Vertical wafer handling equipment

Abstract

The present invention discloses a vertical wafer handling device, comprising: a base plate mounted on a movable bracket, a front loading plate and a rear loading plate mounted on the upper surface of the base plate, and a base arranged below the base plate, an adjustment motor being arranged below one end of the base, the output shaft of the adjustment motor extending vertically to the top of the base and connected to a turntable arranged between the front loading plate and the rear loading plate, a cavity being provided in the turntable, a plurality of vacuum adsorption holes each connected to the cavity being provided on the upper surface of the turntable for overlapping contact with the lower surface of the wafer, and at least one sensor being installed on the upper surface of the other end of the base and located outside the turntable. The present invention can not only realize the docking, position transfer, and automatic detection, identification, and adjustment of the wafer position, thereby improving the position accuracy of the wafer, but also effectively avoid additional position offset of the wafer during the rotation of the turntable, further ensuring the position accuracy of the wafer after angle adjustment.

Description

Technical Field

[0001] The invention relates to vertical wafer transport equipment, belonging to the technical field of wafer testing. Background Art

[0002] During the wafer production process, wafers must be handled with care to avoid mechanical damage during handling. Currently, wafers are typically manually received and transferred to the appropriate workstation. However, the position and angle of the wafers can easily shift during the receiving and transfer process, requiring rotation to the correct position for subsequent processing. Furthermore, the wafers are prone to further positional shifts during rotation, affecting the positional accuracy of the rotated wafers. Summary of the Invention

[0003] The purpose of the present invention is to provide a vertical wafer handling device, which can not only realize the docking, position transfer and automatic detection, identification and adjustment of the wafer position, thereby improving the positioning accuracy of the wafer, but also effectively avoid additional position deviation of the wafer during the rotation of the turntable, thereby further ensuring the positioning accuracy of the wafer after angle adjustment.

[0004] To achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: a vertical wafer transport device, comprising: a substrate mounted on a movable bracket, a front loading plate and a rear loading plate mounted on the upper surface of the substrate, and a base disposed below the substrate; the movable bracket is mounted on a vertical conveying assembly, and the vertical conveying assembly comprises: a vertically extending housing, a lead screw rotatably mounted on the housing, and a movable nut sleeved on the lead screw; an output shaft of a drive motor mounted on the lower end of the housing is connected to the lower end of the lead screw, and the movable bracket is mounted on the movable nut;

[0005] An adjustment motor is provided below one end of the base, and an output shaft of the adjustment motor extends vertically to the top of the base and is connected to a turntable provided between the front loading plate and the rear loading plate. A cavity is provided in the turntable, and a plurality of vacuum adsorption holes are provided on the upper surface of the turntable for overlapping contact with the lower surface of the wafer, each of which is connected to the cavity. A vacuum generator is connected to the cavity through a pipeline.

[0006] When the movable bracket moves to the first position along with the vertical conveying assembly, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable. When the movable bracket moves to the second position along with the vertical conveying assembly, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate. At least one sensor is installed on the upper surface of the other end of the base and located on the outside of the turntable. A notch corresponding to the sensor is formed on the wafer, and the sensor is electrically connected to the adjustment motor and the vacuum generator.

[0007] The further improved scheme in the above technical scheme is as follows:

[0008] 1. In the above scheme, the upper surface of each of the front and rear loading plates is provided with an arc-shaped groove corresponding to the wafer, and the side walls of the two arc-shaped grooves are arranged opposite to each other. When the wafer is embedded in the arc-shaped groove, the lower surface of the wafer overlaps and contacts the bottom surfaces of the two arc-shaped grooves.

[0009] 2. In the above solution, the base is fixedly mounted on a bottom plate, a through hole is formed on the bottom plate, the shell of the vertical transmission assembly passes through the through hole, and one end of the base on which the adjustment motor is mounted extends above the through hole.

[0010] 3. In the above solution, the sensor is a reflective sensor.

[0011] 4. In the above scheme, when the sensor receives the reflection signal from the wafer, it first starts the vacuum generator, and then controls the adjustment motor to drive the turntable to rotate.

[0012] 5. In the above solution, a straight-edge notch is formed on the circular wafer.

[0013] 6. In the above solution, the vacuum generator is arranged below the regulating motor.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0015] The vertical wafer handling equipment of the present invention has an adjustment motor provided below one end of its base, the output shaft of the adjustment motor extends vertically to the top of the base and is connected to a turntable provided between the front loading plate and the rear loading plate, a cavity is provided in the turntable, and a plurality of vacuum adsorption holes are provided on the upper surface of the turntable for overlapping contact with the lower surface of the wafer, each of which is connected to the cavity, and a vacuum generator is connected to the cavity through a pipeline. When the movable bracket moves to the first position with the vertical conveying assembly, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable, and when the movable bracket moves to the second position with the vertical conveying assembly, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate At least one sensor is installed on the upper surface of the other end of the base and located on the outside of the turntable. A notch corresponding to the sensor is formed on the wafer. The sensor is electrically connected to the adjustment motor and the vacuum generator. The wafer can be connected through the front and rear carriers, and the position of the wafer between the carrier and the turntable can be transferred by the up and down movement of the front and rear carriers, as well as the automatic detection and identification of the position of the wafer transferred to the turntable. The circumferential angle of the wafer is adjusted by the rotation of the turntable to improve the position accuracy of the wafer. It can also effectively avoid additional position offset of the wafer during the rotation of the turntable, further ensuring the position accuracy of the wafer after the angle adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attachment Figure 1 It is a structural schematic diagram of the vertical wafer handling equipment of the present invention;

[0017] Attachment Figure 2 Schematic diagram of the partial structure of the vertical wafer handling equipment of the present invention Figure 1 ;

[0018] Attachment Figure 3 Schematic diagram of the partial structure of the vertical wafer handling equipment of the present invention Figure 2 ;

[0019] Attachment Figure 4 For attachment Figure 3 Schematic diagram of the cross-sectional structure;

[0020] Attachment Figure 5 It is a structural schematic diagram of the vertical transfer assembly of the vertical wafer handling equipment of the present invention.

[0021] In the above drawings: 100, wafer; 101, notch; 1, substrate; 2, front loading plate; 3, rear loading plate; 41, slide rail; 42, slider; 5, arc groove; 6, base; 7, adjustment motor; 8, turntable; 81, cavity; 82, vacuum adsorption hole; 93, pipeline; 10, sensor; 11, support; 12, movable bracket; 131, housing; 132, screw rod; 133, movable nut; 134, drive motor; 14, bottom plate; 141, avoidance hole. Implementation Method

[0022] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0023] Example 1: A vertical wafer handling device, comprising: a substrate 1 mounted on a movable bracket 10, a front loading plate 2 and a rear loading plate 3 mounted on the upper surface of the substrate 1, and a base 6 disposed below the substrate 1; the movable bracket 10 is mounted on a vertical conveying assembly, and the vertical conveying assembly comprises: a vertically extending housing 111, a screw 112 rotatably mounted on the housing 111, and a movable nut 113 sleeved on the screw 112; an output shaft of a drive motor 114 mounted on the lower end of the housing 111 is connected to the lower end of the screw 112, and the movable bracket 10 is mounted on the movable nut 113;

[0024] First, the vertical transport assembly drives the movable bracket upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket come into contact with the lower surface of the wafer, and the wafer is connected to the external pickup assembly.

[0025] An adjustment motor 7 is provided below one end of the base 6. The output shaft of the adjustment motor 7 extends vertically to the top of the base 6 and is connected to a turntable 8 provided between the front loading plate 2 and the rear loading plate 3. A cavity 81 is defined within the turntable 8. A plurality of vacuum adsorption holes 82 are provided on the upper surface of the turntable 8 for overlapping contact with the lower surface of the wafer, each of which is connected to the cavity 81. A vacuum generator is connected to the cavity 81 via a pipeline 83.

[0026] Next, the vertical transfer assembly drives the movable bracket downward until the upper surfaces of the front and rear loading plates are lower than the upper surface of the turntable located therebetween. At this point, the wafer is transferred from the front and rear loading plates to the upper surface of the turntable.

[0027] When the movable bracket 10 moves to the first position along with the vertical conveying assembly, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 8. When the movable bracket 10 moves to the second position along with the vertical conveying assembly, the upper surface of the turntable 8 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 9 is installed on the upper surface of the other end of the base 6 and located outside the turntable 8. A notch 101 corresponding to the sensor 9 is formed on the wafer 100. The sensor 9 is electrically connected to the adjustment motor 7 and the vacuum generator.

[0028] Since the position of the wafer may be shifted during the process of transporting the wafer, the sensor sends a sensing signal to detect the position of the notch on the wafer.

[0029] The upper surface of each of the front loading plate 2 and the rear loading plate 3 is provided with an arc groove 5 corresponding to the wafer 100, and the side walls of the two arc grooves 5 are arranged opposite to each other. When the wafer 100 is embedded in the arc groove 5, the lower surface of the wafer 100 overlaps and contacts the bottom surfaces of the two arc grooves 5.

[0030] The base 6 is fixedly mounted on a bottom plate 12 , which has a through hole 121 . The housing 111 of the vertical transmission assembly passes through the through hole 121 . One end of the base 6 on which the adjustment motor 7 is mounted extends above the through hole 121 .

[0031] The above-mentioned sensor is a reflective sensor.

[0032] When the sensor receives the reflection signal from the wafer, the vacuum generator is first started, and then the motor is controlled to drive the turntable to rotate.

[0033] A straight-edge notch 101 is formed on the circular wafer 100 .

[0034] The vacuum generator is arranged below the regulating motor 7 .

[0035] Example 2: A vertical wafer handling device, comprising: a substrate 1 mounted on a movable bracket 10, a front loading plate 2 and a rear loading plate 3 mounted on the upper surface of the substrate 1, and a base 6 disposed below the substrate 1; the movable bracket 10 is mounted on a vertical conveying assembly, and the vertical conveying assembly comprises: a vertically extending housing 111, a screw 112 rotatably mounted on the housing 111, and a movable nut 113 sleeved on the screw 112; an output shaft of a drive motor 114 mounted on the lower end of the housing 111 is connected to the lower end of the screw 112, and the movable bracket 10 is mounted on the movable nut 113;

[0036] After the angle of the wafer is adjusted and corrected, the vertical transfer assembly drives the movable bracket upward again, and the wafer is transferred to the front and rear loading plates and lifted to a certain height to facilitate subsequent wafer transfer processing;

[0037] An adjustment motor 7 is provided below one end of the base 6. The output shaft of the adjustment motor 7 extends vertically to the top of the base 6 and is connected to a turntable 8 provided between the front loading plate 2 and the rear loading plate 3. A cavity 81 is defined within the turntable 8. A plurality of vacuum adsorption holes 82 are provided on the upper surface of the turntable 8 for overlapping contact with the lower surface of the wafer, each of which is connected to the cavity 81. A vacuum generator is connected to the cavity 81 via a pipeline 83.

[0038] When the movable bracket 10 moves to the first position along with the vertical conveying assembly, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 8. When the movable bracket 10 moves to the second position along with the vertical conveying assembly, the upper surface of the turntable 8 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 9 is installed on the upper surface of the other end of the base 6 and located outside the turntable 8. A notch 101 corresponding to the sensor 9 is formed on the wafer 100. The sensor 9 is electrically connected to the adjustment motor 7 and the vacuum generator.

[0039] If the notch on the wafer is directly above the sensor, it means that the wafer position is accurate; otherwise, the wafer will block the sensor. At this time, the sensor will send the received induction signal to the PLC. The PLC first starts the vacuum generator to generate vacuum, adsorbs and positions the wafer through the vacuum adsorption hole, and then controls the motor to rotate a certain angle, thereby realizing the angle adjustment of the wafer on the turntable rotating with the motor output shaft. During this process, the wafer will not deflect relative to the turntable, ensuring the position accuracy of the wafer after angle adjustment.

[0040] The upper surface of each of the front loading plate 2 and the rear loading plate 3 is provided with an arc groove 5 corresponding to the wafer 100, and the side walls of the two arc grooves 5 are arranged opposite to each other. When the wafer 100 is embedded in the arc groove 5, the lower surface of the wafer 100 overlaps and contacts the bottom surfaces of the two arc grooves 5.

[0041] The base 6 is fixedly mounted on a bottom plate 12 , which has a through hole 121 . The housing 111 of the vertical transmission assembly passes through the through hole 121 . One end of the base 6 on which the adjustment motor 7 is mounted extends above the through hole 121 .

[0042] A straight-edge notch 101 is formed on the circular wafer 100 .

[0043] The front loading plate 2 and the rear loading plate 3 are both configured in a semicircular shape.

[0044] The sensor 9 is a reflection type sensor. When the sensor 9 receives a reflection signal from the wafer 100 , it controls the adjustment motor 7 to drive the turntable 8 to rotate.

[0045] The sensor 9 is mounted on the upper surface of the base 6 via a support 91 , and the upper end surface of the sensor 9 is lower than the upper surface of the turntable 8 .

[0046] The working principle of the present invention is as follows:

[0047] First, the vertical transport assembly drives the movable bracket upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket come into contact with the lower surface of the wafer, and the wafer is connected to the external pickup assembly.

[0048] Next, the vertical transfer assembly drives the movable bracket downward until the upper surfaces of the front and rear loading plates are lower than the upper surface of the turntable located therebetween. At this point, the wafer is transferred from the front and rear loading plates to the upper surface of the turntable.

[0049] Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer;

[0050] If the notch on the wafer is directly above the sensor, it indicates that the wafer is in the correct position. Otherwise, the wafer will block the sensor. At this time, the sensor will send the received induction signal to the PLC. The PLC will first start the vacuum generator to generate vacuum, adsorb and position the wafer through the vacuum adsorption holes, and then control the motor to rotate a certain angle, thereby achieving angle adjustment of the wafer on the turntable that rotates with the motor output shaft. During this process, the wafer will not deflect relative to the turntable, ensuring the position accuracy of the wafer after angle adjustment.

[0051] After adjusting and correcting the angle of the wafer, the vertical transfer assembly drives the movable bracket to move up again, and the wafer is transferred to the front and rear loading plates and lifted to a certain height to facilitate subsequent transfer processing of the wafer.

[0052] When using the above-mentioned vertical wafer handling equipment, it can not only realize the connection of wafers through the front and rear carriers, but also realize the position transfer of wafers between the carriers and the turntable through the up and down movement of the front and rear carriers, and realize the automatic detection and identification of the position of the wafer transferred to the turntable, and adjust the circumferential angle of the wafer through the rotation of the turntable to improve the position accuracy of the wafer. It can also effectively avoid additional position deviation of the wafer during the rotation of the turntable, and further ensure the position accuracy of the wafer after the angle adjustment.

[0053] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A vertical wafer handling device comprising: A substrate (1) mounted on a movable bracket (10), a front loading plate (2) and a rear loading plate (3) mounted on the upper surface of the substrate (1), and a base (6) arranged below the substrate (1), characterized in that: the movable bracket (10) is mounted on a vertical transmission assembly, the vertical transmission assembly comprises: a vertically extending shell (111), a screw rod (112) rotatably mounted on the shell (111) and a movable nut (113) sleeved on the screw rod (112), an output shaft of a drive motor (114) mounted on the lower end of the shell (111) is connected to the lower end of the screw rod (112), and the movable bracket (10) is mounted on the movable nut (113); An adjusting motor (7) is provided below one end of the base (6), and an output shaft of the adjusting motor (7) vertically extends to the top of the base (6) and is connected to a turntable (8) provided between the front loading plate (2) and the rear loading plate (3). A cavity (81) is provided in the turntable (8), and a plurality of vacuum adsorption holes (82) are provided on the upper surface of the turntable (8) for overlapping contact with the lower surface of the wafer, each of which is connected to the cavity (81). A vacuum generator is connected to the cavity (81) through a pipeline (83); When the movable bracket (10) moves to the first position along with the vertical conveying assembly, the upper surfaces of the front loading plate (2) and the rear loading plate (3) are higher than the upper surface of the turntable (8); when the movable bracket (10) moves to the second position along with the vertical conveying assembly, the upper surface of the turntable (8) is higher than the upper surfaces of the front loading plate (2) and the rear loading plate (3); at least one sensor (9) is installed on the upper surface of the other end of the base (6) and located outside the turntable (8); a notch (101) corresponding to the sensor (9) is formed on the wafer (100); and the sensor (9) is electrically connected to the adjustment motor (7) and the vacuum generator.

2. The vertical wafer handling equipment according to claim 1, wherein: The front loading plate (2) and the rear loading plate (3) each have an arc-shaped groove (5) corresponding to the wafer (100) on their upper surfaces, and the side walls of the two arc-shaped grooves (5) are arranged opposite to each other. When the wafer (100) is embedded in the arc-shaped groove (5), the lower surface of the wafer (100) is in overlapping contact with the bottom surfaces of the two arc-shaped grooves (5).

3. The vertical wafer handling equipment according to claim 1, wherein: The base (6) is fixedly mounted on a bottom plate (12). A position-avoiding through hole (121) is formed on the bottom plate (12). The housing (111) of the vertical transmission component passes through the position-avoiding through hole (121). One end of the regulating motor (7) mounted on the base (6) extends above the position-avoiding through hole (121).

4. The vertical wafer handling device according to claim 1, wherein: The sensor is a reflective sensor.

5. The vertical wafer handling equipment according to claim 4, characterized in that: When the sensor receives the reflected signal from the wafer, it first starts the vacuum generator and then controls the adjustment motor to drive the turntable to rotate.

6. The vertical wafer handling equipment according to claim 1, wherein: A straight-edge notch (101) is formed on the circular wafer (100).

7. The vertical wafer transport device according to claim 1, characterized in that: The vacuum generator is arranged below the regulating motor (7).

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