LED lamp bead

Abstract

An LED lamp bead comprises a heat dissipation substrate (100) and a plurality of light-emitting wafers (200) arranged on the heat dissipation substrate (100). The light-emitting wafers (200) are arranged on the heat dissipation substrate (100), the metal enclosure (300) is arranged around the light-emitting wafers (200) in a surrounding mode, the packaging glue (400) is arranged on the metal enclosure (300) and packages the light-emitting wafers (200) on the heat dissipation substrate (100), the driving chip (500) is arranged in the heat dissipation substrate (100) and electrically connected with the light-emitting wafers (200), and the driving chip (500) is connected with the heat dissipation substrate (100) and arranged on the heat dissipation substrate (100). And four pins are arranged at four corners. According to the invention, the plurality of light-emitting wafers, the metal enclosure surrounding the light-emitting wafers and the driving chip arranged in the heat-dissipating substrate and electrically connected with the light-emitting wafers are arranged on the heat-dissipating substrate, so that heat generated when the light-emitting wafers and the driving chip work can be quickly dissipated; the temperature of the packaging glue and the driving chip is reduced, and the heat dissipation performance of the lamp bead is improved.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, in particular to an LED lamp bead. Background Art

[0002] LED is mainly used in lighting systems, decoration, electronic equipment indicators, backlight, display and equipment. Among them, high-power LED lamp beads such as 5050 and 7070 lamp beads are mainly prepared by vertical or horizontal structure LED chips. Gold wire welding is required during the preparation process, which leads to reduced light efficiency and reduced reliability. Some high-power LED lamp beads use flip-chip LED chips and fluorescent glass or ceramics. Although they can improve heat dissipation performance and reliability, the cost of LED lamp beads remains high due to the high cost of fluorescent glass and ceramics and the complex processing technology. With the development of society, there is an increasing demand for small-volume, high-power LED lamp beads, and the requirements for lighting power and brightness are increasing, and the cost requirements are increasing. The current high-power LED lamp beads are increasingly difficult to meet the needs in terms of heat dissipation, light efficiency, reliability and cost.

[0003] In order to solve the above problems, the Chinese utility model patent with announcement number CN218209477U in the prior art discloses a high heat dissipation LED lamp bead, including a mounting seat, a mounting groove, a first heat dissipation hole and a second heat dissipation hole are opened inside the mounting seat, a mesh seat is connected to the bottom end of the mounting groove, and a mounting plate is connected to the top of the mesh seat, the outer wall of the mounting plate is provided with external thread teeth, the mounting plate is connected with a heat conducting column inside, an LED lamp bead is arranged on the top of the mounting plate, an internal thread ring is inserted inside the mounting groove, and the internal thread ring is threadedly connected to the external thread teeth, an LED lamp bead lampshade is connected to the top of the mounting seat, a third heat dissipation hole is opened inside the LED lamp bead lampshade, and a connecting pole ear is connected to the LED lamp bead, and the connecting pole ear is connected through the mounting seat. It dissipates heat through multiple heat dissipation holes, but these heat dissipation holes may allow dust, moisture or other foreign matter to enter the interior of the lamp, which may affect the performance of the lamp and even cause a short circuit or other faults.

[0004] Therefore, the prior art needs to be improved and enhanced. Summary of the invention

[0005] In view of the deficiencies in the prior art, an object of the present invention is to provide an LED lamp bead with higher heat dissipation efficiency.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] An LED lamp bead includes a heat dissipation substrate, a plurality of light-emitting chips arranged on the heat dissipation substrate, a metal enclosure arranged around the light-emitting chips, packaging glue arranged in the metal enclosure to package the light-emitting chips on the heat dissipation substrate, a driving chip arranged in the heat dissipation substrate and electrically connected to the light-emitting chips, and four pins connected to the driving chip and arranged on the four corners of the heat dissipation substrate.

[0008] As a further solution of the present invention, the heat dissipation substrate has a cavity, and the driving chip is mounted on the bottom of the cavity.

[0009] As a further solution of the present invention, the four pins are respectively a positive pin, a negative pin, a signal input pin and a signal output pin, the positive pin is arranged opposite to the negative pin, and the signal input pin is arranged opposite to the signal output pin.

[0010] As a further solution of the present invention, a cathode pad connected to the positive pin, an anode pad connected to the negative pin, a signal input pad connected to the signal input pin, and a signal output pad connected to the signal output pin are provided on the bottom of the cavity, and the cathode pad, the anode pad, the signal input pad and the signal output pad are electrically connected to the driving chip.

[0011] As a further solution of the present invention, the light-emitting chips include at least one red light-emitting chip, at least one blue light-emitting chip and at least one green light-emitting chip. The red light-emitting chip and the blue light-emitting chip are electrically connected to the anode pad, and the green light-emitting chip is electrically connected to the signal input pad.

[0012] As a further solution of the present invention, the light-emitting chips and the metal enclosure are arranged on a heat dissipation bottom plate, and the heat dissipation bottom plate is arranged on the heat dissipation substrate.

[0013] As a further solution of the present invention, two heat dissipation blocks are arranged on both sides of the metal enclosure along the length direction, and an arc-shaped bridge is arranged between the metal enclosure and each of the heat dissipation blocks.

[0014] As a further solution of the present invention, the packaging glue is cured to form a hemispherical surface.

[0015] As a further solution of the present invention, a part of the area or the whole area of ​​the packaging glue is mixed with fluorescent powder.

[0016] As a further solution of the present invention, a first mounting portion is provided between the positive pin and the negative pin, and a first mounting hole is provided on the first mounting portion; a second mounting portion is provided between the signal input pin and the signal output pin, and a second mounting hole is provided on the second mounting portion.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] Due to the adoption of the above-mentioned structural design, a number of light-emitting chips are arranged on the heat dissipation substrate, a metal enclosure is arranged around the light-emitting chips, and a driving chip is arranged in the heat dissipation substrate and is electrically connected to the light-emitting chips. The heat generated by the light-emitting chips and the driving chip when working can be quickly dissipated, thereby better reducing the temperature of the packaging glue and the driving chip, and improving the heat dissipation performance of the lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Attached Figure 1 is a top view of a first embodiment of the present invention;

[0020] Attached Figure 2 is a cross-sectional view of a first embodiment of the present invention;

[0021] Attached Figure 3 is a transverse cross-sectional view of a heat dissipation substrate in a first embodiment of the present invention;

[0022] Attached Figure 4 is a cross-sectional view of a second embodiment of the present invention;

[0023] Attached Figure 5 It is a cross-sectional view of a third embodiment of the present invention.

[0024] The numbers in the figure are:

[0025] 100-heat dissipation substrate, 200-light-emitting chip, 300-metal enclosure, 400-packaging glue, 500-driver chip;

[0026] 101 - cavity, 102 - anode pad, 103 - cathode pad, 104 - signal input pad, 105 - signal output pad, 106 - first mounting portion, 107 - second mounting portion;

[0027] 601-positive pin, 602-negative pin, 603-signal input pin, 604-signal output pin;

[0028] 201-red light emitting chip, 202-blue light emitting chip, 203-green light emitting chip;

[0029] 301-heat dissipation base plate, 302-heat dissipation block, 303-arc bridge;

[0030] 1061-first mounting hole;

[0031] 1071-Second mounting hole. DETAILED DESCRIPTION

[0032] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Embodiment 1:

[0038] See also Figure 1-3 The present application discloses an LED lamp bead, comprising a heat dissipation substrate 100, a plurality of light-emitting chips 200 disposed on the heat dissipation substrate 100, a metal enclosure 300 surrounding the light-emitting chips 200, a packaging glue 400 disposed in the metal enclosure 300 to package the light-emitting chips 200 on the heat dissipation substrate 100, a driver chip 500 disposed in the heat dissipation substrate 100 and electrically connected to the light-emitting chips 200, and four pins connected to the driver chip 500 disposed at the four corners of the heat dissipation substrate 100. Through the above structural design, the heat generated by the light-emitting chips 200 when working is dissipated by the metal enclosure 300; the heat generated by the driver chip 500 when working is dissipated by the heat dissipation substrate 100, which can better reduce the temperature of the packaging glue and the driver chip, and improve the heat dissipation performance and heat dissipation efficiency of the lamp bead. In specific implementation, the heat dissipation substrate 100 is a beryllium oxide ceramic substrate or an aluminum nitride ceramic substrate, and the material of the metal dam 300 is a gold-tin alloy, a nickel-gold alloy, or a nickel-palladium-gold alloy.

[0039] In a specific implementation, the heat dissipation substrate 100 has a cavity 101, and the driver chip 500 is installed in the middle position of the bottom of the cavity 101. Since part of the heat generated by the driver chip 500 during operation is dissipated into the cavity 101, and part is conducted to the heat dissipation substrate 100, the heat generated by the driver chip 500 can be quickly dissipated, thereby greatly reducing the temperature of the driver chip 500.

[0040] Specifically, the driver chip 500 is known to the public. Generally, the driver chip 500 has a driver circuit integrated therein and a passivation layer is provided on the driver chip 500. The passivation layer is a surface insulating layer formed when manufacturing the driver chip 500. The driver chip 500 is provided with a plurality of terminals, which are electrically connected to the light emitting chip 200 by direct welding or by bonding wires.

[0041] Specifically, the four pins are a positive pin 601, a negative pin 602, a signal input pin 603 and a signal output pin 604. The positive pin 601 is arranged opposite to the negative pin 602, and the signal input pin 603 is arranged opposite to the signal output pin 604 to facilitate the installation of the present application.

[0042] Specifically, a cathode pad 103 connected to the positive pin 601, an anode pad 102 connected to the negative pin 602, a signal input pad 104 connected to the signal input pin 603, and a signal output pad 105 connected to the signal output pin 604 are provided at the bottom of the cavity 101. The cathode pad 103, the anode pad 102, the signal input pad 104 and the signal output pad 105 are electrically connected to the driving chip 500.

[0043] In a specific implementation, the light-emitting chips 200 include two red light-emitting chips 201, two blue light-emitting chips 202 and one green light-emitting chip 203. The red light-emitting chip 201 and the blue light-emitting chip 202 are electrically connected to the anode pad 102, and the green light-emitting chip 203 is electrically connected to the signal input pad 104.

[0044] As a preferred method of this embodiment, two red light-emitting chips 201, two blue light-emitting chips 202, one green light-emitting chip 203 and the metal enclosure 300 are arranged on a heat dissipation base plate 301, and the heat dissipation base plate 301 is arranged on the heat dissipation substrate 100, so that the heat generated by the light-emitting chips 200 during operation can be transferred to the heat dissipation base plate 301 for heat dissipation, and the heat dissipation base plate 301 then transfers part of the heat to the heat dissipation substrate 100, which is dissipated by the heat dissipation substrate 100, thereby achieving rapid heat dissipation, reducing the temperature of the packaging glue, and improving the heat dissipation performance of the lamp beads.

[0045] As a preferred method of this embodiment, two heat dissipation blocks 302 are provided on both sides of the metal enclosure 300 along the length direction. The heat dissipation blocks 302 are in the shape of long strips. An arc bridge 303 with a certain width is provided between the metal enclosure 300 and each of the heat dissipation blocks 302, so that part of the heat transferred from the light-emitting chips 200 to the metal enclosure 300 can be transferred to the heat dissipation blocks 302 via the arc bridge 303, thereby accelerating the heat dissipation speed and improving the heat dissipation efficiency.

[0046] Specifically, the encapsulation glue 400 is cured to form a hemispherical surface, which acts like a lens, helps to concentrate and diffuse light, and improves the light emitting angle and uniformity of the LED. In this embodiment, the encapsulation glue 400 is not doped with phosphor.

[0047] Specifically, a first mounting portion 106 is provided between the positive pin 601 and the negative pin 602, and a first mounting hole 1061 is provided on the first mounting portion 106; a second mounting portion 107 is provided between the signal input pin 603 and the signal output pin 604, and a second mounting hole 1071 is provided on the second mounting portion 107, so as to facilitate the installation of the present application.

[0048] Embodiment 2:

[0049] According to different requirements on the color and color temperature of the light emitting chip 30, the packaging glue 400 can be mixed with phosphors of different types, colors and proportions.

[0050] Different from the first embodiment, the entire area of ​​the packaging glue 400 is mixed with phosphors. Other similarities will not be described in detail in this embodiment.

[0051] Embodiment 3:

[0052] Different from the first embodiment, a part of the packaging glue 400 is mixed with phosphors. Other similarities will not be described in detail in this embodiment.

[0053] In summary, the present invention solves the deficiencies in the prior art through the above-mentioned structural design, and has the characteristics of reasonable structure and high heat dissipation efficiency.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0055] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An LED lamp bead, characterized in that: The invention comprises a heat dissipation substrate (100), a plurality of light-emitting chips (200) arranged on the heat dissipation substrate (100), a metal enclosure (300) arranged around the light-emitting chips (200), a packaging glue (400) arranged in the metal enclosure (300) for packaging the light-emitting chips (200) on the heat dissipation substrate (100), a driving chip (500) arranged in the heat dissipation substrate (100) and electrically connected to the light-emitting chips (200), and four pins connected to the driving chip (500) and arranged at four corners of the heat dissipation substrate (100).

2. The LED lamp bead according to claim 1, characterized in that: The heat dissipation substrate (100) has a cavity (101), and the driving chip (500) is mounted on the bottom of the cavity (101).

3. The LED lamp bead according to claim 2, characterized in that: The four pins are respectively a positive pin (601), a negative pin (602), a signal input pin (603) and a signal output pin (604). The positive pin (601) is arranged opposite to the negative pin (602), and the signal input pin (603) is arranged opposite to the signal output pin (604).

4. The LED lamp bead according to claim 3, characterized in that: A cathode pad (103) connected to the positive electrode pin (601), an anode pad (102) connected to the negative electrode pin (602), a signal input pad (104) connected to the signal input pin (603), and a signal output pad (105) connected to the signal output pin (604) are arranged on the bottom of the cavity (101); the cathode pad (103), the anode pad (102), the signal input pad (104), and the signal output pad (105) are electrically connected to the driving chip (500).

5. The LED lamp bead according to claim 4, characterized in that: The light-emitting chips (200) include at least one red light-emitting chip (201), at least one blue light-emitting chip (202) and at least one green light-emitting chip (203); the red light-emitting chip (201) and the blue light-emitting chip (202) are electrically connected to the anode pad (102), and the green light-emitting chip (203) is electrically connected to the signal input pad (104).

6. The LED lamp bead according to claim 5, characterized in that: The light-emitting chips (200) and the metal enclosure (300) are arranged on a heat dissipation bottom plate (301), and the heat dissipation bottom plate (301) is arranged on the heat dissipation substrate (100).

7. The LED lamp bead according to claim 6, characterized in that: Two heat sinks (302) are arranged on both sides of the metal enclosure (300) along the length direction, and an arc-shaped bridge (303) is arranged between the metal enclosure (300) and each of the heat sinks (302).

8. The LED lamp bead according to claim 7, characterized in that: The packaging glue (400) solidifies to form a hemispherical surface.

9. The LED lamp bead according to claim 8, characterized in that: A partial area or the entire area of ​​the packaging glue (400) is mixed with fluorescent powder.

10. The LED lamp bead according to claim 9, characterized in that: A first mounting portion (106) is provided between the positive electrode pin (601) and the negative electrode pin (602), and a first mounting hole (1061) is provided on the first mounting portion (106); a second mounting portion (107) is provided between the signal input pin (603) and the signal output pin (604), and a second mounting hole (1071) is provided on the second mounting portion (107).

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