Test circuit and device for integrated circuit chip

Abstract

The invention provides a test circuit and device for an integrated circuit chip, and the device comprises a controller which outputs a level signal with variable amplitude and a test instruction, a DC / DC step-down circuit which is connected with the controller, outputs a voltage signal in a preset range based on a stable reference voltage and the level signal with variable amplitude, and is connected to the positive electrode of a power supply of the integrated circuit chip to be tested. The constant voltage reference circuit is connected with a power supply cathode of the integrated circuit chip to be tested, the power supply cathode of the integrated circuit chip to be tested is raised to a reference voltage, and the bidirectional level conversion circuit realizes communication between the controller and the integrated circuit chip to be tested; the test circuit outputs variable voltage through the controller and the DC / DC step-down circuit, the constant voltage reference circuit raises the cathode voltage of the integrated circuit chip, so that the input voltage of the integrated circuit chip to be tested is within the range of working voltage, and signal communication is realized through the bidirectional level conversion circuit, so that the performance test of the integrated circuit chip is realized. The size is small and use is flexible and convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a testing circuit and device for an integrated circuit chip. Background Art

[0002] Chip test equipment is used to test the electrical properties and parameters of independent chips. It usually consists of a test head and a test socket. The test head is used to connect to the test contacts of the chip, while the test socket is used to stabilize the relative position of the test head and the chip. Chip test equipment can test the chip's current, voltage, frequency and other electrical properties and parameters through high-precision test instruments to verify the quality and performance of the chip.

[0003] Traditional test equipment has the disadvantages of being large, inflexible, expensive, and must be used in conjunction with a chip sorter. It is extremely inconvenient to use traditional test equipment in the experimental sample stage or the chip verification stage with a small number of chips. Summary of the invention

[0004] The present invention provides a test circuit and device for an integrated circuit chip, aiming to realize a small-sized and flexible integrated circuit chip test device.

[0005] In one aspect, the present invention provides a test circuit for an integrated circuit chip, comprising:

[0006] A controller, used for outputting a level signal with a changing amplitude and an instruction for testing the integrated circuit chip;

[0007] A DC / DC step-down circuit is connected to the controller, receives the level signal with amplitude variation, outputs a voltage signal within a preset range based on a stable reference voltage and the level signal with amplitude variation, and is connected to the positive power supply of the integrated circuit chip to be tested;

[0008] A constant voltage reference circuit, connected to the negative electrode of the power supply of the integrated circuit chip to be tested, and used to output a constant reference voltage, and raise the negative electrode of the power supply of the integrated circuit chip to be tested to the reference voltage, so that the input voltage of the integrated circuit chip to be tested is within the range of the working voltage;

[0009] The bidirectional level conversion circuit is used to exchange the communication port voltage of the controller with the communication port voltage of the integrated circuit chip to be tested, so as to realize the communication between the controller and the integrated circuit chip to be tested.

[0010] In one implementation, the controller includes:

[0011] A main controller, used for outputting high and low levels and instructions for testing the integrated circuit chip; and

[0012] The microcontroller is connected to the main controller, receives the high and low levels output by the main controller, adjusts the amplitudes of the high and low levels through a digital-to-analog conversion module, and then outputs a level signal with a changed amplitude.

[0013] In one of the embodiments, it also includes a voltage sampling circuit and a current sampling circuit. The voltage sampling circuit is respectively connected to the DC / DC buck circuit, the integrated circuit chip to be tested and the controller, and is used to collect the output voltage of the DC / DC buck circuit, and connect the sampled voltage to the controller for monitoring. The current sampling circuit is respectively connected to the DC / DC buck circuit, the integrated circuit chip to be tested and the controller, and is used to collect the output current of the DC / DC buck circuit, and connect the sampled current to the controller for monitoring.

[0014] In one implementation, it further includes a human-computer interaction module, which includes a button, an LED indicator light and a display screen for displaying the test result and test status of the integrated circuit chip to be tested.

[0015] In one implementation, the DC / DC buck circuit includes a feedback regulation loop circuit, a control circuit, a power switch circuit, an inductor element and a capacitor element. The control circuit includes a synchronous buck control chip. The feedback regulation loop circuit is connected to a voltage feedback terminal of the synchronous buck control chip and a digital-to-analog conversion terminal of the microcontroller. The voltage feedback terminal outputs a stable reference voltage. The output terminal of the synchronous buck control chip is connected to the power switch circuit, the inductor element and the capacitor element in sequence. The DC / DC buck circuit steps down the level signal with amplitude variation to a preset range based on the stable reference voltage and outputs it, and is connected to the positive power supply of the integrated circuit chip to be tested.

[0016] In one implementation, the feedback regulation loop circuit includes a resistor R0, a resistor R1, a resistor R2 and a capacitor C, one end of the resistor RO is connected to the digital-to-analog conversion terminal DAC of the microcontroller, and the other end is respectively connected to one end of the resistor R1, the resistor R2, the capacitor C, and the voltage feedback terminal V_FB of the synchronous buck control chip, the other ends of the resistor R1 and the capacitor C are connected to the voltage sampling circuit, the other end of the resistor R2 is grounded, the output voltage Vout of the DC / DC buck circuit is Vfb+Vfb*(R1 / R2)-(Vdac-Vfb)*R1 / R0, and the output voltage of the DC / DC buck circuit can be adjusted by adjusting the resistance value of the resistor R0, the resistor R1 or the resistor R2.

[0017] In one implementation, the voltage feedback terminal V_FB of the synchronous buck control chip outputs a stable reference voltage of 0.6V, the digital-to-analog conversion terminal of the microcontroller outputs a level signal Vdac with an amplitude variation range of [0 to 3.3V], and the DC / DC buck circuit converts the level signal Vdac with an amplitude variation range of [0 to 3.3V] into an output voltage Vout of [0.99V to 1.38V].

[0018] In one embodiment, the constant voltage reference circuit includes an operational amplifier U36, a voltage reference chip D46, a MOS tube Q20, a resistor R211, a resistor R212, a resistor R213, a capacitor C138, a capacitor C139 and a capacitor C140, one end of the resistor R211 is connected to a 5V DC voltage, and the other end is respectively connected to one end of the resistor R213, the cathode and the control end of the voltage reference chip D46, the anode of the voltage reference chip D46 is grounded, and the other end of the resistor R213 is respectively connected to one end of the resistor R212, one end of the capacitor C140 and the operational amplifier U36, and the voltage reference chip D46 is grounded. The inverting input terminal of the operational amplifier U36 is connected to the inverting input terminal of the operational amplifier U36, the other end of the resistor R212 is grounded, the other end of the capacitor C140 is connected to the output terminal of the operational amplifier U36, the non-inverting input terminal of the operational amplifier U36 is connected to the ground terminal of the integrated circuit chip to be tested, the output terminal of the operational amplifier U36 is connected to the gate of the MOS tube Q20, the drain of the MOS tube Q20 is connected to the ground terminal of the integrated circuit chip to be tested and grounded through the capacitor C138, the source of the MOS tube Q20 is grounded, and the constant voltage reference circuit outputs a constant voltage with an amplitude of 0.625V.

[0019] In one implementation, the bidirectional level conversion circuit includes a bidirectional level conversion chip, a Schottky diode, a first input resistor, a second input resistor, a first filter capacitor and a second filter capacitor. The communication port of the main controller is connected to the first input and output port of the bidirectional level conversion chip through two series-connected Schottky diodes and the first input resistor. The cathode of the series-connected Schottky diode is connected to the communication port of the main controller. The second input and output port of the bidirectional level conversion chip is connected to the communication port of the integrated circuit chip to be tested through the second input resistor. The power supply voltage of the first input and output port of the bidirectional level conversion chip is connected to 3.3V and grounded through the first filter capacitor. The power supply voltage of the second input and output port of the bidirectional level conversion chip is connected to 1.8V and grounded through the second filter capacitor.

[0020] On the other hand, the present invention proposes a testing device for an integrated circuit chip, comprising a circuit board, on which is provided a test circuit for the integrated circuit chip described in any one of the above items and a chip placement slot, wherein the chip placement slot is provided with electrical contacts for placing the integrated circuit chip to be tested and realizing electrical connection between the integrated circuit chip to be tested and the test circuit.

[0021] The invention discloses a test circuit and device for an integrated circuit chip, comprising a controller outputting a level signal with a variable amplitude and a test instruction, a DC / DC step-down circuit connected to the controller, outputting a voltage signal in a preset range based on a stable reference voltage and the level signal with a variable amplitude, and connected to the positive power supply electrode of the integrated circuit chip to be tested, a constant voltage reference circuit connected to the negative power supply electrode of the integrated circuit chip to be tested, raising the negative power supply electrode of the integrated circuit chip to be tested to a reference voltage, and a bidirectional level conversion circuit realizing communication between the controller and the integrated circuit chip to be tested; the test circuit outputs a variable voltage through the controller and the DC / DC step-down circuit, and the constant voltage reference circuit raises the negative voltage of the integrated circuit chip, so that the input voltage of the integrated circuit chip to be tested is within the range of the working voltage, and realizes signal communication through the bidirectional level conversion circuit, thereby realizing the performance test of the integrated circuit chip, and the test circuit has a small size and is flexible and convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. The drawings described below are only drawings corresponding to some embodiments of the present invention. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without creative work.

[0023] Figure 1 A functional module diagram of a test circuit for an integrated circuit chip in one embodiment of the present invention;

[0024] Figure 2 A functional module diagram of a test circuit for an integrated circuit chip in another embodiment of the present invention;

[0025] Figure 3 A circuit diagram of a feedback regulation loop circuit and a control circuit of a DC / DC buck circuit in one embodiment of the present invention;

[0026] Figure 4 A circuit diagram of a power switch circuit, an inductor element, and a capacitor element of a DC / DC buck circuit in one embodiment of the present invention;

[0027] Figure 5 A circuit diagram of a microcontroller in one embodiment of the present invention;

[0028] Figure 6 A circuit diagram of a constant voltage reference circuit in one embodiment of the present invention;

[0029] Figure 7 A circuit diagram of a bidirectional level conversion circuit in one embodiment of the present invention;

[0030] Figure 8 FIG. 1 is a schematic diagram of a circuit board of a testing device for an integrated circuit chip in one embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0032] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0033] See also Figure 1 , a test circuit for an integrated circuit chip of the present invention, in one embodiment, comprises:

[0034] The controller 10 is used to output a level signal with a changing amplitude and an instruction for testing the integrated circuit chip 100 .

[0035] The controller 10 outputs a variable voltage of 0 to 3.3 V and instructions for testing the integrated circuit chip, including starting a test, commanding a test, and ending a test.

[0036] For details, see Figure 2 In one embodiment, the controller 10 includes:

[0037] A main controller 11, used for outputting high and low levels and instructions for testing the integrated circuit chip; and

[0038] The microcontroller 12 is connected to the main controller, receives the high and low levels output by the main controller, adjusts the amplitudes of the high and low levels through a digital-to-analog conversion module, and then outputs a level signal with a changed amplitude.

[0039] In practical applications, if the controller does not have a digital-to-analog conversion module and cannot output a changing level signal, such as controllers with models S9KEAZ128 and RK3399, but not limited to these models, a microcontroller containing a digital-to-analog conversion module can be added, and the digital-to-analog conversion module of the microcontroller can be used to adjust the amplitude of the high and low levels output by the main control and then output a level signal with changing amplitude.

[0040] The DC / DC step-down circuit 20 is connected to the controller, receives the level signal with amplitude variation, outputs a voltage signal within a preset range based on a stable reference voltage and the level signal with amplitude variation, and is connected to the positive power supply of the integrated circuit chip to be tested.

[0041] The constant voltage reference circuit 30 is connected to the negative power supply electrode of the integrated circuit chip to be tested, and is used to output a constant reference voltage, and raise the negative power supply electrode of the integrated circuit chip to be tested to the reference voltage, so that the input voltage of the integrated circuit chip to be tested is within the range of the working voltage.

[0042] During the test of the integrated circuit chip to be tested, its operating voltage needs to be between 0.4V and 0.7V, and the operating current needs to exceed 20A, which belongs to the low voltage and high current working mode. In order to meet the power supply requirements of the integrated circuit chip to be tested, the level signal with amplitude variation is stepped down by the DC / DC step-down circuit 20. At the same time, in order to meet the high current working requirements of the integrated circuit chip, the voltage cannot be reduced too low. Therefore, the negative pole of the power supply of the integrated circuit chip to be tested is raised to the reference voltage by the constant voltage reference circuit 30, so that the input voltage of the integrated circuit chip to be tested can fall within the range of the working voltage.

[0043] The bidirectional level conversion circuit 40 is used to exchange the communication port voltage of the controller with the communication port voltage of the integrated circuit chip to be tested, so as to realize the communication between the controller and the integrated circuit chip to be tested.

[0044] The communication port voltage of the controller is [0~3.3V], and the communication port voltage of the integrated circuit chip to be tested is [0~1.8V]+reference voltage. Since the voltages of their communication ports are different, signal communication cannot be performed. The port voltages of the controller 10 and the integrated chip to be tested 100 are converted to each other through the bidirectional level conversion circuit 40, thereby realizing signal communication, including the integrated circuit chip to be tested receiving the test instructions of the controller and feeding back the test result information.

[0045] The test circuit of the integrated circuit chip of this embodiment realizes the output of variable voltage by adding a microcontroller, which can meet the situation that the main controller cannot output variable voltage without a digital-to-analog conversion module. It has strong adaptability, and the variable voltage output by the microcontroller is stepped down by the DC / DC step-down circuit. The constant voltage reference circuit raises the negative voltage of the integrated circuit chip, so that the input voltage of the integrated circuit chip to be tested falls within the working voltage range while meeting the current amplitude requirements, and realizes signal communication through a bidirectional level conversion circuit, thereby realizing the performance test of the integrated circuit chip. The test circuit of the integrated circuit chip realizes the chip test by building a circuit function module, which is small in size, flexible and convenient to use, effectively simplifies the test work of the integrated circuit chip, and saves the test cost.

[0046] In one embodiment, the test circuit of the integrated circuit chip also includes a voltage sampling circuit 50, which is respectively connected to the DC / DC buck circuit 20, the integrated circuit chip to be tested 100 and the controller 10, and is used to collect the output voltage of the DC / DC buck circuit and connect the sampled voltage to the controller for monitoring.

[0047] Specifically, the voltage sampling circuit is composed of a rail-to-rail precision operational amplifier AD8551 M5 and its peripheral auxiliary circuits. After amplifying the current working voltage of the integrated circuit chip under test, it is provided to the ADC peripheral of the main controller 11 to more accurately collect the working voltage of the integrated circuit chip under test.

[0048] In one embodiment, the test circuit of the integrated circuit chip also includes a current sampling circuit 60, which is respectively connected to the DC / DC buck circuit 20, the integrated circuit chip to be tested 100 and the controller 10, and is used to collect the output current of the DC / DC buck circuit and connect the sampled current to the controller for monitoring.

[0049] Specifically, the current sampling circuit is composed of a bidirectional high-precision current sensing amplifier chip I NA213AIDCKR and its peripheral auxiliary circuits, which are responsible for collecting and amplifying the current working current of the integrated circuit chip under test, and then providing it to the ADC peripheral of the main controller 11 to more accurately collect the corresponding current value.

[0050] The performance of the IC chip under test is tested by collecting the working voltage and working current of the IC chip under test. The working voltage includes the power supply voltage, communication voltage, etc., and the working current includes the power consumption current, clock and communication auxiliary power consumption current, etc.

[0051] In one embodiment, the test circuit of the integrated circuit chip further includes a human-computer interaction module 70, which includes a button, an LED indicator light, and a display screen, and is used to display the test result and test status of the integrated circuit chip to be tested. The human-computer interaction module 70 provides interactive buttons to facilitate the operation of the test staff, and intuitively displays the test process and test results, making it easy to view and understand the test process.

[0052] See also Figure 3 and Figure 4 The DC / DC buck circuit 20 includes a feedback regulation loop circuit 21, a control circuit, a power switch circuit, an inductor element and a capacitor element. The control circuit includes a synchronous buck control chip U33. The feedback regulation loop circuit 21 is connected to the voltage feedback terminal V_FB of the synchronous buck control chip U33 and the digital-to-analog conversion terminal DAC_CH of the microcontroller 12. The voltage feedback terminal V_FB outputs a stable reference voltage Vfb. The output terminal of the synchronous buck control chip U33 is connected to the power switch circuit, the inductor element L and the capacitor element C in sequence. The DC / DC buck circuit 20 steps down the level signal with amplitude variation to an output voltage VDD within a preset range based on the stable reference voltage Vfb, and connects it to the positive power supply of the integrated circuit chip 100 to be tested.

[0053] Furthermore, the synchronous buck control chip U33 is a dual-channel synchronous buck DC / DC controller, the specific model is LTC3869, but not limited to this model. The dual-channel synchronous buck DC / DC controller can realize the voltage reduction of two voltage signals, output two variable voltages to the integrated circuit chip to be tested, support simultaneous testing of two integrated circuit chips, and improve test efficiency.

[0054] Correspondingly, see Figure 5 When the synchronous buck control chip U33 is a dual-channel synchronous buck DC / DC controller, the number of microcontrollers corresponds to 2. The input ends of the two microcontrollers U32 and U34 are respectively connected to the main controller 11, and the output ends output two variable voltage signals through the digital-to-analog conversion terminals DAC_CH1 and DAC_CH2.

[0055] Specifically, the feedback regulation loop circuit 21 includes a resistor R0, a resistor R1, a resistor R2 and a capacitor C, one end of the resistor RO is connected to the digital-to-analog conversion terminal DAC of the microcontroller, and the other end is respectively connected to the resistor R1, the resistor R2, one end of the capacitor C, and the voltage feedback terminal V_FB of the synchronous buck control chip, the other ends of the resistor R1 and the capacitor C are connected to the voltage sampling circuit, the other end of the resistor R2 is grounded, the output voltage Vout of the DC / DC buck circuit is Vfb+Vfb*(R1 / R2)-(Vdac-Vfb)*R1 / R0, and the output voltage of the DC / DC buck circuit can be adjusted by adjusting the resistance value of the resistor R0, the resistor R1 or the resistor R2.

[0056] Further, the feedback regulation loop circuit 21 includes two paths, the resistor RO refers to the resistor R144 or the resistor R145, the resistor R1 refers to the resistor R139 or the resistor R140, and the resistor R2 refers to the resistor R149 or the resistor R150. The voltage feedback terminal V_FB of the synchronous buck control chip U33 outputs a stable reference voltage of 0.6V, and the digital-to-analog conversion terminals DAC_CH1 and DAC_CH2 of the microcontrollers U6 and U7 output level signals with an amplitude range of [0 to 3.3V]. By setting the resistance values ​​of the resistors RO, R1 and R2, the DC / DC buck circuit converts the two level signals Vdac with a range of [0 to 3.3V] into two output voltages Vout with a range of [0.99V to 1.38V].

[0057] See also Figure 6 In one embodiment, the constant voltage reference circuit 30 includes an operational amplifier U36, a voltage reference chip D46, a MOS tube Q20, a resistor R211, a resistor R212, a resistor R213, a capacitor C138, a capacitor C139 and a capacitor C140, one end of the resistor R211 is connected to a 5V DC voltage, and the other end is respectively connected to one end of the resistor R213, the cathode and the control end of the voltage reference chip D46, the anode of the voltage reference chip D46 is grounded, and the other end of the resistor R213 is respectively connected to one end of the resistor R212, one end of the capacitor C140 and the operational amplifier U36, the voltage reference chip D46 is grounded, and the other end of the resistor R213 is respectively connected to one end of the resistor R212, one end of the capacitor C140 and the operational amplifier U36, the voltage reference chip D46 is grounded, and the voltage reference chip D46 is grounded. The inverting input terminal of the operational amplifier U36 is connected to the inverting input terminal of the operational amplifier U36, the other end of the resistor R212 is grounded, the other end of the capacitor C140 is connected to the output terminal of the operational amplifier U36, the non-inverting input terminal of the operational amplifier U36 is connected to the ground terminal of the integrated circuit chip to be tested, the output terminal of the operational amplifier U36 is connected to the gate of the MOS tube Q20, the drain of the MOS tube Q20 is connected to the ground terminal of the integrated circuit chip to be tested and grounded through the capacitor C138, the source of the MOS tube Q20 is grounded, and the constant voltage reference circuit 30 outputs a constant voltage with an amplitude of 0.625V.

[0058] The amplitude of the reference voltage is not limited to 0.625V, and is specifically determined according to the requirements of the working voltage and working current of the integrated circuit chip to be tested.

[0059] The positive pole of the power supply of the integrated circuit chip 100 to be tested is connected to the supply voltage of [0.99V~1.38V], and the negative pole is raised to 0.625V by the constant voltage reference circuit 30. Then, the input voltage of the integrated circuit chip to be tested is actually [0.365V~0.755V], which can meet the voltage requirement of the integrated circuit chip.

[0060] See also Figure 7 The bidirectional level conversion circuit 40 includes a bidirectional level conversion chip, a Schottky diode, a first input resistor, a second input resistor, a first filter capacitor and a second filter capacitor. The communication port of the main controller is connected to the first input and output port of the bidirectional level conversion chip through two series-connected Schottky diodes and the first input resistor. The cathode of the series-connected Schottky diode is connected to the communication port of the main controller. The second input and output port of the bidirectional level conversion chip is connected to the communication port of the integrated circuit chip to be tested through the second input resistor. The power supply voltage of the first input and output port of the bidirectional level conversion chip is connected to 3.3V and grounded through the first filter capacitor. The power supply voltage of the second input and output port of the bidirectional level conversion chip is connected to 1.8V and grounded through the second filter capacitor.

[0061] Furthermore, the bidirectional level conversion circuit includes two paths to realize signal communication between two integrated circuit chips and the main controller. Specifically, the bidirectional level conversion chip includes U6 and U7, Schottky diodes D1-D14, the first input resistor includes a resistor connected to the communication port of the main controller, the second input resistor includes a resistor connected to the integrated circuit chip to be tested, the first filter capacitor includes C7 and C11, and the second filter capacitor includes C8 and C12.

[0062] Among them, the forward conduction voltage of the Schottky diode is 0.3V, the voltage drop of two Schottky diodes in series is 0.6V, the voltage of the integrated circuit chip communication port is [0~1.8V]+reference voltage, and the level after conversion by the bidirectional level conversion circuit 40 is [0~3.3V]+reference voltage. After the series Schottky diodes generate a voltage drop of 0.6V, the voltage is about [0~3.3V], which meets the voltage requirement of the main controller communication port and realizes signal communication between the integrated circuit chip and the main controller.

[0063] The test circuit of the integrated circuit chip of the embodiment of the present application is constructed by a circuit module. The DC / DC step-down circuit adopts a dual-channel synchronous step-down DC / DC controller, and the two variable voltages output by the microcontroller are stepped down and provided to the integrated circuit chip to be tested. The signal communication between the main controller and the integrated circuit chip is realized through two bidirectional level conversion circuits, and the test of two integrated circuit chips can be realized at the same time, thereby improving the test efficiency. During the test process, the main controller sends a test instruction to the integrated chip to be tested, and the integrated circuit chip to be tested starts to work, and the voltage signal and current signal in the work are collected through the voltage sampling circuit and the current sampling circuit. During the test process, the main controller can adjust the operating frequency of the integrated circuit chip, test the operating voltage and operating current of the integrated circuit chip at different operating frequencies, and perform a complete test on the integrated circuit chip. The test circuit of the integrated circuit chip is small in size, low in power consumption, flexible and convenient to use, and can realize the complete test of the integrated circuit chip, thus simplifying the test work.

[0064] See also Figure 8 The embodiments of the present application also provide a testing device for an integrated circuit chip. In one embodiment, the device includes a circuit board, on which a testing circuit for the integrated circuit chip described in any of the above embodiments and a chip placement slot 80 are provided. The chip placement slot 80 is provided with electrical contacts for placing the integrated circuit chip 100 to be tested and realizing electrical connection between the integrated circuit chip to be tested and the test circuit.

[0065] In one embodiment, two chip placement slots 80 are provided, but the number is not limited to two and is determined according to actual application requirements.

[0066] Specifically, the chip placement slot 80 adopts a flip-top card slot fixture, which can manually place and take out the integrated circuit chip under test. The integrated circuit chip testing device can quickly complete the test of multiple parameters of the chip under test with one-button operation, and directly output the test results visually, and has a small size, low cost, high portability, and good practicality.

[0067] To sum up, although the present invention has been disclosed as above in the form of preferred embodiments, the protection scope of the present invention is not limited thereto, and any technician familiar with the technical field can make equivalent substitutions or changes according to the concept of the technical solution of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0068] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A test circuit for an integrated circuit chip, characterized in that: include: A controller, used for outputting a level signal with a changing amplitude and an instruction for testing the integrated circuit chip; A DC / DC step-down circuit is connected to the controller, receives the level signal with amplitude variation, outputs a voltage signal within a preset range based on a stable reference voltage and the level signal with amplitude variation, and is connected to the positive power supply of the integrated circuit chip to be tested; A constant voltage reference circuit, connected to the negative electrode of the power supply of the integrated circuit chip to be tested, and used to output a constant reference voltage, and raise the negative electrode of the power supply of the integrated circuit chip to be tested to the reference voltage, so that the input voltage of the integrated circuit chip to be tested is within the range of the working voltage; The bidirectional level conversion circuit is used to exchange the communication port voltage of the controller with the communication port voltage of the integrated circuit chip to be tested, so as to realize the communication between the controller and the integrated circuit chip to be tested.

2. The integrated circuit chip test circuit according to claim 1, characterized in that: The controller comprises: A main controller, used for outputting high and low levels and instructions for testing the integrated circuit chip; and The microcontroller is connected to the main controller, receives the high and low levels output by the main controller, adjusts the amplitudes of the high and low levels through a digital-to-analog conversion module, and then outputs a level signal with a changed amplitude.

3. The integrated circuit chip test circuit according to claim 1, characterized in that: It also includes a voltage sampling circuit and a current sampling circuit. The voltage sampling circuit is respectively connected to the DC / DC buck circuit, the integrated circuit chip to be tested and the controller, and is used to collect the output voltage of the DC / DC buck circuit, and connect the sampled voltage to the controller for monitoring. The current sampling circuit is respectively connected to the DC / DC buck circuit, the integrated circuit chip to be tested and the controller, and is used to collect the output current of the DC / DC buck circuit, and connect the sampled current to the controller for monitoring.

4. The test circuit for an integrated circuit chip according to claim 1, characterized in that: It also includes a human-computer interaction module, which includes buttons, LED indicator lights and a display screen, and is used to display the test results and test status of the integrated circuit chip to be tested.

5. The test circuit for an integrated circuit chip according to claim 2, characterized in that: The DC / DC buck circuit includes a feedback regulation loop circuit, a control circuit, a power switch circuit, an inductor element and a capacitor element. The control circuit includes a synchronous buck control chip. The feedback regulation loop circuit is connected to a voltage feedback terminal of the synchronous buck control chip and a digital-to-analog conversion terminal of the microcontroller. The voltage feedback terminal outputs a stable reference voltage. The output terminal of the synchronous buck control chip is connected to the power switch circuit, the inductor element and the capacitor element in sequence. The DC / DC buck circuit steps down the level signal with amplitude variation to a preset range based on the stable reference voltage and is connected to the positive power supply of the integrated circuit chip to be tested.

6. The test circuit for an integrated circuit chip according to claim 5, characterized in that: The feedback regulation loop circuit includes a resistor R0, a resistor R1, a resistor R2 and a capacitor C, one end of the resistor RO is connected to the digital-to-analog conversion terminal DAC of the microcontroller, and the other end is respectively connected to the resistor R1, the resistor R2, one end of the capacitor C, and the voltage feedback terminal V_FB of the synchronous buck control chip, the other ends of the resistor R1 and the capacitor C are connected to the voltage sampling circuit, the other end of the resistor R2 is grounded, the output voltage Vout of the DC / DC buck circuit is Vfb+Vfb*(R1 / R2)-(Vdac-Vfb)*R1 / R0, and the output voltage of the DC / DC buck circuit can be adjusted by adjusting the resistance value of the resistor R0, the resistor R1 or the resistor R2.

7. The test circuit for an integrated circuit chip according to claim 6, characterized in that: The voltage feedback terminal V_FB of the synchronous buck control chip outputs a stable reference voltage of 0.6V, the digital-to-analog conversion terminal of the microcontroller outputs a level signal Vdac with an amplitude variation range of [0 to 3.3V], and the DC / DC buck circuit converts the level signal Vdac with a variation range of [0 to 3.3V] into an output voltage Vout of [0.99V to 1.38V].

8. The test circuit for an integrated circuit chip according to claim 1, characterized in that: The constant voltage reference circuit includes an operational amplifier U36, a voltage reference chip D46, a MOS tube Q20, a resistor R211, a resistor R212, a resistor R213, a capacitor C138, a capacitor C139 and a capacitor C140. One end of the resistor R211 is connected to a 5V DC voltage, and the other end is respectively connected to one end of the resistor R213, the cathode and the control end of the voltage reference chip D46, the anode of the voltage reference chip D46 is grounded, and the other end of the resistor R213 is respectively connected to one end of the resistor R212, one end of the capacitor C140 and the operational amplifier U The inverting input terminal of the operational amplifier U36 is connected to the inverting input terminal of the integrated circuit chip to be tested, the other end of the resistor R212 is grounded, the other end of the capacitor C140 is connected to the output terminal of the operational amplifier U36, the non-inverting input terminal of the operational amplifier U36 is connected to the ground terminal of the integrated circuit chip to be tested, the output terminal of the operational amplifier U36 is connected to the gate of the MOS tube Q20, the drain of the MOS tube Q20 is connected to the ground terminal of the integrated circuit chip to be tested and grounded through the capacitor C138, the source of the MOS tube Q20 is grounded, and the constant voltage reference circuit outputs a constant voltage with an amplitude of 0.625V.

9. The test circuit for an integrated circuit chip according to claim 1, characterized in that: The bidirectional level conversion circuit includes a bidirectional level conversion chip, a Schottky diode, a first input resistor, a second input resistor, a first filter capacitor and a second filter capacitor. The communication port of the main controller is connected to the first input and output port of the bidirectional level conversion chip through two series-connected Schottky diodes and the first input resistor. The cathode of the series-connected Schottky diode is connected to the communication port of the main controller. The second input and output port of the bidirectional level conversion chip is connected to the communication port of the integrated circuit chip to be tested through the second input resistor. The power supply voltage of the first input and output port of the bidirectional level conversion chip is connected to 3.3V and is grounded through the first filter capacitor. The power supply voltage of the second input and output port of the bidirectional level conversion chip is connected to 1.8V and is grounded through the second filter capacitor.

10. A testing device for an integrated circuit chip, characterized in that: It comprises a circuit board, on which a test circuit for the integrated circuit chip according to any one of claims 1 to 9 and a chip placement slot are arranged, and the chip placement slot is provided with electrical contacts for placing the integrated circuit chip to be tested and realizing electrical connection between the integrated circuit chip to be tested and the test circuit.

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