Reinforcing plate, preparation method thereof and electronic equipment

Abstract

The invention provides a reinforcement plate and a preparation method thereof, and electronic equipment, and relates to the technical field of terminals.The reinforcement plate comprises a base body and a ceramic lamination layer, the ceramic lamination layer is located on at least one side surface of the base body, the ceramic lamination layer is made of a ceramic material, and the ceramic lamination layer at least comprises a transition layer and a compact ceramic layer; the transition layer is located between the base body and the compact ceramic layer, the compact ceramic layer is provided with a plurality of first pores which are separated and distributed at intervals, and the porosity of the first pores is smaller than or equal to 0.5%; the transition layer is not straight, the surface of the side, close to the compact ceramic layer, of the transition layer is connected with the compact ceramic layer and matched with the compact ceramic layer in shape, and the surface of the side, close to the base body, of the transition layer is connected with the base body and matched with the base body in shape. Therefore, on the premise that the overall Young modulus and rigidity of the stiffening plate are not changed, the thickness and the weight of the stiffening plate can be reduced.

Description

Technical Field

[0001] The present application relates to the field of terminal technology, and in particular to a reinforcement plate and a preparation method thereof, and an electronic device. Background Art

[0002] With the rapid development of electronic devices such as mobile phones, the thin plate structures in electronic devices have made great progress, but new problems have also been encountered.

[0003] Currently, thin plate structures suitable for various reinforcement scenarios such as screen back panels and inserts are often stainless steel thin plate structures, aluminum alloy thin plate structures, etc., but the cost of stainless steel thin plate structures is relatively high and is not conducive to weight reduction of electronic equipment. The aluminum alloy thin plate structure requires a larger thickness at the same stiffness and cannot achieve thinning of electronic equipment.

[0004] Therefore, it is urgent to provide a thin plate structure to solve the above problems. Summary of the invention

[0005] The present application provides a reinforcing plate and a preparation method thereof, and an electronic device. The reinforcing plate has a ceramic laminate on its substrate that is well bonded to the substrate. When the ceramic laminate is present on multiple surfaces of the substrate, the hard ceramic laminate can bear more stress during the force-bearing process, reducing the degree of deformation under the action of external force, thereby effectively improving the stiffness of the substrate. While ensuring that the overall Young's modulus and stiffness of the reinforcing plate remain unchanged, its thickness and weight can also be reduced.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] In a first aspect, a reinforcement plate is provided, which includes: a substrate and a ceramic laminate, wherein the ceramic laminate is located on at least one side surface of the substrate, the material of the ceramic laminate is a ceramic material, the ceramic laminate includes at least a transition layer and a dense ceramic layer, the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, the porosity of the plurality of first pores is less than or equal to 0.5%, the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is the first surface, the surface of the transition layer close to the substrate is the second surface, the first surface is connected to the surface of the dense ceramic layer close to the transition layer and the shape matches, and the second surface is connected to the surface of the substrate close to the transition layer and the shape matches.

[0008] The embodiment of the present application provides a reinforcing plate. After the surface layer of the substrate of the reinforcing plate is vitrified, the substrate has a ceramic laminate that is well bonded to the substrate. At this time, the ceramic laminate includes at least a transition layer and a dense ceramic layer. The transition layer can be embedded with the dense ceramic layer. In this way, when multiple surfaces of the substrate have the ceramic laminate, a sandwich structure of ceramic sandwiched with the substrate can be obtained. In the process of being subjected to force, the hard ceramic laminate can bear more stress in the sandwich structure, reducing the degree of deformation under the action of external force, thereby effectively improving the stiffness. While ensuring that the overall Young's modulus and stiffness of the reinforcing plate remain unchanged, its thickness and weight can also be reduced.

[0009] In a possible implementation of the first aspect, the reinforcement plate includes: a substrate and a ceramic laminate, the ceramic laminate is located on at least one side surface of the substrate, the material of the ceramic laminate is a ceramic material, the ceramic laminate includes a transition layer and a dense ceramic layer, the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, the porosity of the plurality of first pores is less than or equal to 0.5%, the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is the first surface, the surface of the transition layer close to the substrate is the second surface, the first surface is connected to the surface of the dense ceramic layer close to the transition layer and the shape matches, the second surface is connected to the surface of the substrate close to the transition layer and the shape matches.

[0010] In this implementation, after the surface layer of the substrate of the reinforcement plate is vitrified, the substrate has a ceramic laminate that is well bonded to the substrate, and the ceramic laminate includes a transition layer and a dense ceramic layer. The transition layer can be embedded with the dense ceramic layer. In this way, when multiple surfaces of the substrate have the ceramic laminate, a sandwich structure of ceramic sandwiched with the substrate can be obtained. In the process of being subjected to force, the hard ceramic laminate can bear more stress in the sandwich structure, reducing the degree of deformation under the action of external force, thereby effectively improving the stiffness of the substrate. While ensuring that the overall Young's modulus and stiffness of the reinforcement plate remain unchanged, its thickness and weight can also be reduced.

[0011] In a possible implementation of the first aspect, the reinforcement plate includes: a substrate and a ceramic laminate, the ceramic laminate includes: a transition layer, a dense ceramic layer and a surface loose layer; the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, the porosity of the plurality of first pores is less than or equal to 0.5%, the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is the first surface, the surface of the transition layer close to the substrate is the second surface, the first surface is connected to the surface of the dense ceramic layer close to the transition layer and the shape matches, the second surface is connected to the surface of the substrate close to the transition layer and the shape matches; the surface loose layer is located on the side of the dense ceramic layer away from the transition layer, the surface loose layer is connected to the dense ceramic layer, the surface loose layer has a plurality of discrete and spaced second pores, and the porosity of the plurality of second pores ranges from 5% to 15%.

[0012] In this implementation, after the surface of the substrate is vitrified, the substrate has a ceramic laminate that is well bonded to the substrate. When multiple surfaces of the substrate have the ceramic laminate, a sandwich structure of the ceramic laminate and the substrate can be obtained. The surface loose layer and the dense ceramic layer, the dense ceramic layer and the transition layer, and the transition layer and the substrate in the sandwich structure are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress and reduce the degree of deformation under the action of external force, thereby effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a thinner size than traditional pure metal substrates.

[0013] In a possible implementation manner of the first aspect, the substrate is a light metal substrate.

[0014] In this implementation, after the thin metal surface layer is vitrified, a ceramic laminate that is well bonded to the thin metal substrate is provided on the thin metal substrate. When there are ceramic laminates on multiple surfaces of the thin metal substrate, a sandwich structure of ceramic laminates sandwiching thin metal can be obtained. In this sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress and reduce the degree of deformation under the action of external force, thereby effectively improving the stiffness of the thin metal substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate.

[0015] In a possible implementation manner of the first aspect, the light metal includes any one of aluminum, titanium, zirconium, and the like.

[0016] In this implementation, these light metals are a convenient choice and are reasonably priced.

[0017] In a possible implementation of the first aspect, the thickness of the light metal substrate ranges from 0.05 mm to 0.6 mm.

[0018] In this implementation, the substrate is very thin, and after the thin metal surface is vitrified, a ceramic laminate that is well bonded to the thin metal substrate is provided. When there are ceramic laminates on multiple surfaces of the thin metal substrate, a sandwich structure of ceramic laminates sandwiching thin metal can be obtained. In this sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and effectively improving the stiffness of the thin metal substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate.

[0019] In a possible implementation manner of the first aspect, the ceramic laminate is located on the upper surface and the lower surface of the substrate.

[0020] In this implementation, after the upper and lower surfaces of the substrate are vitrified, a sandwich structure of a ceramic laminate sandwiching a substrate can be obtained. The surface loose layer and the dense ceramic layer, the dense ceramic layer and the transition layer, and the transition layer and the substrate in the sandwich structure are tightly combined. During the force-bearing process, the hard ceramic laminate can bear more stress and reduce the degree of deformation under the action of external force, thereby more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0021] In a possible implementation manner of the first aspect, the ceramic material may include at least one of aluminum oxide ceramics, titanium oxide ceramics, zirconium oxide ceramics, silicon carbide ceramics, titanium carbide ceramics, and yttrium oxide ceramics.

[0022] In this implementation, the ceramic material has a higher density, a higher hardness, and a better Young's modulus.

[0023] In a possible implementation manner of the first aspect, the transition layer is in an undulating corrugated shape.

[0024] In this implementation, the undulating corrugated transition layer can be tightly combined with the substrate and the dense ceramic layer respectively. During the force-bearing process, the hard ceramic laminate can bear more stress and reduce the degree of deformation under the action of external force, thereby more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0025] In a possible implementation manner of the first aspect, the surface loose layer is in an undulating corrugated shape.

[0026] In this implementation, the undulating loose layer on the surface can be tightly combined with the dense ceramic layer. During the stress process, the hard ceramic laminate can bear more stress and reduce the degree of deformation under the action of external force, thereby more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0027] In a possible implementation of the first aspect, the roughness of the surface loose layer may be in the range of 2 μm to 3 μm.

[0028] In this implementation, the relatively rough surface loose layer is not easy to separate from the dense ceramic layer during the stress process, which more effectively improves the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0029] In a possible implementation manner of the first aspect, the light metal of the light metal matrix and the ceramic material of the ceramic laminate are of the same type.

[0030] This implementation is simple and easy to implement.

[0031] In a possible implementation of the first aspect, along a direction perpendicular to the substrate, a ratio of a thickness of the ceramic laminate to a thickness of the reinforcement plate is in a range of 10% to 60%.

[0032] In this implementation, a thicker ceramic laminate can be formed, which forms a ceramic-metal sandwich structure with the substrate, thereby increasing the stiffness of the substrate and reducing the thickness of the original metal material while ensuring that the Young's modulus and stiffness of the overall material remain unchanged. For example, aluminum alloy with a ceramic laminate structure can replace stainless steel materials in related scenarios, thereby achieving the purpose of reducing the thickness and weight of the entire machine.

[0033] In a possible implementation manner of the first aspect, a ratio of the thickness of the base to the thickness of the reinforcement plate is in a range of 40% to 90%.

[0034] In this implementation, the substrate is relatively thin, and the ceramic laminate and the substrate form a sandwich structure of ceramic and metal, thereby increasing the stiffness of the thin substrate and reducing the thickness of the original metal material while ensuring that the Young's modulus and stiffness of the overall material remain unchanged. For example, aluminum alloy with a ceramic laminate structure can replace stainless steel materials in related scenarios, thereby achieving the purpose of reducing the thickness and weight of the entire machine.

[0035] In a possible implementation of the first aspect, along a direction perpendicular to the substrate, a ratio of the thickness of the transition layer to the thickness of the ceramic laminate is in a range of 0.1% to 5%.

[0036] In this implementation, the transition layer is relatively thin, and the transition layer can be tightly combined with the substrate and the dense ceramic layer respectively. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0037] In a possible implementation manner of the first aspect, along a direction perpendicular to the substrate, a thickness of the transition layer ranges from 0.1 μm to 1 μm.

[0038] In this implementation, the transition layer is relatively thin, and the transition layer can be tightly combined with the substrate and the dense ceramic layer respectively. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0039] In a possible implementation of the first aspect, a ratio of the thickness of the dense ceramic layer to the thickness of the Al2O3 ceramic laminate is in a range of 90% to 95%.

[0040] In this implementation, the dense ceramic layer is relatively thick and is the main functional area for increasing the load-bearing hardness and Young's modulus. The dense ceramic layer is tightly combined with the transition layer and the surface loose layer respectively. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0041] In a possible implementation manner of the first aspect, along a direction perpendicular to the substrate, the thickness of the dense ceramic layer ranges from 10 μm to 80 μm.

[0042] In this implementation, the dense ceramic layer is relatively thick and is the main functional area for increasing the load-bearing hardness and Young's modulus. The dense ceramic layer is tightly combined with the transition layer and the surface loose layer respectively. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0043] In a possible implementation of the first aspect, the ratio of the thickness of the surface loose layer to the thickness of the Al2O3 ceramic laminate is in the range of 0.1% to 5%.

[0044] In this implementation, the surface loose layer is relatively thin and can be tightly combined with the dense ceramic layer. During the stress process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0045] In a possible implementation manner of the first aspect, along a direction perpendicular to the substrate, the thickness of the surface loose layer ranges from 0.1 μm to 1 μm.

[0046] In this implementation, the surface loose layer is relatively thin and can be tightly combined with the dense ceramic layer. During the stress process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, and more effectively improving the stiffness of the substrate. Since the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness.

[0047] In a possible implementation manner of the first aspect, the Vickers hardness of the ceramic laminate is greater than or equal to 1000 HV.

[0048] In this implementation, the Vickers hardness of the ceramic laminate is very large.

[0049] In a possible implementation of the first aspect, when a 10 μm alumina ceramic laminate is prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 74.7 GPa.

[0050] In this implementation, the reinforcement plate can have the advantages of light weight, excellent rigidity, and high Young's modulus. Therefore, when used in electronic equipment, the electronic equipment can have a high Young's modulus and excellent rigidity without being too heavy or too thick, and the performance is excellent.

[0051] In a possible implementation of the first aspect, when a 20 μm alumina ceramic laminate is prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 79.4 GPa.

[0052] In this implementation, the reinforcement plate can have the advantages of light weight, excellent rigidity, and high Young's modulus. Therefore, when used in electronic equipment, the electronic equipment can have a high Young's modulus and excellent rigidity without being too heavy or too thick, and the performance is excellent.

[0053] In a possible implementation of the first aspect, when a 30 μm alumina ceramic laminate is prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 87.7 GPa.

[0054] In this implementation, the reinforcement plate can have the advantages of light weight, excellent rigidity, and high Young's modulus. Therefore, when used in electronic equipment, the electronic equipment can have a high Young's modulus and excellent rigidity without being too heavy or too thick, and the performance is excellent.

[0055] In a second aspect, an electronic device is provided, comprising a reinforcing plate as in the first aspect or any possible implementation of the first aspect.

[0056] The embodiments of the present application provide an electronic device, which has the effects of reducing the thickness and weight of the entire device.

[0057] In a possible implementation of the second aspect, the electronic device includes: a middle frame and a reinforcement plate, an adhesive, a reinforcement plate, an adhesive, a display screen, an adhesive, a cover plate, and a protective layer stacked in sequence on the middle frame.

[0058] In this implementation, the electronic device has the effects of reducing the thickness and weight of the entire device.

[0059] In a possible implementation manner of the second aspect, the electronic device includes: foam, plastic, a reinforcing plate and an adhesive.

[0060] In this implementation, the electronic device has the effects of reducing the thickness and weight of the entire device.

[0061] In a possible implementation manner of the second aspect, the electronic device includes: a locking ear, a reinforcement plate, an adhesive, a circuit board assembly and a surface film.

[0062] In this implementation, the electronic device has the effects of reducing the thickness and weight of the entire device.

[0063] In a third aspect, a method for preparing a reinforcement plate is provided, for preparing a reinforcement plate as in the first aspect or any possible implementation of the first aspect.

[0064] The preparation method of the reinforcing plate comprises:

[0065] A substrate is provided.

[0066] A plurality of holes are formed on at least one side surface of the substrate.

[0067] The holes do not penetrate the matrix.

[0068] The holes are filled with ceramic material to form a first structure.

[0069] The first structure is sintered to form a reinforcement plate having a ceramic laminate.

[0070] Among them, the ceramic laminate is located on at least one side surface of the substrate, the material of the ceramic laminate is ceramic material, the ceramic laminate at least includes a transition layer and a dense ceramic layer, the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, and the porosity of the plurality of first pores is less than or equal to 0.5%; the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is connected to the dense ceramic layer and the shape matches, and the surface of the transition layer close to the substrate is connected to the substrate and the shape matches.

[0071] The embodiment of the present application provides a method for preparing a reinforcement plate. Through a vitrification process, a dense ceramic laminate that is well bonded with the thin plate metal is prepared on the surface of the thin plate metal, and the ceramic laminate wraps the middle thin layer of metal to form a sandwich structure. In this way, the original surface metal of the substrate is replaced by the ceramic laminate, and the hard ceramic laminate bears more stress during the force-bearing process. Therefore, compared with traditional stainless steel materials, the thin plate metal and the relatively thin ceramic laminate can achieve unchanged Young's modulus and stiffness, which can achieve the purpose of reducing the weight of the entire device when used in electronic equipment. Moreover, compared with traditional pure alloys, the thin plate metal and the not-too-thin ceramic laminate can achieve higher Young's modulus and stiffness, which can achieve the purpose of reducing the thickness of the entire device when used in electronic equipment. In addition, the preparation method is simple and easy to implement, which is conducive to industrial production.

[0072] In a possible implementation of the third aspect, the pore diameter ranges from 200 nm to 300 nm.

[0073] In this implementation, the holes formed on the substrate are larger, so that the ceramic powder can be better filled into the substrate and a thicker ceramic laminate can be produced. The ceramic laminate and the substrate form a sandwich structure of ceramic and metal. In this sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly combined. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the stiffness of the thin metal substrate, and because the Young's modulus of the ceramic laminate is higher, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate.

[0074] In a possible implementation manner of the third aspect, the depth of the hole ranges from 10 μm to 120 μm.

[0075] In this implementation, the holes formed on the substrate are deeper, so that the ceramic powder can be better filled into the substrate and a thicker ceramic laminate can be produced. The ceramic laminate and the substrate form a sandwich structure of ceramic and metal. In this sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly combined. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the stiffness of the thin metal substrate, and because the Young's modulus of the ceramic laminate is higher, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate.

[0076] In a possible implementation of the third aspect, the method for preparing the reinforcement plate specifically includes:

[0077] S1. Provide a substrate.

[0078] The substrate is a substrate that has not been punched or sintered.

[0079] S2. A plurality of holes are formed on the upper surface and the lower surface of the substrate respectively.

[0080] The hole does not penetrate the substrate.

[0081] S4. Sintering the first structure to form a reinforcement plate having a ceramic laminate.

[0082] The ceramic laminate is located on both side surfaces of the substrate, and the material of the ceramic laminate is ceramic material.

[0083] In this implementation, a dense ceramic laminate that is well bonded to the thin metal is prepared on the surface of the thin metal plate through a vitrification process, and the ceramic laminate wraps the middle thin metal layer to form a sandwich structure, so that the original surface metal of the substrate is replaced by the ceramic laminate, and the hard ceramic laminate bears more stress during the force-bearing process. Therefore, compared with traditional stainless steel materials, the thin metal plate and the thinner ceramic laminate can achieve unchanged Young's modulus and stiffness, which can achieve the purpose of reducing the weight of the entire device when used in electronic equipment. In addition, compared with traditional pure alloys, the thin metal plate and the not-too-thin ceramic laminate can achieve higher Young's modulus and stiffness, which can achieve the purpose of reducing the thickness of the entire device when used in electronic equipment. In addition, the preparation method is simple and easy to implement, which is conducive to industrial production.

[0084] In a possible implementation of the third aspect, the method for preparing the reinforcement plate specifically includes:

[0085] S11. Provide a rectangular parallelepiped base.

[0086] S12. Drilling stage: provide a corrosion drilling pool filled with sulfuric acid with a mass concentration of 180g / L, immerse the entire rectangular substrate in the sulfuric acid through a support rod, and use the sulfuric acid to corrode the unprotected upper and lower surfaces of the substrate to form a plurality of deep holes with uneven inner surfaces on the upper and lower surfaces respectively.

[0087] S13. Powder filling stage: a powder filling sintering pool is provided, in which 10g / L Na2SiO3+1g / L KOH is contained. In addition, a 5g / L Al2O3 aqueous solution with good conductivity (Al2O3 powder is uniformly dispersed in the aqueous solution) is contained in the powder filling sintering pool. There are also stirring blades in the powder filling sintering pool, which continuously stir. The powder filling sintering pool also has a power anode and a power cathode. When power is turned on, the Al2O3 powder is deposited inside the deep hole under the drive of the electric field force.

[0088] S14. Sintering stage: adjust the current parameter to 10A / dm 2 Under the instantaneous high temperature and high pressure generated by arc discharge, complex physical and chemical changes will occur. The surface metal of the unperforated rectangular matrix is ​​oxidized by high temperature and sintered together with the filled Al2O3 ceramic powder to form a dense ceramic laminate. The ceramic laminate is firmly bonded to the rectangular matrix, has a dense internal structure, high toughness, and good wear resistance and corrosion resistance.

[0089] In this implementation, holes with larger inner diameter and deeper hole depth are prepared by chemical methods, and then nano-ceramic particles with good conductivity are directly filled into the deep holes under the drive of electric field force, which has better effect, and the prepared ceramic laminate is thicker and denser. The Vickers hardness of the sintered ceramic laminate is greater than 1000HV, and can be as high as 2000HV or more, so that the reinforcement plate has a higher elastic modulus and better structural rigidity. Therefore, the reinforcement plate can be used directly as an internal structural part, and can be used as an appearance part through subsequent processing such as surface spraying.

[0090] The embodiment of the present application provides a reinforcing plate and a preparation method thereof, and an electronic device. After the thin metal surface layer of the reinforcing plate is vitrified, a ceramic laminate that is well bonded to the thin metal substrate is provided. When there are ceramic laminates on multiple surfaces of the thin metal substrate, a sandwich structure of ceramic laminates sandwiching thin metal can be obtained. In the sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the stiffness of the thin metal substrate, and because the Young's modulus of the ceramic laminate is high, the thickness of the reinforcing plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby obtaining a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate. Furthermore, when applied to various reinforcement scenarios in electronic equipment, the effects of thinning and reducing the weight of the entire machine can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0091] Figure 1 A schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0092] Figure 2 for Figure 1 Schematic diagram of the disassembled structure of the electronic equipment;

[0093] Figure 3 A structural schematic diagram of a flat-plate cross-beam stainless steel hardware sheet in a related technology provided in an embodiment of the present application;

[0094] Figure 4 for Figure 3 Schematic diagram of the local structure of the stainless steel hardware sheet of the middle flat plate after cutting along F1F2;

[0095] Figure 5 A cross-sectional optical microscopic image of a reinforcement plate provided in an embodiment of the present application;

[0096] Figure 6 This is a SEM image of a surface loose layer provided in an embodiment of the present application;

[0097] Figure 7 A schematic diagram of the structure of the first reinforcement plate provided in the embodiment of the present application;

[0098] Figure 8 A schematic diagram of the structure of a second reinforcement plate provided in an embodiment of the present application;

[0099] Fig. 9 A schematic diagram of the structure of a third reinforcement plate provided in an embodiment of the present application;

[0100] Fig.10 A schematic diagram of the structure of a fourth reinforcement plate provided in an embodiment of the present application;

[0101] Fig.11 A schematic diagram of force analysis of a reinforcement plate cross section provided in an embodiment of the present application;

[0102] Fig.12 A schematic diagram of force analysis of another reinforcement plate cross section provided in an embodiment of the present application;

[0103] Fig.13 A surface morphology diagram of a pure aluminum alloy in a related technology provided in an embodiment of the present application;

[0104] Fig.14 A surface morphology diagram of a reinforcement plate provided in an embodiment of the present application;

[0105] Fig.15 A process flow chart of a reinforcement plate preparation method provided in an embodiment of the present application;

[0106] Fig.16 A process flow chart of another reinforcement plate preparation method provided in an embodiment of the present application;

[0107] Fig.17 A schematic diagram of a reinforcement plate provided in an embodiment of the present application;

[0108] Fig.18 A schematic diagram of another reinforcement plate provided in an embodiment of the present application;

[0109] Fig.19 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0110] Fig. 20 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0111] Fig.21 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0112] Fig. 22 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application.

[0113] Reference numerals:

[0114] 01-mobile phone; 100-display screen; 101-middle frame; 102-back cover; 103-circuit board assembly; 1031-main circuit board; 1032-electronic components; 104-battery;

[0115] 106-Jiziliang stainless steel hardware sheet;

[0116] 02-reinforcement plate; 1-substrate; 2-ceramic laminate; 21-transition layer; 22-dense ceramic layer; 23-surface loose layer; m1-first surface; m2-second surface;

[0117] x-second pore; k-hole;

[0118] 4-ceramic material; 5-corrosion drilling pool; 7-support rod; 8-powder filling sintering pool; 9-stirring blades; 10-power anode; 11-power cathode;

[0119] 12-adhesive; 13-cover plate; 14-protective layer; 16-foam; 17-plastic; 19-backlight module; 20-surface film; 22-locking ear. DETAILED DESCRIPTION

[0120] Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and their variations in the specification, claims and drawings of this application are intended to cover non-exclusive inclusions.

[0121] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0122] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0123] In the embodiment of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone.

[0124] In addition, the character “ / ” in this article generally indicates that the previous and next associated objects are in an “or” relationship.

[0125] In the embodiments of the present application, "multiple" means more than two (including two). Similarly, "multiple groups" means more than two groups (including two groups), and "multi-layer" means more than two layers (including two layers), unless otherwise clearly specified and limited.

[0126] In the embodiments of the present application, "at least one" means one or more than one.

[0127] In the embodiments of the present application, the orientations or positional relationships indicated by the technical terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, etc., and should not be understood as a limitation on the embodiments of the present application.

[0128] In the embodiments of the present application, the technical terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application according to the specific circumstances.

[0129] Some of the terms in the embodiments of the present application are explained below so that those skilled in the art can better understand them.

[0130] 1. Arc discharge process

[0131] Arc discharge technology refers to the discharge phenomenon that presents arc-shaped white light and produces high-temperature gas.

[0132] Whether in rarefied gas, metal vapor or atmosphere, when the power supply is large, it can provide a large enough current (several amperes to tens of amperes) to break down the gas, emit a strong glow, and generate high temperature (thousands to tens of thousands of degrees). This form of self-sustaining discharge of gas is arc discharge.

[0133] 2. Micro-arc oxidation process

[0134] The micro-arc oxidation process refers to the growth of a modified ceramic coating composed mainly of matrix metal oxides and supplemented by electrolyte components on the surface of metals and their alloys under the instantaneous high temperature and high pressure generated by arc discharge, relying on the matching adjustment of electrolyte and electrical parameters.

[0135] The micro-arc oxidation process introduces the working area from the Faraday area of ​​ordinary anodizing to the high-voltage discharge area, overcoming the defects of hard anodizing and greatly improving the comprehensive performance of the film layer.

[0136] 3. Vickers hardness

[0137] Vickers hardness is a standard for expressing the hardness of materials. It refers to using a diamond right pyramid indenter with an angle of 136° between relative surfaces to press into the surface of the tested material under a specified load. After maintaining the pressure for a certain period of time, the load is removed and the diagonal length of the indentation is measured. The surface area of ​​the indentation is then calculated. The average pressure on the indentation surface area is the Vickers hardness value of the tested material, which is represented by the symbol HV.

[0138] 4. Moment of inertia

[0139] The moment of inertia is a geometric quantity that is often used to describe the resistance of a cross section to bending.

[0140] 5. AF layer

[0141] The AF layer uses a special coating material that can effectively absorb the grease and sweat left by fingerprints, making the traces left by fingerprints very faint; at the same time, it can also prevent the traces left by fingerprints from being discovered and copied by others, thereby improving the security and accuracy of fingerprint recognition.

[0142] The above is a brief introduction to the nouns involved in the embodiments of the present application, which will not be repeated below.

[0143] In modern life, electronic devices such as laptops and mobile phones play an increasingly important role and are becoming one of the necessities of people's lives.

[0144] The present application provides an electronic device, and no limitation is imposed on the specific type of the electronic device. In some embodiments, the electronic device provided by the present application may include consumer electronic products, household electronic products, vehicle-mounted electronic products, financial terminal electronic products, and communication electronic products.

[0145] Among them, consumer electronic products may include mobile phones, tablet computers, laptops, notebook computers, handheld computers, personal computers (PCs), e-readers, desktop displays, cellular phones, drones, personal digital assistants (PDAs), smart wearable devices (e.g., smart bracelets, smart watches, headphones, etc.), ultra-mobile personal computers (UMPCs), augmented reality (AR) / virtual reality (VR) devices and other Internet of Things (IOT) devices; home electronic products may include televisions, smart door locks, remote controls, refrigerators, rechargeable small household appliances (e.g., soybean milk machines, sweeping robots, etc.), printers, projectors, etc.; vehicle-mounted electronic products may include vehicle-mounted navigation systems, vehicle-mounted high-density digital video discs (DVDs), etc.; financial terminal electronic products may include automated teller machines (ATMs), self-service terminals, etc.; communication electronic products may include servers, storage devices, base stations and other communication equipment.

[0146] For convenience, please refer to Figure 1 and Figure 2 , Figure 1 is an overall schematic diagram of an electronic device applicable to some embodiments of the present application, Figure 2 for Figure 1 The schematic diagram of the electronic device shown in FIG. Figure 1 and Figure 2 The electronic devices shown are all described using tablet phones as examples.

[0147] In other embodiments, the electronic device may also be other types of mobile phones, such as a foldable mobile phone.

[0148] Understandably, Figure 1 and Figure 2 The following figures and the related drawings only schematically illustrate some components of the electronic device, and the actual shape, size, position and structure of these components are not subject to Figure 1 and Figure 2 and the limitations of the accompanying drawings below.

[0149] The specific structure of the electronic device to which the embodiments of the present application are applicable is further described below.

[0150] Please refer to Figure 1 and Figure 2 Taking the electronic device as a mobile phone 01 as an example, the mobile phone 01 includes a display screen 100 and a middle frame 101 , and the display screen 100 is located on one side of the middle frame 101 .

[0151] In applications, the display screen 100 can be used to display images, videos, etc.

[0152] It should be noted that the display screen 100 can be any one of a liquid crystal display (LCD), an organic light emitting diode (OLED) display screen, a sub-millimeter light emitting diode (Mini LED) display screen, a micro light emitting diode (Micro LED) display screen, etc.

[0153] like Figure 2 As shown, the mobile phone 01 also includes a light-transmitting cover plate 105 , which can be stacked with the display screen 100 and is mainly used to protect the display screen 100 and prevent dust.

[0154] exist Figure 1 In the embodiment shown, the shape of the electronic device can be a rectangular flat plate. Of course, the shape of the electronic device can also be any other shape, which depends on the actual application.

[0155] Please refer to Figure 2 The mobile phone 01 also includes other structures such as a rear shell 102, a circuit board assembly 103 and a battery 104.

[0156] Among them, the rear shell 102 is arranged on the side of the middle frame 101 away from the display screen 100; and the rear shell 102 and the middle frame 101 can enclose an internal storage space of the mobile phone 01, and the internal storage space can accommodate structures such as the circuit board assembly 103 and the battery 104.

[0157] The battery 104 can be used to provide power to structures in the mobile phone 01 such as the display screen 100 and the circuit board assembly 103 .

[0158] For example Figure 2 As shown, the circuit board assembly 103 may include a main circuit board 1031 and electronic components 1032 , etc. The main circuit board 1031 may be used to carry the electronic components 1032 and complete signal interaction with the electronic components 1032 .

[0159] Figure 2The circuit board assembly 103 includes two electronic components 1032. Of course, the number of the electronic components 1032 is not limited to two, which depends on the actual application.

[0160] In applications, the main circuit board 1031 may include printed circuit boards (PCB), flexible printed circuits (FPC), etc.

[0161] It should be understood that the electronic components 1032 may include but are not limited to chips, resistors, capacitors, inductors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discretes, sensors, power supplies, switches, micro motors, electronic transformers, relays, subscriber identity module (SIM) card sockets, etc.

[0162] In practical applications, the rear housing 102 may include a back cover ( Figure 2 Not shown), border ( Figure 2 Structures not shown in FIG.

[0163] The back cover may be disposed on a side of the display screen 100 away from the light-transmitting cover plate 105 , and may be stacked with the light-transmitting cover plate 105 and the display screen 100 .

[0164] The frame can be disposed between the back cover and the light-transmitting cover plate 105 and fixed on the back cover.

[0165] The light-transmitting cover plate 105 can be fixed on the frame.

[0166] In some embodiments, the surface of the middle frame 101 facing the back cover may be provided with a battery installation slot ( Figure 2 The battery 104 may be installed in a battery installation slot, which may be subject to actual application.

[0167] In addition, the mobile phone 01 may also include other structures such as a microphone, a speaker, and a camera. Only the contents related to the invention point are introduced here, and the rest will not be explained one by one.

[0168] At present, many metal sheet structures are needed in electronic devices on the market. These metal sheet structures are often used in various support and reinforcement scenarios. There are many types of metal sheet structures, and stainless steel metal sheet is one of them. The shape of stainless steel metal sheet can be determined according to actual needs. Figure 3 A flat plate cross-beam stainless steel metal sheet 106 is shown, which can be used as a flat plate middle frame. Figure 4 yes Figure 3The local structure diagram of the flat plate beam stainless steel hardware sheet after cutting along F1F2. It should be noted that Figure 4 The dotted frame in the figure is because the entire structure of the J-beam stainless steel hardware sheet 106 is not drawn, but only a part of the structure is drawn exemplarily. The part in the dotted frame is a local structure diagram, and the boundary is represented by a dotted line.

[0169] The stainless steel material of the above-mentioned stainless steel hardware sheet has the characteristics of high Young's modulus (for example, up to about 200GPa) and excellent rigidity, so it can be applied to display backplanes, motherboard brackets, keyboard bottom plates, PC touch brackets, etc., effectively achieving an increase in bending resistance. However, stainless steel materials also have the characteristics of high density and heavy weight, which makes it very unfavorable to reduce the weight of electronic equipment when used in electronic equipment.

[0170] In order to solve the above problems, some lightweight metal materials are often used in related technologies to replace stainless steel materials to achieve the weight reduction effect of electronic equipment. Aluminum alloy materials are one of the lightweight metal materials. Although aluminum alloy materials have the advantages of low density, light weight, and good thermal conductivity, the Young's modulus of aluminum alloy materials themselves is relatively low (for example, the Young's modulus can be about 70GPa). Therefore, under the condition of achieving the same stiffness as stainless steel materials, the required thickness of aluminum alloy materials is greater, which is contrary to the requirements of thinning electronic equipment, thereby limiting the application of aluminum alloy materials in reinforcement and other scenarios.

[0171] Based on the above examples, it can be seen that the currently available stainless steel materials have high density and high cost, which is not conducive to weight reduction and efficiency improvement of electronic equipment; while the Young's modulus of aluminum alloy materials is insufficient, and the required thickness is greater at the same stiffness, which is not conducive to the thinning of electronic equipment. Therefore, when traditional reinforcement plates are used in electronic equipment, they cannot take into account the performance of stiffness, quality, Young's modulus and thickness, which leads to the inability of electronic equipment to achieve weight reduction and thinning at the same time, resulting in poor user experience.

[0172] In view of this, the present application provides a reinforcement plate, after the surface layer of the metal substrate of the reinforcement plate is vitrified, a ceramic laminate that is well bonded with the metal substrate is provided on the metal substrate. Since at least a transition layer in the ceramic laminate is embedded with the substrate, and the transition layer is embedded with the dense ceramic layer, the hard ceramic laminate can bear more stress during the force-bearing process, thereby reducing the degree of deformation under the action of external force. Therefore, on the basis of the lighter weight of the reinforcement plate itself, a higher Young's modulus and stiffness are achieved, so that the reinforcement plate can be applied to various reinforcement scenarios, such as display backplane, motherboard bracket, tablet middle frame reinforcement, etc., to increase its bending resistance.

[0173] When the reinforcing plate of the present application is applied to electronic equipment, the electronic equipment can achieve weight reduction and thickness reduction of the entire device, and the performance is excellent.

[0174] Please combine the following Figures 5 to 22 , the reinforcement plate 02 provided in the embodiment of the present application is introduced in detail.

[0175] like Figures 5 to 22 As shown, the reinforcement plate 02 provided in the embodiment of the present application includes:

[0176] Matrix 1.

[0177] The ceramic laminate 2 is located on at least one side of the substrate 1. The material of the ceramic laminate 2 is a ceramic material. The ceramic laminate 2 at least includes a transition layer 21 and a dense ceramic layer 22. The transition layer 21 is located between the substrate 1 and the dense ceramic layer 22. The dense ceramic layer 22 has a plurality of discrete and spaced first pores ( Figures 5 to 22 (not shown), the porosity of the plurality of first pores is less than or equal to 0.5%.

[0178] Among them, the transition layer 21 is not straight, the surface of the transition layer 21 close to the dense ceramic layer 22 is the first surface m1, and the surface of the transition layer 21 close to the substrate 1 is the second surface m2. The first surface m1 is connected to the surface of the dense ceramic layer 22 close to the transition layer 21 and the shape matches, and the second surface m2 is connected to the surface of the substrate 1 close to the transition layer 21 and the shape matches.

[0179] It should be understood that the ceramic laminate is located on at least one side of the substrate surface means that the ceramic laminate can be located on only one side of the substrate surface. Figure 5 , Figure 7 and Figure 8 As shown, the ceramic laminate 2 is located on the upper surface of the substrate 1; or, the ceramic laminate can be located on multiple side surfaces of the substrate, for example, the ceramic laminate can be located on both side surfaces of the substrate, specifically, as Fig. 9 and Fig.10 As shown, the ceramic laminate 2 is located on the upper and lower surfaces of the substrate 1. Fig.11 and Fig.12 As shown, the ceramic laminate 2 is located on the left and right surfaces of the substrate 1, and the specific surface can be determined according to actual needs.

[0180] In one or more embodiments, the ceramic material may include at least one of aluminum oxide (Al2O3) ceramics, titanium oxide (TiO2) ceramics, zirconium oxide (ZrO2) ceramics, silicon carbide (SiC) ceramics, titanium carbide (TiC) ceramics, and yttrium oxide (Y2O3) ceramics.

[0181] Ceramic materials have excellent hardness and Young's modulus, and their density is lower than that of stainless steel.

[0182] As an example, the density of Al2O3 ceramics can be 3.96 g / cm 3, the hardness can be as high as 1551HV, and the Young's modulus can be 400GPa.

[0183] As another example, the density of SiC ceramic may be 3.16 g / cm 3 , the hardness can be as high as 2347HV, and the Young's modulus can be 430GPa.

[0184] It should be understood that the ceramic laminate includes at least a transition layer and a dense ceramic layer. Figure 7 and Fig. 9 As shown, the ceramic laminate 2 may include only the transition layer 21 and the dense ceramic layer 22; or Figure 5 , Figure 8 and Fig.10 As shown, the ceramic laminate 2 may include a transition layer 21, a dense ceramic layer 22 and a surface loose layer 23, which may be specifically determined according to actual needs.

[0185] In the application, the porosity of the plurality of first pores in the dense ceramic layer is not specifically limited. For example, the porosity of the plurality of first pores may be 0.1%, 0.2%, 0.3%, 0.4% or 0.5%. Since the porosity of the dense ceramic layer is relatively small, the dense ceramic layer may be considered to be a dense structure.

[0186] It should be understood that the non-straight transition layer means that the transition layer extends in a non-linear manner. Figure 5 , Figures 7 to 10 As shown, the transition layer 21 is in an undulating corrugated shape. The undulating corrugated shape here can be an irregular undulating corrugated shape, or can also be a regular undulating corrugated shape, which is not specifically limited here and can be determined according to the actual process.

[0187] It should be understood that the second surface of the transition layer is connected to the substrate and their shapes match, which means that the second surface and the substrate can be embedded. For example, the second surface is convex, and the surface of the substrate close to the second surface is concave; or, the second surface is concave, and the surface of the substrate close to the second surface is convex, so that the protrusion and the depression can be completely bitten together, so that the transition layer and the substrate are not easily torn or separated under the action of external force.

[0188] And, the first surface of the transition layer is connected to the dense ceramic layer and their shapes match, which means that: the first surface and the dense ceramic layer can be embedded. For example, the first surface is convex, and the surface of the dense ceramic layer close to the first surface is concave; or, the first surface is concave, and the surface of the dense ceramic layer close to the first surface is convex, so that the protrusion and the depression can be completely bitten together, so that the transition layer and the dense ceramic layer are not easily torn and separated under the action of external force.

[0189] The reinforcement plate provided in the embodiment of the present application has a ceramic laminate that is well bonded to the substrate after the surface layer of the substrate is vitrified. At this time, the ceramic laminate includes at least a transition layer and a dense ceramic layer. The transition layer can be embedded with the dense ceramic layer. When multiple surfaces of the substrate have the ceramic laminate, a sandwich structure of ceramic sandwiched with the substrate can be obtained. In the process of being subjected to force, the hard ceramic laminate can bear more stress in the sandwich structure, thereby reducing the degree of deformation under the action of external force, effectively improving the stiffness of the substrate, and under the premise of ensuring that the overall Young's modulus and stiffness of the reinforcement plate remain unchanged, its thickness and weight can also be reduced.

[0190] Therefore, when the reinforcement plate is used in various reinforcement scenarios in electronic equipment, the effects of reducing the thickness and weight of the entire device can be achieved.

[0191] Alternatively, as an implementable approach, Figure 7 and Fig. 9 As shown, the ceramic laminate 2 includes a transition layer 21 and a dense ceramic layer 22 .

[0192] The transition layer 21 is located between the substrate 1 and the dense ceramic layer 22, and the dense ceramic layer 22 has a plurality of discrete and spaced first pores ( Figure 7 and Fig. 9 The porosity of the plurality of first pores is less than or equal to 0.5%, the transition layer 21 is not straight, the surface of the transition layer 21 close to the dense ceramic layer 22 is the first surface m1, the surface of the transition layer 21 close to the substrate 1 is the second surface m2, the first surface m1 is connected to the surface of the dense ceramic layer 22 close to the transition layer 21 and the shapes thereof are matched, the second surface m2 is connected to the surface of the substrate 1 close to the transition layer 21 and the shapes thereof are matched.

[0193] The reinforcement plate provided in the embodiment of the present application has a ceramic laminate that is well bonded to the substrate after the surface layer of the substrate is vitrified. When the ceramic laminate is present on multiple surfaces of the substrate, a sandwich structure of the ceramic laminate and the substrate can be obtained. The dense ceramic layer and the transition layer, as well as the transition layer and the substrate in the sandwich structure are tightly bonded. During the stress process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the rigidity of the substrate, and because the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and rigidity, thereby achieving a lighter weight than traditional stainless steel materials and a thinner size than traditional pure metal substrates.

[0194] Therefore, when the reinforcement plate is used in various reinforcement scenarios in electronic equipment, the effects of reducing the thickness and weight of the entire device can be achieved.

[0195] Alternatively, as an implementable approach, Figure 5 , Figure 6, Figure 8 and Fig.10 As shown, the ceramic laminate 2 includes a transition layer 21 , a dense ceramic layer 22 and a surface loose layer 23 .

[0196] The transition layer 21 is located between the substrate 1 and the dense ceramic layer 22, and the dense ceramic layer 22 has a plurality of discrete and spaced first pores ( Figure 5 , Figure 8 and Fig.10 The porosity of the plurality of first pores is less than or equal to 0.5%, the transition layer 21 is not straight, the surface of the transition layer 21 close to the dense ceramic layer 22 is the first surface m1, the surface of the transition layer 21 close to the substrate 1 is the second surface m2, the first surface m1 is connected to the surface of the dense ceramic layer 22 close to the transition layer 21 and the shapes thereof are matched, the second surface m2 is connected to the surface of the substrate 1 close to the transition layer 21 and the shapes thereof are matched.

[0197] The surface loose layer 23 is located on the side of the dense ceramic layer 22 away from the transition layer 21, and is connected to the dense ceramic layer 22. The surface loose layer 23 has a plurality of discrete and spaced second pores x, and the porosity of the plurality of second pores x ranges from 5% to 15%.

[0198] It should be noted that Figure 6 is a scanning electron microscope (SEM) image of the surface loose layer 23. Figure 6 It can be clearly seen that the surface loose layer 23 has many second pores x.

[0199] In applications, the porosity of the second pores of the surface loose layer is not specifically limited. For example, the porosity of the second pores may be 5%, 6%, 8%, 10%, 13% or 15%, etc.

[0200] In the application, the shape of the surface loose layer is not specifically limited, for example, Figure 8 and Fig.10 As shown, the surface loose layer 23 may be flat; or, the surface loose layer may be uneven. When the surface loose layer is uneven, the surface loose layer may be undulating and corrugated. Further, the undulating and corrugated shape may be irregular, or may be regular, which may be determined according to the actual process.

[0201] In addition, when the surface loose layer is uneven, the unevenness of the surface loose layer and the unevenness of the transition layer may be the same or different, and no specific limitation is made here.

[0202] In one or more embodiments, when the surface loose layer is not straight, the surface loose layer is connected to the dense ceramic layer and the shapes thereof are matched.

[0203] The above-mentioned connection and shape matching means that: the surface loose layer and the dense ceramic layer can be embedded. For example, the surface of the surface loose layer close to the dense ceramic layer is convex, and the surface of the dense ceramic layer close to the surface loose layer is concave; or, the surface of the surface loose layer close to the dense ceramic layer is concave, and the surface of the dense ceramic layer close to the surface loose layer is convex. Thus, the protrusions and the depressions can be completely bitten together, so that the surface loose layer and the dense ceramic layer are not easily torn and separated under the action of external force.

[0204] In applications, there is no specific limitation on the roughness of the surface loose layer, and the roughness of the surface loose layer may range from 2 μm to 3 μm.

[0205] For example, the roughness of the surface loose layer may be 2 μm, 2.2 μm, 2.4 μm, 2.6 μm, 2.8 μm or 3 μm.

[0206] It should be noted that Figure 5 The black part in the middle is an object used when taking a cross-sectional light microscopic image of the reinforcing plate, such as mounting resin, which can be ignored here.

[0207] The reinforcement plate provided in the embodiment of the present application has a ceramic laminate that is well bonded to the substrate after the surface layer of the substrate is vitrified. When the ceramic laminate is present on multiple surfaces of the substrate, a sandwich structure of the ceramic laminate sandwiching the substrate can be obtained. The surface loose layer and the dense ceramic layer, the dense ceramic layer and the transition layer, and the transition layer and the substrate in the sandwich structure are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the rigidity of the substrate, and because the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcement plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and rigidity, thereby achieving a lighter weight than traditional stainless steel materials and a thinner size than traditional pure metal substrates.

[0208] Therefore, when the reinforcement plate is used in various reinforcement scenarios in electronic equipment, the effects of reducing the thickness and weight of the entire device can be achieved.

[0209] Optionally, as a feasible manner, the substrate is a light metal substrate.

[0210] In the application, the light metal of the light metal matrix is ​​not particularly limited. For example, the light metal may include any one of aluminum (Al), titanium (Ti), zirconium (Zr), and the like.

[0211] In applications, there is no specific limitation on the thickness of the light metal substrate. For example, the thickness of the light metal substrate ranges from 0.05 mm to 0.6 mm.

[0212] Specifically, the thickness of the light metal substrate may be 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm or 0.6 mm.

[0213] In one or more embodiments, the types of the light metal of the light metal matrix and the ceramic material of the ceramic laminate may be the same or different. For example, when the light metal is Al, the ceramic material may be at least one of Al2O3 ceramics, TiO2 ceramics, ZrO2 ceramics, SiC ceramics, TiC ceramics, and Y2O3 ceramics.

[0214] Furthermore, the light metal of the light metal matrix and the ceramic material of the ceramic laminate are of the same type. For example, when the light metal is Al, the ceramic material is Al2O3 ceramic.

[0215] The reinforcing plate provided in the embodiment of the present application has a ceramic laminate that is well bonded to the thin metal substrate after the thin metal surface layer is vitrified. When the thin metal substrate has ceramic laminates on multiple surfaces, a sandwich structure of the ceramic laminate and the thin metal can be obtained. In the sandwich structure, at least the dense ceramic layer and the transition layer, and the transition layer and the substrate are tightly bonded. During the force-bearing process, the hard ceramic laminate can bear more stress, reducing the degree of deformation under the action of external force, effectively improving the stiffness of the thin metal substrate, and because the Young's modulus of the ceramic laminate is relatively high, the thickness of the reinforcing plate can be reduced and its mass can be reduced while obtaining the same Young's modulus and stiffness, thereby achieving a lighter weight than traditional stainless steel materials and a lighter and thinner size than a pure metal substrate.

[0216] Therefore, when the reinforcement plate is used in various reinforcement scenarios in electronic equipment, the effects of reducing the thickness and weight of the entire device can be achieved.

[0217] Combine the following Figure 5 , Figure 8 and Fig.10 , taking the reinforcing plate 02 including an Al matrix and an Al2O3 ceramic laminate, wherein the thickness of the Al matrix ranges from 0.05 mm to 0.6 mm, and the Al2O3 ceramic laminate includes a transition layer 21, a dense ceramic layer 22 and a surface loose layer 23 as an example for explanation.

[0218] In the application, there is no specific limitation on the ratio of the thickness of the Al2O3 ceramic laminate to the thickness of the reinforcing plate. In the direction perpendicular to the Al substrate, the ratio of the thickness of the Al2O3 ceramic laminate to the thickness of the reinforcing plate ranges from 10% to 60%.

[0219] For example, the ratio of the thickness of the Al2O3 ceramic laminate to the thickness of the reinforcing plate may be 10%, 20%, 30%, 40%, 50% or 60%, etc.

[0220] On this basis, there is no specific limitation on the ratio of the thickness of the Al substrate to the thickness of the reinforcing plate, and the ratio of the thickness of the Al substrate to the thickness of the reinforcing plate ranges from 40% to 90%.

[0221] For example, the ratio of the thickness of the Al matrix to the thickness of the reinforcing plate may be 40%, 50%, 60%, 70%, 80% or 90%, etc.

[0222] In one or more embodiments, the ratio of the thickness of the transition layer to the thickness of the Al2O3 ceramic laminate is not specifically limited, and along the direction perpendicular to the Al substrate, the ratio of the thickness of the transition layer to the thickness of the Al2O3 ceramic laminate ranges from 0.1% to 5%.

[0223] Exemplarily, the ratio of the thickness of the transition layer to the thickness of the Al2O3 ceramic laminate may be 0.1%, 1%, 2%, 1.5%, 3%, 4% or 5%, etc.

[0224] Furthermore, there is no specific limitation on the thickness of the transition layer. For example, along the direction perpendicular to the substrate, the thickness of the transition layer ranges from 0.1 μm to 1 μm.

[0225] Specifically, the thickness of the transition layer may be 0.1 μm, 0.2 μm, 0.4 μm, 0.6 μm, 0.8 μm or 1 μm.

[0226] In one or more embodiments, the ratio of the thickness of the dense ceramic layer to the thickness of the Al2O3 ceramic laminate is not specifically limited, and the ratio of the thickness of the dense ceramic layer to the thickness of the Al2O3 ceramic laminate is in the range of 90% to 95%.

[0227] Exemplarily, the ratio of the thickness of the dense ceramic layer to the thickness of the Al2O3 ceramic laminate may be 90%, 91%, 92%, 93%, 94% or 95%, etc.

[0228] Furthermore, there is no specific limitation on the thickness of the dense ceramic layer. For example, along a direction perpendicular to the substrate, the thickness of the dense ceramic layer ranges from 10 μm to 80 μm.

[0229] Specifically, the thickness of the dense ceramic layer may be 10 μm, 20 μm, 30 μm, 40 μm, 60 μm or 80 μm.

[0230] In one or more embodiments, the ratio of the thickness of the surface loose layer to the thickness of the Al2O3 ceramic laminate is not specifically limited, and the ratio of the thickness of the surface loose layer to the thickness of the Al2O3 ceramic laminate is in the range of 0.1% to 5%.

[0231] Exemplarily, the ratio of the thickness of the surface loose layer to the thickness of the Al2O3 ceramic laminate may be 0.1%, 0.5%, 1%, 2%, 3%, 4% or 5%, etc.

[0232] Furthermore, there is no specific limitation on the thickness of the surface loose layer. For example, along the direction perpendicular to the substrate, the thickness of the surface loose layer ranges from 0.1 μm to 1 μm.

[0233] Specifically, the thickness of the surface loose layer may be 0.1 μm, 0.2 μm, 0.4 μm, 0.6 μm, 0.8 μm or 1 μm.

[0234] It should be noted that the matrix is ​​actually a three-dimensional structure. Here, the matrix is ​​regarded as a two-dimensional structure just to illustrate the thickness of the transition layer, the dense ceramic layer and the surface loose layer.

[0235] In the application, the Vickers hardness of the Al2O3 ceramic laminate is not specifically limited. For example, the Vickers hardness of the Al2O3 ceramic laminate is greater than or equal to 1000 HV.

[0236] Specifically, the Vickers hardness of the Al2O3 ceramic laminate may be 1000HV, 1050HV, 1500HV, 1900HV, 2000HV or 2500HV, etc.

[0237] Thus, the Al2O3 ceramic laminate wraps the Al matrix thin layer metal to form a sandwich structure reinforcement plate, in which the original surface metal Al is replaced by the Al2O3 ceramic laminate, and during the stress process, the hard Al2O3 ceramic laminate bears more stress.

[0238] Please refer to the following Fig.11 and Fig.12 , the calculation method of the Young's modulus of the Al2O3 ceramic laminate reinforced metal Al matrix is ​​specifically described. Fig.11 and Fig.12 They are respectively cross-sectional views of the reinforcement plate provided in the embodiments of the present application.

[0239] Combination Fig.11 and Fig.12 Two scenarios of Al2O3 ceramic laminates reinforced with metal Al matrix are given, and the main stress conditions of the cross section are divided into two categories:

[0240] a) If Fig.11 As shown, the left and right sandwich force structures are:

[0241] Under the action of the three-bar bending force, the deflection δ of the metal Al matrix and the upper surface of the Al2O3 ceramic laminate is consistent, and the relationship is δ=P1L 3 / 48E1I1=P2L 3 / 48E2I2=PL 3 / 48EI.

[0242] Wherein, P1 is the force exerted on the Al2O3 ceramic laminate.

[0243] P2 is the force exerted on the metal Al matrix.

[0244] P is the force applied to the entire reinforcement plate.

[0245] E1 is the Young's modulus of the Al2O3 ceramic laminate.

[0246] E2 is the Young's modulus of the metal Al matrix.

[0247] E is the Young's modulus of the entire reinforcement plate.

[0248] I1 is the moment of inertia of the Al2O3 ceramic laminate relative to the neutral plane a.

[0249] I2 is the moment of inertia of the metal Al matrix relative to the neutral plane a.

[0250] I is the moment of inertia of the entire reinforcement plate relative to the neutral plane a.

[0251] L is the length of the reinforcing plate along the OZ direction, where the OZ direction is perpendicular to Fig.11 Direction of the midsection.

[0252] It should be noted that the neutral surface a refers to the non-deformed surface where there is neither tension nor pressure during the material stress process. Fig.11 In the case of the reinforcement plate, the part above the neutral plane a is under pressure, and the part below is under tension. Fig.11 Indicated by dotted line.

[0253] Combined with the synthetic relationship of force P = 2P1 + P2, the Young's modulus in this case can be calculated as:

[0254] E=(2b1E1+b2E2) / (2b1+b2).

[0255] Among them, b1 is the ceramic laminate edge Fig.11 The width in the OX direction shown in FIG. , wherein the OX direction is parallel to Fig.11 Direction of the midsection.

[0256] b2 is the metal Al matrix along Fig.11 The width in the OX direction shown in .

[0257] b) If Fig.12 As shown, the upper and lower sandwich force structure:

[0258] Under the action of bending moment, from the perspective of the metal Al matrix and the upper and lower Al2O3 ceramic laminates respectively, the strain ε of the metal Al matrix and the upper and lower Al2O3 ceramic laminates on both sides of the interface is continuous, that is, the strain ε at the interface is consistent, and the relationship is ε=M1y / E1I1=M2y / E2I2=My / EI.

[0259] Wherein, M1 is the bending moment of the Al2O3 ceramic laminate.

[0260] M2 is the bending moment of the metal Al matrix.

[0261] M is the bending moment of the entire reinforcement plate.

[0262] E1 is the Young's modulus of the Al2O3 ceramic laminate.

[0263] E2 is the Young's modulus of the metal Al matrix.

[0264] E is the Young's modulus of the entire reinforcement plate.

[0265] I1 is the moment of inertia of the Al2O3 ceramic laminate relative to the neutral plane a.

[0266] I2 is the moment of inertia of the metal Al matrix relative to the neutral plane a.

[0267] I is the moment of inertia of the entire reinforcement plate relative to the neutral plane a.

[0268] y is the height of the interface between the metal Al matrix and the Al2O3 ceramic laminate from the neutral plane a, that is, y = 1 / 2h2.

[0269] According to the synthetic relationship of bending moment M = 2M1 + M2 and the parallel axis formula I = (bh 3 ) / 12=I x +∫ A Z 2 dA, the Young's modulus in this case can be calculated as:

[0270] E={2h1[h1 2 +3(h1+h2) 2 ]E1+h2 3 E2} / (2h1+h2) 3 .

[0271] Among them, b is the entire reinforcement plate edge Fig.12 The width in the OX direction shown in .

[0272] A is the corresponding area element in the parallel axis formula calculation.

[0273] h1 is Al2O3 ceramic laminate Fig.12 The height in the OY direction is shown in .

[0274] h2 is the metal Al matrix along Fig.12 The height in the OY direction is shown in .

[0275] h is the entire reinforcement plate edge Fig.12 The height in the OY direction is shown in .

[0276] According to the above content, taking the preparation of alumina ceramic laminates on an Al alloy substrate with a thickness of 0.15mm to 0.5mm as an example, preliminary experiments found that when the thickness of the alumina ceramic laminates on both sides of the Al alloy substrate accounted for 10%, 20%, and 30% of the total thickness of the reinforcement plate, respectively, compared with pure aluminum alloy, the Young's modulus of the reinforcement plate of the embodiment of the present application was increased by more than 6%, 13%, and 25%, respectively.

[0277] As an example, when a 10 μm alumina ceramic laminate is prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 74.7 GPa.

[0278] As another example, when 20 μm alumina ceramic laminates are prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 79.4 GPa.

[0279] As another example, when 30 μm alumina ceramic laminates are prepared on both sides of a 0.2 mm Al alloy substrate, the Young's modulus of the reinforcement plate is 87.7 GPa.

[0280] The above proves that the reinforcement plate provided in the embodiment of the present application can take into account the advantages of light weight, excellent rigidity, and high Young's modulus. Therefore, when used in electronic equipment, the electronic equipment can have a high Young's modulus and excellent rigidity without being too heavy or too thick, and the performance is very excellent.

[0281] It should be noted that Fig.13 shows the surface morphology of traditional pure aluminum alloy, Fig.14 The surface morphology of the reinforcing plate of the embodiment of the present application is shown. Fig.13 and 14 As shown, the reinforcing plate of the embodiment of the present application has a dull appearance, which is different from the bright surface with metallic luster of the traditional pure aluminum alloy.

[0282] right Fig.14By performing glue filling and inlaying observation on the cross section of the reinforcement plate, it can be measured that the thickness of the ceramic laminate is greater than 10 μm, that is, the ceramic laminate in the embodiment of the present application can be made thicker, and the thickness is greater than the thickness of the film layer obtained by traditional micro-arc oxidation or anodizing, so that the Young's modulus of the reinforcement plate can be higher, but the thickness is significantly smaller than the thickness of the stainless steel material in the related art.

[0283] In addition, after corroding the reinforcing plate of the embodiment of the present application with a corrosive agent, it was found that the reinforcing plate showed a laminated form in which the ceramic laminate and the metal matrix were embedded in each other and interlaced, and the interlocking interface was irregularly undulating and wavy, and the combination was good.

[0284] The above only introduces the contents related to the invention point. The remaining structures can be obtained by referring to the relevant technology and will not be described in detail here.

[0285] Please combine the following Fig.15 and Fig.16 , the preparation method of the reinforcement plate 02 provided in the embodiment of the present application is introduced in detail.

[0286] The manufacturing process of the reinforcing plate in the embodiment of the present application can be briefly described as: hot dip degreasing and water washing → neutralization + water washing → punching treatment + water washing → powder filling → arc sintering → water washing and drying → inspection and shipment.

[0287] like Fig.15 As shown, the preparation method comprises the following steps:

[0288] S1. Fig.15 As shown in Figure (a), a substrate 1 is provided.

[0289] The substrate is a substrate that has not been subjected to drilling and sintering.

[0290] In applications, the material of the substrate may be a light metal. For example, the light metal may include any one of Al, Ti, Zr, and the like.

[0291] There is no specific limitation on the shape of the substrate. For example, the shape of the substrate can be any one of a cuboid, a cube, and the like.

[0292] There is no specific limitation on the thickness of the substrate. For example, the thickness of the substrate may range from 0.05 mm to 0.6 mm. Specifically, the thickness of the substrate may be 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm or 0.6 mm.

[0293] S2. Fig.15 As shown in FIG. 2( b ), a plurality of holes k are formed on the upper surface and the lower surface of the substrate 1 .

[0294] The hole k does not penetrate the substrate 1 .

[0295] In the application, there is no specific limitation on the pore size, and the pore size ranges from 200 nm to 300 nm, and specifically, the pore size may be 200 nm, 220 nm, 240 nm, 260 nm, 280 nm or 300 nm.

[0296] There is no specific limitation on the depth of the hole (referred to as hole depth), and illustratively, the hole depth ranges from 10 μm to 120 μm. Specifically, the hole depth may be 10 μm, 20 μm, 50 μm, 70 μm, 100 μm or 120 μm.

[0297] There is no specific limitation on the method of forming the holes. For example, the holes can be formed on the surface of the substrate where the holes are to be formed by a chemical method, such as an acid etching method. When the acid etching method is used, there is no specific limitation on the type of the acid. For example, the acid can include a strong acid, such as sulfuric acid, phosphoric acid, etc., and the mass concentration of the acid can be 180 g / L.

[0298] It should be noted that when only a portion of the surface of the substrate needs to form holes, the surface of the substrate where holes do not need to be formed can be protected.

[0299] S3. Fig.15 As shown in FIG. 5( c ), a ceramic material 4 is filled in the hole k to form a first structure.

[0300] In the application, there is no specific limitation on the type of ceramic material. For example, the ceramic material may include at least one of Al2O3 ceramic, TiO2 ceramic, ZrO2 ceramic, SiC ceramic and the like.

[0301] There is no particular limitation on the size of the ceramic material. For example, the size of the ceramic material may be at a nanometer level.

[0302] There is no specific limitation on the method of filling the ceramic material into the pores. For example, nano ceramic powder with good conductivity can be deposited inside the deep pores under the driving force of the electric field, that is, adsorbed in the pores.

[0303] It should be noted that this step is to allow the ceramic material to enter the pores and be adsorbed in the pores, and at this time the ceramic material does not undergo any reaction.

[0304] S4. Fig.15 As shown in FIG. 5( d ), the first structure is sintered to form a reinforcing plate having a ceramic laminate 2 .

[0305] The ceramic laminate 2 is located on both side surfaces of the substrate 1 , and the material of the ceramic laminate 2 is ceramic material.

[0306] As an example, Fig. 9As shown, the ceramic laminate 2 includes a transition layer 21 and a dense ceramic layer 22. The transition layer 21 is located between the substrate 1 and the dense ceramic layer 22. The dense ceramic layer 22 has a plurality of discrete and spaced first pores ( Fig. 9 (not shown in the figure), the porosity of the plurality of first pores is less than or equal to 0.5%; the transition layer 21 is not straight, the surface of the transition layer 21 close to the dense ceramic layer 22 is connected to the dense ceramic layer 22 and the shape matches, and the surface of the transition layer 21 close to the substrate 1 is connected to the substrate 1 and the shape matches.

[0307] As another example, Fig.10 As shown, the ceramic laminate 2 includes a transition layer 21, a dense ceramic layer 22 and a surface loose layer 23. The transition layer 21 is located between the substrate 1 and the dense ceramic layer 22. The dense ceramic layer 22 has a plurality of discrete and spaced first pores ( Fig.10 The transition layer 21 is not shown in the figure), the porosity of the plurality of first pores is less than or equal to 0.5%; the transition layer 21 is not straight, the surface of the transition layer 21 close to the dense ceramic layer 22 is connected to the dense ceramic layer 22 and the shape matches, the surface of the transition layer 21 close to the substrate 1 is connected to the substrate 1 and the shape matches; the surface loose layer 23 is located on the side of the dense ceramic layer 22 away from the transition layer 21, the surface loose layer 23 is connected to the dense ceramic layer 22, and the surface loose layer 23 has a plurality of discrete and spaced second pores ( Fig.10 (not shown in the figure), the porosity of the plurality of second pores ranges from 5% to 15%, and the surface loose layer is flat.

[0308] In the application, the sintering method is not specifically limited, and illustratively, the sintering method may include arc discharge sintering, etc. When arc discharge sintering is adopted, a salt solution in an alkaline environment needs to be prepared as an electrolyte, and then the first structure is immersed in the electrolyte, and arc discharge sintering is performed after power is applied.

[0309] There is no specific limitation on the type and concentration of the salt solution. For example, the salt solution may include at least one of Na2SiO3 (10 g / L) + alkaline KOH (1 g / L), Na2B4O7 (10 g / L) + alkaline KOH (1 g / L), NaAlO2 (10 g / L) + alkaline KOH (1 g / L), etc.

[0310] There is no specific limitation on the current parameters after power-on. For example, the current parameter range is 10A / dm 2 ~30A / dm 2 Specifically, the current parameter can be 10A / dm 2 、15A / dm 2 、20A / dm 2 、25A / dm 2 、28A / dm 2or 30A / dm 2 wait.

[0311] Thus, a transition layer between the substrate and the ceramic oxide layer is prepared by the above preparation method. The transition layer is the product of the arc reaction between the electrolyte and the substrate. The interface between the transition layer and the substrate is well bonded and is not easy to fall off or crack. The slices show irregular undulating corrugations, which can further effectively ensure the interface bonding strength.

[0312] A dense ceramic layer is prepared by the above preparation method. The dense ceramic layer is a mixed structure of ceramic powders sintered together in the holes and sintered with the hole walls, which is basically close to the initial drilling depth. Due to the influence of high-temperature arc sintering, its inner layer structure is a dense ceramic layer, which is the main functional area for increasing hardness and Young's modulus. The porosity of the dense ceramic layer is extremely low, generally less than or equal to 0.5%, close to a fully dense and pore-free structure.

[0313] The surface loose layer is prepared by the above preparation method, which is a very thin layer on the surface of the dense ceramic layer. Affected by the molten metal, the surface of the surface loose layer has crater pores formed by metal overflow, and has a large brittle tendency and is easy to peel off.

[0314] The preparation method of the reinforcement plate provided in the embodiment of the present application uses a vitrification process to prepare a dense ceramic laminate that is well bonded with the thin plate metal on the surface of the thin plate metal, and the ceramic laminate wraps the middle thin layer of metal to form a sandwich structure, so that the original surface metal of the substrate is replaced by the ceramic laminate, and the hard ceramic laminate bears more stress during the force-bearing process. Therefore, compared with traditional stainless steel materials, the Young's modulus and stiffness can be kept unchanged by the thin plate metal and the relatively thin ceramic laminate, and the purpose of reducing the weight of the whole machine can be achieved when used in electronic equipment. In addition, compared with traditional pure alloys, higher Young's modulus and stiffness can be achieved by the thin plate metal and the not-too-thin ceramic laminate, and the purpose of reducing the thickness of the whole machine can be achieved when used in electronic equipment; in addition, the preparation method is simple and easy to implement, which is conducive to industrial production.

[0315] Please refer to the following Fig.16 ,right Fig.15 A supplementary explanation is given on the preparation method of the reinforcing plate.

[0316] like Fig.16 As shown, the preparation method of the reinforcement plate includes:

[0317] S11. Provide a rectangular parallelepiped substrate 1.

[0318] S12. Punching stage:

[0319] like Fig.16As shown in Figure (a), a corrosion drilling pool 5 containing sulfuric acid with a mass concentration of 180g / L is provided, and the rectangular substrate 1 is completely immersed in the sulfuric acid through the support rod 7. The unprotected upper and lower surfaces of the substrate 1 are corroded by sulfuric acid to form a plurality of deep holes with uneven inner surfaces on the upper and lower surfaces respectively.

[0320] S13. Powder filling stage:

[0321] like Fig.16 As shown in Figure (b), a powder-filled sintering pool 8 is provided, and 10g / L Na2SiO3+1g / L KOH are contained in the powder-filled sintering pool 8. In addition, 5g / L Al2O3 aqueous solution with good conductivity (Al2O3 powder is uniformly dispersed in the aqueous solution) is also contained in the powder-filled sintering pool 8. There are also stirring blades 9 in the powder-filled sintering pool 8, and the stirring blades 9 are continuously stirring. The powder-filled sintering pool 8 also has a power anode 10 and a power cathode 11. When power is turned on, driven by the electric field force, Al2O3 powder is deposited inside the deep hole.

[0322] S14. Sintering stage:

[0323] like Fig.16 As shown in Figure (b), adjust the current parameter to 30A / dm 2 Under the instantaneous high temperature and high pressure generated by arc discharge, complex physical and chemical changes will occur. The surface metal of the unperforated rectangular substrate 1 is oxidized by high temperature and sintered together with the filled Al2O3 ceramic powder to form a dense ceramic laminate. The ceramic laminate is firmly bonded to the rectangular substrate 1, has a dense internal structure, high toughness, and good wear resistance and corrosion resistance.

[0324] Thus, various shapes of reinforcing plates can be prepared by the above preparation method to facilitate use, for example, Fig.17 and Fig.18 The reinforcement plate 02 shown.

[0325] Compared with the traditional technology, the preparation method of the reinforcing plate provided in the embodiment of the present application uses a chemical method to prepare holes with a larger inner diameter and a deeper hole depth, and then directly fills the nano-ceramic particles with good conductivity into the deep hole under the drive of the electric field force, which has a better effect, and the prepared ceramic laminate is also thicker and denser. The Vickers hardness of the ceramic laminate after sintering is greater than 1000HV, and can reach more than 2000HV, so that the reinforcing plate has a higher elastic modulus and better structural rigidity. Therefore, the reinforcing plate can be used directly as an internal structural part, and can be used as an appearance part through subsequent processing such as surface spraying.

[0326] The structural description of the reinforcement plate in the embodiments of the present application can refer to the above embodiments and will not be repeated here.

[0327] Only the contents related to the invention are introduced here. The rest of the preparation methods can be obtained by referring to the relevant technologies and will not be described in detail here.

[0328] An embodiment of the present application further provides an electronic device, which includes the above-mentioned reinforcement plate.

[0329] The electronic device provided in the embodiments of the present application has the effects of reducing the thickness and weight of the entire device.

[0330] The reinforcing plate provided in the embodiment of the present application is applied to an electronic device to obtain the following Figures 19 to 22 Various applications shown.

[0331] As an example, Fig.19 As shown, the electronic device 03 includes: a middle frame 101 and a reinforcing plate 02, an adhesive 12, a reinforcing plate 02, an adhesive 12, a display screen 100, an adhesive 12, a cover plate 13 and a protective layer 14 which are sequentially stacked on the middle frame 101.

[0332] In applications, the type of adhesive is not particularly limited. For example, the adhesive may include an optically clear adhesive (OCA).

[0333] There is no specific limitation on the type of the cover plate. For example, the cover plate may include a glass cover plate, etc., to protect the display screen.

[0334] There is no specific limitation on the type of the protection layer. For example, the protection layer may include an anti-fingerprint (AF) layer or the like.

[0335] As another example, Fig. 20 As shown, the electronic device 03 includes: foam 16 , plastic 17 , a reinforcing plate 02 and an adhesive 12 .

[0336] As another example, Fig.21 As shown, the electronic device 03 includes: a backlight module 19 , a reinforcement plate 02 and a surface film 20 .

[0337] As another example, Fig. 22 As shown, the electronic device 03 includes: a locking ear 22 , a reinforcing plate 02 , an adhesive 12 , a circuit board assembly 103 and a surface film 20 .

[0338] It should be noted that Figure 20 to Figure 22 The dotted box in the figure is because the entire structure of the electronic device is not drawn, but only a part of the structure related to the invention point is drawn as an example. The part within the dotted box is a local structure diagram, and the boundary is represented by a dotted line.

[0339] It should be understood that the above is only to help those skilled in the art better understand the embodiments of the present application, rather than to limit the scope of the embodiments of the present application. Those skilled in the art can obviously make various equivalent modifications or changes based on the above examples given. Or a combination of any two or any multiple embodiments of the above. Such modifications, changes or combined solutions also fall within the scope of the embodiments of the present application.

[0340] It should also be understood that the above description of the embodiments of the present application focuses on emphasizing the differences between the various embodiments. The same or similar points that are not mentioned can be referenced to each other. For the sake of brevity, they will not be repeated here.

[0341] It should also be understood that the division of the methods, situations, categories and embodiments in the embodiments of the present application is only for the convenience of description and should not constitute a special limitation. The features of various methods, categories, situations and embodiments can be combined without contradiction.

[0342] It should also be understood that in the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0343] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A reinforcing plate, characterized in that: include: matrix; A ceramic laminate, wherein the ceramic laminate is located on at least one side surface of the substrate, the material of the ceramic laminate is a ceramic material, the ceramic laminate at least includes a transition layer and a dense ceramic layer, the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, and the porosity of the plurality of first pores is less than or equal to 0.5%; the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is connected to the dense ceramic layer and the shape matches, and the surface of the transition layer close to the substrate is connected to the substrate and the shape matches.

2. The reinforcing plate according to claim 1, characterized in that: The transition layer is in an undulating corrugated shape.

3. The reinforcing plate according to claim 1 or 2, characterized in that: The ceramic laminate also includes a surface loose layer, which is located on the side of the dense ceramic layer away from the substrate, connected to the dense ceramic layer, and has a plurality of discrete and spaced second pores, and the porosity of the plurality of second pores ranges from 5% to 15%.

4. The reinforcing plate according to claim 3, characterized in that: The surface loose layer is not straight.

5. The reinforcing plate according to any one of claims 1 to 4, characterized in that: Along the direction perpendicular to the substrate, the ratio of the thickness of the ceramic laminate to the thickness of the reinforcing plate ranges from 10% to 60%; The ratio of the thickness of the substrate to the thickness of the reinforcing plate ranges from 40% to 90%.

6. The reinforcing plate according to claim 5, characterized in that: Along the direction perpendicular to the substrate, the ratio of the thickness of the transition layer to the thickness of the ceramic laminate ranges from 0.1% to 5%; and / or, The ratio of the thickness of the dense ceramic layer to the thickness of the ceramic laminate ranges from 90% to 95%.

7. The reinforcing plate according to any one of claims 3 to 6, characterized in that: Along the direction perpendicular to the substrate, the ratio of the thickness of the surface loose layer to the thickness of the ceramic laminate is in the range of 0.1% to 5%; and / or, The roughness of the surface loose layer ranges from 2 μm to 3 μm.

8. The reinforcing plate according to any one of claims 1 to 7, characterized in that: The hardness of the ceramic laminate is greater than or equal to 1000 HV.

9. The reinforcing plate according to any one of claims 1 to 7, characterized in that: The substrate is a light metal substrate, and the thickness of the light metal substrate ranges from 0.05 mm to 0.6 mm.

10. The reinforcing plate according to claim 9, characterized in that: Along the direction perpendicular to the substrate, the thickness of the dense ceramic layer ranges from 10 μm to 80 μm; and / or, The thickness of the transition layer ranges from 0.1 μm to 1 μm.

11. The reinforcing plate according to any one of claims 1 to 9, characterized in that: The ceramic material includes at least one of aluminum oxide ceramics, titanium oxide ceramics, zirconium oxide ceramics, silicon carbide ceramics, titanium carbide ceramics and yttrium oxide ceramics.

12. The reinforcing plate according to claim 11, characterized in that: The particle size range of the alumina ceramics includes 10nm to 30nm, and the density range includes 3.94g / cm 3 ~3.98g / cm 3 , hardness range includes 1549HV~1553HV, Young's modulus range includes 398GPa~402GPa; The particle size range of the silicon carbide ceramic is 10nm to 30nm, and the density range is 3.14g / cm 3 ~3.18g / cm 3 , hardness range includes 2345HV~2349HV, and Young's modulus range includes 428GPa~432GPa.

13. An electronic device, characterized in that: The invention comprises the reinforcing plate according to any one of claims 1 to 12.

14. A method for preparing a reinforcing plate, characterized in that: include: providing a substrate; A plurality of holes are formed on at least one side surface of the substrate; wherein the holes do not penetrate the substrate; Filling the holes with ceramic material to form a first structure; The first structure is sintered to form a reinforcing plate with a ceramic laminate; wherein the ceramic laminate is located on at least one side surface of the substrate, the material of the ceramic laminate is a ceramic material, the ceramic laminate at least includes a transition layer and a dense ceramic layer, the transition layer is located between the substrate and the dense ceramic layer, the dense ceramic layer has a plurality of discrete and spaced first pores, and the porosity of the plurality of first pores is less than or equal to 0.5%; the transition layer is not straight, the surface of the transition layer close to the dense ceramic layer is connected to the dense ceramic layer and the shape matches, and the surface of the transition layer close to the substrate is connected to the substrate and the shape matches.

15. The method for preparing a reinforcing plate according to claim 14, characterized in that: The pores have a pore size range of 200 nm to 300 nm; and / or, The depth of the holes ranges from 10 μm to 120 μm.

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