IC separation device and method applied to Socket

Abstract

The invention relates to an IC separation device and method applied to Socket, and relates to the technical field of chip processing / detection devices. The chip testing device comprises a chip testing seat, a testing carrying disc seat and a driving mechanism used for driving the chip testing seat and the testing carrying disc seat to be opened and closed, a separating mechanism is further arranged between the driving mechanism and the chip testing seat, and the separating mechanism is used for driving the chip testing seat to shift in the driving direction of the driving mechanism. After the IC test is finished, the driving mechanism drives the chip test seat to open a small section relative to the test loading disc seat, and at the moment, a part of the IC is still located in the test hole of the test loading disc seat; and then the separating mechanism is used for driving the chip testing seat to move in the direction deviating from the driving direction of the driving mechanism, so that the IC collides with the inner wall of the testing hole, separation of the IC and the POGOPIN is promoted, the IC separation success rate is improved, and the detection efficiency is further improved.

Description

Technical Field

[0001] The present application relates to the field of chip processing / detection devices, and in particular to an IC separation device and method applied to a Socket. Background Art

[0002] A socket (chip test socket) is a device used to test ICs (chips). When the IC is inserted into the socket, the POGOPIN (spring pin) in the socket will contact the IC. During the test, the socket will electrically connect the pins of the IC and send the test signal to the IC. The socket will then read the output signals of the IC and transmit these signals to the test equipment for analysis. In this way, it can be determined whether the functions and performance of the IC meet the specifications.

[0003] In the related art, during the IC testing process, the testing environment is in a negative pressure state, so the IC is easy to stick to the POGOPIN and is not easy to fall off. A commonly used auxiliary method is to add a ejector pin structure inside the Socket. After the test is completed, the IC is gently pushed with the ejector pin to promote the IC to fall off / separate.

[0004] The above-mentioned related technologies have the following defects: in the actual production and processing process, since the POGOPIN is usually arranged along the circumference of the IC, for example, at the four corners of the IC, the ejector pin is set in the middle. After the ejector pin gently pushes the middle of the IC, there is still a small probability that the IC and the POGOPIN on one side will stick to each other. At this time, the IC can only be separated manually, but this requires manpower on the one hand, and on the other hand, human hands entering the operation area will also affect the dryness of the detection environment. Before the next detection, it is necessary to wait for the detection equipment to restore the test environment to the standard state, which will cause delays in detection efficiency, so it needs to be improved. Summary of the invention

[0005] In order to improve the success rate of IC separation, the present application provides an IC separation device and method applied to a Socket.

[0006] In the first aspect, the present application provides an IC separation device applied to a socket, which adopts the following technical solution: An IC separation device applied to a Socket comprises a chip test socket, a test carrier seat and a driving mechanism for driving the chip test socket and the test carrier seat to open and close. A separation mechanism is also provided between the driving mechanism and the chip test socket, and the separation mechanism is used to drive the chip test socket to shift in the driving direction of the driving mechanism. By adopting the above technical solution, the separation mechanism provided between the driving mechanism and the chip test socket can drive the chip test socket to shift in the driving direction of the driving mechanism, so as to promote the separation of IC and POGOPIN, improve the success rate of IC separation, and thus improve the detection efficiency. Preferably, the chip test socket is provided with a positioning sleeve, and the test carrier seat is provided with a positioning pin and a positioning drive member for driving the positioning pin in and out of the positioning sleeve. By adopting the above technical solution, the positioning sleeve on the chip test seat cooperates with the positioning pin on the test carrier seat, and the positioning pin is driven in and out of the positioning sleeve by the positioning drive member, so as to realize the precise positioning and stable connection between the chip test seat and the test carrier seat. Inserting the positioning pin into the positioning sleeve during the test process can make the IC more stable during the test process. When the IC needs to be separated at the end of the test, the positioning pin can be pulled out of the positioning sleeve to release the lock, thereby realizing the subsequent offset movement of the chip test seat. Preferably, the driving end of the driving mechanism is provided with a driving seat, and the separation mechanism includes a linear reciprocating driving member, the body of the separation mechanism is connected to the driving seat and the driving end is connected to the chip test seat. By adopting the above technical solution, a linear reciprocating driving member is used to connect to the chip test seat, so that the displacement of the chip test seat offset driving mechanism in the driving direction can be realized in the simplest and low-cost manner, effectively promoting the separation of the IC and the POGOPIN, and improving the separation success rate. Preferably, the driving end of the driving mechanism is provided with a driving seat, and the separation mechanism includes a pair of linear reciprocating mechanisms, the bodies of the two linear reciprocating mechanisms are connected to the driving seat and the driving ends of the two linear reciprocating mechanisms are provided with clamps for clamping the chip test seat. By adopting the above technical solution, a pair of linear reciprocating mechanisms are provided and clamps are provided at their driving ends, so that the chip test seat can be effectively clamped, so that the chip test seat can be accurately and stably shifted away from the driving direction of the driving mechanism under the drive of the separation mechanism, thereby improving the success rate of separation between the IC and the POGOPIN. The design of a pair of linear reciprocating mechanisms makes the displacement process more stable and controllable, further improving the reliability and efficiency of IC separation. In addition, the design of the two clamps facilitates the switching of the clamping and loosening states of the chip test seat, which is convenient for replacement or maintenance.

[0007] Preferably, the driving end of the driving mechanism is provided with a driving seat, and the separation mechanism includes a pair of cylinders, the bodies of the two cylinders are connected to the driving seat and the driving ends of the two cylinders are provided with a clamping plate for clamping the chip test seat, and a stretching elastic member for driving the clamping plate close to the driving seat is provided between the clamping plate and the driving seat. By adopting the above technical solution, a pair of cylinders are provided as a separation mechanism, and a clamping plate is provided at the driving end of the cylinder to clamp the chip test seat, and a stretching elastic member is provided between the clamping plate and the driving seat, so that the chip test seat can be shifted in the driving direction of the offset driving mechanism, thereby effectively promoting the separation of IC and POGOPIN, improving the separation success rate, and avoiding the inefficiency and environmental impact caused by manual intervention. The coordinated use of the cylinder and the stretching elastic member enables the chip test seat to have a certain degree of buffering capacity in the process of shifting in the offset direction. For example, if the IC is still not separated after colliding with the test hole, the chip test seat can be stretched by stretching the stretching elastic member to continue to shift, thereby ensuring that the chip test seat can be accurately separated after the test is completed, further improving the detection efficiency. Preferably, the clamp is detachably connected to the output end of the cylinder. By adopting the above technical solution, the clamp is detachably connected to the output end of the cylinder, which is convenient for rapid replacement when the output end of the cylinder is fatigued or damaged, improving the maintenance efficiency of the device, and thus ensuring the continuous and stable operation of the IC separation device. Preferably, the tensile elastic member is detachably connected to the drive seat and the clamp. By adopting the above technical solution, the tensile elastic member is detachably connected to the drive seat and the clamp, which is convenient for rapid replacement after spring fatigue, improving the maintenance efficiency and service life of the device. Preferably, the chip test seat is rotatably provided with a pulley, and the pulley is fitted with the drive seat. By adopting the above technical solution, the chip test seat is fitted with the drive seat through the pulley, so that the chip test seat moves smoothly along the drive seat under the drive of the separation mechanism, reducing the friction resistance during the movement process, improving the smoothness and stability of the chip test seat when it is offset and moving, and further improving the success rate of IC separation. Preferably, a limit device for controlling the minimum distance between the clamp and the drive seat is provided between the clamp and the drive seat. By adopting the above technical solution, the minimum distance between the clamping plate and the drive seat can be accurately controlled, thereby ensuring the stability and reliability of the chip test seat during the separation process, effectively avoiding separation failure or equipment damage caused by the clamping plate being too close to or too far away from the drive seat, and thus improving the success rate of IC separation. In addition, during the maintenance process, the two clamping plates can also be kept at the maximum distance through the limit device, so as to facilitate the maintenance of various components on the drive seat or the replacement of the chip test seat.

[0008] In a second aspect, the present application provides an IC separation method applied to a socket, which adopts the following technical solution: An IC separation method applied to Socket: After the IC test is completed, the driving mechanism drives the chip test seat to open a small distance relative to the test carrier seat. At this time, a part of the IC must still be in the test hole of the test carrier seat. Then, the separation mechanism is used to drive the chip test seat to move in a direction offset from the driving direction of the driving mechanism, so that the IC collides with the inner wall of the test hole; Finally, the driving mechanism is used to drive the chip test seat to completely open relative to the test carrier seat.

[0009] By adopting the above technical solution, the process after the IC test is completed is divided into two stages. The collision between the IC and the inner wall of the test hole can promote the separation of the IC and the POGOPIN, and the separation success rate is higher than the method of pushing the IC with a pin.

[0010] In summary, the present application includes at least one of the following beneficial technical effects: 1. By setting a separation mechanism to drive the chip test seat to shift in the driving direction of the offset driving mechanism, the IC collides with the inner wall of the test hole, effectively reducing the situation of incomplete separation of the IC and the single-sided POGOPIN, thereby improving the success rate of IC separation; 2. The setting of the separation mechanism avoids manual separation of IC, reduces labor costs, and avoids personnel entering the operation area to affect the dryness of the test environment, thereby improving detection efficiency; 3. By setting the separation mechanism as a pair of cylinders in conjunction with a stretching elastic member, effective clamping and precise displacement of the chip test seat are achieved, further improving the reliability and stability of IC separation. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the structure of Example 1 of the present application; Figure 2 for Figure 1 The enlarged view of point A in the figure is used to illustrate the connection relationship between the positioning pin and the positioning sleeve; Figure 3 This is a structural schematic diagram for illustrating the connection relationship between the driving seat and the clamping block in Example 1 of the present application; Figure 4 This is a structural schematic diagram for illustrating the connection relationship between the limit device and the clamping plate in Example 1 of the present application; Figure 5 This is a structural schematic diagram for illustrating the connection relationship between the cylinder and the clamping plate in Example 1 of the present application; Figure 6 This is a schematic diagram of the structure used to reflect the two states in Example 1 of the present application, that the IC and the POGOPIN are in a sticky state, and that the IC is successfully separated from the POGOPIN by the ejector pin and falls into the test hole; Figure 7This is a schematic diagram of the structure used to reflect the state in which a part of the IC moves upward after the IC test is completed and a part of the IC remains in the test hole in Example 1 of the present application. In this state, the IC can be lightly touched with the test hole by using the separation mechanism to shift the IC horizontally, thereby promoting the separation of the IC and the POGOPIN; Figure 8 This is a schematic diagram of the structure of Example 2 of the present application; Fig. 9 This is a structural diagram of Example 3 of the present application.

[0012] In the figure: 1. Chip test seat; 11. Positioning sleeve; 12. Clamping block; 13. Pulley; 130. Mounting hole; 2. Test disc holder; 21. Positioning pin; 22. Positioning drive member; 3. driving mechanism; 31. driving seat; 311. baffle; 4. Separation mechanism; 41. Cylinder; 42. Clamping plate; 420. Clamping groove; 421. Mounting groove; 43. Tensile elastic member; 431. Mounting hook; 432. Mounting ring; 44. Mounting plate; 440. Mounting ring groove; 5. Limiting device; 51. Stop screw; 510. Stop screw hole; 52. Stop nut; 53. Buffer pad; 6. Test hole; 7. Ejector pin. DETAILED DESCRIPTION

[0013] The inventor of the present application discovered that after testing the IC, the existing Socket has a POGOPIN that is usually arranged along the circumference of the IC, which results in the ejector pin being only arranged in the middle. Therefore, after the ejector pin gently pushes the middle of the IC, there is still a small probability that the IC will stick to the POGOPIN on one side. This requires manual separation of the IC, which not only consumes manpower, but also affects the dryness of the test environment, further reducing the detection efficiency. To this end, the present application mainly uses a separation mechanism to drive the chip test socket to shift in the driving direction of the offset driving mechanism, thereby achieving the effect of promoting the separation of the IC and the POGOPIN and improving the success rate of IC separation.

[0014] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present invention. The described embodiments are only possible technical implementations of the present invention, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present invention to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present invention.

[0015] Example 1 The present application embodiment discloses an IC separation device applied to a socket. Figure 1An IC separation device applied to a socket comprises a chip test seat 1, a test carrier seat 2 and a driving mechanism 3. The chip test seat 1 is located directly above the test carrier seat 2, and the driving end of the driving mechanism 3 is downwardly arranged and fixedly assembled with a driving seat 31 through a bracket, and the driving seat 31 is used to assemble the chip test seat 1 and drive the chip test seat 1 to approach / move away from the test carrier seat 2 to cover / open the box.

[0016] Reference Figure 2 , the side wall of the chip test seat 1 is equipped with a positioning sleeve 11 through a bracket and a bolt, and the axial direction of the positioning sleeve 11 is arranged vertically. A positioning pin 21 and a positioning drive 22 for driving the positioning pin 21 in and out of the positioning sleeve 11 are correspondingly arranged at the edge of the test carrier seat 2. The positioning drive 22 can be a linear reciprocating mechanism such as a hydraulic cylinder or an electric push rod. During the test process (that is, in the closed state), the positioning pin 21 is used to insert the positioning sleeve 11 to ensure the precise alignment of the POGOPIN, IC and the test hole during the test process. After the test is completed (and in the open state), the positioning pin 21 is pulled out of the positioning sleeve 11, so that the subsequent chip test seat 1 can drive the POGOPIN and the adhered IC to move horizontally as a whole, thereby realizing the collision between the IC and the side wall of the test hole to promote the separation of the IC.

[0017] Reference Figure 3 , a separation mechanism 4 is provided on the driving seat 31 to drive the chip test seat 1 to shift laterally. In this embodiment 1, the separation mechanism 4 includes a pair of cylinders 41. In this embodiment, the cylinder 41 can actively extend the driving shaft in the air intake state and can passively retract under the action of external force in the air discharge state. The driving end of each cylinder 41 is equipped with a clamping plate 42. A tensile elastic member 43 is also provided between the clamping plate 42 and the driving seat 31, which is used to pull the clamping plate 42 in the direction close to the driving seat 31, so that the two clamping plates 42 have a tendency to automatically approach each other. A clamping groove 420 is also prefabricated on the inner side of the clamping plate 42. The inner edge of the clamping groove 420 is trapezoidal. The top of the chip test seat 1 is also assembled with a clamping block 12 clamped by the clamping plate 42 by bolts. The edge shape of the clamping block is adapted to the clamping groove 420, so that it can provide a guiding effect during the clamping process. In addition, the driving seat 31 is further extended with two pairs of baffles 311 , and the two pairs of baffles 311 and the two clamping plates 42 respectively abut against the four sides of the clamping block 12 , thereby achieving stable clamping of the chip test seat 1 .

[0018] The two clamping plates 42 cooperate with the two cylinders 41 to achieve the following actions: Action 1: The clamping plates 42 are opened: by simultaneously taking in air into the two cylinders 41, the two clamping plates 42 can overcome the pulling force of the stretching elastic member 43 and extend outward. At this time, the minimum spacing between the two clamping plates 42 is greater than the maximum width of the clamping block 12. In this state, the chip test seat 1 and the clamping block 12 can be easily replaced and installed as a whole.

[0019] Action 2: The clamping plates 42 are closed: the two cylinders 41 release air simultaneously, and the two clamping plates 42 can be retracted by stretching the elastic member 43. This state can be used to stably clamp the clamping block 12 after the clamping block 12 is placed in the corresponding position.

[0020] Action 3: Control the clamping block 12 and the chip test seat 1 to move to the left as a whole: the left cylinder 41 takes in air, and the right cylinder 41 exhausts air. At this time, the left clamping plate 42 overcomes the pulling force of the left tensile elastic member 43 and extends outward, and the right clamping plate 42 retracts under the pulling force of the right tensile elastic member 43. In this state, the clamping block 12 and the chip test seat 1 can be moved to the left as a whole while maintaining a stable clamping of the clamping block 12, so that the left side of the IC in the sticky state collides with the side wall of the test hole.

[0021] Action 4: Control the clamping block 12 and the chip test seat 1 to move right as a whole: the left cylinder 41 exhausts air, and the right cylinder 41 intakes air. At this time, the right clamping plate 42 overcomes the pulling force of the right tensile elastic member 43 and extends outward, and the left clamping plate 42 retracts under the pulling force of the left tensile elastic member 43. In this state, the clamping block 12 and the chip test seat 1 can be moved right as a whole while maintaining a stable clamping of the clamping block 12, so that the right side of the IC in the sticky state collides with the side wall of the test hole.

[0022] Reference Figure 3 The end of the stretch elastic member 43 is integrally formed with a mounting hook 431, and the drive seat 31 and the clamping plate 42 are both provided with mounting rings 432 through support rods. The mounting rings 432 are used for hanging the mounting hooks 431 to achieve the installation of the stretch elastic member 43, so as to facilitate the replacement of the spring after aging and fatigue.

[0023] Reference Figure 4 In order to make the chip test seat 1 slide more smoothly relative to the driving seat 31, the top wall of the clamping block 12 is prefabricated with a mounting hole 130 and a pulley 13 is rotatably arranged in the mounting hole 130 through a rotating shaft and a bearing. The top of the pulley 13 fits with the bottom wall of the driving seat 31, so that its state is more stable and the friction is smaller during the sliding process.

[0024] Reference Figure 4A limiting device 5 is also provided between the clamping plate 42 and the driving seat 31, and the limiting device 5 includes a stop screw 51 and a stop nut 52. A stop screw hole 510 is prefabricated on the clamping plate 42, and the stop screw 51 is threadedly connected to the stop screw hole 510. The stop nut 52 is threadedly sleeved on the outside of the stop screw 51, and the end face of the stop nut 52 abuts against the side wall of the clamping plate 42, thereby improving the stability of the position state of the stop screw 51 relative to the clamping plate 42. A buffer pad 53 is glued and fixed to the end face of the nut end of the stopping screw 51, and the buffer pad 53 is against the side wall of the driving seat 31. The limiting device 5 can ensure that a certain distance is always maintained between the clamping plate 42 and the driving seat 31, and the minimum distance can be flexibly adjusted by adjusting the length of the stopping screw 51 extending out of the stopping screw hole 510. When maintaining the various components on the driving seat 31 or replacing chip test seats 1 of different specifications, the minimum distance can be used to keep the two clamping plates 42 in a certain degree of opening.

[0025] Reference Figure 5 The connection between the clamping plate 42 and the output end of the cylinder 41 is also detachable, specifically: the output end of the cylinder 41 is fixed with a mounting plate 44 by bolts, and the mounting plate 44 is provided with a mounting ring groove 440 along the circumferential direction. A mounting groove 421 matching the arc of the mounting ring groove 440 is reserved near the middle of the top of the clamping plate 42. During installation, the mounting groove 421 at the top of the clamping plate 42 is embedded in the mounting ring groove 440 to achieve the installation between the clamping plate 42 and the output end of the cylinder 41. After the installation is completed, the clamping plate 42 and the cylinder 41 can maintain lateral stability. In addition, with the support of multiple tensile elastic members 43, the lateral stability can be consolidated while enhancing the vertical connection stability.

[0026] Reference Figure 6 and Figure 7 , the embodiment of the present application also discloses an IC separation method applied to a Socket: After the IC test is completed, the driving mechanism 3 drives the chip test seat 1 upward, so that the chip test seat 1 is first opened a little relative to the test carrier seat 2. At this time, a part of the IC that needs to be in a sticky state is still in the test hole 6 of the test carrier seat 2.

[0027] Then, the separation mechanism 4 is used to perform action 3 or action 4 or to repeat action 3 and action 4, so that the IC adhered to the POGOPIN can collide with the inner wall of the test hole 6, thereby promoting the separation of the IC and the POGOPIN.

[0028] Finally, the driving mechanism 3 drives the chip test seat 1 to move completely upward so that the chip test seat 1 is opened relative to the test carrier seat 2 .

[0029] The implementation principle of this embodiment is: the stroke of the IC after the test is completed is divided into segments and the direction of each segment is designed separately. The traditional method of the ejector pin 7 does not require stroke segmentation, and the IC is directly pushed downward. However, this method is prone to cause one-side adhesion. This embodiment sets an IC lateral movement action in the separation stage, and uses the inner wall of the test hole 6 to move the stuck IC laterally relative to the POGOPIN, thereby solving the problem of one-side adhesion. In actual use, the action of the ejector pin 7 pushing the IC downward can be combined with the action of the IC lateral movement of the present application, which can further improve the success rate of IC separation. This method will further reduce the probability of manual operation and reduce the probability of affecting the dryness in the detection space, thereby improving the overall detection efficiency.

[0030] Example 2 Reference Figure 8 The difference between this embodiment and embodiment 1 is that the separation mechanism 4 adopts a pair of linear reciprocating mechanisms, and the linear reciprocating mechanisms can select components such as hydraulic cylinders and electric push rods. The bodies of the two linear reciprocating mechanisms are connected to the driving seat 31, and the driving end is also provided with a clamping plate 42 for clamping the chip test seat 1.

[0031] The implementation principle of this embodiment is: the linear reciprocating mechanism is directly connected to the clamping plate 42, and the clamping plate 42 is directly driven to clamp the chip test socket 1 and move horizontally through the extension and retraction of the separation mechanism 4, which can also promote the separation of the sticking IC. However, compared with the embodiment 1, this method lacks a certain degree of buffering effect. When executing action 3 or 4 in the embodiment 1, if the IC is stuck, the driving action of the separation mechanism 4 can still be executed to compensate in time by stretching the elastic member 43, while the embodiment 2 can only rigidly execute the driving action of the separation mechanism 4 when encountering a stuck situation, which may cause secondary damage caused by the IC stuck.

[0032] Example 3 Reference Fig. 9 The difference between this embodiment and embodiment 1 and embodiment 2 is that the separation mechanism 4 adopts a linear reciprocating drive member, and the linear reciprocating drive member can be a bidirectional hydraulic cylinder, etc., and does not have a clamping plate 42. The driving end of the separation mechanism 4 is directly fixed to the chip test seat 1 through a bolt matching bracket.

[0033] The implementation principle of this embodiment is: directly driving the chip test socket 1 to move horizontally through the extension and retraction of the separation mechanism 4, which can also promote the separation of the sticky IC, but it is more inconvenient for the maintenance and replacement of the chip test socket 1.

[0034] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An IC separation device applied to a socket, comprising a chip test socket (1), a test carrier seat (2), and a driving mechanism (3) for driving the chip test socket (1) and the test carrier seat (2) to open and close, characterized in that: A separation mechanism (4) is also provided between the driving mechanism (3) and the chip test seat (1), and the separation mechanism (4) is used to drive the chip test seat (1) to shift in a direction away from the driving direction of the driving mechanism (3).

2. The IC separation device for socket according to claim 1, characterized in that: The chip test seat (1) is provided with a positioning sleeve (11), and the test carrier seat (2) is provided with a positioning pin (21) and a positioning drive member (22) for driving the positioning pin (21) to enter and exit the positioning sleeve (11).

3. The IC separation device for socket according to claim 1, characterized in that: The driving end of the driving mechanism (3) is provided with a driving seat (31), the separation mechanism (4) comprises a linear reciprocating driving member, the body of the separation mechanism (4) is connected to the driving seat (31) and the driving end is connected to the chip test seat (1).

4. The IC separation device for socket according to claim 1, characterized in that: The driving end of the driving mechanism (3) is provided with a driving seat (31), and the separation mechanism (4) comprises a pair of linear reciprocating mechanisms, the bodies of the two linear reciprocating mechanisms are both connected to the driving seat (31), and the driving ends of the two linear reciprocating mechanisms are both provided with a clamping plate (42) for clamping the chip test seat (1).

5. The IC separation device for socket according to claim 1, characterized in that: The driving end of the driving mechanism (3) is provided with a driving seat (31), and the separation mechanism (4) comprises a pair of cylinders (41), the bodies of the two cylinders (41) are connected to the driving seat (31), and the driving ends of the two cylinders (41) are provided with a clamping plate (42) for clamping the chip test seat (1), and a tensile elastic member (43) for driving the clamping plate (42) to approach the driving seat (31) is provided between the clamping plate (42) and the driving seat (31).

6. The IC separation device for socket according to claim 5, characterized in that: The clamping plate (42) is detachably connected to the output end of the cylinder (41).

7. The IC separation device for socket according to claim 5, characterized in that: The stretch elastic member (43) is detachably connected to the driving seat (31) and the clamping plate (42).

8. An IC separation device for socket according to claim 3, 4 or 5, characterized in that: The chip test seat (1) is rotatably provided with a pulley (13), and the pulley (13) is in close contact with the driving seat (31).

9. The IC separation device for socket according to claim 4 or 5, characterized in that: A limiting device (5) for controlling the minimum distance between the clamping plate (42) and the driving seat (31) is provided between the clamping plate (42) and the driving seat (31).

10. An IC separation method applied to a socket, characterized in that: After the IC test is completed, the driving mechanism (3) drives the chip test seat (1) to open a small distance relative to the test carrier seat (2), and at this time, a part of the IC is still in the test hole of the test carrier seat (2); Then, the separation mechanism (4) is used to drive the chip test seat (1) to move in a direction offset from the driving direction of the driving mechanism (3), so that the IC collides with the inner wall of the test hole; Finally, the chip test seat (1) is driven by the driving mechanism (3) to be completely opened relative to the test carrier seat (2).

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