Display panel, manufacturing method of display panel and display device

Abstract

The invention provides a display panel, a manufacturing method of the display panel and a display device, the display panel comprises a substrate and a driving circuit layer, the driving circuit layer comprises at least one conductive layer, the conductive layer comprises a plurality of conductive parts, each conductive part comprises a first surface, a second surface and a first side surface, the second surface is oppositely arranged on the side, away from the substrate, of the first surface, the first side face is connected between the first surface and the second surface, the surface roughness of the first side face is larger than the surface roughness of the first surface and the surface roughness of the second surface, the surface roughness of the first side face of the conductive part can be reduced, and therefore the reflectivity of the display panel is reduced; therefore, the contrast ratio of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] In the information society, the importance of displays as a medium for visual information transmission is further strengthened. In order to occupy a dominant position in the future, displays are developing towards lighter, thinner, lower energy consumption, lower cost and better image quality. The core of display technology is to reproduce the human eye's perception of the real world. The current mainstream display technologies include Liquid Crystal Display (LCD) technology and Organic Light-Emitting Diode (OLED) display technology. LCD and OLED display technologies have different advantages in color reproduction, viewing angle, contrast, light and dark state control and reliability. With the development of display technology, in addition to the increasingly higher requirements for the resolution, aperture ratio and border width of the display panel, higher requirements are placed on the reflectivity and contrast of the display panel.

[0003] At present, after the metal layer in the display panel is etched to form a metal pattern, the two sides of the metal pattern are exposed to the outside, which will cause reflection, resulting in an increase in the reflectivity of the display panel, a decrease in contrast, and an impact on the display effect of the display panel. If the width of the light shielding layer above the metal pattern is increased to shield the side of the metal pattern, the aperture ratio of the display panel will decrease, resulting in a decrease in the brightness of the display panel.

[0004] Therefore, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device. Summary of the invention

[0005] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which can reduce the overall reflectivity of the display panel and improve the contrast of the display panel.

[0006] In order to achieve the above object, according to a first aspect of the present application, a display panel is provided, comprising:

[0007] substrate;

[0008] A driving circuit layer, disposed on one side of the substrate, the driving circuit layer comprising at least one conductive layer, the conductive layer comprising a plurality of conductive parts;

[0009] The conductive portion includes a first surface, a second surface and a first side surface, the second surface is arranged relative to the side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, the first side surface is arranged at an angle to the first surface, the surface roughness of the first side surface is greater than the surface roughness of the first surface, and the surface roughness of the first side surface is greater than the surface roughness of the second surface.

[0010] Optionally, the conductive part includes a metal part and a metal oxide part, the metal oxide part is formed on the peripheral side surface of the metal part, the surface roughness of the surface of the metal oxide part away from the metal part is greater than the surface roughness of the surface of the metal part close to the substrate, and the surface roughness of the surface of the metal oxide part away from the metal part is greater than the surface roughness of the surface of the metal part away from the substrate.

[0011] Optionally, the metal portion includes a first sub-metal portion, a second sub-metal portion and a third sub-metal portion which are stacked, and the metal oxide portion includes:

[0012] a first sub-metal oxide portion formed on a peripheral side surface of the first sub-metal portion, wherein the surface roughness of the peripheral side surface of the first sub-metal oxide portion is greater than the surface roughness of a surface of the first sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the first sub-metal oxide portion is greater than the surface roughness of a surface of the first sub-metal portion far from the substrate;

[0013] a second sub-metal oxide portion formed on a peripheral side surface of the second sub-metal portion, wherein the surface roughness of the peripheral side surface of the second sub-metal oxide portion is greater than the surface roughness of a surface of the second sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the second sub-metal oxide portion is greater than the surface roughness of a surface of the second sub-metal portion far from the substrate;

[0014] A third sub-metal oxide portion is formed on the peripheral side surface of the third sub-metal portion, the surface roughness of the peripheral side surface of the third sub-metal oxide portion is greater than the surface roughness of the surface of the third sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the third sub-metal oxide portion is greater than the surface roughness of the surface of the third sub-metal portion away from the substrate.

[0015] Optionally, the metal element in the first sub-metal oxide portion is the same as the metal element in the first sub-metal portion, the metal element in the second sub-metal oxide portion is the same as the metal element in the second sub-metal portion, and the metal element in the third sub-metal oxide portion is the same as the metal element in the third sub-metal portion.

[0016] Optionally, the conductive portion includes:

[0017] a first sub-metal portion, wherein the surface roughness of a side surface of the first sub-metal portion is greater than the surface roughness of a surface of the first sub-metal portion close to the substrate, and the surface roughness of the side surface of the first sub-metal portion is greater than the surface roughness of a surface of the first sub-metal portion far from the substrate;

[0018] A second sub-metal portion is disposed on a side of the first sub-metal portion away from the substrate, the surface roughness of a side surface of the second sub-metal portion being greater than the surface roughness of a surface of the second sub-metal portion close to the substrate, and the surface roughness of a side surface of the second sub-metal portion being greater than the surface roughness of a surface of the second sub-metal portion away from the substrate;

[0019] The third sub-metal portion is arranged on a side of the second sub-metal portion away from the first sub-metal portion, the surface roughness of the side surface of the third sub-metal portion is greater than the surface roughness of the surface of the third sub-metal portion close to the substrate, and the surface roughness of the side surface of the third sub-metal portion is greater than the surface roughness of the surface of the third sub-metal portion away from the substrate.

[0020] Optionally, the metal element in the first sub-metal portion and the third sub-metal portion is titanium, and the metal element in the second sub-metal portion is aluminum.

[0021] Optionally, the driving circuit layer includes:

[0022] A gate layer, disposed on one side of the substrate;

[0023] A source-drain electrode layer, arranged on a side of the gate layer away from or close to the substrate;

[0024] Wherein, at least one of the gate layer and the source and drain layer is the conductive layer.

[0025] According to a second aspect of the present application, a method for manufacturing a display panel is provided, for manufacturing a display panel as described in any one of the above embodiments, the method for manufacturing a display panel comprising:

[0026] depositing a conductive material on a substrate;

[0027] Patterning the conductive material to form a plurality of conductive parts, wherein the conductive part includes a first surface, a second surface and a first side surface, wherein the second surface is arranged at a side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, and the first side surface is arranged at an angle to the first surface;

[0028] The first side surface is roughened so that the surface roughness of the first side surface is greater than the surface roughness of the first surface, and the surface roughness of the first side surface is greater than the surface roughness of the second surface.

[0029] Optionally, the step of roughening the first side surface includes:

[0030] The first side surface is subjected to an oxidation treatment; or the first side surface is subjected to a bombardment treatment using an inert gas.

[0031] According to a third aspect of the present application, a display device is provided, comprising a display panel as described in any one of the above embodiments.

[0032] In the display panel of the embodiment of the present application, by making the surface roughness of the first side surface of the conductive part greater than the surface roughness of the first surface and the second surface of the conductive part, the surface roughness of the first side surface of the conductive part can be reduced, thereby reducing the reflectivity of the display panel and improving the contrast of the display panel.

[0033] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0035] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0036] Figure 1 A schematic diagram of the structure of a first display panel provided in an embodiment of the present application;

[0037] Figure 2 A schematic structural diagram of a conductive portion in a first display panel provided in an embodiment of the present application;

[0038] Figure 3 A schematic diagram of the structure of a first display panel provided in an embodiment of the present application;

[0039] Figure 4 A schematic structural diagram of a conductive portion in a first display panel provided in an embodiment of the present application;

[0040] Figure 5A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0041] Figures 6a to 6e A schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application;

[0042] Figure 7 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 1. Substrate;

[0045] 2. driving circuit layer; 21. conductive layer; 22. gate layer; 23. source-drain electrode layer; 24. light shielding layer; 25. buffer layer; 26. active layer; 27. gate insulating layer; 28. interlayer dielectric layer; 29. ​​passivation layer; 201. first electrode layer; 202. flat layer; 203. second electrode layer; 210. conductive part; 211. first surface; 212. second surface; 213. first side surface; 2101. metal part; 2102. metal oxide part; 21011. first sub-metal part; 21012. second sub-metal part; 21013. third sub-metal part; 21021. first sub-metal oxide part; 21022. second sub-metal oxide part; 21023. third sub-metal oxide part; 2100. conductive material; 21001. first titanium metal layer; 21002. aluminum metal layer; 21003. second titanium metal layer;

[0046] 30. Photoresist pattern;

[0047] 1000. Display device; 100. Display panel; 200. Housing. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0049] The present application provides a display panel, which includes a substrate and a driving circuit layer, wherein the driving circuit layer is arranged on one side of the substrate, the driving circuit layer includes at least one conductive layer, the conductive layer includes a plurality of conductive parts, the conductive parts include a first surface, a second surface and a first side surface, the first surface is arranged close to the substrate, the second surface is arranged on a side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, and the surface roughness of the first side surface is greater than the surface roughness of the first surface and the second surface.

[0050] In this embodiment, by making the surface roughness of the first side surface greater than the surface roughness of the first surface and the second surface, the surface roughness of the first side surface of the conductive portion can be reduced, thereby reducing the reflectivity of the display panel and improving the contrast of the display panel.

[0051] Combination Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of a first display panel provided in an embodiment of the present application, Figure 2 The present invention provides a schematic structural diagram of a conductive part in a first display panel according to an embodiment of the present application. The display panel 100 includes a substrate 1 and a driving circuit layer 2, and the driving circuit layer 2 is disposed on one side of the substrate 1. The driving circuit layer 2 includes at least one conductive layer 21, and the conductive layer 21 includes a plurality of conductive parts 210. The conductive parts 210 include a first surface 211, a second surface 212, and a first side surface 213. The first surface 211 is disposed close to the substrate 1, and the second surface 212 is disposed relatively to a side of the first surface 211 away from the substrate 1. The first side surface 213 is connected between the first surface 211 and the second surface 212. The surface roughness of the first side surface 213 is greater than the surface roughness of the first surface 211, and the surface roughness of the first side surface 213 is greater than the surface roughness of the second surface 212.

[0052] In this embodiment, the first surface 211 can be used as the lower surface of the conductive part 210, the second surface 212 can be used as the upper surface of the conductive part 210, and the first side surface 213 can be used as the side surface of the conductive part 210, that is, the surface roughness of the side surface of the conductive part 210 is greater than the surface roughness of the upper surface and the lower surface. In this way, the reflectivity of the side surface can be reduced by increasing the surface roughness of the side surface of the conductive part 210, thereby reducing the overall reflectivity of the display panel 100, thereby improving the contrast of the display panel 100.

[0053] It should be noted that the embodiment of the present application only reduces the reflectivity of the entire display panel by increasing the surface roughness of the side surface of the conductive portion 210, rather than adjusting the surface roughness of the entire conductive layer 21 to reduce the reflectivity. Since the surface roughness of the first surface 211 and the second surface 212 of the conductive layer 21 does not change, the conductivity of the conductive layer 21 itself can be avoided from being affected, thereby ensuring that the electrical performance of the display panel is not affected and improving the contrast of the display panel.

[0054] In this embodiment, the first side surface 213 and the first surface 211 are disposed at an angle, and the angle between the first side surface 213 and the first surface 211 is less than 90 degrees.

[0055] In some embodiments, the angle between the first side surface 213 and the first surface 211 is greater than or equal to 30 degrees and less than or equal to 80 degrees. For example, the angle between the first side surface 213 and the first surface 211 is 30 degrees, 40 degrees, 50 degrees, 55 degrees, 60 degrees, 70 degrees, or 80 degrees.

[0056] In some embodiments, the substrate 1 is a glass substrate or a flexible substrate.

[0057] In some implementations, such as Figure 1 As shown, the conductive part 210 includes a metal part 2101 and a metal oxide part 2102. The metal oxide part 2102 is formed on the peripheral surface of the metal part 2101. The surface roughness of the surface of the metal oxide part 2102 away from the metal part 2101 is greater than the surface roughness of the surface of the metal part 2101 close to the substrate 1. The surface roughness of the metal oxide part 2102 away from the metal part 2101 is greater than the surface roughness of the surface of the metal part 2101 away from the substrate 1. The surface of the metal part 2101 close to the substrate 1 is the first surface 211 of the conductive part 210, the surface of the metal part 2101 away from the substrate 1 is the second surface 212 of the conductive part 210, and the surface of the metal oxide part 2102 away from the metal part 2101 is the first side surface 213 of the conductive part 210. By forming the metal oxide part 2102 on the peripheral surface of the metal part 2101, the roughness of the peripheral surface of the conductive part 210 can be increased by utilizing the characteristics of large surface roughness and low reflectivity of the metal oxide, thereby reducing the reflectivity of the peripheral surface of the conductive part 210.

[0058] In some embodiments, the metal element in the metal portion 2101 is the same as the metal element in the metal oxide portion 2102. For example, the metal elements in the metal portion 2101 and the metal oxide portion 2102 are both aluminum, that is, the material of the metal oxide portion 2102 is aluminum oxide, and the metal oxide portion 2102 can be considered to be formed by partial oxidation of the peripheral side surface of the metal portion 2101.

[0059] In some embodiments, the conductive portion 210 is a laminated structure formed by stacking multiple layers of metal materials in sequence. Figure 1As shown, the metal part 2101 includes a first sub-metal part 21011, a second sub-metal part 21012, and a third sub-metal part 21013 which are stacked, and the metal oxide part 2102 includes a first sub-metal oxide part 21021, a second sub-metal oxide part 21022, and a third sub-metal oxide part 21023. The first sub-metal oxide part 21021 is formed on the peripheral side surface of the first sub-metal part 21011, and the surface roughness of the peripheral side surface of the first sub-metal oxide part 21021 is greater than the surface roughness of the surface of the first sub-metal part 21011 close to the substrate 1, and the surface roughness of the peripheral side surface of the first sub-metal oxide part 21021 is greater than the surface roughness of the surface of the first sub-metal oxide part 21011 away from the substrate 1. The second sub-metal oxide portion 21022 is formed on the peripheral side surface of the second sub-metal portion 21012, and the surface roughness of the peripheral side surface of the second sub-metal oxide portion 21022 is greater than the surface roughness of the surface of the second sub-metal oxide portion 21012 close to the substrate 1, and the surface roughness of the peripheral side surface of the second sub-metal oxide portion 21022 is greater than the surface roughness of the surface of the second sub-metal oxide portion 21012 away from the substrate 1. The third sub-metal oxide portion 21023 is formed on the peripheral side surface of the third sub-metal portion 21013, and the surface roughness of the peripheral side surface of the third sub-metal oxide portion 21023 is greater than the surface roughness of the surface of the third sub-metal portion 21013 close to the substrate 1, and the surface roughness of the peripheral side surface of the third sub-metal oxide portion 21023 is greater than the surface roughness of the surface of the third sub-metal portion 21013 away from the substrate 1.

[0060] In some embodiments, the metal element in the first sub-metal oxide portion 21021 is the same as the metal element in the first sub-metal oxide portion 21011, the metal element in the second sub-metal oxide portion 21022 is the same as the metal element in the second sub-metal oxide portion 21012, and the metal element in the third sub-metal oxide portion 21023 is the same as the metal element in the third sub-metal oxide portion 21013, that is, the first sub-metal oxide portion 21021 can be regarded as formed by partial oxidation of the peripheral side surface of the first sub-metal oxide portion 21011 leaking out, the second sub-metal oxide portion 21022 can be regarded as formed by partial oxidation of the peripheral side surface of the second sub-metal oxide portion 21012 leaking out, and the third sub-metal oxide portion 21023 can be regarded as formed by partial oxidation of the peripheral side surface of the third sub-metal oxide portion 21013 leaking out.

[0061] In some embodiments, the metal element in the first sub-metal part 21011 and the third sub-metal part 21013 is titanium, and the metal element in the second sub-metal part 21012 is aluminum, that is, the materials of the first sub-metal part 21011 and the third sub-metal part 21013 are both titanium, the materials of the first sub-metal oxide part 21021 and the third sub-metal oxide part 21023 are both titanium oxide, the material of the second sub-metal part 21012 is aluminum, and the material of the second sub-metal oxide part 21022 is aluminum oxide.

[0062] In practical applications, the materials of the first sub-metal part 21011, the second sub-metal part 21012 and the third sub-metal part 21013 are not limited to aluminum and titanium in the above embodiments, but can also be metal materials with good conductivity such as copper, molybdenum, and silver.

[0063] In some embodiments, the driving circuit layer 2 includes a gate layer 22 and a source-drain layer 23, the gate layer 22 is arranged on one side of the substrate 1, and the source-drain layer 23 is arranged on the side of the gate layer 22 away from or close to the substrate 1, and at least one of the gate layer 22 and the source-drain layer 23 is a conductive layer 21.

[0064] In one embodiment, if Figure 1 As shown, the driving circuit layer 2 includes a light shielding layer 24, a buffer layer 25, an active layer 26, a gate insulating layer 27, a gate layer 22, an interlayer dielectric layer 28, a source-drain electrode layer 23, a passivation layer 29, a first electrode layer 201, a flat layer 202, and a second electrode layer 203, which are sequentially stacked on the substrate 1. The source-drain electrode layer 23 is a conductive layer 21, that is, the driving circuit layer 2 includes a conductive layer 21, and the conductive layer 21 is the source-drain electrode layer 23. The structure of the conductive layer 21 described in the above embodiment of the present application is the structure of the source-drain electrode layer 23. The multiple conductive parts 210 in the conductive layer 21 can be the source, drain or data signal line in the source-drain electrode layer 23. In this way, the reflectivity of the side of the source-drain electrode layer 23 can be reduced, thereby improving the contrast of the display panel.

[0065] In some embodiments, the driving circuit layer 2 includes a conductive layer 21, which is a gate layer 22. The structure of the conductive layer 21 described in the above embodiments of the present application is the structure of the gate layer 22. The multiple conductive parts 210 in the conductive layer 21 can be gates or scanning signal lines in the gate layer 22. In this way, the reflectivity of the side of the gate layer 22 can be reduced, thereby improving the contrast of the display panel.

[0066] In some embodiments, the driving circuit layer 2 includes two conductive layers, one of which is a gate layer 22 and the other is a source-drain layer 23. In this way, the reflectivity of the sides of the gate layer 22 and the source-drain layer 23 can be reduced at the same time, thereby further improving the contrast of the display panel.

[0067] In some embodiments, in combination Figure 3 and Figure 4 As shown, Figure 3 A schematic diagram of the structure of a second display panel provided in an embodiment of the present application, Figure 4 The schematic diagram of the structure of the conductive part in the second display panel provided in the embodiment of the present application, the conductive part 210 includes a first sub-metal part 21011, a second sub-metal part 21012 and a third sub-metal part 21013, the surface roughness of the side surface of the first sub-metal part 21011 is greater than the surface roughness of the surface of the first sub-metal part 21011 close to the substrate 1, and the surface roughness of the side surface of the first sub-metal part 21011 is greater than the surface roughness of the surface of the first sub-metal part 21011 away from the substrate 1. The second sub-metal part 21012 is arranged on the side of the first sub-metal part 21011 away from the substrate 1, the surface roughness of the side surface of the second sub-metal part 21012 is greater than the surface roughness of the surface of the second sub-metal part 21012 close to the substrate 1, and the surface roughness of the side surface of the second sub-metal part 21012 is greater than the surface roughness of the surface of the second sub-metal part 21012 away from the substrate 1. The third sub-metal part 21013 is arranged on a side of the second sub-metal part 21012 away from the first sub-metal part 21011, and the surface roughness of the side surface of the third sub-metal part 21013 is greater than the surface roughness of the surface of the third sub-metal part 21013 close to the substrate 1, and the surface roughness of the side surface of the third sub-metal part 21013 is greater than the surface roughness of the surface of the third sub-metal part 21013 away from the substrate 1.

[0068] exist Figure 3 and Figure 4 In the illustrated embodiment, the first side surface 213 of the conductive portion 210 is not subjected to an oxidation treatment. Instead, the first side surface 213 of the conductive portion 210 is bombarded with an inert gas to make the originally smooth first side surface 213 uneven, thereby increasing the surface roughness of the first side surface 213 and reducing the reflectivity of the first side surface 213 of the conductive portion 210, thereby improving the contrast of the display panel.

[0069] In some embodiments, the conductive portion 210 is a laminated structure formed by stacking multiple layers of metal materials in sequence. Figure 3 and Figure 4 As shown, the metal elements in the first sub-metal part 21011 and the third sub-metal part 21013 are titanium, and the metal element in the second sub-metal part 21012 is aluminum, that is, the conductive part 210 is a stacked structure of titanium / aluminum / titanium.

[0070] Combination Figure 5 as well as Figures 6a to 6e As shown, Figure 5 A flowchart of a method for manufacturing a display panel provided in an embodiment of the present application, Figures 6a to 6e A schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application, wherein the method for manufacturing a display panel comprises the following steps:

[0071] Step S1 : depositing a conductive material 2100 on a substrate 1 .

[0072] like Figure 6a As shown, the conductive material 2100 deposited on the substrate 1 in step S1 includes three layers of conductive materials, namely a first titanium metal layer 21001 , an aluminum metal layer 21002 and a second titanium metal layer 21003 .

[0073] Step S2, patterning the conductive material 2100 to form a plurality of conductive parts 210, the conductive part 210 includes a first surface 211, a second surface 212 and a first side surface 213, the second surface 212 is relatively arranged on the side of the first surface 211 away from the substrate 1, the first side surface 213 is connected between the first surface 211 and the second surface 212, and the first side surface 213 is arranged at an angle to the first surface 211.

[0074] Combination Figure 6b to Figure 6c As shown, step S2 includes: forming a layer of photoresist material on the conductive material 2100, exposing and developing the photoresist material to form a photoresist pattern 30; etching the conductive material 2100 using the photoresist pattern 30 to form a plurality of conductive parts 210. The conductive part 210 includes a first surface 211, a second surface 212 and a first side surface 213, the photoresist pattern 30 is disposed on the second surface 212 and covers the second surface 212 of the conductive part 210, and the orthographic projection of the photoresist pattern 30 on the substrate 1 does not overlap with the orthographic projection of the first side surface 213 on the substrate 1.

[0075] Step S3 , roughening the first side surface 213 , so that the surface roughness of the first side surface 213 is greater than the surface roughness of the first surface 211 , and the surface roughness of the first side surface 213 is greater than the surface roughness of the second surface 212 .

[0076] In some embodiments, the step of roughening the first side surface includes: performing an oxidation treatment on the first side surface 213 ; or performing a bombardment treatment on the first side surface 213 using an inert gas.

[0077] In some embodiments, Figure 6dAs shown, oxygen O2 is used to oxidize the first side surface 213 of the conductive part 210, so that the metal material of the first side surface 213 of the conductive part 213 is oxidized to form a metal oxide part 2102, and the unoxidized part inside the conductive part 210 is the metal part 2101. By taking advantage of the characteristics of large surface roughness and low reflectivity of the metal oxide, the roughness of the peripheral side surface of the conductive part 210 can be increased, thereby reducing the reflectivity of the peripheral side surface of the conductive part 210.

[0078] In some other embodiments, the first side surface 213 may be bombarded with an inert gas to change the first side surface 213 from a smooth metal surface to a rough metal surface, thereby increasing the surface roughness of the first side surface 213. Specifically, the inert gas may be nitrogen or argon.

[0079] Step S4, peeling off the photoresist pattern 30.

[0080] Combination Figure 6d and Figure 6e As shown, since the second surface 212 is covered with a photoresist pattern 30, when the first side surface 213 is oxidized, oxygen cannot contact the second surface 212, and the second surface 212 will not be oxidized, so it will not affect the resistance of the conductive part 210 itself, thereby ensuring that the electrical properties of the display panel are not affected. Since the conductive part 210 itself is processed, the photoresist pattern 30 formed by the etching process is used to block the upper surface of the conductive part 210, and the first side surface 213 is roughened, so there is no need to add a mask, and the roughening process is self-aligned, there is no problem of alignment accuracy, and there is no need to increase the width of the light shielding layer, so that the aperture ratio, brightness and electrical performance of the display panel can be ensured without being affected, and the contrast of the display panel can be improved.

[0081] It should be noted that the manufacturing method of the present application only illustrates the manufacturing process of the conductive layer in the display panel, and the manufacturing process of the conductive layer can be applied to the manufacturing of any conductive layer in the display panel, such as the gate layer and the source and drain layer.

[0082] The embodiment of the present application also provides a display device, such as Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of a display device provided in an embodiment of the present application, wherein the display device 1000 includes a housing 200 and a display panel 100, and the display panel 100 is disposed on the housing 200. The display panel 100 may be a display panel provided in any of the above embodiments, and the display device 1000 may achieve the same technical effect as the display panel provided in any of the above embodiments, which will not be described in detail herein.

[0083] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display panel, a method for manufacturing a display panel and a display device, the display panel includes a substrate and a driving circuit layer, the driving circuit layer includes at least one conductive layer, the conductive layer includes a plurality of conductive parts, the conductive part includes a first surface, a second surface and a first side surface, the second surface is arranged relative to the side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, and the surface roughness of the first side surface can be reduced by making the surface roughness of the first side surface greater than the surface roughness of the first surface and the second surface, thereby reducing the reflectivity of the display panel, thereby improving the contrast of the display panel while ensuring that the electrical performance of the display panel is not affected.

[0084] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0085] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0086] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0087] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A driving circuit layer, disposed on one side of the substrate, the driving circuit layer comprising at least one conductive layer, the conductive layer comprising a plurality of conductive parts; The conductive portion includes a first surface, a second surface and a first side surface, the second surface is arranged relative to the side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, the first side surface is arranged at an angle to the first surface, the surface roughness of the first side surface is greater than the surface roughness of the first surface, and the surface roughness of the first side surface is greater than the surface roughness of the second surface.

2. The display panel according to claim 1, wherein: The conductive part includes a metal part and a metal oxide part, the metal oxide part is formed on the peripheral side surface of the metal part, the surface roughness of the surface of the metal oxide part away from the metal part is greater than the surface roughness of the surface of the metal part close to the substrate, and the surface roughness of the surface of the metal oxide part away from the metal part is greater than the surface roughness of the surface of the metal part away from the substrate.

3. The display panel according to claim 2, wherein: The metal portion includes a first sub-metal portion, a second sub-metal portion, and a third sub-metal portion which are stacked, and the metal oxide portion includes: a first sub-metal oxide portion formed on a peripheral side surface of the first sub-metal portion, wherein the surface roughness of the peripheral side surface of the first sub-metal oxide portion is greater than the surface roughness of a surface of the first sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the first sub-metal oxide portion is greater than the surface roughness of a surface of the first sub-metal portion far from the substrate; a second sub-metal oxide portion formed on a peripheral side surface of the second sub-metal portion, wherein the surface roughness of the peripheral side surface of the second sub-metal oxide portion is greater than the surface roughness of a surface of the second sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the second sub-metal oxide portion is greater than the surface roughness of a surface of the second sub-metal portion far from the substrate; A third sub-metal oxide portion is formed on the peripheral side surface of the third sub-metal portion, the surface roughness of the peripheral side surface of the third sub-metal oxide portion is greater than the surface roughness of the surface of the third sub-metal portion close to the substrate, and the surface roughness of the peripheral side surface of the third sub-metal oxide portion is greater than the surface roughness of the surface of the third sub-metal portion away from the substrate.

4. The display panel according to claim 3, wherein: The metal element in the first sub-metal oxide portion is the same as the metal element in the first sub-metal portion, the metal element in the second sub-metal oxide portion is the same as the metal element in the second sub-metal portion, and the metal element in the third sub-metal oxide portion is the same as the metal element in the third sub-metal portion.

5. The display panel according to claim 1, wherein: The conductive part comprises: a first sub-metal portion, wherein the surface roughness of a side surface of the first sub-metal portion is greater than the surface roughness of a surface of the first sub-metal portion close to the substrate, and the surface roughness of the side surface of the first sub-metal portion is greater than the surface roughness of a surface of the first sub-metal portion far from the substrate; A second sub-metal portion is disposed on a side of the first sub-metal portion away from the substrate, the surface roughness of a side surface of the second sub-metal portion being greater than the surface roughness of a surface of the second sub-metal portion close to the substrate, and the surface roughness of a side surface of the second sub-metal portion being greater than the surface roughness of a surface of the second sub-metal portion away from the substrate; The third sub-metal portion is arranged on a side of the second sub-metal portion away from the first sub-metal portion, the surface roughness of the side surface of the third sub-metal portion is greater than the surface roughness of the surface of the third sub-metal portion close to the substrate, and the surface roughness of the side surface of the third sub-metal portion is greater than the surface roughness of the surface of the third sub-metal portion away from the substrate.

6. The display panel according to claim 4 or 5, characterized in that: The metal elements in the first sub-metal portion and the third sub-metal portion are titanium, and the metal element in the second sub-metal portion is aluminum.

7. The display panel according to claim 1, wherein: The driving circuit layer comprises: A gate layer, disposed on one side of the substrate; A source-drain electrode layer, arranged on a side of the gate layer away from or close to the substrate; Wherein, at least one of the gate layer and the source and drain layer is the conductive layer.

8. A method for manufacturing a display panel, characterized in that: Used to prepare the display panel according to any one of claims 1 to 7, the manufacturing method of the display panel comprising: depositing a conductive material on a substrate; Patterning the conductive material to form a plurality of conductive parts, wherein the conductive part includes a first surface, a second surface and a first side surface, wherein the second surface is arranged at a side of the first surface away from the substrate, the first side surface is connected between the first surface and the second surface, and the first side surface is arranged at an angle to the first surface; The first side surface is roughened so that the surface roughness of the first side surface is greater than the surface roughness of the first surface, and the surface roughness of the first side surface is greater than the surface roughness of the second surface.

9. The method for manufacturing a display panel according to claim 8, wherein: The step of roughening the first side surface comprises: The first side surface is subjected to an oxidation treatment; or the first side surface is subjected to a bombardment treatment using an inert gas.

10. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 7.

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