Vehicle-mounted phased-array antenna integrated structure

Abstract

The invention provides a vehicle-mounted phased-array antenna integrated structure, and relates to the technical field of vehicle-mounted phased-array antenna structures. An array surface heat source chip is arranged on one side of an array surface structure of the structure along the height direction of the array surface structure; the heat dissipation structure is arranged on the side, away from the array heat source chip, of the array structure and provided with an air channel, the channel direction of the air channel is located in the plane where the array structure is located in the height direction of the array structure, and the air channel is isolated from the side, provided with the array heat source chip, of the array structure. The air duct can dissipate heat generated by the array heat source chip in a forced air cooling mode; and the array surface structure and the heat dissipation structure are integrally arranged. An array surface structure and a heat dissipation structure are integrated into one structure, the overall weight and size of the antenna are reduced, the design requirement for low profile is met, and meanwhile the effect of rapid heat dissipation is achieved. Moreover, the air duct is isolated from the array heat source chip installed on the array structure, so that the influence of cooling air flowing through the air duct on the phased-array antenna can be effectively avoided.

Description

Technical Field

[0001] The present specification relates to the technical field of heat dissipation of vehicle-mounted phased array antenna structures, and more specifically, to an integrated vehicle-mounted phased array antenna structure. Background Art

[0002] At present, vehicle-mounted phased array antennas are installed on the outside of the vehicle. The design usually requires low profile, small size, and light weight. Conventional heat dissipation includes liquid cooling and air cooling. The disadvantages of liquid cooling are that the operation of the liquid cooling equipment is complicated, the size and weight are large, the installation and fixation are inconvenient, and if the liquid cooling system fails, it is inconvenient to maintain. In addition, if the vehicle-mounted phased array antenna is used in some harsh real-life environments, it is impossible to provide a liquid cooling system for the phased array antenna. Air cooling is divided into two forms: natural air cooling and forced air cooling. The heat dissipation capacity of natural air cooling is poor and can no longer meet the heat dissipation of antennas with higher heat flux density. The existing forced air cooling heat dissipation structure of vehicle-mounted phased array antennas is usually designed in which the installation structure of the main heat source and the air duct heat dissipation teeth are two structural parts. The contact thermal resistance caused by the processing error, deformation error and installation error of the two structures is large, especially between structures with larger sizes. In addition, in view of the requirements of low-profile, large-sized vehicle-mounted antennas, the conventional vertical installation of fans for heat dissipation exceeds the size requirements, and the heat dissipation of small-sized fans is not enough to solve the wind resistance problem caused by the long air duct. Summary of the invention

[0003] The purpose of this specification is to provide an integrated structure of a vehicle-mounted phased array antenna, which can overcome the above-mentioned defects of existing heat dissipation methods.

[0004] The embodiments of this specification are implemented as follows:

[0005] An integrated structure of a vehicle-mounted phased array antenna, comprising an array surface structure and a heat dissipation structure;

[0006] The array structure is provided with an array heat source chip on one side along its height direction;

[0007] The heat dissipation structure is arranged on a side of the array structure away from the array heat source chip, the heat dissipation structure has an air duct, the channel direction of the air duct is located in the plane where the array structure is located along its height direction, the air duct is isolated from the side of the array structure where the array heat source chip is arranged, and the air duct can dissipate the heat generated by the array heat source chip by forced air cooling;

[0008] The array surface structure and the heat dissipation structure are integrated.

[0009] The embodiments of this specification have at least the following advantages or beneficial effects:

[0010] Compared with the prior art, the integrated structure of the vehicle-mounted phased array antenna integrates the array structure and the heat dissipation structure into one structure, which can effectively reduce the weight and volume of the antenna, so as to achieve the design requirements of a low profile and achieve the effect of rapid heat dissipation. Moreover, the isolation of the above-mentioned air duct from the array heat source chip installed on the array structure can effectively prevent the external environment from affecting the phased array antenna, for example, it can prevent impurities (at least including dust) in the cooling air from corroding the array electrical equipment or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present specification and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying any creative work.

[0012] Figure 1 A schematic diagram of the structure of the array provided in this specification;

[0013] Figure 2 A schematic diagram of the heat dissipation structure provided in this specification;

[0014] Figure 3 A schematic diagram of the structure of the sealing groove provided for this specification;

[0015] Figure 4 A structural diagram of a drawer-type window structure provided in this manual;

[0016] Figure 5 This is an example of the radiator temperature distribution cloud diagram.

[0017] Icons: 1- array structure, 2- combined structure slot, 3- air duct, 4- boss, 5- heat sink fin, 6- wind shield. 7- drawer-type window structure, 8- sealing slot, 9- step structure. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of this specification more clear, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are part of the embodiments of this specification, not all of the embodiments. Generally, the components of the embodiments of this specification described and shown in the drawings here can be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present specification provided in the accompanying drawings is not intended to limit the scope of the present specification claimed for protection, but merely represents selected embodiments of the present specification. Based on the embodiments in the present specification, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present specification.

[0020] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0021] In the description of the embodiments of this specification, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the product of this specification is usually placed when used. It is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on this specification. In addition, if the terms "first", "second", "third", etc. appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0022] In addition, the use of terms such as "horizontal", "vertical", and "overhanging" does not mean that the components must be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of the embodiments of this specification, it is also necessary to explain that, unless otherwise clearly specified and limited, the words "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0024] Please refer to Figure 1 and Figure 5 , an integrated vehicle-mounted phased array antenna structure provided in one embodiment of this specification mainly includes an array surface structure 1 and a heat dissipation structure;

[0025] The array structure 1 is provided with an array heat source chip on one side along its height direction;

[0026] The heat dissipation structure is arranged on a side of the array structure 1 away from the array heat source chip, and the heat dissipation structure has an air duct 3, the channel direction of the air duct 3 is located in the plane where the array structure 1 is located along its height direction, the air duct 3 and the array structure 1 are arranged on a side where the array heat source chip is arranged, and the air duct 3 can dissipate the heat generated by the array heat source chip by forced air cooling;

[0027] The array structure 1 and the heat dissipation structure are integrated.

[0028] In this embodiment, the array surface heat source chip is arranged at the center of the array surface structure 1, and large components are arranged at the side thereof.

[0029] In this embodiment, the heat generated by the array heat source chips, large components and other combinations installed in the array structure 1 is transferred to the air duct 3 through the wall surface of the array structure 1, and the heat dissipation structure dissipates heat by forcing air cooling to flow through the air duct 3 to achieve a rapid heat dissipation effect.

[0030] In the present embodiment, the air duct 3 is isolated from the array heat source chips, components and electrical appliances installed on the array structure 1 (that is, the setting position of the air duct is independent of the setting position of the array heat source chips, components and electrical appliances and do not affect each other), which can effectively prevent the cooling wind flowing through the air duct 3 from affecting the phased array antenna, for example, it can prevent impurities (at least including dust) in the cooling wind from corroding the array electrical equipment or electrical appliances.

[0031] In this embodiment, the above-mentioned integrated structure integrates the array surface structure 1 and the heat dissipation structure into one structure, which can effectively reduce the weight and volume of the entire antenna to achieve the design requirements of a low profile, and at the same time can achieve the effect of rapid heat dissipation of the heat source. Moreover, the above-mentioned integrated structure is easy to disassemble and assemble with components such as the array surface combination, and is more convenient.

[0032] In this embodiment, the heat dissipation structure cooperates with the opposite sides of the array structure 1 to form the air duct 3, and the air outlet position of the air duct 3 corresponds to the side wall position of the heat dissipation structure along its length and width directions. It can be seen that the air duct 3 formed by the cooperation of the structural body of the heat dissipation structure and the structural body of the array structure 1 can achieve the heat dissipation effect without setting other components or parts. Moreover, the array structure 1, as the main supporting structure of the above-mentioned integrated structure, can achieve the effect of rapid heat dissipation and reduce the weight of the whole machine while providing support, further reducing the weight and volume of the integrated structure.

[0033] Preferably, the air duct is divided into two independent straight-row double air ducts, separated by the wind shield bottom plate structure, and a double-row fan is installed in the center of the integrated structure. When the fan is in air cooling operation, the airflow passes through the air duct and penetrates the heat dissipation fins designed below the chip and the grooves below the components;

[0034] In this embodiment, a plurality of bosses 4 are provided on one side of the array structure 1 close to the array heat source chip, and the plurality of bosses 4 are in abutment with the array heat source chip. A plurality of step structures 9 are provided on the opposite sides of the array structure 1, and the step structures 9 cooperate with the side walls of the array structure 1 to form a stepped sinking groove, and the stepped sinking groove is in abutment with the chips and / or components installed on the array structure 1.

[0035] In this embodiment, a plurality of bosses are arranged at the center of the array structure 1, and the stepped structures 9 are arranged on opposite sides of the edge thereof (different from the opposite sides where the combined structure groove 2 is located).

[0036] In this embodiment, stepped sinking grooves are reserved on opposite sides of the array structure 1 to facilitate installation of relatively large components on both sides of the array structure 1 .

[0037] Specifically, the above-mentioned array structure 1 can make the contact between the array structure 1 and the heat source better by abutting against the array heat source chip through multiple bosses 4 and abutting against the components through the stepped sinking grooves, thereby improving the thermal conduction efficiency of the array heat source chip and further improving the heat dissipation efficiency.

[0038] In this embodiment, thermal pads are arranged between the boss 4 and the array heat source chip and between the stepped sinking groove and the components to further improve the heat dissipation efficiency.

[0039] In this embodiment, combined structural grooves 2 are provided on two opposite sides of the array structure 1, and the combined structural grooves 2 can be used to arrange a plurality of combined cables.

[0040] In this embodiment, the height of the position of the combined structure slot 2 close to the side of the array heat source chip is lower than the height of the position of the array structure 1 close to the side of the array heat source chip. In detail, the above arrangement can reduce its influence on the electrical performance of the array antenna, and at the same time can facilitate the installation of each combination / module of the antenna and the regular routing of its cables.

[0041] In this embodiment, a wind shield 6 is provided in the air duct 3, and the setting direction of the wind shield 6 is perpendicular to the channel direction of the air duct 3. By providing the wind shield 6, the length of the air duct 3 between the air inlet and the air outlet can be effectively reduced to reduce the wind resistance of the air duct 3, thereby improving the heat dissipation capacity of the air duct 3. Moreover, the wind shield 6 can also change the direction of the cooling air to improve the heat dissipation efficiency of the air duct 3. In this embodiment, the length of the wind shield 6 is consistent with the length or width of the heat dissipation structure.

[0042] For details, please refer to Figure 2 That is, a wind shield 6 is arranged in the middle of the air duct 3, and the length of the wind shield 6 is consistent with the length or width of the heat dissipation structure (the length or width of the inner wall) to shorten the length of the air duct 3 between the air inlet and the air outlet.

[0043] In this embodiment, a plurality of heat dissipation fins 5 are provided in the air duct 3. Providing a plurality of heat dissipation fins 5 can further enhance the heat dissipation effect of the above-mentioned integrated structure.

[0044] In this embodiment, a plurality of the heat dissipation fins 5 are evenly arranged in the air duct 3. By evenly arranging the heat dissipation fins 5, the temperature uniformity of the array heat source chip can be effectively improved.

[0045] In the present embodiment, a drawer-type window structure 7 and a groove structure are provided on the side wall of the combination structure groove 2 away from the array structure 1. The drawer-type window structure 7 can accommodate an electrical appliance combination. The bottom wall size of the groove structure is larger than the opening size of the drawer-type window structure 7. The groove structure is connected with the drawer-type window structure 7 along the direction of its groove channel. A seal is provided on the bottom wall of the groove structure, and the seal can seal the gap between the electrical appliance combination and the drawer-type window structure 7.

[0046] In detail, a cross plate is further provided on the side of the seal away from the drawer-type window opening structure 7, the seal is arranged between the cross plate and the bottom wall of the groove structure, and blind holes are provided at positions corresponding to the side positions of the cross plate and the drawer-type window opening structure 7, and blind holes are provided at corresponding positions of the cross plate and the bottom wall of the groove structure, and the seal can be fixed in the middle position through two circles of blind holes, thereby further improving the sealing effect.

[0047] In this embodiment, a radome is provided on a side of the array surface structure 1 away from the heat dissipation structure, and the radome is covered outside the array surface heat source chip through a sealing member to be isolated from the air duct 3 .

[0048] In this embodiment, a sealing groove 8 is circumferentially arranged on the groove side wall of the above-mentioned combined structure groove 2 away from the array structure 1, and an O-type sealing material is arranged in the sealing groove 8. The antenna cover can be connected with the sealing groove 8 and the sealing material to achieve the effect of sealing the interior.

[0049] By providing the sealing groove 8 and the sealing member, the antenna array and the electrical equipment combination in the antenna cover can be further protected to prevent corrosion of the electrical equipment or components on the array by dust, rain, smoke and the like.

[0050] In this embodiment, based on the above structural setting, the size (length * width * height) of the above integrated structure is not more than 900mm * 900mm * 70mm (excluding the external mounting ears of the antenna) (the specific size is preferably 900mm * 900mm * 51mm), its weight does not exceed 20kg, and it has the waterproof advantage of P67 level.

[0051] Specifically, when in use, the above-mentioned integrated structure can be applied to a vehicle-mounted antenna, and the fan generates forced cooling air to flow through the heat dissipation fins 5 in the air duct 3, and the heat on the heat dissipation fins 5 is taken away to the atmosphere by the cooling air to achieve the desired heat dissipation effect. By providing the heat dissipation fins 5 and the wind shield 6, the cooling air in the air duct 3 can be evenly distributed, and the array surface heat source chip has a uniform temperature. In addition, the array surface structure 1 is isolated from the heat dissipation structure, which can greatly improve the reliability of the above-mentioned integrated structure when applied in harsh environments.

[0052] In this embodiment, the performance of the above integrated structure can be simulated through the following examples, as follows:

[0053] The simulation parameters are as follows:

[0054] (1) Heat source parameters: The heat consumption of the limit indicator receiving chip and transmitting chip is 1600 in total, the heat consumption of the subarray component chip is 165.6W, and the total heat consumption is 713.44W.

[0055] (2) Fan parameters:

[0056] Table 1 HC8020B24U-7 axial flow fan

[0057]

[0058] (3) Material parameters:

[0059] Table 2 Thermophysical properties of materials

[0060] name PCB chip Structural parts Thermal pad Material FR4 and Copper mixture 6061 ZK-D-6 Thermal conductivity W / (m·k) 10 5 167 6

[0061] In this embodiment, the above heat source parameters, fan performance parameters and material parameters are input to perform simulation verification and obtain the following Figure 5As shown in the heat source temperature distribution cloud map, the simulation effect shows that the wind speed is evenly distributed in the three sub-ducts, and the highest temperature of the heat source is 76.9°C. The heat sources meet their respective thermal design requirements, and the thermal design effect of the heat dissipation structure is good.

[0062] The above are only preferred embodiments of this specification and are not intended to limit this specification. For those skilled in the art, this specification may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included in the protection scope of this specification.

Claims

1. A vehicle-mounted phased array antenna integrated structure, characterized in that: Including array structure and heat dissipation structure; The array structure is provided with an array heat source chip on one side along its height direction; The heat dissipation structure is arranged on a side of the array structure away from the array heat source chip, the heat dissipation structure has an air duct, the channel direction of the air duct is located in the plane where the array structure is located along its height direction, the air duct is isolated from the side of the array structure where the array heat source chip is arranged, and the air duct can dissipate the heat generated by the array heat source chip by forced air cooling; The array surface structure and the heat dissipation structure are integrated.

2. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: A plurality of bosses are arranged on one side of the array structure close to the array heat source chip, and the plurality of bosses are in contact with the array heat source chip. A plurality of step structures are arranged on opposite sides of the array structure, and the step structures cooperate with the side walls of the array structure to form a stepped sinking groove, and the stepped sinking groove is in contact with the chips and / or components installed on the array structure.

3. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: Combination structure grooves are provided on opposite sides of the array structure, and the combination structure grooves can be used to arrange a plurality of combined cables.

4. The vehicle-mounted phased array antenna integrated structure according to claim 3, characterized in that: The height of the position of the combined structure groove close to the side of the array heat source chip is lower than the height of the position of the array structure close to the side of the array heat source chip.

5. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: A wind shield is arranged in the air duct, and the arrangement direction of the wind shield is perpendicular to the passage direction of the air duct.

6. The vehicle-mounted phased array antenna integrated structure according to claim 5, characterized in that: The length of the baffle is consistent with the length or width of the heat dissipation structure.

7. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: A plurality of heat dissipation fins are arranged in the air duct, and the plurality of heat dissipation fins are evenly arranged in the air duct.

8. The vehicle-mounted phased array antenna integrated structure according to claim 3, characterized in that: The side wall of the combination structure groove away from the array structure is provided with a drawer-type window structure and a groove structure, the drawer-type window structure can accommodate the electrical appliance combination, the bottom wall size of the groove structure is larger than the opening size of the drawer-type window structure, the groove structure is connected with the drawer-type window structure along the direction of its groove channel, and the bottom wall of the groove structure is provided with a sealing member, which can seal the gap between the electrical appliance combination and the drawer-type window structure.

9. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: A radome is provided on one side of the array structure away from the heat dissipation structure, and the radome is covered outside the array heat source chip through a sealing member so as to be isolated from the air duct.

10. The vehicle-mounted phased array antenna integrated structure according to claim 1, characterized in that: The heat dissipation structure cooperates with the opposite sides of the array structure to form the air duct, and the air outlet position of the air duct corresponds to the side wall position of the heat dissipation structure along the length direction and the width direction thereof.

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