Electronic module and communication equipment

Abstract

The embodiment of the invention discloses an electronic module and communication equipment, which can reduce the surface space of a circuit board occupied by airtight packaging, improve the number of chips capable of being packaged by the circuit board, and improve the space utilization rate of the circuit board. The electronic module comprises a circuit board, a substrate, a shell and a chip, the first conductive wire of the circuit board is electrically connected with the second conductive wire of the substrate, the circuit board is provided with a first side wall in the direction perpendicular to the surface of the circuit board, the substrate is provided with a second side wall in the direction perpendicular to the surface of the substrate, and the first side wall and the second side wall face each other. An airtight package is formed between the substrate and the shell, the chip is located in the airtight package, and the chip is electrically connected with the first conductive wire or the second conductive wire.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of communication technology, and in particular to an electronic module and a communication device. Background Art

[0002] The photoelectric conversion module is an important component in the optical communication system, which is used to realize the mutual conversion of photoelectric signals. Figure 1 The side view structure example diagram of an existing photoelectric conversion module. The photoelectric conversion module 100 includes a circuit board 101 and an optical chip and an electrical chip fixed on the circuit board 101. The electrical chip is used to drive the optical chip to emit light. If the optical chip is directly exposed to the external environment, the life of the photoelectric conversion module 100 will be affected, and the optical chip will be affected by the external environment and cannot emit an optical signal with stable optical power.

[0003] To this end, the optical chip needs to be placed in a hermetic package 102. Figure 1 The hermetic package 102 is stacked on the circuit board 101 to achieve electrical connection between the optical chip and the electrical chip through the circuit board 101 .

[0004] However, the airtight package 102 occupies a relatively large surface space of the circuit board 101 , thereby reducing the space utilization of the circuit board 101 . Summary of the invention

[0005] The embodiments of the present application provide an electronic module and a communication device, which can reduce the surface space of a circuit board occupied by an airtight package, increase the number of chips that can be packaged on the circuit board, and improve the space utilization rate of the circuit board.

[0006] In the first aspect, the embodiment of the present application provides an electronic module, including a circuit board, a substrate, a housing, and a chip; the first conductive trace of the circuit board is electrically connected to the second conductive trace of the substrate, the circuit board has a first side wall along a direction perpendicular to the surface of the circuit board, the circuit board surface is used to fix electronic components, the substrate has a second side wall along a direction perpendicular to the surface of the substrate, the substrate surface is used to fix the chip, the first side wall and the second side wall face each other, that is, the first side wall and the second side wall are arranged side by side. An airtight package is formed between the substrate surface and the housing, the chip is located in the airtight package, and the chip is electrically connected to the first conductive trace or the second conductive trace.

[0007] According to the present invention, the substrate is used to form an airtight package, and the first side wall of the circuit board and the second side wall of the substrate face each other. Then, the circuit board is embedded in the substrate, or the circuit board and the substrate are arranged side by side, which reduces the overall height of the substrate and the circuit board, effectively reduces the surface space of the circuit board occupied by the substrate, increases the size of the circuit board surface used for packaging chips, increases the number of chips that can be packaged on the circuit board surface, and thereby improves the utilization rate of the circuit board surface space.

[0008] Based on the first aspect, in an optional implementation, the electronic module is illuminated by multiple projection lines, the circuit board has a first orthographic projection on the projection plane, and the substrate has a second orthographic projection on the projection plane. Each of the projection lines is parallel to the direction of the circuit board surface, and each of the projection lines is perpendicular to the projection plane. The second orthographic projection is within the coverage of the first orthographic projection.

[0009] By adopting the present implementation method, since the second orthographic projection corresponding to the substrate is located within the range of the first orthographic projection corresponding to the circuit board, the structure of the circuit board embedded in the substrate is ensured, or the structure of the circuit board and the substrate arranged side by side is ensured, which effectively reduces the surface space of the circuit board occupied by the substrate and improves the utilization rate of the surface space of the circuit board.

[0010] Based on the first aspect, in an optional implementation, the circuit board has a first area and a second area, a receiving cavity is formed between the first area and the second area, the substrate is located in the receiving cavity, and the inner side wall of the receiving cavity is the first side wall.

[0011] With this implementation, the substrate is located in the accommodating cavity between the first area and the second area, ensuring the structure of the circuit board embedded with the substrate, effectively reducing the surface space of the circuit board occupied by the substrate, and improving the utilization rate of the circuit board surface space.

[0012] Based on the first aspect, in an optional implementation, the accommodating cavity has a first cavity opening and a second cavity opening, the first cavity opening forms a first step, the second cavity opening forms a second step, the substrate is located between the first step and the second step, the first step includes a first conductive via, the first conductive via is respectively electrically connected to the first conductive trace and the second conductive trace, and / or the second step includes a second conductive via, the second conductive via is respectively electrically connected to the first conductive trace and the second conductive trace.

[0013] With this implementation, the substrate is located between the first step and the second step, ensuring the structure of the circuit board with the substrate embedded in it, effectively reducing the surface space of the circuit board occupied by the substrate, and ensuring successful power-on of the chip when the first conductive trace is electrically connected to the second conductive trace.

[0014] Based on the first aspect, in an optional implementation manner, the opening of the first conductive via is located between the first step and the substrate, or the opening of the first conductive via is located in the substrate.

[0015] With this implementation, based on the position of the opening of the first conductive via, the first conductive trace is electrically connected to the second conductive trace, thereby ensuring successful power-on of the chip.

[0016] Based on the first aspect, in an optional implementation, the first surface of the substrate includes a third conductive via, the third conductive via is electrically connected to the first conductive trace and the second conductive trace respectively, and the first surface of the substrate is connected to the shell.

[0017] With this implementation, the third conductive via ensures that the first conductive trace is electrically connected to the second conductive trace, thereby ensuring successful power-on of the chip.

[0018] Based on the first aspect, in an optional implementation, the circuit board and the substrate are arranged in sequence along a direction parallel to the surface of the circuit board, the first side wall is the side wall of the circuit board facing the substrate, and the second side wall is the side wall of the substrate facing the circuit board.

[0019] With this implementation, the circuit board is located on one side of the substrate, that is, the circuit board and the substrate are arranged in parallel, which reduces the overall height of the substrate and the circuit board, effectively reduces the surface space of the circuit board occupied by the substrate, increases the size of the circuit board surface used for packaging chips, increases the number of chips that can be packaged on the circuit board surface, and thereby improves the utilization rate of the circuit board surface space.

[0020] Based on the first aspect, in an optional implementation, the airtight package is formed between the first surface of the substrate and the shell, another chip is fixed on the second surface of the substrate, the first surface of the substrate and the second surface of the substrate are oriented opposite to each other, and the other chip is electrically connected to the first conductive trace or the second conductive trace.

[0021] With this implementation, the second surface of the substrate can also be used to fix another chip, thereby increasing the number of chips that can be packaged in the electronic module and improving the integration of the electronic module.

[0022] Based on the first aspect, in an optional implementation, the chip is a laser, the electronic module also includes a driving module, the laser is electrically connected to the driving module, and the driving module is used to drive the laser to emit an optical signal; the driving module is located inside the airtight package, on the first surface of the substrate and outside the airtight package, on the second surface of the substrate or on the first surface of the circuit board, the first surface of the substrate is connected to the shell, the first surface of the substrate and the second surface of the substrate face opposite to each other, and the first surface of the circuit board and the first surface of the substrate face the same direction.

[0023] By adopting this implementation method, a photoelectric conversion module can be protected, and the overall height of the substrate and the circuit board is reduced, thereby improving the integration of the photoelectric conversion module.

[0024] Based on the first aspect, in an optional implementation, the electronic module further includes a semiconductor cooler TEC, the TEC is used to dissipate heat from the laser, the TEC is located on the second surface of the substrate, and the TEC is electrically connected to the first conductive trace or the second conductive trace.

[0025] By adopting this implementation, when the TEC is located on the second surface of the substrate, the signal quality of the electrical signal sent by the driving module to the laser is improved.

[0026] Based on the first aspect, in an optional implementation, the electronic module also includes a semiconductor cooler TEC, which is used to dissipate heat from the laser. The TEC is located in the airtight package, and the TEC is located on the first surface of the substrate, and the laser is located on the surface of the TEC facing the shell.

[0027] When the TEC is fixed inside the airtight package by this implementation, the TEC will raise the height of the laser. To this end, the height of the coupling component can be raised by a spacer to ensure that the coupling component is located on the transmission optical path of the optical signal emitted by the laser. A cavity for fixing the coupling component can also be provided on the surface of the substrate. The cavity can reduce the height of the coupling component to ensure that the coupling component is located on the transmission optical path of the optical signal emitted by the laser. As shown in this implementation, the TEC is located inside the airtight package formed between the shell and the substrate, thereby improving the reliability of the TEC and improving the efficiency of the TEC in controlling the temperature of the laser.

[0028] Based on the first aspect, in an optional implementation, the chip is an electrical chip.

[0029] By adopting this implementation method, the electric chip can be protected by airtight packaging, and the overall height of the substrate and the circuit board is reduced, thereby improving the integration of the electronic module including the electric chip.

[0030] Based on the first aspect, in an optional implementation, the driving module is located on the circuit board near the gold finger.

[0031] In this implementation, the gold finger is used to realize a pluggable connection with the processor in the communication device. The gold finger is electrically connected to the first conductive trace of the circuit board. When the driving module is located near the gold finger of the circuit board, it is beneficial to reduce the transmission distance of the electric signal between the processor and the driving module, and reduce the transmission loss of the electric signal.

[0032] In a second aspect, an embodiment of the present application provides a carrier board, comprising a circuit board and a substrate; the first conductive trace of the circuit board is electrically connected to the second conductive trace of the substrate, the circuit board has a first side wall along a direction perpendicular to the surface of the circuit board, and the surface of the circuit board is used to fix electronic components, the substrate has a second side wall along a direction perpendicular to the surface of the substrate, and the surface of the substrate is used to fix the chip, and the first side wall and the second side wall face each other.

[0033] For the description of the beneficial effects of this aspect, please refer to the first aspect and the details will not be repeated here.

[0034] Based on the second aspect, in an optional implementation, the circuit board has a first area and a second area, a receiving cavity is formed between the first area and the second area, the substrate is located in the receiving cavity, and the inner side wall of the receiving cavity is the first side wall.

[0035] Based on the second aspect, in an optional implementation, the accommodating cavity has a first cavity opening and a second cavity opening, the first cavity opening forms a first step, the second cavity opening forms a second step, the substrate is located between the first step and the second step, the first step includes a first conductive via, the first conductive via is respectively electrically connected to the first conductive trace and the second conductive trace, and / or the second step includes a second conductive via, the second conductive via is respectively electrically connected to the first conductive trace and the second conductive trace.

[0036] Based on the second aspect, in an optional implementation manner, the opening of the first conductive via is located between the first step and the substrate, or the opening of the first conductive via is located in the substrate.

[0037] Based on the second aspect, in an optional implementation, the surface of the substrate includes third conductive vias, and the third conductive vias are electrically connected to the first conductive trace and the second conductive trace respectively.

[0038] Based on the second aspect, in an optional implementation, the circuit board and the substrate are arranged in sequence along a direction parallel to the surface of the circuit board, the first side wall is the side wall of the circuit board facing the substrate, and the second side wall is the side wall of the substrate facing the circuit board.

[0039] In the third aspect, the embodiment of the present application provides a photoelectric conversion module, the photoelectric conversion module includes the electronic module as described in any one of the first aspects above, the electronic module includes a transmitting component and a receiving component, the transmitting component includes the chip located in the airtight package, the chip is a laser; the transmitting component is used to receive a first electrical signal, convert the first electrical signal into a first optical signal, and emit the first optical signal; the receiving component is used to receive a second optical signal and convert the second optical signal into a second electrical signal. For the description of the beneficial effects of this aspect, please refer to the first aspect, and no further details will be given.

[0040] In a fourth aspect, an embodiment of the present application provides an electrical module, which includes an electronic module as described in any one of the first aspects above, wherein the chip located in the airtight package is an electrical chip, and the electronic module also includes a transmitting circuit, which is electrically connected to the electrical chip; the electrical chip is used to receive electrical signals and process the electrical signals to obtain processed electrical signals, and the transmitting circuit is used to emit the processed electrical signals.

[0041] In a fifth aspect, an embodiment of the present application provides a communication device, the communication device comprising an outer shell, a processor, and a photoelectric conversion module as described in the third aspect, the outer shell is used to fix the processor and the photoelectric conversion module, the processor is electrically connected to the photoelectric conversion module; the processor is used to send the first electrical signal to the transmitting component, and is used to receive the second electrical signal from the receiving component. For the description of the beneficial effects of this aspect, please refer to the first aspect, and no further details will be given.

[0042] In a sixth aspect, an embodiment of the present application provides a communication device, comprising an outer shell, a processor, and an electrical module as described in the fourth aspect, wherein the processor and the electronic module are fixed inside the outer shell, and the processor is electrically connected to the electrical module; the processor is used to send an electrical signal to the electrical module, and / or the processor is used to receive an electrical signal from the electrical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a side view structural example diagram of an existing photoelectric conversion module;

[0044] Figure 2 An example diagram of the structure of the optical communication system provided in this application;

[0045] Figure 3 A side view structural example diagram of the first embodiment of the photoelectric conversion module provided in the present application;

[0046] Figure 4 for Figure 3 An example diagram of a top view structure of a photoelectric conversion module shown;

[0047] Figure 5a for Figure 3 An example diagram of the positional relationship between the circuit board and the substrate shown;

[0048] Figure 5b for Figure 5a The projection example diagram shown;

[0049] Figure 5c for Figure 5b An example of an orthographic projection is shown;

[0050] Figure 6 A side view structural example diagram of a second embodiment of the photoelectric conversion module provided in the present application;

[0051] Figure 7 This is a side view structural example diagram of the third embodiment of the photoelectric conversion module provided in the present application;

[0052] Figure 8 This is a side view structural example diagram of the fourth embodiment of the photoelectric conversion module provided in the present application;

[0053] Fig. 9 This is a side view structural example diagram of the fifth embodiment of the photoelectric conversion module provided in the present application;

[0054] Fig.10 This is a side view structural example diagram of the sixth embodiment of the photoelectric conversion module provided in the present application;

[0055] Fig.11 This is a side view structural example diagram of the seventh embodiment of the photoelectric conversion module provided in the present application;

[0056] Fig.12 This is a side view structural example diagram of the eighth embodiment of the photoelectric conversion module provided in the present application;

[0057] Fig.13a An example diagram of an embodiment of the assembly process provided in this application;

[0058] Fig.13b for Fig.13a Example diagram of the subsequent process of the provided example diagram;

[0059] Fig.14 This is a side view structural example diagram of the ninth embodiment of the photoelectric conversion module provided in the present application;

[0060] Fig.15 This is an example diagram of the structure of an embodiment of the communication device provided in this application. DETAILED DESCRIPTION

[0061] The embodiment of the present application provides an electronic module, which includes a circuit board and a hermetic package. The embodiment can reduce the surface space of the circuit board occupied by the hermetic package, increase the number of chips that can be packaged on the circuit board, and improve the space utilization rate of the circuit board. The electronic module shown in this embodiment can be applied to an optical communication system. Figure 2 This is a diagram showing an example of the structure of the optical communication system provided in this application.

[0062] The optical communication system 200 includes a core node (central point, CP) 201 and multiple access nodes (access point, AP) 202 connected to CP201. CP201 ​​can be connected to multiple APs through one or more optical splitters. This example does not limit the number of APs included in the optical communication system 200. For example, the optical communication system 200 includes three AP102 as an example. CP201 ​​sends a downlink service optical signal to AP202, and can also receive an uplink service optical signal from AP202. This example does not limit the networking type of the optical communication system. For example, the optical communication system can adopt a ring network or a star network, etc., and there is no specific limitation. This example does not limit the network to which the optical communication system 200 is applied. For example, if the optical communication system 200 shown in this example is applied to a passive optical network (PON), the AP can be an optical network unit (ONU) or an optical network terminal (ONT). The core node CP201 ​​may be an optical line terminal (OLT), a switch (e.g., a core layer switch, a layer 2 switch) or a router, etc. If the optical communication system 200 is applied to an optical transport network (OTN), both the CP and the AP may be OTN devices. The optical communication system 200 shown in this example may also be applied to a data center network (DCN), a metropolitan area network, etc., without specific limitation. The device type of each communication device (e.g., CP201 ​​or AP202) included in the optical communication system 200 shown in this example is not limited. For example, the communication device may be a wireless base station, a wireless remote access device, a wireless baseband signal processing device, a computing server (referred to as a server), a high performance computer (HPC), a storage server or a memory resource pool, etc., without specific limitation.

[0063] In this embodiment, the electronic module is a photoelectric conversion module as an example, and the photoelectric conversion module can also be called an optical module. The packaging type of the photoelectric conversion module shown in this embodiment can be a transistor-outline can (TO CAN) or a butterfly box (BOX) package, etc., which is not specifically limited in this embodiment.

[0064] For example, Figure 2 The communication device shown (e.g., CP201 ​​or AP202) includes an optoelectronic conversion module. The optoelectronic conversion module included in CP201 ​​converts a downlink service electrical signal into a downlink service optical signal and outputs it to AP202. The optoelectronic conversion module included in AP202 converts a downlink service optical signal into a downlink service electrical signal. The optoelectronic conversion module included in AP202 converts an uplink service electrical signal into an uplink service optical signal and outputs it to CP201. The optoelectronic conversion module included in CP201 ​​converts an uplink service optical signal into an uplink service electrical signal.

[0065] Figure 3 This is a side view structural example diagram of the first embodiment of the photoelectric conversion module provided in the present application. Figure 4 for Figure 3 The photoelectric conversion module 300 shown in this embodiment includes a circuit board 301, a substrate 302, a housing 303 and a chip. Figure 3 The side view of the photoelectric conversion module 300 shown is a structural diagram of the photoelectric conversion module 300 in a first plane XY. The first plane XY includes a first direction X and a second direction Y, the second direction Y is a direction perpendicular to the surface of the circuit board 301, the first direction X is a direction of the length of the circuit board 301, and the first direction X is perpendicular to the second direction Y. Figure 4 The top view of the photoelectric conversion module 300 is a structural diagram of the photoelectric conversion module 300 in the second plane XZ. The second plane XZ includes a first direction X and a third direction Z, the third direction Z is the direction of the width of the circuit board 301, and the third direction Z is perpendicular to the first direction X and the second direction Y respectively.

[0066] The present embodiment does not limit the type of the circuit board 301. For example, the circuit board 301 may be a printed circuit board (PCB) or an organic substrate. The circuit board 301 includes one or more layers of plates, and the single-sided or double-sided layout of each plate is used for the first conductive trace 311. The present embodiment does not limit the type of the plate. For example, the plate may be a paper base, a glass fiber cloth base, a composite base, a ceramic base, a metal core base, etc. The material of the substrate 302 may be ceramic or glass, etc. The specific type of ceramic may be low temperature co-fired ceramic (LTCC), high temperature co-fired ceramic (HTCC) or aluminum nitride (AIN) ceramic, etc. In the present embodiment, the substrate 302 is taken as a ceramic substrate as an example. The substrate 302 includes one or more ceramic plates. The single-sided or double-sided layout of each ceramic plate is used for the second conductive trace 321. The substrate 302 made of ceramic material has good chemical stability, oxidation resistance, electrical insulation, high thermal conductivity, high strength and low coefficient of thermal expansion (CTE), and the CTE of the substrate 302 is close to that of the optical chip. An airtight package 400 is formed between the substrate 302 and the shell 303 shown in this embodiment. The airtight package 400 refers to a package with a cavity structure formed between the substrate 302 and the shell 303. The cavity structure is filled with high-purity nitrogen or other inert gases. The airtight package 400 is used to package the chip, which can effectively prevent pollutants (liquid, fixed or gas) from infiltrating and corroding the chip, thereby improving the reliability of the chip. Specifically, along the second direction Y, the substrate 302 has a first surface and a second surface. The first surface of the substrate 302 faces the shell 303, so that the airtight package 400 is formed between the first surface of the substrate 302 and the shell 303. In this embodiment, the substrate 302 is a ceramic substrate as an example. The ceramic substrate has good airtightness, thereby improving the airtightness of the airtight package. In this embodiment, the chip in the airtight package 400 is an optical chip, which includes a transmitting component (for example, the transmitting component includes a laser and other devices). The ceramic substrate has high strength, and the CTE of the ceramic substrate is close to that of the optical chip, so that the ceramic substrate is not easy to deform, and will not change the optical path of the optical signal emitted by the transmitting component, thereby ensuring the stability of the optical signal emitted by the transmitting component.

[0067] The surface of the circuit board 301 is used to package various types of electronic components. This embodiment can effectively reduce the surface space occupied by the substrate 302 of the circuit board 301. Figures 3 to 5a The positional relationship between the circuit board 301 and the base plate 302 will be described. Figure 5a for Figure 3 The circuit board 301 and the substrate 302 are shown in the figure as an example of the positional relationship between the circuit board 301 and the substrate. In this embodiment, the circuit board 301 is embedded in the substrate 302, thereby reducing the surface space of the circuit board 301 occupied by the substrate 302. The structure of the circuit board 301 embedded in the substrate 302 is described below:

[0068] The circuit board 301 specifically includes a first area 312 and a second area 313 arranged along a first direction X. A receiving cavity is formed between the first area 312 and the second area 313. The receiving cavity runs through the circuit board 301 along the second direction Y. The substrate 302 is located in the receiving cavity of the circuit board 301. It can be understood that when the substrate 302 is located in the receiving cavity inside the circuit board 301, the purpose of embedding the substrate 302 in the circuit board 301 is achieved. Specifically, the receiving cavity of the circuit board 301 has a first cavity opening 501 and a second cavity opening 502 along the second direction Y. The substrate 302 is arranged between the first cavity opening 501 and the second cavity opening 502. It can be understood that along the first direction X, the substrate 302 is located between the first area 312 and the second area 313. The inner side wall of the receiving cavity of the circuit board 301 is a first side wall 511, and the first side wall 511 extends along the second direction Y. The outer periphery of the substrate 302 has a second side wall 512 extending along the second direction Y. Because the substrate 302 is located inside the accommodating cavity, the first side wall 511 of the circuit board 301 and the second side wall 512 of the substrate 302 face each other along the first direction X, that is, the first side wall 511 of the circuit board 301 and the second side wall 512 of the substrate 302 are arranged side by side along the first direction X. Figure 5b as well as Figure 5c The structure in which the first side wall 511 of the circuit board 301 and the second side wall 512 of the substrate 302 face each other is described as follows: Figure 5b for Figure 5a The projection example shown is Figure 5c for Figure 5b The orthographic projection example diagram is shown. If the photoelectric conversion module is illuminated by multiple projection lines 531, the circuit board 301 has a first orthographic projection 533 on the projection plane 532, and the substrate 302 has a second orthographic projection 534 on the projection plane 532. Each projection line 531 is parallel to the first direction X, and each projection line 531 is perpendicular to the projection plane. The projection plane includes a second direction Y and a third direction Z. When the first side wall 511 of the circuit board 301 and the second side wall 512 of the substrate 302 face each other, the second orthographic projection 534 is located within the coverage range of the first orthographic projection 533. Because the first side wall 511 of the circuit board 301 and the second side wall 512 of the substrate 302 face each other along the first direction X, the structure of the circuit board 301 embedded in the substrate 302 is effectively guaranteed, and the overall height of the substrate 302 and the circuit board 301 is effectively reduced.

[0069] The substrate 302 shown in this embodiment is used to form an airtight package 400, and the circuit board 301 is embedded with the substrate 302, which effectively reduces the surface space of the circuit board 301 occupied by the substrate 302, increases the size of the surface of the circuit board 301 used for packaging chips, increases the number of chips that can be packaged on the surface of the circuit board 301, and thereby improves the utilization rate of the surface space of the circuit board 301.

[0070] This embodiment does not limit the type of chip in the airtight package 400. Figure 3In the example shown, the chip encapsulated in the airtight package 400 is an optical chip, and the optical chip is a transmitting component, which includes a laser 401 and a coupling component, and the coupling component is used to successfully emit the optical signal emitted by the laser 401 from the photoelectric conversion module. The coupling component includes a first lens group 402, an isolator 403, a second lens group 404, and an output optical fiber 405. The description of the coupling component structure in this embodiment is not limited. For example, the coupling component may also include a reflector for changing the optical path. The laser 401 is electrically connected to the second conductive trace 321 of the substrate 302. Among them, electrical connection refers to a circuit connection with physical contact. For example, the laser 401 is electrically connected to the second conductive trace 321 through a conductive wire (such as a gold wire, etc.). This embodiment does not limit the way in which the laser 401 is electrically connected to the second conductive trace 321. The laser 401 can be electrically connected to the second conductive trace 321 by means of a solder ball or silver paste. An electric chip is arranged on the surface of the circuit board 301, and the electric chip can be a driver (Driver, DRV) 332. The driver module 332 is electrically connected to the first conductive trace 311 of the circuit board 301. Moreover, the first conductive trace 311 of the circuit board 301 is electrically connected to the second conductive trace 321 of the substrate 302, so the driver module 332 is electrically connected to the laser 401, so that the driver module 332 can drive the laser 401 to emit an optical signal. Specifically, the laser 401 is electrically connected to the second conductive trace 321 located on the first surface of the substrate 302, and the driver module 332 is electrically connected to the first conductive trace 311 located on the first surface of the circuit board 301, so as to ensure the electrical connection between the laser 401 and the driver module 332. Among them, the first surface of the circuit board 301 is the surface of the circuit board 301 facing the airtight package 400, and the second surface of the circuit board 301 is the surface of the circuit board 301 facing away from the airtight package 400. In this embodiment, the laser 401, the conductive wire, the second conductive trace 321, the first conductive trace 311 and the driving module 332 are electrically connected in sequence as an example. In other examples, the laser 401 can also be welded to the first surface of the substrate 302 by flip-chip welding to realize that the laser 401 is directly electrically connected to the second conductive trace 321. For another example, the conductive wire connected to the laser 401 is electrically connected to the first conductive trace 311 of the circuit board 301. When the driving module 401 drives the laser 401 to emit light, the first lens group 402 is used to collimate the optical signal emitted by the laser 401 and transmit the collimated optical signal to the isolator 403. The collimated optical signal is transmitted to the second lens group 404 through the isolator 403, and the second lens group 404 converges the optical signal to the output optical fiber 405. In this embodiment, the output optical fiber 405 is located on the housing 303. For example, the housing 303 includes structures such as a penetration, a connector or a penetration joint for connecting the output optical fiber 405.

[0071] It should be noted that this embodiment does not limit the position where the transmitting component is disposed on the circuit board 301 and the substrate 302 . Figure 6 This is a side view of the structure of the second embodiment of the photoelectric conversion module provided in this application. For the description of the circuit board 601, substrate 602, airtight package 603 and transmitting assembly shown in this embodiment, please refer to Figures 3 to 5a The corresponding description is not repeated in detail. In this embodiment, the output optical fiber 611 of the transmitting assembly is arranged on the housing. In this embodiment, in order to realize that the optical signal emitted by the laser located in the airtight package 603 can be successfully transmitted to the output optical fiber 611, the housing of the airtight package 603 can be made of a light-transmitting material, such as glass. The housing can also be made of a metal material. The housing includes a lower housing and an upper housing, the lower housing is assembled to the first surface of the substrate, and the upper housing is assembled to the lower housing. Laser or resistance welding can be used between the upper housing and the lower housing.

[0072] Figure 7 This is a side view structural example diagram of the third embodiment of the photoelectric conversion module provided in the present application. Figure 7 The transmitter components and Figure 3 The difference between the transmitter components shown is that Figure 3 As shown, all components of the transmitting assembly are placed in a hermetic package. Figure 7 As shown, some components of the transmitting assembly are located in the airtight package 703. For the description of the circuit board 701, substrate 702, airtight package 703 and transmitting assembly shown in this embodiment, please refer to Figures 3 to 5a The corresponding instructions are not elaborated in detail. Figure 7 The laser 711 and the first lens group 712 are packaged in the airtight package 703 as an example, and the isolator 713, the second lens group 714 and the output optical fiber 715 are arranged outside the airtight package 703 and are located on the first surface of the substrate 302. The laser 711 including at least a transmitting component is located inside the airtight package 703 shown in this embodiment. In order to ensure that the optical signal emitted by the laser 711 can be successfully transmitted to the output optical fiber 715, the shell of the airtight package 703 can be made of a light-transmitting material, such as glass.

[0073] Figure 8 This is a side view structural example diagram of the fourth embodiment of the photoelectric conversion module provided in the present application. Figure 8 The embodiments shown and Figure 3 The embodiment shown differs in that Figure 3 The structure of the housing shown is different from Figure 8 The structure of the housing shown in the figure. For the description of the circuit board 801, substrate 802, airtight package and transmitting assembly shown in this embodiment, please refer to the corresponding description of 7, and no further details will be given. It should be clear that the description of the position of the transmitting assembly in this embodiment is not limited. For example, the transmitting assembly can also be arranged according to Figure 3 The shell 803 shown in this embodiment has a light hole 804. The light hole 804 is located on the transmission optical path of the optical signal emitted by the laser. It can be understood that the optical signal emitted by the laser can be transmitted to the isolator through the light hole 804. The light hole 804 shown in this embodiment is covered with a seal 805. The seal 805 is made of a light-transmitting material such as glass, sapphire, etc., and is welded to the light hole 804 to form an airtight package. This embodiment does not limit the specific welding position of the seal 805, for example Figure 8 The seal 805 is welded to the outer hole of the light-through hole 804 as an example. In other examples, the seal 805 can be welded to the inner hole of the light-through hole 804. The outer hole and the inner hole of the light-through hole 804 are connected to each other and are located between the isolator and the first lens group in sequence.

[0074] Fig. 9 This is a side view structural example diagram of the fifth embodiment of the photoelectric conversion module provided in the present application. Fig. 9 The embodiments shown and Figure 7 The embodiment shown differs in that Fig. 9 The device shown can protect the transmitting component outside the airtight package. For the description of the circuit board 901, substrate 902, airtight package 903 and transmitting component shown in this embodiment, please refer to Figure 3 The corresponding description is not repeated in detail. This embodiment takes the isolator 904, the second lens group 905 and the output optical fiber 906 as an example where the isolator 904, the second lens group 905 and the output optical fiber 906 are located outside the airtight package 903. For the description of the structure of the airtight package 903, please refer to Figure 7 or Figure 8 The corresponding description is not repeated in detail. It can be understood that the optical signal emitted by the laser shown in this embodiment can pass through the shell of the airtight package 903 and be transmitted to the isolator 904. In order to prevent the devices of the transmitting assembly exposed outside the airtight package 903 from being immersed in pollutants and corroding the chip, and to improve the reliability of the transmitting assembly, the photoelectric conversion module shown in this embodiment also includes a protective shell 911. The protective shell 911 is arranged on the first surface of the substrate 902, and the cover is arranged on the isolator 904, the second lens group 905 and the output optical fiber 906. The protective shell 911 can achieve dustproof and other protection purposes for the devices of the transmitting assembly such as the isolator 904, the second lens group 905 and the output optical fiber 906. The protective shell 911 can be bonded to the first surface of the substrate 902 by glue or the like.

[0075] In the above embodiments (for example Figure 3 as well as Figure 4), taking the example of an electrical chip (such as a driver module 332) being located on the first surface of the circuit board 301, specifically, the driver module 332 is located at a position on the circuit board 301 close to the gold finger 350. The gold finger 350 is used to achieve a pluggable connection with a processor in a communication device. The gold finger 350 is electrically connected to the first conductive trace of the circuit board 301. In the case where the driver module 332 is located at a position on the circuit board 301 close to the gold finger 350, it helps to reduce the transmission distance of the electrical signal transmitted between the processor and the driver module 332, and reduce the transmission loss of the electrical signal. This embodiment shows that the driver module 332 is located outside the airtight package and on the first surface of the substrate as an example. In other examples, the driver module 332 may also be located inside the airtight package, outside the airtight package and at any position on the first surface of the substrate.

[0076] The circuit board 301 shown in this embodiment can also be used to package other types of electrical chips, such as transimpedance amplifiers (TIA), microcontroller units (MCU), optical digital signal processors (oDSP), avalanche photodiodes (APD) or photodiodes (PD), etc. Taking MCU as an example, the MCU333 is located on the second surface of the substrate 302. It can be understood that the first surface of the substrate 302 shown in this embodiment is used to form an airtight package 400, and the second surface of the substrate 302 is used to package electrical chips (such as MCU333). Because the second surface of the substrate 302 shown in this embodiment can also be used to package chips, the space used for packaging chips is increased, thereby improving the space utilization of the optoelectronic conversion module. In this embodiment, electrical chips can also be packaged in the airtight package 400. For example, at least part of the components of the receiving component are encapsulated in the airtight package 400. The receiving component is used to receive optical signals from another optoelectronic conversion module. For example Figure 4As shown, it is taken as an example that the receiving components are all located in the airtight package 400. The receiving components include an input optical fiber 410, a third lens group 411, an APD412 and a TIA413. APD412 and TIA413 are electrically connected to the first conductive trace or the second conductive trace, respectively. For the specific electrical connection instructions, please refer to the instructions for the electrical connection between the laser 401 and the first conductive trace or the second conductive trace, and the details are not repeated here. The input optical fiber 410 transmits the received optical signal to the third lens group 411, and the third lens group 411 converges the optical signal to APD412. APD412 is used to perform photoelectric conversion on the optical signal to obtain an electrical signal. This embodiment takes the photoelectric conversion performed by APD412 as an example. In other examples, the photoelectric conversion can also be performed by PD, which is not specifically limited. TIA amplifies the power of the electrical signal from APD412. In this embodiment, the example in which all components of the receiving assembly are located in the airtight package 400 is taken. In other examples, some components of the receiving assembly are located in the airtight package 400, and other components are located outside the airtight package 400 (for example, located on the first surface of the circuit board 301, or on the second surface of the substrate 302), etc., which is not specifically limited in this embodiment.

[0077] The following describes an optional structure of electrical connection between the second conductive trace 321 of the substrate 302 and the first conductive trace 311 of the circuit board 301:

[0078] Optional structure 1, see Figure 5aAs shown, the first cavity 501 of the circuit board 301 receiving cavity forms a first step 521. The second cavity 502 of the circuit board 301 receiving cavity forms a second step 522. It can be understood that in order to achieve the purpose of embedding the substrate 302 in the circuit board 301, the substrate 302 is located between the first step 521 and the second step 522. The first step 521 includes a first conductive via 523, and the first conductive via 523 extends along the second direction Y. The first conductive via 523 is electrically connected to the first conductive trace 311 of the circuit board 301. Moreover, the opening of the first conductive via 523 is located between the first step 521 and the first surface of the substrate 302. The first surface of the substrate 302 includes a third conductive via 524. The third conductive via 524 extends along the second direction Y. The third conductive via 524 is electrically connected to the second conductive trace 312. Moreover, the opening of the third conductive via 524 is located between the substrate 302 and the first step 521. The opening of the first conductive via 523 contacts the opening of the third conductive via 524, thereby realizing the electrical connection between the first conductive via 523 and the third conductive via 524. The description of the electrical connection between the first conductive via 523 and the third conductive via 524 in this embodiment is an optional example and is not limited. For example, the first conductive via 523 is electrically connected to the third conductive via 524 through at least one of the first conductive trace 311 and the second conductive trace 321 located between the first surface of the substrate 302 and the first step 521. In this optional structure, the shell is fixed on the first surface of the substrate 302 by a sealing material to form an airtight package. The sealing material can be a conductive material or a non-conductive material, which is not specifically limited.

[0079] Optional structure 2: The difference between optional structure 2 and optional structure 1 is that the substrate 302 is not provided with the third conductive via 524, and the second conductive trace 312 of the substrate 302 extends between the substrate 302 and the first step 521. Then, the opening of the first conductive via 523 located between the first step 521 and the substrate 302 is directly electrically connected to the second conductive trace 312 located on the first surface of the substrate 302.

[0080] Optional structure 3: The difference between optional structure 3 and optional structure 1 is that the opening position of the first conductive via of the circuit board is different. Fig.10This is a side view structural example diagram of the sixth embodiment of the photoelectric conversion module provided in the present application. The opening of the first conductive via 1002 of the first step 1001 shown in this embodiment is located in the substrate 1003. Specifically, the opening of the first conductive via 1002 is drilled deep into the interior of the substrate 302 by controlled depth drilling and electroplating. The opening of the first conductive via 1002 is drilled deep into the interior of the substrate 302 and is electrically connected to the opening of the second conductive via in the interior of the substrate 302. For the description of the opening of the second conductive via, please refer to the optional structure 1, and the details are not repeated here. The opening of the first conductive via 1002 is drilled deep into the interior of the substrate 302 and is directly electrically connected to the second conductive trace in the interior of the substrate 302.

[0081] Optional structure 4, see Figure 5a As shown, the second step 522 includes a second conductive via 525, and the opening of the second conductive via 525 is located between the second step 522 and the second surface of the substrate 302. The second surface of the substrate 302 includes a fourth conductive via 526. The fourth conductive via 526 is electrically connected to the second conductive trace 312. Moreover, the opening of the fourth conductive via 526 is located between the second surface of the substrate 302 and the second step 522. The opening of the second conductive via 525 contacts the opening of the fourth conductive via 526, thereby realizing the electrical connection between the second conductive via 525 and the fourth conductive via 526. It can be understood that the description of the electrical connection between the second conductive via 525 and the fourth conductive via 526 can refer to the description of the electrical connection between the first conductive via 523 and the third conductive via 524 shown in the optional structure 1, and the specific details are not repeated.

[0082] Optional structure 5. The difference between optional structure 5 and optional structure 4 is that the fourth conductive via 526 is not set on the substrate 302, and the second conductive trace 312 of the substrate 302 extends between the substrate 302 and the second step 522. Then, the second conductive via 525 located between the second step 522 and the second surface of the substrate 302 is directly electrically connected to the second conductive trace 312.

[0083] Optional structure 6, the difference between optional structure 6 and optional structure 5 is that the opening position of the second conductive via 524 of the circuit board 301 is different. The opening of the second conductive via 525 of the second step 522 is located in the substrate 302. For details, please refer to the optional structure 3 above, and no further description is given.

[0084] Optional structure 7, the difference between this optional structure and the above optional structure is that the first conductive trace and the second conductive trace shown in this optional structure do not need to be electrically connected through a conductive via. In this example, the shell included in the photoelectric conversion module can be made of a conductive material (such as metal, etc.), and the shell can also be made of a non-conductive material (such as glass, etc.). An airtight package is formed between the shell and the substrate through a non-conductive sealing material. The first conductive trace of the circuit board shown in this structure is directly electrically connected to the second conductive trace of the substrate. For example, the first conductive trace located on the first surface of the circuit board is electrically connected to the second conductive trace located on the first surface of the substrate. For another example, the first conductive trace located inside the circuit board is electrically connected to the second conductive trace located inside the substrate.

[0085] The photoelectric conversion module shown in this embodiment also includes a thermoelectric cooler (TEC). Figure 3 As shown, the second surface of the substrate 302 is encapsulated with TEC360. TEC360 is electrically connected to the first conductive trace or the second conductive trace. For example, TEC360 is electrically connected to the first conductive trace or the second conductive trace through a cable. In another example, TEC360 is directly electrically connected to the first conductive trace or the second conductive trace. TEC360 is used to control the temperature of the laser 401 within a preset range to ensure the stability of the wavelength of the optical signal emitted by the laser 401. Moreover, when the TEC is located on the second surface of the substrate, the signal quality of the electrical signal sent by the driving module to the laser is improved.

[0086] Fig.11 This is a side view structural example diagram of the seventh embodiment of the photoelectric conversion module provided in the present application. Fig.11 The embodiment shown is Figure 3 The difference between the embodiments shown is that the packaging position of the TEC is different. For the description of the circuit board 1101, substrate 1102, housing 1104, transmitting assembly and driving module 1103 shown in this embodiment, please refer to Figure 3 The corresponding description is not repeated in detail. The TEC1111 shown in this embodiment is located inside the airtight package formed between the shell 1104 and the substrate 1102, thereby improving the reliability of TEC1111 and improving the efficiency of TEC1111 in controlling the temperature of the laser 1112. Specifically, TEC1111 is located on the first surface of the substrate 1102 and inside the airtight package formed by the shell 1104. The laser 1112 is located on the surface of the TEC1111 facing the shell 1104. It can be understood that because the laser 1112 is located on the surface of the TEC1111, the height of the laser 1112 will be increased. In order to ensure that the optical signal emitted by the laser 1112 can be successfully emitted from the optoelectronic conversion module, it is necessary to ensure that the coupling component is located on the transmission optical path of the optical signal emitted by the laser 1112. For a description of the coupling component, please refer to. Figure 3 The corresponding description is not repeated in detail. The photoelectric conversion module shown in this embodiment also includes a pad 1121, which is located inside the airtight package and on the first surface of the substrate 1102. The pad 1121 is used to encapsulate the coupling component. It can be understood that when the coupling component is located on the surface of the pad 1121, the height of the coupling component can be raised, so that the coupling component can be adjusted to the optical path of the optical signal emitted by the laser 1111. The material of the pad 1121 shown in this embodiment may be the same as the material of the substrate 1102. The pad 1121 and the substrate 1102 can be integrally formed, and can also be fixed to the first surface of the substrate 1102 by bonding or welding.

[0087] Fig.12 This is a side view structural example diagram of the eighth embodiment of the photoelectric conversion module provided in the present application. Fig.12 The embodiment shown is Fig.11 The difference between the embodiments shown is that the substrate structure is different. For the description of the circuit board 1201, the housing 1204, the transmitting component and the driving module 1203 shown in this embodiment, please refer to Fig.11 The corresponding description is not repeated in detail. The first surface of the substrate 1202 shown in this embodiment is concavely provided with a cavity 1220. The TEC 1211 and the laser 1212 are located in the cavity 1220. For the description of the positional relationship of the TEC 1211 and the laser 1212 in the cavity 1220, please refer to Fig.11 It is understood that since the laser 1212 is located on the surface of the TEC 1211, the height of the laser 1212 will be increased, and the TEC 1211 and the laser 1212 are arranged in the cavity 1220, the height of the laser 1212 will be reduced to ensure that the coupling component is located on the transmission optical path of the optical signal emitted by the laser 1212. For the description of the coupling component, please refer to Figure 3 Optionally, the cavity 1220 shown in this embodiment may also include a pad to ensure that the coupling component is located on the transmission optical path of the optical signal emitted by the laser 1212. For a description of the pad, see Fig.11 The corresponding instructions are not elaborated in detail.

[0088] The embodiment of the present application further provides an assembly method, which is used to assemble the photoelectric conversion module shown in the above embodiment. Fig.13a This is an example diagram of an embodiment of the assembly process provided in this application.

[0089] Step 1301, assemble the loading board.

[0090] The carrier shown in this embodiment includes a circuit board and a substrate embedded in the circuit board. The description of the carrier structure is as shown in the above embodiment, and no further details are given.

[0091] Step 1302: Assemble the electronic chip on the carrier board.

[0092] The type of the electric chip shown in this embodiment and the position of the electric chip on the carrier are described in the above embodiment, and the details are not repeated here. The electric chip shown in this embodiment can be assembled by surface mounted technology (SMT).

[0093] Step 1303: Assemble the lower shell and the transmitting assembly on the substrate.

[0094] Fig.13b for Fig.13a The example diagram of the subsequent process of the example diagram provided. As shown in this embodiment, the lower shell 1311 and the transmitting component are assembled on the substrate. For the description of the transmitting component, please refer to the above embodiment, and no further details are given. It should be clear that the lower shell can also be assembled on the substrate during the execution of step 1301 or step 1302 as shown in this embodiment, and no specific limitation is made. The following describes the way in which the lower shell 1311 is fixed to the first surface of the substrate: for example, the shell is a conductive material. The conductive material may be an iron-nickel-cobalt alloy (Kovar) or stainless steel. Based on the reflow soldering method, the lower shell 1311 is soldered to the first surface of the substrate by solder. Among them, the solder may be tin (Sn) silver (Ag) copper (Cu) 305, solder paste (SnBiAg) or gold-tin alloy (AuSn), etc. For another example, the shell is a non-conductive material. The non-conductive material is glass, etc. Based on laser welding or resistance welding, the lower shell 1311 is soldered to the first surface of the substrate by glass solder. This embodiment takes the assembly of the emission component into the photoelectric conversion module in step 1303 as an example. In other examples, at least part of the components of the emission component may be assembled into the carrier during the execution of step 1302 .

[0095] Step 1304: Assemble the upper shell on the lower shell.

[0096] In order to form an airtight package, it is necessary to package the upper shell on the lower shell to form an airtight package. For the description of the airtight package, please refer to the above embodiment, and the details will not be repeated here. Specifically, the welding process for forming an airtight package between the upper shell and the lower shell can be laser welding or resistance welding. In this embodiment, the output optical fiber of the transmitting assembly is welded to the shell. For example, the output optical fiber and the shell are fixed by glass welding or laser welding. Alternatively, if the output optical fiber is a metal optical fiber, then the metal optical fiber and the shell are fixed by resistance welding or laser welding.

[0097] Step 1305: assemble the photoelectric conversion module.

[0098] The carrier board assembled through step 1301 to step 1304 is packaged into a housing to achieve successful assembly of the photoelectric conversion module.

[0099] It should be clear that the above assembly process is an example, and the execution sequence is not limited. As long as the assembly process can be used to assemble the photoelectric conversion module shown in the above embodiment, it will be fine.

[0100] Fig.14 This is a side view structural example diagram of the ninth embodiment of the photoelectric conversion module provided in the present application. The positional relationship between the circuit board and the substrate in the photoelectric conversion module shown in this embodiment is different from that in the above-mentioned embodiments. The photoelectric conversion module 1400 shown in this embodiment includes a circuit board 1401, a substrate 1402, a shell 1403 and an emission component. For the description of the airtight package formed by the shell 1403 for setting the emission component in this embodiment, please refer to the above-mentioned embodiments, and the details will not be repeated. The circuit board 1401 and the substrate 1402 shown in this embodiment are arranged along the first direction X. It can be understood that Figure 3 In the embodiment shown, the circuit board is embedded in the substrate, and in this embodiment, the circuit board 1401 and the substrate 1402 are arranged side by side along the first direction. Specifically, the circuit board 1401 shown in this embodiment has a first side wall 1411 extending along the second direction Y, and the substrate 1402 has a second side wall 1412 extending along the second direction Y, and the first side wall 1411 and the second side wall 1412 face each other. The first side wall 1411 is the outer side wall of the circuit board 1401 facing the substrate 1402, and the second side wall 1412 is the outer side wall of the substrate 1402 facing the circuit board 1401. For a description of the structure in which the first side wall 1411 and the second side wall 1412 face each other, please refer to Figure 5b as well as Figure 5c It can be understood that the substrate 1402 shown in this embodiment is located on one side of the circuit board 1401 , and effectively reduces the space occupied by the substrate 1402 on the surface of the circuit board 1401 , thereby improving the space utilization of the circuit board 1401 .

[0101] The above example takes the electronic module as a photoelectric conversion module, and the chip encapsulated in the airtight package as at least a part of the device of the transmitting component. The electronic module provided in the embodiment of the present application may also be an electrical module. The electrical module shown in this embodiment includes a circuit board, a substrate and a housing. For the description of the specific structure, please refer to the above embodiment, and the details will not be repeated. The airtight package between the substrate and the housing shown in this embodiment is used to set an electrical chip. For example, the electrical chip is a gallium nitride (GaN) power amplifier. It should be clear that this embodiment does not limit the specific type of electrical chip set in the airtight package, based on the airtight package can achieve protection of the electrical chip and improve the reliability of the electrical chip.

[0102] The embodiments of the present application can also protect a printed circuit board assembly (PCBA), which includes a circuit board, a substrate, a shell and a chip, and an airtight package is formed between the substrate and the shell. For the description of the specific structure and chip type, please refer to the above embodiments, and the details will not be repeated here.

[0103] The present application also provides a carrier board, which specifically includes a circuit board and a substrate. For a description of the structure between the circuit board and the substrate, see Figure 5a or Fig.14 As shown, the details are not repeated here.

[0104] The present application provides a communication device, which can be Figure 2 The communication device shown. Fig.15 An example diagram of the structure of an embodiment of the communication device provided in the present application. The communication device shown in this embodiment includes an outer shell 1500, a processor 1501 and an optoelectronic conversion module 1502, wherein the outer shell 1500 is used to fix the processor 1501 and the optoelectronic conversion module 1502, and the processor 1501 is electrically connected to the optoelectronic conversion module 1502. The processor 1501 shown in this embodiment can be one or more optical digital signal processors (optical digital signal processor, oDSP), field programmable gate array (field-programmable gate array, FPGA), application specific integrated circuit (application specific integrated circuit, ASIC), system on chip (system on chip, SoC), central processor unit (central processor unit, CPU), network processor (network processor, NP), microprocessor (microcontroller unit, MCU), programmable processor (programmable logic device, PLD) or other integrated chips, or any combination of the above chips or processing modules, etc., which will not be described in detail. The processor 1501 is used to send a first electrical signal to the transmitting component of the photoelectric conversion module, and the transmitting component is used to receive the first electrical signal, convert the first electrical signal into a first optical signal, and emit the first optical signal. The receiving component of the photoelectric conversion module is used to receive a second optical signal and convert the second optical signal into a second electrical signal. The processor 1501 receives the second electrical signal from the receiving component. For the description of the structure of the photoelectric conversion module, please refer to the above embodiment, and no further description is given.

[0105] The embodiment of the present application also provides an electrical module, which includes a circuit board, a substrate and a housing, and an airtight package is formed between the substrate and the housing. For the description of the circuit board, the substrate, the housing and the airtight package, please refer to the above embodiment, and no further details are given. The chip fixed inside the airtight package shown in this embodiment is an electrical chip. For example, the electrical chip is a GaN power amplifier, and this embodiment does not limit the specific chip type of the electrical chip. The electrical module shown in this embodiment also fixes a transmitting circuit. The transmitting circuit can be fixed on the first surface of the circuit board, in the airtight package, or on the second surface of the substrate. For the description of the first surface of the circuit board and the second surface of the substrate, please refer to the above embodiment, and no further details are given. The transmitting circuit is electrically connected to the electrical chip in the airtight package through a first conductive trace or a second conductive trace. The electrical chip located in the airtight package is used to receive an electrical signal, and process the electrical signal to obtain a processed electrical signal, and the electrical chip emits the processed electrical signal through the transmitting circuit. It can be understood that in the example where the electrical chip is a GaN power amplifier, the GaN power amplifier receives the electrical signal to be amplified. The GaN power amplifier amplifies the power of the electrical signal to obtain the amplified electrical signal. The GaN power amplifier sends the amplified electrical signal to a transmitting circuit, and the transmitting circuit is used to emit the amplified electrical signal.

[0106] The embodiment of the present application provides a communication device, which includes an outer shell, a processor and an electrical module. For the description of the electrical module structure, please refer to the description of the electrical module structure above, and the specific details are not repeated. The processor and the electrical module are fixed inside the outer shell, and the processor is electrically connected to the electrical module. In the example where the electrical module includes a GaN power amplifier, the processor can send an electrical signal to be amplified to the GaN power amplifier, and / or the processor receives an amplified electrical signal from the GaN power amplifier.

[0107] The present application embodiment provides an optical communication system. For a description of the structure of the optical communication system, see Figure 2 The corresponding instructions are not elaborated in detail.

[0108] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic module, characterized in that: Including a circuit board, a substrate, a housing and a chip; The first conductive trace of the circuit board is electrically connected to the second conductive trace of the substrate. The circuit board has a first side wall along a direction perpendicular to the surface of the circuit board, and the surface of the circuit board is used to fix electronic components. The substrate has a second side wall along a direction perpendicular to the surface of the substrate, and the surface of the substrate is used to fix the chip. The first side wall and the second side wall face each other. An airtight package is formed between the substrate surface and the shell, the chip is located in the airtight package, and the chip is electrically connected to the first conductive trace or the second conductive trace.

2. The electronic module according to claim 1, characterized in that: The circuit board has a first area and a second area, a receiving cavity is formed between the first area and the second area, the substrate is located in the receiving cavity, and the inner side wall of the receiving cavity is the first side wall.

3. The electronic module according to claim 2, characterized in that: The accommodating cavity has a first cavity opening and a second cavity opening, the first cavity opening forms a first step, the second cavity opening forms a second step, the substrate is located between the first step and the second step, the first step includes a first conductive via, the first conductive via is electrically connected to the first conductive trace and the second conductive trace respectively, and / or the second step includes a second conductive via, the second conductive via is electrically connected to the first conductive trace and the second conductive trace respectively.

4. The electronic module according to claim 3, characterized in that: The opening of the first conductive via is located between the first step and the substrate, or the opening of the first conductive via is located in the substrate.

5. The electronic module according to any one of claims 1 to 4, characterized in that: The first surface of the substrate includes third conductive vias, the third conductive vias are electrically connected to the first conductive trace and the second conductive trace respectively, and the first surface of the substrate is connected to the housing.

6. The electronic module according to claim 1, characterized in that: The circuit board and the substrate are arranged in sequence along a direction parallel to the surface of the circuit board. The first side wall is the side wall of the circuit board facing the substrate, and the second side wall is the side wall of the substrate facing the circuit board.

7. The electronic module according to any one of claims 1 to 6, characterized in that: The airtight package is formed between the first surface of the substrate and the shell, another chip is fixed on the second surface of the substrate, the first surface of the substrate and the second surface of the substrate are oriented in opposite directions, and the other chip is electrically connected to the first conductive trace or the second conductive trace.

8. The electronic module according to any one of claims 1 to 7, characterized in that: The chip is a laser, and the electronic module further comprises a driving module, the laser is electrically connected to the driving module, and the driving module is used to drive the laser to emit an optical signal; The driving module is located inside the airtight package, on the first surface of the substrate, and outside the airtight package, on the second surface of the substrate, or on the first surface of the circuit board. The first surface of the substrate is connected to the shell, the first surface of the substrate and the second surface of the substrate face opposite to each other, and the first surface of the circuit board faces the same direction as the first surface of the substrate.

9. The electronic module according to claim 8, characterized in that: The electronic module further includes a semiconductor cooler TEC, which is used to dissipate heat for the laser. The TEC is located on the second surface of the substrate and is electrically connected to the first conductive trace or the second conductive trace.

10. The electronic module according to claim 8, characterized in that: The electronic module further comprises a semiconductor cooler TEC, which is used to dissipate heat for the laser. The TEC is located in the airtight package and on the first surface of the substrate. The laser is located on the surface of the TEC facing the housing.

11. The electronic module according to any one of claims 1 to 7, characterized in that: The chip is an electric chip.

12. A communication device, characterized in that: The communication device includes an outer shell, a processor, and an electronic module as described in any one of claims 1 to 11, wherein the outer shell is used to fix the processor and the electronic module, and the processor is electrically connected to the electronic module; the processor is used to send an electrical signal to the electronic module, and / or the processor is used to receive an electrical signal from the electronic module.

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