Wafer docking device

Abstract

The present invention discloses a wafer docking device, comprising: a movable bracket that can move in the vertical direction and a fixed base, the upper surface of the movable bracket is mounted with a base plate, the upper surface of the base plate is movably mounted with a front loading plate and a rear loading plate through at least one set of slide rails and sliders, the lower surface of the base plate is mounted with a motor located between the front loading plate and the rear loading plate, the upper end of the motor output shaft passes through the base plate and is sequentially mounted with a first cam and a second cam, an adjustment motor is arranged below one end of the base, the output shaft of the adjustment motor extends vertically to the top of the base and is connected to a turntable arranged between the front loading plate and the rear loading plate. The present invention not only realizes the docking and position transfer of wafers, but also realizes the automatic detection, identification and adjustment of the wafer position, and also performs centering adjustment and clamping positioning on the wafer while realizing docking, so as to avoid the position of the wafer being offset after centering and angle correction.

Description

Technical Field

[0001] The invention relates to a wafer connecting device and belongs to the technical field of wafer testing. Background Art

[0002] Wafer clamping is generally divided into two methods: clamping the wafer by driving the clamping parts through contact and clamping the wafer by the centrifugal force of the parts during the rotation of the clamping mechanism.

[0003] In the existing technology, when using clamping parts to clamp wafers, it is usually necessary to manually take over the wafers and transfer them to the clamping equipment. However, during the process of receiving and transferring the materials, the wafers are prone to angle and position deviations, resulting in different subsequent clamping positions affecting subsequent processing. The position and angle of the connected wafers need to be adjusted before clamping. Moreover, when rotating the wafer to adjust the angle, if it is not fixed, it is easy for the adjusted position of the wafer to shift again. Summary of the Invention

[0004] The purpose of the present invention is to provide a wafer docking device, which can realize the docking and position transfer of wafers, automatically detect, identify and adjust the position of wafers, and center and clamp the wafers while realizing docking, so as to avoid the position of wafers being offset after centering and angle correction.

[0005] To achieve the above-mentioned object, the present invention adopts a technical solution: a wafer docking device comprising: a movable support movable in a vertical direction and a fixed base, wherein a base plate is mounted on the upper surface of the movable support, and the base plate is disposed below the base plate, and a front loading plate and a rear loading plate are movably mounted on the upper surface of the base plate via at least one set of slide rails and sliders, wherein the upper surface of each of the front loading plate and the rear loading plate is provided with an arcuate groove corresponding to the wafer, and the side walls of the two arcuate grooves are disposed opposite each other;

[0006] A motor is mounted on the lower surface of the base plate and located between the front loading plate and the rear loading plate. The upper end of the motor output shaft passes through the base plate and is sequentially mounted with a first cam and a second cam. The first cam and the second cam are spaced apart in the vertical direction and are 180° apart in the circumferential direction. A first bearing that cooperates with the first cam is mounted on the front loading plate, and a second bearing that cooperates with the second cam is mounted on the rear loading plate. At least one spring is connected between the front loading plate and the rear loading plate to ensure that the raised portion of the first cam maintains contact with the first bearing, and the raised portion of the second cam maintains contact with the second bearing.

[0007] An adjusting motor is provided below one end of the base, and an output shaft of the adjusting motor extends vertically to the top of the base and is connected to a turntable provided between the front loading plate and the rear loading plate. When the movable bracket moves to a first position in the vertical direction, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable. When the movable bracket moves to a second position in the vertical direction, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate. At least one sensor is installed on the upper surface of the other end of the base and located on the outside of the turntable. A notch corresponding to the sensor is formed on the wafer, and the sensor is electrically connected to the adjusting motor.

[0008] The further improved scheme in the above technical scheme is as follows:

[0009] 1. In the above scheme, the movable bracket is mounted on a vertical conveying assembly, which includes: a vertically extending shell, a screw rotatably mounted on the shell, and a movable nut sleeved on the screw, an output shaft of a drive motor mounted on the lower end of the shell is connected to the lower end of the screw, and the movable bracket is mounted on the movable nut.

[0010] 2. In the above solution, a straight-edge notch is formed on the circular wafer.

[0011] 3. In the above solution, the sensor is a reflective sensor. When the sensor receives a reflection signal from the wafer, it controls the adjustment motor to drive the turntable to rotate.

[0012] 4. In the above solution, the front loading plate and the rear loading plate are both configured as semicircular rings.

[0013] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0014] The wafer docking device of the present invention has an adjusting motor provided at the bottom of one end of the base, and the output shaft of the adjusting motor extends vertically to the top of the base and is connected to the turntable provided between the front loading plate and the rear loading plate. When the movable bracket moves in the vertical direction to the first position, the upper surfaces of the front loading plate and the rear loading plate are higher than the upper surface of the turntable. When the movable bracket moves in the vertical direction to the second position, the upper surface of the turntable is higher than the upper surfaces of the front loading plate and the rear loading plate. At least one sensor is installed on the upper surface of the other end of the base and located on the outer side of the turntable. A notch corresponding to the sensor is formed on the wafer, and the sensor is electrically connected to the adjusting motor. The wafer can be docked by the front and rear loading plates, and the position transfer of the wafer between the loading plate and the turntable can be achieved by the up and down movement of the front and rear loading plates. The automatic detection and recognition of the position of the wafer transferred to the turntable can also be achieved, and the circumferential angle of the wafer can be adjusted by the rotation of the turntable to improve the position accuracy of the wafer. Furthermore, its substrate The upper surface of the base is movably mounted with a front loading plate and a rear loading plate through at least one set of slide rails and sliders, and a motor is mounted on the lower surface of the base plate and located between the front loading plate and the rear loading plate, the upper end of the motor output shaft passes through the base plate and is sequentially mounted with a first cam and a second cam, the first cam and the second cam spaced apart in the vertical direction are 180° apart in the circumferential direction, a first bearing cooperating with the first cam is mounted on the front loading plate, and a second bearing cooperating with the second cam is mounted on the rear loading plate, at least one spring is connected between the front loading plate and the rear loading plate, so that the protrusion of the first cam maintains contact with the first bearing, and the protrusion of the second cam maintains contact with the second bearing, through the synchronous relative movement of the two loading plates, the position of the wafer is centered and adjusted while the wafer is docked, thereby improving the accuracy of the subsequent angle correction of the wafer, and the wafer can also be clamped and positioned during the movement of the wafer to avoid position deviation of the wafer after centering and angle correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Attachment Figure 1 It is a structural schematic diagram of the wafer docking device of the present invention;

[0016] Attachment Figure 2 Schematic diagram of the partial structure of the wafer docking device of the present invention Figure 1 ;

[0017] Attachment Figure 3 Schematic diagram of the partial structure of the wafer docking device of the present invention Figure 2 .

[0018] In the above drawings: 100, wafer; 101, notch; 1, substrate; 2, front loading plate; 3, rear loading plate; 41, slide rail; 42, slider; 5, arc groove; 51, arc protrusion; 52, second arc groove; 6, motor; 71, first cam; 72, second cam; 73, pin; 81, first bearing; 82, second bearing; 83, mounting rod; 9, spring; 10, base; 11, adjustment motor; 12, turntable; 13, sensor; 131, support; 14, movable bracket; 151, housing; 152, screw rod; 153, movable nut; 154, drive motor; 16, bottom plate; 161, avoidance hole. DETAILED DESCRIPTION

[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0020] Embodiment 1: A wafer docking device comprises: a movable support 14 movable in a vertical direction and a fixed base 10, wherein a base plate 1 is mounted on the upper surface of the movable support 14, and the base 10 is disposed below the base plate 1. A front loading plate 2 and a rear loading plate 3 are movably mounted on the upper surface of the base plate 1 via at least one set of slide rails 41 and sliders 42, respectively. The upper surface of each of the front loading plate 2 and the rear loading plate 3 is provided with an arcuate groove 5 corresponding to the wafer 100, and the side walls of the two arcuate grooves 5 are disposed opposite each other;

[0021] First, the vertical transport assembly drives the movable bracket upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket come into contact with the lower surface of the wafer, and the wafer is connected to the external pickup assembly.

[0022] A motor 6 is mounted on the lower surface of the base plate 1 and located between the front loading plate 2 and the rear loading plate 3. The upper end of the output shaft of the motor 6 passes through the base plate 1 and is sequentially mounted with a first cam 71 and a second cam 72. The first cam 71 and the second cam 72 are spaced apart in the vertical direction and circumferentially differ by 180°. A first bearing 81 that cooperates with the first cam 71 is mounted on the front loading plate 2, and a second bearing 82 that cooperates with the second cam 72 is mounted on the rear loading plate 3. At least one spring 9 is connected between the front loading plate 2 and the rear loading plate 3 to ensure that the raised portion of the first cam 71 maintains contact with the first bearing 81, and the raised portion of the second cam 72 maintains contact with the second bearing 82.

[0023] At the same time, the two carrier plates always have a tendency to move towards each other under the action of the spring;

[0024] Before the wafer contacts the carrier, the raised portions of the two cams rotating with the motor's output shaft are rotated until they come into contact with the corresponding bearings. At this point, the two carriers are facing away from each other, making it easier for an external pickup assembly to transport the wafer to the top of the arc-shaped slots on the front and rear carriers. The wafer is then released, allowing the lower surface of the wafer to contact the bottom surfaces of the arc-shaped slots on the two carriers.

[0025] An adjusting motor 11 is provided below one end of the base 10, and the output shaft of the adjusting motor 11 extends vertically to the top of the base 10 and is connected to a turntable 12 provided between the front loading plate 2 and the rear loading plate 3. When the movable bracket 14 moves to a first position in the vertical direction, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 12. When the movable bracket 14 moves to a second position in the vertical direction, the upper surface of the turntable 12 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 4 is installed on the upper surface of the other end of the base 10 and located outside the turntable 12. A notch 101 corresponding to the sensor 4 is formed on the wafer 100, and the sensor 4 is electrically connected to the adjusting motor 11.

[0026] The vertical transfer assembly continues to drive the movable bracket downward until the upper surfaces of the front and rear loading plates are lower than the upper surface of the turntable located therebetween. At this point, the wafer is transferred from the front and rear loading plates to the upper surface of the turntable.

[0027] Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer;

[0028] If the notch on the wafer is directly above the sensor, it means that the wafer position is accurate; otherwise, the wafer will block the sensor. At this time, the sensor will send the received sensing signal to the PLC, control the motor to rotate a certain angle, thereby realizing the angle adjustment of the wafer on the turntable rotating with the motor output shaft.

[0029] The movable bracket 14 is mounted on a vertical conveying assembly, which includes a vertically extending housing 151, a screw rod 152 rotatably mounted on the housing 151, and a movable nut 15 sleeved on the screw rod 152. The output shaft of a drive motor 154 mounted on the lower end of the housing 151 is connected to the lower end of the screw rod 152, and the movable bracket 14 is mounted on the movable nut 15.

[0030] The vertical transfer assembly drives the movable bracket to move up to a certain height to facilitate the subsequent transfer processing of the wafer.

[0031] A straight-edge notch 101 is formed on the circular wafer 100 .

[0032] The sensor 13 is a reflection type sensor. When the sensor 13 receives a reflection signal from the wafer 100 , it controls the adjustment motor 11 to drive the turntable 12 to rotate.

[0033] The front carrying plate 32 and the rear carrying plate 33 are both configured in a semicircular ring shape.

[0034] The front loading plate 32 and the rear loading plate 33 arranged opposite to each other can be moved closer to each other or farther away from each other. When the wafer 100 is embedded in the arc-shaped groove 35, the lower surface of the wafer 100 overlaps and contacts the bottom surfaces of the two arc-shaped grooves 35, and when the front loading plate 32 and the rear loading plate 33 are moved closer to each other, the outer surface of the wafer 100 contacts the side walls of the two arc-shaped grooves 35.

[0035] The bottom surface of each of the two arc-shaped grooves 35 is provided with a second arc-shaped groove 352 for the wafer 100 to be embedded. The second arc-shaped groove and the arc-shaped groove can respectively accommodate wafers of different sizes to improve versatility. There are two sensors 13 and they are arranged at intervals along the radial direction of the turntable 12.

[0036] Embodiment 2: A wafer docking device comprises: a movable support 14 movable in a vertical direction and a fixed base 10, wherein a base plate 1 is mounted on the upper surface of the movable support 14, and the base 10 is disposed below the base plate 1. A front loading plate 2 and a rear loading plate 3 are movably mounted on the upper surface of the base plate 1 via at least one set of slide rails 41 and sliders 42, respectively. The upper surface of each of the front loading plate 2 and the rear loading plate 3 is provided with an arcuate groove 5 corresponding to the wafer 100, and the side walls of the two arcuate grooves 5 are disposed opposite each other;

[0037] A motor 6 is mounted on the lower surface of the base plate 1 and located between the front loading plate 2 and the rear loading plate 3. The upper end of the output shaft of the motor 6 passes through the base plate 1 and is sequentially mounted with a first cam 71 and a second cam 72. The first cam 71 and the second cam 72 are spaced apart in the vertical direction and circumferentially differ by 180°. A first bearing 81 that cooperates with the first cam 71 is mounted on the front loading plate 2, and a second bearing 82 that cooperates with the second cam 72 is mounted on the rear loading plate 3. At least one spring 9 is connected between the front loading plate 2 and the rear loading plate 3 to ensure that the raised portion of the first cam 71 maintains contact with the first bearing 81, and the raised portion of the second cam 72 maintains contact with the second bearing 82.

[0038] The motor's output shaft drives the two cams, causing their respective recesses to rotate toward the corresponding bearings. At this point, the front and rear loading plates, acted upon by springs, move synchronously toward each other until the sidewalls of their two arc-shaped grooves come into contact with the outer walls of the wafer, clamping the wafer and performing preliminary centering calibration.

[0039] An adjusting motor 11 is provided below one end of the base 10, and the output shaft of the adjusting motor 11 extends vertically to the top of the base 10 and is connected to a turntable 12 provided between the front loading plate 2 and the rear loading plate 3. When the movable bracket 14 moves to a first position in the vertical direction, the upper surfaces of the front loading plate 2 and the rear loading plate 3 are higher than the upper surface of the turntable 12. When the movable bracket 14 moves to a second position in the vertical direction, the upper surface of the turntable 12 is higher than the upper surfaces of the front loading plate 2 and the rear loading plate 3. At least one sensor 4 is installed on the upper surface of the other end of the base 10 and located outside the turntable 12. A notch 101 corresponding to the sensor 4 is formed on the wafer 100, and the sensor 4 is electrically connected to the adjusting motor 11.

[0040] After the angle of the wafer is adjusted and corrected, the vertical transfer assembly drives the movable bracket to move upward again. After the wafer is transferred to the front loading plate and the rear loading plate again, the output shaft of the motor drives the two cams to rotate so that their respective recessed parts rotate toward the corresponding bearing direction. At this time, the front loading plate and the rear loading plate move toward each other synchronously under the action of the spring until the side walls of the two arc-shaped grooves on them are respectively squeezed into contact with the outer wall of the wafer, thereby clamping the wafer again and performing a second position alignment calibration on the wafer.

[0041] The movable bracket 14 is mounted on a vertical conveying assembly, which includes a vertically extending housing 151, a screw rod 152 rotatably mounted on the housing 151, and a movable nut 15 sleeved on the screw rod 152. The output shaft of a drive motor 154 mounted on the lower end of the housing 151 is connected to the lower end of the screw rod 152, and the movable bracket 14 is mounted on the movable nut 15.

[0042] After the initial alignment, the vertical transfer assembly drives the movable bracket downward so that the lower surface of the wafer contacts the upper surface of the turntable. At this time, the raised parts of the two cams that rotate with the output shaft of the motor are rotated until they are in squeeze contact with the corresponding bearings. At this time, the two carriers are in a back-to-back position and the wafer is released.

[0043] A straight-edge notch 101 is formed on the circular wafer 100 .

[0044] A vertically arranged pin 73 is connected between the above-mentioned first cam 71 and the second cam 72 to prevent relative rotation between the two cams, which may cause the two carriers to move asynchronously and damage the wafer clamped therein; the above-mentioned first bearing 81 and second bearing 82 are respectively installed on the front carrier 2 and the rear carrier 3 through a mounting rod 8, and the other end of the mounting rod 8, one end of which is connected to the lower surface of the front carrier 2 and the rear carrier 3, is rotatably mounted with the first bearing 81 and the second bearing 82.

[0045] The sensor 13 is mounted on the upper surface of the base 10 via a support 131 , and the upper end surface of the sensor 13 is lower than the upper surface of the turntable 12 .

[0046] The base 10 is fixedly mounted on a bottom plate 16 , which has a through hole 161 . The housing 151 of the vertical transmission assembly passes through the through hole 161 . One end of the base 10 on which the adjustment motor 11 is mounted extends above the through hole 161 .

[0047] The working principle of the present invention is as follows:

[0048] First, the vertical transport assembly drives the movable bracket upward, so that the upper surfaces of the front and rear loading plates mounted on the movable bracket come into contact with the lower surface of the wafer, and the wafer is connected to the external pickup assembly.

[0049] At the same time, the two carrier plates always have a tendency to move towards each other under the action of the spring;

[0050] Before the wafer contacts the carrier, the raised portions of the two cams rotating with the motor's output shaft are rotated until they come into contact with the corresponding bearings. At this point, the two carriers are facing away from each other, making it easier for an external pickup assembly to transport the wafer to the top of the arc-shaped slots on the front and rear carriers. The wafer is then released, allowing the lower surface of the wafer to contact the bottom surfaces of the arc-shaped slots on the two carriers.

[0051] Next, the motor's output shaft drives the two cams to rotate, causing their respective recesses to rotate toward the corresponding bearings. At this point, the front and rear loading plates, acted upon by springs, move synchronously toward each other until the sidewalls of their two arc-shaped grooves come into contact with the outer walls of the wafer, clamping the wafer and performing preliminary centering calibration.

[0052] Next, the vertical transfer assembly drives the movable bracket downward so that the lower surface of the wafer contacts the upper surface of the turntable. At this time, the raised portions of the two cams, which rotate with the output shaft of the motor, rotate until they come into contact with the corresponding bearings. At this point, the two carriers are in a position away from each other, releasing the wafer.

[0053] The vertical transfer assembly continues to drive the movable bracket downward until the upper surfaces of the front and rear loading plates are lower than the upper surface of the turntable located therebetween. At this point, the wafer is transferred from the front and rear loading plates to the upper surface of the turntable.

[0054] Since the position of the wafer may be shifted during the wafer transportation process, the sensor sends a sensing signal to detect the position of the notch on the wafer;

[0055] If the notch on the wafer is directly above the sensor, the wafer is correctly positioned. Otherwise, the wafer blocks the sensor. At this point, the sensor sends the received sensing signal to the PLC, which controls the motor to rotate a certain angle, thereby achieving angle adjustment of the wafer on the turntable that rotates with the motor output shaft.

[0056] After the wafer angle is adjusted and corrected, the vertical transfer assembly drives the movable bracket upward again. After the wafer is transferred to the front and rear loading plates, the output shaft of the motor drives the two cams to rotate, causing their respective recesses to rotate in the direction of the corresponding bearings. At this time, the front and rear loading plates move synchronously towards each other under the action of springs until the side walls of the two arc-shaped grooves on them respectively press against the outer walls of the wafer, thus clamping the wafer again and performing a second position calibration of the wafer.

[0057] The vertical transfer assembly continues to drive the movable bracket to move up to a certain height to facilitate the subsequent transfer processing of the wafer.

[0058] When the above-mentioned wafer docking device is used, it can not only realize the docking of wafers through the front and rear carriers, but also realize the position transfer of wafers between the carriers and the turntable through the up and down movement of the front and rear carriers. It can also realize automatic detection and identification of the position of the wafer transferred to the turntable, and adjust the circumferential angle of the wafer through the rotation of the turntable to improve the position accuracy of the wafer; further, it realizes the docking of the wafer and the centering adjustment of the position of the wafer at the same time through the synchronous relative movement of the two carriers, thereby improving the accuracy of the subsequent angle correction of the wafer, and can also clamp and position the wafer during the movement of the wafer to avoid the position of the wafer after centering and angle correction.

[0059] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A wafer docking device, comprising: A movable bracket (14) movable in a vertical direction and a fixed base (10), wherein a substrate (1) is mounted on the upper surface of the movable bracket (14), and the base (10) is arranged below the substrate (1), and is characterized in that a front loading plate (2) and a rear loading plate (3) are movably mounted on the upper surface of the substrate (1) via at least one set of slide rails (41) and sliders (42), and an arc groove (5) corresponding to the wafer (100) is provided on the upper surface of each of the front loading plate (2) and the rear loading plate (3), and the side walls of the two arc grooves (5) are arranged opposite to each other; A motor (6) is installed on the lower surface of the substrate (1) and is located between the front loading plate (2) and the rear loading plate (3). The upper end of the output shaft of the motor (6) passes through the substrate (1) and is sequentially installed with a first cam (71) and a second cam (72). The first cam (71) and the second cam (72) are spaced apart in the vertical direction and are 180 degrees apart in the circumferential direction. A first bearing (81) that cooperates with the first cam (71) is installed on the front loading plate (2), and a second bearing (82) that cooperates with the second cam (72) is installed on the rear loading plate (3). At least one spring (9) is connected between the front loading plate (2) and the rear loading plate (3), so that the raised portion of the first cam (71) and the first bearing (81), and the raised portion of the second cam (72) and the second bearing (82) maintain contact. An adjusting motor (11) is provided below one end of the base (10), and an output shaft of the adjusting motor (11) extends vertically to the top of the base (10) and is connected to a turntable (12) provided between the front loading plate (2) and the rear loading plate (3). When the movable bracket (14) moves to a first position in the vertical direction, the upper surface of the front loading plate (2) and the rear loading plate (3) are higher than the upper surface of the turntable (12). When the movable bracket (14) moves to a second position in the vertical direction, the upper surface of the turntable (12) is higher than the upper surface of the front loading plate (2) and the rear loading plate (3). At least one sensor (4) is installed on the upper surface of the other end of the base (10) and located outside the turntable (12). A notch (101) corresponding to the sensor (4) is formed on the wafer (100), and the sensor (4) is electrically connected to the adjusting motor (11).

2. The wafer docking device according to claim 1, wherein: The movable bracket (14) is mounted on a vertical conveying assembly, which includes: a vertically extending shell (151), a screw rod (152) rotatably mounted on the shell (151), and a movable nut (15) sleeved on the screw rod (152); an output shaft of a drive motor (154) mounted on the lower end of the shell (151) is connected to the lower end of the screw rod (152), and the movable bracket (14) is mounted on the movable nut (15).

3. The wafer docking device according to claim 1, wherein: A straight-edge notch (101) is formed on the circular wafer (100).

4. The wafer docking device according to claim 1, wherein: The sensor (13) is a reflection type sensor. When the sensor (13) receives a reflection signal from the wafer (100), the adjustment motor (11) is controlled to drive the turntable (12) to rotate.

5. The wafer docking device according to claim 1, wherein: The front loading plate (32) and the rear loading plate (33) are both arranged in a semicircular ring shape.

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