Fully automatic online wafer dispensing machine
By using a combination of cover plate and heating components in the wafer dispenser, the temperature stability is automatically maintained after the dispensing is completed, and the structure of the electric push rod and support plate can be achieved to achieve flexible lifting and horizontal conveying of the wafer, which solves the problems of temperature maintenance and wafer conveying structure in the prior art, and improves the adaptability and convenience of the device.
Patent Information
- Application Number
- CN202411783766.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2044-12-06
AI Technical Summary
The existing wafer dispenser cannot maintain the appropriate temperature after dispensing, and cannot lift or transport the wafer horizontally without affecting the wafer conveying structure.
A fully automatic online wafer dispenser is designed, which uses a combination of cover plate and heating components to ensure that the heating function is automatically turned on after dispensing is completed and the temperature is maintained. At the same time, by providing the structure of the first electric push rod, the first support plate and the second support plate, the lifting and horizontal conveying of the wafer are realized to ensure that the wafer conveying structure is not affected.
It effectively avoids the problem of rapid cooling of glue, and realizes flexible lifting and horizontal conveying of wafers without affecting the wafer conveying structure, improving the adaptability and convenience of the device.
Smart Images

Figure CN119237251B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer glue dispensing machines, in particular to a fully automatic online wafer glue dispensing machine. Background Art
[0002] In the integrated circuit manufacturing process, the packaging and connection quality of the wafer directly affects the performance and reliability of the chip. The wafer dispensing machine is mainly responsible for accurately applying glue or other materials on the wafer surface to achieve chip packaging, connection or other functions. The dispensing machine plays an important role in the production of integrated circuits and other electronic components. The existing dispensing machines still have some shortcomings when used.
[0003] The invention patent with publication number CN113828477A discloses a wafer working platform and a glue dispensing machine having the same, including: a heating support platform; a heater, the upper surface of which is formed as a heating surface, the wafer is located above the heating surface, and when the glue dispensing machine body is located at the glue dispensing position, the glue dispensing machine body is located above the wafer; a glue dispensing insulation platform, which is arranged on one side of the heating support platform, and the glue dispensing insulation platform has an insulation surface that can heat the glue dispensing machine body. When the glue dispensing machine body is located at the insulation position, the glue dispensing machine body is close to the insulation surface. The wafer working platform can not only ensure that the temperature of the glue meets the glue dispensing requirements and prevent the glue from cooling and not easily flowing out, but also make the temperature of each position of the glue dispensing machine body uniform, thereby improving the glue dispensing quality. Although the above-mentioned device can prevent the glue from flowing out, it cannot maintain a certain temperature after the dispensing is completed to facilitate subsequent processing. It cannot automatically move the dispensing equipment down to perform the dispensing work after the wafer is transported to the appropriate position. In addition, the existing dispensing machine cannot lift or lower or transport the wafer horizontally without affecting the wafer conveying structure when in use. Summary of the invention
[0004] In view of the problems existing in the existing wafer dispensing machine, the present invention is proposed.
[0005] To solve the above technical problems, the present invention provides the following technical solutions: a fully automatic online wafer dispensing machine, comprising a shell, a connecting shell is installed on the shell, a heat conducting plate is installed on the connecting shell, a cover plate is hinged on the connecting shell, a heating assembly is installed on the cover plate, an electric heating tube is arranged in the heating assembly, a driving assembly is installed in the shell, a conveying assembly is arranged inside the connecting shell, a first electric push rod is fixedly arranged in the middle of the connecting shell, a first connecting block is fixedly connected to the first electric push rod, a first supporting plate is fixedly installed on the first connecting block, a second supporting plate is slidably connected to the left and right sides of the first supporting plate, a second guide rod is installed on the second supporting plate on the right side of the first supporting plate, a guide rod and a third guide rod are fixedly arranged on the connecting shell, a traction steel rope is fixedly connected to the second guide rod, the traction steel rope is connected to the driving assembly through the guide rod, an adjusting block is installed below the driving assembly, a second electric push rod is fixedly arranged below the adjusting block, and a dispensing machine body is installed at the bottom of the second electric push rod.
[0006] As a preferred solution of the present invention, the top of the connecting shell is an open structure, the length of the opening at the top of the connecting shell is greater than the length of the first support plate, and the width of the opening at the top of the connecting shell is greater than the width of the first support plate.
[0007] As a preferred solution of the present invention, a rubber pad is fixedly connected to the cover plate, and the cover plate forms a clamping structure with the connecting shell through the rubber pad.
[0008] As a preferred solution of the present invention, the heating assembly includes a connecting plate fixedly connected to the top of the cover plate, a connecting cover fixedly connected to the connecting plate, the electric heating tube is installed in the connecting cover, a conductive plate is installed on the electric heating tube, a power supply is installed on the connecting shell, and a conductive contact is connected to the power supply.
[0009] As a preferred scheme of the present invention, the driving assembly includes a first motor slidably mounted on the housing, a first screw is connected to the output shaft of the first motor, a first guide rail is fixedly arranged on the first motor, a first slider is slidably mounted in the first guide rail, the first screw and the first slider are threadedly connected, a second guide rail is fixedly connected to the bottom of the first slider, a second slider is slidably mounted in the second guide rail, a second screw is threadedly mounted in the second slider, the second screw and the second guide rail are rotatably connected, a second motor is fixedly arranged on the second guide rail, a synchronous wheel is fixedly connected to the output shaft of the second motor, and a synchronous belt is installed between the synchronous wheel and the second screw.
[0010] As a preferred solution of the present invention, a fixing ring is fixedly connected to the side of the first guide rail, a third guide rod is fitted inside the fixing ring, the third guide rod and the connecting shell are fixedly connected, and the first guide rail forms a lifting structure with the third guide rod through the second guide rod, traction steel rope, guide rod and fixing ring.
[0011] As a preferred solution of the present invention, the second slider and the adjusting block are fixedly connected, the adjusting block forms a first sliding structure with the second guide rail through the second slider and the second screw, and the second guide rail forms a second sliding structure with the first slider and the first screw.
[0012] As a preferred solution of the present invention, the conveying assembly includes a bracket slidably mounted on a connecting shell, a third motor is fixedly mounted on the bracket, a roller is fixedly connected to the output shaft of the third motor, conveyor belts are mounted on both sides of the roller, bumps are equidistantly mounted on the conveyor belt, a convex plate is fixedly mounted on the connecting shell, and a first spring is mounted between the convex plate and the bracket.
[0013] As a preferred solution of the present invention, a first guide rod is installed on the second support plate on the left side of the first support plate, and the first guide rod runs through the interior of the connecting shell. The second support plates on the left and right sides of the first support plate are both slidably connected to the connecting shell.
[0014] As a preferred solution of the present invention, a first connecting block is fixedly provided on the first supporting plate, a second connecting block is fixedly connected to the first connecting block, a third connecting block is fixedly connected to the second supporting plate, a second spring is fixedly connected between the third connecting block and the second connecting block, a height of the first connecting block is greater than a thickness of the first supporting plate, and the thicknesses of the first supporting plate and the second supporting plate are the same.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] 1. By setting the cover and heating assembly, when the cover is closed, the conductive plate on the electric heating tube will contact the conductive contact on the connecting shell, so that the conductive plate and the conductive contact, thereby energizing the electric heating tube, heating the heat-conducting plate, so that the device can maintain a suitable temperature in the connecting shell during operation, avoiding rapid cooling of the glue after the dispensing is completed, and the device can automatically turn on the heating function after closing the cover, and automatically turn off the heating function after opening the cover, solving the problem that the existing wafer dispensing machine cannot maintain a certain temperature after the dispensing is completed.
[0017] 2. The device is provided with a first electric push rod, a first support plate and a second support plate. After the wafer is placed on the conveyor belt, the first support plate is moved upward by extending the first electric push rod, driving the second support plate to slide upward. After the second support plate moves to the top, the first support plate can continue to move. When the conveyor belt is pulled upward, the bracket on the conveying assembly will be pulled toward the middle of the connecting shell, so that the first spring is stretched. When the dispensing is completed, the first electric push rod can be shortened, and the first spring will automatically reset the bracket, so that the device can lift and transport the wafer horizontally without affecting the conveying structure, thereby enhancing the adaptability of the device and solving the problem that the existing wafer dispensing machine cannot lift or transport the wafer horizontally without affecting the wafer conveying structure.
[0018] 3. By setting the second guide rod, traction steel rope, guide rod and third guide rod, when the first electric push rod extends and transports the wafer upward, the second guide rod moves upward, and the bottom end of the traction steel rope moves upward. Under the action of the guide rod, the first guide rail automatically moves downward, so that the device can automatically move the drive assembly and the dispensing machine body downward while raising the wafer, thereby improving the convenience of using the device and solving the problem that the existing dispensing device cannot automatically move the dispensing equipment downward to perform dispensing work after the wafer is transported to the appropriate position. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in combination with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:
[0020] Figure 1 It is a schematic diagram of the overall structure of the fully automatic online wafer dispensing machine of the present invention;
[0021] Figure 2 yes Figure 1 A magnified schematic diagram of the structure at center A;
[0022] Figure 3 It is a schematic diagram of the connection structure between the cover plate and the heating assembly of the present invention;
[0023] Figure 4 It is a schematic diagram of the internal structure of the housing of the present invention;
[0024] Figure 5 yes Figure 4 A magnified schematic diagram of the structure at B in the middle;
[0025] Figure 6 This is a schematic diagram of the connection structure of the connection shell and the conveying assembly of the present invention;
[0026] Figure 7 is a schematic diagram of the connection structure of the first support plate and the second support plate of the present invention;
[0027] Figure 8 yes Figure 7 A magnified schematic diagram of the structure at C in the middle;
[0028] Fig. 9 It is a schematic diagram of the structure of the drive assembly of the present invention;
[0029] Fig.10 yes Fig. 9 A magnified schematic diagram of the structure at position D in the middle.
[0030] Reference numerals: 1, housing; 2, connecting housing; 3, heat conducting plate; 4, cover plate; 5, heating assembly; 501, connecting plate; 502, connecting cover; 503, conductive plate; 504, power supply; 505, conductive contact; 6, electric heating tube; 7, rubber pad; 8, driving assembly; 801, first motor; 802, first screw; 803, first guide rail; 804, first slider; 805, second guide rail; 806, second slider; 807, second screw; 808, second motor; 809, synchronous wheel; 810, synchronous belt; 9, conveying assembly; 901, bracket; 902, third motor; 903, convex plate; 904, first spring; 905, roller; 906, conveyor belt; 907, convex block; 10, first electric push rod; 11, first support plate; 12, second support plate; 13, first connecting block; 14, second connecting block; 15, second spring; 16, third connecting block; 17, adjusting block; 18, second electric push rod; 19, dispensing machine body; 20, first guide rod; 21, second guide rod; 22, traction rope; 23, guide rod; 24, fixing ring; 25, third guide rod. DETAILED DESCRIPTION
[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0033] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.
[0034] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
[0035] like Figure 1-Figure 10 As shown, the fully automatic online wafer dispensing machine comprises a shell 1, a connecting shell 2 is installed on the shell 1, a heat conducting plate 3 is installed on the connecting shell 2, a cover plate 4 is hinged on the connecting shell 2, a heating component 5 is installed on the cover plate 4, an electric heating tube 6 is arranged in the heating component 5, a driving component 8 is installed in the shell 1, a conveying component 9 is arranged inside the connecting shell 2, a first electric push rod 10 is fixedly arranged in the middle of the connecting shell 2, a first connecting block 13 is fixedly connected to the first electric push rod 10, a first supporting plate 11 is fixedly installed on the first connecting block 13, the left and right sides of the first supporting plate 11 are both slidably connected to the second supporting plate 12, a second guide rod 21 is installed on the second supporting plate 12 on the right side of the first supporting plate 11, a guide rod 23 and a third guide rod 25 are fixedly arranged on the connecting shell 2, a traction steel rope 22 is fixedly connected to the second guide rod 21, and the traction steel rope 22 is connected to the driving component 8 through the guide rod 23. An adjusting block 17 is installed below the driving component 8, and a second electric push rod 18 is fixedly arranged below the adjusting block 17. A dispensing machine body 19 is installed at the bottom of the second electric push rod 18. The driving component 8 is used to adjust the left and right position and the front and back position of the second electric push rod 18. The second electric push rod 18 is used to adjust the height of the dispensing machine body 19, thereby changing the dispensing position. The conveying component 9 is used to convey the wafer to a suitable position, and the height of the first support plate 11 and the second support plate 12 is changed by extending the first electric push rod 10, so as to push the wafer to a suitable position for dispensing. After the first electric push rod 10 is extended, the second guide rod 21 will move upward, thereby causing the end of the traction steel rope 22 to move upward. Under the guiding action of the guide rod 23, the driving component 8 will move downward, so that the device can automatically lower the dispensing machine body 19 while lifting the wafer, thereby enhancing the convenience of the device when used.
[0036] In this embodiment, the top of the connecting shell 2 is an open structure, the length of the opening at the top of the connecting shell 2 is greater than the length of the first support plate 11, and the width of the opening at the top of the connecting shell 2 is greater than the width of the first support plate 11. The opening at the top of the connecting shell 2 facilitates the subsequent transportation of the wafer to a suitable position, and the first support plate 11 can move up and down in the opening, thereby ensuring the stability of the device when in use.
[0037] In this embodiment, a rubber pad 7 is fixedly connected to the cover plate 4, and a snap-fit structure is formed between the cover plate 4 and the connecting shell 2 through the rubber pad 7. Through the snap-fit structure on the device, after the cover plate 4 is closed, the rubber pad 7 can clamp the cover plate 4 on the connecting shell 2, thereby ensuring a constant temperature inside the device.
[0038] In this embodiment, the heating assembly 5 includes a connecting plate 501 fixedly connected to the top of the cover plate 4, a connecting cover 502 fixedly connected to the connecting plate 501, the electric heating tube 6 is installed in the connecting cover 502, a conductive plate 503 is installed on the electric heating tube 6, a power supply 504 is installed on the connecting shell 2, and a conductive contact 505 is connected to the power supply 504. When the cover plate 4 is closed, the conductive plate 503 on the electric heating tube 6 will contact the conductive contact 505 on the power supply 504, so that the electric heating tube 6 is automatically energized for heating, so that the device will not cool down quickly after the dispensing is completed, so as to facilitate subsequent processing.
[0039] In this embodiment, the driving assembly 8 includes a first motor 801 slidably mounted on the housing 1, a first screw 802 is connected to the output shaft of the first motor 801, a first guide rail 803 is fixedly provided on the first motor 801, a first slider 804 is slidably mounted in the first guide rail 803, the first screw 802 and the first slider 804 are threadedly connected, a second guide rail 805 is fixedly connected to the bottom of the first slider 804, a second slider 806 is slidably mounted in the second guide rail 805, a second screw 807 is threadedly mounted in the second slider 806, and the second screw 807 is threadedly mounted in the second slider 806. The rod 807 and the second guide rail 805 are rotatably connected. A second motor 808 is fixedly arranged on the second guide rail 805. A synchronous wheel 809 is fixedly connected to the output shaft of the second motor 808. A synchronous belt 810 is installed between the synchronous wheel 809 and the second screw 807. The first motor 801 drives the first screw 802 to rotate, thereby driving the first slider 804 and the second guide rail 805 to move left and right. The second motor 808 drives the second screw 807 to rotate, thereby driving the second slider 806 to move forward and backward, so that the device can change the dispensing position.
[0040] In this embodiment, a fixing ring 24 is fixedly connected to the side of the first guide rail 803, and a third guide rod 25 is fitted inside the fixing ring 24. The third guide rod 25 and the connecting shell 2 are fixedly connected. The first guide rail 803 forms a lifting structure with the third guide rod 25 through the second guide rod 21, the traction steel rope 22, the guide rod 23 and the fixing ring 24. Through the lifting structure on the device, when the second guide rod 21 moves upward, the bottom of the traction steel rope 22 will rise and cause the first guide rail 803 to move downward, so that the dispensing work can be carried out while the wafer is lifted later.
[0041] In this embodiment, the second slider 806 and the adjustment block 17 are fixedly connected. The adjustment block 17 forms a first sliding structure with the second guide rail 805 through the second slider 806 and the second screw 807. The second guide rail 805 forms a second sliding structure with the first guide rail 803 through the first slider 804 and the first screw 802. The left and right position and the front and back position of the adjustment block 17 are changed by the first sliding structure and the second sliding structure on the device, thereby adjusting the dispensing position.
[0042] In this embodiment, the conveying assembly 9 includes a bracket 901 slidably mounted on the connecting shell 2, a third motor 902 is fixedly mounted on the bracket 901, a roller 905 is fixedly connected to the output shaft of the third motor 902, conveyor belts 906 are mounted on both sides of the roller 905, and bumps 907 are equidistantly mounted on the conveyor belt 906, a convex plate 903 is fixedly mounted on the connecting shell 2, and a first spring 904 is mounted between the convex plate 903 and the bracket 901. When the bottom surface of the upper half of the conveyor belt 906 is pushed upward, the roller 905 is compressed so that the bracket 901 slides on the connecting shell 2 and the first spring 904 on the convex plate 903 is stretched. The first spring 904 facilitates the subsequent resetting of the stretched conveyor belt 906, so that the device can lift or transport the wafer as a whole or transport it horizontally without affecting the normal use of the conveyor belt 906.
[0043] In this embodiment, a first guide rod 20 is installed on the second support plate 12 on the left side of the first support plate 11. The first guide rod 20 runs through the interior of the connecting shell 2. The second support plates 12 on the left and right sides of the first support plate 11 are slidably connected to the connecting shell 2. After the slidably installed second support plate 12 moves to the top, the first support plate 11 can still continue to slide, so that the wafer can be subsequently transported to a suitable position for glue dispensing. The first guide rod 20 ensures that the second support plate 12 moves vertically up and down.
[0044] In this embodiment, a first connecting block 13 is fixedly provided on the first supporting plate 11, a second connecting block 14 is fixedly connected to the first connecting block 13, a third connecting block 16 is fixedly connected to the second supporting plate 12, a second spring 15 is fixedly connected between the third connecting block 16 and the second connecting block 14, a height of the first connecting block 13 is greater than a thickness of the first supporting plate 11, and the thicknesses of the first supporting plate 11 and the second supporting plate 12 are the same, ensuring that after the second supporting plate 12 moves to the top, the first supporting plate 11 can still move upward so as to transport the wafer to a suitable position, and the second spring 15 can reset the first supporting plate 11 and the second supporting plate 12 to Figure 6 status in .
[0045] It should be noted that the present invention is a fully automatic online wafer dispensing machine. First, Figure 4-Figure 6 , pictures and Fig.10As shown, when the device is in use, the wafer is placed on the conveyor belt 906 on one side of the connecting shell 2, and the wafer is supported by the protrusion 907 on the conveyor belt 906, so that the back of the wafer is in contact with the support structure as little as possible. When conveying the wafer, the third motor 902 on the conveying assembly 9 drives the roller 905 to rotate, and the roller 905 drives the conveyor belt 906 to rotate. After conveying to the bottom of the top opening of the connecting shell 2, the first electric push rod 10 is extended, and the first support plate 11 is driven to move upward through the first connecting block 13. The first support plate 11 pushes the wafer upward, and after the second support plate 12 moves to the top, the first support plate 1 1 can still move upward, at this time, the second connecting block 14 on the first connecting block 13 slides on the third connecting block 16, and the second spring 15 is compressed, so that the wafer is transported to a suitable position. In the process of the second supporting plate 12 moving upward, the first guide rod 20 and move upward, the second guide rod 21 moves upward and makes the bottom of the traction steel rope 22 move upward. When the bottom of the traction steel rope 22 moves upward, under the guidance of the guide rod 23, the first guide rail 803 will move downward, so that the glue dispenser body 19 moves downward, so that the device can automatically move the glue dispenser body 19 downward while lifting the wafer, so as to perform the subsequent glue dispensing work. When the bottom surface of the upper part of the conveyor belt 906 is pushed upward, the roller 905 is compressed so that the bracket 901 slides on the connecting shell 2 and the first spring 904 on the convex plate 903 is stretched. The first spring 904 facilitates the subsequent resetting of the stretched conveyor belt 906, so that the device can lift or transport the entire wafer horizontally without affecting the normal use of the conveyor belt 906.
[0046] like Figure 1-Figure 3 , Fig. 9 and Fig.10 As shown, when the device is dispensing glue, the first motor 801 drives the first screw 802 to rotate, the first screw 802 drives the first slider 804 and the second guide rail 805 to move left and right, the second motor 808 drives the second screw 807 to rotate, and the second screw 807 drives the second slider 806 to move forward and backward, so that the device can change the left and right position and the front and back position of the adjustment block 17, and then the initial height of the glue dispenser body 19 can be adjusted by the second electric push rod 18 to perform the glue dispensing work. When dispensing glue, the cover plate 4 is closed. After the cover plate 4 is closed, the conductive plate 503 on the electric heating tube 6 will contact the conductive contact 505 on the power supply 504, so that the electric heating tube 6 is automatically energized for heating, so that the device will not cool down quickly after the glue dispensing is completed.
[0047] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A fully automatic online wafer dispensing machine, comprising a housing (1), characterized in that: The outer shell (1) is mounted with a connecting shell (2), a heat conducting plate (3) is mounted on the connecting shell (2), a cover plate (4) is hingedly connected to the connecting shell (2), a heating component (5) is mounted on the cover plate (4), an electric heating tube (6) is arranged in the heating component (5), a driving component (8) is mounted in the outer shell (1), a conveying component (9) is arranged inside the connecting shell (2), a first electric push rod (10) is fixedly arranged in the middle of the connecting shell (2), a first connecting block (13) is fixedly connected to the first electric push rod (10), a first supporting plate (11) is fixedly mounted on the first connecting block (13), and the first supporting plate (11) is fixedly mounted on the first supporting plate (11). The left and right sides of the first support plate (11) are slidably connected to second support plates (12), a second guide rod (21) is installed on the second support plate (12) on the right side of the first support plate (11), a guide rod (23) and a third guide rod (25) are fixedly arranged on the connecting shell (2), a traction steel rope (22) is fixedly connected to the second guide rod (21), the traction steel rope (22) is connected to the driving component (8) through the guide rod (23), an adjustment block (17) is installed below the driving component (8), a second electric push rod (18) is fixedly arranged below the adjustment block (17), and a dispensing machine body (19) is installed at the bottom of the second electric push rod (18); The heating assembly (5) comprises a connection plate (501) fixedly connected to the top of the cover plate (4); a connection cover (502) is fixedly connected to the connection plate (501); the electric heating tube (6) is installed in the connection cover (502); a conductive plate (503) is installed on the electric heating tube (6); a power supply (504) is installed on the connection shell (2); and a conductive contact sheet (505) is connected to the power supply (504).
2. The fully automatic online wafer dispensing machine according to claim 1 is characterized in that: The top of the connection shell (2) is an open structure, the length of the top opening of the connection shell (2) is greater than the length of the first support plate (11), and the width of the top opening of the connection shell (2) is greater than the width of the first support plate (11).
3. The fully automatic online wafer dispensing machine according to claim 1 is characterized in that: A rubber pad (7) is fixedly connected to the cover plate (4), and a snap-fit structure is formed between the cover plate (4) and the connecting shell (2) via the rubber pad (7).
4. The fully automatic online wafer dispensing machine according to claim 1, characterized in that: The driving assembly (8) comprises a first motor (801) slidably mounted on the housing (1); a first screw (802) is connected to an output shaft of the first motor (801); a first guide rail (803) is fixedly arranged on the first motor (801); a first slider (804) is slidably mounted in the first guide rail (803); the first screw (802) and the first slider (804) are threadedly connected; a second guide rail (805) is fixedly connected to the bottom of the first slider (804); a second slider (806) is slidably mounted in the second guide rail (805); a second screw (807) is threadedly mounted in the second slider (806); the second screw (807) and the second guide rail (805) are rotatably connected; a second motor (808) is fixedly arranged on the second guide rail (805); a synchronous wheel (809) is fixedly connected to the output shaft of the second motor (808); and a synchronous belt (810) is installed between the synchronous wheel (809) and the second screw (807).
5. The fully automatic online wafer dispensing machine according to claim 4 is characterized in that: A fixing ring (24) is fixedly connected to the side of the first guide rail (803), a third guide rod (25) is fitted inside the fixing ring (24), the third guide rod (25) and the connecting shell (2) are fixedly connected, and the first guide rail (803) forms a lifting structure with the third guide rod (25) via the second guide rod (21), the traction steel rope (22), the guide rod (23) and the fixing ring (24).
6. The fully automatic online wafer dispensing machine according to claim 4, characterized in that: The second slider (806) and the adjusting block (17) are fixedly connected; the adjusting block (17) forms a first sliding structure with the second guide rail (805) through the second slider (806) and the second screw rod (807); the second guide rail (805) forms a second sliding structure with the first guide rail (803) through the first slider (804) and the first screw rod (802).
7. The fully automatic online wafer dispensing machine according to claim 1, characterized in that: The conveying assembly (9) comprises a bracket (901) slidably mounted on the connecting shell (2), a third motor (902) being fixedly mounted on the bracket (901), a roller (905) being fixedly connected to the output shaft of the third motor (902), conveying belts (906) being mounted on both sides of the roller (905), convex blocks (907) being equidistantly mounted on the conveying belt (906), a convex plate (903) being fixedly mounted on the connecting shell (2), and a first spring (904) being mounted between the convex plate (903) and the bracket (901).
8. The fully automatic online wafer dispensing machine according to claim 1, characterized in that: A first guide rod (20) is mounted on the second support plate (12) on the left side of the first support plate (11); the first guide rod (20) penetrates the interior of the connecting shell (2); and the second support plates (12) on the left and right sides of the first support plate (11) are slidably connected to the connecting shell (2).
9. The fully automatic online wafer dispensing machine according to claim 8, characterized in that: A first connecting block (13) is fixedly arranged on the first supporting plate (11), a second connecting block (14) is fixedly connected to the first connecting block (13), a third connecting block (16) is fixedly connected to the second supporting plate (12), a second spring (15) is fixedly connected between the third connecting block (16) and the second connecting block (14), the height of the first connecting block (13) is greater than the thickness of the first supporting plate (11), and the thickness of the first supporting plate (11) and the second supporting plate (12) are the same.
Citation Information
Patent Citations
Wafer working platform and dispensing machine with same
CN113828477A
Semiconductor wafer surface treatment device
CN113262956A
Automatic wafer gluing equipment
CN114887831A