Power optimizer

By filling the coolant in the power optimizer and adjusting the internal pressure with the airbag, the problem of insufficient heat dissipation capability in the prior art is solved, and more efficient heat conduction and stronger heat dissipation capability are achieved, which is suitable for high-power photovoltaic systems.

CN119277718APending Publication Date: 2025-01-07XIAN PINGGAO SMART ENERGY CO LTD +1
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Patent Information

Application Number
CN202411229252.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-03
Publication Date
2025-01-07

AI Technical Summary

Technical Problem

The existing power optimizers rely on the thermal contact between the PCB board and the mounting base plate, which has low heat dissipation capabilities, and cannot meet the higher heat dissipation needs of high-power and high-current photovoltaic modules.

Method used

A sealing cavity is formed in the outer shell and filled with coolant, so that the circuit board is immersed in the coolant, and heat dissipation is dissipated by the coolant, and the internal pressure is adjusted through the airbag and waterproof and breathable membrane structure to enhance the heat dissipation effect.

Benefits of technology

It achieves more efficient heat conduction, effectively prevents faults caused by high temperatures, improves heat dissipation capabilities and product performance, and is suitable for high-power photovoltaic systems.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a power optimizer, and belongs to the technical field of cooling of electronic equipment, the power optimizer comprises a shell and a circuit board, the shell is internally provided with a sealing cavity, the circuit board is installed in the sealing cavity, the sealing cavity is filled with cooling liquid, the circuit board is immersed in the cooling liquid to dissipate heat through the cooling liquid, and an immersed liquid cooling structure is formed. Heat generated by the circuit board can be better absorbed by using the cooling liquid, instant and efficient conduction of the heat can be realized, power optimizer faults caused by high temperature can be effectively prevented, and improvement of heat dissipation capability is facilitated.
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Description

Technical Field

[0001] The invention relates to a power optimizer, belonging to the technical field of cooling of electronic equipment. Background Art

[0002] With the advancement of photovoltaic power generation technology, high conversion efficiency, high power, and high current components have been widely used. The power optimizer is a key component in the photovoltaic system. It is connected in series with the photovoltaic module to predict the current and voltage to ensure that the photovoltaic module is always in the optimal working state and improve the power generation efficiency of the photovoltaic system. The power optimizer contains many power devices, such as metal-oxide semiconductor field effect transistors (MOSFET, MOS tube for short) and diodes. The switching losses of these power devices during operation are dissipated in the form of heat. Heat accumulation will cause the temperature of the power device to be too high, affecting the working efficiency and life of the power device. Therefore, in order to ensure the safe and stable operation of the power device, it is particularly important to conduct the heat generated by the power device in a timely and effective manner.

[0003] A power optimizer is disclosed in a Chinese invention patent application document with application publication number CN118382269A. The power optimizer includes a power optimizer mounting base plate, a surrounding frame and a PCB board. The surrounding frame is fixedly docked on the power optimizer mounting base plate so that the power optimizer mounting base plate and the surrounding frame together constitute a box structure for mounting and accommodating the PCB board. The PCB board is fixedly mounted on the power optimizer mounting base plate. A transmission cable is conductively connected to the PCB board. The transmission cable passes through the power optimizer to achieve electrical connection between the power optimizer and the photovoltaic module. The PCB board performs heat exchange with the power optimizer mounting base plate. The entire board surface of the power optimizer mounting base plate becomes a heat exchange path for heat exchange with the PCB board, which increases the heat exchange path between the power optimizer mounting base plate and the PCB board and ensures the heat dissipation effect.

[0004] However, as the demand for high power and high current of photovoltaic modules continues to increase, the above-mentioned method of relying on contact heat exchange between the PCB board and the power optimizer mounting base has limited contact area and insufficient heat dissipation capacity, and cannot meet higher heat dissipation requirements. Summary of the invention

[0005] The purpose of the present invention is to provide a power optimizer to solve the problem of low heat dissipation capacity of the current power optimizer which relies on thermal contact between a PCB board and a mounting base plate of the power optimizer for heat dissipation.

[0006] The technical solution of the power optimizer of the present invention is: A power optimizer comprises a shell and a circuit board. A sealed cavity is arranged in the shell. The circuit board is installed in the sealed cavity. The sealed cavity is filled with coolant. The circuit board is immersed in the coolant to dissipate heat through the coolant.

[0007] Furthermore, the volume of the coolant changes when the temperature changes. An airbag is provided in the sealed cavity. The inner cavity of the airbag is isolated from the coolant. The airbag has a connecting port connected to the outside of the shell. The airbag deforms when the volume of the coolant changes.

[0008] Furthermore, a breathable shielding structure is provided at the communication opening, and the shielding structure shields the communication opening.

[0009] Furthermore, the shielding structure is a waterproof and breathable membrane.

[0010] Furthermore, more than two circuit boards are arranged side by side, each circuit board is located on the same side of the airbag, and the airbag extends along the side-by-side direction of each circuit board.

[0011] Furthermore, a wiring cavity isolated from the sealed cavity is provided in the shell, and a partition wall is provided in the shell to separate the sealed cavity from the wiring cavity. A connector is provided on the cavity wall of the wiring cavity adjacent to and / or opposite to the partition wall. The connector has an internal terminal in the wiring cavity and an external interface exposed outside the shell. The power optimizer includes an internal cable, one end of the internal cable is connected to the circuit board, and the other end passes through the partition wall to be connected to the internal terminal of the connector. A sealing structure is provided at the place where the internal cable passes through the partition wall.

[0012] Furthermore, sealant is poured into the wiring cavity.

[0013] Furthermore, the housing includes two side walls which are opposite to each other in the thickness direction of the circuit board, and the circuit board is spaced apart from the two side walls.

[0014] Furthermore, a pillar is protrudingly provided on one of the two side walls, and the circuit board is fixed on the top of the pillar.

[0015] Furthermore, the housing includes a main housing and a cover plate that are fixedly connected, the main housing has an opening toward one side, the cover plate is arranged at the opening, and a sealing member is arranged between the main housing and the cover plate so that the main housing and the cover plate enclose the sealed cavity. Beneficial effects: The present invention changes the elements on the basis of the power optimizer in the prior art, by forming a sealed cavity in the housing and filling it with coolant, so that the circuit board is immersed in the coolant to form an immersion liquid cooling structure, and the coolant can better absorb the heat generated by the circuit board, so that the heat can be conducted instantly and efficiently, and the power optimizer failure caused by high temperature can be effectively prevented, which is conducive to improving the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the installation structure of the airbag and the circuit board of the power optimizer in the main housing according to an embodiment of the present invention; Figure 2 for Figure 1 A left side view of the part is shown in FIG. Figure 3 for Figure 1 A top view of a portion is shown in FIG. Figure 4 for Figure 1 A cross-sectional view of a portion is shown; Figure 5 for Figure 1 A rear view of the part is shown in FIG. Figure 6 for Figure 1 A right side view of the part is shown in FIG. Figure 7 It is a schematic diagram of a connector at a wiring cavity and a waterproof threading joint at a partition wall of a power optimizer according to an embodiment of the present invention.

[0017] In the figure: 1. Main shell; 2. Circuit board; 3. Airbag; 4. Waterproof and breathable membrane structure; 5. Sealing strip; 6. Explosion-proof valve; 7. Antenna; 8. Cable wiring matching cavity; 9. Heat dissipation fins; 10. Pillar; 11. Partition wall; 12. Bottom wall; 13. Sealed matching cavity; 14. Waterproof threading connector; 15. Connector. DETAILED DESCRIPTION

[0018] The power optimizer of the present invention forms a sealed cavity in a shell and fills the cavity with coolant, so that the circuit board is immersed in the coolant to form an immersion liquid cooling structure, thereby improving the heat dissipation capacity.

[0019] Embodiments of the power optimizer of the present invention: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, the power optimizer includes a shell, which includes a main shell 1 and a cover plate. The cover plate is not shown in the figure. The main shell 1 and the cover plate form an inner cavity of the shell. The inner cavity of the shell includes a closed sealed cavity. A circuit board 2 is installed in the sealed cavity and filled with coolant. The circuit board 2 is provided with electronic components that generate heat when working. The circuit board 2 is immersed in the coolant to form an immersion liquid cooling structure. The coolant can better absorb the heat generated by the circuit board 2, and can realize instant and efficient heat conduction, which is beneficial to improving the heat dissipation capacity and can effectively prevent power optimizer failures caused by high temperature.

[0020] The coolant has insulating properties, and silicone oil or other liquids suitable for immersion cooling of the circuit board 2 can be used. The volume of the coolant changes when the temperature changes, and it has the characteristics of thermal expansion and contraction. An airbag 3 is provided in the sealed cavity of the shell, and the inner cavity of the airbag 3 is isolated from the coolant, and the inner cavity of the airbag 3 is not connected to the sealed cavity. The airbag 3 has a connecting port connected to the atmosphere outside the shell. The airbag 3 deforms when the volume of the coolant changes to regulate the pressure in the sealed cavity. An end is provided at the connecting port of the airbag 3, and the end is installed on the side wall of the main shell 1. A waterproof and breathable membrane structure 4 is provided in the end, and the waterproof and breathable membrane structure 4 includes a waterproof and breathable membrane, and the waterproof and breathable membrane constitutes a shielding structure for shielding the connecting port of the airbag 3. The connecting port of the airbag 3 connected to the outside air is shielded by a waterproof and breathable membrane to prevent debris from entering the airbag 3, and to prevent water from entering, which is conducive to ensuring the normal use of the airbag 3.

[0021] The main housing 1 is made of aluminum alloy and is integrally cast. The main housing 1 includes surrounding side walls and a bottom wall 12. The surrounding side walls are respectively an upper side wall, a lower side wall, a left side wall, and a right side wall. One end of the surrounding side walls is connected to the bottom wall 12 and surrounds the inner cavity of the main housing 1. The other end of the surrounding side walls surrounds the front opening of the inner cavity of the main housing 1. The cover plate is arranged at the front opening. The bottom wall 12 constitutes the rear side wall of the main housing 1. The front end surface of the surrounding side walls of the main housing 1 is provided with screw connection holes to fix the cover plate by screws. A partition wall 11 is arranged in the inner cavity of the main housing 1. The left and right ends of the partition wall 11 are respectively connected to the left and right walls of the main housing 1. The partition wall 11 divides the inner cavity of the main housing 1 into upper and lower parts, respectively, a sealing matching cavity 13 arranged on the upper side and a cable wiring matching cavity 8 arranged on the lower side. The partition wall 11 is arranged close to the lower side wall of the main housing 1, so that the space in the sealing matching cavity 13 is much larger than the space in the cable wiring matching cavity 8. The circuit board 2 and the airbag 3 are both installed in the sealing matching cavity 13.

[0022] The front end surface of the partition wall 11 of the main housing 1 and the corresponding side wall for enclosing the sealed matching cavity 13 is provided with a sealing groove, and a sealing strip 5 is provided in the sealing groove. The sealing strip 5 constitutes a sealing member, and the cover plate is pressed against the sealing strip 5. The cover plate covers the sealed matching cavity 13 and cooperates with the sealing strip 5 to form a closed sealed cavity. The cover plate covers the cable wiring matching cavity 8 to form a wiring cavity. The wiring cavity is isolated from the sealed cavity, and the partition wall 11 separates the sealed cavity from the wiring cavity. Figure 7The cable wiring matching cavity 8 cooperates with the cover plate to form a wiring cavity. The left and right side walls of the main shell 1 that are used to form the cable wiring matching cavity 8 constitute the cavity wall of the wiring cavity that is adjacent to the partition wall 11. The lower side wall of the main shell 1 constitutes the cavity wall of the wiring cavity that is opposite to the partition wall 11. The cavity wall of the wiring cavity that is adjacent to the partition wall 11 and the cavity wall that is opposite to the partition wall 11 are respectively provided with connectors 15. The connector 15 has an internal terminal in the cable wiring matching cavity 8 and an external interface exposed outside the main shell 1. The external interface is a plug-in terminal for plugging with an adapter connector. The power optimizer includes an internal cable, which is not shown in the figure. One end of the internal cable is connected to the circuit board 2, and the other end passes through the partition wall 11 and is connected to the internal terminal of the connector 15. One end of the internal cable is provided with a terminal, and the terminal is fixedly connected to the terminal post on the circuit board by a screw. Each circuit board 2 is connected to a number of internal cables. A sealing structure is provided at the place where the internal cables pass through the partition wall 11. The sealing structure can adopt a waterproof threading connector 14. The waterproof threading connector is also called a cable waterproof nut. It can be used for cables to pass through and form a seal with the cables and the through holes on the partition wall 11 to ensure the sealing of the sealed cavity. The waterproof threading connector 14 is fixed at the through hole on the partition wall 11. The waterproof threading connector 14 is sealed with the partition wall 11. The internal cables pass through the waterproof threading connector 14. The waterproof threading connector 14 is provided with a sealing rubber sleeve that can be sealed with the cables. The waterproof threading connector is an existing conventional technology, and its specific structure is not repeated. By setting a connector 15 to connect with the external line, it can be avoided that the sealing part of the internal cable passing through the partition wall 11 is affected when the external line is connected or disconnected, and the force is prevented from being transmitted to the sealing part, which is conducive to reliable sealing and ensures that the coolant in the sealed cavity does not leak out.

[0023] The wiring cavity is filled with sealant, which wraps the internal cables and the internal wiring terminals of the waterproof threading connector 14 and the connector 15 to enhance the sealing performance and make the wiring more stable and reliable. At the same time, the sealant has thermal conductivity and can reduce the impact on the heat dissipation performance.

[0024] There are multiple circuit boards 2 arranged side by side, each circuit board 2 is located on the same side of the airbag 3, and the airbag 3 extends along the parallel direction of each circuit board 2, which is convenient for arranging the airbag 3 so that the airbag 3 has sufficient volume, and the volume of the airbag 3 is not less than the volume increase of the coolant when it works normally. Each circuit board 2 is arranged at intervals along the left-right direction, the airbag 3 is cylindrical and the axial direction is the left-right direction, the airbag 3 is arranged close to the upper side wall of the main shell 1, and each circuit board 2 is located on the lower side of the airbag 3. The thickness direction of the circuit board 2 is the front-to-back direction, and the bottom wall 12 of the main shell 1 and the cover plate constitute the two opposite side walls of the shell in the thickness direction of the circuit board 2. The circuit board 2 and the bottom wall 12 and the cover plate are arranged at intervals to ensure that there is coolant on both sides of the circuit board 2 in the thickness direction to ensure the heat dissipation effect. A pillar 10 is protruding from the bottom wall 12 of the main shell 1, and the circuit board 2 is fixed on the top of the pillar 10. A screw connection hole is provided on the end face of the top of the pillar 10 to fix the circuit board 2 by screws and ensure that the circuit board 2 is reliably grounded. The pillar 10 is used to maintain a gap between the circuit board 2 and the bottom wall 12. The structure is simple and easy to install.

[0025] The cover plate is a flat plate structure, and the cover plate and the main shell 1 form a sealed cavity of the shell, which is easy to manufacture. The end of the airbag 3 is installed on the left side wall of the main shell 1. An antenna 7 is also installed on the left side wall of the main shell 1, which can transmit data in real time and communicate with the operation and maintenance background. The upper side wall of the main shell 1 is provided with a connecting structure for connecting the frame or bracket of the photovoltaic module. The upper side wall of the main shell 1 is also provided with an explosion-proof valve 6 to release pressure when the pressure in the sealed cavity is too high. The outer side surface of the bottom wall 12 of the main shell 1 is provided with a plurality of heat dissipation fins 9 to enhance the heat dissipation efficiency.

[0026] The coolant is filled before the cover is fixed to the main housing 1. When the product is assembled, the airbag 3 and the circuit board 2 of the power optimizer are completely immersed in the coolant. Under normal circumstances, the airbag 3 is not compressed. When the coolant absorbs heat and produces temperature changes, the coolant expands due to heat, and the volume changes to a certain extent. The volume change will produce a certain pressure on the airbag 3. After being subjected to this pressure, the volume of the airbag 3 will be compressed accordingly, so that the air inside it is discharged through the waterproof and breathable membrane structure 4. After the coolant pressure disappears, the airbag 3 returns to its initial shape under the action of the external atmospheric pressure, which plays a role in regulating the pressure inside the power optimizer. This structure not only ensures the sealing of the shell, but also prevents abnormal internal pressure caused by thermal expansion and contraction.

[0027] The power optimizer has four circuit boards 2, which can be connected to four photovoltaic modules respectively, with a maximum power of 900Wp for each module, and can adapt to a maximum of 3600Wp high-power photovoltaic modules, meeting the heat dissipation capacity of 20A high current working conditions under an outdoor environment of 60 degrees Celsius. It has strong heat dissipation capacity and high safety, which can effectively improve product performance and service life, and provide a strong guarantee for the safe and efficient operation of high-power photovoltaic systems. It can be widely used in various photovoltaic power stations to promote the sustainable development of the green energy industry.

[0028] In other implementations, when the pressure change in the sealed cavity is not very large, the airbag may not be provided.

[0029] In other implementations, the shielding structure may also be a filter to prevent large particles of debris from entering the airbag.

[0030] In other implementations, a support beam may be fixed on the main housing, the support beam is spaced apart from the bottom wall, and each circuit board is fixed on the support beam to maintain a gap with the bottom wall.

[0031] In other implementations, when the heat dissipation requirement is met by relying on the coolant, the heat dissipation fins 9 may not be provided.

[0032] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments without creative work, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A power optimizer, characterized in that: The invention comprises a shell and a circuit board. A sealed cavity is arranged in the shell. The circuit board is installed in the sealed cavity. The sealed cavity is filled with coolant. The circuit board is immersed in the coolant to dissipate heat through the coolant.

2. The power optimizer according to claim 1, characterized in that: The volume of the coolant changes when the temperature changes. An airbag is arranged in the sealed cavity. The inner cavity of the airbag is isolated from the coolant. The airbag has a connecting port connected to the outside of the shell. The airbag is deformed when the volume of the coolant changes.

3. The power optimizer according to claim 2, characterized in that: A breathable shielding structure is provided at the communication opening, and the shielding structure shields the communication opening.

4. The power optimizer according to claim 3, characterized in that: The shielding structure is a waterproof and breathable membrane.

5. The power optimizer according to claim 2, 3 or 4, characterized in that: More than two circuit boards are arranged side by side, each circuit board is located on the same side of the airbag, and the airbag extends along the side-by-side direction of each circuit board.

6. The power optimizer according to any one of claims 1 to 4, characterized in that: A wiring cavity isolated from the sealed cavity is also provided in the shell, and a partition wall is provided in the shell to separate the sealed cavity from the wiring cavity. A connector is provided on the cavity wall of the wiring cavity adjacent to and / or opposite to the partition wall. The connector has an internal terminal in the wiring cavity and an external interface exposed outside the shell. The power optimizer includes an internal cable, one end of the internal cable is connected to the circuit board, and the other end passes through the partition wall to be connected to the internal terminal of the connector. A sealing structure is provided at the place where the internal cable passes through the partition wall.

7. The power optimizer according to claim 6, characterized in that: The wiring cavity is filled with sealant.

8. The power optimizer according to any one of claims 1 to 4, characterized in that: The shell comprises two side walls which are opposite to each other in the thickness direction of the circuit board, and the circuit board is spaced apart from the two side walls.

9. The power optimizer according to claim 8, characterized in that: A support is protruded from one of the two side walls, and the circuit board is fixed on the top of the support.

10. The power optimizer according to any one of claims 1 to 4, characterized in that: The shell comprises a main shell and a cover plate which are fixedly connected. The main shell has an opening facing one side. The cover plate is arranged at the opening. A sealing member is arranged between the main shell and the cover plate so that the main shell and the cover plate enclose the sealing cavity.

Citation Information

Patent Citations

  • Power optimizer mounting bottom plate

    CN118382269A