Photovoltaic optimizer

Abstract

The invention relates to the technical field of electronics, in particular to a photovoltaic optimizer. The photovoltaic optimizer comprises a shell, and a circuit board, a power device, a magnetic device and a metal cover which are accommodated in the shell, a heat exchange layer and a first conducting layer which are arranged at an interval are embedded in the circuit board, the power device is fixedly connected to one side of the circuit board, fixedly connected with the heat exchange layer and electrically connected with the first conducting layer, the magnetic device and the metal cover are both fixedly connected to one side of the circuit board, and the magnetic device is electrically connected with the first conducting layer. The metal cover covers the magnetic device and is fixedly and electrically connected with the heat exchange layer. The shell and the metal cover are filled with pouring sealant, and the pouring sealant covers the circuit board, the power device, the magnetic device and the metal cover. Heat generated when the power device works can be transmitted to the metal cover through the heat exchange layer and then transmitted to the external environment through the pouring sealant, heat dissipation of the power device is achieved, and improvement of the heat dissipation efficiency of the power device is facilitated.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a photovoltaic optimizer. Background Art

[0002] In existing photovoltaic optimizers, power devices are mounted on circuit boards, and a heat spreader is in contact with and mounted on the side of the power devices that faces away from the circuit board. The heat generated by the power devices during operation is transferred to the external environment through the heat spreader to dissipate heat. However, as the power density of photovoltaic optimizers increases, more and more heat is generated by the power devices during operation, resulting in low heat dissipation efficiency for the power devices, causing the temperature of the power devices to rise too quickly and the power devices to burn out easily. Summary of the invention

[0003] The present application provides a photovoltaic optimizer, aiming to solve the problem of low heat dissipation efficiency of power devices.

[0004] The embodiment of the present application provides a photovoltaic optimizer. The photovoltaic optimizer includes: a shell, a circuit board, a power device, a magnetic device and a metal cover, and the circuit board, the power device, the magnetic device and the metal cover are all accommodated in the shell. The circuit board is embedded with a heat exchange layer and a first conductive layer, and the heat exchange layer and the first conductive layer are spaced apart. In a first direction, the power device is fixedly connected to one side of the circuit board, and is fixedly connected to the heat exchange layer and electrically connected to the first conductive layer. The first direction is the thickness direction of the circuit board. In the first direction, the magnetic device and the metal cover are both fixedly connected to one side of the circuit board, the magnetic device is electrically connected to the first conductive layer, the metal cover covers the magnetic device and is fixedly connected to the heat exchange layer and electrically connected to the first conductive layer. The shell and the metal cover are filled with potting glue, and the potting glue covers the circuit board, the power device, the magnetic device and the metal cover.

[0005] In the photovoltaic optimizer provided by the embodiment of the present application, since the metal cover is fixedly connected to the heat exchange layer, and the power device is fixedly connected to the heat exchange layer, the heat generated by the power device when working can be transferred to the metal cover through the heat exchange layer, and then transferred to the external environment through the potting glue through the shell, so as to achieve heat dissipation of the power device. In this way, since the contact area between the metal cover and the potting glue is large, the heat exchange efficiency between the metal cover and the potting glue is high, which is conducive to improving the heat dissipation efficiency of the power device; in addition, since the power device is fixedly connected to the heat exchange layer, the power device and the heat exchange layer exchange heat, and the power device has the ability of double-sided heat dissipation. Specifically, when the photovoltaic optimizer is working, the heat generated by the power device is transferred from the following two paths: on the one hand, the heat is directly dissipated from the surface of the power device into the potting glue, and on the other hand, the heat can also be dissipated from the power device to the heat exchange layer. In this way, the heat of the power device can be quickly discharged, which is conducive to improving the heat dissipation efficiency of the power device, improving the performance and safety of the power device, and extending the working life of the power device.

[0006] Moreover, since the metal cover covers the magnetic device and is electrically connected to the heat exchange layer, the metal cover can absorb the magnetic field generated by the magnetic device when it is working, and realize electromagnetic shielding of the magnetic device. The metal cover can realize electromagnetic shielding of the magnetic device and heat dissipation of the power device, which is conducive to improving the utilization rate of the metal cover, avoiding the need to realize heat dissipation of the power device and electromagnetic shielding of the magnetic device through different structural parts, and is conducive to reducing the processing cost of the photovoltaic optimizer, reducing the volume of the photovoltaic optimizer, and facilitating the miniaturization design of the photovoltaic optimizer.

[0007] In addition, the metal cover is designed to dissipate heat for the power device through a heat exchange layer. While ensuring a high heat dissipation efficiency for the power device, the power device and the metal cover may not be in contact, and no other components may be provided between the two. The size of the metal cover is not limited by the size of the power device, and the size of the metal cover can be flexibly set, which is conducive to reducing the difficulty of processing the metal cover, reducing the processing cost and design cost of the metal cover, and reducing the processing cost of the photovoltaic optimizer.

[0008] In a possible embodiment, the circuit board is further provided with a heat exchange hole, which passes through the circuit board and the heat exchange layer along a first direction, and the metal cover includes a mounting portion, which surrounds the opening of the metal cover, and the mounting portion contacts the circuit board and covers the heat exchange hole; the metal cover is further provided with a connecting hole, which passes through the mounting portion along the first direction and is directly connected to the heat exchange hole; the photovoltaic optimizer also includes a fastener, which connects the connecting hole and the heat exchange hole and is used to fix the metal cover to the circuit board, and the fastener contacts the heat exchange layer.

[0009] The heat generated by the power device during operation can be transferred to the fastener through the heat exchange layer, and then transferred to the metal cover through the fastener. The heat generated by the power device during operation can be transferred to the external environment through the fastener and the metal cover, thereby achieving heat dissipation of the power device. The metal cover is fixedly connected to the circuit board through the fastener, and has a simple and stable structure, which is easy to design and helps to reduce the processing cost of the photovoltaic optimizer.

[0010] In a possible implementation, the circuit board is further provided with a heat exchange hole, which penetrates the circuit board and the heat exchange layer along a first direction, and the metal cover is partially inserted into the heat exchange hole and contacts and is fixedly connected to the heat exchange layer.

[0011] The design that the metal cover is partially inserted into the heat exchange hole and contacts and is fixedly connected with the heat exchange layer, the metal cover is fixedly connected with the circuit board by inserting into the heat exchange hole, the structure is simple and stable, easy to design, and can avoid setting additional mounting devices between the metal cover and the circuit board, which is conducive to reducing the processing cost of the photovoltaic optimizer. In addition, if an additional mounting device is set between the metal cover and the circuit board, due to the requirements of safety regulations, the circuit board cannot be wired around the mounting device; the design that the metal cover is partially inserted into the heat exchange hole and contacts and is fixedly connected with the heat exchange layer is also conducive to improving the utilization rate of the board area occupied by the circuit board, which is conducive to reducing the area of ​​the circuit board, and is conducive to the miniaturization design of the circuit board and the photovoltaic optimizer. In addition, the design that the metal cover is partially inserted into the heat exchange hole and contacts and is fixedly connected with the heat exchange layer is conducive to reducing the thermal resistance between the metal cover and the heat exchange layer, which is conducive to increasing the efficiency of the heat generated by the power device during operation to be transferred to the metal cover through the heat exchange layer, and is conducive to improving the heat dissipation efficiency of the power device.

[0012] In a possible implementation, the circuit board is further provided with a heat exchange hole, which penetrates the circuit board and the heat exchange layer along a first direction, and the metal cover includes a fixed portion, which surrounds the opening of the metal cover, contacts and is fixedly connected to the circuit board and covers the heat exchange hole; a heat exchange material is provided in the heat exchange hole, the heat exchange material contacts and is fixedly connected to the fixed portion and the heat exchange layer, and the thermal conductivity of the heat exchange material is greater than the thermal conductivity of the potting glue.

[0013] The design in which the fixing part contacts and is fixedly connected to the circuit board is not only simple and stable in structure and easy to design, but also avoids the need to set up additional mounting devices between the metal cover and the circuit board, which is beneficial to reducing the processing cost of the photovoltaic optimizer. In addition, if additional mounting devices are set up between the metal cover and the circuit board, the circuit board cannot be wired around the mounting devices due to safety regulations; the design in which the fixing part contacts and is fixedly connected to the circuit board is also beneficial to improving the utilization rate of the board area occupied by the circuit board, reducing the area of ​​the circuit board, and miniaturizing the design of the circuit board and the photovoltaic optimizer.

[0014] The heat transferred from the power device to the heat exchange layer can be transferred to the metal cover through the heat exchange material in the heat exchange hole, and then transferred to the external environment through the metal cover to achieve heat dissipation of the power device. The design of the thermal conductivity of the heat exchange material is greater than the thermal conductivity of the potting glue, which is conducive to reducing the thermal resistance between the metal cover and the heat exchange layer, and is conducive to increasing the efficiency of the heat generated by the power device when it is working, which is transferred from the heat exchange layer to the metal cover through the heat exchange material, and is conducive to improving the heat dissipation efficiency of the power device.

[0015] In a possible implementation manner, a projection of the heat exchange hole along the first direction surrounds a projection of the magnetic component along the first direction.

[0016] The design in which the projection of the heat exchange hole along the first direction surrounds the projection of the magnetic device along the first direction is beneficial to increasing the heat exchange area between the heat exchange layer and the metal cover, and is beneficial to improving the efficiency of heat exchange between the metal cover and the heat exchange layer, and is beneficial to improving the efficiency of heat generated by the power device during operation being transferred to the metal cover through the heat exchange layer, and is beneficial to improving the heat dissipation efficiency of the power device.

[0017] In a possible implementation manner, the power device is fixedly connected to a side of the circuit board facing the magnetic device, and the metal cover also covers the power device.

[0018] The power device is fixedly connected to the side of the circuit board facing the magnetic device, and the metal cover also covers the design of the power device to avoid the situation where the magnetic device and the power device are located on both sides of the circuit board, which is beneficial to improving space utilization and reducing the size of the photovoltaic optimizer in the thickness direction of the circuit board; moreover, it is beneficial to improve the utilization rate of the board area occupied by the circuit board, reduce the area of ​​the circuit board, and facilitate the miniaturized design of the photovoltaic optimizer.

[0019] In a possible implementation, in the first direction, a first thermally conductive material is further provided between the power device and the metal cover, the first thermally conductive material is in contact with and fixedly connected to the power device and the metal cover respectively, and the thermal conductivity of the first thermally conductive material is greater than the thermal conductivity of the potting compound.

[0020] The design that the first thermally conductive material contacts and is fixedly connected to the power device and the metal cover respectively, and the power device and the metal cover are fixed by the first thermally conductive material, is conducive to improving the structural stability and reliability of the photovoltaic optimizer. The heat generated by the power device during operation can also be transferred to the metal cover through the first thermally conductive material and then to the external environment. The design that the thermal conductivity of the first thermally conductive material is greater than the thermal conductivity of the potting glue is conducive to reducing the thermal resistance between the power device and the metal cover, and is conducive to improving the efficiency of transferring the heat generated by the power device during operation to the metal cover through the first thermally conductive material, and is conducive to improving the heat dissipation efficiency of the power device.

[0021] In a possible implementation manner, in the first direction, the maximum distance between the magnetic device and the circuit board is greater than the maximum distance between the power device and the circuit board, and a portion of the metal cover opposite to the power device is concave toward the circuit board.

[0022] In the first direction, the maximum distance between the magnetic device and the circuit board is greater than the maximum distance between the power device and the circuit board. The portion of the metal cover opposite to the power device is concave toward the circuit board. The metal cover can be adaptively designed according to the thickness of the power device and the thickness of the magnetic device to avoid excessive space between the portion of the metal cover opposite to the power device and the power device, which is beneficial to improving the space utilization of the metal cover, and is beneficial to improving the strength of the metal cover, and is beneficial to improving the structural stability of the metal cover.

[0023] In a possible implementation manner, the power device is fixedly connected to a side of the circuit board facing away from the magnetic device, and a projection of the power device along a first direction overlaps with a projection of the metal cover along the first direction.

[0024] The power device is fixedly connected to the side of the circuit board facing away from the magnetic device. The design in which the projection of the power device along the first direction overlaps with the projection of the metal cover along the first direction is beneficial to improving the utilization rate of the circuit board area, reducing the area of ​​the circuit board, and facilitating the miniaturization design of the photovoltaic optimizer.

[0025] In a possible implementation manner, the metal cover is further provided with heat dissipation fins, and the heat dissipation fins are located on the outer surface of the metal cover.

[0026] The design of the heat dissipation fins is conducive to increasing the heat dissipation area of ​​the metal cover, which is conducive to improving the efficiency of transferring the heat generated by the power device during operation to the external environment through the metal cover, and is conducive to improving the heat dissipation efficiency of the power device.

[0027] In a possible implementation, the circuit board is further provided with a first through hole, which penetrates the circuit board and the heat exchange layer along a first direction; the power device includes a first pin, which is inserted into the first through hole and contacts and fixedly connected to the heat exchange layer.

[0028] The design in which the first pin is inserted into the first through hole and is in contact with and fixedly connected to the heat exchange layer realizes the fixed connection between the power device and the circuit board by inserting the first pin into the first through hole. The structure is simple and stable, easy to design, and beneficial to reducing the processing cost of the photovoltaic optimizer; moreover, since the first pin is in contact with and fixedly connected to the heat exchange layer, it is beneficial to reduce the thermal resistance between the power device and the heat exchange layer, and it is beneficial to improve the efficiency of transferring the heat generated by the power device during operation to the metal cover through the heat exchange layer, and it is beneficial to improve the heat dissipation efficiency of the power device.

[0029] In a possible implementation, the circuit board is further provided with a first through hole, and the first through hole penetrates the circuit board and the heat exchange layer along a first direction; the power device contacts and is fixedly connected to the surface of the circuit board in the first direction, and a second thermally conductive material is provided in the first through hole, and the second thermally conductive material is fixedly connected to the power device and the heat exchange layer, and the thermal conductivity of the second thermally conductive material is greater than the thermal conductivity of the potting glue.

[0030] The heat generated by the power device during operation can also be transferred to the heat exchange layer through the second heat conductive material. There are various ways for the power device to exchange heat with the heat exchange layer. The appropriate method can be selected according to the structure of the power device, which is conducive to reducing the design difficulty of the photovoltaic optimizer and the processing cost of the photovoltaic optimizer. In addition, the design that the thermal conductivity of the second heat conductive material is greater than the thermal conductivity of the potting glue is conducive to improving the efficiency of the heat generated by the power device during operation being transferred to the heat exchange layer through the second heat conductive material, and is conducive to improving the heat dissipation efficiency of the power device.

[0031] In a possible implementation, the circuit board is also embedded with a second conductive layer, the second conductive layer is spaced apart from the heat exchange layer and the first conductive layer, and the metal cover is electrically connected to the second conductive layer; the photovoltaic optimizer also includes a capacitor, in a first direction, the capacitor is fixedly connected to one side of the circuit board, the circuit board is also provided with a mounting hole, the mounting hole passes through the circuit board and the second conductive layer along the first direction; the capacitor includes a first capacitor pin, the first capacitor pin is inserted into the mounting hole and is fixedly and electrically connected to the second conductive layer.

[0032] The capacitor can be grounded or electrically connected to other circuits on the circuit board, and the capacitor has a stable potential. The capacitor can provide a stable potential for the metal cover through the second conductive layer, which is beneficial to improving the electromagnetic shielding effect of the metal cover on the magnetic device. Moreover, the design in which the first capacitor pin is inserted into the mounting hole and fixedly connected and electrically connected to the second conductive layer has a simple and stable structure, is easy to design, and is beneficial to reducing the processing cost of the photovoltaic optimizer.

[0033] In one possible implementation, the circuit board is also embedded with a second conductive layer, the second conductive layer is spaced apart from the heat exchange layer and the first conductive layer, and the metal cover is electrically connected to the second conductive layer; the photovoltaic optimizer also includes a capacitor, and in a first direction, the capacitor is fixedly connected to one side of the circuit board, and the circuit board is also provided with a mounting hole, and the mounting hole passes through the circuit board and the second conductive layer along the first direction; the capacitor is in contact with and fixedly connected to the surface of the circuit board in the first direction, and a conductive material is provided in the second through hole, and the conductive material is fixedly and electrically connected to the capacitor and the second conductive layer, respectively.

[0034] The capacitor can also be fixedly connected and electrically connected to the second conductive layer through the conductive material. There are various ways to electrically connect the capacitor to the second conductive layer. A suitable method can be selected according to the structure of the capacitor, which is conducive to reducing the design difficulty of the photovoltaic optimizer and reducing the processing cost of the photovoltaic optimizer.

[0035] In a possible embodiment, the circuit board is also provided with a fixing hole, which penetrates the circuit board and the second conductive layer along the first direction. The metal cover is also provided with a plug-in protrusion, which is located on the outer surface of the metal cover. The plug-in protrusion is partially inserted into the fixing hole and is fixedly connected and electrically connected to the second conductive layer.

[0036] By plugging the plug-in protrusion into the fixing hole, the metal cover can be fixedly connected and electrically connected to the second conductive layer. There are various ways to fix and electrically connect the metal cover to the second conductive layer, which is conducive to reducing the design difficulty of the photovoltaic optimizer and reducing the processing cost of the photovoltaic optimizer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0038] Figure 1 This is a structural block diagram of a photovoltaic power generation system provided by an embodiment of the present application in cooperation with a photovoltaic module and a power grid or a load;

[0039] Figure 2 is a schematic structural diagram of a photovoltaic optimizer provided in an embodiment of the present application;

[0040] Figure 3 yes Figure 2 A partial three-dimensional structural schematic diagram of a photovoltaic optimizer (without potting glue) is shown;

[0041] Figure 4 yes Figure 2 A schematic diagram of the three-dimensional structure of a circuit board of a photovoltaic optimizer shown;

[0042] Figure 5 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0043] Figure 6 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0044] Figure 7 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0045] Figure 8 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0046] Fig. 9 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0047] Fig.10 is a schematic structural diagram of another photovoltaic optimizer provided in an embodiment of the present application;

[0048] Fig.11 It is a structural schematic diagram of another photovoltaic optimizer provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The embodiment of the present application provides a photovoltaic optimizer. The photovoltaic optimizer is applied to a photovoltaic power generation system. The photovoltaic optimizer of the embodiment of the present application improves the heat dissipation efficiency of the power device by changing the heat dissipation mode of the power device.

[0050] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0051] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 It is a structural block diagram of a photovoltaic power generation system 1 provided in an embodiment of the present application in cooperation with a photovoltaic module 2 and a power grid or a load 3. Figure 2 1 is a schematic diagram of the structure of a photovoltaic optimizer 100 provided in an embodiment of the present application. Figure 3 yes Figure 2 A partial three-dimensional structural schematic diagram of a photovoltaic optimizer 100 (with the potting glue 70 omitted) is shown.

[0052] like Figure 1 As shown, the photovoltaic power generation system 1 is used to convert the direct current output by the photovoltaic module 2 into alternating current and transmit it to the power grid or load 3 to supply the power grid or load 3. The load can be an electronic device that uses alternating current, such as a motor, a fan or an air conditioner. Among them, the number of photovoltaic modules 2 is multiple, and multiple photovoltaic modules 2 are arranged in series. The photovoltaic power generation system 1 includes multiple photovoltaic optimizers 100 and inverters 200. Multiple photovoltaic optimizers 100 are electrically connected to the inverter 200 and are electrically connected to multiple photovoltaic modules 2 one by one. The direct current output by each photovoltaic module 2 is transmitted to the inverter 200 via the corresponding photovoltaic optimizer 100. The inverter 200 is used to convert the direct current transmitted by the photovoltaic module 2 into alternating current. The alternating current output by the inverter 200 is transmitted to the power grid or load 3.

[0053] In the corresponding photovoltaic optimizer 100 and photovoltaic module 2, the photovoltaic optimizer 100 can reduce the voltage and increase the current of the photovoltaic module 2. Due to factors such as light intensity, temperature and shadow, the output power of each photovoltaic module 2 is different. By reducing the voltage and increasing the current of the corresponding photovoltaic module 2 by some photovoltaic optimizers 100, multiple photovoltaic modules 2 connected in series can output the maximum power to the inverter 200, and then supply the power grid or load 3. In the corresponding photovoltaic optimizer 100 and photovoltaic module 2, the photovoltaic optimizer 100 can also perform maximum power point tracking (MPPT, Maximum Power Point Tracking) on ​​the photovoltaic module 2 to ensure that the photovoltaic module 2 always outputs the maximum power.

[0054] like Figure 1 , Figure 2 and Figure 3As shown, the photovoltaic optimizer 100 includes a housing 10, a circuit board 20, a power device 30, a magnetic device 40 and a metal cover 50, and also includes a capacitor 60. For ease of description, the present application defines any three directions as a first direction (i.e., the Z-axis direction shown in the figure), a second direction (i.e., the X-axis direction shown in the figure) and a third direction (i.e., the Y-axis direction shown in the figure), the first direction (i.e., the Z-axis direction shown in the figure) is the thickness direction of the circuit board 20, and the first direction (i.e., the Z-axis direction shown in the figure), the second direction (i.e., the X-axis direction shown in the figure) and the third direction (i.e., the Y-axis direction shown in the figure) are perpendicular to each other. In this embodiment, the second direction (i.e., the X-axis direction shown in the figure) is the length direction of the circuit board 20, and the third direction (i.e., the Y-axis direction shown in the figure) is the width direction of the circuit board 20. In some other embodiments, the second direction (i.e., the X-axis direction shown in the figure) may also be the width direction of the circuit board 20, and the third direction (i.e., the Y-axis direction shown in the figure) may also be the length direction of the circuit board 20.

[0055] The circuit board 20, the power device 30, the magnetic device 40, the metal cover 50 and the capacitor 60 are all accommodated in the housing 10. The housing 10 may include a first cavity wall 11, a second cavity wall 12 and a third cavity wall 13. In the Z-axis direction, the first cavity wall 11 and the second cavity wall 12 are opposite and spaced apart, and the third cavity wall 13 is fixedly connected between the first cavity wall 11 and the second cavity wall 12. The first cavity wall 11, the second cavity wall 12 and the third cavity wall 13 together form the inner cavity of the housing 10.

[0056] The circuit board 20 is located on the side of the first cavity wall 11 facing the second cavity wall 12 and is spaced apart from the first cavity wall 11 and the second cavity wall 12 respectively, and is fixedly connected to the third cavity wall 13. The circuit board 20 is embedded with a heat exchange layer 21 and a first conductive layer 22, and is also embedded with a second conductive layer 23, a third conductive layer 23a and a fourth conductive layer 23b. The heat exchange layer 21, the first conductive layer 22, the second conductive layer 23, the third conductive layer 23a and the fourth conductive layer 23b are spaced apart from each other. Specifically, in the Z-axis direction, the first conductive layer 22, the second conductive layer 23, the third conductive layer 23a and the fourth conductive layer 23b are all located on one side of the heat exchange layer 21. In the X-axis direction, the fourth conductive layer 23b, the second conductive layer 23, the third conductive layer 23a and the first conductive layer 22 are arranged in sequence. The projection of the heat exchange layer 21 along the Z-axis direction surrounds the projection of the first conductive layer 22 along the Z-axis direction and the projection of the third conductive layer 23a along the Z-axis direction. The projection of the second conductive layer 23 along the Z-axis direction overlaps with the projection of the heat exchange layer 21 along the Z-axis direction, and the projection of the fourth conductive layer 23b along the Z-axis direction is spaced from the projection of the heat exchange layer 21 along the Z-axis direction. Exemplarily, the heat exchange layer 21 can be made of metal materials including but not limited to copper, aluminum or copper-aluminum alloy or other materials with good thermal conductivity, and the first conductive layer 22, the second conductive layer 23, the third conductive layer 23a and the fourth conductive layer 23b can be respectively made of metal materials including but not limited to copper, aluminum or copper-aluminum alloy or other materials with good electrical conductivity.

[0057] In the Z-axis direction (i.e., the first direction), the power device 30 is fixedly connected to one side of the circuit board 20 and is fixedly connected to the heat exchange layer 21 and is electrically connected to the first conductive layer 22. Among them, the power device 30 is also electrically connected to the heat exchange layer 21. In the Z-axis direction (i.e., the first direction), the magnetic device 40 and the metal cover 50 are both fixedly connected to one side of the circuit board 20, the magnetic device 40 is electrically connected to the first conductive layer 22, and is also electrically connected to the third conductive layer 23a. The metal cover 50 covers the magnetic device 40 and is fixedly and electrically connected to the heat exchange layer 21, and the metal cover 50 is also electrically connected to the second conductive layer 23. Specifically, the power device 30 is fixedly connected to the side of the circuit board 20 facing the magnetic device 40, and the metal cover 50 also covers the power device 30. The power device 30 is spaced apart from the magnetic device 40 and the metal cover 50, respectively. Exemplarily, the power device 30, the magnetic device 40, and the metal cover 50 are all fixedly connected to the side of the circuit board 20 facing away from the first cavity wall 11. In some other embodiments, the power device 30 , the magnetic device 40 and the metal cover 50 may also be fixedly connected to the side of the circuit board 20 facing away from the second cavity wall 12 .

[0058] In the Z-axis direction (i.e., the first direction), the capacitor 60 is fixedly connected to one side of the circuit board 20 and is electrically connected to the second conductive layer 23, and is also electrically connected to the fourth conductive layer 23b. The capacitor 60 is fixedly connected to the side of the circuit board 20 facing the metal cover 50, and the capacitor 60 is located outside the metal cover 50. In some other embodiments, the capacitor 60 may also be covered by the metal cover 50. The capacitor 60 is electrically connected to the metal cover 50 through the second conductive layer 23, so that the metal cover 50 electromagnetically shields the magnetic device 40.

[0059] In the corresponding photovoltaic optimizer 100 and photovoltaic module 2, the photovoltaic module 2 is electrically connected to the power device 30 and the magnetic device 40 through the circuit board 20. The power device 30 cooperates with the magnetic device 40 to reduce the voltage and increase the current of the photovoltaic module 2, so that multiple photovoltaic modules 2 connected in series can output the maximum power to the power grid or load 3. The power device 30 cooperates with the magnetic device 40 to track the maximum power point of the photovoltaic module 2. Exemplarily, the power device 30 can include but is not limited to an IGBT (Insulated Gate Bipolar Transistor) chip, an FRD (Fast Recovery Diode) chip or a Mosfet (Metal oxide local semiconductor field-effect transistor) chip, etc. The magnetic device 40 is an inductor. The number of power devices 30 can be multiple, and exemplary, the number of power devices 30 is 2. In some other embodiments, the number of power devices 30 can also be 3, 4 or more. The plurality of power devices 30 are arranged at intervals from each other.

[0060] The housing 10 and the metal cover 50 are filled with potting glue 70. The potting glue 70 can be made of insulating materials including but not limited to epoxy resin, silicone or polyurethane. The potting glue 70 covers the circuit board 20, the power device 30, the magnetic device 40 and the metal cover 50, and also covers the capacitor 60. Among them, the metal cover 50 is provided with a matching hole 501, and the potting glue 70 in the housing 10 can be filled into the metal cover 50 from the matching hole 501. In this way, it is only necessary to fill the potting glue 70 in the housing 10, and the potting glue 70 can be filled in the metal cover 50, which is conducive to reducing the difficulty of filling the potting glue 70 and reducing the processing cost. The number of matching holes 501 can be multiple, and illustratively, the number of matching holes 501 is 3. In some other embodiments, the number of matching holes 501 can also be 1, 2, 4 or more.

[0061] Part of the heat generated by the power device 30 during operation is transferred to the metal cover 50 through the heat exchange layer 21, and then transferred to the housing 10 through the potting glue 70 filled in the housing 10, and then transferred from the housing 10 to the external environment; another part of the heat is transferred to the metal cover 50 through the potting glue 70 filled in the metal cover 50, and then transferred to the housing 10 through the potting glue 70 filled in the housing 10, and then transferred from the housing 10 to the external environment, thereby achieving heat dissipation of the power device 30. The contact area between the metal cover 50 and the potting glue 70 is large, and the heat can be quickly dissipated from the metal cover 50.

[0062] In the photovoltaic optimizer 100 provided in the embodiment of the present application, since the metal cover 50 is fixedly connected to the heat exchange layer 21, and the power device 30 is fixedly connected to the heat exchange layer 21, the heat generated by the power device 30 when working can be transferred to the metal cover 50 through the heat exchange layer 21, and then transferred to the external environment through the potting glue 70 through the shell 10, so as to achieve heat dissipation of the power device 30. In this way, since the contact area between the metal cover 50 and the potting glue 70 is large, the heat exchange efficiency between the metal cover 50 and the potting glue 70 is high, which is conducive to improving the heat dissipation efficiency of the power device 30; in addition, since the power device 30 is fixedly connected to the heat exchange layer 21, the power device 30 exchanges heat with the heat exchange layer 21, and the power device 30 has the ability of double-sided heat dissipation. Specifically, when the photovoltaic optimizer 100 is working, the heat generated by the power device 30 is transferred from the following two paths: on the one hand, the heat is directly dissipated from the surface of the power device 30 into the potting glue 70, and on the other hand, the heat can also be dissipated from the power device 30 to the heat exchange layer 21. In this way, the heat of the power device 30 can be quickly dissipated, which is beneficial to improving the heat dissipation efficiency of the power device 30 , improving the performance and use safety of the power device 30 , and extending the service life of the power device 30 .

[0063] Moreover, since the metal cover 50 covers the magnetic device 40 and is electrically connected to the heat exchange layer 21, the metal cover 50 can absorb the magnetic field generated by the magnetic device 40 when it is working, and realize electromagnetic shielding of the magnetic device 40. The metal cover 50 can realize electromagnetic shielding of the magnetic device 40 and heat dissipation of the power device 30, which is beneficial to improve the utilization rate of the metal cover 50, avoid using different structural parts to realize heat dissipation of the power device 30 and electromagnetic shielding of the magnetic device 40, and is beneficial to reduce the processing cost of the photovoltaic optimizer 100, reduce the volume of the photovoltaic optimizer 100, and facilitate the miniaturization design of the photovoltaic optimizer 100.

[0064] In addition, the metal cover 50 is designed to dissipate heat for the power device 30 through the heat exchange layer 21. While ensuring a high heat dissipation efficiency for the power device 30, the power device 30 and the metal cover 50 may not be in contact, and no other components may be provided between the two. The size of the metal cover 50 is not limited to the size of the power device 30, and the size of the metal cover 50 can be flexibly set, which is beneficial to reducing the processing difficulty of the metal cover 50, reducing the processing cost and design cost of the metal cover 50, and reducing the processing cost of the photovoltaic optimizer 100.

[0065] The power device 30 is fixedly connected to the side of the circuit board 20 facing the magnetic device 40, and the metal cover 50 also covers the design of the power device 30, so as to avoid the situation that the magnetic device 40 and the power device 30 are located on both sides of the circuit board 20, which is conducive to improving the space utilization rate and reducing the size of the photovoltaic optimizer 100 in the thickness direction (i.e., the Z-axis direction) of the circuit board 20; moreover, it is conducive to improving the utilization rate of the board area occupied by the circuit board 20, reducing the area of ​​the circuit board 20, and miniaturizing the design of the photovoltaic optimizer 100. In addition, the heat generated by the power device 30 when working can not only be transferred to the metal cover 50 through the heat exchange layer 21, and then transferred to the external environment through the potting glue 70 through the shell 10; but also can be transferred to the metal cover 50 through the potting glue 70, and then transferred to the external environment through the potting glue 70 through the shell 10. The heat generated by the power device 30 when working is all transferred to the metal cover 50 and then to the external environment, which is conducive to improving the heat dissipation efficiency of the power device 30.

[0066] The following is an illustrative description using multiple embodiments.

[0067] See also Figure 4 , and combined with Figure 2 and Figure 3 , Figure 4 yes Figure 2 A schematic three-dimensional structure diagram of the circuit board 20 of the photovoltaic optimizer 100 is shown.

[0068] like Figure 2 , Figure 3 and Figure 4As shown, in some embodiments, the circuit board 20 is further provided with a first through hole 24, and the first through hole 24 penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction (i.e., the first direction). The power device 30 includes a first pin 31. The first pin 31 is inserted into the first through hole 24 and contacts and is fixedly connected to the heat exchange layer 21 by means including but not limited to welding or crimping. The first pin 31 is electrically connected to the heat exchange layer 21. The design that the first pin 31 is inserted into the first through hole 24 and contacts and is fixedly connected to the heat exchange layer 21, and the fixed connection between the power device 30 and the circuit board 20 is achieved by inserting the first pin 31 into the first through hole 24, the structure is simple and stable, and it is easy to design, which is conducive to reducing the processing cost of the photovoltaic optimizer 100; and, since the first pin 31 contacts and is fixedly connected to the heat exchange layer 21, it is conducive to reducing the thermal resistance between the power device 30 and the heat exchange layer 21, which is conducive to improving the efficiency of the heat generated by the power device 30 when working and transferred to the metal cover 50 through the heat exchange layer 21, and is conducive to improving the heat dissipation efficiency of the power device 30.

[0069] Further, the circuit board 20 is also provided with a second through hole 25, and the second through hole 25 penetrates the circuit board 20 and the first conductive layer 22 along the Z-axis direction (i.e., the first direction); the power device 30 also includes a second pin 32, and the second pin 32 is spaced apart from the first pin 31. The second pin 32 is inserted into the second through hole 25 and is fixedly connected and electrically connected to the first conductive layer 22 by means including but not limited to welding or crimping. Among them, the second pin 32 is in contact with the first conductive layer 22. The design that the second pin 32 is inserted into the second through hole 25 and is fixedly connected and electrically connected to the first conductive layer 22, and the fixed connection between the power device 30 and the circuit board 20 is realized by inserting the second pin 32 and the second through hole 25, the structure is simple and stable, easy to design, and is conducive to reducing the processing cost of the photovoltaic optimizer 100, and is conducive to improving the structural stability; and, since the second pin 32 is fixedly connected to the first conductive layer 22, it is conducive to reducing the contact resistance between the power device 30 and the first conductive layer 22, and is conducive to improving the flow efficiency between the power device 30 and the first conductive layer 22.

[0070] exist Figure 2 , Figure 3 and Figure 4In the illustrated embodiment, the circuit board 20 includes a first surface 26 and a second surface 27. In the Z-axis direction, the first surface 26 and the second surface 27 are opposite to each other and spaced apart. The first surface 26 faces away from the first cavity wall 11, and the second surface 27 faces the first cavity wall 11. The first through hole 24 extends from the first surface 26 to the second surface 27 after penetrating the heat exchange layer 21 along the Z-axis direction. The second through hole 25 extends from the first surface 26 to the second surface 27 after penetrating the first conductive layer 22 along the Z-axis direction. The power device 30 also includes a power body 33. In the Z-axis direction, the power body 33 is fixedly connected to one side of the first pin 31 and the second pin 32. In the X-axis direction, the first pin 31 and the second pin 32 are spaced apart. The power body 33 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27. Exemplarily, in the power device 30, the first pin 31 and the second pin 32 are both one. The number of the first through hole 24 and the number of the second through hole 25 are both 2, and the two power devices 30 correspond to one first through hole 24 and one second through hole 25 respectively. In some other embodiments, in the power device 30, the number of the first pin 31 and the second pin 32 may also be 2, 3 or more. The number of the first through hole 24 and the second through hole 25 may also be 3, 4 or more, and each first through hole 24 corresponds to one first pin 31, and each second through hole 25 corresponds to one second pin 32.

[0071] In the Z-axis direction, the design in which the power body 33 is fixedly connected to one side of the first pin 31 and the second pin 32 ensures that the power body 33 can cover the first pin 31 and the second pin 32, which is beneficial to reducing the board area occupied by the power device 30, reducing the area of ​​the circuit board 20, and facilitating the miniaturization design of the photovoltaic optimizer 100.

[0072] Moreover, the design that the power body 33 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27, the circuit board 20 can support the power body 33, which is conducive to improving the stability of the first pin 31 of the power device 30 and the first through hole 24, and is conducive to improving the stability of the heat exchange between the power device 30 and the heat exchange layer 21, and is conducive to improving the reliability and stability of the heat dissipation of the power device 30; and it is conducive to improving the stability of the second pin 32 of the power device 30 and the second through hole 25, and is conducive to improving the stability of the electrical connection between the power device 30 and the first conductive layer 22, and is conducive to improving the current stability. In some other embodiments, the power body 33 can also be spaced apart from the first surface 26.

[0073] In some embodiments, the circuit board 20 is further provided with a third through hole 28, and the third through hole 28 penetrates the circuit board 20 and the first conductive layer 22 along the Z-axis direction (i.e., the first direction). The magnetic device 40 includes a first device pin 41. The first device pin 41 is inserted into the third through hole 28 and is fixedly connected and electrically connected to the first conductive layer 22 by means including but not limited to welding or crimping. Among them, the first device pin 41 contacts the first conductive layer 22. The design that the first device pin 41 is inserted into the third through hole 28 and is fixedly connected and electrically connected to the first conductive layer 22, realizes the fixed connection between the magnetic device 40 and the circuit board 20 by inserting the first device pin 41 and the third through hole 28, has a simple and stable structure, is easy to design, is conducive to reducing the processing cost of the photovoltaic optimizer 100, and is conducive to improving the structural stability; and, since the first device pin 41 is fixedly connected to the first conductive layer 22, it is conducive to reducing the contact resistance between the magnetic device 40 and the first conductive layer 22, and is conducive to improving the flow efficiency between the magnetic device 40 and the first conductive layer 22.

[0074] Further, the magnetic device 40 also includes a second device pin 42, and the second device pin 42 is spaced apart from the first device pin 41. The second device pin 42 is fixedly connected and electrically connected to the third conductive layer 23a. The second device pin 42 is in contact with the third conductive layer 23a. For details, please refer to the manner in which the first device pin 41 is fixedly connected and electrically connected to the first conductive layer 22, which will not be described in detail.

[0075] exist Figure 2 , Figure 3 and Figure 4 In the illustrated embodiment, the structure of the third through hole 28 can refer to the description of the second through hole 25, and will not be repeated. The magnetic device 40 also includes a device body 43, and in the Z-axis direction, the device body 43 is fixedly connected to one side of the first device pin 41 and the second device pin 42. The device body 43 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27. Exemplarily, the number of the third through holes 28 and the number of the first device pins 41 are both 1. In some other embodiments, the number of the third through holes 28 and the number of the first device pins 41 can also be multiple, such as 2, 3 or more. The multiple third through holes 28 correspond one to one with the multiple first device pins 41.

[0076] In the Z-axis direction, the device body 43 is fixedly connected to one side of the first device pin 41, which ensures that the device body 43 can cover the first device pin 41, which is beneficial to reducing the board area occupied by the magnetic device 40, reducing the area of ​​the circuit board 20, and facilitating the miniaturization design of the photovoltaic optimizer 100.

[0077] Moreover, the device body 43 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27, and the circuit board 20 can support the device body 43, which is beneficial to improve the stability of the first device pin 41 and the third through hole 28, and is beneficial to improve the stability of the electrical connection between the magnetic device 40 and the first conductive layer 22, and is beneficial to improve the current stability. In some other embodiments, the device body 43 can also be spaced apart from the first surface 26.

[0078] In some embodiments, the power body 33 (i.e., the power device 30) includes a first end face 331, and the device body 43 (i.e., the magnetic device 40) includes a second end face 431, and both the first end face 331 and the second end face 431 face away from the circuit board 20. In the Z-axis direction, the distance d1 between the second end face 431 and the first face 26 (i.e., the maximum distance between the magnetic device 40 and the circuit board 20) is greater than the distance d2 between the first end face 331 and the first face 26 (i.e., the maximum distance between the power device 30 and the circuit board 20). In some other embodiments, in the Z-axis direction, the maximum distance d1 between the magnetic device 40 and the circuit board 20 may also be equal to or less than the maximum distance d2 between the power device 30 and the circuit board 20. The size of the power device 30 and the size of the magnetic device 40 are various, and the power device 30 and the magnetic device 40 can be flexibly set according to needs.

[0079] In some embodiments, the circuit board 20 is further provided with a heat exchange hole 29, and the heat exchange hole 29 penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction (i.e., the first direction). By means including but not limited to welding or crimping, the metal cover 50 is partially inserted into the heat exchange hole 29 and contacts and is fixedly connected with the heat exchange layer 21. Thus, the metal cover 50 is electrically connected to the heat exchange layer 21.

[0080] Furthermore, the heat exchange hole 29 also penetrates the second conductive layer 23 along the Z-axis direction (ie, the first direction), and the metal cover 50 is fixedly connected and electrically connected to the second conductive layer 23 .

[0081] Further, the projection of the heat exchange hole 29 along the Z-axis direction (ie, the first direction) surrounds the projection of the magnetic device 40 along the Z-axis direction (ie, the first direction).

[0082] exist Figure 2 , Figure 3 and Figure 4In the illustrated embodiment, the projection of the heat exchange hole 29 along the Z-axis direction also surrounds the projection of the power device 30 along the Z-axis direction. Exemplarily, the heat exchange hole 29 is in a rectangular ring shape. The heat exchange hole 29 includes a first section 291, a second section 292 and two third sections 293. In the X-axis direction, the second section 292 is opposite to the first section 291 and is arranged at intervals, and the two third sections 293 are both connected to the first section 291 and the second section 292. In the Y-axis direction, the two third sections 293 are opposite to each other and are arranged at intervals. The first section 291 extends from the first surface 26 to the second surface 27 after successively penetrating the second conductive layer 23 and the heat exchange layer 21 along the Z-axis direction. The second section 292 and the two third sections 293 extend from the first surface 26 to the second surface 27 after penetrating the heat exchange layer 21 along the Z-axis direction.

[0083] The metal cover 50 has an opening 50a. The metal cover 50 includes a connecting portion 51 and a fixing portion 52. In the Z-axis direction, the fixing portion 52 is fixedly connected to one side of the connecting portion 51. In the Z-axis direction, the connecting portion 51 is arranged opposite to the opening 50a of the metal cover 50, and the fixing portion 52 surrounds the opening 50a of the metal cover 50. Exemplarily, the shape of the fixing portion 52 is adapted to the shape of the heat exchange hole 29. Specifically, the fixing portion 52 is a rectangular ring. In some other embodiments, the shape of the fixing portion 52 and the shape of the heat exchange hole 29 may also be a circular ring, a triangular ring or other special-shaped ring. In the Z-axis direction, the connecting portion 51 is located on the side of the power device 30 facing away from the circuit board 20 and is spaced from the power device 30, and is located on the side of the magnetic device 40 facing away from the circuit board 20 and is spaced from the magnetic device 40. The fixing portion 52 is partially inserted into the heat exchange hole 29 and contacts and is fixedly connected to the heat exchange layer 21. And the fixing portion 52 contacts and is fixedly connected and electrically connected to the second conductive layer 23. The fixing portion 52 surrounds the power device 30 and is spaced apart from the power device 30, and surrounds the magnetic device 40 and is spaced apart from the magnetic device 40. The matching hole 501 penetrates the fixing portion 52 along the Y-axis direction. In some other embodiments, the matching hole 501 may also penetrate the fixing portion 52 along the X-axis direction, and the matching hole 501 may also penetrate the connecting portion 51 along the Z-axis direction.

[0084] The design that the metal cover 50 is partially inserted into the heat exchange hole 29 and is in contact with and fixedly connected to the heat exchange layer 21, the metal cover 50 is fixedly connected to the circuit board 20 by inserting into the heat exchange hole 29, the structure is simple and stable, easy to design, and can avoid setting additional mounting devices between the metal cover 50 and the circuit board 20, which is beneficial to reducing the processing cost of the photovoltaic optimizer 100. In addition, if additional mounting devices are set between the metal cover 50 and the circuit board 20, due to the requirements of safety regulations, the circuit board 20 cannot be wired around the mounting devices; the design that the metal cover 50 is partially inserted into the heat exchange hole 29 and is in contact with and fixedly connected to the heat exchange layer 21 is also beneficial to improving the utilization rate of the board area occupied by the circuit board 20, reducing the area of ​​the circuit board 20, and miniaturizing the circuit board 20 and the photovoltaic optimizer 100. In addition, the design in which the metal cover 50 is partially inserted into the heat exchange hole 29 and contacts and is fixedly connected to the heat exchange layer 21 is beneficial to reducing the thermal resistance between the metal cover 50 and the heat exchange layer 21, and is beneficial to increasing the efficiency of transferring the heat generated by the power device 30 during operation to the metal cover 50 through the heat exchange layer 21, and is beneficial to improving the heat dissipation efficiency of the power device 30.

[0085] The heat exchange hole 29 also penetrates the second conductive layer 23 along the Z-axis direction (i.e., the first direction). The metal cover 50 is fixedly connected and electrically connected to the second conductive layer 23. The metal cover 50 only needs to be inserted into the heat exchange hole 29 to exchange heat with the heat exchange layer 21 and to be electrically connected to the second conductive layer 23. The structure is simple and easy to design, which is conducive to simplifying the structure of the photovoltaic optimizer 100 and reducing the processing cost of the photovoltaic optimizer 100.

[0086] In addition, the design that the projection of the heat exchange hole 29 along the Z-axis direction (i.e., the first direction) surrounds the projection of the magnetic device 40 along the Z-axis direction (i.e., the first direction) is conducive to increasing the heat exchange area between the heat exchange layer 21 and the metal cover 50, and is conducive to improving the efficiency of heat exchange between the metal cover 50 and the heat exchange layer 21, and is conducive to improving the efficiency of heat generated by the power device 30 when working. The heat is transferred to the metal cover 50 through the heat exchange layer 21, which is conducive to improving the heat dissipation efficiency of the power device 30. In some other embodiments, the projection of the heat exchange hole 29 along the Z-axis direction may not surround the projection of the magnetic device 40 along the Z-axis direction. For example, the heat exchange hole 29 is a rectangular hole, and the number of heat exchange holes 29 can be multiple, and the multiple heat exchange holes 29 are arranged in sequence around the power device 30 and the magnetic device 40. In the Z-axis direction, the end surface of the fixing portion 52 facing away from the connecting portion 51 can also be provided with a plurality of protrusions, and the plurality of protrusions are inserted into the plurality of heat exchange holes 29 one by one and are all in contact with and fixedly connected to the heat exchange layer 21.

[0087] In some embodiments, the circuit board 20 is further provided with a mounting hole 29a, and the mounting hole 29a penetrates the circuit board 20 and the second conductive layer 23 along the Z-axis direction (i.e., the first direction). The capacitor 60 includes a first capacitor pin 61. The first capacitor pin 61 is inserted into the second conductive layer 23 and is fixedly connected and electrically connected to the second conductive layer 23 by means including but not limited to welding or crimping. Among them, the first capacitor pin 61 is in contact with the second conductive layer 23. The capacitor 60 can be grounded or electrically connected to other circuits on the circuit board 20, and the capacitor 60 has a stable potential. The capacitor 60 can provide a stable potential for the metal cover 50 through the second conductive layer 23, which is conducive to improving the effect of the metal cover 50 on the electromagnetic shielding of the magnetic device 40. Moreover, the design that the first capacitor pin 61 is inserted into the mounting hole 29a and is fixedly connected and electrically connected to the second conductive layer 23 has a simple and stable structure, is easy to design, and is conducive to reducing the processing cost of the photovoltaic optimizer 100.

[0088] Furthermore, the capacitor 60 further includes a second capacitor pin 62, which is fixedly and electrically connected to the fourth conductive layer 23b. For details, please refer to the manner in which the first capacitor pin 61 is fixedly and electrically connected to the second conductive layer 23, which will not be described in detail.

[0089] exist Figure 2 , Figure 3 and Figure 4 In the illustrated embodiment, the capacitor 60 further includes a capacitor body 63, and in the Z-axis direction, the capacitor body 63 is fixedly connected to one side of the first capacitor pin 61 and the second capacitor pin 62. The capacitor body 63 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27. Exemplarily, the number of mounting holes 29a and the number of first capacitor pins 61 are both 1. In some other embodiments, the number of mounting holes 29a and the number of first capacitor pins 61 can also be multiple, such as 2, 3 or more. Multiple mounting holes 29a correspond one to one with multiple first capacitor pins 61.

[0090] In the Z-axis direction, the capacitor body 63 is fixedly connected to one side of the first capacitor pin 61, which ensures that the capacitor body 63 can cover the first capacitor pin 61, which is beneficial to reducing the board area occupied by the capacitor 60, reducing the area of ​​the circuit board 20, and facilitating the miniaturization design of the photovoltaic optimizer 100.

[0091] Moreover, the capacitor body 63 contacts and is fixedly connected to the side of the first surface 26 facing away from the second surface 27, and the circuit board 20 can support the capacitor body 63, which is beneficial to improve the stability of the first capacitor pin 61 and the mounting hole 29a, and is beneficial to improve the stability of the electrical connection between the capacitor 60 and the second conductive layer 23, and is beneficial to improve the stability of the electromagnetic shielding of the magnetic device 40 by the metal cover 50. In some other embodiments, the capacitor body 63 can also be spaced apart from the first surface 26.

[0092] See also Figure 5 , and combined with Figure 2 , Figure 5 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0093] like Figure 2 and Figure 5 As shown, Figure 5 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the matching relationship between the power device 30 and the metal cover 50 is different. Figure 5 In the illustrated embodiment, in the Z-axis direction (i.e., the first direction), a first thermally conductive material 80 is further provided between the power device 30 and the metal cover 50, and the first thermally conductive material 80 is in contact with and fixedly connected to the power device 30 and the metal cover 50. Specifically, the first thermally conductive material 80 is in contact with and fixedly connected between the connecting portion 51 and the power body 33. The thermal conductivity of the first thermally conductive material 80 is greater than the thermal conductivity of the potting compound 70. Exemplarily, the first thermally conductive material 80 can be made of metal materials including but not limited to solder, sintered copper or sintered silver, or other materials with good thermal conductivity.

[0094] The design that the first heat conductive material 80 is in contact with and fixedly connected to the power device 30 and the metal cover 50 respectively, and the power device 30 and the metal cover 50 are fixed by the first heat conductive material 80, is conducive to improving the structural stability and reliability of the photovoltaic optimizer 100. The heat generated by the power device 30 when working can not only be transferred to the metal cover 50 through the heat exchange layer 21 and then to the external environment, but also be transferred to the metal cover 50 through the first heat conductive material 80 and then to the external environment. The design that the thermal conductivity of the first heat conductive material 80 is greater than the thermal conductivity of the potting glue 70 is conducive to reducing the thermal resistance between the power device 30 and the metal cover 50, and is conducive to improving the efficiency of transferring the heat generated by the power device 30 when working to the metal cover 50 through the first heat conductive material 80, and is conducive to improving the heat dissipation efficiency of the power device 30.

[0095] exist Figure 5In the illustrated embodiment, in the Z-axis direction, the spacing d1 between the second end surface 431 and the first surface 26 is less than or equal to the spacing d2 between the first end surface 331 and the first surface 26. Specifically, in the Z-axis direction, the spacing d1 between the second end surface 431 and the first surface 26 is equal to the spacing d2 between the first end surface 331 and the first surface 26. Such a design is conducive to reducing the thickness of the first thermal conductive material 80 (i.e., the size of the first thermal conductive material 80 in the Z-axis direction), improving the structural stability of the first thermal conductive material 80, reducing the material cost of the first thermal conductive material 80, and reducing the processing cost of the photovoltaic optimizer 100.

[0096] See also Figure 6 , and combined with Figure 2 , Figure 6 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0097] like Figure 2 and Figure 6 As shown, Figure 6 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the metal cover 50 has a different matching relationship with the heat exchange layer 21 and the second conductive layer 23, the power device 30 has a different matching relationship with the heat exchange layer 21 and the first conductive layer 22, the magnetic device 40 has a different matching relationship with the first conductive layer 22 and the third conductive layer 23a, and the capacitor 60 has a different matching relationship with the second conductive layer 23 and the fourth conductive layer 23b. Figure 6 In the illustrated embodiment, the heat exchange hole 29 penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction, and the heat exchange hole 29 also penetrates the second conductive layer 23 along the Z-axis direction. The fixing portion 52 contacts and is fixedly connected to the circuit board 20 and covers the heat exchange hole 29 by means including but not limited to welding or crimping. Specifically, the fixing portion 52 contacts and is fixedly connected to the first surface 26. A heat exchange material 294 is provided in the heat exchange hole 29, and specifically, the heat exchange material 294 is filled in the heat exchange hole 29. In some other embodiments, the heat exchange material 294 may also cover the hole wall of the heat exchange hole 29. The heat exchange material 294 contacts and is fixedly connected to the fixing portion 52 and the heat exchange layer 21. The metal cover 50 is fixedly connected to the heat exchange layer 21 through the heat exchange material 294. The heat exchange material 294 also contacts and is fixedly connected to the second conductive layer 23 and is electrically connected. The metal cover 50 is electrically connected to the heat exchange layer 21 through the heat exchange material 294. The thermal conductivity of the heat exchange material 294 is greater than the thermal conductivity of the potting glue 70. For example, the heat exchange material 294 can be made of metal materials such as copper, aluminum, or copper-aluminum alloy, or other materials with good electrical and thermal conductivity.

[0098] The design that the fixing portion 52 is in contact with and fixedly connected to the circuit board 20 is not only simple and stable in structure and easy to design, but also avoids the need to set up additional mounting devices between the metal cover 50 and the circuit board 20, which is beneficial to reducing the processing cost of the photovoltaic optimizer 100. In addition, if an additional mounting device is set up between the metal cover 50 and the circuit board 20, the circuit board 20 cannot be wired around the mounting device due to safety regulations; the design that the fixing portion 52 is in contact with and fixedly connected to the circuit board 20 is also beneficial to improving the utilization rate of the board area occupied by the circuit board 20, reducing the area of ​​the circuit board 20, and miniaturizing the circuit board 20 and the photovoltaic optimizer 100.

[0099] The heat transferred from the power device 30 to the heat exchange layer 21 can be transferred to the metal cover 50 through the heat exchange material 294 in the heat exchange hole 29, and then transferred to the external environment through the metal cover 50, so as to achieve heat dissipation of the power device 30. The metal cover 50 and the heat exchange layer 21 have various heat exchange modes, which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and reducing the processing cost of the photovoltaic optimizer 100. The design that the thermal conductivity of the heat exchange material 294 is greater than the thermal conductivity of the potting glue 70 is conducive to reducing the thermal resistance between the metal cover 50 and the heat exchange layer 21, and is conducive to increasing the efficiency of the heat generated by the power device 30 when working, which is transferred from the heat exchange layer 21 to the metal cover 50 through the heat exchange material 294, and is conducive to improving the heat dissipation efficiency of the power device 30.

[0100] exist Figure 6 In the illustrated embodiment, the power device 30 only includes a power body 33, that is, the first pin 31 and the second pin 32 can be omitted. The power device 30 contacts and is fixedly connected to the surface of the circuit board 20 in the Z-axis direction (i.e., the first direction). Specifically, the power body 33 contacts and is fixedly connected to the first surface 26. The power device 30 covers the first through hole 24 and the second through hole 25. A second thermally conductive material 241 is provided in the first through hole 24. Specifically, the second thermally conductive material 241 is filled in the first through hole 24. In some other embodiments, the second thermally conductive material 241 may also cover the hole wall of the first through hole 24. The second thermally conductive material 241 is fixedly connected to the power device 30 and the heat exchange layer 21, and is electrically connected to the power device 30 and the heat exchange layer 21. The thermal conductivity of the second thermally conductive material 241 is greater than the thermal conductivity of the potting glue 70. The power device 30 is fixedly connected and electrically connected to the heat exchange layer 21 through the second thermally conductive material 241. The second heat-conducting material 241 can be made of metal materials such as copper, aluminum, or copper-aluminum alloy, or other materials with good thermal conductivity.

[0101] The heat generated by the power device 30 during operation can also be transferred to the heat exchange layer 21 through the second heat conductive material 241. There are various ways for the power device 30 to exchange heat with the heat exchange layer 21. A suitable way can be selected according to the structure of the power device 30, which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and reducing the processing cost of the photovoltaic optimizer 100. Moreover, the design that the thermal conductivity of the second heat conductive material 241 is greater than the thermal conductivity of the potting glue 70 is conducive to improving the efficiency of the heat generated by the power device 30 during operation being transferred to the heat exchange layer 21 through the second heat conductive material 241, and is conducive to improving the heat dissipation efficiency of the power device 30.

[0102] exist Figure 6 In the illustrated embodiment, the magnetic device 40 only includes a device body 43, that is, the first device pin 41 and the second device pin 42 can be omitted. The magnetic device 40 contacts and is fixedly connected to the surface of the circuit board 20 in the Z-axis direction (i.e., the first direction). Specifically, the device body 43 contacts and is fixedly connected to the first surface 26. The magnetic device 40 covers the third through hole 28. The second through hole 25 and the third through hole 28 are both provided with an electrical material 20a, and the electrical material 20a in the second through hole 25 is fixedly connected and electrically connected to the power body 33 (i.e., the power device 30) and the first conductive layer 22, and the electrical material 20a in the third through hole 28 is fixedly connected and electrically connected to the device body 43 (i.e., the magnetic device 40) and the first conductive layer 22. For details, please refer to the relevant description of the second thermal conductive material 241 in the first through hole 24, which will not be repeated. The electrical material 20a can be made of metal materials such as copper, aluminum, or copper-aluminum alloy, or other materials with good electrical conductivity.

[0103] The power device 30 is fixedly connected and electrically connected to the first conductive layer 22 through the electrical material 20a in the second through hole 25. The magnetic device 40 is fixedly connected and electrically connected to the first conductive layer 22 through the electrical material 20a in the third through hole 28. There are various ways to electrically connect the power device 30 (magnetic device 40) to the first conductive layer 22. A suitable way can be selected according to the structure of the power device 30 (magnetic device 40), which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and the processing cost of the photovoltaic optimizer 100. The way in which the magnetic device 40 is fixedly connected and electrically connected to the third conductive layer 23a can refer to the relevant description of the fixed connection and electrical connection of the magnetic device 40 to the first conductive layer 22, and will not be repeated.

[0104] exist Figure 6In the illustrated embodiment, the capacitor 60 only includes a capacitor body 63, that is, the first capacitor pin 61 and the second capacitor pin 62 can be omitted. The capacitor 60 is in contact with and fixedly connected to the surface of the circuit board 20 in the Z-axis direction (i.e., the first direction). Specifically, the capacitor body 63 is in contact with and fixedly connected to the first surface 26. The capacitor body 63 covers the mounting hole 29a. A conductive material 295 is provided in the mounting hole 29a, and the conductive material 295 is fixedly connected and electrically connected to the capacitor 60 and the second conductive layer 23, respectively. For details, please refer to the relevant description of the second thermally conductive material 241 in the first through hole 24, which will not be repeated here. The conductive material 295 can be made of metal materials such as copper, aluminum, or copper-aluminum alloy, or other materials with good conductive properties.

[0105] The capacitor 60 can also be fixedly connected and electrically connected to the second conductive layer 23 through the conductive material 295. There are various ways to electrically connect the capacitor 60 to the second conductive layer 23. A suitable way can be selected according to the structure of the capacitor 60, which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and the processing cost of the photovoltaic optimizer 100. The way in which the capacitor 60 is fixedly connected and electrically connected to the fourth conductive layer 23b can refer to the relevant description of the fixed connection and electrical connection of the capacitor 60 to the second conductive layer 23, and will not be repeated.

[0106] Understandably, Figure 6 In the embodiment shown, the design that the power device 30 is fixedly connected and electrically connected to the heat exchange layer 21 through the second heat conductive material 241, the design that the power device 30 and the magnetic device 40 are fixedly connected and electrically connected to the first conductive layer 22 through the electrical material 20a, and the design that the capacitor 60 is fixedly connected and electrically connected to the second conductive layer 23 through the conductive material 295 can be applied to Figure 1-Figure 5 In any of the embodiments shown.

[0107] See also Figure 7 , and combined with Figure 2 , Figure 7 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0108] like Figure 2 and Figure 7 As shown, Figure 7 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the matching relationship between the metal cover 50 and the circuit board 20 is different. Figure 7In the illustrated embodiment, the circuit board 20 is provided with a heat exchange hole 29, and the heat exchange hole 29 penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction (i.e., the first direction). And the heat exchange hole 29 can also penetrate the second conductive layer 23 along the Z-axis direction (i.e., the first direction). Exemplarily, the number of heat exchange holes 29 is multiple, and the multiple heat exchange holes 29 include a first heat exchange hole 29c and a second heat exchange hole 29d. The first heat exchange hole 29c penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction. Specifically, the first heat exchange hole 29c penetrates the heat exchange layer 21 from the first surface 26 along the Z-axis direction and then extends to the second surface 27. The second heat exchange hole 29d penetrates the circuit board 20, the second conductive layer 23 and the heat exchange layer 21 along the Z-axis direction. Specifically, the second heat exchange hole 29d penetrates the second conductive layer 23 and the heat exchange layer 21 from the first surface 26 in sequence along the Z-axis direction and then extends to the second surface 27.

[0109] exist Figure 7 In the embodiment shown, the metal cover 50 includes a connecting portion 51, a fixing portion 52 and a mounting portion 53. The matching relationship between the connecting portion 51 and the fixing portion 52 can be referred to in Figure 2 The relevant description of the illustrated embodiment is omitted. The mounting portion 53 is arranged outside the fixing portion 52, and the mounting portion 53 faces away from the opening 50a of the metal cover 50. The mounting portion 53 surrounds the opening 50a of the metal cover 50. The fixing portion 52 contacts the circuit board 20. Specifically, the fixing portion 52 contacts the first surface 26 (i.e., the surface of the circuit board 20 in the first direction). The mounting portion 53 contacts the circuit board 20 and covers the heat exchange hole 29. Specifically, the mounting portion 53 contacts the first surface 26.

[0110] The metal cover 50 is further provided with a connection hole 531, which penetrates the mounting portion 53 along the Z-axis direction (i.e., the first direction) and is directly connected to the heat exchange hole 29. Exemplarily, the number of the connection holes 531 is multiple, and specifically, the number of the connection holes 531 is two, and the two connection holes 531 are directly connected to the first heat exchange hole 29c and the second heat exchange hole 29d, respectively.

[0111] The photovoltaic optimizer 100 also includes a fastener 90, which connects the connection hole 531 and the heat exchange hole 29 and is used to fix the metal cover 50 to the circuit board 20. Specifically, the fastener 90 is installed in the connection hole 531 and the heat exchange hole 29, and abuts against the side of the mounting portion 53 facing away from the circuit board 20. The fastener 90 contacts the heat exchange layer 21. The fastener 90 is electrically connected to the heat exchange layer 21. And the fastener 90 can also contact and electrically connect with the second conductive layer 23. Specifically, the number of fasteners 90 is multiple, and the multiple fasteners 90 include a first fastener 90a and a second fastener 90b. The first fastener 90a is installed in the corresponding connected connection hole 531 and the first heat exchange hole 29c and abuts against the side of the mounting portion 53 facing away from the circuit board 20, and the first fastener 90a contacts and electrically connects with the heat exchange layer 21. The second fastener 90b is installed in the corresponding connected connection hole 531 and the second heat exchange hole 29d and abuts against the side of the mounting portion 53 facing away from the circuit board 20. The second fastener 90b contacts and is electrically connected to the heat exchange layer 21, and the second fastener 90b contacts and is electrically connected to the second conductive layer 23.

[0112] The heat generated by the power device 30 when working can be transferred to the fastener 90 (the first fastener 90a and the second fastener 90b) through the heat exchange layer 21, and then transferred to the metal cover 50 through the fastener 90 (the first fastener 90a and the second fastener 90b). The heat generated by the power device 30 when working can be transferred to the external environment through the fastener 90 and the metal cover 50 to achieve heat dissipation of the power device 30. The metal cover 50 is fixedly connected to the circuit board 20 through the fastener 90 (the first fastener 90a and the second fastener 90b), and the structure is simple and stable, easy to design, and is conducive to reducing the processing cost of the photovoltaic optimizer 100.

[0113] The fastener 90 (i.e., the second fastener 90b) is in contact with and electrically connected to the second conductive layer 23, and the metal cover 50 is electrically connected to the second conductive layer 23 through the fastener 90 (the second fastener 90b). There are various ways to electrically connect the metal cover 50 to the second conductive layer 23, which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and reducing the processing cost of the photovoltaic optimizer 100.

[0114] exist Figure 7 In the illustrated embodiment, the connection holes 531, the heat exchange holes 29, and the fasteners 90 correspond to each other, and the number of the connection holes 531, the number of the heat exchange holes 29, and the number of the fasteners 90 are all 2. In other embodiments, the number of the connection holes 531, the number of the heat exchange holes 29, and the number of the fasteners 90 may also be 1, 3, or more.

[0115] Understandably, Figure 7The design in which the metal cover 50 is mounted on the circuit board 20 by the fastener 90 in the embodiment shown can be applied to Figure 1-Figure 6 In any of the embodiments shown.

[0116] See also Figure 8 , and combined with Figure 2 , Figure 8 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0117] like Figure 2 and Figure 8 As shown, Figure 8 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the structure of the metal cover 50 is different. Figure 8 In the illustrated embodiment, the metal cover 50 is further provided with heat dissipation fins 54, which are located on the outer surface of the metal cover 50 facing away from the magnetic device 40. Exemplarily, the number of heat dissipation fins 54 may be multiple, and in the positive direction of the X-axis, a portion of the heat dissipation fins 54 may be fixedly connected to the surface of the fixing portion 52 facing away from the magnetic device 40. In the negative direction of the X-axis, another portion of the heat dissipation fins 54 may be fixedly connected to the surface of the fixing portion 52 facing away from the magnetic device 40. In some other embodiments, in the Z-axis direction, the heat dissipation fins 54 may also be fixedly connected to the surface of the connecting portion 51 facing away from the magnetic device 40. The design of the heat dissipation fins 54 is conducive to increasing the heat dissipation area of ​​the metal cover 50, and is conducive to improving the efficiency of transferring the heat generated by the power device 30 during operation to the external environment through the metal cover 50, and is conducive to improving the heat dissipation efficiency of the power device 30.

[0118] Understandably, Figure 8 In the embodiment shown, the metal cover 50 is provided with the heat dissipation fins 54, which can be applied to Figure 1-Figure 7 In any of the embodiments shown.

[0119] See also Fig. 9 , and combined with Figure 2 , Fig. 9 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0120] like Figure 2 and Fig. 9 As shown, Fig. 9 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the structure of the metal cover 50 is different. Fig. 9In the illustrated embodiment, in the Z-axis direction (i.e., the first direction), the distance d1 between the second end surface 431 and the first surface 26 (i.e., the maximum distance between the magnetic device 40 and the circuit board 20) is greater than the distance d2 between the first end surface 331 and the first surface 26 (i.e., the maximum distance between the power device 30 and the circuit board 20). The portion of the metal cover 50 that is opposite to the power device 30 is concave toward the circuit board 20.

[0121] Specifically, the metal cover 50 includes a connecting portion 51 and a fixing portion 52. In the Z-axis direction, the fixing portion 52 is fixedly connected to one side of the connecting portion 51. In the Z-axis direction (i.e., the first direction), the connecting portion 51 is arranged opposite to the opening 50a of the metal cover 50. The fixing portion 52 surrounds the opening 50a of the metal cover 50. In the Z-axis direction (i.e., the first direction), the connecting portion 51 is located on the side of the magnetic device 40 and the power device 30 facing away from the circuit board 20, and the connecting portion 51 is spaced apart from the power device 30 and the magnetic device 40, respectively. The fixing portion 52 is fixedly connected to the heat exchange layer 21 and is electrically connected to the second conductive layer 23. The fixing portion 52 surrounds the power device 30 and is spaced apart from the power device 30, and surrounds the magnetic device 40 and is spaced apart from the magnetic device 40. For details, please refer to Figure 2 The relevant description of the illustrated embodiment will not be repeated here.

[0122] exist Fig. 9 In the illustrated embodiment, the connection portion 51 includes a first connection portion 511, a second connection portion 512, and a third connection portion 513. In the Z-axis direction (i.e., the first direction), the first connection portion 511 and the second connection portion 512 are offset and spaced apart. In the Z-axis direction, the first connection portion 511 is located on one side of the second connection portion 512 and spaced apart from the second connection portion 512. The third connection portion 513 is fixedly connected between the first connection portion 511 and the second connection portion 512. In the Z-axis direction (i.e., the first direction), the first connection portion 511 is disposed opposite to the power device 30, and specifically, the projection of the first connection portion 511 along the Z-axis direction overlaps with the projection of the power device 30 along the Z-axis direction. In the Z-axis direction (i.e., the first direction), the second connection portion 512 is disposed opposite to the magnetic device 40, and specifically, the projection of the second connection portion 512 along the Z-axis direction overlaps with the projection of the magnetic device 40 along the Z-axis direction. In the Z-axis direction (ie, the first direction), the distance between the first connecting portion 511 and the circuit board 20 is smaller than the distance between the second end surface 431 and the first surface 26 (ie, the maximum distance between the magnetic device 40 and the circuit board 20 ) d1.

[0123] In the Z-axis direction (i.e., the first direction), the maximum distance d1 between the magnetic device 40 and the circuit board 20 is greater than the maximum distance d1 between the power device 30 and the circuit board 20. The design of the portion of the metal cover 50 opposite to the power device 30 (i.e., the first connecting portion 511) being concave toward the circuit board 20 can make the distance between the first connecting portion 511 and the circuit board 20 smaller than the maximum distance d1 between the magnetic device 40 and the circuit board 20, which is beneficial to reducing the distance between the first connecting portion 511 and the circuit board 20. The metal cover 50 can be adaptively designed according to the thickness of the power device 30 and the thickness of the magnetic device 40 to avoid excessive space between the power device 30 and the first connecting portion 511, and to avoid excessive space between the portion of the metal cover 50 opposite to the power device 30 (i.e., the first connecting portion 511) and the power device 30, which is beneficial to improving the space utilization of the metal cover 50, and is beneficial to improving the strength of the metal cover 50 and the structural stability of the metal cover 50.

[0124] Understandably, Fig. 9 In the embodiment shown, the design that the portion of the metal cover 50 opposite to the power device 30 is concave toward the circuit board 20 can be applied to Figure 1-Figure 8 In any of the embodiments shown.

[0125] See also Fig.10 , and combined with Figure 2 , Fig.10 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0126] like Figure 2 and Fig.10 As shown, Fig.10 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the matching relationship between the power device 30 and the circuit board 20 is different. Fig.10 In the illustrated embodiment, the power device 30 is fixedly connected to the side of the circuit board 20 facing away from the magnetic device 40. Specifically, the power body 33 contacts and is fixedly connected to the side of the second surface 27 facing away from the first surface 26, the first pin 31 is inserted into the first through hole 24 and contacts and is fixedly connected to the heat exchange layer 21, and the second pin 32 is inserted into the second through hole 25 and is fixedly connected and electrically connected to the first conductive layer 22. The projection of the power device 30 along the Z-axis direction (i.e., the first direction) overlaps with the projection of the metal cover 50 along the Z-axis direction (i.e., the first direction).

[0127] The power device 30 is fixedly connected to the side of the circuit board 20 facing away from the magnetic device 40. The design in which the projection of the power device 30 along the Z-axis direction (i.e., the first direction) overlaps with the projection of the metal cover 50 along the Z-axis direction (i.e., the first direction) is beneficial to improving the utilization rate of the board area occupied by the circuit board 20, reducing the area of ​​the circuit board 20, and facilitating the miniaturization design of the photovoltaic optimizer 100.

[0128] Understandably, Fig.10 The design in which the power device 30 is fixedly connected to the side of the circuit board 20 facing away from the magnetic device 40 in the embodiment shown can be applied to Figure 1-Figure 4 , Figure 6 , Figure 7 and Figure 8 In any of the embodiments shown.

[0129] See also Fig.11 , and combined with Figure 2 , Fig.11 Schematic diagram of the structure of another photovoltaic optimizer 100 provided in an embodiment of the present application.

[0130] like Figure 2 and Fig.11 As shown, Fig.11 The embodiment shown and Figure 2 The structures of the embodiments shown are similar, and the difference between the two is that the positional relationship between the second conductive layer 23 and the heat exchange layer 21 is different, and the matching relationship between the metal cover 50 and the second conductive layer 23 and the heat exchange layer 21 is different. Fig.11 In the illustrated embodiment, the projection of the second conductive layer 23 along the Z-axis direction is spaced from the projection of the heat exchange layer 21 along the Z-axis direction. Specifically, in the X-axis direction, the second conductive layer 23 is located on the side of the heat exchange layer 21 facing away from the first conductive layer 22 and is spaced from the heat exchange layer 21. The heat exchange hole 29 penetrates the circuit board 20 and the heat exchange layer 21 along the Z-axis direction. The fixing portion 52 is partially inserted into the heat exchange hole 29 and contacts and is fixedly connected to the heat exchange layer 21, and is electrically connected to the heat exchange layer 21. Among them, the heat exchange hole 29 does not penetrate the second conductive layer 23 along the Z-axis direction.

[0131] exist Fig.11In the illustrated embodiment, the circuit board 20 is further provided with a fixing hole 29e, and the fixing hole 29e penetrates the circuit board 20 and the second conductive layer 23 along the Z-axis direction. The metal cover 50 is further provided with a plug-in protrusion 55, and the plug-in protrusion 55 is located on the outer surface of the metal cover 50. Specifically, the plug-in protrusion 55 is fixedly connected to the surface of the fixing portion 52 facing away from the opening 50a of the metal cover 50. The plug-in protrusion 55 is partially inserted into the fixing hole 29e and is fixedly connected and electrically connected to the second conductive layer 23. By plugging the plug-in protrusion 55 into the fixing hole 29e, the metal cover 50 can also be fixedly connected and electrically connected to the second conductive layer 23. There are various ways to fix and electrically connect the metal cover 50 to the second conductive layer 23, which is conducive to reducing the design difficulty of the photovoltaic optimizer 100 and reducing the processing cost of the photovoltaic optimizer 100.

[0132] Understandably, Fig.11 The design in which the metal cover 50 is fixedly connected and electrically connected to the second conductive layer 23 by means of the insertion protrusion 55 inserted into the fixing hole 29e in the illustrated embodiment can be applied to Figure 1-Figure 10 In any of the embodiments shown.

Claims

1. A photovoltaic optimizer, characterized in that: The photovoltaic optimizer comprises: a housing, a circuit board, a power device, a magnetic device and a metal cover, wherein the circuit board, the power device, the magnetic device and the metal cover are all accommodated in the housing; The circuit board is embedded with a heat exchange layer and a first conductive layer, and the heat exchange layer and the first conductive layer are spaced apart; In a first direction, the power device is fixedly connected to one side of the circuit board, and is fixedly connected to the heat exchange layer and electrically connected to the first conductive layer, and the first direction is the thickness direction of the circuit board; In the first direction, the magnetic device and the metal cover are both fixedly connected to one side of the circuit board, the magnetic device is electrically connected to the first conductive layer, and the metal cover covers the magnetic device and is fixedly and electrically connected to the heat exchange layer; The shell and the metal cover are both filled with potting glue, and the potting glue covers the circuit board, the power device, the magnetic device and the metal cover.

2. The photovoltaic optimizer according to claim 1, characterized in that: The circuit board is further provided with a heat exchange hole, the heat exchange hole penetrates the circuit board and the heat exchange layer along the first direction, the metal cover comprises a mounting portion, the mounting portion surrounds the opening of the metal cover, the mounting portion contacts the circuit board and covers the heat exchange hole; The metal cover is also provided with a connecting hole, which passes through the mounting portion along the first direction and is directly connected to the heat exchange hole; the photovoltaic optimizer also includes a fastener, which connects the connecting hole and the heat exchange hole and is used to fix the metal cover to the circuit board, and the fastener is in contact with the heat exchange layer.

3. The photovoltaic optimizer according to claim 1, characterized in that: The circuit board is also provided with a heat exchange hole, which penetrates the circuit board and the heat exchange layer along the first direction. The metal cover is partially inserted into the heat exchange hole and contacts and is fixedly connected with the heat exchange layer.

4. The photovoltaic optimizer according to claim 1, characterized in that: The circuit board is further provided with a heat exchange hole, the heat exchange hole penetrates the circuit board and the heat exchange layer along the first direction, the metal cover comprises a fixing portion, the fixing portion surrounds the opening of the metal cover, the fixing portion contacts and is fixedly connected with the circuit board and covers the heat exchange hole; A heat exchange material is provided in the heat exchange hole, the heat exchange material is in contact with and fixedly connected to the fixing portion and the heat exchange layer, and the thermal conductivity of the heat exchange material is greater than the thermal conductivity of the potting glue.

5. The photovoltaic optimizer according to claim 3 or 4, characterized in that: The projection of the heat exchange hole along the first direction surrounds the projection of the magnetic component along the first direction.

6. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The power device is fixedly connected to a side of the circuit board facing the magnetic device, and the metal cover also covers the power device.

7. The photovoltaic optimizer according to claim 6, characterized in that: In the first direction, a first thermally conductive material is provided between the power device and the metal cover. The first thermally conductive material contacts and is fixedly connected to the power device and the metal cover respectively. The thermal conductivity of the first thermally conductive material is greater than that of the potting compound.

8. The photovoltaic optimizer according to claim 6, characterized in that: In the first direction, the maximum distance between the magnetic device and the circuit board is greater than the maximum distance between the power device and the circuit board, and a portion of the metal cover opposite to the power device is concave toward the circuit board.

9. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: In the first direction, the power device is fixedly connected to a side of the circuit board facing away from the magnetic device, and a projection of the power device along the first direction overlaps with a projection of the metal cover along the first direction.

10. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The metal cover is also provided with heat dissipation fins, and the heat dissipation fins are located on the outer surface of the metal cover.

11. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The circuit board is also provided with a first through hole, which penetrates the circuit board and the heat exchange layer along the first direction; the power device includes a first pin, which is inserted into the first through hole and contacts and fixedly connected with the heat exchange layer.

12. The photovoltaic optimizer according to any one of claims 1 to 4, characterized in that: The circuit board is also provided with a first through hole, which penetrates the circuit board and the heat exchange layer along the first direction; the power device is in contact with and fixedly connected to the surface of the circuit board in the first direction, a second heat-conductive material is provided in the first through hole, the second heat-conductive material is fixedly connected to the power device and the heat exchange layer, and the thermal conductivity of the second heat-conductive material is greater than the thermal conductivity of the potting glue.

13. The photovoltaic optimizer according to claim 1, characterized in that: The circuit board is further embedded with a second conductive layer, the second conductive layer is spaced apart from the heat exchange layer and the first conductive layer, and the metal cover is electrically connected to the second conductive layer; The photovoltaic optimizer also includes a capacitor, which is fixedly connected to one side of the circuit board in the first direction. The circuit board is also provided with a mounting hole, which passes through the circuit board and the second conductive layer along the first direction; the capacitor includes a first capacitor pin, which is inserted into the mounting hole and is fixedly and electrically connected to the second conductive layer.

14. The photovoltaic optimizer according to claim 1, characterized in that: The circuit board is further embedded with a second conductive layer, the second conductive layer and the first conductive layer are both spaced apart, and the metal cover is electrically connected to the second conductive layer; The photovoltaic optimizer also includes a capacitor, which is fixedly connected to one side of the circuit board in the first direction, and the circuit board is also provided with a mounting hole, and the mounting hole penetrates the circuit board and the second conductive layer along the first direction; the capacitor is in contact with and fixedly connected to the surface of the circuit board in the first direction, and a conductive material is provided in the mounting hole, and the conductive material is fixedly and electrically connected to the capacitor and the second conductive layer respectively.

15. The photovoltaic optimizer according to claim 13 or 14, characterized in that: The circuit board is also provided with a fixing hole, which passes through the circuit board and the second conductive layer along the first direction. The metal cover is also provided with an inserting protrusion, which is located on the outer surface of the metal cover. The inserting protrusion is partially inserted into the fixing hole and is fixedly connected and electrically connected to the second conductive layer.

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