Assembled acoustic array device based on printed circuit board and use method thereof
By using a liftable bracket and an angle controller in the acoustic array device to adjust the height and angle of the acoustic array, combined with a signal amplification circuit and power supply plug, the problems of bulky equipment and low imaging resolution in the prior art are solved, and the correct implementation is achieved. Efficient identification and accurate measurement of complex sound sources.
Patent Information
- Application Number
- CN202411453560.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-17
- Publication Date
- 2025-01-07
AI Technical Summary
During the signal acquisition process, existing acoustic array devices have problems such as bulky equipment, cumbersome line connections, inconvenient array movement and reduced imaging resolution. They are especially prone to damage when moving in a narrow space, and cannot effectively adjust the distance between the acoustic sensor and the measuring component. and angle affect the accuracy of the measurement results.
Using an assembled acoustic array device based on a printed circuit board, the height and angle of the acoustic array bracket are adjusted through a liftable bracket and an angle controller, and combined with a signal amplification circuit and power supply plug to ensure that the relative coordinates of the acoustic sensor are fixed, realizing the concentration of signal output. and adjust the number of array channels and diameter through pluggable signal output plugs.
It realizes the optimal position or all-round acquisition of complex sound sources, improves the recognition ability at different distances and angles, simplifies the assembly and disassembly of arrays, reduces the probability of line connection errors, and improves the accuracy of measurement and efficiency.
Smart Images

Figure CN119270202A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of sound signal acquisition, and in particular to an assembled sound array device based on a printed circuit board and a use method thereof. Background Art
[0002] Noise source imaging technology based on acoustic sensor arrays is widely used in the location of noise sources in transportation vehicles such as airplanes, cars, high-speed trains and their parts and accessories. During the signal acquisition process, the sound source signal must be amplified first. At present, a separate signal amplification device is generally used. If the number of array channels is large, several amplification devices need to be equipped. The equipment is relatively bulky and the lines need to be reconnected when changing the experimental site. It is cumbersome to use and prone to line connection errors. On the other hand, with the continuous improvement of the requirements for measurement results, the number of array channels and array apertures are also increasing. The size of the integrated array is large, and it is easy to damage the array when moving in a small measurement space. If a folded array or a variable-aperture array is used, the relative coordinates of the array elements may change when the array is unfolded, which affects the accuracy of the measurement results. The array elements are distributed in the array plane and are at a certain distance from the measurement component. The sound pressure distribution on the surface of the measurement component or several planes near the measurement component is generally achieved through an algorithm. After exceeding a certain distance, it is greatly interfered by noise. Simply relying on the algorithm to change the observation plane will cause the imaging resolution to decrease. Therefore, the array element installation surface itself should have a certain adjustment ability to control the distance and angle between the acoustic sensor and the measurement component to meet the measurement requirements of unknown complex sound sources. Summary of the invention
[0003] The purpose of the present invention is to provide an assembled sound array device based on a printed circuit board and a method for using the same, which can achieve the optimal position or all-round collection of sound source signals by adjusting the height of the sound array bracket and the angle of the array element mounting surface, thereby improving the ability to identify complex sound sources at different distances and angles.
[0004] According to one object of the present invention, the present invention provides an assembled acoustic array device based on a printed circuit board, comprising a circuit board element mounting surface, an array support surface and an acoustic array bracket, wherein the circuit board element mounting surface is fixed to the upper surface of the array support surface, the array support surface and the acoustic array bracket are hingedly connected, the acoustic array bracket is a liftable bracket, an angle controller is provided between the circuit board element mounting surface and the acoustic array bracket, and the acoustic array bracket is used for array movement, positioning, and adjusting the height and angle of the circuit board element mounting surface; an acoustic sensor, a signal output plug, a signal amplifying circuit and a power supply plug are installed in the circuit board element mounting surface, the acoustic sensor is welded on the coordinates corresponding to the circuit board element mounting surface, ensuring that the relative coordinates between the array elements are fixed, the signal collected by the acoustic sensor is output by the signal output plug, the acoustic sensor is connected to the signal amplifying circuit, and the acoustic sensor and the signal amplifying circuit are powered by the power supply plug.
[0005] Furthermore, the sound array support includes a crossbeam, a main longitudinal beam of the support and a secondary longitudinal beam of the support. A slot is opened in the middle of the crossbeam, the bottom end of the main longitudinal beam of the support is inserted into the slot, and the secondary longitudinal beam of the support is mounted on the upper part of the main longitudinal beam of the support.
[0006] Furthermore, universal rollers and liftable fixed feet are respectively installed on both sides of the crossbeam.
[0007] Furthermore, a height adjustment through hole is provided on the side wall of the main longitudinal beam of the support, and an adjustable control bolt is provided at the bottom of the secondary longitudinal beam of the support.
[0008] Furthermore, the end of the angle controller is hinged to the array support surface via a hinge shaft, an angle adjustment through hole is provided in the middle of the angle controller, and the adjustable control bolt passes through the angle adjustment through hole and is slidably connected to the angle controller.
[0009] Furthermore, the upper ends of the two support secondary longitudinal beams are respectively hingedly connected to connecting beams, and the upper parts of the connecting beams are connected to the array support surface through a plurality of hinges.
[0010] Furthermore, a plurality of circuit board support beams are provided on the array support surface, and the array support surface is connected to the circuit board array element mounting surface via quick-release bolts.
[0011] Furthermore, a signal output plug is provided on the back side of the array element mounting surface of the circuit board, and the signal output plug is connected to a signal acquisition device via a signal acquisition circuit, and the signal output plug is connected to the signal acquisition circuit in a pluggable manner.
[0012] Furthermore, the acoustic sensor is arranged in a manner of matching an odd number of spiral lines with a number of circles within the aperture of the circuit board array element mounting surface.
[0013] According to another object of the present invention, the present invention provides a method for using the above-mentioned assembled acoustic array device based on a printed circuit board, comprising the following steps:
[0014] S1, adjusting the tilt angle of the acoustic array bracket by the angle controller, the rotation angle adjustment range is 0-90°, and reading the angle value;
[0015] S2, adjusting the height of the acoustic array bracket by the bracket secondary longitudinal beam, the height adjustment range is 0-0.5 meters, and reading the height value;
[0016] S3, locking the final state of the angle and height of the acoustic array bracket by means of the adjustable control bolt;
[0017] S4, adjusting the number of channels and array aperture during signal acquisition through the signal output plug:
[0018] S401, for acoustic measurement of large components or high resolution requirements, all channels in the signal output plug can be connected to the signal acquisition system, and the number of channels and array aperture reach the designed maximum value;
[0019] S402, for acoustic measurements of small components or those with low resolution requirements, some channels in the signal output plug are connected to the signal acquisition system, and the order of disconnecting the channels is descending from the largest number, that is, disconnecting starts from the peripheral array elements in the acoustic array layout. As the number of channels decreases, the array aperture gradually becomes smaller, and the channels are disconnected in a coordinated manner between the A, B, C, and D areas of the circuit board array element mounting surface until the array aperture and the number of channels meet the acoustic measurement requirements.
[0020] The technical solution of the present invention achieves the best position or all-round collection of sound source signals by adjusting the height of the sound array bracket and the angle of the array element installation surface, and cooperates with the beamforming algorithm to improve the ability to identify complex sound sources at different distances and angles. The circuit board array element installation surface can be welded with the sound sensor and the signal amplification circuit according to the optimal layout of the array element, ensuring that the relative coordinates between the sound sensors are fixed, and the signal output plugs are concentrated in the edge area on the back of the circuit board without affecting signal collection; the circuit board array element installation surface can be freely set in size under the premise of meeting the overall optimal layout of the array elements, and can be manufactured in different areas, which can meet the needs of rapid assembly and disassembly, and overcome the shortcomings of the integrated array being relatively bulky and inconvenient to move. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;
[0023] Figure 2 This is a schematic structural diagram of area C of the array element mounting surface of a circuit board according to an embodiment of the present invention;
[0024] Figure 3 is a circuit diagram of a signal amplifying circuit according to an embodiment of the present invention;
[0025] Figure 4 is a simulation result diagram of the signal amplification circuit according to an embodiment of the present invention;
[0026] Figure 5 This is a schematic diagram of the measurement structure of the array element installation surface at the highest position 0° according to an embodiment of the present invention;
[0027] Figure 6 This is a schematic diagram of the measurement structure of the array element installation surface at the highest position 90° according to an embodiment of the present invention;
[0028] Figure 7 This is a schematic diagram of the measurement structure of the array element installation surface at the lowest position 0° according to an embodiment of the present invention;
[0029] Figure 8 This is a schematic diagram of the measurement structure of the array element installation surface at the lowest position of 90° according to an embodiment of the present invention;
[0030] Fig. 9 This is a schematic diagram of the structure of an angle controller according to an embodiment of the present invention;
[0031] Fig.10 This is a schematic diagram of the structure of the auxiliary fixing mechanism according to an embodiment of the present invention;
[0032] Fig.11 This is a schematic diagram of the structure of the universal roller and the liftable fixed foot according to an embodiment of the present invention;
[0033] In the figure: 1-circuit board array element mounting surface, 2-acoustic array bracket, 3-A zone mounting position, 4-B zone mounting position, 5-C zone mounting position, 6-D zone mounting position, 7-fixing bolt, 8-acoustic sensor, 9-signal output plug, 10-signal amplification circuit, 11-power supply plug, 12-crossbeam, 13-slot hole, 14-universal roller, 15-liftable fixed foot, 16-bracket main longitudinal beam, 17-angle controller, 18-hinge shaft, 19-angle adjustment through hole, 20-height adjustment through hole, 21-adjustable control bolt, 22-bracket secondary longitudinal beam, 23-fixing bolt, 24-height angle indicator, 25-connecting beam, 26-hinge, 27-array support surface, 28-circuit board support beam. DETAILED DESCRIPTION
[0034] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0036] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0037] Example 1
[0038] like Figure 1-Figure 11 As shown, an assembled acoustic array device based on a printed circuit board mainly comprises two parts in structure, namely, a circuit board array element mounting surface 1 and an acoustic array bracket 2. A signal amplifying circuit 10 and array element layout design are performed on the circuit board array element mounting surface 1.
[0039] The bottom of the sound array bracket 2 is placed on the ground through two cross beams 12. A slot 13 is opened in the middle of the cross beam 12. Universal rollers 14 and liftable fixed feet 15 are respectively installed on both sides of the cross beam 12. The universal rollers 14 are used to move the array on the ground. After moving to the designated location, the sound array is fixed by the liftable fixed feet 15.
[0040] The acoustic array support 2 includes a support main longitudinal beam 16 , the lower end of which is inserted into the slot 13 for fixation and can be quickly assembled and disassembled.
[0041] like Figure 1 and Fig. 9 As shown, an angle controller 17 is installed in the middle of the main longitudinal beam 16 of the bracket, and a rotation angle indication scale is marked on the angle controller 17. The end of the angle controller 17 is hinged to the array support surface 27 through a hinge shaft 18. An angle adjustment through hole 19 is opened in the middle of the angle controller 17. The angle adjustment through hole 19 slides on the adjustable control bolt 21, thereby driving the array support surface 27 to rotate. The rotation angle range is 0-90°, and the rotation angle is indicated by the height angle indicator 24. After rotating to the specified position, tighten the adjustable control bolt 21 for positioning.
[0042] The upper part of the bracket main longitudinal beam 16 is fitted with a bracket sub-longitudinal beam 22, and the bracket main longitudinal beam 16 is provided with a height adjustment through hole 20, and an adjustable control bolt 21 is set at the bottom of the bracket sub-longitudinal beam 22, and the bracket sub-longitudinal beam 22 can slide up and down in the height adjustment through hole 20 with the bracket sub-longitudinal beam 22, and the bracket sub-longitudinal beam 22 is fixed to the bracket main longitudinal beam 16 by the adjustable control bolt 21. By sliding the bracket sub-longitudinal beam 22 in the bracket main longitudinal beam 16, the height of the array support surface 27 at different measurement angles is adjusted to obtain the best imaging effect. After the height is adjusted to the specified position, it is positioned by the adjustable control bolt 21. The height angle indicator 24 indicates the array height in real time. The sliding stroke range of the bracket sub-longitudinal beam 22 is 0-0.5 meters, and any height adjustment can be performed based on any angle of the angle controller 17.
[0043] like Fig.10As shown, the connecting beam 25 at the upper end of the bracket sub-longitudinal beam 22 is connected to the array support surface 27 through three hinges 26. The connecting beam 25 and the bracket sub-longitudinal beam 22 are hingedly connected by fixing bolts 23. The hinge 26 serves as the rotation axis of the array support surface 27 and is used in conjunction with the angle controller 17. The rotation angle of the hinge 26 is 0°-90°. The three hinges 26 are all connected by quick-release bolts for quick disassembly and assembly of the array support surface 27.
[0044] The acoustic array bracket 2 of the present invention is used for array movement, positioning, and adjusting the height and angle of the array element installation surface. The acoustic array bracket 2 includes a crossbeam 12, a bracket main longitudinal beam 16, and a bracket secondary longitudinal beam 22. The crossbeam 12 is equipped with a liftable fixed foot 15 and four universal rollers 14. The universal rollers 14 are used for array movement, and the liftable fixed foot 15 is used for array position fixing. The bracket main longitudinal beam 16 is installed in the slot 13 of the crossbeam 12, which can be quickly disassembled and assembled. The bracket main longitudinal beam 16 is installed with an angle controller 17 for adjusting the angle of the array support surface 27. The bracket secondary longitudinal beam 22 is sleeved on the internal slideway of the bracket main longitudinal beam 16, and can slide upward with a sliding range of 0-0.5m. The height of the array support surface 27 can be adjusted, and the height and angle values are indicated by the height angle indicator 24, and fixed by the adjustable control bolt 21. The array support surface 27 is connected to the circuit board array element installation surface 1 through a fixing bolt, and the circuit board array element installation surface 1 is driven to move by the lifting and rotation of the array support surface 27. The inclination angle of the array support surface 27 is adjusted by the angle controller 17 , the height of the array support surface 27 is adjusted by sliding the bracket secondary longitudinal beam 16 up and down, and the angle and height are fixed by the adjustable control bolts 21 .
[0045] The array support surface 27 is a mounting platform for the circuit board array element mounting surface 1. The position of the circuit board support beam 28 can be set according to the number of splits of the circuit board array element mounting surface 1. A number of bolt mounting holes are set on the outer end frame of the array support surface 27. The circuit board array element mounting surface 1 is connected by quick-release bolts to facilitate the rapid disassembly and assembly of the circuit board array element mounting surface 1. The signal output plug 9 on the back of the circuit board array element mounting surface 1 is connected to the signal acquisition device via the signal acquisition line.
[0046] The acoustic sensor 8 is arranged in an odd number of spiral lines and a plurality of circles in the aperture of the circuit board array element mounting surface 1. In the present invention, the origin is located at the center of the acoustic array, the odd number of spiral lines is selected as 7, and the array is divided into four areas A, B, C, and D with the origin as the common vertex, and is respectively installed in the mounting position 3 of the A area, the mounting position 4 of the B area, the mounting position 5 of the C area, and the mounting position 6 of the D area. The number of array elements included is 17, 15, 16, and 16, and a printed circuit board is manufactured for each area separately, and then assembled into a whole.
[0047] like Figure 2As shown, the array element installation surface of the circuit board in area C is shown, where the acoustic sensor 8, signal output plug 9, signal amplification circuit 10 and power supply plug 11 are installed. The acoustic sensor 8 is welded on the corresponding coordinates of the circuit board, and the relative coordinates are fixed. The signal collected by the acoustic sensor 8 is output by the signal output plug 9, and the signal output plug 9 is connected to the signal collection line in a pluggable manner to transmit the signal to the signal collection device. The number of accesses to the acoustic sensor 8 can be controlled by the signal output plug 9 according to the needs of the project, and the number of array channels and the array caliber can be adjusted.
[0048] like Figure 3 and Figure 4 As shown, the design scheme and simulation results of the signal amplification circuit 10 are given. The circuit uses an integrated single-power instrumentation amplifier AD623 for amplification. For a given sine wave signal with an input amplitude of 1, the signal amplification gain is between 28.3-34dB in the range of 100Hz-10kHz. This frequency range basically covers the common frequency distribution of acoustic measurement, and the signal amplification result meets the measurement requirements.
[0049] The four regions A, B, C, and D in the circuit board array element mounting surface 1 are respectively mounted on the mounting surface of the array bracket 2 by fixing bolts 7. The fixing bolts 7 are quick-release bolts, which are convenient for quick disassembly and assembly of the equipment after changing the experimental site. The acoustic sensors 8 and signal amplification circuits 10 in the four regions A, B, C, and D are uniformly powered by the power supply plug 11. Each region is connected in series, and the power supply voltage is 5V.
[0050] The array element mounting surface 1 of the circuit board of the present invention serves as a carrier of the acoustic sensor and the signal amplification circuit, and can be designed as a whole according to the engineering requirements, and then divided into different areas. The present invention takes four zones, including 63 signal acquisition channels, as an example, that is, the overall design is carried out according to the four zones A, B, C, and D. The 63 channels are laid out according to a 7-arm spiral line, and the origin is located at the center of the combination of the four zones. The number of array elements falling into each zone is: 17 in zone A, 15 in zone B, 16 in zone C, and 16 in zone D. The corners of each zone are connected to the array support surface 27 by fixing bolts 7, so that the circuit board can be quickly disassembled and assembled. The position of each array element is fixed on the array element mounting surface 1 of the circuit board, and each zone is fixed to the bracket support surface 27 by fixing bolts 7, and the relative coordinates between the array elements are fixed. All channels are laid out as a whole, and the partition design and production meet the needs of rapid disassembly and assembly, and the relative coordinates of each array element are fixed.
[0051] The array element layout design of the present invention: the array elements adopt an odd number of spiral arrays and a plurality of circular arrays in a layout mode on the array support surface 27, ensuring that the area between every two adjacent circles is equally divided according to the number of odd number of array elements inside them, and the present invention is designed according to the number of odd number of array elements being equal to 7. The array elements adopt an odd number of spiral linear arrays and a plurality of circular arrays in a layout mode, and the area between every two adjacent circles is equally divided according to the number of odd number of array elements inside them.
[0052] The signal amplification circuit design of the present invention: the signal acquisition circuit design is performed for each zone array element respectively, and the circuit includes a signal amplification function. A circuit power supply plug 11 is set in each zone to power all channel lines in the zone. The collected signals are summarized in the signal output plug 9, which is convenient for output to the signal acquisition device, and can effectively avoid line connection errors. The number of signal acquisition channels is controlled by the signal output plug 9 to achieve array aperture adjustment to meet actual measurement needs. The signal amplification circuit 10 and the acoustic sensor 8 are welded on the circuit board, which gets rid of the device's dependence on the signal amplifier. The number of signal acquisition channels is controlled by the signal output plug 9 to achieve array channel number and array aperture adjustment.
[0053] In the embodiment of the present invention, the acoustic array device can be disassembled and assembled according to actual needs, and the disassembly and assembly involves five positions, namely:
[0054] (1) The cross beam 12 and the main longitudinal beam 16 of the bracket adopt a plug-in design, which can realize the disassembly and assembly of the cross beam 12 and the main longitudinal beam 16;
[0055] (2) The adjustable control bolt 21 can realize the disassembly and assembly of the angle controller 17 and the main longitudinal beam 16 of the bracket;
[0056] (3) The adjustable control bolt 21 can realize the disassembly and assembly of the bracket secondary longitudinal beam 22 and the bracket main longitudinal beam 16;
[0057] (4) The three hinges 26 and the connecting beam 25 are all equipped with quick-release bolts, which can realize the disassembly and assembly of the array support surface 27 and the connecting beam 25;
[0058] (5) The circuit board array element mounting surface 1 and the array support surface 27 are connected by quick-release bolts, so that the circuit board array element mounting surface 1 can be disassembled and assembled in various areas.
[0059] In the embodiment of the present invention, the angle and height adjustment during the signal acquisition process are as follows: Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown:
[0060] (1) By sliding the angle controller 17 on the adjustable control bolt 21, the hinge shaft at the end of the angle adjustment through hole 19 drives the array support surface 27 to rotate with the hinge 26 as the rotation axis, with a rotation range of 0-90°, and the angle value is read through the angle indication in the height angle indicator 24;
[0061] (2) The secondary longitudinal beam 22 of the support slides up and down in the main longitudinal beam 16 of the support, driving the array support surface 27 to move up and down, so as to adjust the acoustic array measurement height, with an adjustment range of 0-0.5 meters, and read the height value through the height indication in the height angle indicator 24;
[0062] (3) The height adjustment and the angle adjustment do not affect each other. The height adjustment can be performed first and then the angle adjustment, or the angle adjustment can be performed first and then the height adjustment. The final state of the angle and height can be locked by the adjustable control bolt 21.
[0063] In the embodiment of the present invention, the number of channels and array aperture are adjusted during signal acquisition:
[0064] (1) For acoustic measurements of large components or those with high resolution requirements, all channels in the signal output plug 9 can be connected to the signal acquisition system. At this time, the number of channels and the array aperture reach the maximum design value;
[0065] (2) For acoustic measurements of small components or those with low resolution requirements, some channels in the signal output plug 9 are connected to the signal acquisition system. The order of disconnecting the channels is descending from the largest number, that is, disconnecting from the peripheral array elements in the acoustic array layout. As the number of channels decreases, the array aperture gradually becomes smaller. The channels are disconnected in a coordinated manner between the A, B, C, and D areas on the array element mounting surface 1 of the circuit board until the array aperture and the number of channels meet the acoustic measurement requirements.
[0066] The array element mounting surface of the circuit board of the present invention mainly solves two problems: first, as a mounting carrier for the acoustic sensor, the signal amplifying circuit, the signal output plug and the fixing hole, the acoustic sensor 8 can be installed on the mounting surface according to the optimal layout of the array element, and the signal amplifying circuit 10 can be designed. Since the acoustic sensor 8 is fixed on the circuit board, the relative coordinates between the sensors will not change, and the signal output plug 9 is concentrated in the edge area of the back side of the circuit board, which does not affect the signal collection; second, the size of the circuit board can be freely set under the premise of meeting the overall optimal layout of the array elements, and it can be manufactured in different areas and equipped with quick-release bolts, which can meet the needs of fast assembly and disassembly, and overcome the shortcomings of the integrated array being relatively bulky and inconvenient to move.
[0067] The array element distribution of the present invention adopts a layout mode of coordinating an odd number of spiral arrays with a number of circular arrays, which realizes spatial uniform sampling, ensures the array's ability to distinguish the spatial distribution of sound sources, has a certain inhibitory effect on sound energy in non-sound source directions, reduces the interference of side lobes on imaging results, and improves the spatial anti-aliasing capability, and significantly enhances the array directivity.
[0068] The signal amplification circuit design of the present invention meets the requirements of integration, can get rid of the array's dependence on the signal amplifier, reduce the complexity of equipment installation and the probability of line connection errors, and improve experimental efficiency. The gain of the signal after passing through the signal amplification circuit is 28.3-34dB in the range of 100Hz-10kHz for each channel, and this frequency range covers the measurement range of common sound sources. In addition, the number of channels can be changed through the signal output plug, which plays a role in adjusting the array aperture. The number of channels can be appropriately increased for complex sound sources or larger components, and the number of channels can be appropriately reduced for simple sound sources or measurements with low resolution requirements, so that one set of arrays can meet multiple measurement requirements.
[0069] The acoustic array bracket 2 of the present invention adjusts the inclination and height of the circuit board array element surface by sliding up and down through the angle controller 17 and the bracket sub-longitudinal beam 22, so that the array can adapt to the measurement of complex sound sources. For the same accessory, the sound source distribution will change under different working conditions. In the existing methods, it is relatively cumbersome to move the array, and the calculation of different planes or angles by algorithms may cause the imaging resolution to deteriorate. The array itself has the ability to adjust the height and angle according to the actual measurement object. The device can maximize the all-round measurement of unknown sound sources, effectively overcoming the defects of existing measurement methods.
[0070] The present invention installs the array element on the printed circuit board to solve the problem that the integrated array is relatively bulky during movement. The array element installation surface and the acoustic array bracket base can be quickly assembled and disassembled, and the number of divisions of the array element installation surface can be designed according to actual needs.
[0071] The array element distribution, array aperture, number of array elements, etc. of the present invention will affect the measurement results. Under the premise of meeting the optimal layout of the array elements, the acoustic array is designed with pluggable connectors to adjust the number of array elements during the measurement process. The same set of devices can quickly realize the changes in array aperture and number of array elements according to different measurement objects, meeting the needs of engineering measurement.
[0072] The present invention improves the convenience of array movement for different acoustic measurement experiments, eliminates the change of relative coordinates of array elements caused by different test sites or due to the movement of the acoustic array, reduces the measurement error caused by position change, and improves the reliability and accuracy of acoustic imaging.
[0073] The present invention gets rid of the limitation of the acoustic array on the external amplifier, integrates the signal prevention function into the signal acquisition circuit, improves the signal-to-noise ratio in the measurement process, and reduces the probability of line connection errors that may occur in the process of connecting the array element to the amplifier.
[0074] The present invention realizes omnidirectional collection of sound source signals by adjusting the height of the sound array bracket and the angle of the array element installation surface, and cooperates with the beamforming algorithm to improve the recognition ability of complex sound sources at different distances and angles.
[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An assembled acoustic array device based on a printed circuit board, characterized in that: It includes a circuit board array element mounting surface, an array support surface and an acoustic array bracket, the circuit board array element mounting surface is fixed to the upper surface of the array support surface, the array support surface and the acoustic array bracket are hingedly connected, the acoustic array bracket is a liftable bracket, an angle controller is provided between the circuit board array element mounting surface and the acoustic array bracket, the acoustic array bracket is used for array movement, positioning, and adjusting the height and angle of the circuit board array element mounting surface; an acoustic sensor, a signal output plug, a signal amplifying circuit and a power supply plug are installed in the circuit board array element mounting surface, the acoustic sensor is welded on the coordinates corresponding to the circuit board array element mounting surface to ensure that the relative coordinates between the acoustic sensors are fixed, the signal collected by the acoustic sensor is output by the signal output plug, the acoustic sensor and the signal amplifying circuit are connected, and the acoustic sensor and the signal amplifying circuit are powered by the power supply plug.
2. The assembled acoustic array device based on a printed circuit board according to claim 1, characterized in that: The acoustic array support comprises a crossbeam, a main longitudinal beam and a secondary longitudinal beam. A slot is opened in the middle of the crossbeam, the bottom end of the main longitudinal beam is inserted into the slot, and the secondary longitudinal beam is sleeved on the upper part of the main longitudinal beam.
3. The assembled acoustic array device based on a printed circuit board according to claim 2, characterized in that: Universal rollers and liftable fixed feet are respectively installed on both sides of the crossbeam.
4. The assembled acoustic array device based on a printed circuit board according to claim 2, characterized in that: A height adjustment through hole is arranged on the side wall of the main longitudinal beam of the support, and an adjustable control bolt is arranged on the bottom of the secondary longitudinal beam of the support.
5. The assembled acoustic array device based on a printed circuit board according to claim 4, characterized in that: The end of the angle controller is hinged to the array support surface via a hinge shaft, an angle adjustment through hole is provided in the middle of the angle controller, and the adjustable control bolt passes through the angle adjustment through hole and is slidably connected to the angle controller.
6. The assembled acoustic array device based on a printed circuit board according to claim 5, characterized in that: The upper ends of the two bracket secondary longitudinal beams are respectively hingedly connected to connecting beams, and the upper parts of the connecting beams are connected to the array support surface through a plurality of hinges.
7. The assembled acoustic array device based on a printed circuit board according to claim 1, characterized in that: A plurality of circuit board support beams are arranged on the array support surface, and the array support surface is connected to the circuit board array element mounting surface via quick-release bolts.
8. The assembled acoustic array device based on a printed circuit board according to claim 1, characterized in that: A signal output plug is provided on the back of the circuit board array element installation surface. The signal output plug is connected to a signal acquisition device through a signal acquisition circuit. The signal output plug is connected to the signal acquisition circuit in a pluggable manner.
9. The assembled acoustic array device based on a printed circuit board according to claim 1, characterized in that: The acoustic sensors are arranged in a manner of matching an odd number of spiral lines with a number of circles within the aperture of the circuit board array element mounting surface.
10. The method for using the assembled acoustic array device based on a printed circuit board according to claim 1, characterized in that: The steps include: S1, adjusting the inclination angle of the acoustic array bracket by the angle controller, the angle adjustment range is 0-90°, and reading the angle value; S2, adjusting the height of the acoustic array bracket to achieve acoustic array measurement height adjustment, with an adjustment range of 0-0.5 meters, and reading the height value; S3, locking the final state of the angle and height of the acoustic array bracket; S4, channel number and array aperture adjustment during signal acquisition: S401, for acoustic measurement of large components or high resolution requirements, all channels in the signal output plug can be connected to the signal acquisition system, and the number of channels and array aperture reach the designed maximum value; S402, for acoustic measurements of small components or those with low resolution requirements, some channels in the signal output plug are connected to the signal acquisition system, and the order of disconnecting the channels is descending from the largest number, that is, disconnecting starts from the peripheral array elements in the acoustic array layout. As the number of channels decreases, the array aperture gradually becomes smaller, and the channels are disconnected in a coordinated manner between the A, B, C, and D areas of the circuit board array element mounting surface until the array aperture and the number of channels meet the acoustic measurement requirements.