Information technology integrated circuit board cutting equipment

Abstract

The invention discloses information technology integrated circuit board cutting equipment, relates to the field of integrated circuit board processing instruments, and provides the information technology integrated circuit board cutting equipment capable of solving the problems that a circuit board is prone to cracking in the cutting process and powder generated in the cutting process has large harm to human health. The cutting device is located on the left side of the base and connected with the base, the slotted hole processing device is located above the cutting device, a dust collecting device is arranged below the cutting device, and the dust collecting device is connected with the cutting device; and a slag collecting device is arranged below the slotted hole processing device and is used for collecting slag after the slotted hole processing device performs slotted hole processing on the circuit board. By designing the cutting device and the dust collecting device, the cutting efficiency is improved, and the health of personnel is protected.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit board processing equipment, and in particular to an information technology integrated circuit board cutting device. Background Art

[0002] Integrated circuit boards, made of copper, silicone and glass fiber, are the carriers of electrical connections for electronic components. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, improve the level of automation and production labor rate. Since some electronic manufacturers are unable to produce circuit boards, they have to purchase them from circuit board manufacturers. Since the purchased circuit boards are larger in specifications and do not meet the required specifications, the circuit boards need to be cut.

[0003] The outer layer of the copper clad laminate is a thin aluminum foil, and the middle part is a reinforcing material. However, due to its brittleness, the cut is prone to extension when cut with ordinary knives, resulting in cracking and unusability. In addition, dust is generated during the cutting process of the copper clad laminate, which can cause short circuits and other hazards to the circuits on the copper clad laminate. If the generated dust is inhaled by the human body, it will cause damage to the human skin, eyes, nervous system, digestive system and respiratory system, causing symptoms such as difficulty breathing, asthma, coughing, and sore throat.

[0004] A circuit board line grinding device with a publication (announcement) number of (CN 113692132 B) includes a machine body, a fixing mechanism, a conveying mechanism, and a grinding mechanism. The machine body also includes a dust removal mechanism, a dust exhaust hole, a dust storage box, a groove, a lifting mechanism, a through hole, and a flip cover. The cut circuit board is placed on the conveying mechanism. During the conveying process of the circuit board, the conveying mechanism will grind both sides of the circuit board to remove the burrs, making subsequent processing more convenient. The circuit board is conveyed to the fixing mechanism through the conveying mechanism. The fixing mechanism can be adjusted according to the size of the circuit board to fix the circuit board, and then the circuit board is ground by the grinding mechanism. After grinding, the lifting mechanism is used to move the fixing mechanism to the inside of the machine body, and the dust on the surface of the circuit board is removed by the dust removal mechanism to prevent the dust from polluting the environment and being inhaled by the human body.

[0005] However, this application still cannot solve the problem of easy cracking of circuit boards during cutting by using a retractable tool structure, which may cause the circuit boards of this application to crack during the cutting process, resulting in the circuit boards after cutting not being able to be used normally. In addition, this application only has one dust removal mechanism, which cannot collect all the dust and slag generated during the cutting and drilling processes, which may result in the dust or slag not being completely collected. Summary of the invention

[0006] In view of the above-mentioned problems, the present invention aims to provide an information technology integrated circuit board cutting equipment, which can solve the problem of easy cracking of circuit boards during the cutting process, and by setting up two dust removal machine structures, namely a dust collection device and a slag collection device, the dust generated during the cutting process and the slag generated during the drilling process can be comprehensively collected.

[0007] The main idea of ​​the technical solution adopted by the present invention is: At present, conventional cutting equipment mainly has the following problems: The cutting process is prone to cracking, causing waste and affecting efficiency; The cutting process produces a large amount of powder, which poses a great threat to the health of operators; Therefore, the present application adopts a retractable cutter to replace the conventional circular cutter. There are multiple blades, and the blade body is a long arc shape, which ensures the cutting sharpness while also ensuring its strength. The cutter is placed in the cutter disc groove and can slide radially along the groove. The bottom of the cutter is connected to the cutter disc by a spring, and the outside is fixed by a cover, so that when the cutter rotates with the cutter disc, the cutter extends to the outermost part under the action of the spring and centrifugal force. When cutting, the cutter intersects with the circuit board for a moment, and the circuit board is subjected to an instantaneous impact. However, due to the spring and the retractable groove, the cutter can have a certain amount of extension and contraction, avoiding hard contact between the cutter and the circuit board, and reducing the probability of the circuit board cracking during the cutting process.

[0008] The dust transfer box is also equipped with a one-way air inlet valve and a one-way exhaust valve. The one-way air inlet valve can only allow air to enter the transfer box, and will not let the dust inside escape into the air from here. The one-way exhaust valve only allows the gas and dust in the transfer box to enter the material box, and will not suck the dust in the material box back into the transfer box. The powder suction pump sucks and transports the dust under the drive of the pulley and the motor. When the cutting device cuts the circuit board, the powder suction pump sucks the powder, the front of the pump is negative pressure, and the back of the pump is positive pressure. Dust and air enter the material box, the air is discharged from the top filter, and the dust accumulates in the material box. When the cutting device is reset in the reverse direction, the powder suction pump reverses, the one-way exhaust valve blocks the inflow of dust, and the air flows into the dust transfer box through the one-way air inlet valve, and then is transmitted to the vicinity of the pallet through the flexible plastic pipeline, blowing a small amount of dust particles adsorbed on the circuit board away from the circuit board, and most of it enters the slag collection box below. When returning to the origin, the baffle hits the crossbeam inside the powder collection box, overcomes the elastic force and opens the unloading box, and the dust enters the powder collection box. When the box is full, it is cleaned in time. Improve the cutting working environment and reduce the health risks brought by dust to personnel.

[0009] In order to achieve the above object, the technical solution adopted by the present invention is as follows: An information technology integrated circuit board cutting device comprises a base, a cutting device located on the left side of the base and connected to the base, and a slot processing device located above the cutting device, characterized in that: A dust collecting device is provided below the cutting device, and the dust collecting device is connected to the cutting device; A slag collecting device is provided below the slot processing device, for collecting slag after the slot processing device performs slot processing on the circuit board; The cutting device comprises a tool structure, a driving structure located above the tool structure and connected to the tool structure, and a tool holder structure located below the driving structure and connected to the driving structure; The tool structure includes a tool disc, a retractable tool assembly arranged on the outer ring of the tool disc, and a cover arranged on the surface of the tool disc; The tool holder structure includes a tool holder connected to a tool disc, and a clamping assembly located below the tool holder and integrally formed with the tool holder. The tool holder is connected to the back of the tool disc, and a first pulley is also connected to the back of the tool disc.

[0010] Furthermore, the retractable tool assembly includes a cross-shaped groove opened on the tool disc, a No. 1 spring and a tool located inside the cross-shaped groove, one end of the No. 1 spring is connected to the inner wall of the cross-shaped groove, and the other end is connected to the tool.

[0011] Furthermore, the clamping assembly includes multiple groups of support plate components connected to the tool holder and a scratching knife located at the front end of each group of support plate components. A support member is provided between the tool holder and each group of support plate components. The support member has one end fixed to the tool holder and the other end passing through a support column in the support plate and a No. 2 spring located on one side of the support column.

[0012] Furthermore, each group of the support plate components includes support plates symmetrically arranged on the left and right sides of the tool holder, and a scratching knife is clamped between the support plates.

[0013] Furthermore, the dust collection device includes a powder suction pipeline connected to the support plate, and a powder collecting assembly connected to the powder suction pipeline, the powder collecting assembly includes a powder suction pump connected to the powder suction pipeline, the right end of the powder suction pump is connected to a No. 4 transmission wheel, a dust transfer box located below the powder suction pump, a discharge box located on the left side of the dust transfer box and connected to the dust transfer box, and a powder collecting box located below the discharge box, and a crossbeam is provided inside the powder collecting box.

[0014] Furthermore, the material discharge box includes a triangular box body with an opening facing obliquely downward, and a cover plate movably connected to the triangular box body, and a baffle is provided at the end of the cover plate, and the position of the baffle is flush with the position of the crossbeam.

[0015] Furthermore, the slag collection structure includes a frame located below the slot processing device, a vibration collection assembly located above the frame, a slag collection box located below the vibration collection assembly, and a No. 3 spring located below the slag collection box; a screw rod is provided through the top of the slag collection box, a push plate matching the internal size of the slag collection box is sleeved on the screw rod, and a drive motor is also provided on the slag collection box for driving the screw rod to rotate.

[0016] Furthermore, the vibration collection component is a vibration plate located above the frame, and a manual pressing rod is provided on one side of the vibration plate. The manual pressing rod passes through the side wall of the frame and is located outside the frame.

[0017] Furthermore, the driving structure includes a supporting assembly and a gear driving assembly located above the supporting assembly and connected to the supporting assembly; the supporting assembly includes L-shaped rods symmetrically arranged on the left and right sides of the frame, a crossbeam integrally formed with the two L-shaped rods and located above the L-shaped rods, and the crossbeam is also hollowed out to provide a slot; the gear driving assembly includes a rack laid on the crossbeam, a gear meshing with the rack, a crossbeam passing through the gear, a motor connected to one end of the crossbeam, and a No. 2 transmission wheel connected to the middle end of the crossbeam, a No. 2 belt is sleeved between the No. 1 transmission wheel and the No. 2 transmission wheel, and the No. 2 belt is passed through the slot.

[0018] Furthermore, the other end of the crossbar is also connected to a No. 3 transmission wheel, and the No. 3 transmission wheel is connected to a No. 4 transmission wheel at the right end of the powder suction pump, and a No. 2 belt is provided between the No. 3 transmission wheel and the No. 4 transmission wheel.

[0019] The beneficial effects of the present invention are as follows: compared with the prior art, the present invention has the following improvements: When the cutter disc rotates, the cutter extends to the outermost periphery under the action of the spring and centrifugal force. When cutting, the cutter intersects with the circuit board for a moment, and the circuit board is subjected to an instantaneous impact. However, due to the No. 1 spring and the cross groove, the cutter can have a certain amount of expansion and contraction, thereby avoiding hard contact between the cutter and the circuit board. In addition, four groups of support plates are distributed along the upper and lower cutting lines of the circuit board, and each group of support plates is connected to the cutter holder through the No. 2 spring. Under the elastic force of the No. 2 spring, the support plate provides tough support for the circuit board, thereby reducing the overhang distance of the circuit board during cutting, and reducing the cutting stress received by the cutter during cutting. At the front end of the support plate, two upper and lower scratch knives are fixed, and two upper and lower grooves are scratched on the circuit board before the cutter contacts, thereby further reducing the probability of cracking of the circuit board. The powder suction pump absorbs and transports the dust under the drive of the pulley and the motor. When moving in the cutting direction, the powder suction pump sucks the powder, and the dust and air enter the unloading box. The air is discharged from the top filter, and the dust accumulates in the unloading box. When the cutting frame is reset in the opposite direction, the powder suction pump reverses, and the one-way emptying valve prevents the dust from flowing in. The air flows into the transfer box through the one-way air inlet valve, and then is transmitted to the vicinity of the pallet through the pipeline, blowing a small amount of dust particles adsorbed on the circuit board away from the circuit board, and most of it enters the slag collection box below. When returning to the origin, the baffle hits the cross bar inside the powder collection box, overcomes the elastic force to open the unloading box, and the dust enters the powder collection box. When the box is full, clean it in time. Improve the cutting working environment and reduce the health risks brought by dust to personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a side view of the information technology integrated circuit board cutting device of the present invention.

[0021] Figure 2 It is a top view of the information technology integrated circuit board cutting device of the present invention.

[0022] Figure 3 It is a three-dimensional structural schematic diagram of the information technology integrated circuit board cutting device of the present invention.

[0023] Figure 4 The present invention is a top view of the base and circuit board of the information technology integrated circuit board cutting device.

[0024] Figure 5 The present invention is a schematic structural diagram of the information technology integrated circuit board cutting device after the base and the circuit board are removed.

[0025] Figure 6 The present invention is a schematic diagram of a cutting device of the information technology integrated circuit board cutting device without a cutting tool.

[0026] Figure 7 It is a schematic diagram of the back structure of the cutting device in the information technology integrated circuit board cutting equipment of the present invention.

[0027] Figure 8 It is a side view of the clamping assembly in the information technology integrated circuit board cutting equipment of the present invention.

[0028] Fig. 9 It is a schematic diagram of the three-dimensional structure of the clamping assembly in the information technology integrated circuit board cutting equipment of the present invention.

[0029] Fig.10 It is a schematic diagram of the three-dimensional structure of the clamping assembly of the information technology integrated circuit board cutting device of the present invention from another perspective.

[0030] Fig.11 The present invention is a schematic structural diagram of a slag collecting device for cutting equipment for information technology integrated circuit boards.

[0031] Fig.12 The present invention is a top view of a slag collecting device of an information technology integrated circuit board cutting device.

[0032] Fig.13 The present invention is a schematic diagram of the structure of a slag collection box for cutting equipment for information technology integrated circuit boards.

[0033] Fig.14 It is a side cross-sectional view of a slag collecting device of the information technology integrated circuit board cutting equipment of the present invention.

[0034] Fig.15 It is a front view of the tool structure of the information technology integrated circuit board cutting equipment of the present invention.

[0035] Fig.16 It is a vertical cross-sectional view of the tool structure of the information technology integrated circuit board cutting device of the present invention.

[0036] Fig.17 It is a three-dimensional structural schematic diagram of the tool structure of the information technology integrated circuit board cutting equipment of the present invention.

[0037] Fig.18 The present invention is a schematic diagram of the structure of the powder collecting component of the information technology integrated circuit board cutting device.

[0038] Fig.19 This is a three-dimensional diagram from a top view of a powder collecting assembly of the information technology integrated circuit board cutting device of the present invention.

[0039] Fig. 20 The present invention is a schematic structural diagram of the powder collecting component of the information technology integrated circuit board cutting device after the material box is removed.

[0040] Among them: 1. base, 2. frame, 3. slot processing drill, 4. slide bar, 5. push plate, 6. slide slot, 7. circuit board, 8. L-shaped plate, 9. rack, 10. unloading box, 11. powder suction pipeline, 12. No. 2 spring, 13. support plate, 14. powder suction pump, 15. knife holder, 16. scratch knife, 17. No. 1 transmission wheel, 18. No. 2 belt, 19. motor, 20. cover, 21. tool, 22. No. 1 spring, 23. knife disc, 24. cross groove, 25. Vibrating plate, 26. Driving motor, 27. Manual pressing rod, 28. Slag collection box, 29. Hollow surface, 30. Cross bar, 31. Screw rod, 32. Scraper, 33. Limiting column, 34. Dust transfer box, 35. Powder collection box, 36. Baffle, 37. Cross bar, 38. Spring No. 5, 39. Beam, 40. Inverted L-shaped plate, 41. Spring No. 3, 42. Spring No. 4, 43. Transmission wheel No. 2, 44. Transmission wheel No. 3, 45. Transmission wheel No. 4, 46. Belt No. 1. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0042] See also Figure 1-Figure 20 , the present application discloses an information technology integrated circuit board cutting device, comprising a base 1, a cutting device located on the left side of the base 1 and connected to the base, and a slot processing device located above the cutting device, a dust collecting device is provided below the cutting device, and the dust collecting device is connected to the cutting device; Among them, two slide grooves 6 are provided on the base 1, and a push plate 5 is sleeved in the slide groove 6. When the circuit board 7 is placed on the base 1, the push plate 5 can clamp the circuit board 7 to play a limiting role. When the cutting device cuts the circuit board 7, the circuit board 7 can be pushed forward to facilitate the cutting device to perform cutting at different positions.

[0043] It should be noted that the slot processing drill 3 in the slot processing device of the present application is a rotary drill cutter, which can perform transverse rotation to expand the slot after drilling through, and cooperate with multiple sets of linear modules and control systems to accurately drill holes according to the drawings, and the slot processing device and its use method are prior art. The improvements of the present application do not involve the slot processing device and will not be elaborated here.

[0044] A slag collecting device is provided below the slot processing device, which is used to collect the slag left after the slot processing device performs slot processing on the circuit board 7 and the slag generated after the cutting device cuts the circuit board 7; the slag collecting structure includes a frame 2 located below the slot processing device, a vibration collecting assembly located above the frame 2, a slag collecting box 28 located below the vibration collecting assembly, and a No. 3 spring 41 located below the slag collecting box 28; a screw rod 31 is provided through the top of the slag collecting box 28, and a scraper 32 matching the internal size of the slag collecting box 28 is sleeved on the screw rod 31, and a driving motor 26 is also provided on the slag collecting box 28 for driving the screw rod 31 to rotate.

[0045] More specifically, one surface of the slag collection box facing the outside of the frame 2 is a hollow surface 29, and a cross bar 30 formed integrally with the frame 2 is provided above the hollow surface 29. A screw rod 31 extends through the cross bar 30, and a drive motor 26 is connected to the outside of the screw rod 31.

[0046] The vibration collection component is a vibration plate 25 located on a limit column 33 protruding above the frame 2 through a No. 4 spring 42. Small holes are evenly opened on the vibration plate 25. The diameter of the small holes is 5 mm, which is larger than the diameter of the slag. A manual pressing rod 27 is provided on one side of the vibration plate 25. A larger opening is opened on the side wall of the frame 2, which enables the manual pressing rod 27 to pass through the side wall of the frame 2 and is located outside the frame 2, so that the user can press the manual pressing rod 27 to bounce the slag on the vibration plate 25 and make the slag fall from the small hole to the slag collection box 28.

[0047] During use, when the slot processing device is drilling a hole on the circuit board, or when the tool 21 is cutting the circuit board 7, slag will be generated and fall on the vibration plate 25. Some of the slag will fall into the slag collection box 28 through the small holes, but some will fall on the partition plate between the small holes. Therefore, in order to make all the slag fall into the slag collection box 28, the manual pressing rod 27 located outside the frame 2 can be manually shaken or pressed. Since No. 4 springs 42 are provided on the four corners under the vibration plate 25, the vibration plate 25 is shaken under the elastic force of the No. 4 spring 42 by shaking or pressing the manual pressing rod 27, so that the vibration plate 25 is shaken under the elastic force of the No. 4 spring 42, and the slag falls into the slag collection box 28 during the shaking process, and finally all the slag falls into the slag collection box 28. When the slag in the slag collecting box 28 is collected to a certain extent, for example, the slag has covered the bottom of the slag collecting box, the drive motor 26 can be started to drive the drive motor 26 to rotate the screw rod 31. When the screw rod 31 rotates, it will drive the scraper 32 mounted on one end of the screw rod 31 to move. During the movement, the scraper 32 will scrape the slag to the hollow part of the hollow surface 29, and then the user will collect the slag for subsequent processing.

[0048] The cutting device includes a tool structure, a drive structure located above the tool structure and connected to the tool structure, and a tool holder structure located below the drive structure and connected to the drive structure; The tool structure includes a cutter disc 23, a retractable cutter assembly arranged on the outer ring of the cutter disc 23, and a cover 20 covering the surface of the cutter disc 23; the retractable cutter assembly includes a cross-shaped groove 24 opened on the cutter disc 23, a spring 22 and a cutter 21 located inside the cross-shaped groove 24, one end of the spring 22 is connected to the inner wall of the cross-shaped groove 24, and the other end is connected to the cutter 21. The cutter 21 of the present application adopts a retractable cutter to replace a conventional circular cutter. There are multiple cutters 21, which are evenly distributed on the outer ring of the cutter disc 23, and the blade is a long arc, which ensures the cutting sharpness while also ensuring its strength. The tool 21 is placed in the cross-shaped groove 24 and can slide along the inner diameter of the cross-shaped groove 24. The bottom of the tool 21 is connected to the cutter disc 23 with a No. 1 spring 22, and the outside is fixed by the cover 20. When the tool 21 rotates with the cutter disc 23, under the action of the No. 1 spring 22 and the centrifugal force, the tool 21 extends to the outermost edge. During cutting, the tool 21 intersects with the circuit board 7 for a moment, and the circuit board 7 is subjected to an instantaneous impact. However, due to the No. 1 spring 22 and the cross-shaped groove 24, the tool 21 can have a certain amount of expansion and contraction, thereby avoiding hard contact between the tool 21 and the circuit board 7 and reducing the probability of cracking of the circuit board 7 during the cutting process.

[0049] The tool holder structure includes a tool holder 15 connected to the tool disc 23, and a clamping assembly located below the tool holder 15 and integrally formed with the tool holder 15. The tool holder 15 is connected to the back of the tool disc 23, and the back of the tool disc 23 is also connected to a No. 1 transmission wheel 17.

[0050] The clamping assembly includes multiple groups of support plate components connected to the tool holder 15 and a scoring knife 16 located at the front end of each group of support plate components. A support member is provided between the tool holder 15 and each group of support plate components. The support member includes a support column with one end fixed to the tool holder 15 and the other end passing through the support plate component, and a second spring 12 located on one side of the support column. Each group of support plate components includes support plates 13 symmetrically arranged on the left and right sides of the tool holder 15, and a scoring knife 16 is clamped between the support plates 13.

[0051] More specifically, along the upper and lower cutting lines of the circuit board, four groups of support plates 13 are distributed, and each support plate 13 is connected to the knife holder 15 through a No. 2 spring 12. Under the action of the No. 2 spring 12, the support plate 13 provides tough support for the circuit board 7, so that the overhang distance of the circuit board 7 is reduced during cutting, and the cutting stress received by the cutter 21 during cutting is reduced, thereby reducing the probability of cracking of the circuit board. At the front end of the support plate 13, two upper and lower scratch knives 16 are fixed. Before the cutter 21 contacts the circuit board 7, the upper and lower scratch knives 16 first scratch two upper and lower grooves on the circuit board, further reducing the probability of cracking of the circuit board 7. More preferably, at the rear end of the support plate 13, a grinding plate is provided on the contact surface with the cutting surface of the circuit board 7, and the cutting surface and corners of the circuit board 7 are ground when the knife holder 15 moves forward for cutting, so that the cutting surface is smoother. A powder suction pipeline 11 is bonded and fixed to the outer side of the support plate 13, and the tiny dust generated during the cutting process and the grinding process is transmitted to the unloading box 10 under the suction of the powder suction pump 14.

[0052] More specifically, the dust collection device includes a powder suction pipeline 11 connected to the support plate 13, and a powder collecting assembly connected to the powder suction pipeline 11, the powder collecting assembly includes a powder suction pump 14 connected to the powder suction pipeline 11, the right end of the powder suction pump 14 is connected to the fourth transmission wheel 45, a dust transfer box 34 is located below the powder suction pump 14, a discharge box 10 is located on the left side of the dust transfer box 34 and connected to the dust transfer box 34, and a powder collecting box 35 is located below the discharge box 10, and a cross bar 37 is provided inside the powder collecting box 35.

[0053] The material box 10 comprises a triangular box body with an opening facing obliquely downward, and a baffle 36 movably connected to the triangular box body. A stopper is provided at the end of the baffle 36 , and the position of the stopper is flush with the position of the cross bar 37 .

[0054] More preferably, a one-way air inlet valve and a one-way exhaust valve are also provided on the dust transfer box 34. The one-way air inlet valve can only allow air to enter the dust transfer box 34, and will not allow the dust in the dust transfer box 34 to escape into the air. The one-way exhaust valve only allows the gas and dust in the dust transfer box 34 to enter the material box 10, and will not suck the dust in the material box 10 back to the dust transfer box 34. The powder suction pump 14 sucks and transports the dust under the drive of the fourth transmission wheel 45 and the motor 19. When the cutting device cuts the circuit board, the powder suction pump 14 sucks the powder, and the dust and air enter the material box 10. The air is discharged from the top filter, and the dust accumulates in the material box 10. When the cutting device is reset in the reverse direction, the powder suction pump 14 reverses, the one-way emptying valve prevents dust from flowing in, and the air flows into the dust transfer box 34 through the one-way air inlet valve, and then is transmitted to the vicinity of the support plate 13 through the powder suction pipeline 11, blowing a small amount of dust particles adsorbed on the circuit board 7 away from the circuit board 7, and most of them enter the slag collection box 28 below. When returning to the origin, the block below the baffle 36 hits the cross bar 37 inside the powder collection box 35, overcomes the elastic force and opens the unloading box 10, and the dust enters the powder collection box 35, and the box is cleaned in time when it is full. It should be noted that the powder suction pipeline 11 is a flexible plastic pipeline.

[0055] The realization of the above-mentioned cutting and powder suction functions relies on the driving structure, which includes a support assembly and a gear driving assembly located above the support assembly and connected to the support assembly; the support assembly includes L-shaped plates 8 symmetrically arranged on the left and right sides of the frame, and a crossbeam 39 that is integrally formed with the two L-shaped plates 8 and located above the L-shaped plates 8, and the crossbeam 39 is also hollowed out with a slot; the gear driving assembly includes a rack 9 laid on the crossbeam 39, a gear meshing with the rack 9, a fixed shaft passing through the gear, a motor 19 connected to one end of the fixed shaft, and a No. 2 transmission wheel 43 connected to the middle end of the fixed shaft, and a No. 2 belt 18 is sleeved between the No. 1 transmission wheel 17 and the No. 2 transmission wheel 43, and the No. 2 belt 18 is passed through the slot.

[0056] The other end of the fixed shaft is also connected to a third transmission wheel 44 , which is connected to a fourth transmission wheel 45 at the right end of the powder suction pump 14 , and a first belt 46 is provided between the third transmission wheel 44 and the fourth transmission wheel 45 .

[0057] By starting the motor 19, the gear is driven to rotate. Since the gear and the rack 9 are meshed, the gear moves forward or backward on the rack 9. The forward movement is explained here as an example. When the gear moves forward on the rack 9, the inverted L-shaped plate 40 connected to the motor 19 is driven to move. The inverted L-shaped plate 40 drives the tool 21 and the support plate 13 connected thereto to move forward, thereby starting the tool 21 to cut the circuit board 7.

[0058] Example 1 When the information integrated circuit board cutting device of the present application is in use, the motor 19 is started to drive the gear to rotate. Since the gear and the rack 9 are meshed, the gear moves forward or backward on the rack 9. The forward movement is explained here as an example. When the gear moves forward on the rack 9, the inverted L-shaped plate 40 connected to the motor 19 is driven to move. The inverted L-shaped plate 40 drives the tool 21 and the support plate 13 connected to it to move forward, and then the tool 21 is started to cut the circuit board 7.

[0059] The motor 19 controls the cutting device to move forward or backward through the transmission structure of the gear and the transmission wheel, and then cuts the circuit board 7. Before the cutter 21 contacts the circuit board 7, the upper and lower scratching knives 16 first cut two upper and lower grooves on the circuit board, and then the cutter 21 is used to cut the circuit board 7. The circuit board 7 is subjected to an instantaneous impact, but due to the No. 1 spring 22 and the cross groove 24, the cutter 21 can have a certain amount of expansion and contraction, avoiding the hard contact between the cutter 21 and the circuit board 7, and reducing the probability of cracking of the circuit board 7 during the cutting process. In addition, at the rear end of the support plate 13, which contacts the cutting surface of the circuit board 7, a grinding plate is set to grind the cutting surface and corners of the circuit board 7 when the knife holder 15 moves forward for cutting, so that the cutting surface is smoother.

[0060] When the cutting device cuts the circuit board, dust will be generated. In order to prevent the dust from being inhaled by the human body and causing harm to the human body, the present application also provides a powder suction pump 14 to suck powder. Under the action of the powder suction pump 14, dust and air enter the material box 10, and the air is discharged from the top filter screen, and the dust accumulates in the material box 10. When the cutting device is reversed and reset, the powder suction pump 14 reverses, the one-way emptying valve prevents the dust from flowing in, and the air flows into the dust transfer box 34 through the one-way air inlet valve, and then is transmitted to the vicinity of the support plate 13 through the powder suction pipeline 11, blowing a small amount of dust particles adsorbed on the circuit board 7 away from the circuit board 7, and most of them enter the slag collection box 28 below. When returning to the origin, the block below the baffle 36 hits the cross bar 37 inside the powder collection box 35, overcomes the elastic force to open the material box 10, and the dust enters the powder collection box 35. When the box is full, it is cleaned in time.

[0061] Example 2 The use process and method of this embodiment are the same as those of Example 1. The only difference is that after cutting the circuit board, it is necessary to drill the circuit board. When the slot processing device drills the circuit board, slag will be generated. The slag falls on the vibration plate 25. Some of the slag will fall into the slag collection box 28 through the small holes, but some will fall on the partition plate between the small holes. Therefore, in order to make all the slag fall into the slag collection box 28, the manual pressing rod 27 located outside the frame 2 can be manually shaken or pressed. Since No. 4 springs 42 are provided on the four corners under the vibration plate 25, the vibration plate 25 is shaken under the elastic force of the No. 4 spring 42 by shaking or pressing the manual pressing rod 27, so that the vibration plate 25 is shaken under the elastic force of the No. 4 spring 42, and the slag falls into the slag collection box 28 during the shaking process, and finally all the slag falls into the slag collection box 28. When the slag in the slag collecting box 28 is collected to a certain extent, for example, the slag has covered the bottom of the slag collecting box, the drive motor 26 can be started to drive the drive motor 26 to rotate the screw rod 31. When the screw rod 31 rotates, it will drive the scraper 32 mounted on one end of the screw rod 31 to move. During the movement, the scraper 32 will scrape the slag to the hollow part of the hollow surface 29, and then the user will collect the slag for subsequent processing.

[0062] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An information technology integrated circuit board cutting device, comprising a base (1), a cutting device located on the left side of the base (1) and connected to the base (1), and a slot processing device located above the cutting device, characterized in that: A dust collecting device is provided below the cutting device, and the dust collecting device is connected to the cutting device; A slag collecting device is provided below the slot processing device, for collecting slag after the slot processing device performs slot processing on the circuit board; The cutting device comprises a tool structure, a driving structure located above the tool structure and connected to the tool structure, and a tool holder structure located below the driving structure and connected to the driving structure; The tool structure comprises a tool disc (23), a retractable tool assembly arranged on the outer ring of the tool disc (23), and a cover (20) arranged on the surface of the tool disc (23); The tool holder structure comprises a tool holder (15) connected to a tool disc, and a clamping assembly located below the tool holder (15) and integrally formed with the tool holder (15); the tool holder (15) is connected to the back side of the tool disc (23); and the back side of the tool disc (23) is also connected to a first transmission wheel (17).

2. The information technology integrated circuit board cutting device according to claim 1, characterized in that: The retractable tool assembly comprises a cross-shaped groove (24) formed on a tool disc (23), a first spring (22) and a tool (21) located inside the cross-shaped groove (24), one end of the first spring (22) being connected to the inner wall of the cross-shaped groove (24), and the other end being connected to the tool (21).

3. The information technology integrated circuit board cutting device according to claim 2, characterized in that: The clamping assembly comprises a plurality of groups of support plate components connected to a tool holder (15) and a scoring knife (16) located at the front end of each group of support plate components, a support member is provided between the tool holder (15) and each group of support plate components, the support member comprises a support column having one end fixed to the tool holder (15) and the other end passing through the support plate component, and a No. 2 spring (12) located at one side of the support column.

4. The information technology integrated circuit board cutting device according to claim 3, characterized in that: Each group of the support plate components comprises support plates (13) symmetrically arranged on the left and right sides of the knife holder (15), a scratching knife (16) is clamped between the support plates (13), and a grinding plate is provided on the contact surface between the support plates (13) and the cutting surface of the circuit board, which is used to grind the cutting surface of the circuit board during the cutting process.

5. The information technology integrated circuit board cutting device according to claim 4, characterized in that: The dust collecting device comprises a powder suction pipeline (11) arranged outside the support plate (13), and a powder collecting assembly connected to the powder suction pipeline (11), the powder collecting assembly comprises a powder suction pump (14) connected to the powder suction pipeline (11), a fourth transmission wheel (45) connected to the right end of the powder suction pump (14), a dust transfer box (34) located below the powder suction pump (14), a feed box (10) located on the left side of the dust transfer box (34) and connected to the dust transfer box (34), and a powder collecting box (35) located below the feed box (10), wherein a cross bar (37) is provided inside the powder collecting box (35).

6. The information technology integrated circuit board cutting device according to claim 5, characterized in that: The material discharge box (10) comprises a triangular box body with an opening facing obliquely downward, and a baffle (36) movably connected to the triangular box body, a baffle being provided at the end of the baffle (36), the position of the baffle being flush with the position of the crossbeam (39).

7. The information technology integrated circuit board cutting device according to claim 6, characterized in that: The slag collection structure comprises a frame (2) located below the slot processing device, a vibration collection assembly located above the frame (2), a slag collection box (28) located below the vibration collection assembly, and a No. 3 spring (41) located below the slag collection box (28); a screw rod (31) is provided through the top of the slag collection box (28), a scraper (32) matching the internal dimensions of the slag collection box (28) is sleeved on the screw rod (31), and a drive motor (26) is also provided on the slag collection box (28) for driving the screw rod (31) to rotate.

8. The information technology integrated circuit board cutting device according to claim 7, characterized in that: The vibration collection component is a vibration plate (25) located above the frame (2), the vibration plate (25) is evenly provided with a plurality of small holes with diameters larger than the slag, and a manual pressing rod (27) is provided on one side of the vibration plate (25), the manual pressing rod (27) passes through the side wall of the frame (2) and is located outside the frame (2).

9. The information technology integrated circuit board cutting device according to claim 8, characterized in that: The driving structure comprises a support assembly and a gear drive assembly located above the support assembly and connected to the support assembly; the support assembly comprises L-shaped plates (8) symmetrically arranged on the left and right sides of the frame (2), and a crossbeam (39) integrally formed with the two L-shaped plates (8) and located above the L-shaped plates (8), wherein the crossbeam (39) is also hollowed out to provide a slot; the gear drive assembly comprises a rack (9) laid on the crossbeam (39), a gear meshing with the rack (9), a fixed shaft passing through the gear, a motor (19) connected to one end of the fixed shaft, and a No. 2 transmission wheel (43) connected to the middle end of the fixed shaft, a No. 2 belt (18) being sleeved between the No. 1 transmission wheel (17) and the No. 2 transmission wheel (43), wherein the No. 2 belt (18) is passed through the slot.

10. The information technology integrated circuit board cutting device according to claim 9, characterized in that: The other end of the fixed shaft is also connected to a No. 3 transmission wheel (44), and the No. 3 transmission wheel (44) is connected to a No. 4 transmission wheel (45) at the right end of the powder suction pump (14), and a No. 1 belt (46) is provided between the No. 3 transmission wheel (44) and the No. 4 transmission wheel (45).

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