Vapor chamber and electronic equipment

Abstract

The invention provides a vapor chamber and electronic equipment, the electronic equipment comprises a first part, a second part and a flexible connecting section, the first part and the second part are connected through the flexible connecting section, and a heat source is arranged in the first part; the vapor chamber comprises an evaporation part, a first heat conduction part, a first condensation part, a second heat conduction part and a second condensation part; the evaporation part, the first heat conduction part and the first condensation part are all used for being arranged in the first part, the evaporation part corresponds to a heat source, the first condensation part is used for being arranged in a heat-source-free area of the first part, and the evaporation part communicates with the first condensation part through the first heat conduction part; the second heat conduction part is used for being arranged in the flexible connecting section, the second condensation part is used for being arranged in the second part, and the first condensation part communicates with the second condensation part through the second heat conduction part. The vapor chamber is beneficial to improving the heat dissipation efficiency of the electronic equipment in a folded state.

Description

Technical Field

[0001] The present application relates to electronic equipment heat transfer technology, and more particularly to a heat spreader and electronic equipment. Background Art

[0002] Vapor Chamber (VC), also known as steam chamber, is a highly efficient heat conduction device widely used in electronic equipment to dissipate heat from the heat source of the electronic equipment.

[0003] In the solution of the related art, the foldable electronic device includes a first part, a second part and a flexible connecting section, and the flexible connecting section connects the first part and the second part so that the first part and the second part can be relatively unfolded or folded. The heat spreader arranged in the electronic device includes an evaporation part, a condensation part and a heat conduction part, the evaporation part is arranged in the first part, the condensation part is arranged in the second part, and the heat conduction part connects the evaporation part and the condensation part and is arranged in the flexible connecting section.

[0004] However, when the first part and the second part are in a folded state, the heat dissipation efficiency of the vapor chamber is low. Summary of the invention

[0005] In order to overcome the above-mentioned defects in the related art, the purpose of the present application is to provide a heat spreader and an electronic device, which are helpful in improving the heat dissipation efficiency of the electronic device in a folded state.

[0006] On the one hand, the present application provides a heat spreader for being arranged on a foldable electronic device, the electronic device comprising a first part, a second part and a flexible connecting section, the first part and the second part are connected via the flexible connecting end, a heat source is arranged in the first part; the heat spreader comprises:

[0007] an evaporation part, a first heat conduction part, a first condensation part, a second heat conduction part, and a second condensation part; the evaporation part, the first heat conduction part, and the first condensation part are all used to be arranged in the first part, and the evaporation part corresponds to the heat source, the first condensation part is used to be arranged in a non-heat source area of ​​the first part, and the evaporation part is connected to the first condensation part through the first heat conduction part;

[0008] The second heat conducting portion is used to be arranged in the flexible connecting section, the second condensing portion is used to be arranged in the second part, and the first condensing portion and the second condensing portion are connected through the second heat conducting portion.

[0009] In one possible implementation, the evaporation section includes an evaporation section shell, in which a liquid absorption core is provided; the first condensation section includes a first condensation section shell, in which a first liquid storage core is provided; the first heat conduction section includes a first liquid flow channel and at least one first gas flow channel, and the first liquid flow channel and the first gas flow channel are both connected to the evaporation section shell and the first condensation section shell.

[0010] In a possible implementation, a first liquid guide core is provided in the first liquid flow channel, and two ends of the first liquid guide core are respectively connected to the liquid absorption core and the first liquid storage core;

[0011] The liquid absorbent core is also provided with a plurality of first grooves, and the plurality of first grooves are all located at one end of the liquid absorbent core close to the first gas flow channel; the first liquid storage core is also provided with a plurality of second grooves, and the plurality of second grooves are all located at one end of the first liquid storage core close to the first gas flow channel.

[0012] In one possible implementation, the second condensation section includes a second condensation section shell, in which a second liquid storage core is disposed; the second heat conduction section includes a second liquid flow channel and at least one second gas flow channel, and the second liquid flow channel and the second gas flow channel are both connected to the first condensation section shell and the second condensation section shell.

[0013] In a possible implementation, a second liquid guide core is provided in the second liquid flow channel, and two ends of the second liquid guide core are respectively connected to the first liquid storage core and the second liquid storage core;

[0014] The first liquid storage core is also provided with a plurality of third grooves, and the plurality of third grooves are all located at one end of the first liquid storage core close to the second gas flow channel; the second liquid storage core is also provided with a plurality of fourth grooves, and the plurality of fourth grooves are all located at one end of the second liquid storage core close to the second gas flow channel.

[0015] In a possible implementation, when the electronic device is in a folded state, in a plane parallel to a screen of the electronic device, a projection of the evaporation portion is outside a projection range of the second condensation portion.

[0016] In a possible implementation, the materials of the second liquid flow channel and the second gas flow channel are both memory alloys, and the memory alloys include β-titanium alloy or nickel-titanium alloy.

[0017] In a possible implementation, the evaporation portion shell, the first liquid flow channel, the first gas flow channel, the first condensation portion shell, and the second condensation portion shell are all made of stainless steel or copper.

[0018] In a possible implementation, the liquid absorbing core, the first liquid introducing core, the first liquid storage core, the second liquid introducing core and the second liquid storage core are all porous media made of metal; the porous media made of metal include one or more of copper mesh, copper fiber, copper powder or foam copper.

[0019] In a possible implementation manner, a cooling medium is further included, and the cooling medium includes deionized water.

[0020] On the other hand, the present application provides an electronic device, comprising a first part, a second part and a flexible connecting section, wherein the electronic device is provided with any of the above described heat spreaders.

[0021] The present application provides a heat spreader and an electronic device, the electronic device comprises a first part, a second part and a flexible connection section, the first part and the second part are connected by a flexible connection end, and a heat source is arranged in the first part; the heat spreader comprises: an evaporation part, a first heat conduction part, a first condensation part, a second heat conduction part and a second condensation part; the evaporation part, the first heat conduction part and the first condensation part are all used to be arranged in the first part, and the evaporation part corresponds to the heat source, the first condensation part is used to be arranged in the non-heat source area of ​​the first part, and the evaporation part is connected to the first condensation part through the first heat conduction part; the second heat conduction part is used to be arranged in the flexible connection section, the second condensation part is used to be arranged in the second part, and the first condensation part and the second condensation part are connected through the second heat conduction part. When the electronic device is in the unfolded state, the heat spreader of the present application forms a heat conduction loop through the evaporation part, the first heat conduction part, the first condensation part, the second heat conduction part and the second condensation part, so as to ensure the heat dissipation efficiency of the electronic device in the unfolded state; when the electronic device is in the folded state, the heat conduction loop is formed through the evaporation part, the first heat conduction part and the first condensation part, so as to realize the heat dissipation of the electronic device in the folded state, which is beneficial to improve the heat dissipation efficiency of the electronic device in the folded state compared with the solutions of the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technical descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of the structure of a heat sink provided in one embodiment of the present application;

[0024] Figure 2 for Figure 1 A simplified diagram of the structure after removing part of the shell.

[0025] Reference numerals:

[0026] 100 - evaporation part; 110 - evaporation part housing; 120 - liquid absorption core; 121 - first groove;

[0027] 200 - first heat conduction part; 210 - first liquid flow channel; 211 - first liquid introduction core; 220 - first gas flow channel;

[0028] 300-first condensation part; 310-first condensation part shell; 320-first liquid storage core; 321-second groove; 322-third groove;

[0029] 400 - second heat transfer part; 410 - second liquid flow channel; 411 - second liquid introduction core; 420 - second gas flow channel;

[0030] 500 - second condensation section; 510 - second condensation section outer shell; 520 - second liquid storage core; 521 - fourth groove. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0032] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] The working principle of the heat spreader is mainly based on the phase change heat transfer mechanism. It uses the cooling medium in the closed cavity to absorb heat from the liquid phase and condense into the liquid phase to release heat. It uses capillary force, gravity, etc. as the power for liquid working fluid transportation to complete the phase change cycle of gas and liquid phase in the heat spreader. Specifically, when heat is transferred from the external high-temperature area to the evaporation part of the heat spreader, the cooling medium in the evaporation part will quickly absorb heat and vaporize into steam. This process absorbs a large amount of heat energy, causing the pressure in the evaporation part to increase due to the vaporization of the cooling medium. Under the action of the pressure difference, the vaporized cooling medium quickly diffuses from the high-pressure area (evaporation part) through the heat conduction part to the low-pressure area (condensation part), carrying a large amount of heat energy and realizing rapid heat transfer. When the steam diffuses to the condensation part and contacts the inner wall with a lower temperature, it will quickly condense into liquid, releasing the heat accumulated during the previous evaporation. Under the action of capillary action, the condensed cooling medium will flow back to the evaporation part along the fine structure, reabsorb heat and vaporize into steam again. This process is repeated over and over again, forming a continuous heat conduction cycle, thus achieving efficient heat exchange.

[0034] As described in the background technology, in the scheme of the related technology, the heat dissipation efficiency of the heat spreader of the electronic device in the folded state is low. After research, it was found that the reason for the above problem is that when the electronic device is in the folded state, the heat conduction part will bend to a certain extent, thereby increasing the flow resistance of the internal working fluid, reducing the flow speed of the working fluid, and reducing the heat conduction speed between the evaporation part and the condensation part, thereby reducing the heat dissipation efficiency of the heat spreader. In addition, in the plane parallel to the screen of the electronic device, there is a partial overlapping area between the projection of the evaporation part and the projection of the condensation part of the heat spreader, and the evaporation part and the condensation part generate a certain heat exchange through contact heat transfer, so that the temperature difference between the evaporation part and the condensation part is reduced, further reducing the heat dissipation efficiency of the heat spreader.

[0035] In view of this, the embodiment of the present application aims to provide a heat spreader and an electronic device, the heat spreader includes an evaporation part, a first heat conduction part, a first condensation part, a second heat conduction part and a second condensation part; the evaporation part, the first heat conduction part and the first condensation part are all used to be arranged in the first part, and the evaporation part corresponds to the heat source, the first condensation part is used to be arranged in the non-heat source area of ​​the first part, and the evaporation part is connected with the first condensation part through the first heat conduction part; the second heat conduction part is used to be arranged in the flexible connection section, the second condensation part is used to be arranged in the second part, and the first condensation part and the second condensation part are connected through the second heat conduction part. When the electronic device is in the unfolded state, a heat conduction loop is formed by the evaporation part, the first heat conduction part, the first condensation part, the second heat conduction part and the second condensation part to ensure the heat dissipation efficiency of the electronic device in the unfolded state; when it is in the folded state, a heat conduction loop is formed by the evaporation part, the first heat conduction part and the first condensation part to achieve the heat dissipation of the electronic device in the folded state, which is beneficial to improve the heat dissipation efficiency of the electronic device in the folded state compared with the solutions of the related art.

[0036] The contents of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application in more detail.

[0037] Please refer to Figure 1 and Figure 2 This embodiment provides a heat spreader for being arranged on a foldable electronic device, such as a mobile phone, a tablet computer, a laptop computer, etc. The electronic device includes a first part, a second part and a flexible connecting section, and the first part and the second part are connected by a flexible connecting end, so that the flexible connecting section can be used to bend, so that the electronic device has an unfolded state and a folded state. Among them, when the electronic device is in the folded state, the first part is its display part. A heat source is arranged in the first part, and the heat source includes a motherboard, a battery, etc.

[0038] The heat spreader can be divided into: evaporation part 100, first heat conduction part 200, first condensation part 300, second heat conduction part 400 and second condensation part 500 according to different positions. Among them, the evaporation part 100, the first heat conduction part 200 and the first condensation part 300 are all used to be arranged in the first part, and the evaporation part 100 corresponds to the heat source to absorb the heat transferred by the heat source. The first condensation part 300 is used to be arranged in the non-heat source area of ​​the first part, so that it has a relatively low temperature. The evaporation part 100 is connected to the first condensation part 300 through the first heat conduction part 200, so that a complete heat conduction loop is formed between the evaporation part 100 and the first condensation part 300 by using the first heat conduction part 200. After absorbing heat and vaporizing, the cooling medium in the evaporation part 100 enters the first condensation part 300 through the first heat conduction part 200. Since the temperature of the first condensation part 300 is relatively low, the vaporized cooling medium condenses into liquid in the first condensation part 300. The condensed cooling medium flows back to the evaporation part through the first heat conduction part 200, reabsorbs heat and vaporizes into steam again. The above process enables the cooling medium to form a continuous heat conduction cycle between the evaporation part 100, the first heat conduction part 200 and the first condensation part 300, thereby realizing efficient heat exchange. That is to say, the present application can realize heat exchange in the first part of the electronic device only through the evaporation part 100, the first heat conduction part 200 and the first condensation part 300, thereby realizing heat dissipation of the heat source, so that the electronic device has a good heat dissipation efficiency in the folded state.

[0039] The second heat conducting part 400 is used to be arranged in the flexible connection section, and the second heat conducting part 400 can be bent along with the flexible connection section. The second condensation part 500 is used to be arranged in the second part, and the first condensation part 300 and the second condensation part 500 are connected through the second heat conducting part 400. When the electronic device is in the folded state, the second heat conducting part 400 is bent, so that the connection channel between the first condensation part 300 and the second condensation part 500 is disconnected; that is, at this time, the second condensation part 500 does not participate in the heat exchange. When the electronic device is in the unfolded state, the first condensation part 300 and the second condensation part 500 are connected through the second heat conducting part 400, which is equivalent to increasing the volume of the condensation part, so that the heat dissipation efficiency of the electronic device is higher and can meet the heat dissipation requirements under high energy consumption. When the electronic device is in the unfolded state, the cooling medium in the evaporation part 100 absorbs heat and gasifies, and then enters the first condensation part 300 through the first heat conducting part 200, and the part of the gaseous cooling medium that enters the first condensation part 300 enters the second condensation part 500 through the second heat conducting part 400. The gaseous cooling medium condenses into liquid in the first condensation part 300 and the second condensation part 500, and the condensed cooling medium flows back to the first condensation part 300 through the second heat conduction part 400, and then flows back to the evaporation part through the first heat conduction part 200, reabsorbs heat and vaporizes into steam again. The above process allows the cooling medium to form a continuous heat conduction cycle between the evaporation part 100, the first heat conduction part 200, the first condensation part 300, the second heat conduction part 400 and the second condensation part 500, which is equivalent to expanding the volume of the condensation part, making the heat dissipation efficiency of the heat spreader higher, so as to meet the high power consumption requirements of the electronic equipment in the unfolded state.

[0040] It can be seen from the above description that the heat spreader of this embodiment forms a heat conduction loop through the evaporation part 100, the first heat conduction part 200, the first condensation part 300, the second heat conduction part 400 and the second condensation part 500 when the electronic device is in the unfolded state, so as to ensure that the electronic device has good heat dissipation efficiency in the unfolded state. When the electronic device is in the folded state, the heat conduction loop is formed by the evaporation part 100, the first heat conduction part 200 and the first condensation part 300 to achieve heat dissipation of the electronic device in the folded state, which is beneficial to improve the heat dissipation efficiency of the electronic device in the folded state compared with the solutions of the related art.

[0041] Please continue to refer to Figure 2 The evaporation part 100 of this embodiment includes an evaporation part housing 110, in which a liquid absorption core 120 is disposed. The first condensation part 300 includes a first condensation part housing 310, in which a first liquid storage core 320 is disposed. The first heat conduction part 200 includes a first liquid flow channel 210 and at least one first gas flow channel 220, and the first liquid flow channel 210 and the first gas flow channel 220 are both connected to the evaporation part housing 110 and the first condensation part housing 310.

[0042] It can be understood that by setting the first heat conduction part 200 as a first liquid flow channel 210 and at least one first gas flow channel 220, the gaseous cooling medium and the liquid cooling medium can have independent flow channels, which is beneficial to avoid gas-liquid blockage, thereby helping to improve the heat transfer efficiency between the evaporation part 100 and the first condensation part 300.

[0043] Furthermore, in the first liquid flow channel 210 of the present embodiment, a first liquid introduction core 211 is provided in the first liquid introduction core 211, and the two ends of the first liquid introduction core 211 are respectively connected to the liquid absorption core 120 and the first liquid storage core 320. When the electronic device is in the folded state, the liquid absorption core 120, the first liquid introduction core 211 and the first liquid storage core 320 can form a stable liquid flow path. A plurality of first gas flow channels 220 can be provided, and the first gas flow channels 220 are hollow to reduce the resistance of the gaseous cooling medium when passing through.

[0044] The liquid wick 120 of this embodiment is also provided with a plurality of first grooves 121, and the plurality of first grooves 121 are all located at one end of the liquid wick 120 close to the first gas flow channel 220; by providing a plurality of first grooves 121, the resistance of the gaseous cooling medium in the evaporation part 100 can be reduced, and the speed of the gaseous cooling medium entering the first gas flow channel 220 can be increased. The first liquid storage core 320 is also provided with a plurality of second grooves 321, and the plurality of second grooves 321 are all located at one end of the first liquid storage core 320 close to the first gas flow channel 220; by providing a plurality of second grooves 321, the contact area between the gaseous cooling medium in the first condensation part 300 and the first liquid storage core 320 can be increased, thereby increasing the speed of the gaseous cooling medium condensing into the liquid cooling medium.

[0045] Please continue to refer to Figure 2 The second condensation unit 500 of this embodiment includes a second condensation unit housing 510, and a second liquid storage core 520 is disposed in the second condensation unit housing 510. The second heat conduction unit 400 includes a second liquid flow channel 410 and at least one second gas flow channel 420, and the second liquid flow channel 410 and the second gas flow channel 420 are both connected to the first condensation unit housing 310 and the second condensation unit housing 510.

[0046] It can be understood that by setting the second heat conduction part 400 as a second liquid flow channel 410 and at least one second gas flow channel 420, the gaseous cooling medium and the liquid cooling medium can have independent flow channels, which is beneficial to avoid gas-liquid blockage, thereby helping to improve the heat transfer efficiency between the first condensation part 300 and the second condensation part 500.

[0047] Furthermore, a second liquid guide core 411 is provided in the second liquid flow channel 410, and the two ends of the second liquid guide core 411 are respectively connected to the first liquid storage core 320 and the second liquid storage core 520. When the electronic device is in the unfolded state, the liquid absorbent core 120, the first liquid guide core 211, the first liquid storage core 320, the second liquid guide core 411 and the second liquid storage core 520 can form a stable liquid flow path. A plurality of second gas flow channels 420 can be provided, and the second gas flow channels 420 are hollow to reduce the resistance of the gaseous cooling medium when passing through.

[0048] The first liquid storage core 320 of this embodiment is also provided with a plurality of third grooves 322, which are all located at one end of the first liquid storage core 320 close to the second gas flow channel 420; by providing a plurality of third grooves 322, the resistance of the gaseous cooling medium in the first condensation part 300 can be reduced, and the speed of the gaseous cooling medium entering the second gas flow channel 420 can be increased. The second liquid storage core 520 is also provided with a plurality of fourth grooves 521, which are all located at one end of the second liquid storage core 520 close to the second gas flow channel 420; by providing a plurality of fourth grooves 521, the contact area between the gaseous cooling medium in the second condensation part 500 and the second liquid storage core 520 can be increased, thereby increasing the speed of the gaseous cooling medium condensing into liquid cooling medium.

[0049] Please continue to refer to Figure 1 and Figure 2 When the electronic device is in the folded state, in a plane parallel to the screen of the electronic device, the projection of the evaporation part 100 of this embodiment is outside the projection range of the second condensation part 500. In other words, when the electronic device is in the folded state, there is no contact heat transfer between the evaporation part 100 and the second condensation part 500, which is conducive to maintaining a reasonable temperature difference between the evaporation part 100 and the first condensation part 300, ensuring a good heat conduction effect.

[0050] In this embodiment, the materials of the second liquid flow channel 410 and the second gas flow channel 420 are both memory alloys, including β-titanium alloy or nickel-titanium alloy, to meet the requirement that the second liquid flow channel 410 and the second gas flow channel 420 bend with the electronic device.

[0051] In this embodiment, the cooling medium includes deionized water.

[0052] Furthermore, the materials of the evaporation housing 110, the first liquid flow channel 210, the first gas flow channel 220, the first condensation housing 310 and the second condensation housing 510 of this embodiment are all stainless steel or copper. Copper can be preferably used to avoid chemical reaction with water and improve the service life of the heat sink. Figure 1 and Figure 2In this embodiment, the evaporation portion housing 110, the first liquid flow channel 210, the first gas flow channel 220, the first condensation portion housing 310 and the second condensation portion housing 510 may be formed by a shell, and the shell may include opposite end covers ( Figure 2 The first gas flow channel 220 and the second gas flow channel 420 are both connected to the base, and the detachable cover of the end cover is arranged on the base to form a closed cavity.

[0053] In this embodiment, the liquid wick 120, the first liquid introduction core 211, the first liquid storage core 320, the second liquid introduction core 411 and the second liquid storage core 520 are all porous media made of metal; the porous media made of metal include one or more of copper mesh, copper fiber, copper powder or foam copper. The porous media made of metal can be fixed to the shell by sintering, welding or cold pressing.

[0054] This embodiment also provides an electronic device, including a first part, a second part and a flexible connection section, wherein the first part and the second part are connected by a flexible connection end, so that the flexible connection section can be used to bend, so that the electronic device has an unfolded state and a folded state. When the electronic device is in the folded state, the first part is its display part. A heat source is provided in the first part, and the heat source includes a motherboard, a battery, etc.

[0055] The above-mentioned heat spreader is provided in the electronic device. Specifically, the evaporation part 100, the first heat conduction part 200 and the first condensation part 300 in the heat spreader are all arranged in the first part, and the evaporation part 100 corresponds to the heat source, and the first condensation part 300 is arranged in the non-heat source area of ​​the first part. The second heat conduction part 400 is arranged in the flexible connection section, and the second condensation part 500 is arranged in the second part.

[0056] When the electronic device is in the folded state, the cooling medium in the evaporation part 100 absorbs heat and vaporizes, then enters the first condensation part 300 through the first heat conduction part 200. The vaporized cooling medium condenses into liquid in the first condensation part 300. The condensed cooling medium flows back to the evaporation part through the first heat conduction part 200, reabsorbs heat and vaporizes into steam again. The cooling medium forms a continuous heat conduction cycle between the evaporation part 100, the first heat conduction part 200 and the first condensation part 300, so that the electronic device has a better heat dissipation efficiency when in the folded state.

[0057] When the electronic device is in the unfolded state, the cooling medium in the evaporation part 100 absorbs heat and vaporizes, and then enters the first condensation part 300 through the first heat conduction part 200. The part of the gaseous cooling medium that enters the first condensation part 300 enters the second condensation part 500 through the second heat conduction part 400. The gaseous cooling medium condenses into liquid in the first condensation part 300 and the second condensation part 500. The condensed cooling medium flows back to the first condensation part 300 through the second heat conduction part 400, and then flows back to the evaporation part through the first heat conduction part 200, re-absorbs heat and vaporizes into steam again. The cooling medium forms a continuous heat conduction cycle between the evaporation part 100, the first heat conduction part 200, the first condensation part 300, the second heat conduction part 400, and the second condensation part 500, which is equivalent to expanding the volume of the condensation part, making the heat dissipation efficiency of the heat sink higher, so as to meet the high power consumption requirements of the electronic device in the unfolded state.

[0058] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0059] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] It should be noted that in the description of this application, the terms "first" and "second" are only used to facilitate the description of different components, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0061] The various embodiments or implementation methods in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0062] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat spreader, used for being arranged on a foldable electronic device, the electronic device comprising a first part, a second part and a flexible connecting section, the first part and the second part are connected via the flexible connecting end, a heat source is arranged in the first part; characterized in that: The heat sink comprises: an evaporation part, a first heat conduction part, a first condensation part, a second heat conduction part, and a second condensation part; the evaporation part, the first heat conduction part, and the first condensation part are all used to be arranged in the first part, and the evaporation part corresponds to the heat source, the first condensation part is used to be arranged in a non-heat source area of ​​the first part, and the evaporation part is connected to the first condensation part through the first heat conduction part; The second heat conducting portion is used to be arranged in the flexible connecting section, the second condensing portion is used to be arranged in the second part, and the first condensing portion and the second condensing portion are connected through the second heat conducting portion.

2. The vapor chamber according to claim 1, characterized in that: The evaporation part includes an evaporation part shell, and a liquid absorption core is arranged in the evaporation part shell; the first condensation part includes a first condensation part shell, and a first liquid storage core is arranged in the first condensation part shell; the first heat conduction part includes a first liquid flow channel and at least one first gas flow channel, and the first liquid flow channel and the first gas flow channel are both connected to the evaporation part shell and the first condensation part shell.

3. The heat sink according to claim 2, characterized in that: A first liquid guide core is provided in the first liquid flow channel, and two ends of the first liquid guide core are respectively connected to the liquid absorption core and the first liquid storage core; The liquid absorbent core is also provided with a plurality of first grooves, and the plurality of first grooves are all located at one end of the liquid absorbent core close to the first gas flow channel; the first liquid storage core is also provided with a plurality of second grooves, and the plurality of second grooves are all located at one end of the first liquid storage core close to the first gas flow channel.

4. The heat sink according to claim 3, characterized in that: The second condensation section includes a second condensation section shell, in which a second liquid storage core is arranged; the second heat conduction section includes a second liquid flow channel and at least one second gas flow channel, and the second liquid flow channel and the second gas flow channel are both connected to the first condensation section shell and the second condensation section shell.

5. The vapor chamber according to claim 4, characterized in that: A second liquid introduction core is provided in the second liquid flow channel, and two ends of the second liquid introduction core are respectively connected to the first liquid storage core and the second liquid storage core; The first liquid storage core is also provided with a plurality of third grooves, and the plurality of third grooves are all located at one end of the first liquid storage core close to the second gas flow channel; the second liquid storage core is also provided with a plurality of fourth grooves, and the plurality of fourth grooves are all located at one end of the second liquid storage core close to the second gas flow channel.

6. The vapor chamber according to claim 5, characterized in that: When the electronic device is in a folded state, in a plane parallel to the screen of the electronic device, the projection of the evaporation portion is outside the projection range of the second condensation portion.

7. The vapor chamber according to claim 5, characterized in that: The materials of the second liquid flow channel and the second gas flow channel are both memory alloys, and the memory alloys include β-titanium alloy or nickel-titanium alloy.

8. The vapor chamber according to claim 7, characterized in that: The materials of the evaporation part shell, the first liquid flow channel, the first gas flow channel, the first condensation part shell and the second condensation part shell are all stainless steel or copper.

9. The vapor chamber according to claim 5, characterized in that: The liquid absorbing core, the first liquid introducing core, the first liquid storing core, the second liquid introducing core and the second liquid storing core are all porous media made of metal; the porous media made of metal include one or more of copper mesh, copper fiber, copper powder or foam copper.

10. The vapor chamber according to claim 5, characterized in that: Also included is a cooling medium, which includes deionized water.

11. An electronic device, characterized in that: The electronic device comprises a first part, a second part and a flexible connecting section, and is provided with a heat spreader as described in any one of claims 1 to 10.

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