A device for removing fragments from a sorting and loading table for preparing single-crystalline silicon and its usage method

Abstract

The present invention relates to the technical field of debris removal on the sorting and feeding table for single-crystal silicon preparation, and discloses a debris removal device for the sorting and feeding table in single-crystal silicon preparation and its usage method, including a feeding table, and a fixed table is fixedly connected to the middle of the feeding table. In the present invention, the rotating disk rotates to drive a plurality of push rods on the transmission belt to rotate. When the pressing column I on the push rod presses against the pressure pressing plate, the pressing telescopic rod on one side of the pressure pressing plate contracts under the extrusion of the pressing column I, and the pressing spring is compressed and contracts. The elastic force of the pressing spring increases, and the pressing arc piece at one end of the pressing telescopic rod is subjected to an increased pressing force of the pressing spring, and the pressing force between the pressing arc piece and the side wall of the single-crystal silicon wafer increases. Such a setting is beneficial in that on the one hand, it enables the single-crystal silicon wafer at the bottom layer in the feeding cylinder to be separated from several other single-crystal silicon wafers in the feeding cylinder, thereby reducing the friction generated between the bottom of the single-crystal silicon wafer at the bottom layer and other single-crystal silicon wafers, and thus reducing the scratches generated on the surface of the single-crystal silicon wafer at the bottom layer due to friction.

Description

Technical Field

[0001] The present invention relates to the technical field of fragment removal equipment for a sorting and loading table in single-crystal silicon preparation, and specifically to a device for removing fragments from a sorting and loading table in single-crystal silicon preparation and its usage method. Background Technique

[0002] Single-crystal silicon generally refers to a substance formed by silicon atoms in a certain arrangement. Silicon is the most common and widely used semiconductor material. When molten elemental silicon solidifies, silicon atoms arrange in a diamond lattice to form a crystal nucleus, and the crystal nucleus grows into grains with the same crystal plane orientation, forming single-crystal silicon. As a relatively active non-metallic element crystal, single-crystal silicon is an important part of crystal materials and is at the forefront of the development of new materials. The manufacturing of single-crystal silicon materials goes through the following process: quartz sand - metallurgical-grade silicon - purification and refining - deposition of polycrystalline silicon ingots - single-crystal silicon - silicon wafer cutting. Its main uses are as semiconductor materials and for solar photovoltaic power generation, heating, etc. With the continuous maturity and improvement of semiconductor manufacturing technology, the cost of silicon wafer manufacturing has been continuously reduced, but the cost of silicon wafers used in solar cells has remained high. In the process of single-crystal silicon wafer preparation, there is a sorting device for single-crystal silicon wafers, that is, a device for efficiently removing unqualified single-crystal silicon wafers.

[0003] Under the existing technology, the single-crystal silicon removal device usually needs to place several single-crystal silicon wafers on the loading table. During the process of detecting one by one, friction or collision is likely to occur between the surfaces of several single-crystal wafers, thereby damaging the quality of the single-crystal silicon wafers and increasing the unqualified rate of single-crystal silicon wafer products. Summary of the Invention

[0004] The purpose of the present invention is to provide a device for removing fragments from a sorting and loading table in single-crystal silicon preparation and its usage method to solve the problems raised in the above background technique.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a device for removing fragments from a sorting and loading table in single-crystal silicon preparation and its usage method, including a loading table. A fixed table is fixedly connected to the middle of the loading table. Several support legs are fixedly connected to the bottom of the fixed table. Several connecting plates are fixedly connected to the side wall of the loading table. One end of the connecting plate away from the loading table is fixedly connected to a feeding cylinder. Several single-crystal silicon wafers are arranged inside the feeding cylinder. It further includes:

[0007] A pushing and selecting mechanism. The pushing and selecting mechanism includes that a fixing plate is fixedly connected to the side wall of the fixed table. One end of the fixing plate away from the fixed table is fixedly connected to a first driving motor. The output end of the first driving motor is fixedly connected to an output rotating shaft one. One end of the output rotating shaft one away from the first driving motor is fixedly connected to a rotating disk.

[0008] Further, the feeding mechanism further includes a transmission belt drivingly connected to the rotating disk. A plurality of pushing rods are fixedly connected to the side wall of the transmission belt on the side away from the driving motor. A fixed block is fixedly connected to the outer wall of the feeding cylinder, and an image sensor is fixedly connected to the bottom of the fixed block.

[0009] Further, an auxiliary sliding mechanism is arranged directly above the feeding table. The auxiliary sliding mechanism includes a plurality of fixed bars fixedly connected directly above the feeding table, and a plurality of auxiliary rollers are rotatably connected to the side walls of the fixed bars.

[0010] Further, a lifting mechanism is arranged on the outer wall of the feeding cylinder. The lifting mechanism includes a first extrusion column fixedly connected to both ends of the pushing rod. A second extrusion column is fixedly connected to the end of the first extrusion column away from the pushing rod. A plurality of sliding grooves are formed in the outer wall of the feeding cylinder, and an extrusion telescopic rod is slidably connected inside the sliding grooves. An extrusion arc plate is slidably connected to the inner wall of the feeding cylinder, and one side of the extrusion arc plate away from the single crystal silicon wafer is fixedly connected to the extrusion telescopic rod.

[0011] Further, the lifting mechanism further includes an extrusion spring sleeved on the end of the extrusion telescopic rod away from the extrusion arc plate. A pressure extrusion plate is fixedly connected to the end of the extrusion telescopic rod away from the extrusion arc plate, and a lifting extrusion plate is fixedly connected to the bottom of the pressure extrusion plate.

[0012] Further, a rejection mechanism is arranged in the middle of the feeding table. The rejection mechanism includes a second driving motor fixedly connected to the side wall of the fixed table. An output rotating shaft two is fixedly connected to the output end of the second driving motor. A rejection wheel is connected to the end of the output rotating shaft two away from the second driving motor. A rejection conveyor belt is drivingly connected to the outer wall of the rejection wheel. The rejection conveyor belt is made of an elastic material, and a bottom plate is fixedly connected to the inner wall of the feeding table.

[0013] Further, the rejection mechanism further includes a plurality of electric push rods fixedly connected to both sides of the bottom plate. A plurality of linkage rods are rotatably connected to the ends of the electric push rods away from the bottom plate. A plurality of rejection telescopic rods are fixedly connected to the side wall of the feeding table. A connecting block is fixedly connected to the end of the rejection telescopic rod away from the feeding table. A rising roller is rotatably connected to the end of the connecting block away from the rejection telescopic rod. The end of the linkage rod away from the push plate is rotatably connected to the rising roller. A storage box is fixedly connected to the end of the fixed table away from the second driving motor.

[0014] The usage method of the single crystal silicon preparation sorting and feeding table chip rejection device includes the following steps:

[0015] S1: Pushing detection. When the pushing rod on the transmission belt rotates to directly below the feeding cylinder, the pushing rod can push out the single crystal silicon wafer at the bottom layer of the feeding cylinder. At this time, the pushing rod pushes the single crystal silicon wafer to slide directly above the feeding table. At this time, the image sensor directly below the fixed block can take pictures and detect the surface of the single crystal silicon wafer;

[0016] S2: Auxiliary detection. The rotation of the drive belt drives the rotation of several push rods on the drive belt. When the push rod on the drive belt rotates to directly below the feed cylinder, the push rod can push out the single-crystal silicon wafers at the bottom layer of the feed cylinder. At this time, the bottom of the single-crystal silicon wafer contacts the auxiliary roller on the fixed strip.

[0017] S3: Auxiliary pushing. The rotation of the rotating disk drives the rotation of several push rods on the drive belt. When the first extrusion column on the push rod extrudes the pressure extrusion plate, the extrusion telescopic rod on one side of the pressure extrusion plate extruded by the first extrusion column contracts, and the extrusion spring is compressed and contracts. The elastic force of the extrusion spring increases, and the extrusion arc piece at one end of the extrusion telescopic rod is subjected to an increased extrusion force from the extrusion spring, and the extrusion force between the extrusion arc piece and the side wall of the single-crystal silicon wafer increases. At this time, the second extrusion column on the first extrusion column generates extrusion with the lifting extrusion plate, and the lifting extrusion plate is extruded to drive the extrusion telescopic rod on the pressure extrusion plate to move upward along the sliding groove, and the extrusion telescopic rod drives the single-crystal silicon wafer at one end of the extrusion arc piece to slide upward along the inner wall of the feed cylinder.

[0018] S4: Reject unqualified products. The rotation of the output end of the second drive motor drives the rotation of the rejection wheel on the output rotating shaft two. The rotation of the rejection wheel drives the rotation of the rejection conveyor belt. When the image sensor detects that the single-crystal silicon wafer is an unqualified product, the electric push rod starts and drives the push plate to move towards the end away from the electric push rod. The movement of the push plate drives the rising roller at one end of the linkage rod to move upward along the rejection telescopic rod. At this time, the rising roller drives the rejection conveyor belt to move upward until the surface of the rejection conveyor belt contacts the bottom of the unqualified single-crystal silicon wafer. At this time, the rejection conveyor belt drives the unqualified single-crystal silicon wafer to move towards the end close to the storage box, and the rejection conveyor belt conveys the unqualified single-crystal silicon wafer into the storage box.

[0019] The present invention has the following beneficial effects:

[0020] (1) In the present invention, by providing a lifting mechanism, the rotating disk rotates to drive a plurality of push rods on the transmission belt to rotate. When the extrusion column I on the push rod presses against the pressure extrusion plate, the extrusion telescopic rod on one side of the pressure extrusion plate contracts due to the extrusion of the extrusion column I, and the extrusion spring contracts under extrusion. The elastic force of the extrusion spring increases, and the extrusion arc piece at one end of the extrusion telescopic rod is subjected to an increased extrusion force from the extrusion spring, resulting in an increased extrusion force between the extrusion arc piece and the side wall of the single crystal silicon wafer. At this time, the extrusion column II on the extrusion column I presses against the lifting extrusion plate, and the lifting extrusion plate drives the extrusion telescopic rod on the pressure extrusion plate to move upward along the sliding groove. The extrusion telescopic rod drives the single crystal silicon wafer at one end of the extrusion arc piece to slide upward along the inner wall of the feeding cylinder. This setting is beneficial in that, on the one hand, it helps to separate the bottommost single crystal silicon wafer in the feeding cylinder from several other single crystal silicon wafers in the feeding cylinder, thereby reducing the friction between the bottommost single crystal silicon wafer and the bottoms of other single crystal silicon wafers, and thus reducing scratches on the surface of the bottommost single crystal silicon wafer caused by friction. On the other hand, it is beneficial for the bottommost single crystal silicon wafer to smoothly slide out of the feeding cylinder, thereby improving the working efficiency of the device.

[0021] (2) In the present invention, when using the single crystal silicon preparation sorting and loading table chip rejection device, first place a plurality of single crystal silicon wafers to be processed inside the feeding cylinder. Then start the driving motor I, and the output end of the driving motor I drives the output rotating shaft I to rotate. The rotation of the output rotating shaft I drives the transmission belt on the rotating disk to rotate. The rotation of the transmission belt drives a plurality of push rods on the transmission belt to rotate. When the push rod on the transmission belt rotates to directly below the feeding cylinder, the push rod can push out the bottommost single crystal silicon wafer in the feeding cylinder. At this time, the push rod pushes the single crystal silicon wafer to slide directly above the loading table. At this time, the image sensor directly below the fixed block can take pictures and detect the surface of the single crystal silicon wafer. By providing a push and selection mechanism, the single crystal silicon wafers inside the feeding cylinder can be continuously sent directly below the image sensor for detection, thereby reducing human interference and improving the sorting efficiency of the device.

[0022] (3) In the present invention, by providing an auxiliary sliding mechanism, the rotation of the transmission belt drives a plurality of push rods on the transmission belt to rotate. When the push rod on the transmission belt rotates to directly below the feeding cylinder, the push rod can push out the bottommost single crystal silicon wafer in the feeding cylinder. At this time, the bottom of the single crystal silicon wafer contacts the auxiliary roller on the fixed strip. This setting is beneficial for the single crystal silicon wafer to generate rolling friction with the auxiliary roller, avoiding sliding friction between the bottom of the single crystal silicon wafer and the surface of the loading table, and thus preventing scratches on the bottom of the single crystal silicon wafer.

[0023] (4) In this invention, by setting up a rejection mechanism, since the image sensor is electrically connected to the electric push rod, at this time, the output end of the driving motor 2 rotates to drive the rejection wheel on the output rotating shaft 2 to rotate, and the rotation of the rejection wheel drives the rejection conveyor belt to rotate. When the image sensor detects that the single-crystalline silicon wafer is a non-conforming product, the electric push rod starts and drives the push plate to move towards the end away from the electric push rod. The movement of the push plate drives the rising roller at one end of the linkage rod to move upward along the rejection telescopic rod. At this time, the rising roller drives the rejection conveyor belt to move upward until the surface of the rejection conveyor belt contacts the bottom of the non-conforming single-crystalline silicon wafer. At this time, the rejection conveyor belt drives the non-conforming single-crystalline silicon wafer to move towards the end close to the storage box, and the rejection conveyor belt conveys the non-conforming single-crystalline silicon wafer into the storage box. Such a setting is beneficial to timely reject non-conforming single-crystalline silicon wafers.

[0024] Of course, it is not necessary for any product implementing this invention to simultaneously achieve all the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of this invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 Structural schematic diagram of the overall perspective of this invention;

[0027] Figure 2 Structural schematic diagram of the second overall perspective of this invention;

[0028] Figure 3 Structural schematic diagram of the pushing and material selection mechanism of this invention;

[0029] Figure 4 In this invention Figure 3 Enlarged view of A;

[0030] Figure 5 Structural schematic diagram of the lifting mechanism of this invention;

[0031] Figure 6 Structural schematic diagram of the rejection mechanism of this invention;

[0032] Figure 7 Partial structural schematic diagram of the rejection mechanism of this invention;

[0033] Figure 8 In this invention Figure 7 Enlarged view of B;

[0034] Figure 9 Flowchart of the usage method of this invention.

[0035] In the accompanying drawings, the list of components represented by each reference numeral is as follows:

[0036] In the figure: 1. Loading table; 11. Fixed table; 12. Support legs; 13. Connecting plate; 14. Feeding cylinder; 15. Monocrystalline silicon wafer; 2. Pushing and selecting mechanism; 201. Fixed plate; 202. Driving motor 1; 203. Output rotating shaft 1; 204. Rotating disk; 205. Transmission belt; 206. Pushing rod; 207. Fixed block; 208. Image sensor; 3. Auxiliary sliding mechanism; 301. Fixed strip; 302. Auxiliary roller; 4. Lifting mechanism; 401. Extrusion column 1; 402. Extrusion column 2; 403. Sliding groove; 404. Extrusion arc plate; 405. Extrusion telescopic rod; 406. Extrusion spring; 407. Pressure extrusion plate; 408. Lifting extrusion plate; 5. Rejection mechanism; 501. Driving motor 2; 502. Output rotating shaft 2; 503. Rejection wheel; 504. Rejection conveyor belt; 505. Bottom plate; 506. Electric push rod; 507. Pushing plate; 508. Linking rod; 509. Rejection telescopic rod; 510. Connecting block; 511. Rising roller; 512. Storage box. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] Embodiment 1, please refer to Figures 1-5 As shown, the present invention is a device for removing fragments from a loading table for the preparation and sorting of monocrystalline silicon and its use method, including a loading table 1. A fixed table 11 is fixedly connected to the middle of the loading table 1. A plurality of support legs 12 are fixedly connected to the bottom of the fixed table 11. A plurality of connecting plates 13 are fixedly connected to the side wall of the loading table 1. One end of the connecting plate 13 away from the loading table 1 is fixedly connected to a feeding cylinder 14. A plurality of monocrystalline silicon wafers 15 are arranged inside the feeding cylinder 14. It further includes:

[0039] A pushing and selecting mechanism 2. The pushing and selecting mechanism 2 includes a fixed plate 201 fixedly connected to the side wall of the fixed table 11. One end of the fixed plate 201 away from the fixed table 11 is fixedly connected to a driving motor 1 202. The output end of the driving motor 1 202 is fixedly connected to an output rotating shaft 1 203. One end of the output rotating shaft 1 203 away from the driving motor 1 202 is fixedly connected to a rotating disk 204.

[0040] The material selection mechanism 2 further comprises a transmission belt 205 which is connected to the rotating disk 204, and a plurality of push rods 206 are fixedly connected to the side wall of the transmission belt 205 away from the driving motor 202, and a fixed block 207 is fixedly connected to the outer wall of the feeding barrel 14, and an image sensor 208 is fixedly connected to the bottom of the fixed block 207. The function of this component is that when the single crystal silicon is used to prepare a fragment removal device for a sorting loading table, a plurality of single crystal silicon wafers 15 to be processed are first placed into the feeding barrel 14, and then the driving motor 202 is started, and the output end of the driving motor 202 drives the output shaft 203 to rotate, and the output shaft 203 rotates to drive the transmission belt 20 on the rotating disk 204 5 rotates, the transmission belt 205 rotates to drive several push rods 206 on the transmission belt 205 to rotate. When the push rods 206 on the transmission belt 205 rotate to the bottom of the feeding barrel 14, the push rods 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14. At this time, the push rods 206 push the single crystal silicon wafer 15 to slide along the top of the loading platform 1. At this time, the image sensor 208 under the fixed block 207 can shoot and detect the surface of the single crystal silicon wafer 15. By setting the pushing material selection mechanism 2, the single crystal silicon wafer 15 in the feeding barrel 14 can be continuously sent to the bottom of the image sensor 208 for detection, thereby reducing the interference of personnel and improving the sorting efficiency of the device.

[0041] An auxiliary sliding mechanism 3 is arranged directly above the loading platform 1. The auxiliary sliding mechanism 3 includes a plurality of fixed bars 301 fixedly connected directly above the loading platform 1. The side walls of the fixed bars 301 are rotatably connected to a plurality of auxiliary rollers 302. The function of this component is to arrange the auxiliary sliding mechanism 3, and the rotation of the transmission belt 205 drives the rotation of a plurality of push rods 206 on the transmission belt 205. When the push rod 206 on the transmission belt 205 rotates to directly below the feed barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom layer of the feed barrel 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed bar 301. This arrangement is conducive to the rolling friction between the single crystal silicon wafer 15 and the auxiliary roller 302, thereby avoiding sliding friction between the bottom of the single crystal silicon wafer 15 and the surface of the loading platform 1, thereby avoiding scratches on the bottom of the single crystal silicon wafer 15.

[0042] The outer wall of the feed barrel 14 is provided with a lifting mechanism 4, which includes an extrusion column 1 401 fixedly connected to both ends of the push rod 206, and the end of the extrusion column 1 401 away from the push rod 206 is fixedly connected to the extrusion column 2 402, and the outer wall of the feed barrel 14 is provided with a plurality of sliding grooves 403, and the sliding grooves 403 are slidably connected with an extrusion telescopic rod 405, and the inner wall of the feed barrel 14 is slidably connected with an extrusion arc plate 404, and the side of the extrusion arc plate 404 away from the single crystal silicon wafer 15 is fixedly connected to the extrusion telescopic rod 405.

[0043] The lifting mechanism 4 further includes a compression spring 406 sleeved on one end of the extrusion telescopic rod 405 away from the extrusion arc plate 404. One end of the extrusion telescopic rod 405 away from the extrusion arc plate 404 is fixedly connected with a pressure extrusion plate 407. The bottom of the pressure extrusion plate 407 is fixedly connected with a lifting extrusion plate 408. The function of this component is to set the lifting mechanism 4. The rotation of the rotating disk 204 drives the rotation of a plurality of push rods 206 on the transmission belt 205. When the extrusion column one 401 on the push rod 206 squeezes the pressure extrusion plate 407, the extrusion telescopic rod 405 on one side of the pressure extrusion plate 407 is squeezed and contracts. The compression spring 406 is squeezed and contracts, and the elastic force of the compression spring 406 increases. The extrusion force of the extrusion arc plate 404 at one end of the extrusion telescopic rod 405 by the compression spring 406 increases, and the extrusion force between the extrusion arc plate 404 and the side wall of the single crystal silicon wafer 15 increases. At this time, the extrusion column two 402 on the extrusion column one 401 generates extrusion with the lifting extrusion plate 408. The lifting extrusion plate 408 is squeezed and drives the extrusion telescopic rod 405 on the pressure extrusion plate 407 to move upward along the sliding groove 403. The extrusion telescopic rod 405 drives one end of the extrusion arc plate 404 to drive the single crystal silicon wafer 15 to slide upward along the inner wall of the feeding cylinder 14. Such a setting is beneficial in that on the one hand, it is conducive to separating the lowermost single crystal silicon wafer 15 in the feeding cylinder 14 from several other single crystal silicon wafers 15 in the feeding cylinder 14, thereby reducing the friction between the bottom of the lowermost single crystal silicon wafer 15 and other single crystal silicon wafers 15, and thus reducing the scratches on the surface of the lowermost single crystal silicon wafer 15 caused by friction. On the other hand, it is beneficial for the lowermost single crystal silicon wafer 15 to smoothly slide out of the feeding cylinder 14, thereby improving the working efficiency of the device.

[0044] Embodiment 2, the difference feature from Embodiment 1 is that; as Figures 1-9 shown, a rejection mechanism 5 is provided in the middle of the loading table 1. The rejection mechanism 5 includes a driving motor two 501 fixedly connected to the side wall of the fixed table 11. The output end of the driving motor two 501 is fixedly connected with an output rotating shaft two 502. One end of the output rotating shaft two 502 away from the driving motor two 501 is connected with a rejection wheel 503. The outer wall of the rejection wheel 503 is drivingly connected with a rejection conveyor belt 504. The rejection conveyor belt 504 is made of an elastic material. The inner wall of the loading table 1 is fixedly connected with a bottom plate 505.

[0045] The rejection mechanism 5 further includes a plurality of electric push rods 506 fixedly connected to both sides of the bottom plate 505. One end of the electric push rod 506 away from the bottom plate 505 is rotatably connected to a plurality of linkage rods 508. A plurality of rejection telescopic rods 509 are fixedly connected to the side wall of the loading table 1. One end of the rejection telescopic rod 509 away from the loading table 1 is fixedly connected to a connection block 510. One end of the connection block 510 away from the rejection telescopic rod 509 is rotatably connected to a rising roller 511. One end of the linkage rod 508 away from the push plate 507 is rotatably connected to the rising roller 511. One end of the fixed table 11 away from the second driving motor 501 is fixedly connected to a storage box 512. The function of this component is to set up the rejection mechanism 5. Since the image sensor 208 is electrically connected to the electric push rod 506, at this time, the output end of the second driving motor 501 rotates to drive the rejection wheel 503 on the output rotating shaft 502 to rotate. The rotation of the rejection wheel 503 drives the rejection conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is a defective product, the electric push rod 506 starts and drives the push plate 507 to move towards the end away from the electric push rod 506. The movement of the push plate 507 drives the rising roller 511 at one end of the linkage rod 508 to move upward along the rejection telescopic rod 509. At this time, the rising roller 511 drives the rejection conveyor belt 504 to move upward until the surface of the rejection conveyor belt 504 contacts the bottom of the defective single crystal silicon wafer 15. At this time, the rejection conveyor belt 504 drives the defective single crystal silicon wafer 15 to move towards the end close to the storage box 512. The rejection conveyor belt 504 conveys the defective single crystal silicon wafer 15 into the storage box 512. Such a setting is conducive to timely rejecting the defective single crystal silicon wafers 15.

[0046] The usage method of the single crystal silicon preparation sorting and loading table chip rejection device includes the following steps:

[0047] S1: Pushing and detecting. When the push rod 206 on the transmission belt 205 rotates to directly below the feeding cylinder 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom layer of the feeding cylinder 14. At this time, the push rod 206 pushes the single crystal silicon wafer 15 to slide directly above the loading table 1. At this time, the image sensor 208 directly below the fixed block 207 can take pictures and detect the surface of the single crystal silicon wafer 15.

[0048] S2: Auxiliary detection. The rotation of the transmission belt 205 drives the rotation of a plurality of push rods 206 on the transmission belt 205. When the push rod 206 on the transmission belt 205 rotates to directly below the feeding cylinder 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom layer of the feeding cylinder 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed strip 301.

[0049] S3: Auxiliary pushing. The rotating disk 204 rotates to drive several pushing rods 206 on the transmission belt 205 to rotate. When the extrusion column one 401 on the pushing rod 206 squeezes the pressure extrusion plate 407, the extrusion telescopic rod 405 on one side of the pressure extrusion plate 407 is squeezed and contracted by the extrusion column one 401, and the extrusion spring 406 is squeezed and contracted. The elastic force of the extrusion spring 406 increases, and the extrusion arc piece 404 at one end of the extrusion telescopic rod 405 is subjected to an increased extrusion force from the extrusion spring 406, and the extrusion force between the extrusion arc piece 404 and the side wall of the single crystal silicon wafer 15 increases. At this time, the extrusion column two 402 on the extrusion column one 401 generates extrusion with the lifting extrusion plate 408, and the lifting extrusion plate 408 is squeezed to drive the extrusion telescopic rod 405 on the pressure extrusion plate 407 to move upward along the sliding groove 403. The extrusion telescopic rod 405 drives the single crystal silicon wafer 15 at one end of the extrusion arc piece 404 to slide upward along the inner wall of the feeding cylinder 14.

[0050] S4: Reject unqualified products. The output end of the driving motor two 501 rotates to drive the rejection wheel 503 on the output rotating shaft two 502 to rotate. The rejection wheel 503 rotates to drive the rejection conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is an unqualified product, the electric push rod 506 starts and drives the push plate 507 to move towards the end far from the electric push rod 506. The push plate 507 moves to drive the rising roller 511 at one end of the linkage rod 508 to move upward along the rejection telescopic rod 509. At this time, the rising roller 511 drives the rejection conveyor belt 504 to move upward until the surface of the rejection conveyor belt 504 contacts the bottom of the unqualified single crystal silicon wafer 15. At this time, the rejection conveyor belt 504 drives the unqualified single crystal silicon wafer 15 to move towards the end close to the storage box 512, and the rejection conveyor belt 504 conveys the unqualified single crystal silicon wafer 15 into the storage box 512.

[0051] A specific application of this embodiment is:

[0052] When the single crystal silicon is prepared and the sorting loading table debris removal device is used, firstly, several single crystal silicon wafers 15 to be processed are placed in the feeding barrel 14, and then the driving motor 202 is started, and the output end of the driving motor 202 drives the output shaft 203 to rotate, and the rotation of the output shaft 203 drives the transmission belt 205 on the rotating disk 204 to rotate, and the rotation of the transmission belt 205 drives several push rods 206 on the transmission belt 205 to rotate, and when the push rod 206 on the transmission belt 205 rotates to the bottom of the feeding barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom of the feeding barrel 14, and then the push rod 206 pushes the single crystal silicon wafer 15 to slide along the top of the loading table 1, and then the image sensor 208 directly below the fixed block 207 can shoot and detect the surface of the single crystal silicon wafer 15, By setting up a pushing material selection mechanism 2, the single crystal silicon wafer 15 inside the feed barrel 14 can be continuously sent to the bottom of the image sensor 208 for detection, thereby reducing human interference and improving the sorting efficiency of the device; by setting up an auxiliary sliding mechanism 3, the transmission belt 205 rotates to drive a number of push rods 206 on the transmission belt 205 to rotate. When the push rod 206 on the transmission belt 205 rotates to the bottom of the feed barrel 14, the push rod 206 can push out the single crystal silicon wafer 15 at the bottom of the feed barrel 14. At this time, the bottom of the single crystal silicon wafer 15 contacts the auxiliary roller 302 on the fixed bar 301. This arrangement is conducive to the rolling friction between the single crystal silicon wafer 15 and the auxiliary roller 302, avoiding sliding friction between the bottom of the single crystal silicon wafer 15 and the surface of the loading platform 1, thereby avoiding scratches on the bottom of the single crystal silicon wafer 15;

[0053] By setting up the lifting mechanism 4, the rotating disk 204 rotates to drive a number of push rods 206 on the transmission belt 205 to rotate. When the extrusion column one 401 on the push rod 206 squeezes the pressure extrusion plate 407, the extrusion telescopic rod 405 on one side of the pressure extrusion plate 407 is squeezed and contracted by the extrusion column one 401, and the extrusion spring 406 is squeezed and contracted. The elastic force of the extrusion spring 406 increases, and the extrusion arc piece 404 at one end of the extrusion telescopic rod 405 is squeezed with an increased force by the extrusion spring 406, and the squeezing force between the extrusion arc piece 404 and the side wall of the single crystal silicon wafer 15 increases. At this time, the extrusion column two 402 on the extrusion column one 401 squeezes the lifting extrusion plate 408, and the lifting extrusion plate 408 is squeezed to drive the extrusion telescopic rod 405 on the pressure extrusion plate 407 to move upward along the sliding groove 403. The extrusion telescopic rod 405 drives the single crystal silicon wafer 15 at one end of the extrusion arc piece 404 to slide upward along the inner wall of the feeding cylinder 14. Such a setting is beneficial in that on the one hand, it is conducive to separating the bottom single crystal silicon wafer 15 in the feeding cylinder 14 from several other single crystal silicon wafers 15 in the feeding cylinder 14, thereby reducing the friction between the bottom of the bottom single crystal silicon wafer 15 and other single crystal silicon wafers 15, and thus reducing the scratches on the surface of the bottom single crystal silicon wafer 15 caused by friction. On the other hand, it is beneficial for the bottom single crystal silicon wafer 15 to smoothly slide out of the feeding cylinder 14, thereby improving the working efficiency of the device; by setting up the rejection mechanism 5, since the image sensor 208 is electrically connected to the electric push rod 506, at this time, the output end of the driving motor two 501 rotates to drive the rejection wheel 503 on the output rotating shaft two 502 to rotate. The rejection wheel 503 rotates to drive the rejection conveyor belt 504 to rotate. When the image sensor 208 detects that the single crystal silicon wafer 15 is a defective product, the electric push rod 506 is activated and drives the push plate 507 to move towards the end far from the electric push rod 506. The push plate 507 moves to drive the lifting roller 511 at one end of the linkage rod 508 to move upward along the rejection telescopic rod 509. At this time, the lifting roller 511 drives the rejection conveyor belt 504 to move upward until the surface of the rejection conveyor belt 504 contacts the bottom of the defective single crystal silicon wafer 15. At this time, the rejection conveyor belt 504 drives the defective single crystal silicon wafer 15 to move towards the end close to the storage box 512, and the rejection conveyor belt 504 conveys the defective single crystal silicon wafer 15 into the storage box 512. Such a setting is beneficial for timely rejecting the defective single crystal silicon wafers 15.

[0054] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the relevant technical fields can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A device for removing fragments on a sorting and feeding table for single-crystal silicon preparation, comprising a feeding table (1). A fixed table (11) is fixedly connected to the middle of the feeding table (1). A plurality of support legs (12) are fixedly connected to the bottom of the fixed table (11). A plurality of connecting plates (13) are fixedly connected to the side wall of the feeding table (1). One end of the connecting plate (13) away from the feeding table (1) is fixedly connected to a feeding cylinder (14). A plurality of single-crystal silicon wafers (15) are arranged inside the feeding cylinder (14), and it is characterized in that, Also includes: A material selection mechanism (2) is provided, wherein the material selection mechanism (2) comprises a fixed plate (201) fixedly connected to a side wall of a fixed platform (11), an end of the fixed plate (201) away from the fixed platform (11) is fixedly connected to a driving motor 1 (202), an output end of the driving motor 1 (202) is fixedly connected to an output shaft 1 (203), and an end of the output shaft 1 (203) away from the driving motor 1 (202) is fixedly connected to a rotating disk (204); The pushing and selecting mechanism (2) further comprises a driving belt (205) drivingly connected to the rotating disk (204); a side wall of the driving belt (205) away from the driving motor (202) is fixedly connected to a plurality of pushing rods (206); an outer wall of the feeding barrel (14) is fixedly connected to a fixing block (207); and an image sensor (208) is fixedly connected to the bottom of the fixing block (207); The outer wall of the feed barrel (14) is provided with a lifting mechanism (4), the lifting mechanism (4) comprises an extrusion column 1 (401) fixedly connected to both ends of a push rod (206), the end of the extrusion column 1 (401) away from the push rod (206) is fixedly connected to an extrusion column 2 (402), the outer wall of the feed barrel (14) is provided with a plurality of sliding grooves (403), the interior of the sliding groove (403) is slidably connected to an extrusion telescopic rod (405), the inner wall of the feed barrel (14) is slidably connected to an extrusion arc sheet (404), and the side of the extrusion arc sheet (404) away from the single crystal silicon wafer (15) is fixedly connected to the extrusion telescopic rod (405); The lifting mechanism (4) further comprises an extrusion spring (406) sleeved on one end of the extrusion telescopic rod (405) away from the extrusion arc piece (404); one end of the extrusion telescopic rod (405) away from the extrusion arc piece (404) is fixedly connected to a pressure extrusion plate (407); and the bottom of the pressure extrusion plate (407) is fixedly connected to a lifting extrusion plate (408).

2. The debris removal device for the single-crystal silicon preparation sorting and loading table according to claim 1, wherein: An auxiliary sliding mechanism (3) is arranged directly above the loading platform (1), and the auxiliary sliding mechanism (3) comprises a plurality of fixing bars (301) fixedly connected to the loading platform (1), and a plurality of auxiliary rollers (302) are rotatably connected to the side walls of the fixing bars (301).

3. A fragment removal device for a single crystal silicon preparation sorting and feeding table according to claim 2, characterized in that: A rejection mechanism (5) is provided in the middle of the loading platform (1), and the rejection mechanism (5) includes a second driving motor (501) fixedly connected to the side wall of the fixed platform (11), the output end of the second driving motor (501) is fixedly connected to the second output shaft (502), the end of the second output shaft (502) away from the second driving motor (501) is connected to a rejection wheel (503), the outer wall of the rejection wheel (503) is transmission-connected to a rejection conveyor belt (504), and the rejection conveyor belt (504) is made of elastic material. The inner wall of the loading platform (1) is fixedly connected to a bottom plate (505).

4. A device for removing fragments from a single-crystal silicon preparation sorting and loading table according to claim 3, characterized in that: The rejection mechanism (5) further includes a plurality of electric push rods (506) fixedly connected to both sides of the bottom plate (505). One end of the electric push rod (506) away from the bottom plate (505) is rotatably connected to a plurality of linkage rods (508). A plurality of rejection telescopic rods (509) are fixedly connected to the side wall of the loading table (1). One end of the rejection telescopic rod (509) away from the loading table (1) is fixedly connected to a connecting block (510). One end of the connecting block (510) away from the rejection telescopic rod (509) is rotatably connected to a rising roller (511). One end of the linkage rod (508) away from the push plate (507) is rotatably connected to the rising roller (511). One end of the fixed table (11) away from the second driving motor (501) is fixedly connected to a storage box (512).

5. A method for using a debris removal device of a single-crystal silicon preparation sorting and loading table, which uses the debris removal device of the single-crystal silicon preparation sorting and loading table as described in claim 4, and is characterized in that, It includes the following steps: S1: Pushing detection. When the push rod (206) on the transmission belt (205) rotates to directly below the feeding cylinder (14), the push rod (206) can push out the single crystal silicon wafer (15) at the bottom layer of the feeding cylinder (14). At this time, the push rod (206) pushes the single crystal silicon wafer (15) to slide directly above the loading table (1). At this time, the image sensor (208) directly below the fixed block (207) can take pictures and detect the surface of the single crystal silicon wafer (15). S2: Auxiliary detection. The rotation of the transmission belt (205) drives the rotation of a plurality of push rods (206) on the transmission belt (205). When the push rod (206) on the transmission belt (205) rotates to directly below the feeding cylinder (14), the push rod (206) can push out the single crystal silicon wafer (15) at the bottom layer of the feeding cylinder (14). At this time, the bottom of the single crystal silicon wafer (15) contacts the auxiliary roller (302) on the fixed strip (301). S3: Auxiliary pushing. The rotation of the rotating disk (204) drives the rotation of a plurality of push rods (206) on the transmission belt (205). When the extrusion column one (401) on the push rod (206) extrudes the pressure extrusion plate (407), the extrusion telescopic rod (405) on one side of the pressure extrusion plate (407) is contracted by the extrusion of the extrusion column one (401), and the extrusion spring (406) is squeezed and contracted. The elastic force of the extrusion spring (406) increases. The extrusion arc piece (404) at one end of the extrusion telescopic rod (405) is increased by the extrusion force of the extrusion spring (406), and the extrusion force between the extrusion arc piece (404) and the side wall of the single crystal silicon wafer (15) increases. At this time, the extrusion column two (402) on the extrusion column one (401) generates extrusion with the lifting extrusion plate (408). The lifting extrusion plate (408) is extruded to drive the extrusion telescopic rod (405) on the pressure extrusion plate (407) to move upward along the sliding groove (403). The extrusion telescopic rod (405) drives the single crystal silicon wafer (15) at one end of the extrusion arc piece (404) to slide upward along the inner wall of the feeding cylinder (14). S4: Reject unqualified products. The output end of the second drive motor (501) rotates to drive the rejection wheel (503) on the second output rotating shaft (502) to rotate. The rotation of the rejection wheel (503) drives the rejection conveyor belt (504) to rotate. When the image sensor (208) detects that the single-crystal silicon wafer (15) is an unqualified product, the electric push rod (506) is activated and drives the push plate (507) to move towards one end away from the electric push rod (506). The movement of the push plate (507) drives the lifting roller (511) at one end of the linkage rod (508) to move upward along the rejection telescopic rod (509). At this time, the lifting roller (511) drives the rejection conveyor belt (504) to move upward until the surface of the rejection conveyor belt (504) contacts the bottom of the unqualified single-crystal silicon wafer (15). At this time, the rejection conveyor belt (504) drives the unqualified single-crystal silicon wafer (15) to move towards one end close to the storage box (512), and the rejection conveyor belt (504) conveys the unqualified single-crystal silicon wafer (15) into the storage box (512).

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