Support system and method for 3D printing
Through highly adjustable telescopic array modules and intelligent electronic control technology, the problems of waste of materials and extended printing time in complex shapes of traditional 3D printing support structures are solved, and efficient and accurate support structures are achieved, improving the quality of the print parts and Production efficiency.
Patent Information
- Application Number
- CN202411461182.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-01-03
AI Technical Summary
When dealing with complex geometric shapes and suspended structures, traditional 3D printing support structures lead to waste of materials, extended printing time and difficulty in removing support, affecting the accuracy and aesthetics of the print.
Using height-adjustable telescopic array module and intelligent electronic control technology, dynamic support height adjustment is achieved through piezoelectric spring and FPGA control, and the fit between the support structure and the printing model is optimized.
It significantly improves printing efficiency, reduces material waste and printing time, ensures the accuracy and integrity of the printout, and reduces costs.
Smart Images
Figure CN119238956A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of 3D printing support structures, for example, to a support system and method for 3D printing. Background Art
[0002] 3D printing technology, as a representative of additive manufacturing, has emerged in the manufacturing industry in recent years. It is based on a three-dimensional digital model and builds physical objects by stacking materials layer by layer. This process does not require traditional molds or mechanical processing, which greatly shortens the product development cycle, reduces costs, and achieves a high degree of personalized customization. 3D printing technology is widely used in many fields such as prototyping, medical equipment, aerospace, and architectural design, showing huge market potential and application value.
[0003] However, 3D printing is not without challenges. Especially when dealing with complex geometries and suspended structures, support structures become an indispensable part. The main function of the support structure is to prevent the material from collapsing or deforming during the printing process and to ensure the accuracy and integrity of the printed parts. Although traditional support methods, such as columnar supports and tree supports, have solved the problem to a certain extent, they have also brought new problems:
[0004] Waste of consumables: Support structures often require a large amount of materials, which are often discarded after printing, resulting in a waste of resources.
[0005] Increased printing time: Printing of support structures increases the overall printing time and reduces production efficiency.
[0006] Difficulty in support removal: Especially for complex structures, the support structure is closely connected to the printed part, and it is easy to damage the surface of the printed part when removing it, affecting the appearance and performance.
[0007] Therefore, developing a 3D printing support system that can efficiently and accurately support complex structures while reducing material waste and printing time has become a hot topic in current research.
[0008] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention
[0009] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.
[0010] The embodiments of the present disclosure provide a support system and method for 3D printing, which is composed of a group of height-adjustable array modules, each of which has independent telescopic capabilities and can be dynamically adjusted according to different printing requirements.
[0011] In some embodiments, the support system for 3D printing includes an array assembly, wherein the array assembly includes a plurality of telescopic array modules that can be controlled independently or collaboratively;
[0012] Each telescopic array module is built with an electric control unit, a piezoelectric spring, a telescopic tube and a sleeve structure. The piezoelectric spring and the sleeve are installed in the telescopic tube. One end of the piezoelectric spring is connected to the inner wall of the telescopic tube, and the other end is connected to the first end of the sleeve. The second end of the sleeve is connected to the bottom of the array assembly. The telescopic tube is used to support the 3D model. The expansion and contraction amount of the piezoelectric spring is adjusted by the electric control unit through the control voltage to achieve dynamic adjustment of the support height.
[0013] The telescopic cylinder is designed with lateral slots and connection points for mutual limitation and support between telescopic array modules.
[0014] Optionally, the electronic control unit uses FPGA to control the voltage of each telescopic array module, thereby controlling the expansion and contraction amount of the piezoelectric spring and optimizing the fit between the support structure and the printed model.
[0015] Optionally, the elastic force of the piezoelectric spring is positively correlated with the loaded voltage.
[0016] Optionally, grooves are formed on both sides of the telescopic tube, and connection points are provided on the other two sides, and adjacent telescopic array modules are slidably fitted through the grooves and the connection points, and are limited up and down and support each other.
[0017] Optionally, the array assembly adopts a 30x30 modular array layout.
[0018] Optionally, the telescopic cylinder is detachably connected to the sleeve.
[0019] Optionally, the support system also includes an intelligent analysis unit for automatically identifying areas that require support after the 3D model is sliced, and instructing the electronic control unit to apply corresponding voltages to support the 3D model.
[0020] The present disclosure also provides a support method for 3D printing, using the aforementioned support system for 3D printing, the method comprises the following steps:
[0021] Import 3D models;
[0022] Slice the 3D model;
[0023] Intelligent algorithms determine support shapes;
[0024] The FPGA controller controls the voltage to achieve dynamic support;
[0025] Printing;
[0026] Array components recovered.
[0027] The support system and method for 3D printing provided by the embodiments of the present disclosure can achieve the following technical effects:
[0028] The present invention provides an innovative support system and method for 3D printing. Through the combination of highly adjustable telescopic array modules, intelligent electric control technology and piezoelectric spring drive, it effectively solves the material waste, low printing efficiency and support removal problems caused by complex support structures in traditional 3D printing. This system significantly improves printing efficiency, ensures the accuracy and integrity of printed parts, and provides strong technical support for the widespread application of 3D printing technology.
[0029] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:
[0031] Figure 1 It is a schematic diagram of a use process of a support system for 3D printing provided by an embodiment of the present disclosure;
[0032] Figure 2 is a structural schematic diagram of a support system for 3D printing provided by an embodiment of the present disclosure;
[0033] Figure 3 It is a schematic diagram of the supporting effect of the system provided by the embodiment of the present disclosure on a regular plane;
[0034] Figure 4 is a schematic diagram of the supporting effect of the system provided by the embodiment of the present disclosure on an irregular plane;
[0035] Figure 5 is a schematic diagram of the supporting effect of the system on a free-form surface provided by an embodiment of the present disclosure;
[0036] Figure 6 is an enlarged schematic diagram of a telescopic array module provided in an embodiment of the present disclosure;
[0037] Figure 7 It is a schematic diagram of a sleeve provided in an embodiment of the present disclosure.
[0038] Reference numerals:
[0039] 101: piezoelectric spring; 102: sleeve; 103: telescopic tube. DETAILED DESCRIPTION
[0040] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.
[0041] The terms "first", "second", etc. in the embodiments of the present disclosure are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so as to describe the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0042] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements, or components to have specific directions, or to be constructed and operated in specific directions. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0043] In addition, the terms "disposed", "connected" and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.
[0044] Unless otherwise stated, the term "plurality" means two or more.
[0045] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.
[0046] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.
[0047] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
[0048] Combination Figure 1-7 As shown, the embodiment of the present disclosure provides a support system for 3D printing, which aims to significantly improve support efficiency and accuracy by optimizing complex support structures, while achieving cost savings and shortening printing cycles. The system is mainly composed of an array component and an intelligent analysis unit.
[0049] The array assembly is composed of multiple telescopic array modules arranged precisely, and adopts an efficient 30x30 modular array layout to ensure comprehensive and accurate support for various large and complex 3D printed models. Each telescopic array module has a built-in electronic control unit, a high-performance piezoelectric spring 101, a telescopic cylinder 103 and a sleeve 102 structure. The telescopic array modules can be controlled in a unified and coordinated manner or individually.
[0050] The piezoelectric spring 101 and the sleeve 102 are installed in the telescopic cylinder 103. One end of the piezoelectric spring 101 is connected to the inner wall of the telescopic cylinder 103, and the other end is connected to the first end of the sleeve 102. The second end of the sleeve 102 is connected to the bottom of the array assembly. The telescopic cylinder 103 is used to support the 3D model.
[0051] The expansion and contraction of the piezoelectric spring 101 is adjusted by the electronic control unit through the advanced FPGA technology to precisely control the voltage, thereby achieving dynamic and fine adjustment of the support height. The small elastic force of the piezoelectric spring 101 is positively correlated with the loading voltage. The greater the voltage, the greater the elastic force. By controlling the voltage of the piezoelectric spring 101, different heights of support can be achieved.
[0052] The telescopic cylinder 103 has grooves on both sides and connection points on the other two sides. Adjacent telescopic array modules are slidably matched, and are limited up and down and supported by each other through the grooves and the connection points.
[0053] As an example, the telescopic cylinder 103 is a rectangular parallelepiped structure, and the piezoelectric spring 101 and the sleeve 102 are arranged in the longitudinal direction. The two grooves are vertical grooves, located on two adjacent surfaces, and the two connection points are protrusions arranged on the side of the telescopic cylinder 103, located on two adjacent surfaces. The connection points between adjacent modules are slidably matched with the vertical grooves, and the groove walls of the vertical grooves can limit the movement of the connection points, so that the modules can achieve stable mutual limitation and support, ensuring the stability and flexibility of the entire support system.
[0054] According to the following Figure 1-5 Several implementations of the present system are provided.
[0055] Implementation method 1: Suitable for printing components with flat surfaces
[0056] Module composition: The telescopic array module is the basic component unit of the system, such as Figure 6 , 7 As shown, it comprises a piezoelectric spring 101, a sleeve 102 and a telescopic cylinder 103. The special design of the telescopic cylinder 103 enables the modules to achieve precise upper and lower limits and mutual support when combined.
[0057] Workflow: The system workflow is as follows Figure 1 As shown, the steps are as follows: importing the 3D model, slicing the 3D model, determining the support shape using an intelligent algorithm, controlling the voltage using an FPGA controller to achieve dynamic support, then printing, and finally restoring the system array components.
[0058] Application case: For the step-type suspended mechanical part 201, the system can intelligently lift the module at the corresponding position to form a stable step-type plane platform, such as Figure 2 shown.
[0059] Implementation method 2: Suitable for printing components with uneven surfaces
[0060] For printed components with uneven surfaces, the module structure of the system is the same as that of the first embodiment. The system workflow is as follows: Figure 1 As shown in the figure, the steps are as follows: importing the 3D model, slicing the 3D model, determining the support shape using an intelligent algorithm, controlling the voltage of the FPGA controller to achieve dynamic support, then printing, and finally restoring the system array components. Figure 3 As shown, for a printed component 202 with an uneven surface, the system support algorithm determines that only one point in the middle needs to be supported, so the system only needs to raise the height of a single module in the middle to complete the support work of this component.
[0061] Implementation method 3: Applicable to printed components with free-form surfaces
[0062] For printed components with free-form surfaces, the system workflow is as follows: Figure 1 As shown in the figure, the steps are as follows: importing the 3D model, slicing the 3D model, determining the support shape using an intelligent algorithm, controlling the voltage of the FPGA controller to achieve dynamic support, then printing, and finally restoring the system array components. Figure 3 As shown, for printed components with free-form surfaces, the system can determine the corresponding free-form surface support platform according to the support algorithm, and set different voltage values through the controller to realize the construction of the free-form surface support platform.
[0063] In summary, the present disclosure adopts the following solutions:
[0064] Array module design: The system adopts an array layout of the support system for 3D printing, and each array module is an independent telescopic unit. This design not only improves the flexibility and adaptability of the support, but also enables the system to easily cope with prints of various complex shapes.
[0065] Intelligent control technology: Each telescopic module is equipped with an advanced electronic control system, which is precisely controlled by FPGA (field programmable gate array). The high-speed computing power and flexibility of FPGA enable the system to respond to printing needs in real time and quickly adjust the support structure.
[0066] Piezoelectric spring drive: The core component of the telescopic module is the piezoelectric spring 101, whose elastic force is proportional to the applied voltage. By adjusting the voltage, the elongation of the spring can be precisely controlled, thereby achieving height adjustment of the support structure. This drive method not only has a fast response speed, but also has low energy consumption, which improves the overall efficiency of the system.
[0067] Structural optimization: The slotted design on both sides of the telescopic cylinder 103 allows adjacent modules to limit and support each other, enhancing the stability and reliability of the system. At the same time, this design also facilitates the disassembly and replacement of the modules, reducing maintenance costs.
[0068] The technical effects achieved are as follows:
[0069] Improve support efficiency and accuracy: Through intelligent algorithms and FPGA control, accurate matching of support structure and printing model is achieved, which reduces invalid support, improves support efficiency, ensures support accuracy and improves print quality.
[0070] Cost saving: Optimize material usage and provide support only in necessary locations to avoid material waste caused by excessive support and reduce printing costs.
[0071] Shorten printing cycle: Reduce the time and materials required for support, thereby shortening the overall printing cycle and improving production efficiency.
[0072] Through technological innovation, the present invention optimizes the complex support structure of 3D printing, improves support efficiency and accuracy, saves costs, and shortens the printing cycle, providing strong support for the widespread application of 3D printing technology.
[0073] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims
1. A support system for 3D printing, characterized in that: include: An array assembly, including a plurality of telescopic array modules that can be controlled independently or collaboratively; Each telescopic array module has an electric control unit, a piezoelectric spring, a telescopic tube and a sleeve structure built in. The piezoelectric spring and the sleeve are installed in the telescopic tube. One end of the piezoelectric spring is connected to the inner wall of the telescopic tube, and the other end is connected to the first end of the sleeve. The second end of the sleeve is connected to the bottom of the array assembly. The telescopic tube is used to support the 3D model. The expansion and contraction amount of the piezoelectric spring is adjusted by the electronic control unit through controlling the voltage to achieve dynamic adjustment of the support height; The telescopic cylinder is designed with lateral slots and connection points for mutual limitation and support between telescopic array modules.
2. The support system for 3D printing according to claim 1, characterized in that: The electronic control unit uses FPGA to control the voltage of each telescopic array module, thereby controlling the telescopic amount of the piezoelectric spring and optimizing the fit between the support structure and the printed model.
3. The support system for 3D printing according to claim 1, characterized in that: The elastic force of the piezoelectric spring is positively correlated with the loaded voltage.
4. The support system for 3D printing according to claim 1, characterized in that: The telescopic cylinder is slotted on both sides, and connection points are arranged on the other two sides. Adjacent telescopic array modules are slidably matched, and are limited up and down and supported by each other through the slots and the connection points.
5. The support system for 3D printing according to any one of claims 1 to 4, characterized in that: The array assembly adopts a 30x30 modular array layout.
6. The support system for 3D printing according to any one of claims 1 to 4, characterized in that: The telescopic cylinder is detachably connected to the sleeve.
7. The support system for 3D printing according to any one of claims 1 to 4, characterized in that: Also includes: The intelligent analysis unit is used to automatically identify the areas that need support after the 3D model is sliced, and to guide the electronic control unit to apply corresponding voltages to support the 3D model.
8. A support method for 3D printing, characterized in that: Using the support system for 3D printing according to any one of claims 1 to 7, the steps of the method include: Import 3D models; Slice the 3D model; Intelligent algorithms determine support shapes; The FPGA controller controls the voltage to achieve dynamic support; Printing; Array components recovered.