data feedback according to claim 3, characterized in that: The step of importing the obtained wire core damage data after cutting into the wire core damage abnormality judgment model to perform wire core damage abnormality analysis includes the following specific steps: S31, obtaining wire core damage image data corresponding to the cutting position, and obtaining damage depth data of each point corresponding to the cutting position of the wire core; S32, importing the acquired damage depth data of each point corresponding to the cutting position of the wire core into the wire core damage abnormal value calculation formula to calculate the wire core damage abnormal value, wherein the wire core damage abnormal value calculation formula is: , where Xm is the core damage width, tz is the shortest distance from the z-th damage point on the core to the cutting position on the straight line, Lz is the depth of the z-th damage point on the core, Lm is the damage depth safety value, dz is the integral of the original contour of the damage position, and Mz is the cross-sectional area of ​​the fiber core; S33. Obtain the calculated abnormal value of the wire core damage.

5. The method for predicting the state of a cable processing equipment based on data feedback according to claim 4, characterized in that: The acquisition of the skin cutting abnormality analysis results and the wire core damage abnormality analysis results obtained by analysis to perform abnormality analysis on the power state of the processing equipment includes the following specific contents: The calculated skin cutting abnormality value is compared with the set skin cutting abnormality threshold, and the calculated wire core damage abnormality value is compared with the set wire core damage abnormality threshold, and the cutting complete value is compared with the set cutting complete threshold. If the calculated skin cutting abnormality value is less than or equal to the set skin cutting abnormality threshold, and the wire core damage abnormality value is less than or equal to the set wire core damage abnormality threshold, and the cutting complete value is greater than or equal to the set cutting complete threshold, then it is judged that the power state of the processing equipment is normal, and S5 is not performed; if the obtained skin cutting abnormality value is greater than the set skin cutting abnormality threshold and / or the wire core damage abnormality value is greater than the set wire core damage abnormality threshold and / or the cutting complete value is less than the set cutting complete threshold, then it is judged that the power state of the processing equipment is abnormal, and S5 is performed.

6. The method for predicting the state of cable processing equipment based on data feedback according to claim 5, characterized in that: The method of importing the skin cutting abnormality analysis results and the wire core damage abnormality analysis results of the processing equipment with abnormal power state into the power analysis strategy to predict the optimal cutting power includes the following specific contents: The calculated abnormal skin cutting value, complete cutting value and abnormal core damage value are imported into the optimal power calculation formula to calculate the optimal power, wherein the optimal power calculation formula is: , where Pm is the set power, w is the complete cutting value, b is the abnormal proportion coefficient, and c is the epidermal abnormal cutting value proportion coefficient.

7. A cable processing equipment state prediction system based on data feedback, which is implemented based on the cable processing equipment state prediction method based on data feedback according to any one of claims 1 to 6, characterized in that: It specifically includes a data acquisition module, a skin cutting abnormality analysis module, a core damage abnormality analysis module, a state abnormality analysis module and an optimal power prediction module; The data acquisition module is used to acquire the cable skin cutting data and the wire core damage data after cutting during the cable skin laser cutting process; The skin cutting abnormality analysis module is used to import the skin cutting data obtained during the cable skin laser cutting process into the skin cutting abnormality analysis model to perform skin cutting abnormality analysis; The wire core damage anomaly analysis module is used to import the obtained wire core damage data after cutting into the wire core damage anomaly judgment model to perform wire core damage anomaly analysis; The state abnormality analysis module is used to perform power state abnormality analysis of the processing equipment by analyzing the obtained surface cutting abnormality analysis results and the wire core damage abnormality analysis results; The optimal power prediction module is used to import the skin cutting abnormality analysis results and the core damage abnormality analysis results of the processing equipment with abnormal power status into the power analysis strategy to predict the optimal cutting power.

8. An electronic device comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor; It is characterized in that the processor executes the cable processing equipment state prediction method based on data feedback as described in any one of claims 1 to 6 by calling the computer program stored in the memory.

9. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer executes the cable processing equipment state prediction method based on data feedback as described in any one of claims 1 to 6.

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