Method for manufacturing electronic component

Abstract

The invention provides a method for manufacturing an electronic component, which can eliminate adhesion of laminated body small pieces which are adhered through an adhesive component. This method for manufacturing an electronic component comprises: a preparation step for preparing a first elastic sheet (20) exhibiting adhesiveness at TA DEG C; a preparation step for preparing a second elastic piece (40); a preparation step for preparing a laminate pellet (13) in which a ceramic layer containing a component A exhibiting adhesiveness at TB DEG C is laminated in the thickness direction; a sandwiching step for sandwiching a plurality of laminated small pieces (13) adjacent to each other in the surface direction from above and below in a direction perpendicular to the surface direction using a first elastic piece (20) and a second elastic piece (40); and a separation step for separating a plurality of adjacent laminated small pieces (13) from each other by pressing the laminated small pieces (13) via at least one of the first elastic piece (20) and the second elastic piece (40) while maintaining the laminated small pieces (13) at a temperature T DEG C at which TA < = T < = TB.

Description

Technical Field

[0001] This invention relates to a method for manufacturing electronic components. Background Technology

[0002] Multilayer ceramic capacitors are generally manufactured through the following processes (a) to (e).

[0003] (a) A process of thinly spreading a slurry containing ceramic powder and an organic binder to form a ceramic green sheet.

[0004] (b) The process of stacking multiple ceramic green sheets together to form a ceramic green sheet stack after printing electrodes on the surface of the ceramic green sheet.

[0005] (c) The process of cutting the ceramic green sheet in both directions to form multiple chip pieces.

[0006] (d) The firing process of firing the laminated small pieces to obtain the small pieces.

[0007] (e) The process of forming an external electrode on the end face of the small piece to obtain a multilayer ceramic capacitor.

[0008] Patent Document 1 discloses a method for manufacturing ceramic chip components, characterized by comprising the following steps: attaching an adhesive tape consisting of an expandable substrate film and an adhesive layer formed on at least one side of the substrate film to a laminate of ceramic green chips; fixing the laminate of ceramic green chips to a base via the adhesive tape; cutting the laminate of ceramic green chips fixed to the base with a guillotine to form a plurality of green chips; and expanding the substrate film of the adhesive tape to increase the spacing between adjacent green chips.

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 1: Japanese Patent Application Publication No. 2008-49512 Summary of the Invention

[0012] The problem the invention aims to solve

[0013] In step (c) above, adhesive tape is generally used to temporarily fix the ceramic green sheet laminate to the sheet fixing base. After the laminate is cut with a guillotine, the laminate pieces are removed from the adhesive tape. The cutting with the guillotine is usually performed in a heated atmosphere. Therefore, there is a problem that the warm laminate pieces may bond together with each other through adhesive components such as organic adhesives.

[0014] Blocking, caused by the bonding of small laminated ceramic capacitors with adhesive components, is a major reason for reduced yield in the manufacturing of multilayer ceramic capacitors. In recent years, the demand for smaller multilayer ceramic capacitors has exacerbated this problem. Therefore, a more reliable method to eliminate blocking is desired in the manufacture of electronic components such as multilayer ceramic capacitors.

[0015] The present invention addresses the above-mentioned problems and aims to provide a method for manufacturing electronic components that can eliminate the adhesion of laminated pieces bonded by adhesive components.

[0016] means for solving problems

[0017] The method for manufacturing an electronic component of the present invention includes: a preparation step of preparing a first elastic sheet that exhibits adhesiveness at TA℃; a preparation step of preparing a second elastic sheet; a preparation step of preparing a laminated piece having a ceramic layer containing a component A that exhibits adhesiveness at TB℃ stacked in the thickness direction; a clamping step of clamping a plurality of the laminated pieces adjacent in the surface direction from above and below in a direction perpendicular to the surface direction using the first elastic sheet and the second elastic sheet; and a separation step of separating the plurality of the laminated pieces by pressing the laminated pieces with at least one of the first elastic sheet or the second elastic sheet while maintaining the laminated pieces at a temperature T℃ where TA≤T≤TB.

[0018] Invention Effects

[0019] According to the present invention, a method for manufacturing electronic components is provided that can eliminate the adhesion of laminated pieces bonded by adhesive components. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view showing an example of a mother block.

[0021] Figure 2 It is a schematic cross-sectional view showing the state in which the mother block held on the first elastic sheet is cut off.

[0022] Figure 3 This is a schematic cross-sectional view showing the state in which a small piece of laminated body is sandwiched between a first elastic sheet and a second elastic sheet.

[0023] Figure 4 This is a schematic cross-sectional view showing how a small piece of laminated material, sandwiched between a first elastic sheet and a second elastic sheet, moves toward a break stage.

[0024] Figure 5 This is a schematic cross-sectional view illustrating an example of a separation process.

[0025] Explanation of reference numerals in the attached figures

[0026] 10: Master block;

[0027] 11: Ceramic layer;

[0028] 12: Internal electrodes;

[0029] 13: Small pieces of laminated material;

[0030] 20: First elastic sheet;

[0031] 30: Cutting table;

[0032] 40: Second elastic sheet;

[0033] 50: Disassembly platform;

[0034] 60: Roller;

[0035] CB: Cutting knife;

[0036] CL: Cutting wire;

[0037] VD: The up-down direction of the cutter;

[0038] HD: Horizontal direction. Detailed Implementation

[0039] The manufacturing method of the electronic component of the present invention will now be described. Furthermore, the present invention is not limited to the structures described below, and appropriate modifications may be made without departing from the spirit of the invention. In addition, structures obtained by combining multiple preferred structures described below are also part of the present invention. Hereinafter, the manufacturing method of the electronic component of the present invention will sometimes be described as the manufacturing method of the present invention.

[0040] As one embodiment of the manufacturing method of the electronic component of the present invention, a multilayer ceramic capacitor will be used as an example for explanation. Furthermore, the present invention can also be applied to multilayer ceramic electronic components other than multilayer ceramic capacitors. Examples of such multilayer ceramic electronic components include inductors, piezoelectric elements, and thermistors.

[0041] The method for manufacturing the electronic component of the present invention is characterized in that a stacked sheet is sandwiched between a first elastic sheet and a second elastic sheet, and the stacked sheet is separated from each other by pressing the stacked sheet with at least one of the first elastic sheet or the second elastic sheet while maintaining a given temperature T °C. Here, the first elastic sheet exhibits adhesiveness at TA °C, and the ceramic layer constituting the stacked sheet contains a component A that exhibits adhesiveness at TB °C, where TA ≤ T ≤ TB.

[0042] First, the preparation process for the first elastic sheet will be explained.

[0043] The first elastic sheet has a layer of temperature-sensitive adhesive that exhibits adhesion when warm and loses adhesion when cool. The temperature (TA°C) at which the first elastic sheet exhibits adhesion is not particularly limited, but in the manufacturing method of the present invention, it is preferably 30°C or higher. More preferably, it is 40°C or higher and 120°C or lower. TA°C is preferably, for example, less than 65°C. The first elastic sheet exhibits adhesion at TA°C or higher, thereby enabling the first elastic sheet to hold the laminated pieces. Furthermore, "temperature (TA°C) at which adhesion is exhibited" refers to a temperature indicating a rapid change in adhesion; even below the temperature (TA°C) at which adhesion is exhibited, the first elastic sheet may still possess some adhesion.

[0044] The temperature at which a temperature-sensitive adhesive exhibits its adhesive properties is the lowest temperature at which a small piece of laminate can be attached to the first elastic sheet.

[0045] Examples of temperature-sensitive adhesives include, for example, side-chain crystalline polymers.

[0046] The construction of the first elastic sheet is not particularly limited, but it is preferable to have a layer of temperature-sensitive adhesive disposed on a substrate. Examples of substrates include polyethylene terephthalate (PET).

[0047] The thickness of the substrate is not particularly limited, but it is preferably 10 μm or more and 200 μm or less.

[0048] The thickness of the temperature-sensitive adhesive layer is not particularly limited, but it is preferably 5 μm or more and 40 μm or less.

[0049] Regarding the first elastic sheet, it can be any size larger than the smaller piece of the laminate to be separated, and there are no particular restrictions on its planar shape.

[0050] Next, the preparation process for the second elastic sheet will be explained.

[0051] The second elastic sheet may or may not have adhesive force.

[0052] The thickness of the second elastic sheet is not particularly limited, but it is preferably 30 μm or more and 10,000 μm or less.

[0053] Regarding the second elastic sheet, it can be any size larger than the smaller piece of the laminate to be separated, and there are no particular restrictions on its planar shape.

[0054] The hardness of the second elastic sheet is preferably 20° or higher and 70° or lower. Here, "hardness" refers to the hardness measured using a Type A hardness tester according to JIS K 6253.

[0055] There are no particular restrictions on the raw materials used to form the second elastic sheet.

[0056] Next, the preparation process for preparing the laminated small pieces will be explained.

[0057] The laminated sheet has ceramic layers containing component A, which exhibits adhesion at TB℃, stacked in the thickness direction. The laminated sheet is produced by cutting a parent block, which is an assembly of multiple laminated sheets, into individual sheets.

[0058] The following is for reference Figure 1 The construction of the parent block is explained. Figure 1 This is a schematic cross-sectional view showing an example of a mother block.

[0059] like Figure 1 As shown, the mother block 10 is composed of multiple stacked ceramic layers 11, with layered internal electrodes 12 embedded within them. The ceramic layers 11 can be formed by stacking dielectric sheets containing ceramic powder such as barium titanate and component A, which exhibits adhesion at TB℃. Metal paste, serving as the internal electrodes 12, is printed in a given shape on a portion of the dielectric sheets. The internal electrodes 12 are spaced apart by a certain margin, with a minimum distance of 10 μm.

[0060] Component A, which exhibits adhesive properties at TB℃, can be exemplified by organic binders. Organic binders are used to adjust the dispersibility of ceramic powders, etc. Examples of organic binders include acrylic resins and polyvinyl butyral.

[0061] The organic adhesive exhibits adhesive properties when heated to a constant temperature. The temperature (TB°C) at which component A exhibits adhesive properties is preferably 50°C or higher. More preferably, it is 60°C or higher and 120°C or lower. In the manufacturing method of the present invention, the temperature (TB°C) at which component A exhibits adhesive properties is greater than the temperature (TA°C) at which the first elastic sheet exhibits adhesive properties. Preferably, the difference between TA and TB is 20°C or higher. For example, the difference between TA and TB is 70°C or lower.

[0062] The temperature at which component A exhibits adhesive properties is the lowest temperature at which the laminated pieces bond together through component A.

[0063] Dielectric sheets are obtained by mixing ceramic powders such as barium titanate with components A such as organic binders, plasticizers and organic solvents using a ball mill or similar equipment to obtain a slurry, coating the obtained slurry onto the surface of a resin film and then drying it.

[0064] There are no particular restrictions on the coating method of the slurry, but gravure coating, bar coating, spray coating, spin coating, air knife coating, roller coating, scraper coating, door roller coating, and mold coating can be used.

[0065] The thickness of the dielectric sheet can be, for example, 0.5 μm or more and 3.0 μm or less, and dielectric sheets of various thicknesses can be used.

[0066] After the dielectric sheet is peeled from the resin film, it is typically stacked in groups of 5 to 2000 layers to create a master block. The thickness of the internal electrodes can be set to, for example, 0.2 μm or more and 5 μm or less. In addition, unprinted dielectric sheets, called outer layers, are used on the top and bottom surfaces of the master block.

[0067] In the manufacturing method of the present invention, it is preferable that the laminated piece is obtained by cutting off the mother block held on the first elastic sheet from the side opposite to the first elastic sheet using a cutter. This is because by cutting off the mother block held on the first elastic sheet, the laminated piece can be obtained in an adjacent state on the first elastic sheet in a plane direction orthogonal to the thickness direction of the ceramic layer, thereby allowing direct progress to the clamping process.

[0068] The following is for reference Figure 2 The operation of cutting the mother block held on the first elastic sheet with a cutter is explained.

[0069] Figure 2 This is a schematic cross-sectional view showing the state in which the mother block, held on the first elastic plate, is cut off. (See attached image.) Figure 2 As shown, after attaching the first elastic sheet 20 to one main surface of the mother block 10, the first elastic sheet 20 and the mother block 10 are placed on the cutting table 30, with the side of the first elastic sheet 20 facing downwards. The cutting table 30 is heated to a certain temperature, preferably higher than the aforementioned TB℃, for example, above 70℃ and below 120℃. By heating the cutting table 30, component A contained in the ceramic layer 11 softens, making it easier to cut the mother block 10, and the adhesiveness of the first elastic sheet 20 is exhibited, thereby holding the mother block 10 on the first elastic sheet 20.

[0070] There is no particular limitation on the method of fixing the first elastic sheet 20 to the cutting table 30, but the first elastic sheet 20 can be held on the cutting table 30 by providing an attraction hole (not shown) in the thickness direction of the cutting table 30 and attracting the first elastic sheet 20 from the lower surface side of the cutting table 30 through the attraction hole.

[0071] Next, the cutter CB is moved in the vertical direction VD so that it penetrates the mother block 10 from the side opposite to the first elastic sheet 20. The vertical direction VD is parallel to the thickness direction mentioned above. The end edge of the mother block 10 is cut off, the exposed internal electrode 12 and the position of the cutting wire CL are confirmed, and the mother block 10 is cut off. After cutting, the position of the cutter CB or the cutting table 30 is offset by one laminate piece in the horizontal direction HD, and the cutting of the mother block 10 is further continued. The horizontal direction HD is parallel to the surface direction mentioned above. The above actions are repeated to cut from one end of the mother block 10 to the other. Then, the cutting table 30 is rotated 90° in the horizontal direction HD to change the orientation of the mother block 10, and cutting is performed in the same way, thereby enabling the mother block 10 to be monolithically processed to produce laminate pieces.

[0072] The cutter CB can be made of the same type of guillotine commonly used for cutting mother blocks. The cutter CB preferably has a blade tip thickness of 0.03 mm or more and 0.08 mm or less.

[0073] by Figure 2 The laminated pieces obtained after the steps shown are monolithized are held by the first elastic sheet, so even if they are cut with a cutter, there is no positional shift or scattering, which is therefore preferred.

[0074] Next, the following clamping process is performed: using the first elastic sheet and the second elastic sheet, multiple stacked small pieces adjacent to each other in the aforementioned surface direction are clamped from above and below in a direction perpendicular to the surface direction.

[0075] The procedure for sandwiching the laminated pieces using the first and second elastic sheets is not particularly limited. Figure 2 The steps shown, after being monolithized, result in multiple laminated pieces that can be placed adjacent to each other on the first elastic sheet in a plane direction orthogonal to the thickness direction of the ceramic layer. Therefore, in the case of... Figure 2 After the steps shown are used to fabricate the laminated pieces, it is preferable to adhere the second elastic sheet to the other main surface of the laminated piece on the first elastic sheet. Preferably, the laminated pieces are placed adjacent to each other on the first elastic sheet in a plane direction orthogonal to the thickness direction of the ceramic layer, but it is also possible that the cut surface of the laminated pieces is in contact with both the first and second elastic sheets.

[0076] Figure 3 This is a schematic cross-sectional view showing the state in which a small piece of the laminate is sandwiched between a first elastic sheet and a second elastic sheet. (See attached image.) Figure 3 As shown, the clamping process can be performed by bonding the second elastic sheet 40 to the upper surface of the laminated piece 13 on the first elastic sheet 20.

[0077] Alternatively, the clamping process can be performed by placing the laminated piece 13 on the second elastic sheet 40 and bonding the first elastic sheet 20 to the upper surface of the laminated piece 13.

[0078] Next, a separation process is performed whereby the laminated pieces are held at a temperature T℃ where TA≤T≤TB, and pressed by at least one of the first or second elastic sheets, thereby separating adjacent laminated pieces from each other. Hereinafter, refer to... Figure 4 as well as Figure 5 Let's explain the separate processes.

[0079] Figure 4 It is a schematic cross-sectional view showing how a small piece of a laminate sandwiched between a first elastic sheet and a second elastic sheet moves toward a disintegration stage. Figure 5 This is a schematic cross-sectional view illustrating an example of a separation process.

[0080] Preferably, such as Figure 4 As shown, before the separation process, the first elastic sheet 20, the second elastic sheet 40, and the laminated piece 13 are moved from the cutting table 30 to the disassembly table 50. At this time, after rotating 180° in the vertical direction VD to make the second elastic sheet 40 face down, the first elastic sheet 20, the second elastic sheet 40, and the laminated piece 13 are placed on the disassembly table 50. Alternatively, the first elastic sheet 20, the second elastic sheet 40, and the laminated piece 13 can be placed on the disassembly table 50 without rotating in the vertical direction VD, making the first elastic sheet 20 face down.

[0081] like Figure 5 As shown, the separation process can be performed by rotating the roller 60 while moving it in the surface direction (horizontal direction HD) of the first elastic sheet 20, and pressing the laminated piece 13 by the first elastic sheet 20. The size of the roller 60 is not particularly limited, but it is preferably 2 mm or more and 100 mm or less in diameter. The pressing force applied by the roller 60 can be set to, for example, 0.1 MPa or more and 1.0 MPa or less. The moving speed of the roller 60 can be set to, for example, 10 mm / s or more and 200 mm / s or less.

[0082] The roller can also reciprocate. Alternatively, after pressing in one direction, the first elastic sheet, the laminated small sheet, and the second elastic sheet can be rotated 90° in the horizontal direction to press in another direction.

[0083] Pressing can also be done by means other than rollers, but it is preferred to use rollers.

[0084] exist Figure 5In this process, the laminated pieces are pressed by the first elastic sheet, but the laminated pieces can also be pressed by the second elastic sheet. In this case, when moving the first elastic sheet, the second elastic sheet, and the laminated pieces from the cutting stage to the disassembly stage, the first elastic sheet can be placed directly on the disassembly stage.

[0085] By pressing the laminated pieces via the first or second elastic sheet, the laminated pieces are pressed downwards, creating gaps between adjacent laminated pieces, and the laminated pieces bonded by component A are separated. At this time, the laminated pieces are maintained at a temperature T℃ where TA ≤ T ≤ TB. This temperature T℃ is above the temperature at which the first elastic sheet exhibits adhesiveness (TA℃), so the laminated pieces are held by the first elastic sheet; however, since it is below the temperature at which component A exhibits adhesiveness (TB℃), the laminated pieces do not adhere to each other. Preferably, in the separation process described above, the laminated pieces are pressed via the first elastic sheet.

[0086] There is no particular limitation on the method for maintaining the laminated pieces at a temperature T℃ during the separation process. For example, the heater can be brought into contact with the second elastic sheet (not shown), and the laminated pieces can be maintained at T℃ by heating with the heater. Alternatively, the separation stage itself can be heated, the separation stage can be heated with a heater or the like, a heater can be embedded in the roller, or a heater can be placed above the laminated pieces in the thickness direction to heat the laminated pieces.

[0087] After separating the laminated pieces in the above-described separation process, the laminated pieces are separated from the second elastic sheet, and the first elastic sheet is cooled, etc., to separate the laminated pieces from the first elastic sheet. Then, the laminated pieces are fired, and a functional paste, such as an external electrode paste, is applied to their end faces to form a functional film like an external electrode. Further firing is then performed to obtain a laminated ceramic capacitor, etc. Alternatively, the external electrode paste can be applied to the end faces of the laminated pieces and fired simultaneously with the laminated pieces.

[0088] The following information is disclosed in this specification.

[0089] <1>

[0090] A method for manufacturing an electronic component, comprising:

[0091] Preparation process for the first elastic sheet to exhibit adhesiveness at TA℃;

[0092] Preparation steps for the second elastic sheet;

[0093] Preparation process for preparing small laminated pieces having a ceramic layer containing component A that exhibits adhesion at temperatures above TB℃ in the thickness direction;

[0094] A clamping process that uses the first elastic sheet and the second elastic sheet to clamp multiple adjacent laminated pieces in the surface direction from above and below in a direction perpendicular to the surface direction; and

[0095] A separation process in which adjacent multiple laminated pieces are separated from each other by pressing the laminated pieces with at least one of the first elastic sheet or the second elastic sheet while maintaining the laminated pieces at a temperature T℃ where TA≤T≤TB.

[0096] <2>

[0097] according to <1> The described method for manufacturing electronic components involves pressing using rollers.

[0098] <3>

[0099] according to <1> or <2> The described method for manufacturing electronic components involves bringing a heater into contact with the second elastic sheet, and simultaneously maintaining the laminated sheet at a temperature of T°C using the heater while performing the separation process.

[0100] <4>

[0101] according to <1> ~ <3> The method of manufacturing an electronic component as described in any of the above, wherein a mother block held on the first elastic sheet is cut off from the side opposite to the first elastic sheet by a cutter, thereby monolithizing into a plurality of adjacent laminated pieces.

[0102] <5>

[0103] according to <1> ~ <4> The manufacturing method of the electronic component described in any of the above, wherein, in the above-mentioned separation process, the first elastic sheet is pressed.

[0104] <6>

[0105] according to <1> ~ <5> The manufacturing method of an electronic component described in any of the above, wherein the difference between TA and TB is 20°C or more and 70°C or less.

[0106] <7>

[0107] according to <1> ~ <6> The manufacturing method of the electronic component described in any of the above, wherein TA is above 40°C and below 120°C.

[0108] Example

[0109] The following describes embodiments of a method for manufacturing an electronic component according to the present invention in more detail. However, the present invention is not limited to these embodiments.

[0110] Example 1

[0111] A slurry is prepared by mixing barium titanate powder, an organic binder (component A) exhibiting adhesion at 65°C, a plasticizer, and an organic solvent. The slurry is coated onto a resin film and dried to obtain a dielectric sheet. 100 dielectric sheets are stacked to obtain a master block. A first elastic sheet (manufactured by Nitta Corporation, 115 μm thick) exhibiting adhesion at 45°C is bonded to one main surface of the master block. The master block and the first elastic sheet are placed on a cutting table with the first elastic sheet side facing downwards. The cutting table is heated to 90°C, and the master block is cut with a 0.03 mm thick cutter to obtain a 0.6 mm × 0.3 mm (0603 size) laminated sheet.

[0112] Next, on the other main surface of the mother block, which has been monolithically divided into laminated pieces, a second elastic sheet with a hardness of 20° and a thickness of 2000 μm is bonded. While the mother block is sandwiched between the first and second elastic sheets, it is flipped over, and the mother block is moved from the cutting table to the disassembly table. At this point, the first elastic sheet, the mother block, and the second elastic sheet are placed on the disassembly table, with the side of the second elastic sheet facing downwards.

[0113] The decomposition table is heated to the temperature listed in Table 1, and a roller with a diameter of 6 mm is pressed from above the first elastic sheet at a pressure of 0.5 MPa and a speed of 100 mm / s to separate the laminated pieces.

[0114] Example 2

[0115] Except for changing the organic adhesive to an organic adhesive that exhibits adhesion at 50°C and changing the first elastic sheet to an elastic sheet that exhibits adhesion at 30°C, the master block was made in the same manner as in Example 1, and the individual sheets were separated by pressing rollers.

[0116] The laminated pieces produced by roller pressing in Examples 1 and 2 were evaluated using the following steps.

[0117] (Maintain the effect)

[0118] The ratio of the number of laminated body fragments detached from the first elastic sheet to the total number of laminated body fragments was calculated. Regarding the number of laminated body fragments detached from the first elastic sheet, the number of laminated body fragments remaining on the second elastic sheet when the first elastic sheet was lifted upwards was visually counted. The laminated body fragments remaining on the second elastic sheet were those detached from the first elastic sheet. Evaluation was performed according to the following criteria. The results are shown in Tables 1 and 2.

[0119] ○(Good)...The percentage of small pieces of laminated material detached from the first elastic sheet is less than 0.1%.

[0120] △(May)...More than 0.1% and less than 10% of the laminated pieces detached from the first elastic sheet.

[0121] × (Not allowed)...More than 10% of the laminated pieces detached from the first elastic sheet.

[0122] (Unlocked effect)

[0123] The ratio of the number of laminated pieces bonded to each other to the total number of laminated pieces was calculated. Regarding the number of bonded laminated pieces, all laminated pieces were removed from the first and second elastic sheets and placed on a nylon mesh sieve; the number of laminated pieces remaining on the sieve was counted. All laminated pieces remaining on the sieve were laminated pieces bonded to each other. Evaluation was performed according to the following criteria. The results are shown in Tables 1 and 2.

[0124] ○(Good)...The proportion of small laminated pieces bonded together is less than 0.1%.

[0125] △(Optional)...The proportion of small pieces of the laminate that are bonded to each other is greater than 0.1% and less than 10%.

[0126] × (Not allowed)... The proportion of small pieces of the laminated body that are bonded to each other is greater than 10%.

[0127] Table 1

[0128]

[0129] Table 2

[0130]

[0131] As shown in Table 1, in Example 1, which used a first elastic sheet exhibiting adhesive strength at 45°C and an organic adhesive exhibiting tack at 65°C, no adhesion occurred between the laminated pieces when the temperature of the laminated pieces was above 45°C and below 65°C, and most of the laminated pieces did not detach from the first elastic sheet. In particular, when the temperature of the laminated pieces was above 50°C and below 60°C, no adhesion occurred between the laminated pieces, and the laminated pieces did not detach from the first elastic sheet.

[0132] As shown in Table 2, in Example 2, which used a first elastic sheet exhibiting adhesive strength at 30°C and an organic adhesive exhibiting tack at 50°C, no adhesion occurred between the laminated pieces when the temperature of the laminated pieces was above 30°C and below 50°C, and most of the laminated pieces did not detach from the first elastic sheet. In particular, at a temperature of 45°C, no adhesion occurred between the laminated pieces, and the laminated pieces did not detach from the first elastic sheet.

Claims

1. A method for manufacturing an electronic component, comprising: a step of preparing a first elastic sheet exhibiting adhesiveness at TA°C; A preparation step of preparing a second elastic sheet; A step of preparing a small laminated body sheet in which a ceramic layer including a component A showing adhesiveness at TB° C. is laminated in a thickness direction; A clamping step of clamping a plurality of the stacked body small pieces adjacent to each other in the plane direction from top to bottom in a direction perpendicular to the plane direction using the first elastic sheet and the second elastic sheet; as well as A separating step is a step of separating a plurality of adjacent small laminate pieces from each other by pressing the small laminate pieces via at least one of the first elastic sheet or the second elastic sheet while the small laminate pieces are maintained at a temperature T° C. satisfying TA≤T≤TB.

2. The method for manufacturing an electronic component according to claim 1, wherein: The pressing is performed using a roller.

3. The method for manufacturing an electronic component according to claim 1 or 2, wherein: The separation step is performed while a heater is brought into contact with the second elastic sheet and the temperature of the small laminated body pieces is maintained at T° C. by the heater.

4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein: The mother block held on the first elastic sheet is cut with a cutter from the side opposite to the first elastic sheet to separate into the plurality of adjacent small laminated body pieces.

5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein: In the separating step, the first elastic piece is pressed.

6. The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein: The difference between TA and TB is 20° C. or more and 70° C. or less.

7. The method for manufacturing an electronic component according to any one of claims 1 to 6, wherein: TA is 40°C or higher and 120°C or lower.

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