Wireless communication frequency modulation system based on high RF transceiver chip

Abstract

The present invention relates to the field of wireless communication technology for transceiver chips, and specifically discloses a wireless communication frequency modulation system based on a high-frequency transceiver chip. The system sets an environmental monitoring module, a communication detection module and a chip communication module in the chip area, monitors the environment of the working area to which the chip belongs, and finds adverse factors that may affect the stability of communication. The wireless communication frequency modulation system adopts corresponding frequency modulation strategies to ensure the stability and reliability of the chip's communication in the current environment, analyzes the chip's communication signal data, captures abnormal fluctuations in the chip's communication signal, adjusts the wireless communication strategy, and monitors the attribute data of the wireless communication signal in real time. When the signal attribute data is found to be abnormal, the communication frequency modulation system can respond quickly and issue an early warning prompt for the communication signal sent by the receiving chip, thereby avoiding data loss caused by unstable wireless communication transmission signals and improving the overall stability of the wireless communication of the communication high-frequency transceiver chip.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless communication of transceiver chips, and in particular to a wireless communication frequency modulation system based on a high-frequency transceiver chip. Background Art

[0002] In the field of wireless communications, with the continuous advancement of technology and the growing application needs, the performance requirements for wireless communication systems are also constantly increasing. Radio frequency technology is the key to achieving high-speed data transmission and ultra-low latency communication, and has gradually become an important part of wireless communication systems. High-frequency transceiver chips, with their high frequency, wide bandwidth and high-speed transmission characteristics, provide strong technical support for wireless communication systems.

[0003] For example, the invention patent with publication number CN118232947A discloses a transceiver RF front-end chip and a transceiver fully integrated chip array, which chip includes: a RF chip and a digital chip; the RF chip includes a first RF transmission link, a second RF transmission link, a common antenna for transmission and reception, and a RF receiving link, the first RF transmission link and the second RF transmission link are respectively connected to the common antenna for transmission and reception, and the RF receiving link is connected to the common antenna for transmission and reception; the digital chip includes a phase-locked loop, a first modulator, a second modulator and an analog-to-digital converter, the phase-locked loop is respectively connected to the first RF transmission link through a first adjuster and to the second RF transmission link through a second modulator, the phase-locked loop is also connected to the RF receiving link, the analog-to-digital converter is connected to the RF receiving link, and performs analog-to-digital conversion on the received signal obtained by the RF receiving link.

[0004] For example, the invention patent with announcement number CN111431584B announces a satellite mobile communication terminal based on a radio frequency transceiver chip module, which belongs to the field of satellite mobile communication technology. The radio frequency transceiver chip module adopts a highly integrated, single-frequency conversion design architecture, and fully integrates a low-noise amplifier, mixer, voltage-controlled oscillator, fractional-frequency phase-locked loop, intermediate frequency filter, variable bandwidth analog-to-digital converter and high-speed digital-to-analog converter. The transceiver interface adopts a serial digital interface with a digital interface, supporting variable bandwidth, multi-modulation mode S-band signal radio frequency transceiver processing.

[0005] However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:

[0006] Currently, the technical solution for wireless communication of RF transceiver chips is mainly to perform complex wireless communication directly through RF transceiver chips. However, due to the propagation range limitation of the wireless signal of the RF transceiver chip, the RF transceiver chip based on this communication makes it difficult to ensure the signal stability and transmission efficiency of the wireless signal in the propagation path, which directly affects the stability and reliability of the communication. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention provides a wireless communication frequency modulation system based on a high-frequency transceiver chip, which can effectively solve the problems involved in the above-mentioned background technology.

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions: a wireless communication frequency modulation system based on a high-frequency transceiver chip, including an environmental monitoring module for the area to which the chip belongs, which is used to monitor and obtain environmental data of the working area to which the high-frequency transceiver chip belongs, analyze the data, obtain the chip environmental impact index, and compare it with the chip environmental impact index boundary value preset in the communication frequency modulation library. If the chip environmental impact index is less than or equal to the chip environmental impact index boundary value preset in the communication frequency modulation library, the high-frequency transceiver chip is subjected to communication quality detection. If the chip environmental impact index is greater than the chip environmental impact index boundary value preset in the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is subjected to frequency modulation once, and the high-frequency transceiver chip after frequency modulation is subjected to communication quality detection.

[0009] The communication detection module is used to obtain the communication signal data of the high-frequency transceiver chip through the process of performing communication quality detection on the high-frequency transceiver chip, obtain the chip communication quality index, and compare it with the chip communication quality index threshold preset by the communication frequency modulation library. If the chip communication quality index is greater than or equal to the chip communication quality index threshold preset by the communication frequency modulation library, the high-frequency transceiver chip is directly recorded as an information receiving chip. If the chip communication quality index is less than the chip communication quality index threshold preset by the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is secondary frequency modulated, and the high-frequency transceiver chip after the secondary frequency modulation is recorded as an information receiving chip.

[0010] The chip communication module is used to send the communication information of each communication device to the target device through the information receiving chip, thereby monitoring and obtaining the corresponding attribute data of the wireless communication signal belonging to the information receiving chip during the communication information sending process, analyzing it, and obtaining the chip sending stability index, and comparing it with the chip sending stability index threshold preset in the communication frequency modulation library, and finally determining whether to issue an early warning prompt for the wireless communication signal of the information receiving chip.

[0011] As a further solution, the chip environmental impact index has a specific analysis process as follows:

[0012] A comprehensive analysis is performed on the humidity, air pressure, electromagnetic interference intensity and radio frequency signal intensity of the working area of ​​the high-frequency transceiver chip at the current time point to obtain the chip environmental impact index.

[0013] As a further solution, the wireless communication signal of the high-frequency transceiver chip is frequency modulated once, and the specific frequency modulation process is:

[0014] The chip environmental impact index is matched with the wireless communication signal primary frequency modulation strategy corresponding to each chip environmental impact index interval preset in the communication frequency modulation library, thereby obtaining the wireless communication signal primary frequency modulation strategy of the high-frequency transceiver chip. Finally, the high-frequency transceiver chip performs primary frequency modulation of the wireless communication signal through the wireless communication signal primary frequency modulation strategy.

[0015] As a further solution, the chip communication quality indicator has a specific analysis process as follows:

[0016] The average communication signal power of the high-frequency transceiver chip communication signal in the communication detection period is processed with the average communication noise power to obtain the average signal-to-noise ratio of the high-frequency transceiver chip communication signal in the communication detection period.

[0017] The average communication signal frequency of the high-frequency transceiver chip communication signal within the communication detection period is processed with the communication signal reference frequency preset in the communication frequency modulation library to obtain the communication signal frequency offset of the high-frequency transceiver chip communication signal within the communication detection period.

[0018] The average communication signal strength, communication signal frequency offset, average signal-to-noise ratio, average signal phase noise power, average communication signal delay time and average RF signal strength of the high-frequency transceiver chip communication signal during the communication detection period are comprehensively analyzed to obtain the chip communication quality index.

[0019] As a further solution, the wireless communication signal of the high-frequency transceiver chip is subjected to secondary frequency modulation, and the specific frequency modulation process is:

[0020] The chip communication quality index threshold and the chip communication quality index are difference processed to obtain the chip communication quality deviation value, and matched with the wireless communication signal secondary frequency modulation method corresponding to the communication quality deviation value interval of each chip preset in the communication frequency modulation library, thereby obtaining the wireless communication signal secondary frequency modulation method of the high-frequency transceiver chip, and finally the high-frequency transceiver chip performs secondary frequency modulation of the wireless communication signal through the wireless communication signal secondary frequency modulation method.

[0021] As a further solution, the chip sends a stability indicator, and the specific analysis process is as follows:

[0022] The average humidity, average air pressure, maximum electromagnetic interference intensity and maximum radio frequency signal intensity of the working area to which the information receiving chip belongs during the information sending time period are obtained, and the chip environmental impact index corresponding to the area to which the information receiving chip belongs is obtained according to the analysis method of the chip environmental impact index.

[0023] The frequency, average transmission power, average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending cycle and the chip environmental impact index corresponding to the area to which the information receiving chip belongs are comprehensively analyzed to obtain the chip sending stability index. The specific analysis method is as follows:

[0024]

[0025] In the formula, Send stability indicators to the chip, is a natural constant, The frequency of the wireless communication signal of the information receiving chip during the information sending cycle, The reference frequency preset for the communication FM library, is the average transmission power of the wireless communication signal of the information receiving chip during the information sending cycle, The transmission reference power preset for the communication FM library, is the average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending cycle, The transmission reference bandwidth preset for the communication FM library, is the chip environmental impact index corresponding to the area to which the information receiving chip belongs, The weight factor corresponding to the chip environmental impact index preset for the communication frequency modulation library.

[0026] As a further solution, the specific analysis process is to determine whether to issue an early warning prompt for the wireless communication signal of the information receiving chip, and the specific determination process is:

[0027] Compare the chip sending stability index with the chip sending stability index threshold preset by the communication frequency modulation library;

[0028] If the chip transmission stability index is less than the chip transmission stability index threshold preset by the communication frequency modulation library, an early warning prompt will be given to the wireless communication signal of the information receiving chip.

[0029] If the chip transmission stability index is greater than or equal to the chip transmission stability index threshold preset by the communication frequency modulation library, there is no need to issue an early warning prompt for the wireless communication signal of the information receiving chip.

[0030] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0031] (1) The present invention monitors and analyzes the environment of the working area of ​​the high-frequency transceiver chip to obtain the chip environmental impact index, and compares it with the chip environmental impact index limit value preset in the communication frequency modulation library, so as to discover the adverse factors that may affect the communication stability. For example, when the ambient temperature is too high or the electromagnetic interference is enhanced, the wireless communication frequency modulation system can adopt corresponding frequency modulation strategies, such as adjusting the transmission power, changing the communication frequency, etc., to ensure the stability and reliability of the communication of the high-frequency transceiver chip in the current environment.

[0032] (2) The present invention can detect and analyze the communication signal data of the high-frequency transceiver chip, capture the abnormal fluctuation of the communication signal of the high-frequency transceiver chip, obtain the chip communication quality index, reflect the communication performance of the chip, and compare it with the chip communication quality index threshold preset by the communication frequency modulation library, so as to adjust the wireless communication strategy in time and ensure the subsequent communication quality of the high-frequency transceiver chip.

[0033] (3) The present invention can accurately evaluate the transmission stability performance of the information receiving chip by real-time monitoring of the attribute data of the wireless communication signal, such as the frequency, transmission power, average transmission bandwidth, etc. of the wireless communication signal. When the signal attribute data is found to be abnormal, the communication frequency modulation system can respond quickly and issue an early warning prompt for the sending communication signal of the receiving chip, thereby effectively avoiding data loss caused by unstable wireless communication transmission signals and improving the overall stability of the wireless communication of the communication high-frequency transceiver chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0035] Figure 1 It is a schematic diagram of system module connection of the present invention. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0037] See also Figure 1 As shown, an embodiment of the present invention provides a technical solution: a wireless communication frequency modulation system based on a high-frequency transceiver chip, including an environmental monitoring module for the area to which the chip belongs, a communication detection module, a chip communication module and a communication frequency modulation library.

[0038] The chip area environment monitoring module is connected to the communication detection module, the communication detection module is connected to the chip communication module, and the communication frequency modulation library is respectively connected to the chip area environment monitoring module, the communication detection module and the chip communication module.

[0039] The chip area environmental monitoring module is used to monitor and obtain environmental data of the working area to which the high-frequency transceiver chip belongs, analyze it, obtain the chip environmental impact index, and compare it with the chip environmental impact index boundary value preset in the communication frequency modulation library. If the chip environmental impact index is less than or equal to the chip environmental impact index boundary value preset in the communication frequency modulation library, the high-frequency transceiver chip is subjected to communication quality detection. If the chip environmental impact index is greater than the chip environmental impact index boundary value preset in the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is frequency modulated once, and the communication quality of the high-frequency transceiver chip after frequency modulation is detected.

[0040] The communication detection module is used to obtain the communication signal data of the high-frequency transceiver chip through the process of performing communication quality detection on the high-frequency transceiver chip, obtain the chip communication quality index, and compare it with the chip communication quality index threshold preset by the communication frequency modulation library. If the chip communication quality index is greater than or equal to the chip communication quality index threshold preset by the communication frequency modulation library, the high-frequency transceiver chip is directly recorded as an information receiving chip. If the chip communication quality index is less than the chip communication quality index threshold preset by the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is secondary frequency modulated, and the high-frequency transceiver chip after the secondary frequency modulation is recorded as an information receiving chip.

[0041] The chip communication module is used to send the communication information of each communication device to the target device through the information receiving chip, thereby monitoring and obtaining the corresponding attribute data of the wireless communication signal belonging to the information receiving chip during the communication information sending process, analyzing it, obtaining the chip sending stability index, and comparing it with the chip sending stability index threshold preset in the communication frequency modulation library, and finally determining whether to issue an early warning prompt for the wireless communication signal of the information receiving chip.

[0042] It should be explained that the above-mentioned communication devices include but are not limited to smart home devices, such as smart door locks, smart cameras, smart light bulbs, etc.; the communication information of the smart camera in the smart home device can be the video data transmitted by the smart camera, whether there are moving objects in the area monitored by the camera, such as online / offline, lens obstruction warning, etc.

[0043] The communication frequency modulation library is used to store preset chip environmental impact index boundary values, preset chip communication quality index thresholds, preset chip transmission stability index thresholds, preset reference humidity corresponding to high radio frequency transceiver chips, preset reference air pressure corresponding to high radio frequency transceiver chips, preset electromagnetic interference reference strength corresponding to high radio frequency transceiver chips, preset radio frequency signal reference strength corresponding to high radio frequency transceiver chips, preset wireless communication signal primary frequency modulation strategies corresponding to each chip environmental impact index interval, preset communication signal reference frequencies, preset communication signal reference strengths, preset communication signal frequency offset reference amounts, library preset reference signal-to-noise ratios, preset signal phase noise reference powers, preset communication signal delay reference durations, preset radio frequency signal reference strengths, preset wireless communication signal secondary frequency modulation methods corresponding to each chip communication quality deviation value interval, preset reference frequencies, preset transmission reference powers, preset transmission reference bandwidths, and preset weight factors corresponding to chip environmental impact indexes.

[0044] Specifically, the environmental data of the working area to which the high-frequency transceiver chip belongs includes humidity, air pressure, electromagnetic interference intensity, and radio frequency signal intensity of the working area to which the high-frequency transceiver chip belongs at a current time point.

[0045] It should be noted that the humidity and air pressure in the working area to which the above-mentioned high-frequency transceiver chip belongs at the current time point are obtained by high-precision environmental monitoring sensors deployed in the environment of the working area to which the high-frequency transceiver chip belongs. The electromagnetic interference intensity can be measured in the working area to which the high-frequency transceiver chip belongs using an electromagnetic field strength meter. The RF signal strength is measured in the working area to which the high-frequency transceiver chip belongs using a RF signal strength meter.

[0046] Specifically, the chip environmental impact index has a specific analysis process as follows:

[0047] Comprehensively analyze the humidity, air pressure, electromagnetic interference intensity and radio frequency signal intensity of the working area of ​​the high-frequency transceiver chip at the current time point to obtain the chip environmental impact index. The specific analysis method is as follows:

[0048]

[0049] In the formula, It is the chip environmental impact index. is a natural constant.

[0050] It is the humidity of the working area of ​​the high-frequency transceiver chip at the current time point, which refers to the actual humidity value of the working environment of the high-frequency transceiver chip.

[0051] The corresponding reference humidity of the high radio frequency transceiver chip preset for the communication frequency modulation library refers to a reference humidity value preset for the high radio frequency transceiver chip in the communication frequency modulation library.

[0052] It is the air pressure of the working area of ​​the high-frequency transceiver chip at the current time point, which refers to the actual air pressure value of the working environment of the high-frequency transceiver chip.

[0053] The corresponding reference air pressure of the high radio frequency transceiver chip preset for the communication frequency modulation library refers to a reference air pressure preset for the high radio frequency transceiver chip in the communication frequency modulation library.

[0054] It is the electromagnetic interference intensity of the working area of ​​the high radio frequency transceiver chip at the current time point, which refers to the actual electromagnetic interference intensity value of the working environment of the high radio frequency transceiver chip.

[0055] The electromagnetic interference reference strength corresponding to the high radio frequency transceiver chip preset for the communication frequency modulation library refers to a reference electromagnetic interference strength preset for the high radio frequency transceiver chip in the communication frequency modulation library.

[0056] It is the RF signal strength of the working area of ​​the high RF transceiver chip at the current time point, which refers to the actual RF signal strength value of the current working environment of the high RF transceiver chip.

[0057] The reference RF signal strength corresponding to the high RF transceiver chip preset for the communication frequency modulation library refers to a reference RF signal strength preset for the high RF transceiver chip in the communication frequency modulation library.

[0058] In this embodiment, when the humidity of the working area to which the high-RF transceiver chip belongs at the current time point deviates greatly from the preset reference humidity corresponding to the high-RF transceiver chip, if the humidity is too high, condensation may occur on the chip surface, increasing the risk of short circuit of the high-RF transceiver chip circuit; if the humidity is too low, static electricity may be generated, affecting the signal stability of the high-RF transceiver chip; when the air pressure of the working area to which the high-RF transceiver chip belongs at the current time point deviates greatly from the preset reference air pressure corresponding to the high-RF transceiver chip, especially in an extremely high or low pressure environment, the tiny structure inside the chip will be affected by the pressure change, affecting its normal operation, resulting in an increase in the failure rate of the chip and unstable performance; when the high-RF transceiver chip The greater the electromagnetic interference intensity in the working area at the current time point, the more it will interfere with the normal signal reception and transmission of the chip, resulting in a decrease in signal quality, a shortened communication distance, and even possible communication failure; when the RF signal strength in the working area of ​​the high RF transceiver chip at the current time point is small, the communication capability of the chip will be seriously affected, resulting in a decrease in communication rate, unstable signal transmission, and even failure to establish an effective communication connection; therefore, through a detailed analysis of the parameters in the chip environmental impact index, the chip stability and communication reliability can be improved, and in the actual application of the high RF transceiver chip in the later stage, a suitable environmental control strategy should be formulated according to the working scenario of the high RF transceiver chip.

[0059] In this embodiment, the four parameters of humidity, air pressure, electromagnetic interference intensity and radio frequency signal strength of the working area to which the above-mentioned high-frequency transceiver chip belongs at the current time point may be intertwined and influence each other in the chip working environment. For example, changes in humidity will affect the propagation characteristics of electromagnetic interference, and changes in air pressure will affect the transmission efficiency of radio frequency signals. There is a direct mutual influence between electromagnetic interference intensity and radio frequency signal strength. When the electromagnetic interference intensity is high, it will interfere with the transmission of radio frequency signals, resulting in a decrease in signal quality. Conversely, when the radio frequency signal strength is weak, it may be more susceptible to electromagnetic interference.

[0060] In this embodiment, the chip environmental impact index is compared with the chip environmental impact index limit value preset in the communication frequency modulation library. If the chip environmental impact index is less than or equal to the chip environmental impact index limit value preset in the communication frequency modulation library, it means that the current chip environment has little impact on the communication quality and is in a relatively ideal or acceptable state. Therefore, there is no need to perform a frequency modulation on the wireless communication signal of the high-frequency transceiver chip, and the high-frequency transceiver chip can be directly tested for communication quality to ensure that its communication performance meets the requirements; when the chip environmental impact index is greater than the chip environmental impact index limit value preset in the communication frequency modulation library, it means that the current chip environment has a greater impact on the communication quality, which may cause communication instability or quality degradation. In this case, the wireless communication signal of the high-frequency transceiver chip needs to be frequency modulated. The purpose of frequency modulation is to adjust the frequency of the signal to reduce environmental interference and improve communication stability and quality. At the same time, the high-frequency transceiver chip after frequency modulation is tested for communication quality.

[0061] Furthermore, the wireless communication signal of the high-frequency transceiver chip is frequency modulated once, and the specific frequency modulation process is:

[0062] The chip environmental impact index is matched with the wireless communication signal primary frequency modulation strategy corresponding to each chip environmental impact index interval preset in the communication frequency modulation library, thereby obtaining the wireless communication signal primary frequency modulation strategy of the high-frequency transceiver chip. Finally, the high-frequency transceiver chip performs primary frequency modulation of the wireless communication signal through the wireless communication signal primary frequency modulation strategy.

[0063] It should be explained that the chip environmental impact index is matched with the wireless communication signal primary frequency modulation strategy corresponding to each chip environmental impact index interval preset in the communication frequency modulation library. The specific matching process is:

[0064] The chip environmental impact index that is greater than the chip environmental impact index limit value preset in the communication frequency modulation library is matched with the wireless communication signal primary frequency modulation strategy corresponding to each chip environmental impact index interval preset in the communication frequency modulation library, thereby obtaining the wireless communication signal primary frequency modulation strategy corresponding to the chip environmental impact index that is greater than the chip environmental impact index limit value preset in the communication frequency modulation library. Finally, the high-frequency transceiver chip is specifically adjusted through the wireless communication signal primary frequency modulation strategy.

[0065] In a specific example, the chip environmental impact index is 2.5, and the chip environmental impact index interval stored in the communication frequency modulation library is (2, 3). Then the wireless communication signal frequency modulation strategy corresponding to the chip environmental impact index interval (2, 3) is to increase the RF signal strength of the high RF transceiver chip by 10%.

[0066] It needs to be explained that the wireless communication signal frequency modulation strategy is completed by the high-frequency transceiver chip in the working area at the current time point, but the purpose is to improve the communication quality of the high-frequency transceiver chip in the working area at the next time point.

[0067] Specifically, the high RF transceiver chip communication signal data specifically includes the average communication signal strength, average communication signal frequency, average communication signal power, average communication noise power, average signal phase noise power, average communication signal delay time and average RF signal strength of the high RF transceiver chip communication signal during the communication detection period.

[0068] It should be noted that the average communication signal strength of the communication signal of the high RF transceiver chip during the communication detection period is obtained by using a professional signal strength measuring instrument, such as an RF power meter or a signal analyzer, to measure the signal strength of the high RF transceiver chip at multiple time points during the communication detection period, and then calculating the average value. The average communication signal frequency can be obtained by using a spectrum analyzer to measure the frequency distribution of the signal by analyzing the spectrum characteristics of the signal during the communication detection period, and calculating the average frequency; the RF power meter of the average communication signal power measures the signal power at multiple time points during the communication detection period, and then calculates the average value; the average communication noise power is obtained by measuring the power of the background noise during the communication detection period with a noise measuring instrument, and calculating the average value. The average signal phase noise power is obtained by measuring the phase fluctuation of the signal with a phase noise analyzer, and the phase noise power is obtained. The average signal phase noise power is obtained by measuring the phase fluctuation of the signal multiple times and calculating the average value. The average delay time of the communication signal can be obtained by using a signal analyzer to measure the transmission time of the signal and calculating its average value. The average delay time of the communication signal is obtained. The RF signal strength can be directly obtained by using an RF power meter to measure the RF signal strength within the communication detection period, and multiple measurements are taken and the average value is calculated to obtain the average RF signal strength. In this embodiment, the communication detection period refers to a detection time interval set by a high-frequency transceiver chip in a wireless communication system to evaluate the quality and stability of the communication signal, and can be randomly set according to the signal of the RF transceiver chip.

[0069] In this embodiment, the average communication signal strength, average communication signal frequency, average communication signal power, average communication noise power, average signal phase noise power, average communication signal delay time and average RF signal strength of the above-mentioned high RF transceiver chip communication signal in the communication detection period are mutually influenced, wherein the average communication signal strength is usually proportional to the average communication signal power, and the signal strength is a measure of the signal power. Therefore, when the signal power increases, the signal strength will also increase accordingly. The average communication noise power is a key factor affecting the signal-to-noise ratio. When the noise power increases, the signal-to-noise ratio will decrease accordingly. The average signal phase noise power reflects the instability of the signal in the phase, which will cause signal distortion and increased bit error rate. The increase in signal power will increase the signal strength, but will also increase the noise power and phase noise power, thereby affecting the signal-to-noise ratio and signal quality. Therefore, when detecting the high RF transceiver chip wireless communication system, it is necessary to comprehensively consider the balance and compromise between these parameters.

[0070] In this embodiment, the average RF signal strength of the working area to which the high RF transceiver chip belongs at the current time point refers to the RF signal strength of the working area to which the high RF transceiver chip belongs at the current single time point. This is an instantaneous value, reflecting the stability of the chip's external environment at that moment and its potential impact on communication. The average RF signal strength of the high-frequency transceiver chip's communication signal during the communication detection cycle refers to the average value of the RF signal during the communication detection cycle, a statistical value obtained by sampling and averaging the signal strength during the communication detection cycle, reflecting the actual signal strength of the chip during the communication detection cycle. Although the two are different in the time dimension, they are interrelated. The RF signal strength at a single time point can be regarded as an instantaneous sample of the average RF signal strength during the communication detection cycle. Through the RF signal strength at a single time point, the current signal status of the working area to which the high-frequency transceiver chip belongs can be quickly understood; and through the average RF signal strength during the communication detection cycle, the stability and reliability of the signal over a period of time can be more comprehensively understood. If the data at the current time point is significantly different from the mean value within the cycle, it indicates that there is an abnormal situation, such as sudden electromagnetic interference. Based on the data at the current time point, adjustments can be made quickly, such as changing the communication frequency, to optimize the communication quality; and the mean data within the cycle is helpful in formulating long-term optimization strategies.

[0071] Furthermore, the chip communication quality indicator has a specific analysis process as follows:

[0072] The average communication signal power of the high-frequency transceiver chip communication signal in the communication detection period is processed with the average communication noise power to obtain the average signal-to-noise ratio of the high-frequency transceiver chip communication signal in the communication detection period.

[0073] The average communication signal frequency of the high-frequency transceiver chip communication signal within the communication detection period is processed with the communication signal reference frequency preset in the communication frequency modulation library to obtain the communication signal frequency offset of the high-frequency transceiver chip communication signal within the communication detection period.

[0074] The average communication signal strength, communication signal frequency offset, average signal-to-noise ratio, average signal phase noise power, average communication signal delay time and average RF signal strength of the high-frequency transceiver chip communication signal in the communication detection period are comprehensively analyzed to obtain the chip communication quality index. The specific analysis method is as follows:

[0075]

[0076] In the formula, is the chip communication quality indicator, is a natural constant.

[0077] It is the average communication signal strength of the communication signal of the high RF transceiver chip during the communication detection period, which refers to the average strength of the communication signal of the high RF transceiver chip during the communication detection period.

[0078] The communication signal reference strength preset for the communication frequency modulation library refers to a standard signal strength value set in the communication frequency modulation library.

[0079] It is the communication signal frequency offset of the high RF transceiver chip communication signal within the communication detection period, which refers to the absolute value of the difference between the average communication signal frequency of the high RF transceiver chip communication signal within the communication detection period and the communication signal reference frequency preset in the communication frequency modulation library.

[0080] The communication signal frequency offset reference preset for the communication frequency modulation library refers to a reference value of a frequency offset preset in the communication frequency modulation library.

[0081] It is the average signal-to-noise ratio of the communication signal of the high RF transceiver chip during the communication detection period, which refers to the average value of the ratio of the signal power to the noise power of the communication signal of the high RF transceiver chip during the communication detection period.

[0082] The reference signal-to-noise ratio preset for the communication frequency modulation library refers to a reference value of the signal-to-noise ratio preset in the communication frequency modulation library.

[0083] It is the average signal phase noise power of the communication signal of the high RF transceiver chip during the communication detection period, which refers to the average value of the phase noise power of the communication signal of the high RF transceiver chip during the communication detection period.

[0084] The signal phase noise reference power preset for the communication frequency modulation library refers to a reference value of a signal phase noise power preset in the communication frequency modulation library.

[0085] It is the average delay time of the communication signal of the high RF transceiver chip during the communication detection cycle, which refers to the average time required for the communication signal of the high RF transceiver chip to travel from the sending end to the receiving end during the communication detection cycle.

[0086] The communication signal delay reference duration preset for the communication frequency modulation library refers to a reference value of a communication signal delay duration preset in the communication frequency modulation library.

[0087] It is the average strength of the radio frequency signal of the high-frequency transceiver chip communication signal during the communication detection period, which refers to the average power of the radio frequency signal of the high-frequency transceiver chip during the communication detection period.

[0088] The radio frequency signal reference strength preset for the communication frequency modulation library refers to a reference value of the radio frequency signal strength preset in the communication frequency modulation library.

[0089] In this embodiment, if the average communication signal strength of the high RF transceiver chip communication signal within the communication detection period is low, the signal receiving ability of the chip communication receiving end will be reduced, and the bit error rate and packet loss rate will be increased; it will directly cause the chip communication receiving end to be unable to correctly demodulate the signal, causing the communication signal frequency offset to increase; at the same time, the reduction in the average signal-to-noise ratio will also increase the communication bit error rate and data loss, and reduce the reliability and communication rate of wireless communication; and the increase in the average signal phase noise power will also cause signal distortion and increased bit error rate; the increase in the average delay time of the communication signal will increase the delay of wireless communication, affect the average strength of the RF signal, and reduce the value of the average strength of the RF signal, so as to reduce the distance and penetration ability of wireless communication, and affect the coverage and stability of wireless communication; therefore, through a detailed analysis of the parameters in the chip communication quality index, it is possible to reduce wireless communication interruptions and data loss, thereby improving the stability of wireless communication of the high RF transceiver chip.

[0090] In this embodiment, the chip communication quality index is compared with the chip communication quality index threshold preset by the communication frequency modulation library. If the chip communication quality index is greater than or equal to the chip communication quality index threshold preset by the communication frequency modulation library, it means that the communication quality of the current high radio frequency transceiver chip is good and can meet the requirements of information reception. Therefore, the high radio frequency transceiver chip is directly recorded as an information receiving chip without the need for additional frequency modulation operations. If the chip communication quality index is less than the chip communication quality index threshold preset by the communication frequency modulation library, it means that the communication quality of the current high radio frequency transceiver chip is poor, and the wireless communication signal of the high radio frequency transceiver chip needs to be secondary frequency modulated to try to improve the communication quality.

[0091] Specifically, the wireless communication signal of the high-frequency transceiver chip is subjected to secondary frequency modulation, and the specific frequency modulation process is as follows:

[0092] The chip communication quality index threshold and the chip communication quality index are difference processed to obtain the chip communication quality deviation value, and matched with the wireless communication signal secondary frequency modulation method corresponding to the communication quality deviation value interval of each chip preset in the communication frequency modulation library, thereby obtaining the wireless communication signal secondary frequency modulation method of the high-frequency transceiver chip, and finally the high-frequency transceiver chip performs secondary frequency modulation of the wireless communication signal through the wireless communication signal secondary frequency modulation method.

[0093] It should be noted that the chip communication quality index threshold and the chip communication quality index are subjected to difference processing to obtain the chip communication quality deviation value, and matched with the wireless communication signal secondary frequency modulation method corresponding to each chip communication quality deviation value interval preset by the communication frequency modulation library. The specific matching method is:

[0094] The chip communication quality index that is less than the chip communication quality index threshold value preset by the communication frequency modulation library is subjected to difference processing with the chip communication quality index to obtain the chip communication quality deviation value; the chip communication quality deviation value is matched with the wireless communication signal secondary frequency modulation method corresponding to each chip communication quality deviation value interval preset by the communication frequency modulation library, thereby obtaining the wireless communication signal secondary frequency modulation method corresponding to the chip communication quality index that is less than the chip communication quality index threshold value preset by the communication frequency modulation library, and finally the high-frequency transceiver chip is specifically adjusted through the wireless communication signal secondary frequency modulation method.

[0095] In a specific example, the chip communication quality index is 1.5, and the chip communication quality index threshold preset in the communication frequency modulation library is 3, thereby obtaining a chip communication quality deviation value of 1.5, and the chip communication quality deviation value interval stored in the communication frequency modulation library is (1, 3). Then, the secondary frequency modulation method of the wireless communication signal corresponding to the chip communication quality deviation value interval (1, 3) is to increase the communication signal power by 10% and switch to the 8-PSK signal modulation method.

[0096] Furthermore, the attribute data corresponding to the wireless communication signal of the information receiving chip in the process of sending the communication information specifically includes the frequency, average transmission power and average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending period.

[0097] It should be noted that the frequency of the wireless communication signal of the above-mentioned information receiving chip within the information sending cycle can be monitored and analyzed by a signal analyzer, thereby obtaining the frequency of the wireless communication signal. The average transmission power can be obtained by measuring the transmission power of the wireless communication signal within the information sending cycle using a power meter and calculating its average value. The average transmission bandwidth is obtained by measuring the bandwidth of the wireless communication signal within the information sending cycle using a spectrum analyzer and calculating its average value. In this embodiment, the information sending cycle refers to the time interval between the start of sending one message and the start of sending the next message.

[0098] Specifically, the chip sends a stability indicator, and the specific analysis process is as follows:

[0099] The average humidity, average air pressure, maximum electromagnetic interference intensity and maximum radio frequency signal intensity of the working area to which the information receiving chip belongs during the information sending time period are obtained, and the chip environmental impact index corresponding to the area to which the information receiving chip belongs is obtained according to the analysis method of the chip environmental impact index.

[0100] It should be noted that the average humidity, average air pressure, maximum electromagnetic interference intensity and maximum radio frequency signal intensity of the working area to which the above-mentioned information receiving chip belongs during the information sending time period are obtained in the same way as the humidity, air pressure, electromagnetic interference intensity and radio frequency signal intensity of the working area to which the above-mentioned high radio frequency transceiver chip belongs at the current time point. In this embodiment, the average humidity, average air pressure, maximum electromagnetic interference intensity and maximum radio frequency signal intensity of the working area to which the information receiving chip belongs during the information sending time period are comprehensively analyzed to obtain the chip environmental impact index corresponding to the area to which the information receiving chip belongs, and the specific analysis method is also the same as the analysis method of the above-mentioned chip environmental impact index.

[0101] In this embodiment, the chip environmental impact index focuses on the humidity, air pressure, electromagnetic interference intensity and radio frequency signal strength of the working area to which the high radio frequency transceiver chip belongs at the current time point. These parameters together constitute the chip environmental impact index at the current moment, which is a description of an instantaneous state, used to evaluate the impact of environmental factors on chip performance, and to provide data support for subsequent frequency modulation of the wireless communication signal of the high radio frequency transceiver chip. The chip environmental impact index corresponding to the area to which the information receiving chip belongs reflects the environmental changes during the information sending time period, usually including average humidity, average air pressure, maximum electromagnetic interference intensity, etc., which is used to comprehensively evaluate the overall performance of the chip in the current environment, and provide a quantitative evaluation basis for the stability and reliability of wireless communication. Although the chip environmental impact index and the chip environmental impact index corresponding to the area to which the information receiving chip belongs are different in the time dimension, they are both analyzed based on the same environmental parameters (humidity, air pressure, electromagnetic interference intensity, radio frequency signal strength), and both evaluate the impact of the environment on chip wireless communication. At the same time, the chip environmental impact index and the chip environmental impact index corresponding to the area to which the information receiving chip belongs are analyzed by combining multiple environmental parameters, reflecting the complexity and multifaceted nature of the impact of the environment on chip performance.

[0102] The frequency, average transmission power, average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending cycle and the chip environmental impact index corresponding to the area where the information receiving chip belongs are comprehensively analyzed to obtain the chip sending stability index.

[0103] In this embodiment, the frequency, average transmission power, average transmission bandwidth of the wireless communication signal of the above-mentioned information receiving chip during the information sending period, and the chip environmental impact index corresponding to the area to which the information receiving chip belongs are interrelated and influence each other. The increase in frequency can increase the data transmission rate. The higher the frequency, the wider the bandwidth that can be occupied, supporting a higher data transmission rate. The transmission power and bandwidth jointly affect the signal coverage and data transmission rate. Under the same transmission power, the wider the bandwidth, the higher the data transmission rate; and under the same bandwidth, the greater the transmission power, the wider the signal coverage. At the same time, when the environmental impact index is high, it will lead to problems such as decreased frequency stability of the chip, increased transmission power fluctuations, and reduced bandwidth utilization, thereby affecting the chip's sending stability index.

[0104] The chip sends a stability indicator, and the specific analysis method is as follows:

[0105]

[0106] In the formula, Send stability indicators to the chip, is a natural constant, It is the chip environmental impact index corresponding to the area to which the information receiving chip belongs.

[0107] It is the frequency of the wireless communication signal of the information receiving chip during the information sending cycle, which refers to the number of times the information receiving chip repeatedly sends the signal during the information sending cycle.

[0108] The reference frequency preset for the communication frequency modulation library refers to a frequency standard value set in the communication frequency modulation library for wireless communication.

[0109] It is the average transmission power of the wireless communication signal of the information receiving chip during the information sending period, which refers to the average value of the transmission power of the wireless communication signal of the chip during the information sending period.

[0110] The transmission reference power preset for the communication frequency modulation library refers to a transmission power standard value set in the communication frequency modulation library for wireless communication.

[0111] It is the average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending period, which refers to the average value of the transmission bandwidth of the wireless communication signal of the chip during the information sending period.

[0112] The transmission reference bandwidth preset for the communication frequency modulation library refers to a transmission bandwidth standard value set in the communication frequency modulation library for wireless communication.

[0113] The weight factor corresponding to the chip environmental impact index preset for the communication frequency modulation library can be directly obtained from the communication frequency modulation library. The corresponding relationship can be a preset mapping relationship. For example, a mapping set is formed according to the historical chip environmental impact index and the weight factor corresponding to the chip environmental impact index, and the real-time chip environmental impact index is input into the mapping set to obtain the weight factor corresponding to the chip environmental impact index. The mapping relationship can be one-to-one or many-to-one. At the same time, in this example, its value range is [0, 1].

[0114] In this embodiment, if the frequency of the wireless communication signal of the information receiving chip during the information sending cycle is low, it will directly lead to low efficiency of communication information transmission and fail to meet the real-time wireless communication needs; and directly affect the average transmission power, even when the average transmission power is too small, it means that the coverage range of the wireless communication signal will be reduced, which will cause some areas to be unable to receive the signal, affecting the connectivity of the communication; at the same time, if the average transmission bandwidth is low, it will limit the rate and capacity of data transmission, affecting the real-time and integrity of wireless communication, and at the same time, insufficient bandwidth will cause information to queue during the wireless communication transmission process, thereby increasing communication delays and affecting the real-time response capability of wireless communication; a higher chip environmental impact index corresponding to the area to which the information receiving chip belongs means that the working environment of the information receiving chip has a greater negative impact on the chip performance, which may be due to environmental factors such as humidity, air pressure, and electromagnetic interference, which may cause the chip's transmission performance to decline, such as signal distortion, increased noise, etc.; therefore, by conducting a detailed analysis of each parameter in the chip sending stability index, the sending stability performance of the information receiving chip can be accurately evaluated.

[0115] Furthermore, the determination of whether to issue an early warning prompt for the wireless communication signal of the information receiving chip is specifically carried out as follows:

[0116] The chip transmission stability index is compared with the chip transmission stability index threshold preset by the communication frequency modulation library.

[0117] If the chip transmission stability index is less than the chip transmission stability index threshold preset by the communication frequency modulation library, an early warning prompt will be given to the wireless communication signal of the information receiving chip.

[0118] It should be noted that when the chip sending stability index is less than the chip sending stability index threshold preset by the communication frequency modulation library, it means that the wireless communication signal of the information receiving chip may be unstable in the current working environment, which may be manifested as a decrease in data transmission rate, deterioration in signal quality, and reduced signal stability. These unstable factors may lead to communication interruption, data loss or delay, and other problems. Therefore, it is necessary to give an early warning prompt for the wireless communication signal of the information receiving chip. The specific early warning prompt can be to issue an alarm sound to prompt the instability of the current wireless communication signal.

[0119] If the chip transmission stability index is greater than or equal to the chip transmission stability index threshold preset by the communication frequency modulation library, there is no need to issue an early warning prompt for the wireless communication signal of the information receiving chip.

[0120] It should be noted that when the chip sending stability index is greater than or equal to the chip sending stability index threshold preset by the communication frequency modulation library, it means that the data transmission rate, signal quality, signal stability and other aspects of the current wireless communication are in good condition, which can ensure smooth wireless communication and accurate data transmission. Therefore, there is no need to provide early warning for the wireless communication signal of the information receiving chip.

[0121] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined in this specification, they should all fall within the protection scope of the present invention.

Claims

1. A wireless communication frequency modulation system based on a high-frequency transceiver chip, characterized in that: include: The chip area environmental monitoring module is used to monitor and obtain the environmental data of the working area of ​​the high-frequency transceiver chip, analyze it, obtain the chip environmental impact index, and compare it with the chip environmental impact index limit value preset by the communication frequency modulation library. If the chip environmental impact index is less than or equal to the chip environmental impact index limit value preset by the communication frequency modulation library, the high-frequency transceiver chip is subjected to communication quality detection. If the chip environmental impact index is greater than the chip environmental impact index limit value preset by the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is frequency modulated once, and the communication quality of the high-frequency transceiver chip after frequency modulation is detected. A communication detection module is used to obtain the communication signal data of the high-frequency transceiver chip through the process of performing communication quality detection on the high-frequency transceiver chip, obtain the chip communication quality index, and compare it with the chip communication quality index threshold preset by the communication frequency modulation library. If the chip communication quality index is greater than or equal to the chip communication quality index threshold preset by the communication frequency modulation library, the high-frequency transceiver chip is directly recorded as an information receiving chip. If the chip communication quality index is less than the chip communication quality index threshold preset by the communication frequency modulation library, the wireless communication signal of the high-frequency transceiver chip is secondary frequency modulated, and the high-frequency transceiver chip after secondary frequency modulation is recorded as an information receiving chip; A chip communication module is used to send the communication information of each communication device to the target device through the information receiving chip, thereby monitoring and obtaining the corresponding attribute data of the wireless communication signal of the information receiving chip during the communication information sending process, analyzing it, obtaining the chip sending stability index, and comparing it with the chip sending stability index threshold preset by the communication frequency modulation library, and finally determining whether to issue an early warning prompt for the wireless communication signal of the information receiving chip; the corresponding attribute data of the wireless communication signal of the information receiving chip during the communication information sending process specifically includes the frequency, average transmission power and average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending period; The chip sends a stability indicator, and the specific analysis process is as follows: Obtain the average humidity, average air pressure, maximum electromagnetic interference intensity, and maximum radio frequency signal intensity of the working area to which the information receiving chip belongs during the information sending time period, and obtain the chip environmental impact index corresponding to the area to which the information receiving chip belongs according to the chip environmental impact index analysis method; The frequency, average transmission power, average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending cycle and the chip environmental impact index corresponding to the area to which the information receiving chip belongs are comprehensively analyzed to obtain the chip sending stability index. The specific analysis method is as follows: ； In the formula, Send stability indicators to the chip, is a natural constant, The frequency of the wireless communication signal of the information receiving chip during the information sending cycle, The reference frequency preset for the communication FM library, is the average transmission power of the wireless communication signal of the information receiving chip during the information sending cycle, The transmission reference power preset for the communication FM library, is the average transmission bandwidth of the wireless communication signal of the information receiving chip during the information sending cycle, The transmission reference bandwidth preset for the communication FM library, is the chip environmental impact index corresponding to the area to which the information receiving chip belongs, The weight factor corresponding to the chip environmental impact index preset for the communication frequency modulation library.

2. The wireless communication frequency modulation system based on the high-frequency transceiver chip according to claim 1 is characterized in that: The environmental data of the working area to which the high-frequency transceiver chip belongs specifically includes the humidity, air pressure, electromagnetic interference intensity and radio frequency signal intensity of the working area to which the high-frequency transceiver chip belongs at the current time point.

3. The wireless communication frequency modulation system based on the high-frequency transceiver chip according to claim 2 is characterized in that: The specific analysis process of the chip environmental impact index is as follows: A comprehensive analysis is performed on the humidity, air pressure, electromagnetic interference intensity and radio frequency signal intensity of the working area of ​​the high-frequency transceiver chip at the current time point to obtain the chip environmental impact index.

4. The wireless communication frequency modulation system based on the high-frequency transceiver chip according to claim 1 is characterized in that: The wireless communication signal of the high-frequency transceiver chip is frequency modulated once, and the specific frequency modulation process is: The chip environmental impact index is matched with the wireless communication signal primary frequency modulation strategy corresponding to each chip environmental impact index interval preset in the communication frequency modulation library, thereby obtaining the wireless communication signal primary frequency modulation strategy of the high-frequency transceiver chip. Finally, the high-frequency transceiver chip performs primary frequency modulation of the wireless communication signal through the wireless communication signal primary frequency modulation strategy.

5. The wireless communication frequency modulation system based on high-frequency transceiver chip according to claim 1 is characterized in that: The high RF transceiver chip communication signal data specifically includes the average communication signal strength, average communication signal frequency, average communication signal power, average communication noise power, average signal phase noise power, average communication signal delay time and average RF signal strength of the high RF transceiver chip communication signal during the communication detection period.

6. The wireless communication frequency modulation system based on high-frequency transceiver chip according to claim 5, characterized in that: The chip communication quality indicator, the specific analysis process is as follows: Performing ratio processing on the average communication signal power of the high-frequency transceiver chip communication signal in the communication detection period and the average communication noise power to obtain the average signal-to-noise ratio of the high-frequency transceiver chip communication signal in the communication detection period; The average communication signal frequency of the high-frequency transceiver chip communication signal in the communication detection period is processed with the communication signal reference frequency preset in the communication frequency modulation library to obtain the communication signal frequency offset of the high-frequency transceiver chip communication signal in the communication detection period; The average communication signal strength, communication signal frequency offset, average signal-to-noise ratio, average signal phase noise power, average communication signal delay time and average RF signal strength of the high-frequency transceiver chip communication signal during the communication detection period are comprehensively analyzed to obtain the chip communication quality index.

7. The wireless communication frequency modulation system based on high-frequency transceiver chip according to claim 1, characterized in that: The wireless communication signal of the high-frequency transceiver chip is subjected to secondary frequency modulation, and the specific frequency modulation process is as follows: The chip communication quality index threshold and the chip communication quality index are difference processed to obtain the chip communication quality deviation value, and matched with the wireless communication signal secondary frequency modulation method corresponding to the communication quality deviation value interval of each chip preset in the communication frequency modulation library, thereby obtaining the wireless communication signal secondary frequency modulation method of the high-frequency transceiver chip, and finally the high-frequency transceiver chip performs secondary frequency modulation of the wireless communication signal through the wireless communication signal secondary frequency modulation method.

8. The wireless communication frequency modulation system based on high-frequency transceiver chip according to claim 1, characterized in that: The specific process of determining whether to issue an early warning prompt for the wireless communication signal of the information receiving chip is as follows: Compare the chip sending stability index with the chip sending stability index threshold preset by the communication frequency modulation library; If the chip transmission stability index is less than the chip transmission stability index threshold preset by the communication frequency modulation library, an early warning prompt is issued for the wireless communication signal of the information receiving chip; If the chip transmission stability index is greater than or equal to the chip transmission stability index threshold preset by the communication frequency modulation library, there is no need to issue an early warning prompt for the wireless communication signal of the information receiving chip.

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