Sealing member, fluid supply apparatus, and substrate processing apparatus

Abstract

The invention provides a sealing member, a fluid supply apparatus, and a substrate processing apparatus capable of preventing leakage of fluid even in an ultra-low temperature environment. A sealing member according to an embodiment of the present invention comprises: a sealing sleeve having a ring shape; the upper O-shaped ring is mounted on the upper surface of the sealing sleeve; the lower O-shaped ring is mounted on the lower surface of the sealing sleeve; and a pressing ring which is inserted into the accommodating part of the sealing sleeve and presses the upper surface and the lower surface.

Description

Technical Field

[0001] The invention relates to a sealing component for sealing a connection portion between fluid supply pipes, and a fluid supply device and a substrate processing device comprising the sealing component. Background Art

[0002] The semiconductor manufacturing process is a process for manufacturing semiconductor elements on a substrate (e.g., wafer), and includes, for example, exposure, vapor deposition, etching, ion implantation, cleaning, etc. In order to perform each manufacturing process, a semiconductor manufacturing equipment for performing each process is provided in a clean room of a semiconductor manufacturing plant, and process treatment is performed on the substrates input into the semiconductor manufacturing equipment.

[0003] In the semiconductor manufacturing process, processes using plasma are widely used, such as etching, evaporation, etc. The plasma processing process is performed in a plasma processing space with a substrate placed at the bottom and a voltage applied through a coil located above along with supply of fluid for plasma processing.

[0004] In order to produce multi-level semiconductor products like the current VNAND (Vertical NAND) flash memory, the AspectRatio (AR) is also expanding. In this way, in order to achieve a higher etching rate (Etch Rate), a higher plasma power than before is required in the 300mm wafer full-process plasma etching equipment. However, since the electrostatic chuck (ESC), an essential element of the etching equipment, is subjected to greater thermal damage (Thermal Damage), the cooling heat of the refrigerant used in the previous electrostatic chuck cannot fully offset the heat energy.

[0005] In order to avoid thermal damage to the electrostatic chuck, ultra-low temperature (maximum -100°C) cooling temperature regulation is required. In such an ultra-low temperature environment, the components of the electrostatic chuck may shrink. In particular, fluid leakage may occur in the connection part of the fluid supply pipe that supplies gas to the inside of the electrostatic chuck.

[0006] (Patent Document 1) Japanese Patent Publication No. 2019-176018

[0007] (Patent Document 2) Patent Publication No. 10-2021-0141104

[0008] (Patent Document 3) Patent Publication No. 10-2023-0013937 Summary of the invention

[0009] The present invention provides a sealing component capable of preventing leakage of fluid even in an ultra-low temperature environment, a fluid supply device comprising the sealing component, and a substrate processing device.

[0010] The sealing component according to an embodiment of the present invention comprises: a sealing sleeve having a ring-shaped upper O-ring installed on the upper surface of the sealing sleeve; a lower O-ring installed on the lower surface of the sealing sleeve; and a pressure ring inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

[0011] According to an embodiment of the present invention, the receiving portion may be formed on an inner side wall of the sealing sleeve.

[0012] According to an embodiment of the present invention, the receiving portion may be formed on an outer side wall of the sealing sleeve.

[0013] According to an embodiment of the present invention, the pressurizing ring may be a ring-shaped coil spring inserted into the accommodating portion.

[0014] According to an embodiment of the present invention, the pressure ring may be an O-ring inserted into the receiving portion.

[0015] According to an embodiment of the present invention, the pressure ring may be made of phenyl vinyl methyl silicone (PVMQ; Phenyl Vinyl Methyl Silicone).

[0016] A fluid supply device for connecting a fluid supply pipe and an electrostatic chuck according to an embodiment of the present invention comprises: a fluid connection block, formed with a fluid supply hole to be connected to the fluid supply pipe for supplying fluid to the electrostatic chuck; and a sealing component, installed around the fluid supply hole and sealing the space between the fluid connection block and the electrostatic chuck. The sealing component comprises: a sealing sleeve having a ring shape; an upper O-ring installed on the upper surface of the sealing sleeve; a lower O-ring installed on the lower surface of the sealing sleeve; and a pressurizing ring inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

[0017] According to an embodiment of the present invention, the fluid supply hole includes: a first fluid supply hole, connected to a first fluid supply pipe that supplies a first fluid supplied at a first pressure higher than atmospheric pressure; and a second fluid supply hole, connected to a second fluid supply pipe that supplies a second fluid supplied at a second pressure lower than atmospheric pressure.

[0018] According to an embodiment of the present invention, the first fluid may be a refrigerant.

[0019] According to an embodiment of the present invention, the second fluid may be helium (He).

[0020] According to an embodiment of the present invention, the sealing member includes: a first sealing member installed at a periphery of the first fluid supply hole; and a second sealing member installed at a periphery of the second fluid supply hole.

[0021] According to an embodiment of the present invention, in the first sealing component, the receiving portion may be formed on an inner side wall of the sealing sleeve.

[0022] According to an embodiment of the present invention, in the second sealing component, the receiving portion may be formed on an outer side wall of the sealing sleeve.

[0023] The substrate processing device according to the present invention includes: an electrostatic chuck for placing a substrate; a fluid supply pipe for supplying a fluid for adjusting the temperature of the substrate to the electrostatic chuck; and a fluid supply device for connecting the fluid supply pipe and the electrostatic chuck. The fluid supply device includes: a fluid connection block formed with a fluid supply hole connected to the fluid supply pipe to supply fluid to the electrostatic chuck; and a sealing component installed around the fluid supply hole and sealing the space between the fluid connection block and the electrostatic chuck. The sealing component includes: a sealing sleeve having a ring shape; an upper O-ring installed on the upper surface of the sealing sleeve; a lower O-ring installed on the lower surface of the sealing sleeve; and a pressurizing ring inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

[0024] According to an embodiment of the present invention, the fluid connection block and the sealing sleeve are composed of one of polyetheretherketone (PEEK), Teflon, Vesper, polybenzimidazole, and perfluoroalkoxy (PFA); the upper O-ring, the lower O-ring, and the pressure ring are composed of phenyl vinyl methyl silicone (PVMQ; Phenyl Vinyl Methyl Silicone).

[0025] According to the present invention, the upper surface and the lower surface of the upper O-ring and the lower O-ring are pressurized by the pressurizing ring, so that the upper O-ring and the lower O-ring can seal the connection part of the fluid supply pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The structure of the substrate processing apparatus according to the present invention is schematically shown.

[0027] Figure 2 is a perspective view of a fluid supply device according to the present invention.

[0028] Figure 3 The upper surface of a fluid supply device according to the invention is shown.

[0029] Figure 4 The sealing member having a receiving portion formed on the inner wall of the sealing sleeve is shown.

[0030] Figure 5 Show Figure 4 The state in which the sealing component is combined with the electrostatic chuck.

[0031] Figures 6 to 8 It is used to illustrate the Figure 4 A diagram of the sealing process of the fluid supply device of the sealing components.

[0032] Fig. 9 The sealing member having a receiving portion formed on the outer side wall of the sealing sleeve is shown.

[0033] Fig.10 Show Fig. 9 The state in which the sealing component is combined with the electrostatic chuck.

[0034] Figures 11 to 13 It is used to illustrate the Fig. 9 A diagram of the sealing process of the fluid supply device of the sealing components.

[0035] (Explanation of Reference Numerals)

[0036] 10: Substrate processing equipment

[0037] 100: Electrostatic chuck

[0038] 200: Fluid supply pipe

[0039] 300: Fluid supply device

[0040] 310: Fluid connection block

[0041] 320: Sealing parts

[0042] 322: Sealing sleeve

[0043] 324: Upper O-ring

[0044] 326: Lower O-ring

[0045] 328: Pressurized ring DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various forms and is not limited to the embodiments described here.

[0047] In order to clearly describe the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

[0048] In addition, in a plurality of embodiments, components having the same configuration are denoted by the same reference numerals and only representative embodiments are described, and in other embodiments, only the representative embodiments and other configurations are described.

[0049] Throughout the specification, when a part is "connected (or coupled)" to another part, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" via other parts. In addition, when a part "includes" a certain constituent element, it means that other constituent elements may be included, rather than excluding other constituent elements, unless otherwise specifically stated.

[0050] Unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meanings as those generally understood by persons skilled in the art to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the relevant technology, and should not be interpreted as idealized or overly formalized meanings unless explicitly defined in this application.

[0051] Hereinafter, the sealing member 320 that can prevent leakage of fluid even in a very low temperature environment, the fluid supply device 300 including the sealing member 320, and the substrate processing device 10 will be described. The substrate processing device 10 according to the present invention performs a process such as etching and evaporation on a substrate W.

[0052] Figure 1 1 is a schematic diagram showing the structure of a substrate processing apparatus 10 according to the present invention. The substrate processing apparatus 10 according to the present invention includes an electrostatic chuck 100 that supports a substrate W, a fluid supply pipe 200 that supplies a fluid for adjusting the temperature of the substrate W to the electrostatic chuck 100, and a fluid supply device 300 that connects the fluid supply pipe 200 and the electrostatic chuck 100. Although not shown in the figure, the substrate processing apparatus 10 may include a processing fluid supply unit that supplies a processing fluid for processing the substrate W, and a power source and an electrode that generate plasma using the processing fluid.

[0053] In order to perform a treatment process, the electrostatic chuck 100 supports the substrate W below the substrate W. The electrostatic chuck 100 may be used as a lower electrode for generating plasma. A temperature adjustment device for temperature control may be provided inside the electrostatic chuck 100. The temperature adjustment device includes a heater for heating, a first flow path 110 through which a first fluid for cooling can flow, and a second flow path 120 through which a second fluid for transferring the temperature of the electrostatic chuck 100 to the substrate W can flow. Figure 1 As shown, the first flow path 110 and the second flow path 120 may be formed inside the electrostatic chuck 100 .

[0054] According to an embodiment of the present invention, the first fluid is a refrigerant, which may be one of FC, HT, NOVECSeries, and Ethylene Glycol from 3M Company.

[0055] According to an embodiment of the present invention, the second fluid is helium (He). As the second fluid, not only helium (He) can be used, but also other inert fluids such as neon (Ne) and argon (Ar) can be used.

[0056] The fluid supply pipe 200 provides a path for supplying a fluid to the electrostatic chuck 100. For example, a first fluid for temperature adjustment and a second fluid may flow to the electrostatic chuck 100 through the fluid supply pipe 200. The fluid supply pipe 200 may include a first fluid supply pipe 210 through which a first fluid (e.g., a refrigerant) can flow and a second fluid supply pipe 220 through which a second fluid (e.g., He) can flow. The first fluid supply pipe 210 may connect the first fluid supply source 205 and the first flow path 110 and the first flow path 110 and the fluid discharge port 207. In addition, the second fluid supply pipe 220 may connect the second fluid supply source 215 and the second flow path 120. The fluid supply pipe 200 is connected to the fluid supply device 300, and supplies the fluid to the inside of the electrostatic chuck 100 through the fluid supply device 300.

[0057] The fluid supply device 300 supplies flowing fluid to the electrostatic chuck 100 through the fluid supply pipe 200 . One end of the fluid supply device 300 is connected to the fluid supply pipe 200 , and the other end of the fluid supply device 300 is connected to the electrostatic chuck 100 .

[0058] The fluid supply device 300 includes a fluid connection block 310 having a fluid supply hole 312 connected to the fluid supply pipe 200 to be supplied to the electrostatic chuck 100, and a sealing member 320 installed around the fluid supply hole 312 and sealing the connection between the fluid supply pipes 200. Figure 2 A fluid supply hole 312 for connecting the fluid supply pipe 200 and the internal flow path of the electrostatic chuck 100 is formed in the fluid connection block 310. In addition, a groove and a fastening port for fastening the fluid supply pipe 200 and the electrostatic chuck 100 are formed in the fluid connection block 310. The fluid supply hole 312 includes a pressure higher than the atmospheric pressure P atm The first pressure P 1 The first fluid supply hole 312A for supplying the first fluid (eg, refrigerant) and the first fluid supply hole 312A for supplying the first fluid (eg, refrigerant) at a pressure lower than the atmospheric pressure P atm The second pressure P 2 The second fluid supply hole 312B supplies the second fluid (eg, He). Figure 2 as well as Figure 3As shown, two first fluid supply holes 312A may be formed in the fluid connection block 310, and two second fluid supply holes 312B may be formed between the first fluid supply holes 312A. The shape, position, size, and number of the fluid supply holes 312 may vary according to the system structure. The fluid connection block 310 may be made of an insulating material. For example, the fluid connection block 310 may be made of engineering plastics such as polyetheretherketone (PEEK), Teflon, Vesper, polybenzimidazole, and perfluoroalkoxy (PFA).

[0059] A sealing component 320 for sealing the space between the fluid connection block 310 and the electrostatic chuck 100 is installed around the fluid supply hole 312 of the fluid supply device 300. The sealing component 320 can be inserted into a groove formed around the fluid supply hole 312. The first sealing component 320A is installed around the first fluid supply hole 312A, and the second sealing component 320B is installed around the second fluid supply hole 312B. That is, the sealing component 320 may include a first sealing component 320A installed around the first fluid supply hole 312A and a second sealing component 320B installed around the second fluid supply hole 312B. The sealing component 320 needs to be constructed of a material that meets the chemical resistance conditions for refrigerants or process fluids and meets the resistance conditions in ultra-low temperature environments (for example: -100°C). Therefore, Virgin PTFE (polytetrafluoroethylene) or a material mixed with PTFE and PI can be used for the sealing component 320.

[0060] The sealing component 320 according to the present invention includes a sealing sleeve 322 having a ring shape, an upper O-ring 324 installed on the upper surface 322US of the sealing sleeve 322, a lower O-ring 326 installed on the lower surface 322LS of the sealing sleeve 322, and a pressurizing ring 328 inserted into the receiving portion 322RS of the sealing sleeve 322 to pressurize the upper surface 322US and the lower surface 322LS.

[0061] Figure 4 As an example of the sealing member 320, a cross section of a first sealing member 320A is shown. Fig. 9 As another example of the sealing member 320, a cross section of a second sealing member 320B is shown. Figure 4 In the first sealing member 320A, a receiving portion 322RS is formed on the inner wall 322IW of the sealing sleeve 322. Fig. 9 In the second sealing member 320B, a receiving portion 322RS is formed on the outer wall 322OW of the sealing sleeve 322 .

[0062] According to the present invention, the pressurizing ring 328 inserted into the receiving portion 322RS of the sealing sleeve 322 pressurizes the upper surface 322US and the lower surface 322LS of the sealing sleeve 322 in the upper and lower directions, respectively. That is, the pressurizing ring 328 expands the upper surface 322US and the lower surface 322LS of the sealing sleeve 322 in the upper and lower directions. Therefore, the upper O-ring 324 and the lower O-ring 326 installed on the upper surface 322US and the lower surface 322LS are closely attached to the lower surface of the electrostatic chuck 100 and the fluid connection block 310. Therefore, in an ultra-low temperature environment, when the electrostatic chuck 100 or the fluid connection block 310 is contracted, the upper O-ring 324 and the lower O-ring 326 can also be closely attached to the lower surface of the electrostatic chuck 100 and the fluid connection block 310.

[0063] like Figure 2 As shown, the sealing sleeve 322 is provided in a ring shape inserted around the fluid supply hole 312 of the fluid connection block 310. An upper O-ring 324 and a lower O-ring 326 may be installed in grooves formed on the upper surface 322US and the lower surface 322LS of the sealing sleeve 322. A receiving portion 322RS into which a pressurizing ring 328 can be inserted may be formed on the inner side wall 322IW or the outer side wall 322OW of the sealing sleeve 322. For insulation and heat insulation, the sealing sleeve 322 may be made of engineering plastics such as polyetheretherketone (PEEK), Teflon, Vesper, polybenzimidazole, and perfluoroalkoxy (PFA).

[0064] The upper O-ring 324 and the lower O-ring 326 are inserted into the upper surface 322US and the lower surface 322LS of the sealing sleeve 322. The upper O-ring 324 and the lower O-ring 326 seal the space between the electrostatic chuck 100 and the fluid connection block 310. The materials of the upper O-ring 324 and the lower O-ring 326 may be different depending on the type of fluid to be sealed. For example, the upper O-ring 324 and the lower O-ring 326 are made of phenyl vinyl methyl silicone (PVMQ; Phenyl Vinyl Methyl Silicone) which does not deform in an ultra-low temperature environment (e.g., -100°C) and has chemical resistance.

[0065] According to an embodiment of the present invention, the pressure ring 328 may be a ring-shaped coil spring inserted into the receiving portion 322RS. The upper surface 322US and the lower surface 322LS of the sealing sleeve 322 may be pressurized in the upper and lower directions by the elastic force of the pressure ring 328. On the other hand, since the electrostatic chuck 100 applies RF (Radio Frequency) power as a lower electrode, a coil spring of a material having insulating and heat-insulating properties is used.

[0066] The pressurizing ring 328 may be designed in consideration of the chemical resistance of the refrigerant and the deformation of the sealing sleeve 322. The elastic spring used as the pressurizing ring 328 may be a hollow spring (e.g., Helical Spring, Cantilever Spring). SUS 316L (EP), nickel alloy, Hastelloy may be used as the material of the elastic spring. When the insulation breakdown voltage of the sealing sleeve 322 is greater than the RF voltage applied to the electrostatic chuck 100, an elastic spring of a metal material may be used.

[0067] When the insulation breakdown voltage of the sealing sleeve 322 is less than the RF voltage applied to the electrostatic chuck 100, electrical conduction (current flow) may occur at the contact point between the elastic spring of the metal material used as the pressure ring 328 and the sealing sleeve 322. In this case, the pressure ring 328 with insulation is used. According to an embodiment of the present invention, the pressure ring 328 is an O-ring inserted in the receiving portion 322RS. That is, an O-ring in the form of an upper O-ring 324, a lower O-ring 326, etc. can be used as the pressure ring 328. The pressure ring 328 is made of phenyl vinyl methyl silicone (PVMQ; Phenyl Vinyl Methyl Silicone) material.

[0068] Hereinafter, the principle of sealing the space between the fluid connection block 310 and the electrostatic chuck 100 by the sealing member 320 according to the present invention will be described. Figure 5 Show Figure 4 The state in which the first sealing member 320A is combined with the electrostatic chuck 100. In particular, Figure 5 Show Figure 3 A cross section of the AA section.

[0069] Reference Figure 5 , a fluid connection block 310 is combined at the connection portion between the first flow path 110 and the first fluid supply pipe 210 below the electrostatic chuck 100. Here, the first flow path 110 and the first fluid supply pipe 210 can be connected through the first fluid supply hole 312A of the fluid connection block 310. The first fluid (e.g., refrigerant) is supplied through the first fluid supply pipe 210, and the first fluid flows into the first flow path 110 through the first fluid supply hole 312A. At this time, the first fluid is at a pressure higher than the atmospheric pressure P atm The first pressure P 1 The refrigerant is supplied to maintain the electrostatic chuck 100 at a constant temperature or below, that is, to cool the electrostatic chuck 100 .

[0070] exist Figure 5 In FIG. 1 , the portion indicated by the dotted line indicates the region pressurized by the first fluid, and the portion indicated by the bold line indicates the region pressurized by the atmospheric pressure. Figure 5, due to the first pressure P exerted by the first fluid 1 , the pressure ring 328 of the first sealing member 320A is deformed in the vertical direction, and the upper O-ring 324 and the lower O-ring 326 are pressurized in the vertical direction due to the deformation of the pressure ring 328. The upper O-ring 324 and the lower O-ring 326 are pressurized in the vertical direction, so that the space between the electrostatic chuck 100 and the fluid connection block 310 can be more strongly sealed. In particular, when the electrostatic chuck 100 and the fluid connection block 310 are contracted in an ultra-low temperature environment, the upper O-ring 324 and the lower O-ring 326 can also seal the space between the electrostatic chuck 100 and the fluid connection block 310.

[0071] Figures 6 to 8 It is used to illustrate the Figure 4 FIG. 5 is a diagram of a sealing process of the fluid supply device 300 using the first sealing member 320A. Figure 6 FIG. 3 shows a state where the first sealing component 320A is combined with the fluid connection block 310. Figure 7 FIG. 2 shows a state where the fluid connection block 310 equipped with the first sealing member 320A is connected to the lower side of the electrostatic chuck 100. Figure 8 FIG. 3 shows a state where the electrostatic chuck 100 and the fluid connection block 310 are contracted in an ultra-low temperature environment when the first fluid is supplied to the first flow path 110 through the first fluid supply hole 312A.

[0072] like Figure 6 As shown, the first sealing member 320A is inserted into the groove portion around the first fluid supply hole 312A of the fluid connection block 310. The upper surface 322US and the lower surface 322LS of the sealing sleeve 322 have an inclined shape so that the center portion is more protruding than the edge. The vertical height of the first sealing member 320A is set to be higher than the groove portion of the sealing sleeve 322. If the first sealing member 320A is installed in the groove portion of the sealing sleeve 322, as shown in FIG. Figure 6 In this way, a portion of the first sealing member 320A protrudes.

[0073] Reference Figure 7 , the fluid connection block 310 is connected to the electrostatic chuck 100 by bolts 330. Here, the upper O-ring 324 and the lower O-ring 326 are pressed by the electrostatic chuck 100, and on the contrary, the upper O-ring 324 and the lower O-ring 326 are closely attached to the electrostatic chuck 100 and the fluid connection block 310 in the vertical direction. Figure 8 As shown, when the fluid connection block 310 and the electrostatic chuck 100 shrink in an ultra-low temperature environment, the upper O-ring 324 and the lower O-ring 326 can also be tightly attached to the electrostatic chuck 100 and the fluid connection block 310, thereby preventing leakage of the first fluid.

[0074] Fig. 9The second sealing member 322B is shown to have a receiving portion 322RS formed on the outer wall 322OW of the sealing sleeve 322. In particular, Fig. 9 Show Figure 3 The cross section of the BB part. Fig. 9 , a pressurizing ring 328 is inserted into a receiving portion 322RS formed on an outer side wall 322OW of the second sealing member 322B. The pressurizing ring 328 inserted into the receiving portion 322RS of the sealing sleeve 322 pressurizes the upper surface 322US and the lower surface 322LS of the sealing sleeve 322 in the up-down direction, respectively. That is, the pressurizing ring 328 expands the upper surface 322US and the lower surface 322LS of the sealing sleeve 322 in the up-down direction. Therefore, the upper O-ring 324 and the lower O-ring 326 mounted on the upper surface 322US and the lower surface 322LS are in close contact with the lower surface of the electrostatic chuck 100 and the fluid connection block 310. Therefore, when the electrostatic chuck 100 or the fluid connection block 310 shrinks in an ultra-low temperature environment, the upper O-ring 324 and the lower O-ring 326 can also be in close contact with the lower surface of the electrostatic chuck 100 and the fluid connection block 310.

[0075] Reference Fig.10 , a fluid connection block 310 is connected to the connection portion of the second flow path 120 and the second fluid supply pipe 220 below the electrostatic chuck 100. Here, the second flow path 120 and the second fluid supply pipe 220 can be connected through the second fluid supply hole 312B of the fluid connection block 310. The second fluid (e.g., He) is supplied through the second fluid supply pipe 220, and the second fluid flows into the second flow path 120 through the supply hole 312B. At this time, the second fluid is at a pressure lower than the atmospheric pressure P atm The second pressure P 2 The He fluid of the second fluid supply is provided to transfer the temperature of the electrostatic chuck 100 to the substrate W. Figure 1 A groove portion through which the second fluid can flow is formed on the upper surface of the electrostatic chuck 100 on which the substrate W is placed. The groove portion formed on the surface of the electrostatic chuck 100 is connected to the second flow path 120. The second fluid can flow along the lower surface of the substrate W through the second flow path 120, and the temperature of the electrostatic chuck 100 is transferred to the substrate W through the second fluid. For example, while the electrostatic chuck 100 is maintained at an ultra-low temperature by the first fluid, the substrate W can be cooled by the second fluid.

[0076] On the other hand, during the process, since the inner space of the plasma processing chamber is maintained in a vacuum state, the second fluid is supplied at a very low pressure so as not to be affected by the vacuum environment of the chamber. 2 supply.

[0077] exist Fig. 9In the figure, the portion indicated by the dotted line represents the area pressurized by the second fluid, and the portion indicated by the bold line represents the area pressurized by the atmospheric pressure. Figure 5 When compared with the case of atm The pressurized outer side wall 322OW, so that the pressurized ring 328 can pass the atmospheric pressure P atm Deformation. Fig. 9 , the pressurizing ring 328 passes through the atmospheric pressure P atm The upper O-ring 324 and the lower O-ring 326 are deformed in the vertical direction, and are pressurized in the vertical direction by the deformation of the pressurizing ring 328. The upper O-ring 324 and the lower O-ring 326 are pressurized in the vertical direction, so that the space between the electrostatic chuck 100 and the fluid connection block 310 can be more tightly sealed. In particular, when the electrostatic chuck 100 and the fluid connection block 310 are contracted in an ultra-low temperature environment, the upper O-ring 324 and the lower O-ring 326 can also seal the space between the electrostatic chuck 100 and the fluid connection block 310.

[0078] Figures 11 to 13 It is used to illustrate the Fig. 9 The sealing process of the fluid supply device 300 using the second sealing member 320B. Fig.11 FIG. 3 shows a state where the second sealing component 320B is combined with the fluid connection block 310. Fig.12 FIG. 2 shows a state where the fluid connection block 310 with the second sealing member 320B installed is connected to the lower side of the electrostatic chuck 100. Fig.13 The diagram shows a state where the electrostatic chuck 100 and the fluid connection block 310 are contracted in an ultra-low temperature environment when the second fluid is supplied to the second flow path 120 through the second fluid supply hole 312B.

[0079] like Fig.11 As shown, the second sealing member 320B is inserted into the groove portion around the second fluid supply hole 312B of the fluid connection block 310. The upper surface 322US and the lower surface 322LS of the sealing sleeve 322 have an inclined shape with the edge portion protruding more than the center portion. The vertical height of the second sealing member 320B is set to be higher than the groove portion of the sealing sleeve 322. If the second sealing member 320B is installed in the groove portion of the sealing sleeve 322, as shown in FIG. Fig.11 As shown, a portion of the second sealing member 320B is protruding.

[0080] Reference Fig.12 , the fluid connection block 310 is connected to the electrostatic chuck 100 by bolts 330. Here, the upper O-ring 324 and the lower O-ring 326 are pressed by the electrostatic chuck 100, and on the contrary, the upper O-ring 324 and the lower O-ring 326 are closely attached to the electrostatic chuck 100 and the fluid connection block 310 in the vertical direction. Fig.13As shown, when the fluid connection block 310 and the electrostatic chuck 100 shrink in an ultra-low temperature environment, the upper O-ring 324 and the lower O-ring 326 can also be tightly attached to the electrostatic chuck 100 and the fluid connection block 310, thereby preventing leakage of the second fluid.

[0081] This embodiment and the drawings attached to this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that modifications and specific embodiments that can be easily derived by those skilled in the art within the scope of the technical concept included in the specification and drawings of the present invention are all included in the scope of rights of the present invention.

[0082] Therefore, the concept of the present invention should not be limited to the illustrated embodiments, but rather to the appended claims. All concepts that are equivalent to or equivalently modified to the claims belong to the scope of the concept of the present invention.

Claims

1. A sealing component, wherein: include: A sealing sleeve having a ring shape; An upper O-ring, mounted on the upper surface of the sealing sleeve; A lower O-ring, mounted on the lower surface of the sealing sleeve; as well as A pressurizing ring is inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

2. The sealing component according to claim 1, wherein: The receiving portion is formed on the inner side wall of the sealing sleeve.

3. The sealing component according to claim 1, wherein: The receiving portion is formed on the outer side wall of the sealing sleeve.

4. The sealing component according to claim 1, wherein: The pressurizing ring is a ring-shaped coil spring inserted into the housing portion.

5. The sealing member according to claim 1, wherein: The pressurizing ring is an O-ring inserted into the housing portion.

6. The sealing component according to claim 5, wherein: The compression ring is composed of phenyl vinyl methyl silicone.

7. A fluid supply device, connecting a fluid supply pipe and an electrostatic chuck, wherein: The fluid supply device comprises: a fluid connection block formed with a fluid supply hole connected to the fluid supply pipe to supply fluid to the electrostatic chuck; and a sealing member installed around the fluid supply hole and sealing the space between the fluid connection block and the electrostatic chuck, The sealing component comprises: A sealing sleeve having a ring shape; An upper O-ring, mounted on the upper surface of the sealing sleeve; a lower O-ring mounted on the lower surface of the sealing sleeve; and A pressurizing ring is inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

8. The fluid supply device according to claim 7, wherein: The fluid supply hole comprises: a first fluid supply hole connected to a first fluid supply pipe supplying a first fluid supplied at a first pressure higher than atmospheric pressure; and The second fluid supply hole is connected to a second fluid supply pipe that supplies a second fluid supplied at a second pressure lower than the atmospheric pressure.

9. The fluid supply device according to claim 8, wherein: The first fluid is a refrigerant.

10. The fluid supply device according to claim 8, wherein: The second fluid is helium.

11. The fluid supply device according to claim 8, wherein: The sealing component comprises: A first sealing member installed at a periphery of the first fluid supply hole; and The second sealing member is installed around the second fluid supply hole.

12. The fluid supply device according to claim 11, wherein: In the first sealing component, the receiving portion is formed on an inner side wall of the sealing sleeve.

13. The fluid supply device according to claim 11, wherein: In the second sealing member, the receiving portion is formed on an outer side wall of the sealing sleeve.

14. The fluid supply device according to claim 7, wherein: The pressurizing ring is a ring-shaped coil spring inserted into the housing portion.

15. The fluid supply device according to claim 7, wherein: The pressurizing ring is an O-ring inserted into the housing portion.

16. The fluid supply device according to claim 15, wherein: The compression ring is composed of phenyl vinyl methyl silicone.

17. A substrate processing device, wherein: include: Electrostatic chuck, for placing substrate; a fluid supply pipe for supplying a fluid for adjusting the temperature of the substrate to the electrostatic chuck; a fluid supply device, connecting the fluid supply pipe and the electrostatic chuck, The fluid supply device comprises: a fluid connection block formed with a fluid supply hole connected to the fluid supply pipe to supply fluid to the electrostatic chuck; and a sealing member installed around the fluid supply hole and sealing the space between the fluid connection block and the electrostatic chuck, The sealing component comprises: A sealing sleeve having a ring shape; An upper O-ring, mounted on the upper surface of the sealing sleeve; a lower O-ring mounted on the lower surface of the sealing sleeve; and A pressurizing ring is inserted into the receiving portion of the sealing sleeve to pressurize the upper surface and the lower surface.

18. The substrate processing apparatus according to claim 17, wherein: The fluid supply hole comprises: a first fluid supply hole connected to a first fluid supply pipe supplying refrigerant at a first pressure higher than atmospheric pressure; and The second fluid supply hole is connected to a second fluid supply pipe that supplies helium gas at a second pressure lower than the atmospheric pressure.

19. The substrate processing apparatus according to claim 18, wherein: The sealing component comprises: A first sealing member installed at a periphery of the first fluid supply hole; and a second sealing member, mounted on the periphery of the second fluid supply hole, In the first sealing component, the receiving portion is formed on the inner side wall of the sealing sleeve. In the second sealing member, the receiving portion is formed on an outer side wall of the sealing sleeve.

20. The substrate processing apparatus according to claim 18, wherein: The fluid connection block and the sealing sleeve are made of one of polyetheretherketone, Teflon, Vesper, polybenzimidazole, and perfluoroalkoxy. The upper O-ring, the lower O-ring and the pressure ring are made of phenyl vinyl methyl silicone.

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