Wafer clamping module

Abstract

The present application provides a wafer clamping module, comprising a base, and a first clamping mechanism and a second clamping mechanism evenly spaced on the base, the first clamping mechanism and the second clamping mechanism both comprising a clamping claw and a driving cylinder, the driving end of the driving cylinder being connected to a mechanical arm of the clamping claw to drive the clamping claw to move in a predetermined direction; the first clamping mechanism is also provided with a positioning portion, when clamping a wafer, the time for the clamping claw of the first clamping mechanism to move to the positioning portion and for its claw to clamp the wafer is less than the time for the clamping claw of the second clamping mechanism to move and for its claw to clamp the wafer, thereby, the first clamping mechanism preferentially reaches the edge of the wafer and serves as a positioning point, and the second clamping mechanism subsequently moves to the edge of the wafer, effectively improving the clamping accuracy of the wafer; at the same time, the force with which the clamping claw of the first clamping mechanism clamps the wafer is greater than the force with which the clamping claw of the second clamping mechanism clamps the wafer, ensuring that the wafer is not deformed, thereby further improving the clamping accuracy of the wafer.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a wafer clamping module. Background Art

[0002] In the manufacturing process of integrated circuits, wafers are core components, and every step of the production process is crucial, especially the requirements for wafer surface pollution and precise positioning. Currently, the clamping technologies widely used in wafer testing systems mainly include suction cup adsorption process and mechanical claw design.

[0003] Although the suction cup adsorption process can meet the clamping requirements to a certain extent, in actual operation, the direct contact between the suction nozzle and the wafer surface can easily lead to wafer contamination, which is unacceptable for wafer production with extremely high requirements for surface pollution. In addition, the cylinder-driven mechanical claw design is completely dependent on the body accuracy of the robot arm, which not only limits the accuracy of clamping, but also increases the complexity of the system. Although the motor-driven mechanical claw can provide higher precision, its high cost and complex structure limit its practical application.

[0004] In addition, the mechanical claw structure used in conventional technology also has certain problems. Usually, each claw of the mechanical claw will grasp or release the wafer at the same time, which makes it impossible to effectively determine which claw is the positioning point during the grasping process, resulting in the randomness of the final positioning center, which cannot meet the needs of high-precision positioning. Summary of the invention

[0005] In view of the problems existing in the wafer clamping device in the prior art, the present application provides a wafer clamping module. The wafer clamping module is provided with a first clamping mechanism and a second clamping mechanism, wherein the first clamping mechanism and the second clamping mechanism have some differences, and the first clamping mechanism is provided with a positioning portion. When clamping a wafer, the time for the clamping claw of the first clamping mechanism to move to the positioning portion and clamp the wafer is less than the time for the clamping claw of the second clamping mechanism to move and clamp the wafer with its claw. In this way, the first clamping mechanism first reaches the edge of the wafer and serves as a positioning point. After the second clamping mechanism moves to the edge of the wafer, the first clamping mechanism and the second clamping mechanism cooperate to clamp and fix the wafer, thereby achieving wafer pollution-free and improving the clamping accuracy of the wafer; at the same time, the force of the first clamping mechanism clamping the wafer is greater than the force of the second clamping mechanism clamping the wafer. By controlling the force on the wafer, the wafer is ensured not to be deformed, and the wafer clamping accuracy is further improved.

[0006] An embodiment of the present application provides a wafer clamping module, comprising:

[0007] Base;

[0008] A first clamping mechanism and a second clamping mechanism, wherein the first clamping mechanism and the second clamping mechanism are evenly spaced and arranged on the base; the first clamping mechanism and the second clamping mechanism each include a clamping claw and a driving cylinder, wherein the clamping claw includes a mechanical arm and a claw portion connected to the mechanical arm, and a driving end of the driving cylinder is connected to the mechanical arm to drive the clamping claw to move in a predetermined direction;

[0009] The first clamping mechanism is provided with a positioning portion. When clamping a wafer, the time taken for the clamping claw of the first clamping mechanism to move to the positioning portion and for the claw to clamp the wafer is less than the time taken for the clamping claw of the second clamping mechanism to move and for the claw to clamp the wafer; and the force with which the clamping claw of the first clamping mechanism clamps the wafer is greater than the force with which the clamping claw of the second clamping mechanism clamps the wafer.

[0010] As an embodiment, the first clamping mechanism and the second clamping mechanism each further include a first limiter and a second limiter, the driving cylinder is disposed in the base, the first limiter and the second limiter are disposed on the base, and the second limiter is farther from the claw portion than the first limiter, the mechanical arm of the clamping hook portion is located between the first limiter and the second limiter, the driving end of the driving cylinder is connected to the mechanical arm, and drives the mechanical arm to move between the first limiter and the second limiter;

[0011] The second limiting member of the first clamping mechanism serves as the positioning portion;

[0012] The second clamping mechanism further includes a resistance mechanism, which is disposed between the second limiting member and the mechanical arm and is used to reduce the force exerted on the mechanical arm by the driving cylinder.

[0013] As an embodiment, when clamping the wafer, the total driving force applied to the clamping claws of the first clamping mechanism is at least twice the total driving force applied to the clamping claws of the second clamping mechanism.

[0014] As an embodiment, a driving air channel is provided in the base, and the driving air channel is connected to the driving cylinder of the first clamping mechanism and the driving cylinder of the second clamping mechanism.

[0015] As an embodiment, the mechanical arm includes a first connecting section, a second connecting section and a third connecting section, the first connecting section is parallel to the upper surface of the base, the second connecting section is vertically connected to the first connecting section, the third connecting section is vertically connected to the second connecting section, and one end of the third connecting section away from the second connecting section is connected to the claw;

[0016] The first position-limiting member comprises a frame structure, the frame structure is arranged at the edge of the base, and the second connecting section of the mechanical arm passes through the frame structure;

[0017] The second limiting member includes a limiting block, which is arranged on the upper surface of the base. The limiting block is provided with a protrusion, which is located between the limiting block and the first connecting section, and the protrusion can limit the first connecting section from moving toward the limiting block.

[0018] As an embodiment, the resistance mechanism includes an air accommodating chamber arranged at one end of the first connecting section of the robotic arm close to the second limiting member, and the protrusion at least partially extends into the air accommodating chamber; and a first sealing ring arranged at one end of the protrusion extending into the air accommodating chamber.

[0019] As an implementation manner, the resistance mechanism includes a spring, the spring portion is sleeved on the protrusion, and one end of the spring is fixed to the limit block or the protrusion.

[0020] As an implementation manner, the first clamping mechanism and the second clamping mechanism both further include a guide rail connected to the first connecting section of the mechanical arm, and the guide rail is disposed on the base;

[0021] The driving end of the driving cylinder is connected to the mechanical arm via a decoupling spring.

[0022] As an embodiment, the first clamping mechanism and the second clamping mechanism both further include a first detection air channel, the first detection air channel is arranged in the base, the outlet of the first detection air channel of the first clamping mechanism is a first air outlet, and the outlet of the first detection air channel of the second clamping mechanism is a second air outlet;

[0023] The first air outlet and the second air outlet are both located on a side of the second limiter close to the mechanical arm, and a second sealing ring is provided at the end of the second air outlet;

[0024] Alternatively, the first air outlet is located on a side of the second limiting member close to the mechanical arm, the second air outlet is located on a side wall of the base close to the mechanical arm, and a second sealing ring is provided at an end of the second air outlet.

[0025] As an implementation manner, the first clamping mechanism and the second clamping mechanism both further include a second detection airway;

[0026] Part of the second detection air channel is arranged in the base and the clamping claw, the air channel arranged in the base and the air channel arranged in the clamping claw are connected through an air pipe, and the outlet of the second detection air channel is located at the contact point between the claw and the wafer.

[0027] As an implementation manner, the driving cylinder includes a cylinder body, a cylinder guide column, a cylinder extension rod and a nut, and the cylinder extension rod is fixedly connected to the clamping claw through the nut.

[0028] As an embodiment, a limiting hole is provided on the base, the robotic arm is penetrated by the limiting hole, the aperture of the limiting hole is larger than the length and width of the robotic arm, and the limiting hole in the first clamping mechanism is away from the inner wall of the corresponding claw portion as the positioning portion.

[0029] As an embodiment, the driving cylinder is arranged on the upper surface of the base, a hinge point is provided between the mechanical arm of the clamping claw and the base, and the first clamping mechanism also includes a stopper arranged on the base and capable of limiting the swing amplitude of the mechanical arm, and the stopper serves as the positioning portion.

[0030] As described above, the wafer clamping module of the present application has the following beneficial effects:

[0031] The wafer clamping module of the present application is provided with a first clamping mechanism and a second clamping mechanism with differences. The first clamping mechanism can preferentially reach the edge of the wafer and serve as a positioning point because the time it takes for its clamping claws to move to the positioning portion and clamp the wafer is shorter, and the second clamping mechanism then moves to the edge of the wafer. The two cooperate to clamp and fix the wafer, effectively improving the clamping accuracy of the wafer. The design of the wafer clamping module avoids direct contact between the suction nozzle and the wafer surface, thereby reducing the risk of contamination of the wafer during the clamping process and meeting the strict requirements for no pollution in the wafer production process. At the same time, by controlling the force of the first clamping mechanism to clamp the wafer to be greater than the force of the second clamping mechanism to clamp the wafer, it can be ensured that the wafer does not deform during the clamping process, further improving the accuracy and reliability of wafer clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Shown is a structural schematic diagram of a wafer clamping module according to the first embodiment of the present invention;

[0033] Figure 2 Shown is a structural schematic diagram of a first clamping mechanism or a second clamping mechanism in a wafer clamping module according to the first embodiment of the present invention;

[0034] Figure 3 It is a schematic diagram showing a part of the structure of the driving cylinder in the wafer clamping module according to the first embodiment of the present invention;

[0035] Figure 4 It is a schematic structural diagram of a claw portion in a wafer clamping module according to the first embodiment of the present invention;

[0036] Figure 5 It is a schematic diagram showing the structure of another claw portion in the wafer clamping module according to the first embodiment of the present invention;

[0037] Figure 6 It is a schematic structural diagram of another claw portion in the wafer clamping module according to the first embodiment of the present invention;

[0038] Figure 7 It is a schematic structural diagram of a second clamping mechanism in a wafer clamping module according to a second embodiment of the present invention;

[0039] Figure 8 It is a schematic structural diagram of the second clamping mechanism in the wafer clamping module according to the third embodiment of the present invention;

[0040] Fig. 9 Shown is a structural schematic diagram of a first clamping mechanism or a second clamping mechanism in a wafer clamping module according to a fourth embodiment of the present invention;

[0041] Fig.10 It is a schematic structural diagram of the second clamping mechanism in the wafer clamping module according to the fourth embodiment of the present invention;

[0042] Fig.11 It is a schematic diagram showing the cooperation between the outlet of the second detection air channel and the wafer in the wafer clamping module according to the fourth embodiment of the present invention;

[0043] Fig.12 It is a schematic diagram showing the structure of a driving cylinder in a wafer clamping module according to a fifth embodiment of the present invention;

[0044] Fig.13 Shown is a structural schematic diagram of a first clamping mechanism or a second clamping mechanism in a wafer clamping module according to a fifth embodiment of the present invention;

[0045] Fig.14 Shown is a schematic diagram of the structure of the first clamping mechanism or the second clamping mechanism in the wafer clamping module of the sixth embodiment of the present invention.

[0046] Component number description

[0047] 100, base; 110, limit hole; 120, hinge point; 130, stopper; 201, first clamping mechanism; 202, second clamping mechanism; 210, clamping claw; 211, mechanical arm; 212, claw; 220, driving cylinder; 221, driving end; 222, decoupling reed; 223, cylinder body; 224, cylinder guide column; 225, cylinder extension rod; 226, nut; 230, first limiting member; 240, second limiting member; 241, limiting block; 242, protrusion; 250, resistance mechanism; 251, air containing chamber; 252, first sealing ring; 253, spring; 260, guide rail; 270, first detection air channel; 271, first air outlet; 272, second air outlet; 273, second sealing ring; 280, second detection air channel; 300, wafer. DETAILED DESCRIPTION

[0048] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0049] See also Figures 1 to 14 It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner, and the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated. Embodiment 1

[0050] This embodiment provides a wafer clamping module, such as Figure 1As shown, the wafer clamping module includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The first clamping mechanism 201 and the second clamping mechanism 202 are both used to clamp the wafer 300, and the first clamping mechanism 201 and the second clamping mechanism 202 are evenly spaced and arranged on the base 100. The number of the first clamping mechanism 201 and the second clamping mechanism 202 can be one or more. When there is only one first clamping mechanism 201 and one second clamping mechanism 202, the area of ​​the edge of the wafer 300 clamped by the first clamping mechanism 201 and the second clamping mechanism 202 needs to be large enough to prevent the wafer 300 from falling off. When the total number of the first clamping mechanism 201 and the second clamping mechanism 202 is more than 3, the clamping positions are evenly distributed, and the first clamping mechanism 201 and the second clamping mechanism 202 cannot clamp the wafer 300 alone. Specifically, in this embodiment, the number of the first clamping mechanisms 201 is two, and the number of the second clamping mechanisms 202 is two, so as to ensure the firmness of the wafer 300 after being clamped by the first clamping mechanism 201 and the second clamping mechanism 202 .

[0051] like Figure 2 As shown, the first clamping mechanism 201 and the second clamping mechanism 202 each include a clamping claw 210 and a driving cylinder 220. The clamping claw 210 includes a mechanical arm 211 and a claw portion 212, and the mechanical arm 211 is connected to the claw portion 212. The driving cylinder 220 includes a driving end 221, and the driving end 221 is connected to the mechanical arm 211 to drive the clamping claw 210 to move in a predetermined direction.

[0052] The first clamping mechanism 201 is provided with a positioning portion. When clamping the wafer 300, the time taken for the clamping claw 210 of the first clamping mechanism 201 to move to the positioning portion and for its claw 212 to clamp the wafer 300 is less than the time taken for the clamping claw 210 of the second clamping mechanism 202 to move and for its claw 212 to clamp the wafer 300. For example, the air flow rate in the first clamping mechanism 201 is larger than that in the second clamping mechanism 202, or the power of the driving cylinder 220 in the first clamping mechanism 201 is larger. During operation, since the first clamping mechanism 201 clamps the wafer 300 in a shorter time, it can first reach the positioning portion and the edge of the wafer 300 and serve as a positioning point, and the second clamping mechanism 202 then moves to the edge of the wafer 300, and the two cooperate to clamp and fix the wafer 300 (that is, the first clamping mechanism 201 shrinks into place first, and the second clamping mechanism 202 continues to shrink until the wafer 300 is clamped and fixed), which effectively improves the clamping accuracy of the wafer 300.

[0053] The force of the clamping claws 210 of the first clamping mechanism 201 clamping the wafer 300 is greater than the force of the clamping claws 210 of the second clamping mechanism 202 clamping the wafer 300, which can ensure that the wafer 300 does not deform during the clamping process and further improve the accuracy and reliability of the wafer 300 clamping.

[0054] The wafer clamping module provided in this embodiment avoids direct contact between the suction nozzle and the wafer surface, reduces the risk of contamination of the wafer during the clamping process, and meets the strict requirements for non-contamination in the wafer production process; at the same time, the wafer clamping module has the ability to quickly position and clamp, making the wafer testing process more efficient, shortening the production cycle, and improving overall production efficiency. In addition, the wafer clamping module uses a cylinder as a driving component, which can achieve high-precision positioning requirements without power supply, simplifying the design difficulty of the device itself and related accessories.

[0055] In an optional embodiment, if Figure 2 As shown, the first clamping mechanism 201 and the second clamping mechanism 202 both further include a first stopper 230 and a second stopper 240, the first stopper 230 and the second stopper 240 are arranged on the base 100, and the second stopper 240 is farther from the claw portion 212 than the first stopper 230 (it can be understood that when comparing or describing the relative relationship, all refer to the components on the same first clamping mechanism 201 or the second clamping mechanism 202, and the relative relationship in the following description also refers to the components on the same first clamping mechanism 201 or the second clamping mechanism 202, so it will not be repeated), and the partial mechanical arm 211 of the clamping hook 210 is located between the first stopper 230 and the second stopper 240. The driving cylinder 220 is arranged in the base 100, and the driving end 221 of the driving cylinder 220 is connected to the mechanical arm 211, and drives the mechanical arm 211 to move between the first stopper 230 and the second stopper 240. The second stopper 240 of the first clamping mechanism 201 serves as a positioning part. Specifically, before clamping, the mechanical arms 211 of the first clamping mechanism 201 and the second clamping mechanism 202 are both located at the first stopper 230; when clamping starts, the mechanical arm 211 of the first clamping mechanism 201 first moves to the second stopper 240, and the second stopper 240 positions the clamping claw 210 of the first clamping mechanism 201.

[0056] In an optional embodiment, the second clamping mechanism 202 further includes a resistance mechanism 250, which is disposed between the second stopper 240 and the mechanical arm 211, and the resistance mechanism 250 can reduce the force exerted by the driving cylinder 220 on the mechanical arm 211. It can be understood that the direction of the force exerted by the resistance mechanism 250 on the mechanical arm 211 of the second clamping mechanism 202 is opposite to the direction of the force exerted by the driving cylinder 220 on the mechanical arm 211 of the second clamping mechanism 202 to clamp the wafer 300. By setting the resistance mechanism 250, on the one hand, compared with the time when the claw 212 of the first clamping mechanism 201 reaches the edge of the wafer 300, the time when the claw 212 of the second clamping mechanism 202 reaches the edge of the wafer 300 increases, thereby, the claw 212 of the first clamping mechanism 201 is used as a positioning point, thereby improving the clamping speed and clamping accuracy; on the other hand, the force of the claw 212 of the first clamping mechanism 201 to clamp the wafer 300 will be greater than the force of the claw 212 of the second clamping mechanism 202 to clamp the wafer 300, which can avoid deformation of the wafer 300, thereby further improving the clamping accuracy. It should be noted that the structure of the resistance mechanism 250 can be in various forms, and some embodiments will be described in detail in the subsequent description.

[0057] In an optional embodiment, when clamping the wafer 300, the total driving force received by the clamping claw 210 of the first clamping mechanism 201 is at least twice the total driving force received by the clamping claw 210 of the second clamping mechanism 202. During operation, since the clamping claw 210 of the first clamping mechanism 201 receives a large driving force and a fast speed, it preferentially moves to the second stopper 240 to stop, while the clamping claw 210 of the second clamping mechanism 202 receives a small thrust and a slow speed, and will approach the wafer 300 more slowly. When clamping the wafer 300, since the force received by the clamping claw 210 of the second clamping mechanism 202 is smaller than the force received by the clamping claw 210 of the first clamping mechanism 201, the position of the wafer 300 is always positioned by the second stopper 240 of the first clamping mechanism 201. Preferably, the total driving force applied to the clamping claw 210 of the second clamping mechanism 202 is 0.2N-1N, for example, 0.2N, 0.4N, 0.6N, 0.8N, 1.0N, etc.

[0058] In an optional embodiment, a driving air duct is provided in the base 100, and the driving air duct is connected to the driving cylinder 220 of the first clamping mechanism 201 and the driving cylinder 220 of the second clamping mechanism 202. That is to say, the driving cylinder 220 of the first clamping mechanism 201 and the driving cylinder 220 of the second clamping mechanism 202 share a gas source. In this way, when clamping the wafer 300, the resistance mechanism 250 can be used to make the total driving force received by the first clamping mechanism 201 greater than the total driving force received by the second clamping mechanism 202, thereby coping with the scenario of only one gas source and one driving cylinder, and can effectively simplify the gas source pipeline design and reduce costs.

[0059] In an optional embodiment, if Figure 2 As shown, the robotic arm 211 includes a first connecting segment, a second connecting segment and a third connecting segment. The first connecting segment is parallel to the upper surface of the base 100, the second connecting segment is vertically connected to the first connecting segment, the third connecting segment is vertically connected to the second connecting segment, and the end of the third connecting segment away from the second connecting segment is connected to the claw 212.

[0060] The first position-limiting member 230 includes a frame structure, which is disposed at the edge of the base 100 , and the second connecting section of the mechanical arm 211 passes through the frame structure.

[0061] The second limiting member 240 includes a limiting block 241, which is arranged on the upper surface of the base 100. A protrusion 242 is arranged on the limiting block 241, and the protrusion 242 is located between the limiting block 241 and the first connecting section of the robot arm 211. The protrusion 242 can limit the first connecting section of the robot arm 211 from moving toward the limiting block 241.

[0062] In an optional embodiment, if Figure 2 As shown, the first clamping mechanism 201 and the second clamping mechanism 202 also include a guide rail 260, which is arranged on the upper surface of the base 100 and connected to the first connecting section of the robot arm 211 through a slider, so that the movement accuracy of the first clamping mechanism 201 and the second clamping mechanism 202 can be improved.

[0063] like Figure 3 As shown, the driving end 221 of the driving cylinder 220 is connected to the mechanical arm 211 through a decoupling spring 222. In this way, the decoupling spring 222 can eliminate the jamming problem caused by the non-parallelism between the driving cylinder 220 and the guide rail 260 caused by parts and assembly. Specifically, the driving end 221 of the driving cylinder 220 is connected to the center of the decoupling spring 222 through a nut, and the surrounding positions of the decoupling spring 222 are connected to the mechanical arm 211 through bolts.

[0064] In an optional embodiment, if Figures 4 to 6 As shown, the claw portion 212 of the clamping hook 210 can be in an arc shape, a flat portion shape, or a combination of a flat portion and a barb. Figure 5 As shown, when the claw portion 212 is flat, the positioning accuracy can be improved. Figure 6 As shown, when the claw portion 212 is a combination of a flat portion and a barb, the positioning accuracy can be further improved. Embodiment 2

[0065] This embodiment also provides a wafer clamping module, which also includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The difference from the first embodiment is that:

[0066] like Figure 7 As shown, the resistance mechanism 250 includes an air receiving chamber 251 and a first sealing ring 252. The air receiving chamber 251 is opened at one end of the first connecting section of the mechanical arm 211 close to the second stopper 240, and the protrusion 242 of the second stopper 240 at least partially extends into the air receiving chamber 251; the first sealing ring 252 is arranged at the end of the protrusion 242 extending into the air receiving chamber 251. The function of the first sealing ring 252 is sealing. Since the air receiving chamber 251 is filled with air, and the first sealing ring 252 is arranged at the end of the protrusion 242 extending into the air receiving chamber 251, the air receiving chamber 251 will not leak. When the driving end 221 of the driving cylinder 220 drives the mechanical arm 211 of the second clamping mechanism 202 to move from the first limiter 230 to the second limiter 240, the length of the protrusion 242 extending into the air receiving chamber 251 increases, causing the air in the air receiving chamber 251 to be compressed. During this process, the mechanical arm 211 will be subjected to a thrust, and the thrust is opposite to the driving force of the driving end 221 of the driving cylinder 220, so that the total driving force on the mechanical arm 211 of the second clamping mechanism 202 is reduced, thereby achieving the asynchronous movement speed of the first clamping mechanism 201 and the second clamping mechanism 202. The structure of the above-mentioned resistance mechanism 250 can be used when the driving cylinder 220 of the first clamping mechanism 201 and the driving cylinder 220 of the second clamping mechanism 202 share the same air source, and there is no other air source supply, and high and low air pressures cannot be provided by external means.

[0067] The advantage of using the air containing chamber 251 and the first sealing ring 252 as the resistance mechanism 250 is that the resistance of the resistance mechanism 250 can change with the displacement of the robot arm 211. When the second clamping mechanism 202 clamps the wafer 300, the speed and the clamping force gradually decrease. This will not affect the clamping efficiency and avoid damage to the wafer 300 due to excessive clamping force. Embodiment 3

[0068] This embodiment also provides a wafer clamping module, which also includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The difference from the first or second embodiment is that:

[0069] like Figure 8As shown, the resistance mechanism 250 includes a spring 253, and the spring 253 is partially sleeved on the protrusion 242. One end of the spring 253 is fixed on the limit block 241 or the protrusion 242, and the other end of the spring 253 is closer to the mechanical arm 211 than the protrusion 242. When the mechanical arm 211 of the second clamping mechanism 202 is driven by the driving end 221 of the driving cylinder 220, the mechanical arm 211 of the second clamping mechanism 202 will move from the first limit member 230 to the second limit member 240. At this time, the first connecting section of the mechanical arm 211 will squeeze the spring 253, and the squeezing of the spring 253 will give the mechanical arm 211 a reaction force, which reduces the total driving force received by the mechanical arm 211, thereby achieving the asynchronous movement speed of the first clamping mechanism 201 and the second clamping mechanism 202. Specifically, in this embodiment, one end of the spring 253 is fixed in the limit block 241. The advantage of using the spring 253 is that it has a simple structure as the resistance mechanism 250, is easy to install, and has low cost. Embodiment 4

[0070] This embodiment also provides a wafer clamping module, which also includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The difference from the first to third embodiments is that:

[0071] like Fig. 9 , Fig.10 As shown, the first clamping mechanism 201 and the second clamping mechanism 202 both include a first detection air channel 270. The first detection air channel 270 is disposed in the base 100, and the outlet of the first detection air channel 270 of the first clamping mechanism 201 is a first air outlet 271, and the outlet of the first detection air channel 270 of the second clamping mechanism 202 is a second air outlet 272.

[0072] In an optional embodiment, if Fig. 9As shown, the first air outlet 271 of the first detection air channel 270 of the first clamping mechanism 201 and the second air outlet 272 of the first detection air channel 270 of the second clamping mechanism 202 can be located at the same position, both located on the side of the protrusion 242 of the second limiter 240 close to the mechanical arm 211. The purpose of setting the first detection air channel 270 is to detect whether the first clamping mechanism 201 and the second clamping mechanism 202 are clamped in place. When the mechanical arm 211 is brought back from the first limiter 230 to the second limiter 240 by the driving cylinder 220, the first connecting section of the mechanical arm 211 close to the end of the second limiter 240 blocks the first air outlet 271 and the second air outlet 272, so that the air pressure in the first detection air channel 270 increases, thereby reducing the airflow, which can replace traditional detection methods such as photoelectric sensors. Since the first connection section of the mechanical arm 211 of the second clamping mechanism 202 is not completely fitted with the protrusion 242 when the wafer 300 is clamped, a second sealing ring 273 (not shown) is provided at the end of the second air outlet 272 (that is, the side of the protrusion 242 close to the first connection section of the mechanical arm 211). The second sealing ring 273 is elastic. It should be noted that the second stopper 240 of the first clamping mechanism 201, as a positioning part, will contact the mechanical arm 211, so there is no need to provide a sealing ring.

[0073] In an optional embodiment, if Fig.10 As shown, the position of the first air outlet 271 remains unchanged, the second air outlet 272 is located at the side wall of the base 100 close to the mechanical arm 211, and a second sealing ring 273 is provided at the end of the second air outlet 272. This arrangement is to prevent the components and structure of the protruding portion 242 of the second clamping mechanism 202 from being too complicated or being affected by the resistance mechanism 250.

[0074] In an optional embodiment, if Fig. 9 and Fig.10 As shown, the first clamping mechanism 201 and the second clamping mechanism 202 both further include a second detection airway 280, part of which is disposed in the base 100 and the clamping claw 210, and the airway disposed in the base 100 and the airway disposed in the clamping claw 210 are connected via an air pipe. Fig.11As shown, the outlet of the second detection air channel 280 is located at the contact point between the claw 212 and the wafer 300. The second detection air channel 280 can perform vacuum vent detection, and can be used to detect whether the first clamping mechanism 201 and the second clamping mechanism 202 have clamped the wafer 300 and whether the wafer 300 is flat. When there is a wafer 300 and the wafer 300 is flat, the outlet of the second detection air channel 280 is blocked by the wafer 300, at which time the flow rate in the second detection air channel 280 decreases and the pressure increases; when there is no wafer 300, the outlet of the second detection air channel 280 is open, at which time the flow rate in the second detection air channel 280 increases and the pressure decreases. Setting the second detection air channel 280 can replace the traditional photoelectric sensor detection, with a simple structure and reduced cost, and can realize non-electrical installation and operation in the entire product. Embodiment 5

[0075] This embodiment also provides a wafer clamping module, which also includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The difference from the first to fourth embodiments is that:

[0076] like Fig.12 As shown, the driving cylinder 220 includes a cylinder body 223, a cylinder guide column 224, a cylinder extension rod 225 and a nut 226. The cylinder guide column 224 is arranged around the outer side of the cylinder body 223, and the cylinder guide column 224 is parallel to the cylinder extension rod 225. The cylinder extension rod 225 is fixedly connected to the clamping claw 210 through the nut 226.

[0077] like Fig.13 As shown, a limiting hole 110 is provided on the base 100, and the mechanical arm 211 includes a second connecting section and a third connecting section. The second connecting section of the mechanical arm 211 is provided with the limiting hole 110. In order to realize the movement of the first clamping mechanism 201 and the second clamping mechanism 202 in a predetermined direction, the aperture of the limiting hole 110 is set to be larger than the length and width of the second connecting section of the mechanical arm 211. The inner wall of the limiting hole 110 close to the corresponding claw portion 212 is equivalent to the first limiting member 230 in the above embodiment, and the inner wall of the limiting hole 110 away from the corresponding claw portion 212 is equivalent to the second limiting member 240 in the above embodiment. The inner wall of the limiting hole 110 in the first clamping mechanism 201 away from the corresponding claw portion 212 serves as a positioning portion.

[0078] By using a guide cylinder and removing the parts disposed above the upper surface of the base 100 (such as the second stopper 240, the guide rail 260 and the first connecting section of the mechanical arm 211), the number of parts can be further reduced. In addition, the hole walls at different positions of the stopper hole 110 are used as the first stopper 230 and the second stopper 240, which further simplifies the structure. Embodiment 6

[0079] This embodiment also provides a wafer clamping module, which also includes a base 100, a first clamping mechanism 201 and a second clamping mechanism 202. The difference from the first to fifth embodiments is that:

[0080] like Fig.14 As shown, the driving cylinder 220 is arranged on the upper surface of the base 100, and a hinge point 120 is arranged between the mechanical arm 211 of the clamping claw 210 and the base 100. The first clamping mechanism 201 also includes a stopper 130 arranged on the base 100 and capable of limiting the swing amplitude of the mechanical arm 211, and the stopper 130 serves as a positioning part. The wafer 300 is clamped by rotating the claw 212. By arranging the stopper 130 as a positioning part on the base 100, the swing amplitude of the mechanical arm 211 can be accurately controlled to ensure the accurate positioning of the clamping claw 210 when clamping the wafer 300; the setting of the hinge point 120 provides a flexible connection between the mechanical arm 211 and the base 100, and at the same time, with the use of the stopper 130, the stability of the clamping operation is enhanced, and the risk of wafer 300 clamping failure or damage caused by excessive swing of the mechanical arm 211 is reduced.

[0081] In summary, the wafer clamping module provided by the embodiment of the present application is provided with a first clamping mechanism and a second clamping mechanism with differences, so that the first clamping mechanism can quickly reach the positioning part, and quickly reach the edge of the wafer and serve as a positioning point, and then the second clamping mechanism moves to the edge of the wafer, and the two cooperate to clamp and fix the wafer, effectively improving the clamping accuracy of the wafer. The first clamping mechanism can preferentially reach the edge of the wafer because the time for its clamping claw to move to the positioning part and clamp the wafer is short. This design optimizes the clamping process and improves the clamping efficiency. By controlling the force of the first clamping mechanism to clamp the wafer to be greater than the force of the second clamping mechanism to clamp the wafer, it can be ensured that the wafer does not deform during the clamping process, further improving the accuracy and reliability of wafer clamping. The design of the wafer clamping module avoids direct contact between the suction nozzle and the surface of the wafer, reduces the risk of contamination of the wafer during the clamping process, meets the strict requirements for pollution-free during the wafer production process, and improves the overall production efficiency and production quality. In addition, in the design of conventional wafer mechanical claws, it is necessary to try to avoid generating different claw clamping forces and movement speeds to improve the clamping accuracy. This solution uses this technical feature to improve the wafer clamping accuracy and stability.

[0082] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer clamping module, characterized in that: include: base(100); A first clamping mechanism (201) and a second clamping mechanism (202), wherein the first clamping mechanism (201) and the second clamping mechanism (202) are evenly spaced and arranged on the base (100); the first clamping mechanism (201) and the second clamping mechanism (202) both comprise a clamping claw (210) and a driving cylinder (220); the clamping claw (210) comprises a mechanical arm (211) and a claw portion (212) connected to the mechanical arm (211); a driving end (221) of the driving cylinder (220) is connected to the mechanical arm (211) to drive the clamping claw (210) to move along a predetermined direction; The first clamping mechanism (201) is provided with a positioning portion. When clamping a wafer (300), the time for the clamping claw (210) of the first clamping mechanism (201) to move to the positioning portion and for its claw portion (212) to clamp the wafer (300) is shorter than the time for the clamping claw (210) of the second clamping mechanism (202) to move and for its claw portion (212) to clamp the wafer (300); and the force with which the clamping claw (210) of the first clamping mechanism (201) clamps the wafer (300) is greater than the force with which the clamping claw (210) of the second clamping mechanism (202) clamps the wafer (300).

2. The wafer clamping module according to claim 1, characterized in that: The first clamping mechanism (201) and the second clamping mechanism (202) both further include a first limiting member (230) and a second limiting member (240); the driving cylinder (220) is arranged in the base (100); the first limiting member (230) and the second limiting member (240) are arranged on the base (100); the second limiting member (240) is farther from the claw portion (212) than the first limiting member (230); the mechanical arm (211) of the clamping hook claw (210) is located between the first limiting member (230) and the second limiting member (240); the driving end (221) of the driving cylinder (220) is connected to the mechanical arm (211) and drives the mechanical arm (211) to move between the first limiting member (230) and the second limiting member (240); The second limiting member (240) of the first clamping mechanism (201) serves as the positioning portion; The second clamping mechanism (202) further comprises a resistance mechanism (250), wherein the resistance mechanism (250) is arranged between the second limiting member (240) and the mechanical arm (211) and is used to reduce the force exerted on the mechanical arm (211) by the driving cylinder (220).

3. The wafer clamping module according to claim 2, characterized in that: When clamping the wafer (300), the total driving force received by the clamping claw (210) of the first clamping mechanism (201) is at least twice the total driving force received by the clamping claw (210) of the second clamping mechanism (202).

4. The wafer clamping module according to claim 2, characterized in that: A driving air channel is provided in the base (100), and the driving air channel is in communication with the driving cylinder (220) of the first clamping mechanism (201) and the driving cylinder (220) of the second clamping mechanism (202).

5. The wafer clamping module according to claim 2, characterized in that: The mechanical arm (211) comprises a first connecting section, a second connecting section and a third connecting section, the first connecting section being parallel to the upper surface of the base (100), the second connecting section being vertically connected to the first connecting section, the third connecting section being vertically connected to the second connecting section, and an end of the third connecting section away from the second connecting section being connected to the claw portion (212); The first position-limiting member (230) comprises a frame structure, the frame structure is arranged at the edge of the base (100), and the second connecting section of the mechanical arm (211) passes through the frame structure; The second limiting member (240) comprises a limiting block (241), the limiting block (241) being arranged on the upper surface of the base (100), the limiting block (241) being provided with a protrusion (242), the protrusion (242) being located between the limiting block (241) and the first connecting section, the protrusion (242) being capable of limiting the movement of the first connecting section towards the limiting block (241).

6. The wafer clamping module according to claim 5, characterized in that: The resistance mechanism (250) comprises an air accommodating chamber (251) arranged at one end of the first connecting section of the mechanical arm (211) close to the second limiting member (240), the protrusion (242) at least partially extending into the air accommodating chamber (251); and a first sealing ring (252) arranged at one end of the protrusion (242) extending into the air accommodating chamber (251).

7. The wafer clamping module according to claim 5, characterized in that: The resistance mechanism (250) comprises a spring (253), wherein a portion of the spring (253) is sleeved on the protruding portion (242), and one end of the spring (253) is fixed on the limiting block (241) or the protruding portion (242).

8. The wafer clamping module according to claim 5, characterized in that: The first clamping mechanism (201) and the second clamping mechanism (202) both further include a guide rail (260) connected to the first connecting section of the mechanical arm (211), and the guide rail (260) is arranged on the base (100); The driving end (221) of the driving cylinder (220) and the mechanical arm (211) are connected via a decoupling spring (222).

9. The wafer clamping module according to claim 2, characterized in that: The first clamping mechanism (201) and the second clamping mechanism (202) both further comprise a first detection air channel (270), the first detection air channel (270) being arranged in the base (100), the outlet of the first detection air channel (270) of the first clamping mechanism (201) being a first air outlet (271), and the outlet of the first detection air channel (270) of the second clamping mechanism (202) being a second air outlet (272); The first air outlet (271) and the second air outlet (272) are both located on a side of the second limiting member (240) close to the mechanical arm (211), and a second sealing ring (273) is provided at the end of the second air outlet (272); Alternatively, the first air outlet (271) is located on a side of the second limiting member (240) close to the mechanical arm (211), the second air outlet (272) is located on a side wall of the base (100) close to the mechanical arm (211), and a second sealing ring (273) is provided at the end of the second air outlet (272).

10. The wafer clamping module according to claim 2, characterized in that: The first clamping mechanism (201) and the second clamping mechanism (202) both further include a second detection airway (280); Part of the second detection air channel (280) is arranged in the base (100) and the clamping claw (210), the air channel arranged in the base (100) and the air channel arranged in the clamping claw (210) are connected through an air pipe, and the outlet of the second detection air channel (280) is located at the contact point between the claw (212) and the wafer (300).

11. The wafer clamping module according to claim 1, characterized in that: The driving cylinder (220) comprises a cylinder body (223), a cylinder guide column (224), a cylinder extension rod (225) and a nut (226); the cylinder extension rod (225) and the clamping claw (210) are fixedly connected via the nut (226).

12. The wafer clamping module according to claim 11, characterized in that: A limiting hole (110) is provided on the base (100), the mechanical arm (211) is penetrated by the limiting hole (110), the diameter of the limiting hole (110) is larger than the length and width of the mechanical arm (211), and the limiting hole (110) in the first clamping mechanism (201) is away from the inner wall corresponding to the claw portion (212) as the positioning portion.

13. The wafer clamping module according to claim 1, characterized in that: The driving cylinder (220) is arranged on the upper surface of the base (100), and a hinge point (120) is provided between the mechanical arm (211) of the clamping claw (210) and the base (100). The first clamping mechanism (201) further comprises a stopper (130) arranged on the base (100) and capable of limiting the swing amplitude of the mechanical arm (211), and the stopper (130) serves as the positioning portion.

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