Dispensing machine for semiconductor element packaging and control system thereof

Abstract

The invention relates to the field of semiconductor element packaging, and discloses a dispensing machine for semiconductor element packaging and a control system thereof.The dispensing machine comprises a dispensing mechanism, the top of the dispensing mechanism is fixedly connected with an air drying mechanism, the top of the dispensing mechanism is fixedly connected with a monitoring mechanism, and the bottom of the dispensing mechanism is fixedly connected with a protection mechanism; the dispensing mechanism comprises a workbench, the top of the workbench is fixedly connected with a long vertical plate, and the top of the long vertical plate is fixedly connected with a long top plate. According to the dispensing machine for packaging the semiconductor element and the control system of the dispensing machine, through the arranged dispensing mechanism, dispensing can be conveniently carried out on the semiconductor element, workers do not need to carry out manual dispensing on the semiconductor element, the working content of the workers is reduced, the working complexity of the workers is reduced, the dispensing speed of the dispensing machine is increased, and the working efficiency of the workers is improved. And the working time of workers is shortened, and the working efficiency of the workers is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor element packaging, in particular to a glue dispensing machine for semiconductor element packaging and a control system thereof. Background Art

[0002] Semiconductor component packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end process of the wafer are cut into small chips through the dicing process, and then the cut chips are glued to the corresponding islands on the substrate rack, which requires the use of a glue dispenser.

[0003] However, the glue dispensing machines currently available on the market are not very convenient to use and cannot automatically dispense glue on the packaging of semiconductor components. Workers are required to manually dispense glue on the semiconductor components, which increases the work content of the workers, increases the complexity of their work, reduces their work speed, increases the dispensing time of the glue dispensing machine, and reduces their work efficiency. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a glue dispensing machine for semiconductor element packaging and a control system thereof, which has the function of automatic glue dispensing and solves the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a glue dispensing machine for semiconductor component packaging and its control system, comprising a glue dispensing mechanism, the top of which is fixedly connected to a drying mechanism, the top of which is fixedly connected to a monitoring mechanism, and the bottom of which is fixedly connected to a protection mechanism.

[0008] The dispensing mechanism comprises:

[0009] A workbench, the top of the workbench is fixedly connected to a long vertical board, the top of the long vertical board is fixedly connected to a long top board, the bottom of the long top board is fixedly connected to a glue storage box, the top of the glue storage box is fixedly connected to a boosting pipe, one end of the boosting pipe is fixedly connected to a boosting device, the bottom of the glue storage box is fixedly connected to a glue dispensing head, the top of the glue storage box is fixedly connected to a glue injection pipe, the top of the glue injection pipe is movably connected to a pipe cover, one side of the workbench is fixedly connected to a side panel, one side of the side panel is fixedly connected to a telescopic sleeve, the top of the telescopic sleeve is fixedly connected to a connecting plate, and one end of the connecting plate is fixedly connected to a storage movable plate, which can conveniently dispense glue for semiconductor components without the need for staff to manually dispense glue for semiconductor components, thereby reducing the work content of the staff, reducing the complexity of the staff's work, accelerating the dispensing speed of the glue dispensing machine, reducing the working time of the staff, and improving the work efficiency of the staff.

[0010] Furthermore, a small vertical plate is fixedly connected to the top of the workbench, and a small top plate is fixedly connected to the top of the small vertical plate, so as to facilitate the connection of other components.

[0011] Furthermore, the top of the small top plate is fixedly connected to a heating manufacturing device, the top of the heating manufacturing device is fixedly connected to an air inlet pipe, and the bottom of the heating manufacturing device is fixedly connected to an air outlet pipe, so that semiconductor components can be solidified after glue dispensing.

[0012] Furthermore, a support frame is fixedly connected to the top of the workbench, and a monitoring instrument is fixedly connected to the top of the support frame to facilitate the control of the operation of the dispensing machine.

[0013] Furthermore, a lifting inner column is fixedly connected to the bottom of the workbench, and the number of the lifting inner columns is four, which is convenient for adjusting the height of the working mechanism.

[0014] Furthermore, a protection frame is fixedly connected to the bottom end of the lifting inner column, and the length and width of the protection frame are greater than the length and width of the workbench, so as to provide protection for other mechanisms.

[0015] Furthermore, a hinge is fixedly connected to one side of the protection frame, a frame top is fixedly connected to one side of the hinge, and a top handle is fixedly connected to one side of the frame top, so that the protection frame can be closed to provide more protection for other mechanisms.

[0016] Furthermore, the following steps are included:

[0017] S1. The monitoring instrument starts working and detects that glue needs to be dispensed on the semiconductor component. The telescopic sleeve is controlled to retract so that the semiconductor component on the storage movable plate is located below the glue dispensing head. The booster device starts working and the glue dispensing head dispenses glue on the semiconductor component.

[0018] S2. After the monitoring instrument detects that the dispensing is completed, the telescopic sleeve is controlled to retract again so that the storage movable plate is located below the air outlet pipe, and the heating manufacturing equipment starts to work, spraying heating air through the air outlet pipe to solidify the liquid glue;

[0019] S3. After the monitoring instrument detects that the dispensing machine has completed its work, it controls the lifting inner column to retract, so that the dispensing mechanism, air drying mechanism and monitoring mechanism are all located in the protective frame, and the top of the frame and the top of the protective frame are closed through the top handle.

[0020] The present invention provides a glue dispensing machine for semiconductor component packaging and a control system thereof. The invention has the following beneficial effects:

[0021] 1. The dispensing machine for semiconductor component packaging and its control system, through the dispensing mechanism, if it is necessary to dispense glue to the semiconductor component, first inject glue into the glue storage box through the glue injection tube to place the semiconductor component in the depression above the storage movable plate. At this time, the telescopic sleeve begins to retract, so that the semiconductor component is located below the dispensing head, and the booster device starts to work. The booster device increases the pressure in the glue storage box through the booster tube, so that the dispensing head can first dispense glue on the semiconductor component, thereby completing the automatic dispensing of the semiconductor component. It is convenient to dispense glue for semiconductor components, and there is no need for staff to manually dispense glue for semiconductor components, which reduces the work content of the staff, reduces the complexity of the staff's work, speeds up the dispensing speed of the dispensing machine, reduces the working time of the staff, and improves the work efficiency of the staff.

[0022] 2. The semiconductor component packaging glue dispensing machine and its control system, through the air drying mechanism, when the semiconductor component that has been glued needs to solidify the colloid, the telescopic sleeve begins to retract again. The retraction of the telescopic sleeve causes the storage movable plate to move to the bottom of the air outlet pipe. At this time, the heating manufacturing equipment starts to work, and the heating manufacturing equipment inhales air through the air inlet pipe and blows warm air to the colloid on the semiconductor component through the air outlet pipe, so that the colloid can be quickly fixed. The semiconductor component after glue dispensing can be quickly fixed without waiting for the natural solidification of the colloid, reducing the time required for the colloid to solidify, improving the packaging speed of semiconductor components, improving the overall working speed of the staff, speeding up the progress of subsequent work, and improving the overall work efficiency of the staff.

[0023] 3. The semiconductor component packaging glue dispensing machine and its control system, through the monitoring mechanism set up, when the glue dispensing machine needs to dispense glue to the semiconductor component, the monitoring instrument starts working, and when the monitoring instrument detects that the storage movable plate is located below the glue dispensing head, the telescopic sleeve can stop shrinking, and the glue dispensing mechanism can complete the packaging glue dispensing of the semiconductor component. When the monitoring instrument detects that the storage movable plate is located below the air outlet pipe, the telescopic sleeve can also stop shrinking, and the air drying mechanism can complete the air drying of the colloid. The normal operation of the glue dispensing machine as a whole is guaranteed, the speed of the overall operation of the glue dispensing machine is improved, and the execution efficiency of the glue dispensing machine is also improved.

[0024] 4. The semiconductor component packaging glue dispensing machine and its control system have a protective mechanism. When the glue dispensing machine is not working, the lifting inner column starts to move. The contraction of the lifting inner column allows the glue dispensing mechanism, air drying mechanism and monitoring mechanism to be located inside the protective frame. The top handle is then used to cover the top of the protective frame, thereby completing the protection of other working mechanisms. The overall integrity of the glue dispensing machine is improved, the glue dispensing machine is prevented from being affected by the environment when not working, and the service life of the glue dispensing machine is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional diagram of the structure of the present invention;

[0026] Figure 2 It is a three-dimensional diagram of the connection structure between the frame top and the top handle of the present invention;

[0027] Figure 3 It is a rear view of the structure of the present invention;

[0028] Figure 4 It is a side sectional view of the structure of the present invention;

[0029] Figure 5 This is a diagram showing the structure of the dispensing mechanism of the present invention;

[0030] Figure 6 This is a diagram showing the structure of the air-drying mechanism of the present invention;

[0031] Figure 7 The structure of the present invention Figure 1 Enlarged view of point A in the middle;

[0032] Figure 8 It is a schematic diagram of the process of the present invention.

[0033] In the figure: 1. Glue dispensing mechanism; 101. Workbench; 102. Long vertical board; 103. Long top board; 104. Glue storage box; 105. Booster pipe; 106. Booster equipment; 107. Glue dispensing head; 108. Glue injection tube; 109. Tube cover; 110. Side panel; 111. Telescopic sleeve; 112. Connecting plate; 113. Storage movable plate; 2. Air drying mechanism; 201. Small vertical board; 202. Small top board; 203. Heating manufacturing equipment; 204. Air inlet pipe; 205. Air outlet pipe; 3. Monitoring mechanism; 301. Support frame; 302. Monitoring instrument; 4. Protection mechanism; 401. Lifting inner column; 402. Protection frame; 403. Hinge; 404. Frame top; 405. Top handle. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Embodiment 1, the preferred embodiment of the semiconductor element packaging dispensing machine and its control system provided by the present invention is as follows Figures 1 to 7 As shown: a glue dispensing machine for semiconductor component packaging and its control system, including a glue dispensing mechanism 1, a drying mechanism 2 is fixedly connected to the top of the glue dispensing mechanism 1, a monitoring mechanism 3 is fixedly connected to the top of the glue dispensing mechanism 1, and a protection mechanism 4 is fixedly connected to the bottom of the glue dispensing mechanism 1.

[0036] The dispensing mechanism 1 comprises:

[0037] A workbench 101 is fixedly connected to a long vertical board 102 on the top of the workbench 101, a long top board 103 is fixedly connected to the top of the long vertical board 102, a glue storage box 104 is fixedly connected to the bottom of the long top board 103, a booster pipe 105 is fixedly connected to the top of the glue storage box 104, a booster device 106 is fixedly connected to one end of the booster pipe 105, a glue dispenser 107 is fixedly connected to the bottom of the glue storage box 104, a glue injection pipe 108 is fixedly connected to the top of the glue storage box 104, a pipe cover 109 is movably connected to the top of the glue injection pipe 108, and a glue storage box 104 is fixedly connected to the top of the glue storage box 104. One side is fixedly connected to a side panel 110, one side of the side panel 110 is fixedly connected to a telescopic sleeve 111, the top of the telescopic sleeve 111 is fixedly connected to a connecting plate 112, and one end of the connecting plate 112 is fixedly connected to a storage movable plate 113, which can conveniently dispense glue for semiconductor components without the need for staff to manually dispense glue for semiconductor components, thereby reducing the work content and complexity of the staff, speeding up the dispensing speed of the glue dispensing machine, reducing the working time of the staff, and improving the work efficiency of the staff.

[0038] Furthermore, a small vertical plate 201 is fixedly connected to the top of the workbench 101, and a small top plate 202 is fixedly connected to the top of the small vertical plate 201, so as to facilitate the connection with other components.

[0039] Furthermore, the top of the small top plate 202 is fixedly connected to a heating manufacturing device 203, the top of the heating manufacturing device 203 is fixedly connected to an air inlet pipe 204, and the bottom of the heating manufacturing device 203 is fixedly connected to an air outlet pipe 205, which can be used to solidify the semiconductor components after gluing.

[0040] Furthermore, the top of the workbench 101 is fixedly connected to a support frame 301, and the top of the support frame 301 is fixedly connected to a monitoring instrument 302, which facilitates the control of the operation of the dispensing machine.

[0041] Furthermore, a lifting inner column 401 is fixedly connected to the bottom of the workbench 101, and the number of the lifting inner columns 401 is four, which is convenient for adjusting the height of the working mechanism.

[0042] Furthermore, a protective frame 402 is fixedly connected to the bottom end of the lifting inner column 401, and the length and width of the protective frame 402 are greater than the length and width of the workbench 101, so as to provide protection for other mechanisms.

[0043] Furthermore, a hinge 403 is fixedly connected to one side of the protection frame 402, a frame top 404 is fixedly connected to one side of the hinge 403, and a top handle 405 is fixedly connected to one side of the frame top 404, so that the protection frame 402 can be closed to provide more protection for other mechanisms.

[0044] Furthermore, the following steps are included:

[0045] S1, the monitoring instrument 302 starts working and detects that glue needs to be dispensed on the semiconductor element, controls the telescopic sleeve 111 to retract, so that the semiconductor element on the storage movable plate 113 is located below the glue dispensing head 107, and the booster device 106 starts working, and the glue dispensing head 107 dispenses glue on the semiconductor element;

[0046] S2, after the monitoring instrument 302 detects that the dispensing is completed, the telescopic sleeve 111 is controlled to retract again, so that the storage movable plate 113 is located below the outlet pipe 205, and the heating manufacturing device 203 starts to work, spraying heating air through the outlet pipe 205 to solidify the liquid glue;

[0047] S3. After the monitoring instrument 302 detects that the glue dispensing machine has completed its work, it controls the lifting inner column 401 to retract, so that the glue dispensing mechanism 1, the air-drying mechanism 2 and the monitoring mechanism 3 are all located in the protective frame 402, and the frame top 404 and the top of the protective frame 402 are closed through the top handle 405.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A glue dispensing machine for semiconductor element packaging, comprising a glue dispensing mechanism (1), characterized in that: The top of the glue dispensing mechanism (1) is fixedly connected to a drying mechanism (2), the top of the glue dispensing mechanism (1) is fixedly connected to a monitoring mechanism (3), and the bottom of the glue dispensing mechanism (1) is fixedly connected to a protection mechanism (4); The dispensing mechanism (1) comprises: A workbench (101), the top of the workbench (101) is fixedly connected to a long vertical board (102), the top of the long vertical board (102) is fixedly connected to a long top board (103), the bottom of the long top board (103) is fixedly connected to a glue storage box (104), the top of the glue storage box (104) is fixedly connected to a booster pipe (105), one end of the booster pipe (105) is fixedly connected to a booster device (106), the bottom of the glue storage box (104) is fixedly connected to a glue dispenser (106), and the bottom of the glue storage box (104) is fixedly connected to a glue dispenser (106). 07), the top of the glue storage box (104) is fixedly connected to a glue injection tube (108), the top of the glue injection tube (108) is movably connected to a tube cover (109), one side of the workbench (101) is fixedly connected to a side panel (110), one side of the side panel (110) is fixedly connected to a telescopic sleeve (111), the top of the telescopic sleeve (111) is fixedly connected to a connecting plate (112), and one end of the connecting plate (112) is fixedly connected to a storage movable plate (113).

2. A glue dispensing machine for semiconductor element packaging according to claim 1, characterized in that: A small vertical plate (201) is fixedly connected to the top of the workbench (101), and a small top plate (202) is fixedly connected to the top of the small vertical plate (201).

3. A glue dispensing machine for semiconductor element packaging according to claim 2, characterized in that: The top of the small top plate (202) is fixedly connected to a heating device (203), the top of the heating device (203) is fixedly connected to an air inlet pipe (204), and the bottom of the heating device (203) is fixedly connected to an air outlet pipe (205).

4. The semiconductor element packaging glue dispensing machine according to claim 1, characterized in that: The top of the workbench (101) is fixedly connected to a support frame (301), and the top of the support frame (301) is fixedly connected to a monitoring instrument (302).

5. The semiconductor element packaging glue dispensing machine according to claim 1, characterized in that: The bottom of the workbench (101) is fixedly connected with a lifting inner column (401), and the number of the lifting inner columns (401) is four.

6. A glue dispensing machine for semiconductor element packaging according to claim 5, characterized in that: The bottom end of the lifting inner column (401) is fixedly connected to a protection frame (402), and the length and width of the protection frame (402) are both greater than the length and width of the workbench (101).

7. A glue dispensing machine for semiconductor element packaging according to claim 6, characterized in that: A hinge (403) is fixedly connected to one side of the protection frame (402), a frame top (404) is fixedly connected to one side of the hinge (403), and a top handle (405) is fixedly connected to one side of the frame top (404).

8. A glue dispensing machine for semiconductor element packaging and its control system, characterized in that: The following steps are involved: S1, the monitoring instrument (302) starts working and detects that glue needs to be dispensed on the semiconductor element, controls the telescopic sleeve (111) to retract, so that the semiconductor element on the storage movable plate (113) is located below the glue dispensing head (107), and the booster device (106) starts working, and the glue dispensing head (107) dispenses glue on the semiconductor element; S2, after the monitoring instrument (302) detects that the dispensing is completed, the telescopic sleeve (111) is controlled to retract again, so that the storage movable plate (113) is located below the air outlet pipe (205), and the heating manufacturing device (203) starts to work, spraying heating air through the air outlet pipe (205) to solidify the liquid glue; S3. After the monitoring instrument (302) detects that the glue dispensing machine has completed its work, it controls the lifting inner column (401) to retract, so that the glue dispensing mechanism (1), the air drying mechanism (2) and the monitoring mechanism (3) are all located in the protective frame (402), and the frame top (404) and the top of the protective frame (402) are closed through the top handle (405).

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