Preparation method of supporting assembly, supporting assembly, camera module and electronic equipment

Abstract

The invention provides a preparation method of a supporting assembly, the supporting assembly, a camera module and electronic equipment, which are used for reducing the size of an avoiding hole so as to be beneficial to realizing the miniaturization design of the camera module. The preparation method of the supporting assembly comprises the steps that a combination of a substrate, an environment sensor and a protection adhesive layer is provided, the environment sensor and the protection adhesive layer are both installed on the substrate, and the environment sensor is covered with the protection adhesive layer; forming a supporting piece on the substrate through injection molding, wherein the supporting piece covers the peripheral surface of the protective glue layer; and removing the protective adhesive layer.

Description

Technical Field

[0001] The present application relates to the field of camera technology, and in particular to a method for preparing a support component, a support component, a camera module and an electronic device. Background Art

[0002] With the continuous development of science and technology, electronic devices such as mobile phones are widely used in people's daily life and work, and have become indispensable daily necessities for people. In existing electronic devices, functional devices such as camera modules are often used to enrich the functions of electronic devices. In order to ensure the imaging quality of the camera module, a thermistor is usually set in the camera module, and a avoidance hole is set on the support of the camera module to avoid the environmental sensor, so that the environmental sensor is exposed to the air to detect environmental information. However, limited by the existing hole opening process, the size of the avoidance hole is often large, which is not conducive to the miniaturization design of the camera module. Summary of the invention

[0003] The present application provides a method for preparing a support assembly, a support assembly, a camera module and an electronic device, which are used to reduce the size of the avoidance hole to facilitate the miniaturization design of the camera module.

[0004] In a first aspect, the present application provides a method for preparing a support assembly, comprising:

[0005] Providing a combination of a substrate, an environmental sensor and a protective adhesive layer, wherein the environmental sensor and the protective adhesive layer are both mounted on the substrate, and the protective adhesive layer covers the environmental sensor;

[0006] Injection molding is performed on the substrate to form a support member, wherein the support member covers the peripheral surface of the protective rubber layer;

[0007] Remove the protective adhesive layer.

[0008] In the preparation method of the support component shown in the present application, the environmental sensor is first coated with a protective rubber layer, and then the support part is injection molded. The size of the avoidance hole can be controlled by controlling the thickness of the protective rubber layer, which can effectively reduce the opening size of the support part, help reduce the size of the support part, and further help to achieve a miniaturized design of the camera module.

[0009] In one embodiment, the melting point of the protective adhesive layer is greater than the injection molding temperature of the support member. During the process of injection molding the support member, the protective adhesive layer will not melt under the heat of the molten plastic liquid and cannot cover the environmental sensor, thereby ensuring the reliability of the subsequent formation of the avoidance hole.

[0010] In one embodiment, the melting point of the protective adhesive layer is greater than or equal to 250° C. It should be noted that during the injection molding process of the support member, the temperature of the molten plastic liquid is generally less than 250° C. The melting point of the protective adhesive layer is greater than or equal to 250° C. This ensures that the protective adhesive layer will not melt under the heat of the molten plastic liquid and cannot cover the environmental sensor, which helps to ensure the reliability of the subsequent formation of the avoidance hole.

[0011] In one embodiment, the step of providing a combination of a substrate, an environmental sensor, and a protective adhesive layer includes:

[0012] Provide substrates and environmental sensors;

[0013] mounting the environmental sensor on the substrate;

[0014] A protective adhesive layer covering the environmental sensor is formed on the substrate.

[0015] In one embodiment, the step of forming a protective adhesive layer covering the environmental sensor on the substrate includes:

[0016] The dispensing mold is mounted on the substrate, and the dispensing cavity of the dispensing mold accommodates the environmental sensor;

[0017] The dispensing syringe injects the protective glue from the dispensing port of the dispensing mold into the dispensing cavity until the protective glue covers the environmental sensor;

[0018] The protective glue in the glue dispensing cavity is solidified to form a protective glue layer.

[0019] In one embodiment, the step of providing a combination of a substrate, an environmental sensor, and a protective adhesive layer includes:

[0020] Providing a combination of an environmental sensor and a protective adhesive layer, and a substrate, wherein the protective adhesive layer covers the environmental sensor;

[0021] The combination of the environmental sensor and the protective adhesive layer is mounted on the substrate.

[0022] In one embodiment, the step of providing a combination of an environmental sensor and a protective adhesive layer includes:

[0023] Install the environmental sensor on the lower mold of the dispensing mold;

[0024] The upper mold of the dispensing mold is installed on the lower mold, wherein the upper mold and the lower mold are enclosed to form a dispensing cavity, and the dispensing cavity accommodates the environmental sensor;

[0025] The dispensing syringe injects the protective glue from the dispensing port of the dispensing mold into the dispensing cavity until the protective glue covers the environmental sensor;

[0026] The protective glue in the glue dispensing cavity is solidified to form a protective glue layer.

[0027] In one embodiment, the melting point of the protective adhesive layer is lower than the maximum tolerable temperature of the environmental sensor, and / or the melting point of the protective adhesive layer is lower than the maximum tolerable temperature of the substrate, so as to avoid the protective adhesive damaging the environmental sensor and the substrate during the formation of the protective adhesive layer, thereby helping to ensure the yield of the supporting assembly.

[0028] In one embodiment, in the step of removing the protective rubber layer, the protective rubber layer is removed by steam cleaning, ultrasonic cleaning or water cleaning.

[0029] In one embodiment, the thickness of the protective adhesive layer is between 0.15 mm and 0.2 mm to limit the aperture of the avoidance hole formed subsequently, ensuring that the distance between the hole wall of the avoidance hole of the support member formed subsequently and the environmental sensor is between 0.15 mm and 0.2 mm, which helps to reduce the size of the support member and realize the miniaturized design of the camera module.

[0030] In the second aspect, the present application provides a support assembly, including a substrate, a support member and an environmental sensor. The support member is installed on the substrate. The support member is provided with an avoidance hole. The avoidance hole penetrates the support member along the thickness direction of the support member. The environmental sensor is accommodated in the avoidance hole and is installed on the substrate and is spaced apart from the hole wall of the avoidance hole.

[0031] In the support assembly shown in the present application, the size of the avoidance hole is relatively small, that is, the opening size of the support member is reduced, which helps to reduce the size of the support member and further helps to achieve a miniaturized design of the camera module.

[0032] In a third aspect, the present application provides a camera module, comprising any one of the above-mentioned support components, a lens base and a lens, wherein the lens base is mounted on a surface of the support member facing away from the substrate, and the lens is mounted on the inner side of the lens base.

[0033] In the camera module shown in the present application, the size of the avoidance hole is relatively small, that is, the opening size of the support member is reduced, which helps to reduce the size of the support member and further helps to achieve a miniaturized design of the camera module.

[0034] In one embodiment, the support member is further provided with a light-through hole, which penetrates the support member along the thickness direction of the support member and is spaced apart from the avoidance hole;

[0035] The camera module also includes a filter, which is mounted on the support, covers the light hole, and is arranged opposite to the lens;

[0036] The supporting assembly also includes an image sensor, which is mounted on the substrate and arranged opposite to the filter.

[0037] The lens can converge the light outside the camera module. The converged external light can enter the filter from the light hole and be received by the image sensor after being filtered by the filter. The image sensor converts the light to form an image.

[0038] In a fourth aspect, the present application provides an electronic device, including a processor and the above-mentioned camera module, and the camera module is electrically connected to the processor.

[0039] In the electronic device shown in the present application, the size of the avoidance hole of the camera module is relatively small, that is, the opening size of the support member is reduced, which helps to reduce the size of the support member, helps to achieve a miniaturized design of the camera module, and further facilitates a lightweight design of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0041] Figure 1 It is a structural schematic diagram of an electronic device provided by this application;

[0042] Figure 2 yes Figure 1 A schematic diagram of the structure of a camera module in the electronic device shown;

[0043] Figure 3 yes Figure 2 The schematic diagram of the exploded structure of the camera module shown;

[0044] Figure 4 yes Figure 3 A schematic diagram of the structure of the support assembly in the camera module shown;

[0045] Figure 5 yes Figure 4 The cross-sectional structure diagram of the support assembly shown is after being cut along position II;

[0046] Figure 6 yes Figure 4 The cross-sectional structure diagram of the support assembly shown is after being cut along II-II;

[0047] Figure 7 is a process flow chart of a method for preparing a support assembly provided in the present application;

[0048] Figure 8 yes Figure 7 A schematic structural diagram of a combination of a substrate, an environmental sensor and a protective adhesive layer in the method for preparing the support assembly shown;

[0049] Fig. 9 yes Figure 8 The process flow chart of the preparation method of the combination of the substrate, the environmental sensor and the protective adhesive layer in the first embodiment;

[0050] Fig.10 yes Fig. 9 A schematic diagram of the structure of a substrate and an environmental sensor in a method for preparing a combination of the substrate, the environmental sensor and the protective adhesive layer;

[0051] Fig.11 yes Fig. 9 A schematic diagram of the structure in which the environmental sensor is installed on the substrate in the method for preparing the combination of the substrate, the environmental sensor and the protective adhesive layer;

[0052] Fig.12 yes Fig. 9 A process flow chart of forming a protective adhesive layer in the method for preparing a combination of a substrate, an environmental sensor and a protective adhesive layer;

[0053] Fig.13 yes Fig. 9 A schematic diagram of the structure of forming a protective adhesive layer in the method for preparing the combination of the substrate, the environmental sensor and the protective adhesive layer;

[0054] Fig.14 yes Figure 8 A process flow chart of a method for preparing a combination of a substrate, an environmental sensor and a protective adhesive layer in a second embodiment;

[0055] Fig.15 yes Fig.14 A schematic structural diagram of a combination of an environmental sensor and a protective adhesive layer, and a substrate in a method for preparing a combination of the substrate, the environmental sensor and the protective adhesive layer;

[0056] Fig.16 yes Fig.14 A process flow chart of forming a combination of an environmental sensor and a protective adhesive layer in a method for preparing a combination of a substrate, an environmental sensor and a protective adhesive layer;

[0057] Fig.17 yes Fig.14 A schematic diagram of the structure of forming an environmental sensor and a protective adhesive layer in the method for preparing the combination of the substrate, the environmental sensor and the protective adhesive layer;

[0058] Fig.18 yes Figure 7 A schematic diagram of the structure of the support member formed by injection molding on a substrate in the preparation method of the support assembly shown;

[0059] Fig.19 yes Figure 7 A schematic structural diagram of removing the protective adhesive layer in the preparation method of the support assembly shown. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0061] See also Figure 1 , Figure 1 It is a schematic diagram of the structure of the electronic device 1000 provided in this application.

[0062] The electronic device 1000 may be a mobile phone, a tablet computer, a laptop computer, a car computer, a smart watch, a smart bracelet, a POS (point of sales terminal), etc. Next, the present application takes the electronic device 1000 as a mobile phone as an example for explanation.

[0063] The electronic device 1000 includes a housing 100, a display module 200, a processor 300 and a camera module 400. The display module 200, the processor 300 and the camera module 400 are all installed in the housing 100. The housing 100 includes a middle frame 110 and a back cover 120, and the back cover 120 is installed in the middle frame 110. Specifically, the back cover 120 is installed on one side of the middle frame 110. The back cover 120 is provided with a camera hole 1201, and the camera hole 1201 passes through the back cover 120 along the thickness direction of the back cover 120. The camera hole 1201 connects the inside and outside of the housing 100. Exemplarily, the back cover 120 can be installed in a detachable manner in the middle frame 110 to facilitate the maintenance and replacement of the internal components or modules of the electronic device 1000, or the back cover 120 can be integrally formed with the middle frame 110 to increase the overall strength of the housing 100. The back cover 120 may be a battery cover of the electronic device 1000 .

[0064] The display module 200 is installed on the other side of the middle frame 110. That is, the display module 200 is installed on the side of the middle frame 110 away from the back cover 120. That is, the display module 200 and the back cover 120 are respectively installed on the opposite sides of the middle frame 110. When the user uses the electronic device 1000, the display module 200 is placed toward the user, and the back cover 120 is placed away from the user. Among them, the display module 200 includes a cover plate and a display screen fixed to the cover plate (not shown). The cover plate can be made of transparent materials such as glass. The display screen can be a display screen such as LCD (liquid crystal display) or OLED (organic light-emitting diode) for displaying information such as images or text.

[0065] The processor 300 is installed on the inner side of the housing 100. Specifically, the processor 300 is installed on the inner side of the middle frame 110. The processor 300 may be a CPU (central processing unit) of the electronic device 1000.

[0066] The camera module 400 is installed on the inner side of the housing 100, exposed relative to the housing 100, and electrically connected to the processor 300. Specifically, the camera module 400 is installed on the inner side of the middle frame 110, penetrates the camera hole 1201, and is exposed relative to the back cover 120. The camera module 400 and the camera module 400 can receive the information acquisition signal sent by the processor 300, collect the light outside the electronic device 1000, and form corresponding image data. Exemplarily, the camera module 400 serves as a rear camera module of the electronic device 1000. It should be noted that the exposure of the camera module 400 relative to the housing 100 means that the housing 100 does not completely cover the camera module 400. In some other embodiments, the camera module 400 can also be used as a front camera module of the electronic device 1000, and the embodiment of the present application does not impose specific restrictions on this.

[0067] Please also read Figure 2 and Figure 3 , Figure 2 yes Figure 1 The structural diagram of the camera module 400 in the electronic device 1000 is shown. Figure 3 yes Figure 2 A schematic diagram of the exploded structure of the camera module 400 is shown.

[0068] The camera module 400 includes a support assembly 410, a filter 420, a lens base 430 and a lens 440. The filter 420 and the lens base 430 are both mounted on the support assembly 410. The lens 440 is mounted on the inner side of the lens base 430. For ease of description, the width direction of the camera module 400 is defined as the X-axis direction, the length direction of the camera module 400 is defined as the Y-axis direction, and the height direction of the camera module 400 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

[0069] Please also read Figure 4 and Figure 5 , Figure 4 yes Figure 3 The structural diagram of the support assembly 410 in the camera module 400 is shown in FIG. Figure 5 yes Figure 4 The cross-sectional structure diagram of the support assembly 410 is shown after being cut along position II. Here, “cut along position II” means cutting along the plane where line II is located, and the description of the accompanying drawings in the following text can be understood in the same way.

[0070] The support assembly 410 includes a substrate 411, an image sensor 412, an environmental sensor 413 and a holder 414. The image sensor 412, the environmental sensor 413 and the holder 414 are all mounted on the substrate 411. The substrate 411 has a first surface 411a and a second surface 411b. Along the thickness direction of the substrate 411 (Z-axis direction in the figure), the first surface 411a and the second surface 411b are arranged opposite to each other. The substrate 411 is provided with a mounting groove 415. The opening of the mounting groove 415 is located on the first surface 411a. The mounting groove 415 is recessed from the first surface 411a to the direction of the second surface 411b (negative direction of the Z-axis in the figure). Among them, the mounting groove 415 is located in the middle of the substrate 411.

[0071] In this embodiment, the substrate 411 may be a circuit board. The substrate 411 is electrically connected to the processor 300 to achieve electrical connection between the camera module 400 and the processor 300. Specifically, the substrate 411 includes a plate body 411c, a reinforcement plate 411d and a connection layer 411e. The plate body 411c has a first surface 411a. The reinforcement plate 411d is located on one side of the plate body 411c, and is spaced and arranged opposite to the plate body 411c. The reinforcement plate 411d has a second surface 411b. The reinforcement plate 411d can support the plate body 411c, so that the substrate 411 has sufficient structural strength to better carry other devices and structures. The connection layer 411e is located between the plate body 411c and the reinforcement plate 411d, and is connected between the plate body 411c and the reinforcement plate 411d. For example, the connection layer 411e may be an adhesive layer, in which case the board 411c may be mounted on the reinforcing plate 411d by bonding, or the connection layer 411e may be a solder layer, in which case the board 411c may be mounted on the reinforcing plate 411d by welding. In addition, the mounting groove 415 penetrates the board 411c and the connection layer 411e.

[0072] The image sensor 412 is mounted in the mounting groove 415 and is electrically connected to the substrate 411. Specifically, the image sensor 412 is mounted on the bottom wall of the mounting groove 415. Among them, the image sensor 412 is mounted on the reinforcement plate 411d. Exemplarily, the image sensor 412 can be mounted on the substrate 411 by bonding. For example, the support assembly 410 also includes a first bonding layer 416, and the first bonding layer 416 is located between the image sensor 412 and the reinforcement plate 411d, and is bonded between the image sensor 412 and the reinforcement plate 411d to achieve the assembly between the image sensor 412 and the substrate 411. The image sensor 412 can reuse the thickness space of the mounting groove 415 to reduce the occupation of the image sensor 412 in the thickness space of the support assembly 410, which helps to achieve the miniaturized design of the support assembly 410.

[0073] The environmental sensor 413 is mounted on the first surface 411a, and is spaced apart from the image sensor 412 and the mounting groove 415, and is electrically connected to the substrate 411. The environmental sensor 413 can be welded to the first surface 411a. For example, the environmental sensor 413 can be mounted on the first surface 411a by surface mounting technology (SMT).

[0074] In this embodiment, there is one environmental sensor 413. The environmental sensor 413 can be exposed to the environment and can detect environmental information. For example, the environmental sensor 413 can be a thermistor, in which case the environmental sensor 413 can detect the temperature of the environment, or the environmental sensor 413 can be a Hall element, and the environmental sensor 413 can detect the magnetic field of the environment. In some other embodiments, there can be multiple environmental sensors 413, at least one environmental sensor 413 is a thermistor, and at least one environmental sensor 413 is a Hall element. The present application does not specifically limit the number and type of environmental sensors 413.

[0075] Please also read Figure 6 , Figure 6 yes Figure 4 The support assembly 410 is shown as a schematic diagram of a cross-sectional structure after being cut along II-II.

[0076] In this embodiment, the support member 414 is made of plastic. The support member 414 is formed by injection molding, which not only helps to ensure the overall strength of the support member 414, but also helps to reduce the size of the support member 414 in the X-axis direction, the Y-axis direction and the Z-axis direction, and helps to achieve a miniaturized design of the camera module 400.

[0077] The support member 414 includes a third surface 414a and a fourth surface 414b, and the third surface 414a and the fourth surface 414b are disposed opposite to each other along the thickness direction (Z-axis direction in the figure) of the support member 414. The third surface 414a is the surface of the support member 414 facing away from the substrate 411, and the fourth surface 414b is the surface of the support member 414 facing the substrate 411.

[0078] The support member 414 is provided with a light-through hole 417 and an avoidance hole 418. Both the light-through hole 417 and the avoidance hole 418 penetrate the third surface 414a and the fourth surface 414b along the thickness direction of the support member 414. That is, the light-through hole 417 and the avoidance hole 418 penetrate the support member 414 along the thickness direction of the support member 414. Specifically, the light-through hole 417 is located in the middle of the support member 414, and is connected to the mounting groove 415, and exposes the image sensor 412. The avoidance hole 418 is located at the edge of the support member 414, and is spaced apart from the light-through hole 417. Among them, the avoidance hole 418 avoids the environmental sensor 413 to expose the environmental sensor 413. In other words, the environmental sensor 413 is located in the avoidance hole 418, and is spaced apart from the hole wall surface of the avoidance hole 418.

[0079] Among them, the distance W between the environmental sensor 413 and the hole wall of the avoidance hole 418 is between 0.15mm and 0.2mm. For example, the distance W between the environmental sensor 413 and the hole wall of the avoidance hole 418 can be 0.15mm, 0.18mm or 0.2mm. It should be noted that the distance between the environmental sensor 413 and the hole wall of the avoidance hole 418 refers to the minimum distance between the environmental sensor 413 and the hole wall of the avoidance hole 418. At this time, the size of the avoidance hole 418 in the X-axis direction and the Y-axis direction is small enough to reduce the space occupied by the avoidance hole 418 on the support member 414, which helps to reduce the size of the support member 414 in the X-axis direction and the Y-axis direction, thereby helping to achieve a miniaturized design of the camera module 400.

[0080] In addition, the support member 414 is provided with a support portion 419, which is provided on the hole wall surface of the light-through hole 417, and is arranged around the hole wall surface of the light-through hole 417, and is spaced apart from the central axis O of the light-through hole 417. Specifically, the support portion 419 is located on the side of the hole wall surface of the light-through hole 417 close to the substrate 411, and is located between the third surface 414a and the fourth surface 414b. Exemplarily, the support portion 419 is in a square ring shape.

[0081] Please also read Figure 3 , the filter 420 is mounted on the support 414, covers the light hole 417, and is arranged opposite to the image sensor 412. Specifically, the filter 420 is mounted on the support 419. It should be noted that the filter 420 covering the light hole 417 means that the filter 420 covers the narrowest position of the light hole 417, and the external light can only enter the interior of the support 414 through the filter 420. Among them, the filter 420 is arranged opposite to the image sensor 412, and the external light can enter the filter 420 from the light hole 417, and is received by the image sensor 412 after being filtered by the filter 420, and the image sensor 412 converts the light to form an image. Exemplarily, the filter 420 can be blue glass (blue glass, BG).

[0082] Exemplarily, the optical filter 420 can be mounted on the support 414 by bonding. For example, the camera module 400 further includes a second bonding layer 450, which is located between the optical filter 420 and the support portion 419 and bonded between the optical filter 420 and the support portion 419 to achieve assembly between the optical filter 420 and the support 414, and further to achieve assembly between the optical filter 420 and the support assembly 410.

[0083] The lens base 430 is mounted on the third surface 414a. Specifically, the lens base 430 is mounted on the edge area of ​​the third surface 414a. Exemplarily, the lens base 430 can be mounted on the support member 414 by bonding. For example, the camera module 400 also includes a third bonding layer 460, which is located between the lens base 430 and the third surface 414a, and is bonded between the lens base 430 and the third surface 414a to achieve assembly between the lens base 430 and the support member 414, and further achieve assembly between the filter 420 and the support assembly 410.

[0084] The lens base 430 is provided with a mounting hole 431, and the mounting hole 431 penetrates the lens base 430 from the height direction (Z-axis direction in the figure) of the lens base 430. Specifically, the mounting hole 431 is located in the middle of the lens base 430, and is connected to the light-through hole 417, and is arranged opposite to the filter 420. Light outside the camera module 400 can enter the filter 420 from the mounting hole 431 and the light-through hole 417, and after being filtered by the filter 420, it is received by the image sensor 412.

[0085] The lens 440 is mounted in the mounting hole 431 and is arranged opposite to the filter 420. The lens 440 can converge the light outside the camera module 400, and the converged external light can be projected from the filter 420 to the image sensor 412. Exemplarily, the lens 440 can be mounted on the lens base 430 by bonding. For example, the camera module 400 may include a fourth bonding layer (not shown), and the fourth bonding layer is bonded between the lens 440 and the lens base 430.

[0086] The lens 440 may include a lens barrel and a lens group, and the lens group may be fixed inside the lens barrel. Exemplarily, the number of lenses in the lens group may be one. It should be noted that the lens base 430 may be a motor, for example, the lens base 430 may be a shape memory alloy (SMA) motor, and the motor may drive the lens group to move in the optical axis direction of the lens 440 to achieve focusing of the camera module 400.

[0087] See also Figure 7 , Figure 7It is a process flow chart of the preparation method of the support assembly provided in this application.

[0088] The method for preparing the support assembly shown in the present application is used to prepare the above-mentioned support assembly 410. The method for preparing the support assembly includes steps S1 to S3.

[0089] Step S1, providing a combination of a substrate 411, an environmental sensor 413 and a protective adhesive layer 500, wherein the environmental sensor 413 is mounted on the substrate 411, and the protective adhesive layer 500 is mounted on the substrate 411 and covers the environmental sensor 413, such as Figure 8 As shown. Exemplarily, the protective adhesive layer 500 is made of protective adhesive, and the protective adhesive can be UV (ultraviolet) adhesive, UV thermosetting adhesive or hydrolyzed adhesive.

[0090] In this embodiment, step S1 includes step S11 to step S13, or step S1 includes step S14 to step S15.

[0091] See also Fig. 9 , Fig. 9 yes Figure 8 The process flow chart of the method for preparing the assembly of the substrate 411 , the environmental sensor 413 and the protective adhesive layer 500 in the first embodiment is shown.

[0092] In the first implementation, step S1 includes steps S11 to S13.

[0093] Step S11, providing a substrate 411 and an environmental sensor 413, such as Fig.10 As shown. The substrate 411 has a first surface 411a and a second surface 411b. Along the thickness direction of the substrate 411 (Z-axis direction in the figure), the first surface 411a and the second surface 411b are arranged opposite to each other. The dispensing fixture 600 includes a dispensing mold 610 and a dispensing syringe 620.

[0094] Step S12, installing the environmental sensor 413 on the substrate 411, such as Fig.11 Specifically, the environment sensor 413 is mounted on the first surface 411a. The environment sensor 413 can be mounted on the substrate 411 by welding. For example, the environment sensor 413 can be mounted on the first surface 411a by surface mounting technology.

[0095] Step S13, forming a protective adhesive layer 500 covering the environmental sensor 413 on the substrate 411, such as Figure 8 Specifically, a protective adhesive layer 500 covering the environmental sensor 413 is formed on the substrate 411 by using a dispensing process. The protective adhesive layer 500 covering the environmental sensor 413 is formed on the substrate 411 by using a dispensing jig 600. Fig.12shown.

[0096] See also Fig.12 and Fig.13 , Fig.12 yes Fig. 9 The process flow chart of forming the protective adhesive layer 500 in the method for preparing the combination of the substrate 411, the environmental sensor 413 and the protective adhesive layer 500 is shown in FIG. Fig.13 yes Fig. 9 The schematic diagram of the structure of forming the protective adhesive layer 500 by using a dispensing jig 600 in the preparation method of the assembly of the substrate 411 , the environmental sensor 413 and the protective adhesive layer 500 is shown.

[0097] Among them, the dispensing mold 610 is provided with a dispensing cavity 611 and a dispensing hole 612. The dispensing cavity 611 is located on the inner side of the dispensing mold 610. The dispensing hole 612 penetrates the dispensing mold 610 along the thickness of the dispensing mold 610 and connects the dispensing cavity 611 and the outside of the dispensing mold 610.

[0098] Step S13 includes steps S131 to S133.

[0099] Step S131, install the glue dispensing mold 610 on the substrate 411. Specifically, the glue dispensing mold 610 is installed on the first surface 411a of the substrate 411, the glue dispensing cavity 611 accommodates the environmental sensor 413, and the cavity wall surface of the glue dispensing cavity 611 is spaced apart from the environmental sensor 413. Among them, the distance between the cavity wall surface of the glue dispensing cavity 611 and the environmental sensor 413 is between 0.15mm and 0.2mm. For example, the distance between the cavity wall surface of the glue dispensing cavity 611 and the environmental sensor 413 can be 0.15mm, 0.18mm or 0.2mm.

[0100] In step S132, the glue dispensing syringe 620 injects the protective glue from the glue dispensing hole 612 into the glue dispensing cavity 611 until the protective glue covers the environmental sensor 413. Specifically, the glue dispensing syringe 620 first aligns with the glue dispensing hole 612, and then injects the protective glue from the glue dispensing hole 612 into the glue dispensing cavity 611 until the protective glue covers the environmental sensor 413. At this time, the protective glue can fill the glue dispensing cavity 611.

[0101] Step S133, solidifying the protective glue in the glue dispensing cavity 611 to form a protective glue layer 500. The thickness of the protective glue layer 500 is between 0.15 mm and 0.2 mm. For example, the thickness of the protective glue layer 500 can be 0.15 mm, 0.18 mm or 0.2 mm.

[0102] The melting point of the protective glue layer 500 is lower than the maximum tolerable temperature of the environmental sensor 413 and the maximum tolerable temperature of the substrate 411. During the injection of the molten protective glue, the molten protective glue will not damage the environmental sensor 413 and the substrate 411, so as to ensure the product yield of the support assembly 410.

[0103] See also Fig.14 , Fig.14 yes Figure 8 The process flow chart of the method for preparing the assembly of the substrate 411 , the environmental sensor 413 and the protective adhesive layer 500 in the second embodiment is shown.

[0104] In the second implementation, step S1 includes steps S14 to S15.

[0105] Step S14, providing a combination of the environmental sensor 413 and the protective adhesive layer 500, and the substrate 411, such as Fig.15 As shown, the protective adhesive layer 500 covers the environmental sensor 413, and the substrate 411 has a first surface 411a and a second surface 411b. Along the thickness direction of the substrate 411 (Z-axis direction in the figure), the first surface 411a and the second surface 411b are arranged opposite to each other.

[0106] See also Fig.16 and Fig.17 , Fig.16 yes Fig.14 The process flow chart of forming the combination of the environmental sensor 413 and the protective adhesive layer 500 in the preparation method of the combination of the substrate 411, the environmental sensor 413 and the protective adhesive layer 500 is shown in FIG. Fig.17 yes Fig.14 The structure schematic diagram of the combination of the environmental sensor 413 and the protective adhesive layer 500 is formed in the method for preparing the combination of the substrate 411 , the environmental sensor 413 and the protective adhesive layer 500 .

[0107] In this embodiment, a dispensing jig 600 is used to form a combination of an environmental sensor 413 and a protective adhesive layer 500. The dispensing jig 600 includes a dispensing mold 610 and a dispensing syringe 620. The dispensing mold 610 is provided with a dispensing cavity 611 and a dispensing hole 612. The dispensing cavity 611 is located on the inner side of the dispensing mold 610. The dispensing hole 612 penetrates the dispensing mold 610 along the thickness of the dispensing mold 610 and connects the dispensing cavity 611 and the outside of the dispensing mold 610. In this embodiment, the dispensing mold 610 includes a lower mold 613 and an upper mold 614. The upper mold 614 is provided with a dispensing hole 612. The lower mold 613 and the upper mold 614 together enclose the dispensing cavity 611.

[0108] In this embodiment, step S14 includes steps S141 to S144.

[0109] Step S141 , installing the environmental sensor 413 on the lower mold 613 of the dispensing mold 610 .

[0110] Step S142, install the upper mold 614 of the glue dispensing mold 610 on the lower mold 613. The upper mold 614 and the lower mold 613 enclose a glue dispensing cavity 611, and the glue dispensing cavity 611 accommodates the environmental sensor 413. The cavity wall surface of the glue dispensing cavity 611 is spaced apart from the environmental sensor 413. The distance between the cavity wall surface of the glue dispensing cavity 611 and the environmental sensor 413 is between 0.15 mm and 0.2 mm. For example, the distance between the cavity wall surface of the glue dispensing cavity 611 and the environmental sensor 413 can be 0.15 mm, 0.18 mm or 0.2 mm.

[0111] In step S143, the dispensing syringe 620 injects the protective glue from the dispensing hole 612 of the dispensing mold 610 into the dispensing cavity 611 until the protective glue covers the environmental sensor 413. Specifically, the dispensing syringe 620 first aligns with the dispensing hole 612, and then injects the protective glue from the dispensing hole 612 into the dispensing cavity 611 until the protective glue covers the environmental sensor 413. At this time, the protective glue can fill the dispensing cavity 611.

[0112] Step S144, solidify the protective glue in the glue dispensing cavity 611 to form a protective glue layer 500. The thickness of the protective glue layer 500 is between 0.15 mm and 0.2 mm. For example, the thickness of the protective glue layer 500 can be 0.15 mm, 0.18 mm or 0.2 mm.

[0113] Step S15, installing the combination of the environmental sensor 413 and the protective adhesive layer 500 on the substrate 411, such as Figure 8 Specifically, the combination of the environmental sensor 413 and the protective adhesive layer 500 is mounted on the first surface 411a of the substrate 411. The environmental sensor 413 can be mounted on the substrate 411 by welding. For example, the environmental sensor 413 can be mounted on the first surface 411a by surface mounting technology.

[0114] See also Figure 7 and Fig.18 , Fig.18 yes Figure 7 A schematic structural diagram of the method for preparing the support assembly shown is a method for forming a support member 414 by injection molding on a substrate 411 .

[0115] Step S2, forming a support member 414 by injection molding on the substrate 411, the support member 414 covering the peripheral surface of the protective adhesive layer 500. Specifically, the support member 414 is formed by injection molding on the first surface 411a of the substrate 411. The support member 414 can be formed by injection molding on the first surface 411a of the substrate 411 using an injection mold 700.

[0116] It should be noted that the injection molding temperature of the support member 414 is lower than the melting point of the protective rubber layer 500. That is, the melting point of the protective rubber layer 500 exceeds the injection molding temperature of the support member 414. In the process of injection molding the support member 414, the protective rubber layer 500 will not melt under the heat of the molten plastic liquid and will not be able to cover the environmental sensor 413, which can ensure the reliability of the subsequent formation of the avoidance hole 418. Among them, the melting point of the protective rubber layer 500 is greater than or equal to 250°C. It can be understood that in the process of injection molding the support member, the temperature of the molten plastic liquid is generally less than 250°C, and the melting point of the protective rubber layer 500 is greater than or equal to 250°C, which can ensure that the protective rubber layer 500 will not melt under the heat of the molten plastic liquid and will not be able to cover the environmental sensor 413, which helps to ensure the reliability of the subsequent formation of the avoidance hole 418.

[0117] See also Figure 7 and Fig.19 , Fig.19 yes Figure 7 The structural schematic diagram of removing the protective adhesive layer 500 in the preparation method of the support assembly shown. Fig.19 The bold black wavy line shown represents heating steam.

[0118] Step S3, removing the protective adhesive layer 500. Specifically, the protective adhesive layer 500 can be removed by heating steam using a hot plate 800. In some other embodiments, the protective adhesive layer 500 can also be removed by ultrasonic cleaning, or when the protective adhesive layer 500 is a hydrolyzed adhesive, the protective adhesive layer 500 can also be removed by washing with water, which is not specifically limited in the present application.

[0119] In addition, in step S1 , the method for preparing the support assembly further includes providing an image sensor. Before step S2 , the method for preparing the support assembly further includes mounting the image sensor on the substrate 411 .

[0120] It should be noted that the opening size of the conventional injection-molded support is often large. When the environmental sensor 413 is accommodated in the avoidance hole, the distance between the environmental sensor 413 and the hole wall of the avoidance hole is between 0.6 mm and 0.8 mm. In the preparation method of the support assembly shown in the present application, the environmental sensor 413 is first coated with a protective adhesive layer 500, and then the support member 414 is injection-molded. The size of the avoidance hole 418 can be controlled by controlling the thickness of the protective adhesive layer 500, and the distance between the hole wall of the avoidance hole 418 and the environmental sensor 413 is controlled between 0.15 mm and 0.2 mm, which can effectively reduce the opening size of the support member 414, help reduce the size of the support member 414 in the X-axis direction, the Y-axis direction and the Z-axis direction, help to achieve the miniaturization design of the camera module 400, and then help to achieve the lightweight design of the electronic device 1000.

[0121] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application; in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for preparing a support assembly, characterized in that: include: Providing a combination of a substrate, an environmental sensor and a protective adhesive layer, wherein the environmental sensor and the protective adhesive layer are both mounted on the substrate, and the protective adhesive layer covers the environmental sensor; Injection molding a support member on the substrate, wherein the support member covers the peripheral surface of the protective adhesive layer; The protective adhesive layer is removed.

2. The method for preparing a support assembly according to claim 1, characterized in that: The melting point of the protective adhesive layer is greater than the injection molding temperature of the support member.

3. The method for preparing a support assembly according to claim 1 or 2, characterized in that: The step of providing a combination of a substrate, an environmental sensor and a protective adhesive layer comprises: providing the substrate and the environmental sensor; installing the environmental sensor on the substrate; A protective adhesive layer covering the environmental sensor is formed on the substrate.

4. The method for preparing a support assembly according to claim 3, characterized in that: The step of forming a protective adhesive layer covering the environmental sensor on the substrate includes: Installing a dispensing mold on the substrate, wherein the dispensing cavity of the dispensing mold accommodates the environmental sensor; The glue dispensing syringe injects the protective glue from the glue dispensing port of the glue dispensing mold into the glue dispensing cavity until the protective glue covers the environmental sensor; The protective glue in the glue dispensing cavity is solidified to form the protective glue layer.

5. The method for preparing a support assembly according to claim 1 or 2, characterized in that: The step of providing a combination of a substrate, an environmental sensor and a protective adhesive layer comprises: Providing a combination of the environmental sensor and the protective adhesive layer, and the substrate, wherein the protective adhesive layer covers the environmental sensor; The combination of the environmental sensor and the protective adhesive layer is mounted on the substrate.

6. The method for preparing a support assembly according to claim 5, characterized in that: The step of providing a combination of an environmental sensor and a protective adhesive layer includes: Installing the environmental sensor on the lower mold of the dispensing mold; Installing the upper mold of the dispensing mold on the lower mold, wherein the upper mold and the lower mold enclose a dispensing cavity, and the dispensing cavity accommodates the environmental sensor; The glue dispensing syringe injects the protective glue from the glue dispensing port of the glue dispensing mold into the glue dispensing cavity until the protective glue covers the environmental sensor; The protective glue in the glue dispensing cavity is solidified to form the protective glue layer.

7. The method for preparing a support assembly according to any one of claims 1 to 6, characterized in that: The melting point of the protective adhesive layer is lower than the maximum tolerable temperature of the environmental sensor, and / or the melting point of the protective adhesive layer is lower than the maximum tolerable temperature of the substrate.

8. The method for preparing a support assembly according to any one of claims 1 to 7, characterized in that: In the step of removing the protective adhesive layer, the protective adhesive layer is removed by steam cleaning, ultrasonic cleaning or water cleaning.

9. The method for preparing a support assembly according to any one of claims 1 to 8, characterized in that: The thickness of the protective adhesive layer is between 0.15 mm and 0.2 mm.

10. A support assembly, characterized in that: The invention comprises a substrate, a support member and an environmental sensor, wherein the support member is mounted on the substrate, the support member is provided with an avoidance hole, the avoidance hole penetrates the support member along the thickness direction of the support member, the environmental sensor is accommodated in the avoidance hole, mounted on the substrate, and spaced apart from the hole wall of the avoidance hole.

11. A camera module, characterized in that: It comprises the support assembly as claimed in claim 10, a lens base and a lens, wherein the lens base is mounted on a surface of the support member facing away from the substrate, and the lens is mounted on the inner side of the lens base.

12. The camera module according to claim 11, characterized in that: The support member is further provided with a light-through hole, which penetrates the support member along the thickness direction of the support member and is spaced apart from the avoidance hole; The camera module further includes a filter, which is mounted on the support member, covers the light hole, and is arranged opposite to the lens; The supporting assembly further comprises an image sensor, which is mounted on the substrate and arranged opposite to the optical filter.

13. An electronic device, characterized in that: It comprises a processor and a camera module as described in claim 11 or 12, wherein the camera module is electrically connected to the processor.

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