Wafer connection device

Abstract

The invention discloses a wafer connection device which comprises a movable support capable of moving in the vertical direction and a fixedly-arranged base, a base plate is installed on the upper surface of the movable support, and a front carrying plate and a rear carrying plate are movably installed on the upper surface of the base plate through at least one set of sliding rails and sliding blocks. A motor is installed on the lower surface of the base plate and located between the front carrying plate and the rear carrying plate, the upper end of an output shaft of the motor penetrates through the base plate and is sequentially provided with a first cam and a second cam, and an adjusting motor is arranged below one end of the base. An output shaft of the adjusting motor vertically extends to the position above the base and is connected with a rotary disc arranged between the front carrying plate and the rear carrying plate. According to the invention, connection and position transfer of the wafer are realized, automatic detection, identification and adjustment of the position of the wafer are realized, centering adjustment and clamping positioning of the wafer are carried out while connection is realized, and deviation of the position of the wafer after centering and angle correction is avoided.

Description

Technical Field

[0001] The invention relates to a wafer connection device and belongs to the technical field of wafer testing. Background Art

[0002] The wafer clamping is generally divided into two methods: clamping the wafer by driving the clamping parts through contact and clamping the wafer by the centrifugal force of the parts during the rotation of the clamping mechanism.

[0003] When the prior art uses clamping parts to clamp wafers, it is usually necessary to manually take over the wafer and transfer it to the clamping equipment. However, the wafer is prone to angle and position deviation during the material receiving and transfer process, resulting in different subsequent clamping positions affecting subsequent processing. The position and angle of the connected wafer need to be adjusted before clamping. Moreover, when rotating the wafer to adjust the angle, if it is not fixed, it is easy to cause the adjusted position of the wafer to shift again. Summary of the invention

[0004] The object of the present invention is to provide a wafer docking device, which can realize the docking and position transfer of wafers, automatically detect, identify and adjust the position of wafers, and center and clamp the wafers while realizing docking, so as to avoid the position of wafers being offset after centering and angle correction.

[0005] To achieve the above-mentioned object, the technical solution adopted by the present invention is: a wafer docking device, comprising: a movable bracket movable in the vertical direction and a fixed base, a base plate is installed on the upper surface of the movable bracket, the base plate is arranged below the base plate, a front loading plate and a rear loading plate are movably installed on the upper surface of the base plate through at least one set of slide rails and sliders, and an arc groove corresponding to the wafer is provided on the upper surface of each of the front loading plate and the rear loading plate, and the side walls of the two arc grooves are arranged opposite to each other; A motor is installed on the lower surface of the substrate and located between the front loading plate and the rear loading plate. The upper end of the motor output shaft passes through the substrate and is sequentially installed with a first cam and a second cam. The first cam and the second cam are arranged at intervals in the vertical direction and differ by 180° in the circumferential direction. A first bearing matched with the first cam is installed on the front loading plate, and a second bearing matched with the second cam is installed on the rear loading plate. At least one spring is connected between the front loading plate and the rear loading plate, so that the protrusion of the first cam and the first bearing, and the protrusion of the second cam and the second bearing are kept in contact. An adjusting motor is arranged below one end of the base, and the output shaft of the adjusting motor extends vertically to the top of the base and is connected to a turntable arranged between the front loading plate and the rear loading plate. When the movable bracket moves to a first position in the vertical direction, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable. When the movable bracket moves to a second position in the vertical direction, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate. At least one sensor is installed on the upper surface of the other end of the base and located on the outside of the turntable. A notch corresponding to the sensor is formed on the wafer, and the sensor is electrically connected to the adjusting motor.

[0006] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, the movable bracket is installed on a vertical conveying assembly, and the vertical conveying assembly includes: a vertically extending shell, a screw rod rotatably installed on the shell and a movable nut sleeved on the screw rod, an output shaft of a driving motor installed on the lower end of the shell is connected to the lower end of the screw rod, and the movable bracket is installed on the movable nut.

[0007] 2. In the above solution, a straight-edge notch is formed on the circular wafer.

[0008] 3. In the above solution, the sensor is a reflective sensor. When the sensor receives a reflection signal from the wafer, the sensor controls the motor to drive the turntable to rotate.

[0009] 4. In the above scheme, the front loading plate and the rear loading plate are both configured as semicircular rings.

[0010] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The wafer docking device of the present invention has an adjusting motor disposed below one end of its base, the output shaft of the adjusting motor vertically extending to the top of the base and connected to a turntable disposed between the front loading plate and the rear loading plate. When the movable bracket moves to the first position in the vertical direction, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable. When the movable bracket moves to the second position in the vertical direction, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate. At least one sensor is installed on the upper surface of the other end of the base and located on the outer side of the turntable. A notch corresponding to the sensor is formed on the wafer. The sensor is electrically connected to the adjusting motor. The wafer can be docked through the front and rear loading plates, and the position of the wafer between the loading plate and the turntable can be transferred by the up and down movement of the front and rear loading plates. The wafer position transferred to the turntable can also be automatically detected and identified, and the circumferential angle of the wafer can be adjusted by the rotation of the turntable to improve the position accuracy of the wafer. Furthermore, its substrate A front loading plate and a rear loading plate are movably mounted on the upper surface of the substrate through at least one set of slide rails and sliders, a motor is mounted on the lower surface of the substrate and located between the front loading plate and the rear loading plate, the upper end of the motor output shaft passes through the substrate and is sequentially mounted with a first cam and a second cam, the first cam and the second cam spaced apart in the vertical direction are 180° apart in the circumferential direction, a first bearing matched with the first cam is mounted on the front loading plate, a second bearing matched with the second cam is mounted on the rear loading plate, at least one spring is connected between the front loading plate and the rear loading plate, so that the raised portion of the first cam is in contact with the first bearing, and the raised portion of the second cam is in contact with the second bearing, through the synchronous relative movement of the two loading plates, the position of the wafer is centered and adjusted while the wafer is docked, thereby improving the accuracy of the subsequent angle correction of the wafer, and the wafer can also be clamped and positioned during the movement of the wafer, thereby avoiding the position of the wafer after centering and angle correction from being offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Attached Figure 1 It is a structural schematic diagram of the wafer docking device of the present invention; Attached Figure 2 The partial structure diagram of the wafer docking device of the present invention is shown in FIG. Figure 1 ; Attached Figure 3 The partial structure diagram of the wafer docking device of the present invention is shown in FIG. Figure 2 .

[0012] In the above drawings: 100, wafer; 101, notch; 1, substrate; 2, front loading plate; 3, rear loading plate; 41, slide rail; 42, slider; 5, arc groove; 51, arc protrusion; 52, second arc groove; 6, motor; 71, first cam; 72, second cam; 73, pin; 81, first bearing; 82, second bearing; 83, mounting rod; 9, spring; 10, base; 11, adjustment motor; 12, turntable; 13, sensor; 131, support; 14, movable bracket; 151, housing; 152, screw rod; 153, movable nut; 154, drive motor; 16, bottom plate; 161, avoidance through hole. Implementation

[0013] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0014] Embodiment 1: A wafer docking device comprises: a movable support 14 movable in a vertical direction and a fixed base 10, a substrate 1 is mounted on the upper surface of the movable support 14, the base 10 is arranged below the substrate 1, a front loading plate 2 and a rear loading plate 3 are movably mounted on the upper surface of the substrate 1 through at least one set of slide rails 11 and sliders 12, the upper surface of each of the front loading plate 2 and the rear loading plate 3 is provided with an arc groove 5 corresponding to the wafer 100, and the side walls of the two arc grooves 5 are arranged opposite to each other; First, the vertical conveying assembly drives the movable bracket to move upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket contact the lower surface of the wafer, and the wafer is connected from the external pickup assembly; A motor 6 is installed on the lower surface of the base plate 1 and is located between the front loading plate 2 and the rear loading plate 3. The upper end of the output shaft of the motor 6 passes through the base plate 1 and is sequentially installed with a first cam 71 and a second cam 72. The first cam 71 and the second cam 72 are arranged at intervals in the vertical direction and differ by 180° in the circumferential direction. A first bearing 81 matched with the first cam 71 is installed on the front loading plate 2, and a second bearing 82 matched with the second cam 72 is installed on the rear loading plate 3. At least one spring 9 is connected between the front loading plate 2 and the rear loading plate 3, so that the raised portion of the first cam 71 and the first bearing 81, and the raised portion of the second cam 72 and the second bearing 82 maintain contact; At the same time, the two carrier plates always have a tendency to move towards each other under the action of the spring; Before the wafer contacts the carrier, the protrusions of the two cams rotating with the output shaft of the motor are rotated to be pressed and contacted with the corresponding bearings. At this time, the two carriers are in a state of being away from each other, which is convenient for the external pickup assembly to transport the wafer to the top of the arc grooves on the front carrier and the rear carrier, and release the wafer so that the lower surface of the wafer contacts the bottom surface of the arc grooves on the two carriers. An adjusting motor 11 is arranged below one end of the base 10, and the output shaft of the adjusting motor 11 vertically extends to the top of the base 10 and is connected to a turntable 12 arranged between the front loading plate 2 and the rear loading plate 3. When the movable bracket 14 moves to a first position in the vertical direction, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 12. When the movable bracket 14 moves to a second position in the vertical direction, the upper surface of the turntable 12 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 4 is installed on the upper surface of the other end of the base 10 and located outside the turntable 12. A notch 101 corresponding to the sensor 4 is formed on the wafer 100, and the sensor 4 is electrically connected to the adjusting motor 11. The vertical transfer assembly continues to drive the movable bracket to move downward until the upper surfaces of the front loading plate and the rear loading plate are lower than the upper surface of the turntable located therebetween, at which point the wafer is transferred from the front loading plate and the rear loading plate to the upper surface of the turntable; Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer; If the notch on the wafer is directly above the sensor, it means that the wafer is in the correct position; otherwise, the wafer will block the sensor. At this time, the sensor will send the received sensing signal to the PLC to control the motor to rotate a certain angle, thereby achieving angle adjustment of the wafer on the turntable that rotates with the motor output shaft.

[0015] The movable bracket 14 is mounted on a vertical conveying assembly, which includes a vertically extending housing 151, a screw rod 152 rotatably mounted on the housing 151, and a movable nut 15 sleeved on the screw rod 152. An output shaft of a driving motor 154 mounted on the lower end of the housing 151 is connected to the lower end of the screw rod 152, and the movable bracket 14 is mounted on the movable nut 15. The vertical transfer assembly drives the movable bracket to move up to a certain height to facilitate the subsequent transfer processing of the wafer.

[0016] The wafer 100 having a circular body is provided with a straight-edge notch 101 .

[0017] The sensor 13 is a reflection type sensor. When the sensor 13 receives a reflection signal from the wafer 100 , the sensor 13 controls the adjustment motor 11 to drive the turntable 12 to rotate.

[0018] The front loading plate 32 and the rear loading plate 33 are both configured in a semicircular ring shape.

[0019] The front loading plate 32 and the rear loading plate 33 arranged opposite to each other can approach each other or move away from each other. When the wafer 100 is embedded in the arc groove 35, the lower surface of the wafer 100 overlaps and contacts the bottom surfaces of the two arc grooves 35, and when the front loading plate 32 and the rear loading plate 33 approach each other, the outer surface of the wafer 100 contacts the side walls of the two arc grooves 35.

[0020] The bottom surface of each of the two arc grooves 35 is provided with a second arc groove 352 for the wafer 100 to be embedded. The second arc groove and the arc groove can respectively allow wafers of different sizes to be embedded, thereby improving versatility. There are two sensors 13 and they are arranged at intervals along the radial direction of the turntable 12.

[0021] Embodiment 2: A wafer docking device, comprising: a movable bracket 14 movable in a vertical direction and a fixed base 10, a substrate 1 being mounted on the upper surface of the movable bracket 14, the base 10 being disposed below the substrate 1, a front loading plate 2 and a rear loading plate 3 being movably mounted on the upper surface of the substrate 1 through at least one set of slide rails 11 and sliders 12, the upper surface of each of the front loading plate 2 and the rear loading plate 3 being provided with an arc groove 5 corresponding to the wafer 100, and the side walls of the two arc grooves 5 being disposed opposite to each other; A motor 6 is installed on the lower surface of the base plate 1 and is located between the front loading plate 2 and the rear loading plate 3. The upper end of the output shaft of the motor 6 passes through the base plate 1 and is sequentially installed with a first cam 71 and a second cam 72. The first cam 71 and the second cam 72 are arranged at intervals in the vertical direction and differ by 180° in the circumferential direction. A first bearing 81 matched with the first cam 71 is installed on the front loading plate 2, and a second bearing 82 matched with the second cam 72 is installed on the rear loading plate 3. At least one spring 9 is connected between the front loading plate 2 and the rear loading plate 3, so that the raised portion of the first cam 71 and the first bearing 81, and the raised portion of the second cam 72 and the second bearing 82 maintain contact; The output shaft of the motor drives the two cams to rotate so that their respective recessed parts rotate toward the corresponding bearing direction. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, thereby clamping the wafer and performing preliminary position centering calibration on the wafer. An adjusting motor 11 is arranged below one end of the base 10, and the output shaft of the adjusting motor 11 vertically extends to the top of the base 10 and is connected to a turntable 12 arranged between the front loading plate 2 and the rear loading plate 3. When the movable bracket 14 moves to a first position in the vertical direction, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 12. When the movable bracket 14 moves to a second position in the vertical direction, the upper surface of the turntable 12 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 4 is installed on the upper surface of the other end of the base 10 and located outside the turntable 12. A notch 101 corresponding to the sensor 4 is formed on the wafer 100, and the sensor 4 is electrically connected to the adjusting motor 11. After the angle of the wafer is adjusted and corrected, the vertical transfer assembly drives the movable bracket to move upward again. After the wafer is transferred to the front loading plate and the rear loading plate again, the output shaft of the motor drives the two cams to rotate so that their respective recessed portions rotate toward the corresponding bearing directions. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves thereon are respectively squeezed and contacted with the outer wall of the wafer, thereby clamping the wafer again and performing a second position alignment calibration on the wafer.

[0022] The movable bracket 14 is mounted on a vertical conveying assembly, which includes a vertically extending housing 151, a screw rod 152 rotatably mounted on the housing 151, and a movable nut 15 sleeved on the screw rod 152. An output shaft of a driving motor 154 mounted on the lower end of the housing 151 is connected to the lower end of the screw rod 152, and the movable bracket 14 is mounted on the movable nut 15. After the initial alignment, the vertical transmission assembly drives the movable bracket to move downward so that the lower surface of the wafer contacts the upper surface of the turntable. At this time, the raised parts of the two cams that rotate with the output shaft of the motor are rotated until they are in extrusion contact with the corresponding bearings. At this time, the two carriers are in a state of moving away from each other and the wafer is released.

[0023] The wafer 100 having a circular body is provided with a straight-edge notch 101 .

[0024] A vertically arranged pin 73 is connected between the above-mentioned first cam 71 and the second cam 72 to prevent relative rotation between the two cams, which may cause the two carriers to move asynchronously and damage the wafer clamped therein; the above-mentioned first bearing 81 and second bearing 82 are respectively installed on the front carrier 2 and the rear carrier 3 through a mounting rod 8, and the other end of the mounting rod 8, one end of which is connected to the lower surface of the front carrier 2 and the rear carrier 3, is rotatably installed with the first bearing 81 and the second bearing 82.

[0025] The sensor 13 is mounted on the upper surface of the base 10 via a support 131 , and the upper end surface of the sensor 13 is lower than the upper surface of the turntable 12 .

[0026] The base 10 is fixedly mounted on a bottom plate 16 , which has a through hole 161 , through which the housing 151 of the vertical transmission assembly passes. One end of the base 10 on which the adjustment motor 11 is mounted extends to above the through hole 161 .

[0027] The working principle of the present invention is as follows: First, the vertical conveying assembly drives the movable bracket to move upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket contact the lower surface of the wafer, and the wafer is connected from the external pickup assembly; At the same time, the two carrier plates always have a tendency to move towards each other under the action of the spring; Before the wafer contacts the carrier, the protrusions of the two cams rotating with the output shaft of the motor are rotated to be pressed and contacted with the corresponding bearings. At this time, the two carriers are in a state of being away from each other, which is convenient for the external pickup assembly to transport the wafer to the top of the arc grooves on the front carrier and the rear carrier, and release the wafer so that the lower surface of the wafer contacts the bottom surface of the arc grooves on the two carriers. Next, the output shaft of the motor drives the two cams to rotate so that their respective recessed parts rotate toward the corresponding bearing direction. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, thereby clamping the wafer and performing preliminary position centering calibration on the wafer. Next, the vertical conveying assembly drives the movable bracket to move downward so that the lower surface of the wafer contacts the upper surface of the turntable. At this time, the protrusions of the two cams rotating with the output shaft of the motor are rotated to be pressed and contacted with the corresponding bearings. At this time, the two carriers are in a state of moving away from each other and the wafer is released. The vertical transfer assembly continues to drive the movable bracket to move downward until the upper surfaces of the front loading plate and the rear loading plate are lower than the upper surface of the turntable located therebetween, at which point the wafer is transferred from the front loading plate and the rear loading plate to the upper surface of the turntable; Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer; If the notch on the wafer is located directly above the sensor, it means that the wafer is in the correct position; otherwise, the wafer will block the sensor. At this time, the sensor sends the received sensing signal to the PLC to control the motor to rotate a certain angle, thereby achieving the angle adjustment of the wafer on the turntable that rotates with the motor output shaft; After the angle of the wafer is adjusted and corrected, the vertical conveying assembly drives the movable bracket to move up again. After the wafer is transferred to the front loading plate and the rear loading plate again, the output shaft of the motor drives the two cams to rotate so that their respective recessed parts rotate in the direction of the corresponding bearings. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves thereon are respectively pressed and contacted with the outer wall of the wafer, so that the wafer is clamped again and the wafer is calibrated for the second position centering. The vertical transfer assembly continues to drive the movable bracket to move up to a certain height to facilitate the subsequent transfer processing of the wafer.

[0028] When the above-mentioned wafer docking device is used, it can not only realize the docking of wafers through the front and rear carriers, but also realize the position transfer of wafers between the carrier and the turntable through the up and down movement of the front and rear carriers, and can also realize automatic detection and identification of the position of the wafer transferred to the turntable, and adjust the circumferential angle of the wafer through the rotation of the turntable, thereby improving the position accuracy of the wafer; further, it realizes the docking of the wafer and the centering adjustment of the position of the wafer at the same time through the synchronous relative movement of the two carriers, thereby improving the accuracy of the subsequent angle correction of the wafer, and can also clamp and position the wafer during the movement of the wafer, thereby avoiding the position of the wafer after centering and angle correction.

[0029] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer docking device, comprising: A movable bracket (14) movable in a vertical direction and a fixed base (10), wherein a substrate (1) is mounted on the upper surface of the movable bracket (14), and the base (10) is arranged below the substrate (1), characterized in that a front loading plate (2) and a rear loading plate (3) are movably mounted on the upper surface of the substrate (1) via at least one set of slide rails (11) and sliders (12), and an arc groove (5) corresponding to the wafer (100) is formed on the upper surface of each of the front loading plate (2) and the rear loading plate (3), and the side walls of the two arc grooves (5) are arranged opposite to each other; A motor (6) is installed on the lower surface of the base plate (1) and located between the front loading plate (2) and the rear loading plate (3); the upper end of the output shaft of the motor (6) passes through the base plate (1) and is sequentially installed with a first cam (71) and a second cam (72); the first cam (71) and the second cam (72) are arranged at intervals in the vertical direction and are 180° apart in the circumferential direction; a first bearing (81) matched with the first cam (71) is installed on the front loading plate (2); a second bearing (82) matched with the second cam (72) is installed on the rear loading plate (3); at least one spring (9) is connected between the front loading plate (2) and the rear loading plate (3) so that the raised portion of the first cam (71) and the first bearing (81), and the raised portion of the second cam (72) and the second bearing (82) maintain contact; An adjusting motor (11) is arranged below one end of the base (10); an output shaft of the adjusting motor (11) vertically extends to the top of the base (10) and is connected to a turntable (12) arranged between the front loading plate (2) and the rear loading plate (3); when the movable bracket (14) moves to a first position in the vertical direction, the upper surfaces of the front loading plate (2) and the rear loading plate (3) are higher than the upper surface of the turntable (12); when the movable bracket (14) moves to a second position in the vertical direction, the upper surface of the turntable (12) is higher than the upper surfaces of the front loading plate (2) and the rear loading plate (3); at least one sensor (4) is installed on the upper surface of the other end of the base (10) and located outside the turntable (12); a notch (101) corresponding to the sensor (4) is formed on the wafer (100); and the sensor (4) is electrically connected to the adjusting motor (11).

2. The wafer docking device according to claim 1, characterized in that: The movable bracket (14) is mounted on a vertical conveying assembly, which comprises: a vertically extending shell (151), a screw rod (152) rotatably mounted on the shell (151), and a movable nut (15) sleeved on the screw rod (152); an output shaft of a driving motor (154) mounted on the lower end of the shell (151) is connected to the lower end of the screw rod (152), and the movable bracket (14) is mounted on the movable nut (15).

3. The wafer docking device according to claim 1, characterized in that: A straight-edge notch (101) is formed on the circular wafer (100).

4. The wafer docking device according to claim 1, characterized in that: The sensor (13) is a reflection type sensor, and when the sensor (13) receives a reflection signal from the wafer (100), the adjustment motor (11) is controlled to drive the turntable (12) to rotate.

5. The wafer docking device according to claim 1, characterized in that: The front loading plate (32) and the rear loading plate (33) are both arranged in a semicircular ring shape.

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