Self-repairing butyl hot melt adhesive for double-glass photovoltaic module and preparation method of self-repairing butyl hot melt adhesive

Abstract

The invention relates to a self-repairing butyl hot melt adhesive for a double-glass photovoltaic module and a preparation method of the self-repairing butyl hot melt adhesive. The butyl hot melt adhesive is prepared from the following raw materials in parts by weight: 1-40 parts of butyl rubber, 10-80 parts of polyisobutene, 5-30 parts of modified polyisobutene, 5-20 parts of tackifying resin, 1-10 parts of a water absorbent, 10-30 parts of inorganic filler, 8-30 parts of a reinforcing agent, 0.5-3 parts of an antioxidant, 0.5-3 parts of a light stabilizer and 0.5-4 parts of a physical crosslinking agent, the modified polyisobutene is obtained by reacting polyisobutene succinic anhydride with an amino-containing silane coupling agent; the physical cross-linking agent is selected from at least one of an amine compound, a pyridine compound and a pyridine polymer with two or more degrees of functionality. The self-repairing butyl rubber has good bonding strength with glass, and also has a good self-healing effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of sealants, and in particular relates to a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules and a preparation method thereof. Background Art

[0002] The regular molecular structure of butyl rubber gives it excellent air tightness and very low water vapor permeability. It is widely used in the airtight layer of tire inner tubes, the first seal of insulating glass, building waterproof membranes, special waterproof tapes, photovoltaic modules and other fields.

[0003] Butyl hot melt adhesive is a single-component, solvent-free, non-fogging, non-vulcanized thermoplastic material based on butyl rubber and polyisobutylene. It is used as the first water-blocking edge sealant in the field of photovoltaic modules, especially in perovskite and heterojunction photovoltaic modules that are sensitive to water vapor. The dense arrangement of side methyl groups in the molecular chain of butyl rubber limits the thermal motion of polymer molecules, reduces the flexibility of the chain, and produces trace crystals. These structural characteristics make butyl rubber have excellent weather resistance, heat resistance, alkali resistance, low water vapor permeability, good air tightness, and its air permeability is one order of magnitude lower than that of natural rubber. However, the bonding effect of butyl rubber and glass interface is still not ideal. The bonding force is easy to decrease after aging. There are problems such as lack of glue and delamination after aging under ultraviolet, damp heat, high and low temperature, and poor water vapor barrier rate. It cannot be guaranteed that the sealing tape has a long-lasting water vapor barrier effect during use.

[0004] In addition, improper construction operations or mistakes during the use of sealants may easily cause sealant damage, defects or bubbles, resulting in a decrease in the mechanical properties of butyl hot melt sealants. In severe cases, the sealing performance may fail, greatly reducing the service life of photovoltaic modules. In addition, butyl hot melt sealants themselves do not have the ability to repair damage at room temperature. As an edge sealing system, this greatly reduces the product qualification rate.

[0005] Patent CN112280498A uses silane coupling agent and polyisobutylene succinic anhydride to prepare silane-modified polyisobutylene succinic anhydride. Although silane-modified polyisobutylene can improve the adhesion between butyl hot melt adhesive and substrate, it does not focus on retaining carboxyl groups, and the resulting butyl adhesive does not have self-healing properties. Summary of the invention

[0006] Based on this, the present invention provides a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules. The self-repairing butyl adhesive has good bonding strength with the glass and also has good self-healing effect.

[0007] The present invention includes the following technical solutions.

[0008] The first aspect of the present invention is to provide a self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, which is prepared from raw materials comprising the following components in parts by weight:

[0009]

[0010] The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent;

[0011] The physical crosslinking agent is selected from at least one of amine compounds with difunctionality or more, pyridine compounds, and pyridine polymers.

[0012] In some of the embodiments, the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules is prepared from raw materials comprising the following components, in parts by weight:

[0013]

[0014]

[0015] In some of the embodiments, the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules is prepared from raw materials comprising the following components, in parts by weight:

[0016]

[0017] In some of the embodiments, the modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent in a molar ratio of 1:0.9-1.1.

[0018] In some of the embodiments, the modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent in a molar ratio of 1:1.

[0019] In some embodiments, the number average molecular weight of the polyisobutylene succinic anhydride is 1000-3000, preferably 1000-1500.

[0020] In some embodiments, the amino-containing silane coupling agent has the structural formula NHR(CH2): n Si(R1)(OR2)2, wherein R1 is selected from: C1~C3 alkyl, C1~C3 alkoxy; R2 is selected from: C1~C3 alkyl; R is selected from: H, C1~C3 alkyl, amino-substituted C1~C3 alkyl; n is selected from: 2, 3, 4, 5.

[0021] In some of the embodiments, the amino-containing silane coupling agent is γ-aminopropyltriethoxysilane and / or N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, more preferably N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane.

[0022] In some embodiments, the method for preparing the modified polyisobutylene comprises the following steps:

[0023] The polyisobutylene succinic anhydride and the amino-containing silane coupling agent are reacted in an organic solvent at 15° C.-30° C. and in an inert gas atmosphere for 1 h to 2 h, and the organic solvent is removed to obtain the modified polyisobutylene.

[0024] In some embodiments, the organic solvent is dichloromethane.

[0025] In some embodiments, the physical crosslinker is selected from at least one of poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine), bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and N,N'-dimethyl-1,6-diaminohexane.

[0026] In some embodiments, the physical crosslinker is poly(4-vinylpyridine).

[0027] In some embodiments, the weight average molecular weight of the poly(4-vinylpyridine) is 50,000-70,000.

[0028] In some of the embodiments, the molar ratio of vinylpyridine to styrene in the poly(4-vinylpyridine-co-styrene) is 1:0.9-1.1, and the weight average molecular weight is 300,000-500,000.

[0029] In some embodiments, the raw rubber Mooney viscosity ML of the butyl rubber is 1+8 It is 40 to 60.

[0030] In some of the embodiments, the polyisobutylene is composed of two or three of low molecular weight polyisobutylene, medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the low molecular weight polyisobutylene is 400 to 30,000, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 30,000 to 100,000; and the viscosity average molecular weight of the high molecular weight polyisobutylene is 100,000 to 2,000,000.

[0031] In some of the embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the medium molecular weight polyisobutylene is 60,000 to 95,000; and the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000 to 500,000.

[0032] In some of the embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene; the viscosity average molecular weight of the medium molecular weight polyisobutylene is 70,000-80,000; the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000-300,000.

[0033] In some of the embodiments, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene in a mass ratio of 1:1-2.5.

[0034] In some embodiments, the tackifying resin is selected from one or more combinations of C5 petroleum resin, C9 petroleum resin, terpene resin, styrene-grafted terpene resin, polyterpene resin and natural resin or rosin resin.

[0035] In some embodiments, the water absorbent is selected from one or more combinations of calcium oxide, molecular sieves, calcium sulfate, anhydrous calcium chloride, anhydrous magnesium sulfate, and activated alumina.

[0036] In some embodiments, the inorganic filler is selected from one or more combinations of mica powder, silica powder, kaolin, calcium carbonate, talc, kaolin, clay and diatomaceous earth.

[0037] In some embodiments, the reinforcing agent is selected from one or a combination of carbon black and fumed silica.

[0038] In some embodiments, the antioxidant is selected from pentaerythritol tetrakis[2-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,6-di-tert-butyl-4-methylphenol, tris[2.4-di-tert-butylphenyl]phosphite, 2-methyl-4,6-dinonylphenol, 2,6-di-tert-butyl-α-methoxy-p-cresol, 2,4,6-tri-tert-butylphenol and a combination of one or more of 2,2,4-trimethyl-1,2-dihydroquinoline polymers.

[0039] In some embodiments, the light stabilizer is selected from one or more combinations of hindered amine light stabilizers.

[0040] In some embodiments, the light stabilizer is selected from 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole and / or 2-[2-hydroxy-5-tert-octylphenyl)benzotriazole.

[0041] The second aspect of the present invention is to provide a method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, comprising the following steps:

[0042] At 110° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and blended under vacuum protection for 20 minutes to 130 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 60 minutes to 180 minutes to obtain the self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0043] In some embodiments, the method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules comprises the following steps:

[0044] At 140° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and mixed under vacuum protection for 20 minutes to 40 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 100 minutes to 150 minutes to obtain the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules.

[0045] The present invention has the following beneficial effects:

[0046] The present invention obtains a modified polyisobutylene having a siloxane group and a carboxyl group by grafting and modifying polyisobutylene succinic anhydride with an amino-containing silane coupling agent, and the modified polyisobutylene is prepared by combining the modified polyisobutylene with butyl rubber, polyisobutylene, a specific physical crosslinking agent, etc. through an appropriate formula to obtain a reactive butyl hot melt adhesive with self-repairing properties. In the butyl hot melt adhesive system, the siloxane group is used for the dealcoholization reaction of the butyl hot melt adhesive system after the adhesive is applied to form a first layer of chemical crosslinking network, and on the other hand, it can improve the adhesion between the butyl hot melt adhesive and the glass; the carboxyl group interacts with the pyridine group, the amine group, etc. through hydrogen bonds to form a second layer of physical crosslinking network, which enhances the mechanical properties of the material and also gives the butyl hot melt adhesive good self-repairing properties. With the coordinated cooperation of each component, the butyl hot melt adhesive of the present invention has good adhesion to the glass interface, high strength, good mechanical properties, low water vapor permeability, and excellent self-repairing properties, and can be used in the field of dual-wave photovoltaic modules. Moreover, the non-covalent interactions in the system will undergo reversible dissociation at higher temperatures and will not affect the processing and construction performance of the butyl hot melt adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 The product NMR of the modified polyisobutylene prepared in Example 1 of the present invention is 1 H-NMR spectrum. DETAILED DESCRIPTION

[0048] In order to facilitate the understanding of the present invention, the present invention will be described more fully below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0049] The experimental methods in the following examples without specifying specific conditions are usually carried out under conventional conditions or under conditions recommended by the manufacturers. The raw materials and various chemical reagents used in the examples are all commercially available products.

[0050] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0051] In addition, as used in the present invention, the term "or" is an inclusive "or" symbol and is equivalent to the term "and / or", unless the context clearly dictates otherwise. The term "based on" is not exclusive and allows for being based on other factors not described, unless the context clearly dictates otherwise. In addition, throughout the specification, the meanings of "a", "an", and "the" include plural referents. The meaning of "in..." includes "in..." and "on...".

[0052] The present invention is further described in detail below with reference to specific embodiments.

[0053] In the following embodiments, the normal temperature or room temperature refers to an indoor temperature of 20°C-30°C.

[0054] Example 1

[0055] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:1 were reacted in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene (its NMR 1 H-NMR Figure 1 shown).

[0056] The reaction formula is as follows:

[0057]

[0058] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 1, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and pyridine polymer were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0059] Table 1

[0060]

[0061]

[0062] Example 2

[0063] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0064] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 2, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and pyridine polymer were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0065] Table 2

[0066]

[0067] Example 3

[0068] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0069] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 3, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and difunctional amine were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0070] Table 3

[0071]

[0072]

[0073] Example 4

[0074] Polyisobutylene succinic anhydride (M n =1000) and N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane in a molar ratio of 1:1 in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0075] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 4, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and difunctional amine were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0076] Table 4

[0077]

[0078]

[0079] Comparative Example 1

[0080] The difference between this comparative example and Example 1 is that no pyridine-based polymer is added.

[0081] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:1 in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0082] At 150°C, add butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer to the kneader in sequence according to Table 5, and blend for 30 minutes under -0.1 MPa vacuum protection; then add inorganic filler, reinforcing agent and water absorbent in sequence, and mix thoroughly for 120 minutes under -0.1 MPa vacuum protection to obtain butyl hot melt adhesive for double-glass photovoltaic modules.

[0083] Table 5

[0084]

[0085]

[0086] Comparative Example 2

[0087] The difference between this comparative example and Example 1 is that polyisobutylene succinic anhydride is used to replace the modified polyisobutylene.

[0088] At 150°C, add butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer to the kneader in sequence according to Table 6, and blend for 45 minutes under -0.1 MPa vacuum protection; then add inorganic filler, reinforcing agent, water absorbent and pyridine polymer in sequence, and mix thoroughly for 120 minutes under -0.1 MPa vacuum protection to obtain butyl hot melt adhesive for double-glass photovoltaic modules.

[0089] Table 6

[0090]

[0091]

[0092] Comparative Example 3

[0093] The difference between this comparative example and Example 1 is that the molar ratio of polyisobutylene succinic anhydride to γ-aminopropyltriethoxysilane is different.

[0094] Polyisobutylene succinic anhydride (M n =1000) and γ-aminopropyltriethoxysilane in a molar ratio of 1:2 in dichloromethane (1 mol polyisobutylene succinic anhydride: 1 L dichloromethane) at room temperature and under a nitrogen atmosphere for 1.5 h. After the reaction, dichloromethane was removed by rotary evaporation to obtain modified polyisobutylene.

[0095] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 7, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and pyridine polymer were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0096] Table 7

[0097]

[0098]

[0099] Comparative Example 4

[0100] The difference between this comparative example and Example 1 is that the preparation method of the modified polyisobutylene is different.

[0101] Polyisobutylene succinic anhydride (M n =1000) was heated to 80° C., γ-aminopropyltriethoxysilane was added in a molar ratio of 1:1, and the mixture was reacted at 80° C. in a nitrogen atmosphere for 30 min to obtain modified polyisobutylene.

[0102] At 150°C, butyl rubber, polyisobutylene mixture, tackifying resin, antioxidant and light stabilizer were added to the kneader in sequence according to Table 8, and blended for 30 minutes under -0.1 MPa vacuum protection; then inorganic filler, reinforcing agent, water absorbent and pyridine polymer were added in sequence, and fully mixed for 120 minutes under -0.1 MPa vacuum protection to obtain a self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

[0103] Table 8

[0104]

[0105] The butyl hot melt adhesives prepared in Examples 1 to 4 and Comparative Examples 1 to 4 were subjected to the performance tests shown in Table 9. The performance test methods of the samples in Table 9 are as follows:

[0106] 1. Double glass shear strength: Test the shear strength according to the method specified in GB / T 7124-2008.

[0107] 2. Self-healing test: Reassemble the fractured parts of the samples that have completed the shear strength test, place them at room temperature for 7 days, and then conduct a double-glass shear strength test according to GB / T 7124-2008.

[0108] 3. 38℃ water vapor transmission rate: Test according to GB / T 26253-2010. Put the glue on the release paper, heat it to the appropriate temperature, and then press it into a sheet with a thickness of (1±0.1) mm, a length of not less than 120 mm, and a width of not less than 120 mm. Take a circular test piece with a diameter of not less than 100 mm for testing.

[0109] The results are shown in Table 9.

[0110] No physical crosslinking agent is added to the butyl hot melt adhesive of Comparative Example 1, so it has no self-healing property, which is manifested in that the shear strength of the fracture-joined sample is greatly reduced, and the water vapor permeability is higher than that of Example 1.

[0111] The butyl hot melt adhesive of Comparative Example 2 does not contain modified polyisobutylene, and there are no siloxane groups and carboxyl groups in the system. It is a non-reactive butyl hot melt adhesive, has low bonding shear strength with glass, and does not have self-healing properties. The material has a low cross-linking density, and its water vapor permeability is much higher than that of Example 1.

[0112] In Comparative Example 3, polyisobutylene succinic anhydride and γ-aminopropyltriethoxysilane are reacted in a molar ratio of 1:2 to prepare modified polyisobutylene. The siloxane groups grafted on the macromolecule react with excess silane coupling agent under the catalysis of water vapor in the air and are consumed, which reduces the bonding shear strength between the material and the glass, and increases the degree of branching, thereby reducing the density of the material and increasing the water vapor permeability.

[0113] In Comparative Example 4, polyisobutylene succinic anhydride and γ-aminopropyltriethoxysilane react at 80° C. Under the reaction conditions, the anhydride and the amine group can react to easily form imide, resulting in a decrease in or no carboxyl content in the system. Therefore, the self-healing performance of the resulting butyl hot melt adhesive is low.

[0114] In Examples 1 to 4, with the cooperation of modified polyisobutylene and a physical cross-linking agent, self-healing of the butyl hot melt adhesive at room temperature was achieved. After fracture splicing, most of the shear strength of the samples was restored. The siloxane contained in the butyl hot melt adhesive can cross-link itself to form a first layer of cross-linked network, and can also form good adhesion with the glass surface. The molecular chain forms a second layer of reversible physical cross-linked network through the electrostatic interaction between the terminal carboxyl group and the amine group of the cross-linking agent. The synergistic cooperation of the components not only gives the butyl hot melt adhesive good self-healing properties, but also significantly enhances its mechanical properties.

[0115] Table 9 Performance test results of butyl hot melt adhesive in the embodiment

[0116]

[0117] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A self-repairing butyl hot melt adhesive for double-glass photovoltaic modules, characterized in that: The composition is prepared from the following raw materials in parts by weight: The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent; The physical crosslinking agent is selected from at least one of amine compounds with difunctionality or more, pyridine compounds, and pyridine polymers.

2. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 1, characterized in that: The composition is prepared from the following raw materials in parts by weight:

3. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 1, characterized in that: The composition is prepared from the following raw materials in parts by weight:

4. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The modified polyisobutylene is obtained by reacting polyisobutylene succinic anhydride with an amino-containing silane coupling agent in a molar ratio of 1:0.9-1.

1.

5. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The number average molecular weight of the polyisobutylene succinic anhydride is 1000 to 3000, preferably 1000 to 1500; and / or, The structural formula of the amino-containing silane coupling agent is NHR(CH2) n Si(R1)(OR2)2, wherein R1 is selected from: C1-C3 alkyl, C1-C3 alkoxy; R2 is selected from: C1-C3 alkyl; R is selected from: H, C1-C3 alkyl, amino-substituted C1-C3 alkyl; n is selected from: 2, 3, 4, 5; Preferably, the amino-containing silane coupling agent is γ-aminopropyltriethoxysilane and / or N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane, more preferably N-(β-aminoethyl)-γ-aminopropylmethyldimethoxysilane.

6. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The preparation method of the modified polyisobutylene comprises the following steps: The polyisobutylene succinic anhydride and the amino-containing silane coupling agent are reacted in an organic solvent at 15° C. to 30° C. and in an inert gas atmosphere for 1 to 2 hours, and the organic solvent is removed to obtain the modified polyisobutylene; Preferably, the organic solvent is dichloromethane.

7. According to any one of claims 1 to 3, the self-healing butyl hot melt adhesive for double-glass photovoltaic modules, the physical crosslinker is selected from at least one of poly(4-vinylpyridine-co-styrene), poly(4-vinylpyridine), bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and N,N'-dimethyl-1,6-diaminohexane; preferably, the physical crosslinker is poly(4-vinylpyridine), and its weight average molecular weight is preferably 50,000 to 70,000.

8. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 3, characterized in that: The raw Mooney viscosity of the butyl rubber is ML 1+8 is 40 to 60; and / or, The polyisobutylene is composed of two or three of low molecular weight polyisobutylene, medium molecular weight polyisobutylene and high molecular weight polyisobutylene, the viscosity average molecular weight of the low molecular weight polyisobutylene is 400-30000, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 30000-100000, and the viscosity average molecular weight of the high molecular weight polyisobutylene is 100000-2000000; and / or, The tackifying resin is selected from one or more combinations of C5 petroleum resin, C9 petroleum resin, terpene resin, styrene-grafted terpene resin, polyterpene resin and natural resin or rosin resin; and / or, The water absorbing agent is selected from one or more combinations of calcium oxide, molecular sieves, calcium sulfate, anhydrous calcium chloride, anhydrous magnesium sulfate, and activated alumina; and / or, The inorganic filler is selected from one or more combinations of mica powder, silica powder, kaolin, calcium carbonate, talc, kaolin, clay and diatomaceous earth; and / or, The reinforcing agent is selected from one or a combination of carbon black and fumed silica; and / or, The antioxidant is selected from the group consisting of one or more combinations of pentaerythritol tetrakis[2-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2,6-di-tert-butyl-4-methylphenol, tris[2,4-di-tert-butylphenyl]phosphite, 2-methyl-4,6-dinonylphenol, 2,6-di-tert-butyl-α-methoxy-p-cresol, 2,4,6-tri-tert-butylphenol and 2,2,4-trimethyl-1,2-dihydroquinoline polymer; and / or, The light stabilizer is selected from one or more combinations of hindered amine light stabilizers.

9. The self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to claim 8, characterized in that: The polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene, the viscosity average molecular weight of the medium molecular weight polyisobutylene is 60,000 to 95,000, and the viscosity average molecular weight of the high molecular weight polyisobutylene is 200,000 to 500,000; and / or, The light stabilizer is selected from 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole and / or 2-[2-hydroxy-5-tert-octylphenyl)benzotriazole; Preferably, the polyisobutylene is composed of medium molecular weight polyisobutylene and high molecular weight polyisobutylene in a mass ratio of 1:1-2.

5.

10. A method for preparing the self-repairing butyl hot melt adhesive for double-glass photovoltaic modules according to any one of claims 1 to 9, characterized in that: The following steps are involved: At 110° C. to 160° C., the butyl rubber, polyisobutylene, modified polyisobutylene, tackifying resin and antioxidant are added to a kneader in sequence, and blended under vacuum protection for 20 minutes to 130 minutes; then the inorganic filler, reinforcing agent, water absorbent and physical cross-linking agent are added in sequence, and mixed under vacuum protection for 60 minutes to 180 minutes to obtain the self-healing butyl hot melt adhesive for double-glass photovoltaic modules.

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