Chip precision positioning system and method

Abstract

The invention relates to the technical field of electronic components, in particular to a chip precision positioning system and method.The chip precision positioning system comprises a shooting module, a positioning module, a transmission module and an import module, the positioning module comprises an analysis unit, a calibration unit, a calculation unit and a positioning unit, and the analysis unit analyzes and recognizes shooting data based on the image recognition technology; an end sealing plate layout is obtained; the calibration unit divides the layout of the end sealing plates and calibrates the plate hole positions of the end sealing plates to obtain calibration coordinates; the calculation unit calculates a transverse difference value between the calibration coordinate and the position of the import module to obtain a coordinate difference; the positioning unit adjusts the position of the end sealing plate based on the coordinate difference and completes feeding positioning of the end sealing plate, the positioning system obtains the layout of the end sealing plate through photographing analysis, the coordinate position of a plate hole of the end sealing plate is calibrated, the difference between the coordinate position and the position of the guiding-in module is obtained, displacement needing to be adjusted by the end sealing plate each time is obtained, and the position of the end sealing plate is automatically adjusted through the positioning module. And automatic positioning of end sealing plate feeding is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a chip precision positioning system and method. Background Art

[0002] Flip-chip multilayer ceramic capacitors are a type of specially designed multilayer ceramic capacitors with specifications including 0204, 0306, 0508, 0612, etc. The difference from conventional multilayer ceramic capacitors is that the length and width of the capacitor chip are reversed. For example, the flip-chip multilayer ceramic capacitor corresponding to the 0402 specification (0.04 inches long and 0.02 inches wide) of the conventional multilayer ceramic capacitor is the 0204 specification (0.02 inches long and 0.04 inches wide). Flip-chip multilayer ceramic capacitors have a significantly reduced aspect ratio compared to conventional products, thus greatly reducing the equivalent series inductance, and are particularly suitable for high-speed decoupling applications in electronic equipment.

[0003] However, when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the end plate, the chip positioning orientation error is easy to occur, so that the terminal electrodes are mistakenly formed on the two opposite short sides of the chip, making the end sealing efficiency of the flip-chip multilayer ceramic capacitor chip low. Therefore, a chip positioning precision positioning system and method are urgently needed to solve the above problem. Summary of the invention

[0004] The object of the present invention is to provide a chip precision positioning system and method, aiming to solve the problem of low chip termination efficiency of flip-chip multilayer ceramic capacitors.

[0005] To achieve the above-mentioned purpose, in a first aspect, the present invention provides a chip precision positioning system, comprising a shooting module, a positioning module, a transmission module and an import module, wherein the shooting module, the positioning module and the import module are respectively connected to the transmission module, and the positioning module comprises an analysis unit, a calibration unit, a calculation unit and a positioning unit, wherein the analysis unit, the calibration unit, the calculation unit and the positioning unit are connected in sequence;

[0006] The shooting module is used to shoot the end-capping plate image to obtain shooting data;

[0007] The import module is used to import the chip into the positioned end-capping plate;

[0008] The transmission module is used to transport the end-sealing plates to realize automatic loading of the end-sealing plates;

[0009] The analysis unit analyzes and identifies the photographed data based on image recognition technology to obtain the end capping plate layout;

[0010] The calibration unit is used to divide the end plate layout and calibrate the end plate hole positions to obtain calibration coordinates;

[0011] The calculation unit is used to calculate the lateral difference between the calibration coordinate and the position of the import module to obtain the coordinate difference;

[0012] The positioning unit adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

[0013] Wherein, the shooting module includes a shooting unit and an auxiliary unit, and the shooting unit and the auxiliary unit are connected;

[0014] The photographing unit is used to take pictures of the end-capping plates transported by the transmission module to obtain photographing data;

[0015] The auxiliary unit is used to assist the shooting unit in shooting.

[0016] Wherein, the auxiliary unit includes a fill light subunit and a cleaning subunit, and the fill light subunit is connected to the cleaning subunit;

[0017] The fill light sub-unit is used for fill light illumination to assist the shooting unit in shooting;

[0018] The cleaning subunit is used to regularly clean the shooting unit.

[0019] Wherein, the analysis unit includes an identification subunit and a mining subunit, and the identification subunit is connected to the mining subunit;

[0020] The recognition subunit analyzes and recognizes the photographed data based on image recognition technology to obtain recognition information;

[0021] The mining subunit mines the end plate hole positions based on the identification information to obtain the end plate layout.

[0022] Wherein, the calibration unit comprises a region subunit and a calibration subunit, and the region subunit and the calibration subunit are connected;

[0023] The regional subunit is divided into quadrants based on the central position of the end-capping plate layout to obtain divided regions;

[0024] The calibration subunit calibrates the positions of the holes in the end-capping plate based on the divided areas to obtain calibration coordinates.

[0025] Wherein, the positioning unit includes a sensing subunit and an adjusting subunit, and the sensing subunit is connected to the adjusting subunit;

[0026] The sensing sub-unit senses the position of the end-capping plate based on infrared sensing technology to obtain sensing data;

[0027] The regulating subunit adjusts the position of the end sealing plate based on the sensing data and the coordinate difference to complete the positioning of the end sealing plate material.

[0028] In a second aspect, the present invention further provides a chip precision positioning method, comprising the following steps:

[0029] The end-sealing plate is transported by the transmission module for loading, and the photographing module photographs the end-sealing plate to obtain photographing data;

[0030] The analysis unit analyzes and identifies the photographed data based on image recognition technology to obtain the end-capping plate layout;

[0031] The calibration unit divides the end-capping plate layout and calibrates the end-capping plate hole positions to obtain calibration coordinates;

[0032] The calculation unit calculates the lateral difference between the calibration coordinate and the position of the import module to obtain the coordinate difference;

[0033] The positioning unit adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

[0034] A chip precision positioning system of the present invention transports the end-capping plate for loading through the transmission module, and the shooting module takes a picture of the end-capping plate to obtain shooting data; the analysis unit analyzes and identifies the shooting data based on image recognition technology to obtain the layout of the end-capping plate; the calibration unit divides the layout of the end-capping plate, and calibrates the position of the plate holes of the end-capping plate to obtain calibration coordinates; the calculation unit calculates the lateral difference between the calibration coordinates and the position of the import module to obtain the coordinate difference; the positioning unit adjusts the position of the end-capping plate based on the coordinate difference to complete the loading and positioning of the end-capping plate, the positioning system obtains the layout of the end-capping plate through photo analysis, and calibrates the coordinate position of the plate holes of the end-capping plate, and calculates the difference with the position of the import module to obtain the displacement required for each adjustment of the end-capping plate, and automatically adjusts the position of the end-capping plate through the positioning module to realize automatic positioning of the end-capping plate loading, thereby avoiding the problem of chip positioning orientation error when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the end-capping plate, and solving the problem of low end-capping efficiency of the chip of the flip-chip multilayer ceramic capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a schematic diagram of a chip precision positioning system provided by the present invention.

[0037] Figure 2 It is a schematic diagram of a shooting module of a chip precision positioning system provided by the present invention.

[0038] Figure 3 It is a schematic diagram of a positioning module of a chip precision positioning system provided by the present invention.

[0039] Figure 4 The present invention provides a flow chart of a chip precision positioning method.

[0040] In the figure: 1-shooting module, 2-positioning module, 3-transmission module, 4-import module, 5-analysis unit, 6-calibration unit, 7-computing unit, 8-positioning unit, 9-shooting unit, 10-auxiliary unit, 11-fill light subunit, 12-cleaning subunit, 13-identification subunit, 14-mining subunit, 15-region subunit, 16-calibration subunit, 17-sensing subunit, 18-adjustment subunit, 19-computing subunit, 20-heat dissipation subunit. DETAILED DESCRIPTION

[0041] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0042] See also Figures 1 to 3 In a first aspect, the present invention provides a chip precision positioning system, comprising a shooting module 1, a positioning module 2, a transmission module 3 and an import module 4, wherein the shooting module 1, the positioning module 2 and the import module 4 are respectively connected to the transmission module 3, the positioning module 2 comprises an analysis unit 5, a calibration unit 6, a calculation unit 7 and a positioning unit 8, and the analysis unit 5, the calibration unit 6, the calculation unit 7 and the positioning unit 8 are connected in sequence;

[0043] The shooting module 1 is used to shoot the end-capping plate image to obtain shooting data;

[0044] The import module 4 is used to import the chip into the positioned end-capping plate;

[0045] The transmission module 3 is used to transport the end-sealing plates to realize automatic loading of the end-sealing plates;

[0046] The analysis unit 5 analyzes and identifies the photographed data based on image recognition technology to obtain the end capping plate layout;

[0047] The calibration unit 6 is used to divide the end plate layout and calibrate the end plate hole positions to obtain calibration coordinates;

[0048] The calculation unit 7 is used to calculate the lateral difference between the calibration coordinate and the position of the import module 4 to obtain the coordinate difference;

[0049] The positioning unit 8 adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

[0050] In this embodiment, the end-capping plate is transported by the transmission module 3 for loading, and the shooting module 1 takes pictures of the end-capping plate to obtain shooting data; the analysis unit 5 analyzes and identifies the shooting data based on image recognition technology to obtain the layout of the end-capping plate; the calibration unit 6 divides the layout of the end-capping plate, and calibrates the position of the end-capping plate holes to obtain calibration coordinates; the calculation unit 7 calculates the lateral difference between the calibration coordinates and the position of the import module 4 to obtain the coordinate difference; the positioning unit 8 adjusts the position of the end-capping plate based on the coordinate difference to complete the loading and positioning of the end-capping plate. The positioning system obtains the layout of the end-capping plate through photo analysis, and calibrates the coordinate position of the end-capping plate holes, and calculates the difference with the position of the import module 4 to obtain the displacement required for each adjustment of the end-capping plate, and automatically adjusts the position of the end-capping plate through the positioning module 2 to realize automatic positioning of the end-capping plate loading, thereby avoiding the problem of chip positioning orientation error when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the end-capping plate, and solving the problem of low end-capping efficiency of the chip of the flip-chip multilayer ceramic capacitor.

[0051] Further, the shooting module 1 includes a shooting unit 9 and an auxiliary unit 10, and the shooting unit 9 is connected to the auxiliary unit 10; the auxiliary unit 10 includes a fill light subunit 11 and a cleaning subunit 12, and the fill light subunit 11 is connected to the cleaning subunit 12;

[0052] The photographing unit 9 is used to photograph the end-capping plate transported by the transport module 3 to obtain photographing data;

[0053] The auxiliary unit 10 is used to assist the shooting unit 9 in shooting;

[0054] The fill light sub-unit 11 is used for fill light illumination to assist the shooting unit 9 in shooting;

[0055] The cleaning subunit 12 is used to regularly clean the photographing unit 9 .

[0056] In this embodiment, the shooting unit 9 is used to shoot the picture of the end sealing plate transported by the transmission module 3 to obtain shooting data. The fill light subunit 11 of the auxiliary unit 10 is used for fill light illumination to assist the shooting unit 9 in shooting to avoid unclear shooting of the shooting unit 9 due to dim light, which affects the accuracy of analysis and identification by the analysis unit 5. The cleaning subunit 12 is used to regularly clean the shooting unit 9 to avoid unclear shooting due to long-term use of the shooting unit 9.

[0057] Further, the analysis unit 5 includes an identification subunit 13 and a mining subunit 14, and the identification subunit 13 is connected to the mining subunit 14; the calibration unit 6 includes an area subunit 15 and a calibration subunit 16, and the area subunit 15 is connected to the calibration subunit 16; the positioning unit 8 includes a sensing subunit 17 and an adjustment subunit 18, and the sensing subunit 17 is connected to the adjustment subunit 18;

[0058] The identification subunit 13 analyzes and identifies the photographed data based on image recognition technology to obtain identification information;

[0059] The mining subunit 14 mines the hole positions of the end capping plates based on the identification information to obtain the layout of the end capping plates;

[0060] The regional subunit 15 divides the quadrants based on the center position of the end-capping plate layout to obtain divided regions;

[0061] The calibration subunit 16 calibrates the positions of the holes of the end-capping plate based on the divided areas to obtain calibration coordinates;

[0062] The sensing subunit 17 senses the position of the end-capping plate based on infrared sensing technology to obtain sensing data;

[0063] The regulating subunit 18 adjusts the position of the end sealing plate based on the sensing data and the coordinate difference to complete the positioning of the end sealing plate material.

[0064] In this embodiment, the identification subunit 13 analyzes and identifies the captured data according to the image recognition technology to obtain identification information; the mining subunit 14 mines the end plate hole positions according to the identification information to obtain the end plate layout; the area subunit 15 then divides the end plate layout into quadrants based on the center position to obtain the divided areas, and finally the calibration subunit 16 calibrates the end plate hole positions based on the divided areas to obtain calibration coordinates, the sensing subunit 17 senses the position of the end plate through infrared sensing technology to obtain sensing data, and the adjustment subunit 18 adjusts the end plate position according to the sensing data and the coordinate difference to complete the positioning of the end plate material.

[0065] Further, the computing unit 7 includes a computing subunit 19 and a heat dissipation subunit 20, and the computing subunit 19 and the heat dissipation subunit 20 are connected;

[0066] The calculation subunit 19 is used to calculate the lateral difference between the calibration coordinate and the position of the import module 4 to obtain the coordinate difference;

[0067] The heat dissipation subunit 20 is used to detect the temperature of the computing subunit 19 in real time and provide heat dissipation protection for the computing subunit 19 .

[0068] In this embodiment, the computing subunit 19 calculates the lateral difference between the calibration coordinates and the position of the import module 4 to obtain the coordinate difference; the heat dissipation subunit 20 detects the temperature of the computing subunit 19 in real time and performs heat dissipation protection on the computing subunit 19 to prevent the computing subunit 19 from operating for a long time and causing the temperature of the internal electrical components of the computing subunit 19 to be too high, thereby accelerating their aging speed.

[0069] See also Figure 4 In a second aspect, the present invention further provides a chip precision positioning method, comprising the following steps:

[0070] S1 transports the end-sealing plate through the transmission module 3 for loading, and the shooting module 1 shoots the end-sealing plate to obtain shooting data;

[0071] Specifically, the photographing unit 9 photographs the end-capping plate transported by the transmission module 3 to obtain photographing data, and the fill light subunit 11 of the auxiliary unit 10 is used for fill light illumination to assist the photographing unit 9 in photographing.

[0072] S2 The analysis unit 5 analyzes and identifies the photographed data based on image recognition technology to obtain the end capping plate layout;

[0073] Specifically, the identification subunit 13 analyzes and identifies the photographed data according to the image recognition technology to obtain identification information; the mining subunit 14 mines the hole positions of the end capping plate according to the identification information to obtain the layout of the end capping plate.

[0074] S3: the calibration unit 6 divides the end plate layout and calibrates the end plate hole positions to obtain calibration coordinates;

[0075] Specifically, the area subunit 15 divides the end plate layout into quadrants based on the center position to obtain divided areas, and finally the calibration subunit 16 calibrates the end plate hole positions based on the divided areas to obtain calibration coordinates.

[0076] S4: the calculation unit 7 calculates the lateral difference between the calibration coordinate and the position of the import module 4 to obtain the coordinate difference;

[0077] S5: The positioning unit 8 adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

[0078] Specifically, the sensing subunit 17 senses the position of the end sealing plate through infrared sensing technology to obtain sensing data, and the adjusting subunit 18 then adjusts the position of the end sealing plate according to the sensing data and the coordinate difference to complete the positioning of the end sealing plate material.

[0079] The above disclosure is only a preferred embodiment of a chip precision positioning system and method of the present invention. Of course, it cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention are still within the scope of the invention.

Claims

1. A chip precision positioning system, characterized in that: It includes a shooting module, a positioning module, a transmission module and an importing module, wherein the shooting module, the positioning module and the importing module are respectively connected to the transmission module, and the positioning module includes an analyzing unit, a calibration unit, a calculating unit and a positioning unit, wherein the analyzing unit, the calibration unit, the calculating unit and the positioning unit are connected in sequence; The shooting module is used to shoot the end-capping plate image to obtain shooting data; The import module is used to import the chip into the positioned end-capping plate; The transmission module is used to transport the end-sealing plates to realize automatic loading of the end-sealing plates; The analysis unit analyzes and identifies the photographed data based on image recognition technology to obtain the end capping plate layout; The calibration unit is used to divide the end plate layout and calibrate the end plate hole positions to obtain calibration coordinates; The calculation unit is used to calculate the lateral difference between the calibration coordinate and the position of the import module to obtain the coordinate difference; The positioning unit adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

2. A chip precision positioning system as claimed in claim 1, characterized in that: The shooting module includes a shooting unit and an auxiliary unit, and the shooting unit is connected to the auxiliary unit; The photographing unit is used to take pictures of the end-capping plates transported by the transmission module to obtain photographing data; The auxiliary unit is used to assist the shooting unit in shooting.

3. A chip precision positioning system as claimed in claim 2, characterized in that: The auxiliary unit includes a fill light subunit and a cleaning subunit, and the fill light subunit is connected to the cleaning subunit; The fill light sub-unit is used for fill light illumination to assist the shooting unit in shooting; The cleaning subunit is used to regularly clean the shooting unit.

4. A chip precision positioning system as claimed in claim 1, characterized in that: The analysis unit includes an identification subunit and a mining subunit, and the identification subunit is connected to the mining subunit; The recognition subunit analyzes and recognizes the photographed data based on image recognition technology to obtain recognition information; The mining subunit mines the end plate hole positions based on the identification information to obtain the end plate layout.

5. A chip precision positioning system as claimed in claim 1, characterized in that: The calibration unit includes a region subunit and a calibration subunit, and the region subunit is connected to the calibration subunit; The regional subunit is divided into quadrants based on the central position of the end-capping plate layout to obtain divided regions; The calibration subunit calibrates the positions of the holes in the end-capping plate based on the divided areas to obtain calibration coordinates.

6. A chip precision positioning system as claimed in claim 1, characterized in that: The positioning unit includes a sensing subunit and an adjusting subunit, and the sensing subunit is connected to the adjusting subunit; The sensing sub-unit senses the position of the end-capping plate based on infrared sensing technology to obtain sensing data; The regulating subunit adjusts the position of the end sealing plate based on the sensing data and the coordinate difference to complete the positioning of the end sealing plate material.

7. A chip precision positioning method, a chip precision positioning system as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: The end-sealing plate is transported by the transmission module for loading, and the photographing module photographs the end-sealing plate to obtain photographing data; The analysis unit analyzes and identifies the photographed data based on image recognition technology to obtain the end-capping plate layout; The calibration unit divides the end-capping plate layout and calibrates the end-capping plate hole positions to obtain calibration coordinates; The calculation unit calculates the lateral difference between the calibration coordinate and the position of the import module to obtain the coordinate difference; The positioning unit adjusts the position of the end sealing plate based on the coordinate difference to complete the loading positioning of the end sealing plate.

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