Warping degree laser detection equipment for semiconductor assembly

Abstract

The invention belongs to the field of semiconductor detection, and particularly relates to semiconductor component warping degree laser detection equipment which comprises a detection box, an assembly box is arranged in the detection box, and an assembly seat is arranged in the assembly box. The uppermost assembly disc retracts into the assembly seat, the assembly discs drive the to-be-detected semiconductor component installed on the top of the assembly discs to retract into the assembly seat together, the to-be-detected semiconductor component below the assembly discs moves upwards to the detection position a along with the assembly box, and after detection is completed, the assembly box moves upwards, and the to-be-detected semiconductor component is detected. The to-be-detected semiconductor assemblies after detection are retracted into the assembly seat, and the next to-be-detected semiconductor assembly is moved to the detection position a again, so that the equipment can detect a plurality of to-be-detected semiconductor assemblies, time is saved, the detection distances between the to-be-detected semiconductor assemblies and the laser detection assembly are the same, and the detection efficiency is improved. And the detection of the laser detection assembly is ensured.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor detection, in particular to a warpage laser detection device for semiconductor components. Background Art

[0002] Semiconductor warpage will reduce process accuracy, cause equipment compatibility issues, increase manufacturing difficulty and cost during the manufacturing process, and cause product electrical performance degradation, reliability degradation, and optical performance damage. Therefore, it is necessary to use semiconductor component warpage laser detection equipment to detect semiconductor warpage.

[0003] The warpage laser detection equipment for semiconductor components emits a laser beam to the surface of the semiconductor component. The laser beam is captured by the receiving device after being reflected from the surface of the component. The height information of different positions on the surface of the component is accurately calculated based on parameters such as the angle and time of the reflected light. The warpage of the semiconductor component is determined by analyzing and processing the height data of multiple positions, thereby completing the warpage detection of the semiconductor component.

[0004] When using the existing laser detection equipment for warpage of semiconductor components, the semiconductor component needs to be clamped into the detection equipment for detection. After the detection is completed, it is taken out and the next semiconductor component is clamped. The semiconductor components are clamped and tested repeatedly, which wastes a lot of time during clamping, slowing down the detection process and affecting the detection efficiency.

[0005] To this end, the present invention provides a laser detection device for warpage of a semiconductor component. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a laser detection device for warping of a semiconductor component described in the present invention comprises: a detection box, an assembly box is arranged inside the detection box, an assembly seat is arranged inside the assembly box, an assembly disk is arranged on one side of the assembly seat, a vacuum adsorption component is arranged at the bottom of the assembly disk, a semiconductor component to be detected is arranged on the top of the assembly disk, a laser detection component is arranged on one side inside the detection box, the laser detection component is located above the semiconductor component to be detected, side frames are fixed at both ends of the assembly seat, a barrier block 1 is arranged inside the side frame, a barrier block 2 is arranged on one side of the barrier block 1, and push rods are arranged at both ends of one side of the top of the assembly box.

[0008] Preferably, a sliding rod 1 is fixed at both ends inside the assembly seat, a sliding sleeve 1 is provided on the outside of the sliding rod 1, the sliding sleeve 1 is fixed to the two ends of one side of the assembly disk, one end of the sliding sleeve 1 is fixedly connected to a blocking block 1, the blocking block 1 is placed in the side frame and can slide in the side frame, the blocking block 2 can prevent the assembly disk from moving into the assembly seat by blocking the movement of the blocking block 1, a spring 2 is wound around the outside of the sliding rod 1, one end of the spring 2 is fixedly connected to the sliding sleeve 1, and the other end of the spring 2 is fixedly connected to the inner wall of the assembly seat, a guide rod is fixed on one side of the assembly disk, and the guide rod protrudes from one side of the assembly seat.

[0009] Preferably, a side block is fixed at one end of the side frame, and a barrier block two is arranged at the end of the side block facing the side frame, barrier block two is in conflict with barrier block one, guide rods are arranged at the top and bottom ends inside the side block, the guide rods are fixed to the top and bottom ends of the back of barrier block two, guide grooves are opened at the top and bottom ends of the back of the side block, the guide rods are placed in the guide grooves and slide in the guide grooves, a spring three is fixed inside the side block, the spring three is located between the guide rods, and one end of the spring three is fixedly connected to the back of barrier block two.

[0010] Preferably, a sliding sleeve 2 is fixed on the top and bottom of the side block, a sliding rod 2 is arranged inside the sliding sleeve 2, the sliding rod 2 is fixed on the push block 2, the push blocks 2 are fixed on both sides of the side block, a push block 1 is arranged above the push block 2, and the push block 1 is fixed on the top rod.

[0011] Preferably, a movable rod is provided at the top and bottom ends of the side block, a connecting block 2 is fixed to one end of the movable rod, the connecting block 2 is fixed to the sliding sleeve 2, a connecting block 3 is sleeved on the outside of the other end of the movable rod, the connecting block 3 is fixed to the sliding rod 2, a spring 4 is wound around the outside of the movable rod, one end of the spring 4 is fixedly connected to the connecting block 2, and the other end of the spring 4 is fixedly connected to the connecting block 3.

[0012] Preferably, the assembly seat is installed inside the assembly box from bottom to top, and the laser detection component is located above the uppermost assembly plate.

[0013] Preferably, a slide rail 1 is provided at the front and rear ends of the laser detection component, an electric slider 1 is provided on the slide rail 1, the electric slider 1 is fixed to the front and back of the laser detection component, a slide rail 2 is provided on one side of the slide rail 1, the slide rail 2 is installed on one side inside the detection box, an electric slider 2 is provided on the slide rail 2, and one side of the electric slider 2 is fixedly connected to the slide rail 1.

[0014] Preferably, a box seat is fixed to the bottom of the testing box, an assembly table one is fixed to the bottom of the assembly box, an assembly table two is arranged at the bottom of the assembly table one, the assembly table two is fixed to the bottom end inside the testing box, a telescopic rod is installed at the top end inside the box seat, the top of the telescopic rod protrudes from the bottom end inside the testing box and is fixedly connected to the bottom of the assembly table two.

[0015] Preferably, connecting blocks 1 are fixed on both sides of the top of the second assembly platform, connecting grooves are opened on both sides of the bottom of the first assembly platform, the sizes of the connecting block 1 and the connecting grooves match, and the connecting grooves can slide on the outside of the connecting block 1.

[0016] Preferably, a fixing hole is provided at one end of the connecting block 1, and built-in cavities are provided on both sides of the assembly table 1, the built-in cavities are communicated with the interior of the connecting groove, and the positions are exactly corresponding to the fixing holes, a fixing pin is provided in the built-in cavity, the fixing pin can be inserted into the fixing hole, a built-in block is provided in the built-in cavity, the built-in block is fixed to the outside of the fixing pin, a spring 1 is provided inside the built-in cavity, one end of the spring 1 is fixedly connected to the built-in block, and the other end of the spring 1 is fixedly connected to the inner wall of the built-in cavity.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. A warpage laser detection device for semiconductor components described in the present invention, after the detection of the top semiconductor component to be detected is completed, the assembly box moves up, the barrier block 2 retracts, and the barrier block 1 is lost, so that the assembly disk located at the top is retracted into the assembly seat, and the assembly disk drives the semiconductor component to be detected installed on the top thereof to be retracted into the assembly seat together. After a semiconductor component to be detected located at the top is retracted into the assembly seat, a semiconductor component to be detected below it follows the assembly box to move up to the detection position a. After the detection is completed, the assembly box moves up, so that the detected semiconductor component to be detected is retracted into the assembly seat, and the next semiconductor component to be detected is moved to the detection position a again. In this way, not only can the device detect multiple semiconductor components to be detected without repeated clamping, thus saving the time required for repeated clamping, but also, the detection distance between the semiconductor component to be detected and the laser detection component is the same each time, thus ensuring the detection of the laser detection component, and the detection of the semiconductor component to be detected will not be affected by the long distance between the semiconductor component to be detected and the laser detection component.

[0019] 2. The warpage laser detection device for semiconductor components described in the present invention can detect multiple semiconductor components to be detected by loading multiple semiconductor components to be detected at one time. There is no need to repeatedly clamp the semiconductor components to be detected. During the detection process, the next batch of semiconductor components to be detected can be loaded. After the detection is completed, the assembly box loaded with the semiconductor components to be detected can be directly loaded into the equipment, which saves a lot of time and improves the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is the overall structural diagram of the present invention;

[0022] Figure 2It is a cross-sectional view of the overall structure of the present invention;

[0023] Figure 3 It is a partial structural diagram of the present invention;

[0024] Figure 4 The bearing seat structure of the present invention Figure 1 ;

[0025] Figure 5 The bearing seat structure of the present invention Figure 2 ;

[0026] Figure 6 is a cross-sectional view of the bearing seat structure in the present invention;

[0027] Figure 7 It is a partial structural diagram of the barrier block in the present invention;

[0028] Figure 8 is a cross-sectional view of a local structure of a barrier block in the present invention;

[0029] Fig. 9 is a side structural sectional view of the carrying box in the present invention;

[0030] Fig.10 This is a structural split diagram of the assembly seat in the present invention;

[0031] Fig.11 It is a partial structural sectional view of the assembly seat in the present invention;

[0032] In the figure: 1, test box; 2, box seat; 3, assembly box; 31, assembly table 1; 32, assembly table 2; 33, telescopic rod; 34, connection block 1; 341, fixing hole; 342, built-in cavity; 343, fixing pin; 344, built-in block; 345, spring 1; 35, connection groove; 4, assembly seat; 41, assembly plate; 42, semiconductor component to be tested; 43, side frame; 44, side block; 45, guide rod; 46, sliding sleeve 1; 47, sliding rod 1; 48, spring Spring two; 5, push rod; 51, push block one; 52, push block two; 53, barrier block one; 54, barrier block two; 541, spring three; 542, guide rod; 543, guide groove; 55, slide sleeve two; 551, connecting block two; 552, movable rod; 553, connecting block three; 554, spring four; 56, slide rod two; 6, laser detection component; 61, electric slider one; 62, slide rail one; 63, electric slider two; 64, slide rail two; 7, vacuum adsorption component. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0034] like Figures 1 to 11 As shown, a laser detection device for warping of a semiconductor component according to an embodiment of the present invention comprises: a detection box 1, an assembly box 3 is arranged inside the detection box 1, an assembly seat 4 is arranged inside the assembly box 3, an assembly disk 41 is arranged on one side of the assembly seat 4, a vacuum adsorption component 7 is arranged at the bottom of the assembly disk 41, a semiconductor component 42 to be detected is arranged on the top of the assembly disk 41, a laser detection component 6 is arranged on one side inside the detection box 1, the laser detection component 6 is located above the semiconductor component 42 to be detected, side frames 43 are fixed at both ends of the assembly seat 4, a blocking block 1 53 is arranged in the side frame 43, a blocking block 2 54 is arranged on one side of the blocking block 1 53, top rods 5 are arranged on both ends of one side of the top of the assembly box 3, the assembly seat 4 is installed inside the assembly box 3 from bottom to top, and the laser detection component 6 is located above the top assembly disk 41.

[0035] A plurality of semiconductor components 42 to be inspected are mounted on an assembly tray 41, and the semiconductor components 42 to be inspected are adsorbed and fixed by a vacuum adsorption component 7. A plurality of assembly seats 4 are arranged inside the assembly box 3, and an assembly tray 41 is arranged in each assembly seat 4. A semiconductor component 42 to be inspected is mounted on each assembly tray 41. The laser detection component 6 preferentially detects the warpage of the semiconductor component 42 to be inspected at the top, and the position of the semiconductor component 42 to be inspected at the top is set as the detection position, which is marked with a.

[0036] After the inspection of the top semiconductor component 42 to be inspected is completed, the assembly box 3 moves upward, the blocking block 2 54 retracts, and the blocking block 1 53 is no longer blocked, so that the assembly plate 41 located at the top is retracted into the assembly seat 4, and the assembly plate 41 drives the semiconductor component 42 to be inspected installed on the top thereof to be retracted into the assembly seat 4 together;

[0037] After a semiconductor component 42 to be detected located above is retracted into the assembly seat 4, a semiconductor component 42 to be detected below it follows the assembly box 3 to move up to the detection position a. After the detection is completed, the assembly box 3 moves up to make the semiconductor component 42 to be detected that has completed the detection retract into the assembly seat 4, and the next semiconductor component 42 to be detected is moved to the detection position a again. In this way, not only can the device detect multiple semiconductor components 42 to be detected without repeated clamping, thus saving the time required for repeated clamping, but also, the detection distance between the semiconductor component 42 to be detected and the laser detection component 6 is the same each time, thus ensuring the detection of the laser detection component 6, and the detection of the semiconductor component 42 to be detected will not be affected by the change in the distance between the semiconductor component 42 to be detected and the laser detection component 6.

[0038] like Figures 1 to 11As shown, a slide rod 47 is fixed at both ends inside the assembly seat 4, and a slide sleeve 46 is sleeved on the outside of the slide rod 47. The slide sleeve 46 is fixed to both ends of one side of the assembly disk 41, and one end of the slide sleeve 46 is fixedly connected to a blocking block 53. The blocking block 53 is placed in the side frame 43 and can slide in the side frame 43. The blocking block 54 can prevent the assembly disk 41 from moving into the assembly seat 4 by blocking the movement of the blocking block 53. A spring 48 is wound around the outside of the slide rod 47, and one end of the spring 48 is fixedly connected to the slide sleeve 46, and the other end of the spring 48 is fixedly connected to the inner wall of the assembly seat 4. A guide rod 45 is fixed to one side of the assembly disk 41, and the guide rod 45 protrudes from one side of the assembly seat 4.

[0039] In the default state, the assembly plate 41 is retracted into the assembly seat 4. When loading the semiconductor component 42 to be tested, the assembly plate 41 is pulled out of the assembly seat 4, and the assembly plate 41 drives the sliding sleeve 46 and the blocking block 53 to move with it. The sliding sleeve 46 slides outside the sliding rod 47 and pulls one end of the spring 48 to extend it.

[0040] The blocking block 1 53 moves toward the position of the blocking block 2 54. After the inclined surface of the blocking block 1 53 contacts the inclined surface of the blocking block 2 54, the blocking block 2 54 is pushed to retract. When the blocking block 1 53 moves to the straight part of the blocking block 2 54, the blocking block 2 54 is reset. The straight part of the blocking block 2 54 contacts the straight part of the blocking block 1 53 tightly. The blocking block 2 54 blocks the blocking block 1 53, preventing the sliding sleeve 1 46 from moving under the elastic force of the spring 2 48 to retract the assembly disk 41 into the assembly seat 4.

[0041] After the inspection of the semiconductor component 42 to be inspected is completed, the blocking block 2 54 retracts and stops blocking the blocking block 1 53. At this time, the elastic force of the spring 2 48 is used to pull the sliding sleeve 1 46 to move, so as to drive the assembly disk 41 to retract into the assembly seat 4, and the semiconductor component 42 to be inspected mounted on the top of the assembly disk 41 is retracted into the assembly seat 4.

[0042] like Figures 1 to 11 As shown, a side block 44 is fixed at one end of the side frame 43, and a blocking block 2 54 is arranged at the end of the side block 44 facing the side frame 43, and the blocking block 2 54 conflicts with the blocking block 1 53. A guide rod 542 is arranged at the top and bottom ends inside the side block 44, and the guide rod 542 is fixed to the top and bottom ends of the back of the blocking block 2 54. A guide groove 543 is provided at the top and bottom ends of the back of the side block 44, and the guide rod 542 is placed in the guide groove 543 and slides in the guide groove 543. A spring 3 541 is fixed inside the side block 44, and the spring 3 541 is located between the guide rods 542, and one end of the spring 3 541 is fixedly connected to the back of the blocking block 2 54.

[0043] When the assembly plate 41 is pulled out from the assembly seat 4, the blocking block 1 53 moves toward the position of the blocking block 2 54. After the inclined surface of the blocking block 1 53 conflicts with the inclined surface of the blocking block 2 54, the blocking block 2 54 is pushed to retract into the side block 44. The blocking block 2 54 pushes the guide rod 542 to slide in the guide groove 543. The guide rod 542 and the guide groove 543 guide the blocking block 2 54. At the same time, the blocking block 2 54 squeezes the spring 3 541 to contract. When the blocking block 1 53 After moving to the straight part of blocking block 2 54, blocking block 2 54 loses the pressure of blocking block 1 53, and spring 3 541 pushes blocking block 2 54 out of side block 44. At this time, blocking block 2 54 is reset, and the straight part of blocking block 2 54 is tightly pressed against the straight part of blocking block 1 53. Blocking block 2 54 blocks blocking block 1 53 to prevent sliding sleeve 1 46 from moving under the elastic force of spring 2 48 so that assembly disk 41 is retracted into assembly seat 4.

[0044] like Figures 1 to 11 As shown, a sliding sleeve 2 55 is fixed to the top and bottom of the side block 44, a sliding rod 2 56 is arranged inside the sliding sleeve 2 55, and the sliding rod 2 56 is fixed to the push block 2 52. Push blocks 2 52 are fixed on both sides of the side block 44, and a push block 1 51 is arranged above the push block 2 52, and the push block 1 51 is fixed to the top rod 5.

[0045] After the inspection of the top semiconductor component 42 to be inspected is completed, the assembly box 3 moves up, so that the push rod 5 is gradually moved into the assembly box 3, and the push block 1 51 fixed on the push rod 5 moves toward the push block 2 52 on the side walls of the side blocks 44 on both sides of the top assembly seat 4 and pushes downward on the top of the push block 2 52, and the inclined surface of the push block 1 51 is used to push the push block 2 52 to move the side block 44 backward, and the side block 44 drives the sliding sleeve 2 55 to slide outside the sliding rod 2 56, and the blocking block 2 54 placed on the side block 44 retracts with the side block 44 and stops blocking the blocking block 1 53, and the elastic force of the spring 2 48 is used to pull the sliding sleeve 1 46 to move, so as to drive the assembly plate 41 to retract into the assembly seat 4, and the semiconductor component 42 to be inspected mounted on the top of the assembly plate 41 is retracted into the assembly seat 4;

[0046] When the assembly box 3 moves upward, the semiconductor component 42 to be inspected that has been inspected at the top is retracted into the assembly seat 4, and the next semiconductor component 42 to be inspected is moved to the top position again for inspection.

[0047] like Figures 1 to 11As shown, a movable rod 552 is provided at the top and bottom ends of the side block 44, one end of the movable rod 552 is fixed with a connecting block 2 551, the connecting block 2 551 is fixed on the sliding sleeve 2 55, the other end of the movable rod 552 is sleeved with a connecting block 3 553 on the outside, the connecting block 3 553 is fixed on the sliding rod 2 56, a spring 4 554 is wound around the outside of the movable rod 552, one end of the spring 4 554 is fixedly connected to the connecting block 2 551, and the other end of the spring 4 554 is fixedly connected to the connecting block 3 553.

[0048] When the push block 1 51 pushes the push block 2 52 to drive the side block 44 to move, the sliding sleeve 2 55 slides outside the sliding rod 2 56, the sliding sleeve 2 55 drives the connecting block 2 551 and the movable rod 552 to move, the movable rod 552 slides in the connecting block 3 553, the connecting block 2 551 squeezes the spring 4 554 to shrink it, when the push block 1 51 finishes pushing the push block 2 52 and moves to the bottom of the push block 2 52, the push block 1 51 gradually loses the pressure on the push block 2 52, the spring 4 554 uses its own elastic force to push the connecting block 2 551 to move, under the action of the spring 4 554, the sliding sleeve 2 55 slides outside the sliding rod 2 56, the side block 44 follows the sliding sleeve 2 55 to move back to the initial position, and the blocking block 2 54 set on the side block 44 is reset;

[0049] It should be noted that the second blocking block 54 plays a blocking role. When the assembly disk 41 is removed from the assembly seat 4 to install the semiconductor component 42 to be tested, the straight portion of the second blocking block 54 is pressed against the straight portion of the first blocking block 53. The second blocking block 54 keeps the assembly disk 41 in the state of being removed from the assembly seat 4 through the first blocking block 53. In this state, the semiconductor component 42 to be tested can be installed and tested.

[0050] Secondly, the retraction of the blocking block 2 54 itself is that the assembly plate 41 is moved out of the assembly seat 4, the inclined surface of the blocking block 1 53 contacts the inclined surface of the blocking block 2 54, and the blocking block 2 54 is pushed into the side block 44 by the inclined surface of the blocking block 1 53, and after the blocking block 1 53 moves from the position of the blocking block 2 54, the blocking block 2 54 is reset, and the straight portion of the blocking block 1 53 contacts the straight portion of the blocking block 1 53 to block the blocking block 1 53;

[0051] Finally, the side block 44 as a whole drives the blocking block 2 54 to move backward, which is achieved by the pushing block 1 51 pushing the pushing block 2 52, so that after the semiconductor component 42 to be inspected is inspected, the inspected semiconductor component 42 to be inspected is moved into the assembly seat 4, and the semiconductor component 42 to be inspected at the next station can be moved to the inspection position again, and the inspected semiconductor component 42 to be inspected will not collide with the laser detection component 6 due to its own upward movement.

[0052] like Figures 1 to 11As shown, a slide rail 62 is provided at the front and rear ends of the laser detection component 6, an electric slider 61 is provided on the slide rail 62, the electric slider 61 is fixed to the front and back of the laser detection component 6, a slide rail 64 is provided on one side of the slide rail 62, the slide rail 64 is installed on one side of the detection box 1, an electric slider 63 is provided on the slide rail 64, and one side of the electric slider 63 is fixedly connected to the slide rail 62.

[0053] The electric slider 61 and the slide rail 62 are used to enable the laser detection component 6 to move horizontally above the semiconductor component 42 to be detected. The electric slider 63 and the slide rail 64 are used to enable the laser detection component 6 to move vertically above the semiconductor component 42 to be detected. The laser detection component 6 moves above the semiconductor component 42 to be detected to detect various parts of the semiconductor component 42 to be detected.

[0054] like Figures 1 to 11 As shown, a box seat 2 is fixed to the bottom of the detection box 1, an assembly table 31 is fixed to the bottom of the assembly box 3, an assembly table 32 is arranged at the bottom of the assembly table 31, and the assembly table 32 is fixed to the bottom end of the inside of the detection box 1, and a telescopic rod 33 is installed at the top end of the inside of the box seat 2, and the top of the telescopic rod 33 protrudes from the bottom end of the inside of the detection box 1 and is fixedly connected to the bottom of the assembly table 32.

[0055] The assembly platform 1 31 at the bottom of the assembly box 3 is installed on the assembly platform 2 32. When the assembly box 3 needs to be moved up, the assembly platform 2 32 is pushed up by the telescopic rod 33 to drive the assembly platform 1 31 to move up, so that the assembly box 3 can be moved up with it.

[0056] like Figures 1 to 11 As shown, connecting blocks 1 34 are fixed on both sides of the top of the second assembly platform 32, and connecting grooves 35 are opened on both sides of the bottom of the first assembly platform 31. The sizes of the connecting block 1 34 and the connecting groove 35 match, and the connecting groove 35 can slide on the outside of the connecting block 1 34.

[0057] Push out multiple assembly trays 41 from the assembly seat 4, and install the semiconductor components 42 to be tested on the assembly trays 41. By aligning the connecting grooves 35 on both sides of the bottom of the assembly platform 1 31 with the connecting blocks 1 34 on both sides of the top of the assembly platform 2 32, and sliding the connecting grooves 35 to the outside of the connecting blocks 1 34, the assembly platform 1 31 and the assembly platform 2 32 can be connected. The assembly box 3 is installed on the assembly platform 2 32 to complete the loading operation of multiple semiconductor components 42 to be tested.

[0058] like Figures 1 to 11As shown, a fixing hole 341 is provided at one end of the connecting block 34, and built-in cavities 342 are provided on both sides of the assembly table 31. The built-in cavity 342 is communicated with the interior of the connecting groove 35, and the position corresponds to the fixing hole 341. A fixing pin 343 is provided in the built-in cavity 342, and the fixing pin 343 can be inserted into the fixing hole 341. A built-in block 344 is provided in the built-in cavity 342, and the built-in block 344 is fixed to the outside of the fixing pin 343. A spring 345 is provided in the built-in cavity 342, and one end of the spring 345 is fixedly connected to the built-in block 344, and the other end of the spring 345 is fixedly connected to the inner wall of the built-in cavity 342.

[0059] When connecting the assembly platform 1 31 with the assembly platform 2 32, first pull the fixing pin 343 out of the connecting groove 35 to prevent the fixing pin 343 from blocking the connecting block 1 34 from sliding into the connecting groove 35. When pulling the fixing pin 343, the built-in block 344 moves with it and squeezes the spring 1 345 in the built-in cavity 342. When the connecting block 1 34 completely slides into the connecting groove 35, the fixing hole 341 and the fixing pin 343 are aligned. Release the pulled fixing pin 343, and the spring 1 345 drives the fixing pin 343 to be inserted into the fixing hole 341 by pushing the built-in block 344, thereby fixing the connection between the connecting block 1 34 and the connecting groove 35. In this way, the connection between the assembly platform 1 31 and the assembly platform 2 32 can be completed, so that the assembly box 3 can be loaded into the equipment for warpage detection.

[0060] By loading multiple semiconductor components 42 to be inspected at one time, the equipment can inspect multiple semiconductor components 42 to be inspected during inspection, without repeatedly clamping the semiconductor components 42 to be inspected. During the inspection process, the next batch of semiconductor components 42 to be inspected can be loaded. After the inspection is completed, the assembly box 3 loaded with the semiconductor components 42 to be inspected can be directly loaded into the equipment, which saves a lot of time and improves the inspection efficiency.

[0061] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A warpage laser detection device for semiconductor components, characterized in that: The device comprises: a testing box (1), an assembly box (3) is arranged inside the testing box (1), an assembly seat (4) is arranged inside the assembly box (3), an assembly tray (41) is arranged on one side of the assembly seat (4), a vacuum adsorption component (7) is arranged at the bottom of the assembly tray (41), a semiconductor component (42) to be tested is arranged on the top of the assembly tray (41), a laser detection component (6) is arranged on one side inside the testing box (1), the laser detection component (6) is located above the semiconductor component (42) to be tested, side frames (43) are fixed at both ends of the assembly seat (4), a blocking block 1 (53) is arranged inside the side frame (43), a blocking block 2 (54) is arranged on one side of the blocking block 1 (53), and push rods (5) are arranged on both ends of one side of the top of the assembly box (3).

2. The warpage laser detection device for semiconductor components according to claim 1, characterized in that: A slide bar (47) is fixed at both ends of the interior of the assembly seat (4), a slide sleeve (46) is sleeved on the exterior of the slide bar (47), the slide sleeve (46) is fixed to both ends of one side of the assembly plate (41), one end of the slide sleeve (46) is fixedly connected to a blocking block (53), the blocking block (53) is placed in the side frame (43) and can slide in the side frame (43), the blocking block (54) can prevent the assembly plate (41) from moving into the assembly seat (4) by blocking the movement of the blocking block (53), a spring (48) is wound around the exterior of the slide bar (47), one end of the spring (48) is fixedly connected to the slide sleeve (46), the other end of the spring (48) is fixedly connected to the inner wall of the assembly seat (4), a guide rod (45) is fixed to one side of the assembly plate (41), and the guide rod (45) protrudes from one side of the assembly seat (4).

3. The warpage laser detection device for semiconductor components according to claim 2, characterized in that: A side block (44) is fixed to one end of the side frame (43), and a second blocking block (54) is arranged at the end of the side block (44) facing the side frame (43), and the second blocking block (54) is in conflict with the first blocking block (53). A guide rod (542) is arranged at the top and bottom ends of the inside of the side block (44), and the guide rod (542) is fixed to the top and bottom ends of the back of the second blocking block (54), and a guide groove (543) is provided at the top and bottom ends of the back of the side block (44), and the guide rod (542) is placed in the guide groove (543) and slides in the guide groove (543). A third spring (541) is fixed to the inside of the side block (44), and the third spring (541) is located between the guide rods (542), and one end of the third spring (541) is fixedly connected to the back of the second blocking block (54).

4. The warpage laser detection device for semiconductor components according to claim 3, characterized in that: A second sliding sleeve (55) is fixed at the top and bottom of the side block (44), a second sliding rod (56) is arranged inside the second sliding sleeve (55), the second sliding rod (56) is fixed on the second pushing block (52), the second pushing block (52) is fixed on both sides of the side block (44), a first pushing block (51) is arranged above the second pushing block (52), and the first pushing block (51) is fixed on the top rod (5).

5. The warpage laser detection device for semiconductor components according to claim 4, characterized in that: A movable rod (552) is arranged at the top and bottom ends of the side block (44), one end of the movable rod (552) is fixed with a second connecting block (551), the second connecting block (551) is fixed on the second sliding sleeve (55), the other end of the movable rod (552) is sleeved with a third connecting block (553), the third connecting block (553) is fixed on the second sliding rod (56), a fourth spring (554) is wound around the outside of the movable rod (552), one end of the fourth spring (554) is fixedly connected to the second connecting block (551), and the other end of the fourth spring (554) is fixedly connected to the third connecting block (553).

6. The warpage laser detection device for semiconductor components according to claim 5, characterized in that: The assembly seat (4) is installed inside the assembly box (3) from bottom to top, and the laser detection component (6) is located above the uppermost assembly plate (41).

7. The warpage laser detection device for semiconductor components according to claim 6, characterized in that: A slide rail 1 (62) is provided at the front and rear ends of the laser detection component (6), an electric slider 1 (61) is provided on the slide rail 1 (62), the electric slider 1 (61) is fixed to the front and back of the laser detection component (6), a slide rail 2 (64) is provided on one side of the slide rail 1 (62), the slide rail 2 (64) is installed on one side of the detection box (1), an electric slider 2 (63) is provided on the slide rail 2 (64), and one side of the electric slider 2 (63) is fixedly connected to the slide rail 1 (62).

8. The warpage laser detection device for semiconductor components according to claim 7, characterized in that: A box seat (2) is fixed at the bottom of the detection box (1), an assembly platform (31) is fixed at the bottom of the assembly box (3), an assembly platform (32) is arranged at the bottom of the assembly platform (31), the assembly platform (32) is fixed to the bottom end of the inside of the detection box (1), a telescopic rod (33) is installed at the top end of the inside of the box seat (2), the top of the telescopic rod (33) protrudes from the bottom end of the inside of the detection box (1) and is fixedly connected to the bottom of the assembly platform (32).

9. The warpage laser detection device for semiconductor components according to claim 8, characterized in that: Connecting blocks (34) are fixed on both sides of the top of the second assembly platform (32), and connecting grooves (35) are opened on both sides of the bottom of the first assembly platform (31). The sizes of the connecting block (34) and the connecting groove (35) match each other, and the connecting groove (35) can slide on the outside of the connecting block (34).

10. The warpage laser detection device for semiconductor components according to claim 9, characterized in that: A fixing hole (341) is provided at one end of the connection block (34), and built-in cavities (342) are provided on both sides of the assembly platform (31). The built-in cavity (342) is connected to the interior of the connection groove (35) and its position corresponds to the fixing hole (341). A fixing pin (343) is provided in the built-in cavity (342), and the fixing pin (343) can be inserted into the fixing hole (341). A built-in block (344) is provided in the built-in cavity (342), and the built-in block (344) is fixed to the outside of the fixing pin (343). A spring (345) is provided in the built-in cavity (342), and one end of the spring (345) is fixedly connected to the built-in block (344), and the other end of the spring (345) is fixedly connected to the inner wall of the built-in cavity (342).

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