Heat dissipation structure and electronic device comprising same

Abstract

An electronic device is provided according to an embodiment of the present disclosure. The electronic device may include: a housing having a plurality of first fins; a plurality of second fins; the vapor chamber is provided with a first cover body, a second cover body and a plurality of column bodies; an electronic component; and a printed circuit board. The housing may include at least one heat sink forming an open area. According to the vapor chamber, through the open area, at least a part of the first surface of the first cover body of the vapor chamber can be exposed. The plurality of second fins may be disposed on the at least a portion of the first surface of the first cover that is exposed. The electronic component may be disposed on one surface of the printed circuit board. The electronic component may be disposed in a space between a first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation structure and an electronic device comprising the heat dissipation structure. Background Art

[0002] An electronic device may include various electronic components for communication. Electronic components within an electronic device may generate heat. For example, the heat generated by the electronic component may degrade the performance of the electronic component and other electronic components. To disperse the heat generated by the electronic component, the electronic device may include a heat dissipation structure.

[0003] The above contents may be provided as background art to help understand the present disclosure. No claim or determination is made as to whether any of the above contents can be applied as prior art related to the present disclosure. Summary of the invention

[0004] Means for solving problems

[0005] According to an embodiment of the present disclosure, an electronic device is provided. The electronic device may include: a housing having a plurality of first fins; a plurality of second fins; a vapor chamber having a first cover, a second cover and a plurality of pillars; an electronic component; and a printed circuit board (PCB). The housing may include at least one heat sink forming an opening area. The vapor chamber, through the opening area, may be configured so that at least a portion of the first surface of the first cover of the vapor chamber is exposed. The plurality of second fins may be disposed on at least a portion of the first surface of the exposed first cover. The electronic component may be disposed on one surface of the printed circuit substrate. The electronic component may be disposed in a space between the first surface of the second cover facing the one surface of the printed circuit substrate and the one surface of the printed circuit substrate.

[0006] According to an embodiment of the present disclosure, an electronic device is provided. The electronic device may include: a housing having a plurality of first fins; a plurality of modules; and a printed circuit board (PCB). Each of the plurality of modules may include: a plurality of second fins; a vapor chamber having a first cover, a second cover and a plurality of pillars; and an electronic component. The housing may include at least one heat sink portion forming an opening area. The vapor chamber, through the opening area, may be configured so that at least a portion of the first surface of the first cover of the vapor chamber is exposed. The plurality of second fins may be disposed on at least a portion of the first surface of the exposed first cover. The electronic component may be disposed on one surface of the printed circuit substrate. The electronic component may be disposed in a space between the first surface of the second cover facing the one surface of the printed circuit substrate and the one surface of the printed circuit substrate.

[0007] According to an embodiment of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure is combined with the first metal structure, and a space for a fluid may be formed between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns arranged in the space. The first metal structure may be formed based on a composite material combined with a first metal material and a second metal material. The second metal structure may be formed based on a composite material combined with the first metal material and the second metal material. The first metal structure may be configured such that the first metal material is located on a first surface of the first metal structure, and the second metal material is located on a second surface of the first metal structure opposite to the first surface. The second metal structure may be configured such that the first metal material is located on a first surface of the second metal structure, and the second metal material is located on a second surface of the second metal structure opposite to the first surface. At least a portion of the second surface of the first metal structure may be combined with at least a portion of the second surface of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0008] According to an embodiment of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure is combined with the first metal structure, and a space for a fluid may be formed between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns arranged in the space. The vapor chamber may include a third metal structure. The third metal structure may be formed based on the first metal material. The first metal structure and the second metal structure may be formed based on the second metal material. The first surface of the first metal structure may be combined with the third metal structure. At least a portion of the second surface of the first metal structure opposite to the first surface may be combined with at least a portion of the second metal structure. The first metal material may include aluminum. The second metal material may include copper. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A wireless communication system is shown.

[0010] Figure 2 An example of the appearance of an electronic device including a heat dissipation structure is shown.

[0011] Figure 3 An example of an electronic device including a heat dissipation structure is shown.

[0012] Figure 4a It is an exploded perspective view of the vapor chamber of the heat dissipation structure.

[0013] Figure 4b It is a cross-sectional view of the heat spreader of the heat dissipation structure.

[0014] Figure 5a A cross-sectional view of an electronic device including a heat dissipation structure is shown.

[0015] Figure 5b Examples of elements for heat dissipation are shown.

[0016] Figure 6a to Figure 6b An example of the arrangement of multiple fins for heat dissipation is shown.

[0017] Figure 7a An example of a vapor chamber comprising multiple metal materials is shown.

[0018] Figure 7b Another example of a vapor chamber including multiple metal materials is shown.

[0019] Figure 8An example of an electronic device including a heat dissipation structure is shown. DETAILED DESCRIPTION

[0020] The terms used in this disclosure are only used to describe specific embodiments, and are not intended to limit the scope of other embodiments. In addition to the context clearly indicating different meanings, singular expressions may also include plural expressions. Including technical or scientific terms, the terms used herein may have the same meaning as that generally understood by ordinary technicians in the technical field recorded in this disclosure. Among the terms used in this disclosure, the terms defined by general dictionaries can be interpreted as having the same or similar meaning as the context of the relevant technology, and should not be interpreted as ideal or overly formal meanings unless clearly defined in this disclosure. Depending on the circumstances, even the terms defined in this disclosure should not be interpreted as excluding embodiments of the present disclosure.

[0021] The various embodiments of the present disclosure described below are described using hardware as an example, but the various embodiments of the present disclosure include technologies using hardware and software, so the various embodiments of the present disclosure do not exclude descriptions based on software.

[0022] The following description includes terms referring to components of electronic devices (e.g., communication module, wireless communication module, heat dissipation module, substrate, printed circuit board (PCB), flexible printed circuit board (FPCB), printed circuit board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, constituent element, instrument), and terms referring to RF-related components (e.g., front end module (FEM), power amplifier module (PAM), front end module including duplexer (FEMid: FEM including duplexer), power amplifier module including duplexer (PAMid: power amplifier module including duplexer), low noise amplifier (LPAMid: Low noise amplifier PAM including duplexer), radio frequency front end (RFFE), radio frequency integrated circuit (RFIC) Circuit), terms referring to the shape of components (e.g., opening area, opening portion, protruding area, protruding portion, structure, structure, support portion, contact portion), terms referring to the connecting portion between structures (e.g., connecting portion, contact portion, supporting portion, connecting structure, conductive component, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna cable, RF path, RF module, RF circuit, splitter, divider, coupler, combiner), etc. are used exemplarily for the convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms with equivalent meanings may also be used. In addition, the terms "…part", "…device", "…object", "…body" and the like used below may refer to at least one shape structure or functional processing unit.

[0023] Moreover, in the present disclosure, in order to judge whether a specific condition is satisfied or fulfilled, expressions such as "exceed" or "not full" may be used, but this is only to express an example and does not exclude the description of above or below. The condition recorded by "above" can be replaced by "exceed", the condition recorded by "below" can be replaced by "not full", and the condition recorded by "above and not full" can be replaced by "exceed and below". Moreover, in the following, "A" to "B" means at least one of the elements from A (including A) to B (including B). In the following, "C" and / or "D" means including at least one of "C" or "D", that is, it means {'C', 'D', 'C' and 'D'}.

[0024] Figure 1 A wireless communication system is shown.

[0025] Reference Figure 1 , Figure 1 1 , a base station 110 and a terminal 120 are shown as a part of a node using a wireless channel in a wireless communication system.

[0026] The base station 110 is a network infrastructure that provides wireless access to the terminal 120. The base station 110 has a coverage defined based on the distance over which a signal can be transmitted. In addition to a base station, the base station 110 may also be referred to as an "access point (AP)", "eNodeB (eNB)", "5G node (5th generation node)", "next generation nodeB (gNB)", "wireless point (wireless point)", "transmission / reception point (transmission / reception point, TRP)" or other terms with equivalent technical meanings.

[0027] The terminal 120 is a device used by a user and communicates with the base station 110 through a wireless channel. The link from the base station 110 to the terminal 120 is called a downlink (DL), and the link from the terminal 120 to the base station 110 is called an uplink (UL). Figure 1, but the terminal 120 and other terminals can communicate through wireless channels between each other. At this time, the link (device-to-device link, D2D) between the terminal 120 and the other terminals is called a sidelink, and the sidelink can be mixed with the PC5 interface. In some other embodiments, the terminal 120 can operate without user participation. According to one embodiment, the terminal 120 is a device that performs machine type communication (MTC), which may not be carried by the user. In addition, according to one embodiment, the terminal 120 may be a narrowband-IoT (NB (narrowband)-IoT (internet of things)) device.

[0028] In addition to terminal, terminal 120 may also be referred to as "user equipment (UE)", "customer premises equipment (CPE)", "mobile station (mobile station)", "subscriber station" "remote terminal (remote terminal)", "wireless terminal (wireless terminal)", "electronic device (electronic device)" or "user device (user device)" or other terms with equivalent technical meanings.

[0029] In the past, in a communication system with a large base station cell radius, each base station was configured to include the functions of a digital processing unit (or DU (distributed unit)) and a radio frequency (RF, radiofrequency) processing unit (RF processing unit, or RU (radio unit)). However, with the use of high frequency bands in 4G (4th generation) and / or subsequent communication systems (e.g., 5G) and the reduction in the cell coverage of base stations, the number of base stations used to cover a specific area has increased. The installation cost of operators for installing base stations has also increased. In order to minimize the installation cost of the base station, the following structure is proposed, that is, the DU and RU of a base station (e.g., base station 110) are separated, more than one RU is connected to one DU via a wired network, and more than one RU is geographically distributed to cover a specific area.

[0030] The housing refers to the appearance of the internal components in various devices such as electronic devices and mechanical devices. The housing is used to protect and fix the parts of the device. In the case of electronic devices that use electricity or mechanical devices that physically move, such as network devices, heat is generated during the movement. Heat can have an adverse effect on the operation of the device, so the housing is usually designed to have a structure that dissipates heat outward. In recent years, due to the development of the electronics industry, electronic components are installed more closely on printed circuit boards due to the high density of circuits and the miniaturization of equipment. In addition, with the trend of miniaturization of electronic equipment, the high density and high installation of the package containing the printed circuit board as its core component have become important factors. When the electronic device is driven, each of the electronic components on the above-mentioned printed circuit board will generate heat. If the heat generated by the electronic components on the above-mentioned printed circuit board cannot be properly dissipated outward, the heat will lead to reduced function, so there is a problem of shortening the product life. Therefore, in order to maintain the optimized performance of the electronic components installed on the printed circuit board, it is necessary to maintain an environment that is compatible with the use characteristics of each electronic component used in the instrument. A device that disperses and dissipates the heat generated inside the instrument is inevitably required.

[0031] Network communication devices such as base stations 110, terminals 120, RIC (RAN intelligence controller), CU (central unit), DU, RU, MMU (massive MIMO (multiple input multiple output) unit) or AU (access unit) may include multiple electronic components for generating transmission signals to external electronic devices or processing reception signals from external electronic devices. During the operation of the network communication device, at least one electronic component generates heat. The network communication device may have a heat dissipation structure to disperse the generated heat or dissipate the heat to the outside. In the following disclosure, a heat dissipation structure and related technologies for dissipating heat generated from network communication devices such as CU, DU, RU, MMU and AU are described. Hereinafter, the network communication device may be referred to as an electronic device.

[0032] Figure 2 An example of the appearance of an electronic device (eg, base station 110, terminal 120, DU, RU, MMU, AU) including a heat dissipation structure is shown.

[0033] Reference Figure 2, the electronic device may include a first housing 210 and a second housing 220. The first housing 210 may be referred to as an upper housing, and the second housing 220 may be referred to as a lower housing. The first housing 210 and the second housing 220 may be assembled to form a closed space for protecting a printed board assembly (PBA) from external influences. A PBA is a collection of circuits including a substrate (board) and a plurality of components mounted on the substrate. As in a PBA, components disposed in an internal space formed by the first housing 210 and the second housing 220 may generate heat according to their operation. For example, the operation may include sending and / or receiving signals for wireless communication, and data calculation. According to one embodiment, the first housing 210 and the second housing 220 may respectively include a plurality of fins for heat dissipation. According to another embodiment, either of the first housing 210 and the second housing 220 may not include fins for heat dissipation.

[0034] The housing (e.g., the first housing 210 and the second housing 220) of the electronic device can protect the PBA installed inside the electronic device from the influence of the external environment. For example, since the electronic components of the PBA have different sizes, the inner side of the housing in contact with the PBA can be formed into a shape with different heights. The exterior of the housing may include a plurality of fins to dissipate the heat generated by the PBA to the outside (e.g., to the air). Such fins may be called heat sinks. In order to effectively dissipate heat, the fins may be in the shape of a plate with a large surface area. The electronic components in the PBA may contact the bottom surface of the housing. Thus, when the electronic components are working (e.g., when the electronic components are processing wireless signals), the heat generated by the electronic components of the PBA can be discharged to the outside air through the bottom surface of the housing and the heat sink.

[0035] Figure 3 Examples of electronic devices (eg, base station 110, terminal 120, DU, RU, MMU, AU) including heat dissipation structures are shown. Figure 3 The cross section of the interior of a housing (eg, a first housing 210 , a second housing 220 ) of the electronic device is described.

[0036] Reference Figure 3, the electronic device may include a housing 300. The housing 300 of the electronic device may be equipped with a plurality of electronic components. The housing 300 of the electronic device may protect a printed circuit board assembly (PBA) installed inside the product from the influence of the external environment. PBA refers to a substrate completed by soldering electronic components to a printed circuit board (PCB). PCB is an insulating board on which a conductive pattern (for example, a pattern composed of copper wires) for electrical connection of electronic components is formed, and PBA may be manufactured by connecting the electronic components to the conductive pattern. Due to the height of various components on the PBA, the inner side of the housing 300 in contact with the PBA may be in a shape having various heights.

[0037] The exterior of the housing 300 may include a heat sink 310 to dissipate the heat generated by the PBA to the outside. The heat sink 310 of the housing 300 is formed for heat dissipation. According to one embodiment, the heat sink 310 may include a plurality of fins. Each of the plurality of fins may be referred to as a heat sink. In order to effectively dissipate heat, the fin may be in the shape of a plate having a large surface area. For example, the housing 300 may be manufactured by die casting. Die casting is a type of casting process that not only has high productivity, but also can provide high precision because the components are manufactured using molds. The die casting method includes a method of manufacturing components using various metals (e.g., aluminum, zinc, magnesium, copper, tin, lead, iron). For example, the housing 300 may be formed of aluminum. Aluminum is light in weight, has high thermal conductivity, and has excellent corrosion resistance. With the high functionality and high integration of network communication equipment, the demand for lightweight housing 300 continues to increase. There are a variety of methods for lightweight housing 300. For example, magnesium having a lower specific gravity than lightweight metal aluminum may be used, or a technique for reducing weight by thinning the thickness of the fins of the housing 300 may be used. For example, in order to diffuse the heat of the high heat generating portion to the surroundings and release it to the outside, the housing 300 may use a material having high thermal conductivity instead of aluminum, or a separate component having high thermal conductivity (e.g., a graphite sheet, a heat pipe, a vapor chamber) may be attached to the inner side of the housing 300.

[0038] The housing 300 can reduce the corrosion caused by the exposure of the PBA or electronic components to external moisture or dust, etc. The heat generated from the electronic components can be released to the outside air through the inner side of the housing 300 via the fins. At least a portion of the components located on or in the PBA can contact the surface of the housing 300. When the electronic device is working, the heat generated by the components will be discharged to the outside air through the bottom surface of the housing and the heat sink. The electronic components mounted on the PBA may have various temperature margins. Among the electronic components, for components with large heat generation or insufficient temperature margin, in order to fully dissipate the heat, in order to widely distribute the heat generated by the components to the fins of the radiator 310 of the housing 300 with a larger area, a vapor chamber 360 or a heat pipe can be used. The vapor chamber 360 or the heat pipe can be arranged between the electronic component and the inner side of the housing 300. For example, the electronic components 340 (e.g., the first electronic component 341 and the second electronic component 342) are not in direct contact with the surface of the housing 300, but may be in contact with the surface of the housing 300 through a heat spreader 360 (or through a heat spreader 360 and a thermal interface material (TIM) (not shown)). The electronic device may include a first heat spreader 361 for the first electronic component 341. The electronic device may include a second heat spreader 362 for the second electronic component 342. Since the heat spreader 360 or the heat pipe has good thermal conductivity, the heat generated by the electronic components can be quickly diffused to the surroundings.

[0039] Figure 4a 3 is an exploded perspective view of a vapor chamber 360 of the heat dissipation structure. For the same or similar descriptions, the same reference numerals may be used.

[0040] 4, the heat spreader 360 may include a first cover 411, a second cover 412, a plurality of columns 420, a first wick structure 431, and a second wick structure 432. The heat spreader 360 may have a stacked structure. For example, in the (+) z direction, the second cover 412, the second wick structure 432, the plurality of columns 420, the first wick structure 431, and the first cover 411 may be stacked in the order of one another. An electronic component (not shown) that generates heat may be disposed below a lower surface (e.g., a surface facing the (-) z direction) of the second cover 412.

[0041] The vapor chamber 360 can be used for heat conduction. The heat generated by the electronic components can be conducted along the (+) z-axis direction through the vapor chamber 360 and discharged to the outside. The vapor chamber 360 is made of a metal material and can contain a fluid inside it. In order to store the fluid inside, the vapor chamber 360 may include a first cover 411 and a second cover 412. The fluid absorbs heat and is converted into steam, and the converted steam can move to the outside of the vapor chamber 360 to dissipate heat. The vapor chamber 360 may include a plurality of pillars 420 to transfer internal heat to the outside. For example, each pillar may have a cylindrical shape. For example, each pillar may have a square pillar shape. For example, each pillar may have a polygonal pillar shape. The vapor chamber 360 may include a wick structure to improve heat diffusion and cooling efficiency. For example, the vapor chamber 360 may include at least one of a first wick structure 431 and / or a second wick structure 432. Each wick structure may have a porous plate shape. In order to generate surface tension through the capillary force of the fluid, a liquid wick structure may be provided on one surface of the first cover body 411 and one surface of the second cover body 412 , respectively.

[0042] Figure 4b This is a cross-sectional view of the heat spreader of the heat dissipation structure. Figure 4b In the figure, the observation along the (-)y axis is shown. Figure 4a 2 is a cross-sectional view of a vapor chamber 360. For the same or similar descriptions, the same reference numerals may be used.

[0043] Reference Figure 4b, the heat spreader 360 may include a stacked structure in the (+) z-axis direction. The first cover 411 may be disposed on the second cover 412. The first cover 411 and the second cover 412 may be formed of a metal providing a thermal conductivity greater than a specified threshold. For example, each of the first cover 411 and the second cover 412 may be formed of copper. For example, the thermal conductivity of copper is about 401W / (m·K)(watts per meter-kelvin). Heat may be conducted by the heat spreader 360 along the (+) z-axis direction and discharged to the outside. For example, the first surface 461 of the first cover 411 may face the (+) z-axis direction. The second surface 471 of the first cover 411 opposite to the first surface 461 of the first cover 411 may face the (-) z-axis direction. The first surface 462 of the second cover 412 may face the (-) z-axis direction. The heat generated by the electronic component may be transferred to the first surface 462 of the second cover 412. The second surface 472 of the second cover 412 opposite to the first surface 462 of the second cover 412 may face the (+) z-axis direction. One area of ​​the second surface 472 of the second cover 412 may contact the first cover 411. Another area of ​​the second surface 472 of the second cover 412 may contact a plurality of pillars 420 (e.g., pillars 420a, 420b, 420c, and 420d).

[0044] A plurality of columns 420 may be disposed in a space between the first cover 411 and the second cover 412. A fluid (e.g., water) for absorbing heat may be disposed in the space. The plurality of columns 420 may be formed of a metal material so as to effectively transfer the heat transferred from the second cover 412 to the first cover 411. For example, the plurality of columns 420 may be formed of a copper material.

[0045] Figure 5a A cross-sectional view of an electronic device including a heat dissipation structure is shown. For the same or similar descriptions, the same reference numerals may be used.

[0046] Reference Figure 5a, the electronic device may include a housing 300. The housing 300 may include a first housing portion 300a and a second housing portion 300b. For example, the housing 300 may include a plurality of parts. For example, the housing 300 may be formed as a whole, and may be seen in a separated form in a cross-sectional view. As another example, the housing 300 may include a plurality of physically separated parts. The housing 300 is configured to be able to dissipate heat generated from each electronic component to the outside. The housing 300 may include a heat sink 310. The heat sink 310 may include fins 310a and fins 310b. The fins 310a may be disposed on a surface of the first housing portion 300a. The fins 310b may be disposed on a surface of the second housing portion 300b. Each of the fins 310a and fins 310b may have a plate shape. Each of the fins 310a and fins 310b may be configured to be exposed to the air by an electronic device disposed outdoors, thereby cooling the generated heat. The fins 310 a and 310 b can be formed together with the housing 300 by a die casting method.

[0047] The electronic device may include a PCB 520. The PCB 520 may be configured as a PBA by combining with electronic components formed in the form of a circuit. A plurality of electronic components may be arranged on one surface of the PCB 520. For example, an electronic component 531 and an electronic component 532 may be arranged on one surface of the PCB 520. The electronic component 531 and the electronic component 532 may contact the housing 300. As an example, the electronic component 531 may contact the inner side of the first housing portion 300a. The electronic component 532 may contact the inner side of the second housing portion 300b. Since the inner side of the housing 300 and the electronic components are in contact with each other, the heat generated by the corresponding electronic components may be transferred to the housing 300. The heat is discharged to the outside through the fins (e.g., fins 310a, fins 310b) of the heat sink 310. The power margin of the electronic component 531 or the electronic component 532 may be higher than the power margin of the electronic component 340 described later. This is because the heat dissipation performance provided by the heat dissipation structure of the housing alone is low. For example, the electronic component 531 or the electronic component 532 may be a module (eg, RFFE, FEM, FEMid, PAMid, LPAMid) or a chip including a power amplifier.

[0048] The electronic device may include a PCB 520. The PCB 520 may be configured as a PBA by combining with electronic components formed in the form of a circuit. A plurality of electronic components may be configured on one surface of the PCB 520. For example, the electronic component 340 may be configured on one surface. The heat generated in the electronic component 340 may be released through the heat spreader 360. The heat contacts the heat spreader 360 and may diffuse to as many surroundings as the area of ​​the heat spreader 360. The power margin of the electronic component 340 may be relatively lower than the power margin of the electronic component 531 or the electronic component 532. For example, the electronic component 340 may include a processor, a central processing unit (CPU), a graphics processing unit (GPU), an application processor (AP), a communication processor (CP), or a field-programmable gate array (FPGA). When the electronic component 340 contacts the heat spreader 360, an interface inevitably occurs due to component tolerance. In order to improve thermal resistance, a terminal interface material (TIM) 540 may be provided between the electronic component 340 and the heat spreader 360. For example, the TIM 540 may include a thermal pad, a gel, or a grease. The TIM 540 includes metal and ceramic particles having thermal conductivity based on a polymer substance, so that mechanical tolerances may be reduced according to the arrangement of the TIM 540, thereby increasing thermal conductivity at the interface.

[0049] and Figure 5aDifferent, it can be considered to set the TIM between the heat spreader 360 and the inner side of the shell 300. However, TIM has a thermal conductivity of 20 to 30 W / m·K. The higher the thermal conductivity, the higher the price. In addition, the setting of TIM is subject to structural restrictions due to pressing conditions and reuse. For example, the fin molding of the heat sink 310 of the shell 300 can be manufactured by die casting. The advantage of the die casting method is that it can mold the complex internal shape of the shell 300 and the heat sink 310 at a low price, but in order to prevent the fins from breaking or deforming when the product molded in the die casting mold is removed from the mold, the fin thickness and arrangement spacing above a certain level need to be met. In addition, the higher the heat generation of the component, the higher the fin height is required to improve the heat dissipation effect. In other words, the more heat the component generates, the thicker and longer the heat sink needs to be. However, the thicker and longer the heat sink, the larger the volume and weight of the electronic device, which is not conducive to the lightweight of the electronic device.

[0050] In order to solve the above problems, at least a portion of the housing 300 may include an opening area 569. Through the opening area 569 of at least a portion of the housing 300, one surface of the heat spreader 360 (for example, the first surface 461 of the first cover 411 or the coating) can be exposed to the outside. The structure of the aluminum sheet arranged on the copper heat spreader or the structure of forming a coating on one surface of the heat spreader can be understood as the structure of the heat spreader 360. In other words, the aluminum sheet is exposed through the opening area 569, which can also be included in the embodiment of the present disclosure. The heat sink 560 can be arranged on one surface of the exposed heat spreader 360. The heat sink 560 can be combined by welding with the one surface of the heat spreader 360. Unlike the heat sink formed integrally with the housing 300 by the die casting method, it is arranged by welding after being separately made, so compared with the heat sink of the radiator 310, the electronic device can have a wide spacing margin and be allowed to be thin. Hereinafter, for convenience of description, the heat sink of the heat sink 310 of the housing 300 may be referred to as a first fin. The heat sink 560 formed on one surface of the vapor chamber 360 may be referred to as a second fin.

[0051] The second fin may be disposed on one surface of the heat spreader 360, and the first fin may be disposed on one surface of the heat sink 310 of the housing 300. For example, the die-casting aluminum material for the housing 300 may use aluminum die casting (ADC, aluminum die casting) 12 or ADC 3. Aluminum materials generally have a thermal conductivity of about 90 to 160 W / m·K. In order to attach the second fin to the heat spreader 360, materials with high thermal conductivity of about 170 to 210 W / m·K such as AL1050, AL1070, AL3003, AL6063, etc. may be used. The first fin is formed by die casting together with the housing 300, so its thickness and arrangement are limited. However, since the second fin attached to the heat spreader 360 is manufactured separately instead of using die casting, it can be formed in a relatively thin sheet shape. In addition, since a certain thickness is not required, the weight of each fin can be reduced. According to the opening area 569 of the housing 300, the thickness of one side surface of the housing 300 can be removed. One side surface of the housing 300 has a thickness of about 3 to 4 mm. Since the heat sink 360 replaces the housing 300, the weight of the housing 300 can be reduced. In addition, since the length of the second fin can be increased by the removed thickness, the second fin can provide better heat dissipation performance.

[0052] The heat spreader 360 can replace a part of the housing 300. For example, when viewed from above along the (-) z-axis direction, the heat spreader 360 and the housing 300 can be assembled so that the edge portion 577 of the heat spreader 360 overlaps the housing 300. In order to prevent foreign substances such as external moisture and dust from penetrating into the space formed by the housing 300, the PCB 520 and the heat spreader 360, a structure can be additionally set between the edge portion 577 and the housing 300. For example, a gasket 555 can be set between the edge portion 577 and the housing 300. For example, a screw can be set between the edge portion 577 and the housing 300 to fix the heat spreader 360 to the housing 300. The gasket 555 can be made of a high molecular substance (e.g., silicone resin) having elasticity. For example, the surface hardness value of the gasket 555 is required to be Shore A20 or above. Since the elastic properties of the gasket 555 can keep the tolerance between the vapor chamber 360 and the electronic component 320 below a certain level, it can play a role in reducing the thermal resistance at the TIM. To further reduce the tolerance between the vapor chamber 360 and the electronic component 340, a screw with an additional spring (not shown) can be used.

[0053] The first cover 411 and / or the second cover 412 of the heat spreader 360 can be formed of copper. Copper has high thermal conductivity, and a working fluid with excellent cooling efficiency can be arranged inside the heat spreader 360. For example, water can be used as the working fluid of the heat spreader 360. The advantages of water are stable chemical properties, high latent heat, and excellent heat dissipation effect. When the working fluid is water, the reaction between water and aluminum will produce hydrogen, which may cause a decrease in heat dissipation performance. The stability is reduced, so the first cover 411 and / or the second cover 411 of the heat spreader 360 can be formed of copper. For another example, other working fluids other than water (acetone, ammonia, hydrochlorofluorocarbons (HCFCs, hydrochlorofluorocarbons), hydrofluorocarbons (HFCs, hydrofluorocarbons), etc.) can also be used as fluids. Since most network communication equipment is installed and used in outdoor environments, if the copper material is directly exposed to the outside, there is a risk of corrosion. Therefore, the vapor chamber 360 according to the embodiment of the present disclosure may be subjected to an additional electroplating or painting coating for corrosion prevention on one surface of the vapor chamber 360 (e.g., the first surface 461 of the first cover 411) to which the heat sink 560 is attached. One surface of the first cover 411 of the vapor chamber 360 may include a coating.

[0054] Figure 5b Examples of elements for heat dissipation are shown. For the same or similar descriptions, the same reference numerals may be used. Figure 5b , describes Figure 5a Thermal resistances in the heat dissipation structure of an electronic device.

[0055] Reference Figure 5b, can be arranged in the order of PCB 520, electronic component 340, TIM 540, heat spreader 360 and heat sink 560. The heat generated by the electronic component 340 can be conducted along the (+) z-axis direction and discharged to the outside. The fins of the heat sink 310 and the heat sink 560 can dissipate heat through the influence of wind in the air. On the path where the heat generated by the electronic component is conducted, there can be a thermal resistance (RJC) 581 of the electronic component 340, a thermal resistance (RTIM) 582 of the TIM 540, a thermal resistance (RvC) 583 of the heat spreader 360, a thermal resistance (Rwelding) 584 of the welding layer, and a thermal resistance (Rfin) 585 of the heat sink 560. Since the heat spreader 360 and the heat sink 310 are not in direct contact with each other, the thermal resistance of the TIM between the heat spreader 360 and the heat sink 310 can be ignored. In addition, without the thermal resistance caused by the thickness of the housing 300, the path from the vapor chamber 360 through the solder layer and the heat sink 560 can have a lower thermal resistance than the path through contact with the housing 300. Due to the low thermal resistance, the heat dissipation structure of the vapor chamber 360 and the heat sink 560 can provide improved heat dissipation performance.

[0056] Figure 6a to Figure 6b An example of the arrangement of multiple fins for heat dissipation is shown. Figures 6a to 6b In the figure, the image is viewed from the (+) z-axis direction to the (-) z-axis direction. Figure 5a to Figure 5b For the same or similar descriptions, the same reference numerals may be used.

[0057] Reference Figure 6a , the heat sink 310 of the housing 300 may include a plurality of first fins. The heat sink 560 (i.e., the second fin) may be disposed on one surface of the heat spreader 360. The thickness of each fin of the heat sink 560 may be less than the thickness of each first fin. Unlike the first fin formed by the die casting method with the housing 300, the second fin may have a relatively thin sheet shape due to separate manufacturing. For example, the thickness of the first fin formed by the die casting method may be about 1.64 mm, and the distance between the fins may be about 13 mm. The thickness of the second fin formed by the sheet may have a thickness of about 0.5 to 1.0 mm and a gap between the fins of about 5 to 10 mm.

[0058] exist Figure 6a In the example, the surfaces of the first fin and the second fin are arranged in an aligned manner in the x-axis direction, but the embodiments of the present disclosure are not limited thereto. According to the diversity of wind directions, the fins may also be aligned in such a way that the surface of each fin faces a different direction. Figure 6b, at least a portion of the fins may be arranged to face a direction tilted from the x-axis to the (-)y-axis, and the remaining portion of the fins may be arranged to face a direction tilted from the x-axis to the (+)y-axis.

[0059] Figure 7a An example of a heat spreader 360 including multiple metal materials is shown. Figure 7a In, it is described Figure 4a An example of a heat spreader 360 made of a variety of metal materials. Metals may have different properties depending on their type. Metals have different ionization tendencies depending on their type. The ionization tendency indicates the degree to which a metal is easy to become an ion. A metal with a large ionization tendency is easy to lose electrons and become an ion. On the contrary, a metal with a small ionization tendency is not easy to lose electrons and become an ion. For example, the ionization tendency of aluminum is higher than that of copper. In addition, metals have different thermal conductivities depending on their type. For example, the thermal conductivity of copper or silver is higher than that of aluminum. For the same or similar descriptions, the same figure marks may be used.

[0060] Reference Figure 7a In order to form the heat spreader 360, a composite material (clad) combining a first metal material 710 and a second metal material 720 can be used. A composite material is a material made by combining two or more metals. The composite material can give full play to the advantages of each metal and can be used in various fields. The first metal material 710 can form the outer surface of the heat spreader 360. The second metal material 720 can form the inner surface of the heat spreader 360. The ionization tendency of the first metal material 710 can be higher than the ionization tendency of the second metal material 720. The first metal material 710 with a high ionization tendency can react with oxygen in the air to form an oxide film. Due to the oxide film, the oxidation resistance is increased and corrosion can be prevented. For example, the first metal material 710 may include aluminum. The second metal material 720 may include copper. That is, the composite material may be an aluminum-copper composite material. For example, the aluminum-copper composite material has a thickness of about 0.3 to 1.5 mm (millimeter), the thickness ratio of copper may be about 30 to 50%, and the thickness ratio of aluminum may be about 50 to 70%. The first cover body 411 and the second cover body 412 may be made of aluminum-copper composite materials.

[0061] The first substrate 711 may be formed of an aluminum-copper composite material. The second surface 471 of the first substrate 711 may be a copper surface. The second substrate 712 may be formed of an aluminum-copper composite material. The second surface 472 of the second substrate 712 may be a copper surface. Since the copper surface is located on the inner side rather than the outside, the copper is not exposed to the air, so that the heat spreader 360 can provide strong corrosion resistance. A space surrounded by copper can be formed by joining the second surface 471 of the first substrate 711 and the second surface 472 of the second substrate 712 to face each other. A working fluid (e.g., water) may be arranged inside the space. Since the first metal material 710 (e.g., aluminum) is disposed outside the heat spreader 360, a heat sink (e.g., heat sink 560) having the first metal material 710 may be easily disposed. Since it is the same metal material, unnecessary processes during welding can be omitted, and the thermal resistance (e.g., thermal resistance 584) generated by welding can also be reduced. In order to make the surface exposed to the outside (e.g., the first surface 461 of the first substrate 411) more durable in the air, an additional paint coating may be performed. The coating layer can maintain heat dissipation performance, so the electronic device can be used for a long time when exposed to the outdoor environment.

[0062] Instead of using only a single metal material (e.g., copper) to form the vapor chamber, the vapor chamber may be formed by a metal material (e.g., aluminum) having a lower specific gravity than the metal material and a composite material combining the metal material. The vapor chamber may be made lighter by using a metal material having a lower specific gravity. For example, the first cover 411 and the second cover 412 of the vapor chamber may be formed by an aluminum-copper composite material combining aluminum and copper. According to one embodiment, at least a portion of the vapor chamber may be formed by Figure 5a The heat sink exposed by the opening area 569 can be formed by the aluminum-copper composite material. Figure 7a As shown, the heat sink formed by the aluminum-copper composite material itself can be understood as an embodiment of the present disclosure. In other words, even if the housing 300 covers the heat sink and there is no Figure 5a The opening area 569, the structure of the heat sink formed by the aluminum-copper composite material, and the electronic device including the structure can be understood as an embodiment of the present disclosure.

[0063] Figure 7b Other examples of heat spreaders 360 including multiple metal materials are shown. Figure 7b In, it is described Figure 4a The heat spreader 360 is made of a variety of metal materials. Metals can have different properties depending on the type. Metals have different ionization tendencies depending on the type. And, metals have different thermal conductivity coefficients depending on the type.

[0064] Reference Figure 7b , the first cover 411 of the vapor chamber 360 may include a first portion 411a having a first metal material 710 and a second portion 411b having a second metal material 720. For example, the first cover 411 may include a composite material combining dual metal materials. A surface 761 of the first portion 411a may be bonded to a surface 762 of the second portion 411b. A surface 761 of the first portion 411a may be opposite to the first surface 461 of the first cover 411. A surface 762 of the second portion 411b may be opposite to the second surface 471 of the first cover 411.

[0065] According to one embodiment, the first metal material 710 may include aluminum. The second metal material 720 may include copper. For example, in the product state of the copper vapor chamber, the aluminum sheet may be bonded to the copper surface on one side (e.g., one surface 762 of the second portion 411b). In other words, the vapor chamber 360 may include the copper vapor chamber and the aluminum sheet (e.g., the first portion 411a of the first cover 411). For example, the first cover 411 may include a copper-aluminum composite material. Since the copper vapor chamber is formed as a single product and a space is formed by a single material, the vapor chamber 360 can ensure the original function of evaporating the working fluid to transfer heat. Although aluminum has strong corrosion resistance to oxygen, it has weak resistance to water reaction due to low heat dissipation performance and explosion. On the contrary, although copper has weak corrosion resistance to oxygen, it has strong resistance to water. Therefore, the aluminum sheet is located in the portion exposed to the outside, and the internal space for storing the fluid (e.g., water) is formed by copper, so that the vapor chamber 360 can be stably formed. In addition, since the specific gravity of aluminum is lower than that of copper, the volume and weight of the heat spreader 360 can be more effectively formed. The strength of the additional aluminum sheet can be enhanced, and the thickness of the copper can be reduced, so Figure 7b The Vapor Chamber 360 is lighter than a vapor chamber made of copper alone.

[0066] exist Figure 7b In the embodiment, a heat sink formed of copper and a heat sink including an aluminum sheet (such as the first portion 411a of the first cover 411) are exemplified, but the embodiments of the present disclosure are not limited thereto. According to one embodiment, other metal materials (such as metals having a property of being more resistant to oxidation corrosion than copper) may be used instead of the aluminum sheet.

[0067] Instead of using only a single metal material (e.g., copper) to form the heat spreader, a metal material (e.g., aluminum) with a lower specific gravity than the metal material can be used to form the heat spreader. The heat spreader can be made lighter by using a metal material with a lower specific gravity. This is because when aluminum is used, the thickness of the copper part in the heat dissipation structure can be reduced. For example, an aluminum sheet can be combined with a copper heat spreader. The first cover 411 of the heat spreader may include a combination structure of aluminum and copper. According to one embodiment, at least a portion of the heat spreader is formed by Figure 5a The heat sink exposed by the opening area 569 may include the Figure 7b At the same time, Figure 7b As shown, the heat spreader itself, which is combined with aluminum sheet instead of the copper portion of the upper surface of the conventional heat spreader, can be understood as an embodiment of the present disclosure. In other words, even if the housing 300 covers the heat spreader and there is no Figure 5a The opening area 569, the structure of the heat sink formed by the combination, and the electronic device including the structure can be understood as an embodiment of the present disclosure.

[0068] Figure 8 An example of an electronic device (e.g., base station 110, terminal 120, DU, RU, MMU, AU) including a heat dissipation structure is shown. Figure 8 , a cross section of the interior of one housing (eg, a first housing 210 and a second housing 220) of an electronic device is described.

[0069] Reference Figure 8 , the electronic device may include a housing 300. The stereogram 800 shows an example in which the first fins of the heat sink 310 of the housing 300 are arranged downward. The first fins of the heat sink 310 may have a length in the (+) z-axis direction, and each fin may have a plate shape. The first fins of the heat sink 310 may have a first thickness. The distance between the first fins may be a first length. A plurality of electronic components may be arranged inside the housing 300 of the electronic device. The housing 300 of the electronic device may protect the electronic components or the PBA containing the electronic components from the external environment.

[0070] The electronic device may include a plurality of modules (e.g., a first module 851 and a second module 852). Each of the plurality of modules may include a heat dissipation structure. Each module may be referred to as a heat dissipation module, a communication module, a fin module, a radiator module, or a term having an equivalent technical meaning thereto. For example, the first module 851 may include an electronic component 341, a heat sink 361, and a heat sink 561. The second module 852 may include an electronic component 342, a heat sink 362, and a heat sink 562. The heat sink 561 and the heat sink 562 (hereinafter referred to as the second fin) may have a second thickness. The interval between the second fins may be a second length. Unlike the first fin formed by the die casting method, the second fin is formed by a separate sheet, and the formed second fin may be welded and attached to one surface of the heat sink. Due to the relatively sufficient margin, the second thickness may be less than the first thickness. In addition, the second length may be shorter than the first length. In other words, the second fin may be arranged more densely in a limited space than the first fin. Thus, the heat dissipation performance is improved, and since the second fin is directly bonded to the heat spreader 360 without the case 300 , the communication device can be made lighter.

[0071] Another electronic device of an embodiment of the present disclosure relates to a heat dissipation device used for various communication equipment such as mobile communication base stations (e.g., DU, RU, MMU) and relay stations (HPA (high power amplifier), LPA (low power amplifier), etc.) as outdoor housings. The heat of the electronic components can be dissipated to the outside through fins (e.g., heat sink 560) exposed to the air. In addition, in order to use for a long time under conditions exposed to the external environment, a specific material (e.g., aluminum) can be used for the coating of the heat sink or the heat spreader 560 so that it has strong corrosion resistance. In addition, since reducing the thickness of the heat sink will lead to a decrease in heat dissipation performance, the result is that the overall volume of the communication device is increased. According to the heat dissipation structure of the embodiment of the present disclosure, unlike the die-casting method of the heat sink 310 formed integrally with the housing 300, a separately manufactured heat sink is directly attached to one surface of the heat spreader 360, so that a heat sink that is thinner and longer than the heat sink of the heat sink 310 can be achieved. The thinner the fins are, the more heat sinks can be provided, and the longer each fin is formed, the better the heat dissipation performance can be. Since one area of ​​the housing 300 is opened, and thus one surface of the vapor chamber 360 is exposed, the communication device can be made lightweight.

[0072] Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and those having ordinary skill in the art may clearly understand other effects not mentioned from the following description.

[0073] According to an embodiment of the present disclosure, an electronic device is provided. The electronic device may include: a housing having a plurality of first fins; a plurality of second fins; a vapor chamber having a first cover, a second cover and a plurality of pillars; an electronic component; and a printed circuit board (PCB). The housing may include at least one heat sink portion forming an opening area. The vapor chamber, through the opening area, may be configured so that at least a portion of the first surface of the first cover of the vapor chamber is exposed. The plurality of second fins may be disposed on at least a portion of the first surface of the exposed first cover. The electronic component may be disposed on one surface of the printed circuit board. The electronic component may be disposed in a space between the first surface of the second cover facing the one surface of the printed circuit board and the one surface of the printed circuit board.

[0074] According to an embodiment, a thickness of a second fin among the plurality of second fins may be thinner than a thickness of a first fin among the plurality of first fins.

[0075] According to an embodiment, the plurality of columns may be disposed between the first cover and the second cover, and a fluid may be disposed in the space between the first cover, the second cover, and the plurality of columns.

[0076] According to one embodiment, the vapor chamber may include: a first wick structure coupled to a second surface of the first cover body opposite to the first surface; and a second wick structure coupled to a second surface of the second cover body opposite to the first surface.

[0077] According to one embodiment, the first wick structure may include a plurality of first holes for the plurality of pillars. The second wick structure may include a plurality of second holes for the plurality of pillars.

[0078] According to one embodiment, the invention may further include: an upper cover body, which is combined on a second surface of the first cover body opposite to the first surface. The plurality of columns may be arranged between the upper cover body and the second cover body. The first cover body may be made of a first metal material. The upper cover body may be made of a second metal material different from the first metal material.

[0079] According to an embodiment, the first metal material may include aluminum. The second metal material may include copper.

[0080] According to an embodiment, the first cover may include a first clad metal composed of a first metal material and a second metal material. The first cover may include a second clad metal composed of the first metal material and the second metal material.

[0081] According to an embodiment, the first metal material may include aluminum. The second metal material may include copper.

[0082] According to an embodiment, the first surface of the first cover may include the first metal material of the first composite metal. The first surface of the second cover may include the first metal material of the second composite metal. The second surface of the first cover opposite to the first surface may include the second metal material of the first composite metal. The second surface of the second cover opposite to the first surface may include the second metal material of the second composite metal.

[0083] According to an embodiment, the electronic device may further include a thermal interface material (TIM). The TIM may contact the electronic component and the first surface of the second cover.

[0084] According to an embodiment, the electronic device may further include at least one electronic component mounted on the one surface of the printed circuit substrate. The at least one electronic component may be arranged to contact the housing. The temperature margin for the at least one electronic component may be higher than the temperature margin for the electronic component.

[0085] According to an embodiment, the electronic component may include at least one of a processor, a central processing unit (CPU) or a field programmable gate array (FPGA). The at least one electronic component may include a component having a power amplifier.

[0086] According to an embodiment, the electronic device may further include a gasket, and a region of the first surface of the first cover body that is different from at least a portion of the first surface of the first cover body that is exposed may be combined with the housing through the gasket.

[0087] According to one embodiment, the electronic device may include a radio unit (RU), a distributed unit (DU), a digital unit (DU), or a massive multiple input multiple output (MIMO) unit (MMU).

[0088] According to one embodiment, the plurality of first fins may be arranged on a surface of the at least one heat sink portion. The plurality of first fins and the plurality of second fins may protrude in a direction toward which the first surface of the first cover body faces. Each of the plurality of first fins may be plate-shaped. Each of the plurality of second fins may be plate-shaped. The first cover body of the vapor chamber may include a coating layer. The coating layer may include at least a portion of the first surface of the first cover body that is exposed.

[0089] According to an embodiment of the present disclosure, an electronic device is provided. The electronic device may include: a housing having a plurality of first fins; a plurality of modules; and a printed circuit board (PCB). Each of the plurality of modules may include: a plurality of second fins; a vapor chamber having a first cover, a second cover and a plurality of pillars; and an electronic component. The housing may include at least one heat sink portion forming an opening area. The vapor chamber, through the opening area, may be configured so that at least a portion of the first surface of the first cover of the vapor chamber is exposed. The plurality of second fins may be disposed on at least a portion of the first surface of the exposed first cover. The electronic component may be disposed on one surface of the printed circuit substrate. The electronic component may be disposed in a space between the first surface of the second cover facing the one surface of the printed circuit substrate and the one surface of the printed circuit substrate.

[0090] According to an embodiment, a thickness of a second fin among the plurality of second fins may be thinner than a thickness of a first fin among the plurality of first fins.

[0091] According to an embodiment, the housing may be formed based on a first metal material. The heat sink of each of the plurality of modules may be formed based on the first metal material and a second metal material. The first surface of the first cover may include the first metal material. At least a portion of the second cover may include the second metal material. The first metal material may include aluminum. The second metal material may include copper.

[0092] According to an embodiment, the electronic device may further include a gasket, and a region of the first surface of the first cover body that is different from at least a portion of the first surface of the first cover body that is exposed may be combined with the housing through the gasket.

[0093] According to an embodiment of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure is combined with the first metal structure, and a space for a fluid may be formed between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns arranged in the space. The first metal structure may be formed based on a composite material combined with a first metal material and a second metal material. The second metal structure may be formed based on a composite material combined with the first metal material and the second metal material. The first metal structure may be configured such that the first metal material is located on a first surface of the first metal structure, and the second metal material is located on a second surface of the first metal structure opposite to the first surface. The second metal structure may be configured such that the first metal material is located on a first surface of the second metal structure, and the second metal material is located on a second surface of the second metal structure opposite to the first surface. At least a portion of the second surface of the first metal structure may be combined with at least a portion of the second surface of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0094] According to an embodiment of the present disclosure, a vapor chamber is provided. The vapor chamber may include a first metal structure and a second metal structure. The second metal structure is combined with the first metal structure, and a space for a fluid may be formed between the first metal structure and the second metal structure. The vapor chamber may include a plurality of columns arranged in the space. The vapor chamber may include a third metal structure. The third metal structure may be formed based on the first metal material. The first metal structure and the second metal structure may be formed based on the second metal material. The first surface of the first metal structure may be combined with the third metal structure. At least a portion of the second surface of the first metal structure opposite to the first surface may be combined with at least a portion of the second metal structure. The first metal material may include aluminum. The second metal material may include copper.

[0095] In the specific embodiments of the present disclosure described above, the constituent elements included in the present disclosure are expressed in the singular or plural according to the specific embodiments presented. However, for the sake of convenience, the expression of the singular or plural is appropriately selected according to the presented situation, and the present disclosure is not limited to the singular or plural constituent elements, even if the constituent elements expressed in the plural may be composed of the singular, or the constituent elements expressed in the singular may be composed of the plural.

[0096] According to an embodiment, one or more constituent elements or operations in the above-mentioned corresponding constituent elements can be omitted, or one or more other constituent elements or operations can be added. Alternatively or additionally, multiple constituent elements (e.g., modules or programs) can be integrated into one constituent element. At this time, the integrated constituent element can perform one or more functions of each constituent element in multiple constituent elements, and these functions are the same or similar to the functions performed by the corresponding constituent elements in multiple constituent elements before integration. According to an embodiment, the actions performed by modules, programs or other constituent elements can be performed sequentially, in parallel, repeatedly or heuristically, or more than one of the actions can be performed in different orders, omitted, or more than one other actions can be appended.

[0097] In addition, in the detailed description of the present disclosure, specific embodiments have been described, but various modifications may be made without departing from the scope of the present disclosure.

Claims

1. An electronic device comprising: a housing having a plurality of first fins; a plurality of second fins; A heat spreader having a first cover, a second cover and a plurality of columns; Electronic components; as well as Printed Circuit Board PCB, The housing includes at least one heat sink portion forming an open area, The vapor chamber, through the open area, at least a portion of the first surface of the first cover of the vapor chamber is exposed, The plurality of second fins are disposed on the at least a portion of the first surface of the first cover that is exposed, The electronic component is disposed on one surface of the printed circuit board, The electronic component is provided in a space between a first surface of the second cover body facing the one surface of the printed circuit board and the one surface of the printed circuit board.

2. The electronic device according to claim 1, wherein: The thickness of the second fins among the plurality of second fins is thinner than the thickness of the first fins among the plurality of first fins.

3. The electronic device according to claim 1, wherein: The plurality of columns are disposed between the first cover and the second cover, A fluid is disposed in the space between the first cover, the second cover, and the plurality of columns.

4. The electronic device according to claim 1, wherein: The heat sink comprises: A first liquid-absorbing core structure is bonded to a second surface of the first cover body opposite to the first surface; and The second liquid-absorbing core structure is combined on a second surface of the second cover body opposite to the first surface.

5. The electronic device as claimed in claim 4, wherein: The first wick structure includes a plurality of first holes for the plurality of columns, The second wick structure includes a second plurality of holes for the plurality of posts.

6. The electronic device as claimed in claim 4, wherein: It also includes: an upper cover body, which is combined on a second surface of the first cover body opposite to the first surface, The plurality of columns are arranged between the upper cover and the second cover, The first cover is made of a first metal material. The upper cover is made of a second metal material different from the first metal material.

7. The electronic device as claimed in claim 6, wherein: The first metal material includes aluminum. The second metal material includes copper.

8. The electronic device as claimed in claim 1, wherein: The first cover body comprises a first composite material metal composed of a first metal material and a second metal material. The first cover body includes a second composite material metal formed by the first metal material and the second metal material.

9. The electronic device as claimed in claim 8, wherein: The first metal material includes aluminum. The second metal material includes copper.

10. The electronic device according to claim 8, wherein: The first surface of the first cover includes the first metal material of the first composite metal. The first surface of the second cover includes the first metal material of the second composite material metal, A second surface of the first cover body opposite to the first surface includes the second metal material of the first composite metal. A second surface of the second cover body opposite to the first surface includes the second metal material of the second composite metal.

11. The electronic device according to claim 1, wherein: It also includes thermal interface materials TIM, The TIM contacts the electronic component and the first surface of the second cover.

12. The electronic device according to claim 1, wherein: further comprising at least one electronic component mounted on the one surface of the printed circuit substrate, The at least one electronic component is arranged to contact the housing, A temperature margin for the at least one electronic component is higher than a temperature margin for the electronic component.

13. The electronic device according to claim 12, wherein: The electronic component includes at least one of a processor, a central processing unit CPU or a field programmable gate array FPGA, The at least one electronic component includes a component having a power amplifier.

14. The electronic device according to claim 1, wherein: Also includes washers, A region of the first surface of the first cover body, different from at least a portion of the first surface of the first cover body that is exposed, is coupled to the housing through the gasket.

15. The electronic device according to claim 1, wherein: The electronic device comprises a radio unit RU, a distributed unit DU, a digital unit DU or a massive multi-input multi-output unit MMU.

16. The electronic device as claimed in claim 1, wherein: The plurality of first fins are disposed on a surface of the at least one heat sink portion, The plurality of first fins and the plurality of second fins protrude in a direction toward which the first surface of the first cover faces, Each of the plurality of first fins is in a plate shape, Each of the plurality of second fins is in a plate shape, The first cover of the vapor chamber comprises a coating, The coating includes the at least a portion of the first surface of the first cover that is exposed.

17. An electronic device comprising: a housing having a plurality of first fins; Multiple modules; as well as Printed Circuit Board PCB, Each of the plurality of modules comprises: a plurality of second fins; A heat spreader having a first cover, a second cover, and a plurality of columns; and Electronic components, The housing includes at least one heat sink portion forming an open area, The vapor chamber, through the open area, at least a portion of the first surface of the first cover of the vapor chamber is exposed, The plurality of second fins are disposed on the at least a portion of the first surface of the first cover that is exposed, The electronic component is disposed on one surface of the printed circuit board, The electronic component is provided in a space between a first surface of the second cover body facing the one surface of the printed circuit board and the one surface of the printed circuit board.

18. The electronic device as claimed in claim 17, wherein: The thickness of the second fins among the plurality of second fins is thinner than the thickness of the first fins among the plurality of first fins.

19. The electronic device according to claim 17, wherein: The housing is formed based on a first metal material. The heat sink of each module in the plurality of modules is formed based on the first metal material and the second metal material, The first surface of the first cover includes the first metal material, At least a portion of the second cover includes the second metal material, The first metal material includes aluminum. The second metal material includes copper.

20. The electronic device of claim 17, wherein: Also includes washers, A region of the first surface of the first cover body, different from at least a portion of the first surface of the first cover body that is exposed, is coupled to the housing through the gasket.

21. A vapor chamber, comprising: a first metal structure; a second metal structure, the second metal structure being combined with the first metal structure to form a space for a fluid between the first metal structure and the second metal structure; as well as A plurality of columns are arranged in the space; The first metal structure is formed based on a composite material composed of a first metal material and a second metal material. The second metal structure is formed based on a composite material formed by combining the first metal material and the second metal material. The first metal structure is configured such that the first metal material is located on a first surface of the first metal structure, and the second metal material is located on a second surface of the first metal structure opposite to the first surface. The second metal structure is configured such that the first metal material is located on a first surface of the second metal structure, and the second metal material is located on a second surface of the second metal structure opposite to the first surface. At least a portion of the second surface of the first metal structure is bonded to at least a portion of the second surface of the second metal structure, The first metal material includes aluminum, The second metal material includes copper.

22. A vapor chamber, comprising: a first metal structure; a second metal structure, the second metal structure being combined with the first metal structure to form a space for a fluid between the first metal structure and the second metal structure; A plurality of columns are arranged in the space; as well as The third metal structure; The third metal structure is formed based on the first metal material. The first metal structure and the second metal structure are formed based on the second metal material. The first surface of the first metal structure is combined with the third metal structure. At least a portion of a second surface of the first metal structure opposite to the first surface is bonded to at least a portion of the second metal structure, The first metal material includes aluminum, The second metal material includes copper.

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