Automatic grinding device for high-voltage semi-conductive rubber part and grinding process of automatic grinding device

Abstract

The invention discloses an automatic grinding device for a high-voltage semi-conductive rubber part and a grinding process of the automatic grinding device. The grinding device comprises a mounting table, a controller arranged on the mounting table, an identification module moving device electrically connected with the controller, a lofting device, a grinding device body, a sampling device and a first sliding rail. A mounting base is arranged on the moving device, a sample fixing column and a motor are arranged on the mounting base, the device moves along the first sliding rail, and the angle between the mounting base and the mounting table is adjustable; a first sample pressing plate and a second sample pressing plate are respectively arranged on the lofting device and the sampling device; a grinding wheel is arranged on the grinding device; and an identification plug-in facing the sample is carried in the identification module. In the grinding process, automatic circulation can be conducted, the grinding degree can be automatically adjusted, compared with manual grinding or grinding equipment without automatic recognition, the grinding uniformity of the joint line of the rubber part can be better guaranteed, and the problem of electric field deformity caused by flashes or tips is avoided.

Description

Technical Field

[0001] The invention relates to an automatic grinding device for a high-voltage semi-conductive rubber part and a grinding process thereof, belonging to the technical field of high-voltage cable preparation. Background Art

[0002] High-voltage cables are the most commonly used cables in long-distance power transmission. High-voltage semi-conductive rubber parts are mainly used at the terminals and joints of power cables during power transmission. Their main functions include stress control, electromagnetic shielding, and electrical performance improvement. The preparation process of high-voltage semi-conductive rubber parts is generally to first use a material pump to inject liquid silicone into the mold at high pressure, and then vulcanize it at high temperature on a flat vulcanizer to obtain a semi-finished product, and then polish it. In the process of inverting the mold, a ring-shaped parting line is generally generated due to mold design problems. When the parting line is not processed evenly, its flash and tip often cause the electric field of the high-voltage cable to be deformed, and eventually cause the cable breakdown problem. Therefore, effective polishing of the parting line is one of the important means to ensure the stability of high-voltage semi-conductive rubber parts. The existing parting line polishing process often has the problem of too light polishing or too heavy polishing. Too light polishing will lead to uneven electric field control, and too heavy polishing will cause changes in product size. Summary of the invention

[0003] The purpose of the present invention is to provide a high-voltage semi-conductive rubber component automatic grinding device to solve the above technical problems.

[0004] The technical solution for achieving the purpose of the present invention is:

[0005] A high-voltage semi-conductive rubber automatic grinding device comprises a mounting platform, an identification module arranged on the mounting platform, a controller, a moving device, a lofting device, a grinding device, a sampling device and a first slide rail, wherein the moving device, the lofting device, the grinding device and the sampling device are connected in sequence and are electrically connected to the controller together with the identification module; the moving device is provided with a mounting base perpendicular to the first slide rail, the mounting base is provided with a sample fixing column and a motor connected to the sample fixing column by a belt, the moving device can be moved along the first slide rail, and the relative angle between the mounting base and the mounting platform can be adjusted; the lofting device and the sampling device are respectively provided with a first sample pressing plate and a second sample pressing plate which can be moved up and down and have an opening facing the sample fixing column; the grinding device is provided with a grinding wheel with adjustable height; the identification module is equipped with a shape and size recognition plug-in, the identification module is installed on the side of the moving device close to the motor and faces the sample fixing column for sampling.

[0006] The automatic grinding device of the present application has an automatic identification module, and its moving device has an angle adjustment function. The high-voltage semi-conductive rubber parts to be ground can be automatically circulated and the degree of grinding can be adjusted autonomously during the grinding process. Compared with manual grinding or grinding equipment without automatic identification, it can better ensure the uniformity of the grinding of the mold line of the rubber parts, avoid the electric field deformity problem caused by flash or tip, and the performance of the processed products is more stable.

[0007] Further or optionally, a second slide rail group perpendicular to the first slide rail is provided, and the lofting device, the grinding device and the sampling device are respectively mounted on the second slide rail group and are respectively moved on the slide rail through a gear worm structure.

[0008] In the above structure, a worm gear structure is used for distance control, and the linearity of its transmission is used to improve the accuracy of position control of each component.

[0009] Further or optionally, the grinding device comprises a grinding wheel, a grinding wheel mounting platform, a rotating motor, a worm gear transmission mechanism and a cylinder. The grinding wheel mounting platform is mounted on the second slide rail group, and the grinding wheel mounting platform and the second slide rail group are moved by the worm gear transmission mechanism; the rotating shafts of the rotating motor and the grinding wheel are arranged in parallel and driven to rotate by a belt, and a cylinder is installed on the shaft of the grinding wheel close to the grinding wheel mounting platform and the height is adjusted by the cylinder; the rotating motor, the worm gear transmission mechanism and the cylinder are electrically connected to the controller. In this way, the grinding wheel can move along the second slide rail group and in the vertical direction, and the grinding force can be accurately controlled during the grinding process.

[0010] Further or optionally, the sample placement device and the sampling device are respectively mounted on the second slide rail group, the first sample pressing plate and the second sample pressing plate are respectively arranged on the sample placement device and the sampling device and are height-adjusted by a cylinder, and the second sample pressing plate has a rotating flipping mechanism at one end away from the moving device, so that the second sample pressing plate can be raised when the sample needs to be removed, so that the sample can be quickly separated from the sample fixing column, and the connection between it and the subsequent process is smoother, which is conducive to further automation.

[0011] Further or optionally, the mounting base of the mobile device includes a first base plate and a second base plate which are stacked, the sample fixing column and the motor are arranged on the first base plate, the first base plate and the second base plate are connected by a hinge on one side, and the angle between them is adjusted on the other side by an angle adjusting cylinder, the angle adjusting cylinder is electrically connected to the controller, and the grinding angle between the sample fixing column and the grinding wheel is adjusted by adjusting the angle between the first base plate and the second base plate during use, so that the grinding process is more precise.

[0012] Further or optionally, it also includes at least one secondary grinding device, which is arranged side by side close to the grinding device. The mesh number of the grinding wheel of the grinding device is smaller than the mesh number of the grinding wheel of the secondary grinding device. The grinding level and grinding fineness can be set according to actual needs to better meet the production process needs.

[0013] Further or optionally, in order to ensure the cleanliness of the production process and the production environment, a cleaning device and a dust cover are also provided. The cleaning device is arranged at one end of the mounting table away from the prototyping device; the dust cover covers the moving device, the prototyping device, the grinding device, the sampling device and the first slide rail and the second slide rail group; the dust cover is provided with a vent, which is connected to the fan.

[0014] Further or optionally, in order to improve cleaning efficiency, the cleaning device is an ultrasonic cleaning tank.

[0015] The present application also relates to a high-voltage semi-conductive rubber part automatic grinding process, which uses the above-mentioned high-voltage semi-conductive rubber part automatic grinding device, and is characterized by comprising the following steps:

[0016] S1: Laying out the sample, placing the high-voltage semi-conductive rubber piece to be polished on the sample fixing column of the mobile device, and pushing it down to the corresponding position by the first sample pressing plate;

[0017] S2: The recognition module collects the shape of the high-voltage semi-conductive rubber part and compares it with the standard size preset in the controller to calculate the grinding size;

[0018] S3: grinding, the high-voltage semi-conductive rubber parts that have completed the layout and size identification are respectively ground through the grinding device; during the grinding process, the angle between the sample fixing column and the mounting table is adjusted;

[0019] S4: Extend the second sample pressing plate of the sampling device to the bottom of the high-voltage semi-conductive rubber part, and then move it upward. When the center of gravity height of the high-voltage semi-conductive rubber part is greater than the top of the sample fixing column, the second sample pressing plate rotates to push the high-voltage semi-conductive rubber part out of the sample fixing column, so that the workpiece falls off and enters the next process.

[0020] The above-mentioned grinding steps are simple and the operation is smooth, which can effectively improve the grinding efficiency of the product, control the grinding intensity, and ensure the consistency of the product size.

[0021] Further or optionally, in order to connect with the subsequent processing process, the above polishing process also includes the following steps:

[0022] S5: The workpiece enters the cleaning device to complete the cleaning operation, and then enters the subsequent drying process.

[0023] By adopting the above technical solution, the present invention has the following beneficial effects:

[0024] (1) The automatic polishing device of the present application has an automatic identification module, and its moving device has an angle adjustment function. The high-voltage semi-conductive rubber parts to be polished can be automatically circulated and the degree of polishing can be adjusted autonomously during the polishing process. Compared with manual polishing or polishing equipment without automatic identification, it can better ensure the uniformity of the mold line polishing of the rubber parts, avoid the electric field deformity problem caused by flash or tips, and the performance of the processed products is more stable.

[0025] (2) The grinding device of the present application can move in a direction perpendicular to the second slide rail and in a vertical direction, and the grinding force can be controlled more accurately during the grinding process.

[0026] (3) The sampling device of the present application includes a second sample pressing plate that can be raised, lowered and flipped, and can be automatically connected with the cleaning device, making the processing process smoother.

[0027] (4) The movable base plate and sample fixing column of the present application can realize angle adjustment, and the angle can be flexibly adjusted during the grinding process to make the grinding angle more in line with product requirements.

[0028] (5) The automatic grinding device for high-voltage semi-conductive rubber parts of the present application is provided with a multi-stage grinding device and the number of grinding wheels thereof is gradually increased, which can effectively control the grinding accuracy.

[0029] (6) The automatic grinding device for high-voltage semi-conductive rubber parts of the present application is also provided with a cleaning device and a dust cover to ensure the cleanliness of the production process and the production environment.

[0030] (7) The present application adopts an ultrasonic cleaning tank, which has a higher cleaning efficiency than other cleaning devices.

[0031] (8) The movable base plate of the movable device of the present application is adjusted by two plates and a cylinder, and its angle adjustment is more precise and flexible.

[0032] (9) The present application also relates to an automatic grinding process for high-voltage semi-conductive rubber parts, which has simple grinding steps and smooth operation, and can effectively improve product grinding efficiency, control grinding force, and ensure product size consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein

[0034] Figure 1 It is a schematic diagram of the structure of the present invention.

[0035] Figure 2 It is a schematic diagram of the structure of the mobile device in the present invention.

[0036] The reference numerals in the accompanying drawings are:

[0037] Mounting table 1, identification module 2, controller 3, moving device 4, mounting base 41, first base plate 411, second base plate 412, sample fixing column 42, motor 43, angle adjustment cylinder 44, placement device 5, first sample pressing plate 51, grinding device 6, grinding wheel 61, grinding wheel mounting table 62, rotating motor 63, sampling device 7, second sample pressing plate 71, first slide rail 8, second slide rail group 9, secondary grinding device 10, cleaning device 11. DETAILED DESCRIPTION

[0038] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0042] In the description of the embodiments of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when used, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0043] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The present invention is further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the scope of protection of the present invention.

[0044] (Example 1)

[0045] A high-voltage semi-conductive rubber automatic grinding device, comprising a mounting platform 1, an identification module 2 arranged on the mounting platform 1, a controller 3, a moving device 4, a lofting device 5, a grinding device 6, and a sampling device 7, wherein the moving device 4, the lofting device 5, the grinding device 6, and the sampling device 7 are sequentially connected and electrically connected to the controller 3 together with the identification module 2, the moving device 4 is moved by a first slide rail 8, and the moving device 4, the lofting device 5, the grinding device 6, and the sampling device 7 are all moved by a second slide rail group 9; the first slide rail 8 is perpendicular to the second slide rail group 9; the moving device 4 includes a conical sample solid The sample fixing column 42 and the motor 43 for driving the sample fixing column 42 to rotate, the identification module 2 is arranged on one side of the sample fixing column 42, the grinding device 6 comprises a grinding wheel 61 with adjustable height; the sample placing device 5 and the sampling device 7 are respectively provided with a first sample pressing plate 51 and a second sample pressing plate 71, the first sample pressing plate 51 and the second sample pressing plate 71 have an arc opening facing the sample side, the second sample pressing plate 71 has a rotating axis, the moving direction of the moving device 4 is perpendicular to the second slide rail 9 and has an angle adjustment mechanism for adjusting the angle with the mounting table; the identification module 2 is equipped with a shape recognition plug-in.

[0046] The shape recognition plug-in in module 2 can be a commercially available module, such as the Star Pupil OpenMV4. Before recognition, the height and diameter of the standard workpiece are first collected, with an emphasis on presetting the size and shape of the ring line. After the image recognition module 2 collects the size of the workpiece to be polished, it is compared with the pre-collected standard workpiece data, and then the data is transmitted to the mobile device 4 and the polishing device 6 to adjust the polishing accuracy and estimate the degree of polishing.

[0047] After the workpiece is placed on the sample fixing column 42 of the mobile device 4, it is pressed down by the first sample pressing plate 51 of the placement device, and then the data is collected through the identification module. The mobile device 4 adjusts the grinding angle, and then the workpiece to be polished is driven by the mobile device 4 to move in the first slide rail 8. When the workpiece to be polished moves to the corresponding position of the polishing device 6, the polishing device 6 slides in the second slide rail group 9 to a position close to the workpiece to be polished, and the controller 3 adjusts the height of the polishing wheel 61, and then polishing is performed; after polishing is completed, the workpiece that has completed the preliminary polishing is driven by the mobile device 4 to move along the first slide rail 8 to the corresponding position of the sampling device 7, and then the second sample pressing plate 71 extends to the bottom of the sample fixing column, and the second sample pressing plate 71 rotates, and the sample that has completed the preliminary polishing is removed from the sample fixing column.

[0048] The grinding device 6 includes a grinding wheel 61, a grinding wheel mounting platform 62, a rotating motor 63, a worm gear transmission mechanism and a cylinder. The grinding wheel mounting platform 62 is mounted on the second slide rail group 9, and the grinding wheel mounting platform 62 and the second slide rail group 9 are moved through the worm gear transmission mechanism; the rotating motor 63 and the rotating shaft of the grinding wheel 61 are arranged in parallel and the grinding wheel 61 is driven to rotate by a belt. A cylinder is installed on the axis of the grinding wheel 61 close to the grinding wheel mounting platform 62 and the height is adjusted by the cylinder; the rotating motor 63, the worm gear transmission mechanism and the cylinder are electrically connected to the controller 3, and the controller 3 adjusts the position of the grinding wheel during the above adjustment process.

[0049] The sample placing device 5 and the sampling device 7 are mounted on the second slide rail group 9 and are moved in the second slide rail group 9 through a worm gear transmission mechanism. The first sample pressing plate 51 and the second sample pressing plate 71 are respectively installed on the sample placing device 5 and the sampling device 7 and the height is adjusted by a cylinder. The second sample pressing plate 71 is also provided with a rotating mechanism at the end away from the sample to enable it to be flipped.

[0050] The mobile device 4 also includes a mounting base 41 mounted on the first slide rail 8, the sample fixing column 42 and the motor 43 are mounted in parallel on the mounting base 41, and a transmission belt is provided between the output shaft of the motor 43 and the sample fixing column 42; the position between the mounting base 41 and the first slide rail 8 is adjusted by a worm transmission assembly, and the motor 43 and the worm transmission assembly are electrically connected to the controller 3 respectively.

[0051] It also includes at least one secondary grinding device 10, which is close to the grinding device 6. The mesh number of the grinding wheel 61 of the first grinding device 6 is smaller than the mesh number of the grinding wheel of the secondary grinding device 10. During the grinding process, the workpiece moves in the direction of gradually increasing mesh number, and enters the next process after completing the grinding and polishing process.

[0052] A cleaning device 11 and a dust cover are also provided. The cleaning device 11 is arranged at one end of the mounting table 1 away from the lofting device 5; the dust cover covers the moving device 4, the lofting device 5, the grinding device 6, the sampling device 7 and the first slide rail 8 and the second slide rail group 9; a vent is provided on the dust cover, and the vent is connected to the fan.

[0053] The above-mentioned cleaning device can be omitted according to actual needs. In the actual production process, the workpieces can be collected and collected after grinding and polishing and then enter the cleaning process.

[0054] The cleaning device 11 is an ultrasonic cleaning tank.

[0055] The mounting base 41 of the mobile device 4 is divided into a first base plate 411 and a second base plate 412 which are stacked. The sample fixing column 42 and the motor 43 are mounted on the first base plate 411. The first base plate 411 and the second base plate 412 are connected by a hinge. The opposite side of the hinge is provided with an angle adjustment cylinder 44 for adjusting the offset height of the two. The angle adjustment cylinder 44 is electrically connected to the controller 3.

[0056] An automatic grinding process for high-voltage semi-conductive rubber parts, using the above-mentioned automatic grinding device for high-voltage semi-conductive rubber parts for cleaning, comprises the following steps:

[0057] S1: Laying out the sample, placing the high-voltage semi-conductive rubber piece to be polished on the sample fixing column 42 of the mobile device, and pushing it down to the corresponding position by the first sample pressing plate 51;

[0058] S2: The recognition module 2 collects the shape of the high-voltage semi-conductive rubber part and compares it with the standard size preset in the controller 3 to calculate the grinding size;

[0059] S3: grinding, the high-voltage semi-conductive rubber parts that have completed the lofting and size identification are respectively ground through the grinding device 6; during the grinding process, the angle between the sample fixing column 42 and the mounting table 1 is adjusted;

[0060] S4: Extend the second sample pressing plate 71 of the sampling device 7 to below the high-voltage semi-conductive rubber piece, and then move it upward. When the center of gravity of the high-voltage semi-conductive rubber piece is greater than the top of the sample fixing column 41, the second sample pressing plate 71 rotates to push the high-voltage semi-conductive rubber piece out of the sample fixing column 71, so that it falls into the cleaning device 11;

[0061] S5: The cleaning device 11 completes the cleaning operation, and then enters the subsequent drying process.

[0062] The controller 3 adopts a feedback regulation system.

[0063] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic grinding device for high-voltage semi-conductive rubber parts, characterized in that: The invention comprises a mounting platform (1), an identification module (2) arranged on the mounting platform (1), a controller (3), a moving device (4), a sample setting device (5), a grinding device (6), a sampling device (7) and a first slide rail (8); the moving device (4), the sample setting device (5), the grinding device (6) and the sampling device (7) are connected in sequence and are electrically connected to the controller (3) together with the identification module (2); the moving device (4) is provided with a mounting base (41) perpendicular to the first slide rail (8); the mounting base (41) is provided with a sample fixing column (42) and a motor (43) connected to the sample fixing column (42) by a belt The moving device (4) can move along the first slide rail (8), and the relative angle between the mounting base (41) and the mounting table (1) can be adjusted; the sample placement device (5) and the sampling device (7) are respectively provided with a first sample pressing plate (51) and a second sample pressing plate (71) that can move up and down and have an opening facing the sample fixing column (42); the grinding device (6) is installed with a grinding wheel (61) with adjustable height; the recognition module (2) is equipped with a shape and size recognition plug-in, and the recognition module (2) is installed on the side of the moving device (4) close to the motor (43) and faces the sample fixing column (42) for sampling.

2. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 1 is characterized in that: A second slide rail group (9) is also provided which is perpendicular to the first slide rail (8); the lofting device (5), the grinding device (6) and the sampling device (7) are respectively mounted on the second slide rail group (9) and are respectively moved on the slide rails via a gear worm structure.

3. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 2 is characterized in that: The grinding device (6) comprises a grinding wheel (61), a grinding wheel mounting platform (62), a rotating motor (63), a worm gear transmission mechanism and a cylinder. The grinding wheel mounting platform (62) is mounted on the second slide rail group (9), and the grinding wheel mounting platform (62) and the second slide rail group (9) are moved by the worm gear transmission mechanism. The rotating shafts of the rotating motor (63) and the grinding wheel (61) are arranged in parallel and the grinding wheel (61) is driven to rotate by a belt. The axis of the grinding wheel (61) close to the grinding wheel mounting platform (62) is equipped with a cylinder and the height is adjusted by the cylinder. The rotating motor (63), the worm gear transmission mechanism and the cylinder are electrically connected to the controller (3).

4. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 2 is characterized in that: The sample placing device (5) and the sampling device (7) are respectively mounted on the second slide rail group (9); the first sample pressing plate (51) and the second sample pressing plate (71) are respectively arranged on the sample placing device (5) and the sampling device (7) and are height-adjusted by a cylinder; the second sample pressing plate (71) has a rotating flipping mechanism at one end away from the moving device (4).

5. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 2 is characterized in that: The mounting base (41) of the mobile device (4) includes a first base plate (411) and a second base plate (412) which are stacked together. The sample fixing column (42) and the motor (43) are arranged on the first base plate (411). The first base plate (411) and the second base plate (412) are connected by a hinge on one side, and the angle between them is adjusted on the other side by an angle adjustment cylinder (44). The angle adjustment cylinder (44) is electrically connected to the controller (3).

6. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 1 or 2, characterized in that: It also comprises at least one secondary grinding device (10), wherein the secondary grinding device (10) is arranged side by side close to the grinding device (6), and the mesh number of the grinding wheel (61) of the grinding device (6) is smaller than the mesh number of the grinding wheel of the secondary grinding device (10).

7. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 1 or 2, characterized in that: A cleaning device (11) and a dust cover are also provided. The cleaning device (11) is provided at one end of the mounting platform (1) away from the setting-out device (5); the dust cover covers the moving device (4), the setting-out device (5), the grinding device (6), the sampling device (7), the first slide rail (8), and the second slide rail group (9); and a vent is provided on the dust cover, which is connected to the fan.

8. The automatic grinding device for high-voltage semi-conductive rubber parts according to claim 1 or 2, characterized in that: The cleaning device (11) is an ultrasonic cleaning tank.

9. A high-voltage semi-conductive rubber part automatic grinding process, using a high-voltage semi-conductive rubber part automatic grinding device as claimed in any one of claims 1 to 8, characterized in that The following steps are involved: S1: Laying out the sample, placing the high-voltage semi-conductive rubber piece to be polished on the sample fixing column (42) of the moving device (4), and pushing it down to the corresponding position by the first sample pressing plate (51); S2: The recognition module (2) collects the shape of the high-voltage semi-conductive rubber part and compares it with the standard size preset in the controller (3) to calculate the grinding size; S3: grinding, the high-voltage semi-conductive rubber parts that have been set out and dimensionally identified are respectively ground through a grinding device (6); during the grinding process, the angle between the sample fixing column (42) and the mounting platform (1) is adjusted; S4: Extend the second sample pressing plate (71) of the sampling device (7) below the high-voltage semi-conductive rubber part and then move it upward. When the center of gravity height of the high-voltage semi-conductive rubber part is greater than the top of the sample fixing column (42), the second sample pressing plate (71) rotates to push the high-voltage semi-conductive rubber part out of the sample fixing column (71), so that the workpiece falls off and enters the next process.

10. The automatic grinding process for high-voltage semi-conductive rubber parts according to claim 9, characterized in that: Also includes S5: The workpiece enters the cleaning device (11) to complete the cleaning operation, and then enters the subsequent drying process.

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