Golden finger gold wrapping method

Abstract

The invention provides a golden finger gold wrapping method. The method comprises the following steps: connecting a first end of a golden finger with a wire end to end along a first direction; reducing the size of the first end along the second direction to form a groove; and plating gold on the groove surface of the groove. After the groove is formed by removing the material of the first end, the groove surface of the groove can be separated from the wire under the condition that the first end is electrically connected with the wire, so that the groove surface of the groove can be plated with gold. According to the scheme, the side, facing the wire, of the golden finger can be plated with gold, so that the gold plating area can be increased, and the strength and performance of the golden finger are improved.

Description

Technical Field

[0001] The invention relates to the technical field of gold finger manufacturing, in particular to a gold finger gold coating method. Background Art

[0002] In recent years, with the rapid development of the electronics industry, some products of gold finger boards need to be made of hard gold and four-sided gold in order to meet the requirements of plug-in resistance and corrosion resistance in complex environments. In related technologies, due to process limitations, when one end of the gold finger needs to be electrically connected to the wire for gold plating, especially for segmented gold fingers, it is impossible to achieve four-sided gold plating of the gold finger. Summary of the invention

[0003] The main purpose of the invention is to provide a gold finger gold coating method, which can increase the gold plating area and is beneficial to improving the strength and performance of the gold finger.

[0004] To achieve the above objectives, the embodiments of the present invention adopt the following technical solutions: Goldfinger gold coating methods include: Connecting the first end of the gold finger to the wire end to end along a first direction; Reducing the dimension of the first end along a second direction to form a groove; wherein the second direction is perpendicular to the first direction; The groove surface of the groove is gold plated.

[0005] In some embodiments, before the step of reducing the dimension of the first end along the second direction to form a groove, the gold finger gold coating method further includes: A protective material and a dry film are applied to the second end of the gold finger, wherein the second end is connected end to end with the first end along a first direction; After the step of reducing the dimension of the first end along the second direction to form a groove, the gold finger gold coating method further comprises: Remove protective materials and dry films.

[0006] In some embodiments, before the step of gold-plating the groove surface of the groove, the gold finger gold coating method further includes: Coating a protective material and covering a dry film on the second end of the gold finger; wherein the second end is connected end to end with the first end along a first direction; and / or coating a protective material and covering a dry film on the end of the wire connected to the first end; After the step of gold-plating the groove surface of the groove, the gold finger gold-plating method further comprises: The protective material and dry film at the second end and / or the protective material and dry film at the end portion are removed.

[0007] In some embodiments, after the step of gold-plating the groove surface of the groove, the gold finger gold coating method further includes: A protective material is applied to the first end and the second end, and a dry film is covered, and then the conductive line is etched; wherein the second end and the first end are connected end to end along a first direction; Remove protective materials and dry films.

[0008] In some embodiments, a dimension of the groove along the second direction is greater than 40 μm.

[0009] In some embodiments, the second end of the gold finger is plated with gold, wherein the second end is connected end to end with the first end along the first direction.

[0010] In some embodiments, the gold finger includes a first segment and a second segment spaced apart along a first direction, and the first end is located in the first segment.

[0011] In some embodiments, the end of the second segment along the first direction and the end of the second segment along the second direction are plated with gold.

[0012] In some embodiments, before the step of reducing the dimension of the first end along the second direction, the dimension of the wire along the second direction is equal to the dimension of the first end; The step of reducing the dimension of the first end along the second direction to form a groove specifically includes: At the same time, the dimensions of the first end and the conductive wire along the second direction are reduced.

[0013] In some embodiments, the first end includes a first portion and a second portion opposite to each other along a second direction, the gold finger further includes an insulating layer located between the first portion and the second portion, and the step of reducing the size of the first end along the second direction to form the groove specifically includes: The size of the first part along the second direction and the size of the second part along the second direction are reduced respectively to form two grooves; wherein, along the second direction, each groove is located at two end surfaces of the first part and the second part away from the insulating layer, and are all recessed towards the insulating layer.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The gold finger gold-plating method of the present invention comprises the following steps: connecting the first end of the gold finger with the wire end to end along the first direction; reducing the size of the first end along the second direction to form a groove; and gold-plating the groove surface of the groove. After the groove is formed by removing the material of the first end, the groove surface of the groove can be spaced apart from the wire when the first end is electrically connected to the wire, so as to facilitate gold plating of the groove surface of the groove. In the related art, when one end of the gold finger needs to be electrically connected to the wire for gold plating, especially for segmented gold fingers, it is impossible to achieve gold plating on all four sides of the gold finger. The scheme of the present invention can gold-plate the side of the gold finger facing the wire, thereby increasing the gold-plating area, which is beneficial to improving the strength and performance of the gold finger. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of a first state of a gold finger and a wire combined in one embodiment of the present invention; Figure 2 A schematic diagram of a second state of a gold finger and a wire combined in one embodiment of the present invention; Figure 3 A schematic diagram of a third state of a gold finger and a wire combined in one embodiment of the present invention; Figure 4 A schematic diagram of a fourth state of a gold finger and a wire combined in one embodiment of the present invention; Figure 5 A schematic diagram of a fifth state of a gold finger and a wire combined in one embodiment of the present invention; Figure 6 A schematic diagram of a sixth state of a gold finger provided in an embodiment of the present invention; Figure 7 A flow chart of a gold finger gold coating method provided in one embodiment of the present invention; Figure 8 A flowchart of the first part of a method for coating gold fingers with gold provided in another embodiment of the present invention; Fig. 9 FIG. 2 is a flow chart of the second part of the gold finger gold coating method provided in another embodiment of the present invention; wherein S206 is Figure 8 The step after S205, and the two steps are adjacent.

[0017] Description of Figure Numbers: 10-Golden Finger; 100- first paragraph; 110-first end; 110A-first portion; 110B-second portion; 111-groove; 1111-groove surface; 120-second end; 130-Protective objects; 140-dry film; 200-Second paragraph; 300- conductor; 310- end; 400-Gold layer; 500-insulation layer; X-first direction; Y - Second direction.

[0018] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0021] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0022] In recent years, with the rapid development of the electronics industry, some products of gold finger boards need to be made of hard gold and four-sided gold in order to meet the requirements of plug-in resistance and corrosion resistance in complex environments. In related technologies, due to process limitations, when one end of the gold finger needs to be electrically connected to the wire for gold plating, especially for segmented gold fingers, it is impossible to achieve four-sided gold plating of the gold finger.

[0023] In view of this, see Figure 1-Figure 9 In the embodiment of the present invention, a method for gold-plating a gold finger 10 is provided. Figure 7 The method includes but is not limited to the following steps: S101: Connecting the first end 110 of the gold finger 10 and the wire 300 end to end along a first direction X; S102: reducing the dimension of the first end 110 along the second direction Y to form a groove 111; wherein the second direction Y is perpendicular to the first direction X; S103 : Gold-plating the groove surface 1111 of the groove 111 .

[0024] See also Figure 1 and Figure 3 , the above steps are further explained below. In step S101, the wire 300 is a lead for electrically connecting the gold finger 10. Connecting one end of the gold finger 10 to the wire 300 means that when the wire 300 is powered on, the gold finger 10 can provide electrical energy for the gold plating operation. In particular, in step S102, after the groove 111 is formed by removing the material of the first end 110, the groove surface 1111 of the groove 111 can be spaced apart from the wire 300 when the first end 110 is electrically connected to the wire 300, so as to facilitate gold plating of the groove surface 1111 of the groove 111. As required, the groove 111 can have any suitable structural shape, for example, see Figure 3 In some embodiments, the groove 111 is a rectangular groove when viewed along the direction perpendicular to the first direction X and the second direction Y. In other embodiments, the groove 111 can also be any one of a square groove, a triangular groove, a circular groove, and an elliptical groove when viewed along the direction perpendicular to the first direction X and the second direction Y. In step S103, gold plating can be understood as a gold-plating operation, and any suitable tool and process can be used to plate the groove surface 1111 with gold. For example, in some embodiments, electroplating equipment can be used for gold plating, and the gold finger 10 is immersed in a gold plating solution, and a certain current and voltage are applied. During the electroplating process, gold ions migrate from the gold plating solution to the surface of the gold finger 10 under the action of the electric field, and are reduced to gold atoms on the surface of the gold finger 10 to form a gold layer 400. The gold layer 400 can make the gold finger 10 have good conductivity and wear resistance, and can also improve the consistency and reliability of the gold finger 10, and reduce failures caused by poor contact.

[0025] According to the combination of the above embodiments, it can be seen that the gold-plating method of the gold finger 10 of the present invention includes the following steps: connecting the first end 110 of the gold finger 10 and the wire 300 end to end along the first direction X; reducing the size of the first end 110 along the second direction Y to form a groove 111; and gold-plating the groove surface 1111 of the groove 111. After the groove 111 is formed by removing the material of the first end 110, the groove surface 1111 of the groove 111 can be spaced from the wire 300 when the first end 110 is electrically connected to the wire 300, so as to facilitate gold plating of the groove surface 1111 of the groove 111. In the related art, when one end of the gold finger needs to be electrically connected to the wire 300 for gold plating, especially for segmented gold fingers, it is impossible to achieve gold plating on all four sides of the gold finger. The solution of the present invention can gold-plate the side of the gold finger 10 facing the wire 300, thereby increasing the gold-plating area, which is conducive to improving the strength and performance of the gold finger 10.

[0026] See also Figure 1-Figure 3 In some embodiments, before the step of reducing the dimension of the first end 110 along the second direction Y to form the groove 111, the method for gold coating the gold finger 10 further includes the following steps: A protective material 130 and a covering dry film 140 are coated on the second end 120 of the gold finger 10; wherein the second end 120 and the first end 110 are connected end to end along the first direction X; After the step of reducing the dimension of the first end 110 along the second direction Y to form the groove 111, the method for gold coating the gold finger 10 further includes: The protective material 130 and the dry film 140 are removed.

[0027] The above steps are further explained below. By coating the protective material 130 and covering the dry film 140, the other parts of the gold finger 10 (i.e., the second end 120) can be protected during the process of removing the material of the first end 110, so that it is not easily damaged. Removing the protective material 130 and the dry film 140 after forming the groove 111 can facilitate subsequent operations and avoid interference caused by the protective material 130 and the dry film 140. It should be noted that in the above steps, the removal of the protective material 130 and the dry film 140 is for the protective material 130 coated on the second end 120 and the covering dry film 140 in the previous step.

[0028] See also Figure 4-Figure 5 In some embodiments, before the step of gold-plating the groove surface 1111 of the groove 111, the gold-plating method of the gold finger 10 further includes: A protective material 130 and a covering dry film 140 are applied to the second end 120 of the gold finger 10; wherein the second end 120 and the first end 110 are connected end to end along the first direction X; and / or, a protective material 130 and a covering dry film 140 are applied to the end 310 of the wire 300 connected to the first end 110; After the step of gold-plating the groove surface 1111 of the groove 111, the gold-plating method of the gold finger 10 further includes: The protector 130 and the dry film 140 at the second end 120 and / or the protector 130 and the dry film 140 at the end 310 are removed.

[0029] The above steps are further explained below. By coating the protective material 130 and covering the dry film 140, the other parts of the gold finger 10 (i.e., the second end 120) or the wire 300 can be protected during the gold plating of the groove surface 1111. Specifically, on the one hand, it can prevent the outside of the gold-plated area from being plated with gold; on the other hand, it can also improve the quality of gold plating, avoid interference from other parts, and make the gold layer 400 more uniform. Removing the protective material 130 and the dry film 140 after the gold plating is formed can facilitate subsequent operations and avoid interference from the protective material 130 and the dry film 140. It should be noted that in the above steps, the removal of the protective material 130 and the dry film 140 is for the protective material 130 and the covering dry film 140 coated on the second end 120 and / or the end 310 of the wire 300 in the previous step.

[0030] See also Figure 5-Figure 6 In some embodiments, after the step of gold-plating the groove surface 1111 of the groove 111, the method for gold-plating the gold finger 10 further includes: A protective material 130 is coated on the groove surface 1111, a dry film 140 is covered on the first end 110 and the second end 120, and then the conductive line 300 is etched; wherein the second end 120 and the first end 110 are connected end to end along the first direction X; The protective material 130 and the dry film 140 are removed.

[0031] The above steps are further described below. By coating the protective material 130 and covering the dry film 140, the gold finger 10 can be protected during the etching of the conductive line 300. In some embodiments, the first end 110 and the second end 120 can be coated with the protective material 130 and covered with the dry film 140, or in other embodiments, the protective material 130 can be coated only on the groove surface 1111, and the dry film 140 can be covered on the first end 110 and the second end 120. It should be noted that in the above steps, the removal of the protective material 130 and the dry film 140 is for the protective material 130 and the covering dry film 140 coated on the first end 110 and the second end 120 in the previous step.

[0032] In order to facilitate other operations on the groove surface 1111 after the groove 111 is manufactured, in some embodiments, see Figure 3, the size of the groove 111 along the second direction Y is greater than 40μm. In other words, in the step of reducing the size of the first end 110 along the second direction Y to form the groove 111, the height difference of the groove 111 (along the second direction Y) formed by removing the material is greater than 40μm. Thus, it can be ensured that the size of the groove 111 along the second direction Y is large enough to facilitate the subsequent gold plating, or coating of the protective material 130 and covering the dry film 140, and the size of the groove 111 can also ensure that the groove surface 1111 has a sufficient gold plating area to ensure the strength and performance of the gold finger 10.

[0033] See also Figure 5 In some embodiments, the method for coating the gold finger 10 with gold further includes: The second end 120 of the gold finger 10 is gold plated; wherein the second end 120 is connected to the first end 110 along the first direction X end to end.

[0034] The above steps are further described below. In addition to gold-plating the first end 110 of the gold finger 10, another part of the gold finger 10, namely the second end 120, may also be gold-plated to further ensure the strength and performance of the gold finger 10. Specifically, in some embodiments, the gold-plated portion of the second end 120 includes the end surface of the second end 120 along the first direction X and the end surface of the second end 120 along the second direction Y.

[0035] In addition, in some embodiments, the gold finger 10 includes a first section 100 and a second section 200 spaced apart along a first direction X, and the first end 110 is located at the first section 100. It can be understood that the above definition indicates that the gold finger 10 can be a segmented gold finger 10. Based on this, see Figure 5 In some embodiments, the method for coating the gold finger 10 with gold further includes: The end portion 310 of the second segment 200 along the first direction X and the end portion 310 along the second direction Y are plated with gold.

[0036] The above steps are further described below. In addition to gold-plating the first section 100 of the gold finger 10, another part of the gold finger 10, namely the second section 200, can also be gold-plated to ensure the overall strength and performance of the gold finger 10. Specifically, in some embodiments, the gold-plated portion of the second section 200 includes the end face of the second section 200 along the first direction X (including the end face close to the first section 100 and the end face away from the first section 100) and the end face of the second section 200 along the second direction Y. As for the setting of the gold-plating position, due to the separation of the first section 100 and the second section 200, the second section 200 can be connected from the root to achieve the gold-plating operation of each end face, and the four sides can be gold-plated, while the first section 100 is independently set so that it needs to be connected to the wire 300 on the side away from the second section 200 (the corresponding connection area is the area between the groove surface 1111 of the groove 111 of the first end 110 and the other end face of the first end 110 along the second direction Y).

[0037] See also Figure 1-Figure 2 In some embodiments, before the step of reducing the size of the first end 110 along the second direction Y, the size of the wire 300 along the second direction Y is equal to the size of the first end 110 .

[0038] Based on this, in some embodiments, the step of reducing the dimension of the first end 110 along the second direction Y to form the groove 111 specifically includes: At the same time, the dimensions of the first end 110 and the conductive line 300 along the second direction Y are reduced.

[0039] The above steps are further described below. Before the groove 111 is formed, the first end 110 and the conductor 300 are made equal in size along the second direction Y, and in the process of removing the material of the first end 110 to form the groove 111, the material of the conductor 300 can also be removed at the same time, so that the groove surface 1111 of the first end 110 can be formed to have the same width as the conductor 300, so as to avoid the phenomenon that the conductor 300 is not neat and the conductor 300 remains when observed from the appearance.

[0040] See also Figure 1-Figure 3 In some embodiments, the first end 110 includes a first portion 110A and a second portion 110B opposite to each other along the second direction Y, and the gold finger 10 further includes an insulating layer 500 located between the first portion 110A and the second portion 110B. Based on this, in some embodiments, the step of reducing the size of the first end 110 along the second direction Y to form the groove 111 specifically includes: The size of the first portion 110A along the second direction Y and the size of the second portion 110B along the second direction Y are reduced respectively to form two grooves 111; wherein, along the second direction Y, each groove 111 is located at two end surfaces of the first portion 110A and the second portion 110B away from the insulating layer 500, and are all recessed in a direction close to the insulating layer 500.

[0041] The above steps are further described below. The first part 110A and the second part 110B can be regarded as two parts of the gold finger 10 for electrical contact, and an insulating layer 500 is provided between the two parts to play an insulating role. The provision of the insulating layer 500 can ensure that there is no short circuit between adjacent gold finger 10 contacts, provide certain support and protection for the gold finger 10 contacts, and help maintain the overall structural stability of the gold finger 10. Therefore, the insulating layer 500 can be made of any suitable insulating material, such as plastic or resin material. For further information, see Figure 1-Figure 6 The first portion 110A and the second portion 110B may be symmetrically arranged relative to the insulating layer 500 , and the second segment 200 and the second segment 200 of the aforementioned embodiment may also include two parts and may be symmetrically arranged relative to the insulating layer 500 .

[0042] More specifically, see Figure 1-Figure 6The above-mentioned insulating layer 500 can make the first part 110A have a groove 111 on one side end surface of the first end 110 along the second direction Y, and both ends of the groove surface 1111 along the first direction X and the second direction Y are gold-plated, and the second end 120 has a gold-plated one side end surface along the second direction Y, and the other side end surfaces of the first end 110 and the second end 120 along the second direction Y (i.e., the end surface close to the insulating layer 500) and the end surface of the second end 120 away from the first end 110 along the first direction X are gold-plated; for the second part 110B, it can be similar to the first part 110A, that is, the first part 110A and the second part 110B can be symmetrically arranged relative to the insulating layer 500, the structure of the second part 110B can be symmetrical with the structure of the first part 110A, and the gold-plating position of the second part 110B can be symmetrical with the gold-plating position of the first part 110A. The gold-plated portion of the second section 200 may include the end surface of the second section 200 along the first direction X (including the end surface close to the first section 100 and the end surface away from the first section 100) and the end surface of the second section 200 along the second direction Y. After the gold plating is completed, each of the above-mentioned gold-plated portions can form a gold layer 400. It can be understood that, combined with the gold plating operations for different parts in the above-mentioned embodiments, in some embodiments, after the groove 111 is manufactured and formed, gold plating can be performed on all other parts except the connection portion between the first end 110 and the wire 300 (that is, the area between the groove surface 1111 of the groove 111 of the first end 110 and the other end surface of the first end 110 close to the insulating layer 500 along the second direction Y), so as to maximize the gold plating area and further improve the strength and performance of the gold finger 10.

[0043] For ease of understanding, the following describes a method for coating the gold finger 10 with gold corresponding to a relatively complete embodiment of the present invention, see Figure 8-Figure 9 The method includes but is not limited to the following steps: S201: Connecting the first end 110 of the gold finger 10 and the wire 300 end to end along a first direction X; S202: coating the protective material 130 and the covering dry film 140 on the second end 120 of the gold finger 10; wherein the second end 120 and the first end 110 are connected end to end along the first direction X; S203: simultaneously reducing the dimensions of the first end 110 and the conductive wire 300 along the second direction Y to form a groove 111; wherein the second direction Y is perpendicular to the first direction X; S204: removing the protective material 130 and the dry film 140; S205: coating the protective material 130 and the covering dry film 140 on the end portion 310 of the wire 300 connected to the first end 110; S206: Gold-plating the groove surface 1111 of the groove 111, the second end 120 of the gold finger 10, and the end 310 of the second section 200 along the first direction X and the end 310 along the second direction Y; S207: removing the protective material 130 and the dry film 140; S208: coating the protective material 130 on the groove surface 1111, covering the first end 110 and the second end 120 with a dry film 140, and then etching the conductive wire 300; S209: removing the protective material 130 and the dry film 140.

[0044] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A method for coating gold fingers, characterized in that: include: Connecting the first end of the gold finger to the wire end to end along a first direction; Reducing the dimension of the first end along a second direction to form a groove; wherein the second direction is perpendicular to the first direction; The groove surface of the groove is plated with gold.

2. The method for coating gold fingers with gold according to claim 1, characterized in that: Before the step of reducing the dimension of the first end along the second direction to form a groove, the gold finger gold coating method further includes: Coating a protective material and a dry film on the second end of the gold finger; wherein the second end is connected end to end with the first end along the first direction; After the step of reducing the dimension of the first end along the second direction to form a groove, the gold finger gold coating method further comprises: The protective material and the dry film are removed.

3. The method for gold-plating a gold finger according to claim 1, characterized in that: Before the step of gold-plating the groove surface of the groove, the gold finger gold-plating method further comprises: Coating a protective material and a covering dry film on the second end of the gold finger; wherein the second end is connected end to end with the first end along the first direction; and / or coating a protective material and a covering dry film on the end of the wire connected to the first end; After the step of gold-plating the groove surface of the groove, the gold finger gold-plating method further comprises: The protective material and the dry film at the second end and / or the protective material and the dry film at the end portion are removed.

4. The method for gold-plating a gold finger according to claim 1, characterized in that: After the step of gold-plating the groove surface of the groove, the gold finger gold-plating method further comprises: Coating a protective material on the groove surface, covering the first end and the second end with a dry film, and then etching the wire; wherein the second end is connected end to end with the first end along the first direction; The protective material and the dry film are removed.

5. The method for gold-plating a gold finger according to claim 1, characterized in that: A dimension of the groove along the second direction is greater than 40 μm.

6. The method for gold-plating a gold finger according to claim 1, characterized in that: Also includes: The second end of the gold finger is gold plated; wherein the second end is connected end to end with the first end along the first direction.

7. The method for coating gold fingers with gold according to claim 1, characterized in that: The gold finger includes a first section and a second section spaced apart along the first direction, and the first end is located in the first section.

8. The method for gold-plating a gold finger according to claim 7, characterized in that: Also includes: The end portion of the second segment along the first direction and the end portion along the second direction are plated with gold.

9. The method for coating gold fingers with gold according to claim 1, characterized in that: Before the step of reducing the size of the first end along the second direction, the size of the wire along the second direction is equal to the size of the first end; The step of reducing the dimension of the first end along the second direction to form a groove specifically includes: At the same time, the dimensions of the first end and the conductive wire along the second direction are reduced.

10. The method for coating gold fingers with gold according to claim 1, characterized in that: The first end includes a first portion and a second portion opposite to each other along the second direction, the gold finger further includes an insulating layer located between the first portion and the second portion, and the step of reducing the size of the first end along the second direction to form the groove specifically includes: The size of the first part along the second direction and the size of the second part along the second direction are reduced respectively to form two grooves; wherein, along the second direction, each groove is located at two end surfaces of the first part and the second part away from the insulating layer, and are all recessed towards the direction close to the insulating layer.

Images