Printer solder paste management system and method and storage medium

Abstract

The invention discloses a printing machine solder paste management system and method and a storage medium, relates to the technical field of solder paste management, and solves the technical problem that in the prior art, type division cannot be performed according to solder paste characteristics, so that backup solder paste use control cannot be performed with high precision. The method specifically comprises the steps that a characteristic evaluation unit marks solder paste purchased in real time as newly-added solder paste, carries out characteristic evaluation on the newly-added solder paste, obtains a characteristic evaluation coefficient according to information processing, and divides the newly-added solder paste into non-matched solder paste, matched solder paste and backup solder paste through coefficient comparison; the backup analysis control unit is used for carrying out backup demand analysis on the printing machine and carrying out backup solder paste use control according to the backup demand analysis; the supply risk assessment unit carries out risk assessment on solder paste supply in the operation stage of the printing machine.

Description

Technical Field

[0001] The present invention relates to the technical field of solder paste management, and in particular to a printing press solder paste management system, method and storage medium. Background Art

[0002] Printing machine solder paste is a sticky viscous substance, which is mainly used to provide spot welding effect for connecting electronic components on PCB (printed circuit board); metal powder is the main component of solder paste, usually alloy powder composed of metal elements such as tin, lead, silver, copper, etc.; different alloy components have different melting points, welding performance and costs.

[0003] The patent with announcement number CN116362630A discloses a solder paste printer management method, system and medium based on the Internet of Things, which belongs to the field of solder paste printer management technology. The present invention obtains the printing process requirement data information of the current solder paste printing product, and generates solder paste printing suggestions based on the printing process requirement data information of the current solder paste printing product and the relevant performance critical points. The present invention predicts the degradation of the solder paste printer by converting the quality of the solder paste printing product produced within a preset time into a state transition probability matrix through a Markov chain according to the production quality, and then constructs a solder paste printer performance degradation prediction model according to the state transition probability matrix, thereby combining the evaluation with the processing requirements of the solder paste printing product to be processed, so as to avoid the solder paste printer that does not meet the processing requirements from producing a large number of defective products or products that do not meet the requirements when mass-producing products.

[0004] However, in the prior art, when solder paste is supplied, it is not possible to infer whether the solder paste meets the requirements based on characteristic analysis, and it is not possible to classify the solder paste into types based on its characteristics, so that the use of backup solder paste cannot be controlled with high precision. In addition, it is even more impossible to conduct a risk assessment of the solder paste supply, which reduces the efficiency of the use of the printing machine.

[0005] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problems and to provide a printing machine solder paste management system, method and storage medium.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A printing press solder paste management system includes a solder paste management platform, and the solder paste management platform is connected with: The characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste, and to perform characteristic evaluation on the newly added solder paste, collect viscosity influence information, thixotropy influence information and welding performance information, and obtain characteristic evaluation coefficients based on information processing, and classify the newly added solder paste into non-matching solder paste, matching solder paste and backup solder paste by comparing the coefficients; The backup analysis control unit is used to analyze the backup needs of the printing press and control the use of backup solder paste according to the backup needs analysis; The supply risk assessment unit is used to conduct risk assessment on solder paste supply during the operation of the printing machine, collect supply risk information, and substitute it into the formula to obtain the supply risk assessment coefficient. It can also infer whether the supply risk assessment is qualified through coefficient comparison. If not, solder paste supply is carried out again. If yes, printing efficiency assessment is carried out. The printing satisfaction analysis unit is used to analyze the printing of the printing machine, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison. If so, the extrusion volume is adaptively adjusted. If not, the printing machine is continuously monitored.

[0008] As a preferred embodiment of the present invention, the viscosity influence information is the ratio of the average scraping amount of the newly added solder paste when a single scraping operation is performed under the set scraper force and the floating span value of the coverage area when the newly added solder paste is scraped to the circuit board; The thixotropic influence information is the ratio of the deviation between the viscosity reduction ratio of the newly added solder paste and the preset reduction ratio when the newly added solder paste is subjected to external force, and the duration of the newly added solder paste moving to the initial form of the solder paste on the circuit board. The welding performance information is the real-time increase span of conductive loss when adding solder paste for welding and the increase span of the number of solder joints that fall off after welding is completed.

[0009] As a preferred embodiment of the present invention, if the characteristic evaluation coefficient exceeds the maximum value of the characteristic evaluation coefficient threshold range, a non-matching signal is generated; if the characteristic evaluation coefficient is within the characteristic evaluation coefficient threshold range, an inefficient matching signal is generated; if the characteristic evaluation coefficient is lower than the characteristic evaluation coefficient threshold range, a high matching signal is generated.

[0010] As a preferred embodiment of the present invention, the backup demand analysis process is as follows: the deviation between the preset solder paste usage and the actual usage during the current use of the printing machine, the ratio of the delay time of solder paste replenishment to the total printing time during the use of the printing machine are obtained, and floating inferences are made based on the values ​​of the two. If the duration of the increase of the usage deviation and the duration ratio in the same period exceeds the duration threshold, or the average of the floating speed in the same period exceeds the speed average threshold, it is inferred that solder paste backup is required in the current printing stage; conversely, if the duration of the increase of the usage deviation and the duration ratio in the same period does not exceed the duration threshold, and the average of the floating speed in the same period does not exceed the speed average threshold, it is inferred that solder paste backup is not required in the current printing stage; As a preferred embodiment of the present invention, when solder paste backup is needed, the interval period for changing the type of originally supplied solder paste during the current backup solder paste storage stage is inferred; if the type change interval period is shorter than the set period, the current backup solder paste is replenished first when it meets the solder paste type required by the printer, and solder paste scheduling is performed before the solder paste storage time threshold is exceeded when it does not meet the requirements; conversely, if the type change interval period is longer than the set period, the current backup solder paste is continuously replenished.

[0011] As a preferred embodiment of the present invention, the supply risk information includes the numerical ratio of the time when the ambient temperature and humidity of the surrounding environment of the solder paste is within the set range during the real-time supply of the solder paste during the solder paste supply stage of the printing press and the maximum span of the reciprocating fluctuation of the ambient temperature and humidity at any two moments during the supply stage, the numerical ratio of the ambient temperature control deviation floating span of the solder paste during the real-time warming period during the solder paste supply stage of the printing press and the continuous time when the solder paste is in a temperature environment with no control deviation, and the deviation value of the distribution uniformity of the alloy powder and flux corresponding to each part of the stirred solder paste.

[0012] As a preferred embodiment of the present invention, if the supply risk assessment coefficient exceeds the supply risk assessment coefficient threshold, a supply qualified signal is generated; if the supply risk assessment coefficient does not exceed the supply risk assessment coefficient threshold, a supply unqualified signal is generated.

[0013] As a preferred embodiment of the present invention, the consumption parameter and the area parameter are respectively the peak value of the increase span of the deviation value of the solder paste consumption corresponding to the printing moment when the real-time printing speed of the printer fluctuates when the printer scraper angle alternates, and the maximum deviation value of the pressure forming area of ​​the same type of solder paste in the delivery area when the printer continues to print and under the same pressure; If the consumption parameter exceeds the increased span peak threshold, or the area parameter exceeds the area maximum deviation value threshold, a supply deviation signal is generated; if the consumption parameter does not exceed the increased span peak threshold, and the area parameter does not exceed the area maximum deviation value threshold, a qualified signal is generated.

[0014] As a preferred embodiment of the present invention, a printing machine solder paste management method comprises the following steps: Step 1: Property detection: After the printing press is used, when the amount of solder paste is reduced, the purchased solder paste properties are detected and classified according to the solder paste property analysis; Step 2: Backup analysis control: backup control of solder paste backup type during feature division; Step 3: Supply risk analysis: Conduct risk analysis on solder paste addition supply; Step 4: Printing efficiency analysis: Conduct printing efficiency analysis when there is no supply risk.

[0015] As a preferred embodiment of the present invention, a computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned printing machine solder paste management method is implemented.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the characteristics of the solder paste purchased by the printer in real time are analyzed, and the solder paste characteristics are detected to ensure that the solder paste purchased by the printer in real time can meet the actual printing needs, ensure the use efficiency of the solder paste, and avoid the solder paste characteristics being in the same range, avoid affecting the use of the original remaining solder paste, and promote the efficiency and stability of the use of the printer; Conduct backup demand analysis on the printing press, and infer whether the current low-risk impact analysis is normal through backup solder paste usage analysis, so as to conduct backup solder paste usage risk assessment based on the current printing press usage needs, to avoid the backup solder paste being unsuitable for use in the current period, resulting in a waste of storage costs for the backup solder paste and affecting the printing quality of the printing press.

[0017] 2. In the present invention, a risk assessment is performed on the solder paste supply during the operation stage of the printing press. Through the solder paste supply stage, it is inferred whether there is a supply risk in the current solder paste supply, so as to avoid external influences during the solder paste supply, which may reduce the solder paste supply efficiency and affect the normal operation of the printing press. It also avoids abnormal solder paste supply execution, which may lead to an increase in solder paste and storage costs, and also cause the printing press to slow down, affecting the execution progress of the printing operation; When the solder paste is supplied, the printing analysis is performed on the printer. The printer's operating performance analysis is used to infer whether the current printing satisfies actual needs, thereby inferring whether the current printer's operating efficiency is qualified after receiving the solder paste supply. The real-time performance of the printer is tested to ensure the execution efficiency of the printing task. At the same time, the efficiency of solder paste use can be monitored in real time through performance testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0019] Figure 1 It is a system principle block diagram of the present invention; Figure 2 is a flow chart of the method of the present invention; Figure 3 It is a schematic diagram of the execution steps of the method of the present invention. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] Embodiment 1 See also Figure 1 As shown, a printing press solder paste management system includes a solder paste management platform, wherein the solder paste management platform is communicatively connected to a printing press use unit, a characteristic evaluation unit, a backup analysis control unit, a supply risk evaluation unit, and a printing satisfaction analysis unit; each component of this embodiment is oriented to solder paste management, cooperates with the operation of the printing press, and ensures the use efficiency of the printing press and the supply efficiency of solder paste; The printing press use unit is used as a monitoring module for the printing press operation switch. When the printing press starts running, it generates a solder paste management signal and sends it to the solder paste management platform. After receiving the solder paste management signal, the solder paste management platform manages the solder paste during the operation phase of the printing press. All the involved links of the solder paste meet the efficiency of the printing press. The solder paste management platform generates a characteristic evaluation signal and sends it to the characteristic evaluation unit. After receiving the characteristic evaluation signal, the characteristic evaluation unit performs characteristic analysis on the solder paste purchased by the printer in real time. Through solder paste characteristic detection, it ensures that the solder paste purchased by the printer in real time can meet the actual printing needs, ensures the efficiency of solder paste use, and avoids the solder paste characteristics being in the same range, avoiding the impact on the use of the original remaining solder paste, and promoting the efficiency and stability of the use of the printer; Mark the solder paste purchased in real time as newly added solder paste, and evaluate the characteristics of the newly added solder paste, obtain the average scraping amount of the newly added solder paste when a single scraping is executed under the set scraper force, and the floating span value of the coverage area when the newly added solder paste is scraped onto the circuit board, and obtain the numerical ratio through ratio calculation and mark it as viscosity influence information; set the label NDX; At the same time, the deviation between the viscosity reduction ratio of the newly added solder paste and the preset reduction ratio when the newly added solder paste is subjected to external force and the duration of the newly added solder paste moving to the initial form of the solder paste on the circuit board are obtained, and the numerical ratio is obtained through ratio calculation and marked as thixotropic influence information; the label CBX is set; The real-time conductive loss growth span when adding solder paste for welding and the growth span of the number of solder joints falling off after welding are obtained, and the average value of the growth span is calculated by summing and averaging, and marked as welding performance information, and set the label HJX; Substitute the above collected information into the formula to obtain the newly added solder paste characteristic evaluation coefficient TX during the operation of the printing machine, where the formula is: , where vng1, vng2, and vng3 are preset proportional coefficients, e is a natural constant, and α is an error correction factor with a value of 0.798; Compare the newly added solder paste characteristic evaluation coefficient TX during the operation of the printer with the characteristic evaluation coefficient threshold range: If the characteristic evaluation coefficient TX of the newly added solder paste during the operation of the printer exceeds the maximum value of the characteristic evaluation coefficient threshold range, it is inferred that the characteristic analysis of the current newly added solder paste is abnormal, a non-matching signal is generated and sent to the solder paste management platform, and the solder paste management platform will not use the current batch of solder paste as the newly used solder paste and re-select the material; If the characteristic evaluation coefficient TX of the newly added solder paste is within the characteristic evaluation coefficient threshold range during the operation of the printing press, it is inferred that the characteristic analysis of the current newly added solder paste is inefficient, and an inefficient matching signal is generated and sent to the solder paste management platform. The solder paste management platform uses the current batch of solder paste as an alternative new solder paste, and replaces the solder paste when the amount of solder paste is insufficient to ensure the continuity of the operation of the printing press. The characteristics of this type of solder paste meet the needs, but the risk of printing press operation regulation is high when used, and it is only used as an alternative solder paste; If the characteristic evaluation coefficient TX of the newly added solder paste during the operation of the printer is lower than the characteristic evaluation coefficient threshold range, it is inferred that the characteristic analysis of the current newly added solder paste is qualified, a high matching signal is generated and the high efficiency matching signal is sent to the solder paste management platform. After the solder paste management platform receives the high matching signal, the current newly added solder paste is used as the supplementary solder paste for the printer; At the same time, a backup analysis control signal is generated and sent to the backup analysis control unit. After receiving the backup analysis control signal, the backup analysis control unit performs a backup demand analysis on the printing press, and infers whether the current low-risk impact analysis is normal through the backup solder paste usage analysis, thereby performing a backup solder paste usage risk assessment in combination with the current usage requirements of the printing press, to avoid the backup solder paste being unsuitable for use in the current period, resulting in a waste of storage costs for the backup solder paste and affecting the printing quality of the printing press; Obtain the deviation between the preset solder paste usage and the actual usage during the current use of the printing machine, and the ratio of the delay time of solder paste replenishment to the total printing time during the use of the printing machine, and make floating inferences based on the two values. If the duration of the increase in the usage deviation and the duration ratio in the same period exceeds the duration threshold, or the average of the floating speed in the same period exceeds the speed average threshold, it is inferred that solder paste backup is required in the current printing stage; conversely, if the duration of the increase in the usage deviation and the duration ratio in the same period does not exceed the duration threshold, and the average of the floating speed in the same period does not exceed the speed average threshold, it is inferred that solder paste backup is not required in the current printing stage; When solder paste backup is needed, the replacement interval of the original solder paste type in the current backup solder paste storage stage is inferred. If the type replacement interval is shorter than the set period, the current backup solder paste is replenished first when it meets the solder paste type required by the printer, and the solder paste is scheduled before the solder paste storage time threshold is exceeded when it does not meet the requirements. On the contrary, if the type replacement interval is longer than the set period, the current backup solder paste is continuously replenished. Send the real-time processing method of backup solder paste to the solder paste management platform during the printing press operation stage; The solder paste management platform generates a supply risk assessment signal and sends it to the supply risk assessment unit. After receiving the supply risk assessment signal, the supply risk assessment unit conducts a risk assessment on the solder paste supply during the operation phase of the printing press. It infers whether there is a supply risk during the current solder paste supply phase through the solder paste supply phase, so as to avoid external influences during the solder paste supply that may reduce the solder paste supply efficiency and affect the normal operation of the printing press. It also avoids abnormal solder paste supply execution that may lead to an increase in solder paste and storage costs, which may also cause the printing press to slow down and affect the execution of the printing job. Obtain the numerical ratio of the duration of the ambient temperature and humidity of the real-time solder paste supply environment in the set range during the solder paste supply phase of the printer and the maximum span of the reciprocating fluctuation of the ambient temperature and humidity at any two moments during the supply phase, that is, the ratio of the duration to the amplitude span, and the two do not consider the influence of inconsistent units, and set the label SK; At the same time, the numerical ratio of the ambient temperature control deviation floating span of the solder paste in the real-time temperature recovery period during the solder paste supply stage of the printer and the duration of the solder paste in the temperature environment without control deviation is obtained, and the label KS is set; the temperature control deviation floating span is expressed as the deviation between the actual temperature value and the set control temperature value, corresponding to the deviation floating span; After the solder paste of the printing machine is heated up, it is stirred according to the set stirring speed and time, and the uniformity deviation value of the alloy powder and flux distribution corresponding to each part of the solder paste after stirring is obtained, wherein the uniformity deviation value is expressed as the content deviation value of the powder and flux corresponding to each part of the solder paste in the same area position; and the label JP is set; The above collected information is uniformly marked as supply risk information, and substituted into the formula to obtain the supply risk assessment coefficient P in the printing machine solder paste supply stage, where the formula is: , where mh1, mh2, and mh3 are preset proportional coefficients, and t1 is the numerical growth time of the ratio of time length to amplitude span, and t2 is the non-growth time of the numerical ratio of temperature deviation to time length; Compare the supply risk assessment coefficient P in the printer solder paste supply stage with the supply risk assessment coefficient threshold: If the supply risk assessment coefficient P during the solder paste supply stage of the printing press exceeds the supply risk assessment coefficient threshold, it is inferred that the supply risk assessment of the printing press is qualified, a supply qualified signal is generated and the supply qualified signal is sent to the solder paste management platform; if the supply risk assessment coefficient P during the solder paste supply stage of the printing press does not exceed the supply risk assessment coefficient threshold, it is inferred that the supply risk assessment of the printing press is unqualified, a supply unqualified signal is generated and the supply unqualified signal is sent to the solder paste management platform. After receiving the supply unqualified signal, the solder paste management platform suspends the current supply of solder paste, schedules the spare solder paste and resupplies it to ensure supply efficiency; After completing the supply risk assessment, a printing satisfaction analysis signal is generated and sent to the printing satisfaction analysis unit. After receiving the printing satisfaction analysis signal, the printing satisfaction analysis unit performs printing analysis on the printing machine when the solder paste is supplied. Through the operation performance analysis of the printing machine, it is inferred whether the current printing satisfaction meets the actual demand, thereby inferring whether the current printing machine has qualified operation efficiency after receiving the supply of solder paste. The real-time performance of the printing machine is tested to ensure the execution efficiency of the printing task. At the same time, the use efficiency of the solder paste can be monitored in real time through performance testing; At the corresponding moments of different reserves of solder paste in the solder paste supply cycle, the peak value of the deviation of solder paste consumption at the corresponding printing moment of the printer scraper angle alternating when the real-time printing speed of the printer fluctuates is obtained, and at the same time, the maximum deviation value of the pressure forming area of ​​the same type of solder paste in the delivery area under the same pressure when the printer is continuously printing is obtained. It can be understood that the deviation of solder paste consumption reflects the deviation of the supply amount of solder paste during printing and the usage amount under the cooperation of the scraper, and the pressure forming area also reflects the area formed by the amount of solder paste delivered under the same pressure, which mainly reflects the cooperation efficiency of the printer and the solder paste; The peak value of the deviation of the solder paste consumption corresponding to the alternating angle of the scraper of the printer at the printing moment when the real-time printing speed of the printer fluctuates, and the maximum deviation of the pressure forming area of ​​the same type of solder paste in the delivery area under the same pressure when the printer continues to print are marked as consumption parameters and area parameters, respectively, and compared with the threshold of the peak value of the increase in span and the threshold of the maximum deviation value of the area, respectively: If the peak value of the increase in the span of the deviation value of the solder paste consumption at the printing moment corresponding to the alternating scraper angle of the printer when the real-time printing speed of the printer fluctuates exceeds the threshold value of the increase in the span peak value, or if the printer continues to print and the maximum deviation value of the pressure forming area of ​​the same type of solder paste in the delivery area under the same pressure exceeds the threshold value of the maximum area deviation value, it is inferred that there is an abnormality in the real-time printing efficiency of the printer after the solder paste supply is completed, and a supply deviation signal is generated and sent to the solder paste management platform. After receiving the supply deviation signal, the solder paste management platform adjusts the real-time solder paste extrusion amount of the current printer according to the adjustment of the printing speed and the scraper angle to avoid the reduction of printing efficiency due to the deviation of the solder paste amount; If the peak value of the increase span of the deviation value of the solder paste consumption at the printing moment corresponding to the alternating angle of the scraper of the printer when the real-time printing speed of the printer fluctuates does not exceed the threshold value of the increase span peak value, and the printer continues to print and the maximum deviation value of the pressure forming area of ​​the same type of solder paste in the delivery area under the same pressure does not exceed the threshold value of the maximum area deviation value, it is inferred that the real-time printing efficiency of the printer after completing the solder paste supply is normal, and a qualified signal is generated and sent to the solder paste management platform; Embodiment 2 Please refer to Figure 2-3 As shown, a printing press solder paste management method includes four steps: printing demand generation, purchasing environment, use link and printing demand execution, and the printing press solder paste management also plays a role in detecting the operating efficiency of the printing press; In the four specific environmental steps, the specific process is the use of the printing press, that is, the use demand is generated; then the purchased solder paste characteristics are tested, that is, after the printing press is used, in the process of reducing the amount of solder paste, the purchased solder paste characteristics are tested, and the types are divided according to the solder paste characteristics analysis, backup analysis control, and backup control of the solder paste backup type during the characteristic division, after the backup is completed, the supply risk analysis is performed, the risk analysis of the solder paste addition supply is performed, and the printing efficiency analysis is performed, and the printing efficiency analysis is performed when there is no risk; Additionally, a computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned printing machine solder paste management method is implemented.

[0023] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing related hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods.

[0024] Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory, the non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory, and the volatile memory may include random access memory (RAM) or external cache memory.

[0025] By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0026] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned functions can be distributed to different functional units and modules as needed, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. The above formulas are obtained by collecting a large amount of data and performing software simulation, and a formula close to the actual value is selected. The coefficients in the formula are set by technicians in this field according to actual conditions; When the present invention is in use, the characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste, and perform characteristic evaluation on the newly added solder paste, collect viscosity influence information, thixotropy influence information and welding performance information, and obtain characteristic evaluation coefficients based on information processing, and divide the newly added solder paste into non-matching solder paste, matching solder paste and backup solder paste through coefficient comparison; the backup analysis control unit is used to perform backup demand analysis on the printing machine, and perform backup solder paste use control based on the backup demand analysis; the supply risk assessment unit is used to perform risk assessment on the solder paste supply during the operation stage of the printing machine, collect supply risk information, and substitute it into the formula to obtain the supply risk assessment coefficient, and infer whether the supply risk assessment is qualified through coefficient comparison, if not, the solder paste is re-supplied, and if yes, the printing efficiency is evaluated; the printing satisfaction analysis unit is used to perform printing analysis on the printing machine, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison, if yes, the extrusion amount is adaptively controlled, and if not, the printing machine is continuously monitored.

[0027] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A printing machine solder paste management system, characterized in that: Including solder paste management platform, the solder paste management platform is connected to: The characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste, and to perform characteristic evaluation on the newly added solder paste, collect viscosity influence information, thixotropy influence information and welding performance information, and obtain characteristic evaluation coefficients based on information processing, and classify the newly added solder paste into non-matching solder paste, matching solder paste and backup solder paste by comparing the coefficients; The backup analysis control unit is used to analyze the backup needs of the printing press and control the use of backup solder paste according to the backup needs analysis; The supply risk assessment unit is used to conduct risk assessment on solder paste supply during the operation of the printing machine, collect supply risk information, and substitute it into the formula to obtain the supply risk assessment coefficient. It can also infer whether the supply risk assessment is qualified through coefficient comparison. If not, solder paste supply is carried out again. If yes, printing efficiency assessment is carried out. The printing satisfaction analysis unit is used to analyze the printing of the printing machine, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison. If so, the extrusion volume is adaptively adjusted. If not, the printing machine is continuously monitored.

2. A printing press solder paste management system according to claim 1, characterized in that: The viscosity impact information is the ratio of the average amount of solder paste scraped off in a single scraping operation under the set scraper force and the floating span value of the coverage area when the solder paste is scraped onto the circuit board; The thixotropic influence information is the ratio of the deviation between the viscosity reduction ratio of the newly added solder paste and the preset reduction ratio when the newly added solder paste is subjected to external force, and the duration of the newly added solder paste moving to the initial form of the solder paste on the circuit board. The welding performance information is the real-time increase span of conductive loss when adding solder paste for welding and the increase span of the number of solder joints that fall off after welding is completed.

3. A printing press solder paste management system according to claim 2, characterized in that: If the characteristic evaluation coefficient exceeds the maximum value of the characteristic evaluation coefficient threshold range, a non-matching signal is generated; if the characteristic evaluation coefficient is within the characteristic evaluation coefficient threshold range, an inefficient matching signal is generated; if the characteristic evaluation coefficient is lower than the characteristic evaluation coefficient threshold range, a high matching signal is generated.

4. The printing press solder paste management system according to claim 1, characterized in that: The backup demand analysis process is as follows: obtain the deviation between the preset solder paste usage and the actual usage during the current use of the printing machine, and the proportion of solder paste replenishment delay time to the total printing time during the printing machine use phase, and make floating inferences based on the two values. If the duration of the usage deviation and the duration ratio increasing in the same period exceeds the duration threshold, or the average floating speed in the same period exceeds the speed average threshold, it is inferred that solder paste backup is required in the current printing phase; conversely, if the duration of the usage deviation and the duration ratio increasing in the same period does not exceed the duration threshold, and the average floating speed in the same period does not exceed the speed average threshold, it is inferred that solder paste backup is not required in the current printing phase.

5. A printing press solder paste management system according to claim 4, characterized in that: When solder paste backup is needed, the interval period for changing the type of the original supplied solder paste during the current backup solder paste storage stage is inferred. If the type change interval period is shorter than the set period, the current backup solder paste will be replenished first when it meets the solder paste type required by the printer, and solder paste scheduling will be performed before the solder paste storage time threshold is exceeded when it does not meet the requirements. On the contrary, if the type change interval period is longer than the set period, the current backup solder paste will be continuously replenished.

6. The printing press solder paste management system according to claim 1, characterized in that: The supply risk information includes the numerical ratio of the time when the ambient temperature and humidity of the surrounding environment of the solder paste are within the set range during the real-time supply stage of the solder paste of the printing press and the maximum span of the reciprocating fluctuation of the ambient temperature and humidity at any two moments during the supply stage, the numerical ratio of the floating span of the ambient temperature control deviation of the solder paste during the real-time warming period during the solder paste supply stage of the printing press and the continuous time when the solder paste is in a temperature environment with no control deviation, and the deviation value of the distribution uniformity of alloy powder and flux corresponding to each part of the stirred solder paste.

7. A printing machine solder paste management system according to claim 6, characterized in that: If the supply risk assessment coefficient exceeds the supply risk assessment coefficient threshold, a supply qualified signal is generated; if the supply risk assessment coefficient does not exceed the supply risk assessment coefficient threshold, a supply unqualified signal is generated.

8. The printing press solder paste management system according to claim 1, characterized in that: The consumption parameter and area parameter are respectively the peak value of the increase in the deviation of the solder paste consumption when the scraper angle of the printer is alternating at the printing moment when the real-time printing speed of the printer fluctuates, and the maximum deviation of the pressure forming area of ​​the same type of solder paste in the delivery area when the printer is continuously printing and under the same pressure; If the consumption parameter exceeds the increased span peak threshold, or the area parameter exceeds the area maximum deviation value threshold, a supply deviation signal is generated; if the consumption parameter does not exceed the increased span peak threshold, and the area parameter does not exceed the area maximum deviation value threshold, a qualified signal is generated.

9. A solder paste management method for a printing press solder paste management system based on any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1: Property detection: After the printing press is used, when the amount of solder paste is reduced, the purchased solder paste properties are detected and classified according to the solder paste property analysis; Step 2: Backup analysis control: backup control of solder paste backup type during feature division; Step 3: Supply risk analysis: Conduct risk analysis on solder paste addition supply; Step 4: Printing efficiency analysis: Conduct printing efficiency analysis when there is no supply risk.

10. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, a solder paste management method as claimed in claim 9 is implemented.

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