Multi-layer storage and loading system of front open type wafer transfer box

Abstract

A multi-layer storage and loading system of a front open type wafer conveying box comprises a storage unit and a feeding and discharging unit. The storage unit comprises a shell, a first surface of the shell comprises a feeding and discharging port, and a second surface of the shell comprises a plurality of loading ports; the multi-layer storage mechanism is arranged in the shell and is used for bearing a plurality of front open type wafer conveying boxes; the lifting mechanism is used for axially moving the multi-layer storage mechanism to a plurality of positions; and a plurality of uncovering mechanisms attached to the plurality of loading ports of the second surface. The feeding and discharging unit is arranged on the first surface of the shell and comprises a feeding and discharging platform used for bearing the front-open type wafer conveying box. The code reading mechanism is arranged on one side of the feeding and discharging platform and used for identifying codes on the front opening type conveying box; the driving mechanism is used for driving the feeding and discharging platform. The arrangement position of the feeding and discharging platform corresponds to the feeding and discharging port, and the driving mechanism drives the feeding and discharging platform to enable the front-open type wafer conveying box to be conveyed into and out of the storage unit from the feeding and discharging port through the feeding and discharging platform.

Description

Technical Field

[0001] The invention relates to a storage and loading system for a wafer transport box, in particular to a multi-layer storage and loading system for a front-opening wafer transport box. Background Art

[0002] The integrated circuit manufacturing process involves dozens or even hundreds of different processes on semiconductor wafers, including etching, developing, diffusion, ion implantation, heat treatment, vapor deposition and other processes. When a process is completed, the semiconductor wafer will be transported to the next process for processing. In order to transport semiconductor wafers between these many different process sites, semiconductor manufacturers usually place one or more semiconductor wafers in a front-opening wafer transfer box (FOUP) to protect these semiconductor wafers from dust particles, organic gases, vapors and other pollutants during storage and transportation.

[0003] After semiconductor wafers are placed in a front-loading pod, they are usually transported between various process stations by robotic arms, overhead cranes, and other equipment. After arriving at a process station, the front-loading pod is placed on a loading system to prepare for loading the front-loading pod onto the process equipment at that station for processing.

[0004] The loading system is equipped with a code reading mechanism and a carrying platform, and the front-opening wafer pod is placed on the carrying platform. Before the process starts, the code reading mechanism will start to read the code on the front-opening wafer pod to confirm that the processing batch number or material number is correct. Then, the loading system will transport the front-opening wafer pod to the connection port of the process equipment, and open the front cover of the front-opening wafer pod through the cover opening mechanism, so that the robot arm of the process equipment can pick up or deliver the semiconductor wafer into the process equipment for processing.

[0005] When the semiconductor wafer is processed at the process equipment station, the robot arm will deliver the processed semiconductor wafer back to the front-opening wafer cassette. After all the semiconductor wafers are placed back into the front-opening wafer cassette, the lid is closed, and the front-opening wafer cassette is transported from the loading system to the next process station by the robot arm or the overhead crane. In this process, since the loading system can only place one front-opening wafer cassette at a time and process the semiconductor wafer in the process equipment, when the processing is completed and the next front-opening wafer cassette needs to be replaced, it is necessary to wait for the processed front-opening wafer cassette to be transported to the next process station by the overhead crane before the next front-opening wafer cassette can be transported to the loading system. In this way, the process equipment must be idle and waiting, and cannot operate continuously, affecting production capacity. In other words, when the front-opening wafer pod is fed or unloaded into or out of the process equipment, it is through the same loading system, and this loading system can only load one front-opening wafer pod at a time, which seriously affects the process flow and production capacity. At present, the solution to the conflict between the front-opening wafer pod and the loading system in and out of the material is mostly to install at least two or more loading systems. Summary of the invention

[0006] In view of this, the purpose of the present invention is to provide a multi-layer storage and loading system for front-opening wafer pods. Different from the original loading system, the multi-layer storage and loading system for front-opening wafer pods proposed by the present invention has a storage unit, which includes a multi-layer storage mechanism, and a plurality of front-opening wafer pods can be pre-entered and stored in the multi-layer storage mechanism through an in-and-out unit. This multi-layer storage mechanism can store at least two or more front-opening wafer pods, so when one of the front-opening wafer pods has completed the process, the process equipment can immediately continue to load another front-opening wafer pod and start the process, and the front-opening wafer pod that has completed the process can be returned at the same time, and the front-opening wafer pod is moved out of the storage unit to the in-and-out unit, and then the front-opening wafer pod is transported to the next station by an overhead crane, and then another front-opening wafer pod to be processed is placed.

[0007] Therefore, the multi-layer storage and loading system of the front-opening wafer transfer box proposed in the present invention can separate the loading process and the material in and out process of the front-opening wafer transfer box from the process to avoid conflicts. In other words, through the multi-layer storage mechanism in the storage unit, a plurality of front-opening wafer transfer boxes can be transported and stored in the storage unit in advance, so that the process equipment can continuously load semiconductor wafers without interrupting the supply. At the same time, the front-opening wafer transfer box that has been processed can be temporarily placed in the multi-layer storage mechanism or returned without affecting the loading and supply. The multi-layer storage and loading system of the front-opening wafer transfer box proposed in the present invention can effectively improve the process fluency, and therefore can greatly improve production capacity.

[0008] In order to achieve the above-mentioned purpose, the present invention provides a multi-layer storage and loading system for a front-opening wafer transfer box, including a storage unit and an in-and-out unit. The storage unit includes a shell, a multi-layer storage mechanism, a lifting mechanism and a plurality of cover opening mechanisms. The first surface of the shell has an in-and-out port, and the second surface of the shell includes a plurality of loading ports; the multi-layer storage mechanism is arranged inside the shell to carry a plurality of front-opening wafer transfer boxes; the lifting mechanism is used to axially move the multi-layer storage mechanism to multiple positions; and the plurality of cover opening mechanisms are attached to the plurality of loading ports on the second surface of the shell. The in-and-out unit is arranged on the first surface of the shell, and includes an in-and-out platform, a code reading mechanism and a driving mechanism. The in-and-out platform is used to carry the front-opening wafer transfer box; the code reading mechanism is arranged on one side of the in-and-out platform to identify the code on the front-opening wafer transfer box; the driving mechanism is used to drive the in-and-out platform. Among them, the setting position of the loading and unloading platform corresponds to the loading and unloading port, and the driving mechanism drives the loading and unloading platform so that the front-opening wafer transfer box is transferred from the loading and unloading port into and out of the storage unit through the loading and unloading platform.

[0009] In one embodiment of the present invention, the multi-layer storage mechanism comprises a storage frame, and the storage frame has at least two layers, and can be used to carry at least two front-opening wafer transfer boxes.

[0010] In one embodiment of the present invention, the multi-layer storage mechanism includes a plurality of single-layer platforms that can move independently.

[0011] In one embodiment of the present invention, the lifting mechanism includes a lifting platform disposed at the bottom of the shell.

[0012] In one embodiment of the present invention, the lifting mechanism further includes a plurality of slide rails vertically disposed inside the shell, and the multi-layer storage mechanism is attached to the plurality of slide rails, so that the multi-layer storage mechanism can be axially moved to multiple positions along the slide rails.

[0013] In one embodiment of the present invention, the plurality of cover opening mechanisms include at least two cover opening mechanisms attached to at least two of the plurality of loading ports.

[0014] In one embodiment of the present invention, the number of the plurality of cover opening mechanisms and the number of the plurality of loading ports may be equal or unequal.

[0015] In one embodiment of the present invention, the bottom of the storage unit and the loading and unloading unit further includes a plurality of supporting members and a plurality of multi-directional wheels. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of a common loading system.

[0017] Figure 2 FIG. 1 is a schematic diagram of a multi-layer storage and loading system of a front-opening wafer pod according to an embodiment of the present invention.

[0018] Figure 3 It is a schematic diagram of a material feeding and discharging unit according to an embodiment of the present invention.

[0019] Figure 4 A schematic diagram of a storage frame according to an embodiment of the present invention.

[0020] Explanation of the reference numerals: 10 - a common loading system; 20 - a multi-layer storage and loading system for a front-opening wafer transfer box; 100 - a front-opening wafer transfer box; 200 - a storage unit; 210 - a shell; 211 - a first surface; 212 - a second surface; 213 - an inlet and outlet port; 220 - a multi-layer storage mechanism; 221 - a storage frame; 230 - an opening mechanism; 300 - an inlet and outlet unit; 310 - an inlet and outlet platform; 320 - a coding reading mechanism; 330 - a driving mechanism; 500 - a support member; 600 - a multi-directional wheel. DETAILED DESCRIPTION

[0021] The following will refer to the relevant drawings to illustrate an embodiment of a multi-layer storage and loading system for a front-opening wafer transfer box of the present invention. For the sake of clarity and convenience of the illustration, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, the technical terms used should be interpreted in accordance with the commonly known meanings of those skilled in the art. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols. The terms "including", "comprising", "having", etc. mentioned in the present invention are all open terms, that is, "including but not limited to".

[0022] See also Figure 1, which is a schematic diagram of a common loading system 10. As shown in the figure, a general loading system 10 can only hold one front-opening wafer pod 100. When the unprocessed semiconductor wafer is placed in the front-opening wafer pod 100 and transported by an overhead crane or a robot arm, after the front-opening wafer pod 100 is placed on the loading system 10, the loading system 10 transports the front-opening wafer pod 100 to the process equipment, and then the front cover of the front-opening wafer pod 100 is opened by the cover opening mechanism, and the semiconductor wafer is picked up and delivered by the robot arm into the process equipment for processing. At this time, the front-opening wafer pod 100 will continue to be placed on the loading system 10. After the semiconductor wafers in the front-opening wafer pod 100 are processed, the cover opening mechanism closes the front cover of the front-opening wafer pod 100, and then the loading system 10 transports the front-opening wafer pod 100 to the overhead crane pick-up point, and then the overhead crane transports the front-opening wafer pod 100 to the next process station. It should be noted that the process equipment is in a state of waiting for materials at this time, and must wait until another front-opening wafer pod 100 to be processed is transported to the loading system 10 before it can be fed again to start semiconductor wafer processing. In this way, the capacity utilization rate of the process equipment cannot be improved.

[0023] See also Figures 2 to 4 , which is a schematic diagram of a multi-layer storage and loading system of a front-opening wafer transfer box proposed by the present invention. A multi-layer storage and loading system 20 of a front-opening wafer transfer box of the present invention includes a storage unit 200 and an inlet and outlet unit 300. The storage unit includes a shell 210, a multi-layer storage mechanism 220, a lifting mechanism (not shown in the figure) and a plurality of cover opening mechanisms 230. The first surface 211 of the shell 210 has an inlet and outlet port 213, and the second surface 212 of the shell 210 includes a plurality of loading ports (overlapping with the cover opening mechanism 230 in the figure); the multi-layer storage mechanism 220 is arranged inside the shell 210 to carry a plurality of front-opening wafer transfer boxes 100; the lifting mechanism is used to axially move the multi-layer storage mechanism 220 to multiple positions; the plurality of cover opening mechanisms 230 are attached to the plurality of loading ports on the second surface 212 of the shell 210. The loading and unloading unit 300 is disposed on the first surface 211 of the housing 210, and includes a loading and unloading platform 310, a code reading mechanism 320, and a driving mechanism 330. The loading and unloading platform 310 is used to carry the front-opening wafer pod 100; the code reading mechanism 320 is disposed on one side of the loading and unloading platform 310, and is used to identify the code on the front-opening wafer pod 100; the driving mechanism 330 is used to drive the loading and unloading platform 310. The loading and unloading platform 310 is disposed at a position corresponding to the loading and unloading port 213, and the driving mechanism 330 drives the loading and unloading platform 310, so that the front-opening wafer pod 100 is transported into and out of the storage unit 200 from the loading and unloading port 213 through the loading and unloading platform 310.

[0024] To further explain, in the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention, when a front-opening wafer pod 100 is transported by an overhead crane and placed on the loading and unloading platform 310 of the loading and unloading unit 300, the code reading mechanism 320 will read the code on the front-opening wafer pod 100, and after confirming that the incoming batch number is correct, the driving mechanism 330 of the loading and unloading unit 300 will drive the loading platform 310 to transfer the front-opening wafer pod 100 from the loading and unloading port 213 of the storage unit 200 into the housing 210 of the storage unit 200, and place the front-opening wafer pod 100 in one layer of the multi-layer storage mechanism 220. Then, the driving mechanism 330 moves the loading and unloading platform 310 from the housing 210 back to the waiting position of the loading and unloading unit 300.

[0025] See also Figure 2 and Figure 4 Before the front-opening FOUP 100 is transferred into the storage unit 200, the layer of the multi-layer storage mechanism 220 where the front-opening FOUP 100 is to be stored can be moved to a position corresponding to the material inlet and outlet port 213 by the lifting mechanism in advance, so that the front-opening FOUP 100 can be placed in a preset position. For example, the first front-opening FOUP 100 can be placed on the top layer of the multi-layer storage mechanism 220 first, and then the lifting mechanism moves the multi-layer storage mechanism 220 upwards so that the second layer of the multi-layer storage mechanism 220 is aligned with the material inlet and outlet port 213, and then the material inlet and outlet platform 310 transfers the second front-opening FOUP 100 and places it in the second layer of the multi-layer storage mechanism 220. By analogy, the number of layers of the multi-layer storage mechanism 220 can be adjusted according to actual production needs to cooperate with the automated loading operation.

[0026] In one embodiment, the multi-layer storage mechanism 220 has at least 2 layers, preferably 3 layers, and most preferably 4 layers.

[0027] It should be understood that in order to allow the multi-layer storage mechanism 220 to move axially within the shell 210, the internal space of the shell 210 is sufficient to accommodate approximately twice the number of layers of the multi-layer storage mechanism 220, so that the multi-layer storage mechanism 220 can move axially so that its top and bottom layers can both correspond to the feed and discharge ports 213.

[0028] In addition, the multi-layer storage mechanism 220 can be configured such that each layer moves independently or simultaneously. Figure 4 As shown, in one embodiment, the multi-layer storage mechanism 220 may include Figure 4The storage frame 221 shown has at least two layers and can be used to carry at least two front-opening wafer transport boxes 100. In another embodiment, the multi-layer storage mechanism 220 includes a plurality of single-layer platforms that can be moved independently.

[0029] In one embodiment, the lifting mechanism may be, for example, a lifting platform disposed at the bottom of the shell 210 to support and axially move the multi-layer storage mechanism to multiple positions.

[0030] In another embodiment, the lifting mechanism for axially moving the multi-layer storage mechanism 220 to multiple positions of the present invention further includes a plurality of slide rails (not shown in the figure) vertically arranged inside the housing 210, and the multi-layer storage mechanism 220 is attached to the plurality of slide rails, so that the multi-layer storage mechanism can be axially moved to multiple positions along the slide rails. It should be understood that the purpose of using the slide rails in this embodiment is mainly to allow the multi-layer storage mechanism 220 to slide stably to the set position using the slide rails, so as not to cause vibration, shaking or collision during the movement process, and to ensure that the front-opening wafer transfer box 100 stored in each layer of the multi-layer storage mechanism 220 will not be damaged. Of course, a person skilled in the art of the present invention can achieve the purpose of stably moving the multi-layer storage mechanism 220 and avoiding vibration and shaking by converting this concept with equal technology, which should be included in the scope of protection claimed by the present invention. For example, in another embodiment, the upright side of the storage frame 221 can be attached to the slide rail vertically arranged inside the housing 210 with a pulley, so that the storage frame 221 can be stably moved axially along the slide rail by the lifting mechanism.

[0031] Please refer to Figure 2 The second surface 212 of the storage unit 200 of the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention has a plurality of loading ports (overlapping with the cover opening mechanism 230 in the figure), and a plurality of cover opening mechanisms 230 are attached to these plurality of loading ports. The loading ports are mainly used to dock with the process equipment so that the front-opening wafer pod 100 can be loaded into the process equipment for processing. It should be understood that the cover opening mechanism 230 is used to open the front cover of the front-opening wafer pod 100 before loading the front-opening wafer pod 100 into the process equipment. The setting of each loading port is configured according to the front-opening interface mechanical standard (FIMS) so that various process equipment can receive the front-opening wafer pod 100 and pick up the semiconductor wafers therein for processing, and protect the semiconductor wafers from being contaminated during storage and transportation.

[0032] Since a plurality of front-opening wafer pods 100 can be stored in the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention, a plurality of front-opening wafer pods 100 can be provided to the process equipment for loading and processing at the same time in response to the process requirements. Therefore, the number of the aforementioned opening mechanisms 230 can also be set according to the number of loading ports and the process requirements. In other words, for example, if two front-opening wafer pods 100 need to be opened at the same time, two opening mechanisms 230 can be set. For example Figure 2 As shown in the figure, there are four loading ports. Therefore, if it is necessary to open the covers of four front-opening wafer transfer boxes 100 at the same time, four opening mechanisms 230 can also be set as shown in the figure.

[0033] Furthermore, since the multi-layer storage and loading system 20 of the front-opening wafer transport box of the present invention has a plurality of loading ports, the position and number of the cover opening mechanism 230 can be set according to the actual operation requirements. For example, when there are four loading ports, four cover opening mechanisms 230 can be set at each loading port (such as Figure 2 ), or it can be combined with process equipment, and only two cover opening mechanisms 230 are set in the middle position of the housing 210. During operation, the two front-opening wafer transfer boxes 100 are opened first, and then the other two unopened front-opening wafer transfer boxes 100 are moved to the cover opening mechanism 230 for opening. In addition, the arrangement of the plurality of cover opening mechanisms 230 can also be non-continuous, for example: the two cover opening mechanisms 230 can be set separately, one cover opening mechanism 230 is set at the top layer corresponding to the loading port, and the other is set at the bottom layer. Therefore, the number of cover opening mechanisms 230 can be equal to or different from the number of loading ports.

[0034] Please refer to Figure 2 As shown in the figure, in order to enable the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention to be applied to the movement and operation in the factory area, a plurality of support members 500 and a plurality of multi-directional wheels 600 are provided at the bottom of the storage unit 200 and the loading and unloading unit 300 in the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention. It should be understood that the support member 500 is a generally existing adjustable support member, and its length can be adjusted. Therefore, during the movement process, the length of the support member 500 is first shortened so that it does not touch the ground, so that the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention can be moved. After moving to the predetermined position, the length of the support member 500 is lengthened again so that it can stably support and fix the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention, so as to avoid accidentally moving the device during operation.

[0035] In summary, the multi-layer storage and loading system 20 of the front-opening wafer pod of the present invention has the following advantages compared to the conventional loading system 10:

[0036] 1. The storage unit 200 has a multi-layer storage mechanism 220, which can store multiple front-opening wafer pods 100. When a front-opening wafer pod 100 completes processing, the material return process is an independent operation, which will not affect the material supply, and the material supply can be continued without causing the equipment to be idle.

[0037] Second, the pre-operation of opening the cover of a single or multiple front-opening wafer transfer boxes 100 can be performed at a specific location at the same time.

[0038] 3. The loading and unloading unit 300 can be used in conjunction with a factory automated conveying system to transport the front-opening wafer transport box 100, thereby improving process fluency and productivity.

[0039] 4. It can be moved independently with the process equipment in the factory, and can be fixed and operated after being moved to the predetermined position, with high adjustability.

[0040] 5. The front-opening wafer pod 100 performs the pre-operation (cover opening) only after entering the storage unit 200, so as to avoid the semiconductor wafer material from shaking or shifting during the loading process.

[0041] Of course, the above embodiments are only used for illustration and are not intended to limit the scope of the present invention. Any equivalent modifications or changes made to the multi-layer storage and loading system 20 of the front-opening wafer transfer box according to the above embodiments should still be included in the scope of the present invention.

[0042] In summary, it can be seen that the present invention has indeed achieved the desired improved effect by breaking through the previous technology, and it is not easy for those familiar with the art to think of it.

[0043] The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A multi-layer storage and loading system for a front-opening wafer pod, characterized in that: include: A storage unit, comprising: A shell; the shell includes a first surface and a second surface, the first surface includes an inlet and outlet port, and the second surface includes a plurality of loading ports; A multi-layer storage mechanism is disposed inside the housing and is used to carry a plurality of front-opening wafer transfer boxes; A lifting mechanism for axially moving the multi-layer storage mechanism to a plurality of positions; a plurality of cover opening mechanisms attached to the plurality of loading ports on the second surface; A material inlet and outlet unit is disposed on the first surface of the housing, comprising: A loading and unloading platform for carrying a front-opening wafer transfer box; a code reading mechanism, disposed on one side of the material loading and unloading platform, for identifying a code on the front-opening conveyor box; and A driving mechanism, used to drive the feeding and discharging platform; The loading and unloading platform is located at a position corresponding to the loading and unloading port, and the driving mechanism drives the loading and unloading platform so that the front-opening wafer transfer box is transferred from the loading and unloading port into and out of the storage unit through the loading and unloading platform.

2. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The multi-layer storage mechanism comprises a storage frame, and the storage frame has at least two layers for carrying at least two front-opening wafer transfer boxes.

3. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The multi-layer storage mechanism includes a plurality of single-layer platforms capable of independent movement.

4. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The lifting mechanism comprises a lifting platform arranged at the bottom of the shell body.

5. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The lifting mechanism further includes a plurality of slide rails vertically arranged inside the shell, and the multi-layer storage mechanism is attached to the plurality of slide rails so that the multi-layer storage mechanism can be axially moved to a plurality of positions along the slide rails.

6. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The plurality of cover opening mechanisms include at least two cover opening mechanisms attached to at least two of the plurality of loading ports.

7. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The number of the plurality of cover opening mechanisms is equal to or unequal to the number of the plurality of loading ports.

8. The multi-layer storage and loading system for a front-opening wafer pod as claimed in claim 1, wherein: The storage unit and the bottom of the material loading and unloading unit further include a plurality of supporting members and a plurality of multi-directional wheels.

Images